Wafer test lifting mechanism

Abstract

The present invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a wafer testing lifting mechanism, comprising: a carrier plate; a central driving device, the central driving device is located on a side of the carrier plate away from the carrier surface, and the center of the central driving device is directly opposite to the center of the carrier plate, the free end of the central driving device is connected to the carrier plate, and the free end of the central driving device can drive the carrier plate to perform lifting motion along the z-axis direction; four supporting driving devices arranged at intervals around the central driving device, the four supporting driving devices are located on a side of the carrier plate away from the carrier surface, and the four supporting driving devices correspond one-to-one to the four corners of the carrier plate, the free ends of the supporting driving devices are in non-connected contact with the carrier plate, and the free ends of the supporting driving devices and the free ends of the central driving devices are synchronously lifted and lowered along the z-axis direction. The present invention can at least meet the wafer testing needs under large load and offset load conditions.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a wafer testing lifting mechanism. Background Art

[0002] As the integration of high-end storage and computing chips increases, wafer size increases, while pad size decreases, the number of pads increases, and pad layout becomes more compact. Furthermore, due to insufficient production capacity for high-end chips, the semiconductor chip manufacturing process requires higher precision, efficiency, and stricter testing stability. These factors place more stringent demands on the large load capacity and high precision of wafer probe stations in wafer testing equipment. The core load-bearing component of a wafer probe station is the lifting platform, which has high technical barriers and is difficult to develop.

[0003] The Chinese patent application number CN116798937A applied by Changchun Guanghua Microelectronic Equipment Engineering Center Co., Ltd., with a publication date of September 22, 2023, and the patent name is "Lifting mechanism and wafer test carrier device" mentioned in the invention patent application, and the Chinese patent application number CN216979228U applied by Zhejiang Changchuan Technology Co., Ltd., with a publication date of July 15, 2022, and the patent name is "A wafer detection platform and wafer detection device thereof" mentioned in the utility model, the wafer test lifting platform introduced in the wafer detection platform and wafer detection device. It is the current mainstream technology. Among them, in the lifting mechanism and wafer test carrier provided by the Changchun Guanghua Microelectronic Equipment Engineering Center Co., Ltd., the wafer test lifting platform adopts a vertical guide rail for guidance and a horizontal ball screw to drive a wedge structure. The wedge structure connects the horizontal guide rail and the vertical guide rail respectively, and the inclined surface of the wedge structure is also connected by the guide rail. This structure can realize power transmission from horizontal to vertical direction, and the wedge structure can realize displacement subdivision. However, this wedge structure has a shearing effect on the vertical guide rail due to the horizontal lateral driving force. Under high load conditions, the shearing effect is significant and cannot meet the use requirements of high load conditions. The wafer inspection platform and wafer inspection device provided by Zhejiang Changchuan Technology Co., Ltd. adopt a three-group lifting mechanism vertical guide structure. Each lifting mechanism consists of a motor and a screw nut. The three lifting mechanisms are driven by a synchronous belt to achieve synchronous movement. This structure has too high requirements on the precision of the screw nut, and the pitch error of the three lifting mechanisms can easily cause the mechanism to get stuck during movement. At the same time, during the implementation of the project, in order to achieve the same height of the three sets of lifting mechanisms, the installation and adjustment were very difficult. In addition, under large load conditions, the synchronous belts were elastically deformed, making it difficult to ensure high precision of vertical displacement.

[0004] In summary, the current wafer test lifting platform has the defects of being difficult to achieve large loads and high precision. Summary of the Invention

[0005] In view of this, the present invention aims to provide a wafer testing lifting mechanism that can at least meet the wafer testing requirements under large load and offset load conditions.

[0006] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0007] The present invention provides a wafer testing lifting mechanism, which is connected to an external mechanism through a base plate. The wafer testing lifting mechanism includes: a carrying plate, which has a carrying surface for carrying wafers; a central driving device, which is located on a side of the carrying plate away from the carrying surface, and the center of the central driving device is opposite to the center of the carrying plate, and the free end of the central driving device is connected to the carrying plate, and the free end of the central driving device can drive the carrying plate to perform lifting movement along the z-axis direction; four supporting driving devices are arranged at intervals around the central driving device, the four supporting driving devices are located on a side of the carrying plate away from the carrying surface, and the four supporting driving devices correspond one-to-one to the four corners of the carrying plate, the free ends of the supporting driving devices are in non-connected contact with the carrying plate, and the free ends of the supporting driving devices and the free end of the central driving device are synchronously lifted and lowered along the z-axis direction.

[0008] In some embodiments, the central drive device includes: a bottom support frame, a bearing support seat, a torque motor, a planetary roller screw, a first screw nut and a nut adapter; wherein the bearing support seat is arranged at one end of the bottom support frame facing the supporting plate, the planetary roller screw is located in the area surrounded by the bottom support frame and the bearing support seat, and one end of the planetary roller screw is connected to the bearing support seat, and the other end of the planetary roller screw is fixed to the mover of the torque motor, and the stator of the torque motor is fixed on the bottom support frame; the first screw nut is assembled on the outer ring of the planetary roller screw, the first screw nut is connected to the nut adapter, and the nut adapter is fixed to the supporting plate as the free end of the central drive device; the mover of the torque motor drives the planetary roller screw to rotate, so that the first screw nut drives the nut adapter to perform lifting and lowering movements along the z-axis direction, thereby driving the supporting plate to perform lifting and lowering movements.

[0009] In some embodiments, the bearing support seat has a first screw extension hole at one end away from the bottom support frame, and the first end of the planetary roller screw is arranged in the first screw extension hole through a first angular contact ball bearing. The central drive device also includes a bearing pressure ring, which is fixed on the bearing support seat and is located on the top of the first angular contact ball bearing; the stator of the torque motor is fixed to the end of the bottom support frame away from the bearing support seat, and the end of the bottom support frame away from the bearing support seat has a second screw extension hole, the second end of the planetary roller screw extends from the second screw extension hole, and is fixed to the mover of the torque motor through a first coupling, and the planetary roller screw is assembled in the second screw extension hole through a second angular contact ball bearing.

[0010] In some embodiments, the bottom support frame includes a main body, and the central drive device also includes four first guide assemblies, which are arranged on the outside of the main body and are arranged at intervals along the outer circle of the main body; the first guide assembly includes a first guide rail, a first slider and a first guide connecting member, the first guide rail is arranged on the outer surface of the main body, the first slider is arranged on the first guide rail, and the first slider is connected to the supporting plate through the first guide connecting member.

[0011] In some embodiments, two of the four first guide assemblies are arranged on the first side surface of the main body, and the other two first guide assemblies are arranged on the second side surface of the main body opposite to the first side surface. The two first guide connecting members located on the first side surface of the main body are connected by a first reinforcing beam, and the two first guide connecting members located on the second side surface of the main body are connected by a second reinforcing beam.

[0012] In some embodiments, the central drive device also includes a matching central drive grating scale and a central drive grating scale reading head. The central drive grating scale is arranged on the bottom support frame, and the central drive grating scale reading head is connected to the supporting plate.

[0013] In some embodiments, the bottom support frame includes a main body and an extension portion connected to each other, the bearing support seat is arranged at one end of the main body facing the supporting plate, and the extension portion extends outward from one end of the main body away from the bearing support seat; the supporting drive device includes a driving frame, a fixing frame, a second lead screw, a second lead screw nut, a lead screw synchronous pulley, a synchronous belt, a motor synchronous pulley and a driving reduction motor; wherein, the fixing frame is arranged on the side of the main body, the first end of the second lead screw is connected to the fixing frame through an upper positioning bearing, the second end of the second lead screw is connected to the extension portion through a lower positioning bearing, and the second end of the second lead screw passes through the extension portion and is connected to the lead screw synchronous pulley, the driving reduction motor is arranged on the extension portion, and the rotating shaft of the driving reduction motor is connected to the motor synchronous pulley, the driving reduction motor drives the motor synchronous pulley to rotate, and the motor synchronous pulley transmits power to the lead screw synchronous pulley through the synchronous belt, the second lead screw nut is assembled on the outer ring of the second lead screw, and the driving frame is connected to the second lead screw nut, and the driving frame serves as the free end of the supporting drive device in non-connected contact with the supporting plate.

[0014] In some embodiments, the fixed frame has a third screw extension hole, the first end of the second screw is arranged in the third screw extension hole through an upper locating bearing, and an upper locating bearing pressure ring is provided between the upper locating bearing and the inner ring of the third screw extension hole, the fixed frame is provided with an upper locating bearing pressure cover, the upper locating bearing pressure cover is opposite to the third screw extension hole, and is located on the top of the upper locating bearing; the extension part has a fourth screw extension hole, the second end of the second screw passes through the fourth screw extension hole, and the second screw is assembled in the fourth screw extension hole through a lower locating bearing, the second end of the second screw is fixed to the screw synchronous pulley through a second coupling, the extension part is provided with a lower locating bearing pressure cover, the lower locating bearing pressure cover is opposite to the fourth screw extension hole, and is located on the top of the lower locating bearing, the lower locating bearings are paired angular contact ball bearings, and the upper locating bearings are angular contact ball bearings.

[0015] In some embodiments, the supporting drive device also includes: a second guide assembly, the second guide assembly includes a second guide rail, a second slider and a second guide connector, the second guide rail is arranged on the side of the main body, the second slider is connected to the second guide rail, and the second slider is connected to the drive frame through the second guide connector.

[0016] In some embodiments, the supporting drive device also includes a matching outer grating scale and an outer reading head, the outer grating scale is arranged on the extension part, and the outer reading head is connected to the drive frame.

[0017] Compared with the prior art, the invention can achieve the following beneficial effects: the wafer test lifting mechanism provided by the present invention can meet the requirements of large load, off-load and high-precision wafer testing, which consists of a central drive device and four support drive devices. The central drive device is driven by a torque motor directly connected to a precision planetary roller screw, and guided by a vertical heavy-load roller guide (first guide component). The torque motor is equipped with a high-precision encoder, so that the torque motor can be guaranteed to have a high angular accuracy and can meet the requirements of large load and high-precision lifting and lowering movements. The support drive device is driven by a DC reduction motor with its own encoder through a synchronous belt to drive a precision ball screw (second screw) to provide auxiliary support for the overall structure and improve the ability to resist off-load. The wafer test lifting mechanism provided by the embodiment of the present invention can overcome the defects of traditional structures that are difficult to achieve large loads and high precision, and can greatly improve the upper limit of large loads and off-loads, and has strong engineering feasibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0019] Figure 1A schematic structural diagram of a wafer testing lifting mechanism according to an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of a cross section parallel to the z-axis direction of the wafer test lifting mechanism including a central drive device according to an embodiment of the present invention;

[0021] Figure 3 A schematic cross-sectional view of the wafer test lifting mechanism according to an embodiment of the present invention, perpendicular to the z-axis direction;

[0022] Figure 4 An enlarged schematic diagram of the center-driven grating ruler assembly according to an embodiment of the present invention;

[0023] Figure 5 A schematic diagram of a cross section parallel to the z-axis direction of the wafer test lifting mechanism including a support drive device according to an embodiment of the present invention;

[0024] Figure 6 This is another structural diagram of the wafer testing lifting mechanism according to an embodiment of the present invention;

[0025] Figure 7 for Figure 2 An enlarged schematic diagram of the portion circled by circle E. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0029] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art can understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0030] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0031] refer to Figures 1 to 7 The present invention provides a wafer testing lifting mechanism, which is connected to an external mechanism through a base plate 2001. The wafer testing lifting mechanism includes: a carrier plate 3, which has a carrier surface for supporting wafers; a central driving device 1, which is located on a side of the carrier plate 3 away from the carrier surface, and the center of the central driving device 1 is opposite to the center of the carrier plate 3, and the free end of the central driving device 1 is connected to the carrier plate 3, and the free end of the central driving device 1 can drive the carrier plate 3 to move up and down along the z-axis direction; four supporting driving devices 2 are arranged at intervals around the central driving device 1, and the four supporting driving devices 2 are located on a side of the carrier plate 3 away from the carrier surface, and the four supporting driving devices 2 correspond to the four corners of the carrier plate 3 one by one, and the free ends of the supporting driving devices 2 are not in contact with the carrier plate 3, and the free ends of the supporting driving devices 2 and the free ends of the central driving devices 1 are synchronously lifted and lowered along the z-axis direction.

[0032] It should be noted that the z-axis direction is the thickness direction of the supporting plate 3. In addition, in actual application, the movement directions of the free end of the central driving device 1 and the free end of the supporting driving device 2 are parallel and synchronized to ensure that the lifting mechanism has better performance in bearing large loads and resisting overload.

[0033] When the wafer on the carrier plate 3 is subjected to a large pressure applied by the probe station, the four support drive devices 2 support and drive the four corners of the carrier plate 3 on the basis of the central drive device 1 as the main lifting drive structure, which is beneficial to increase the carrier plate 3's ability to withstand larger loads; when the probe station tests a partial area on the wafer that deviates from the center of the wafer, the carrier plate 3 needs to be subjected to a larger offset load, and the four support drive devices 2 ensure stable support for the edges of the carrier plate 3, which is beneficial to improving the ability to withstand larger offset loads during the test.

[0034] In addition, the free end of the support drive device 2 is not in contact with the supporting plate 3, and each support drive device 2 is relatively independent, which reduces the difficulty of installing and adjusting each support drive device 2 and the precision requirements for the synchronous lifting and lowering of the support drive device 2, and avoids the entire mechanism from being stuck when one of the support drive devices 2 fails.

[0035] In some embodiments, the supporting plate 3 includes a first connecting plate 114 and a second connecting plate 115 that are fixed to each other.

[0036] In some embodiments, reference Figure 2 The central drive device 1 includes: a bottom support frame 111, a bearing support seat 112, a torque motor 102, a planetary roller screw 108, a first screw nut (not marked) and a nut adapter 110; wherein the bearing support seat 112 is arranged at one end of the bottom support frame 111 facing the bearing plate 3, the planetary roller screw 108 is located in the area surrounded by the bottom support frame 111 and the bearing support seat 112, and one end of the planetary roller screw 108 is rotatably connected to the bearing support seat 112, and the other end of the planetary roller screw 108 is fixed to the mover 1021 of the torque motor 102, The stator 1022 of the torque motor 102 is fixed on the bottom support frame 111; the first lead screw nut is assembled on the outer ring of the planetary roller screw 108, and the first lead screw nut is connected to the nut adapter 110, and the nut adapter 110 is fixed to the supporting plate 3 as the free end of the central driving device 1; the mover 1021 of the torque motor 102 drives the planetary roller screw 108 to rotate, so that the first lead screw nut is lifted and lowered relative to the planetary roller screw 108 along the z-axis direction, and then drives the nut adapter 110 to lift and lower along the z-axis direction, and finally drives the supporting plate 3 to lift and lower.

[0037] In some embodiments, the bearing support seat 112 has a first screw extension hole at one end away from the bottom support frame 111, and the first end of the planetary roller screw 108 is arranged in the first screw extension hole through the first angular contact ball bearing 109. The central drive device 1 also includes a bearing pressure ring 113, which is fixed on the bearing support seat 112 and located on the top of the first angular contact ball bearing 109; the stator 1022 of the torque motor 102 is fixed on the end of the bottom support frame 111 away from the bearing support seat 112, and the end of the bottom support frame 111 away from the bearing support seat 112 has a second screw extension hole, the second end of the planetary roller screw 108 extends from the second screw extension hole and is fixed to the mover 1021 of the torque motor 102 through the first coupling 107, and the planetary roller screw 108 is assembled in the second screw extension hole through the second angular contact ball bearing 141.

[0038] Among them, the planetary roller screw is positioned on both sides by a pair of angular contact ball bearings (the first angular contact ball bearing 109 and the second angular contact ball bearing 141), which can withstand large vertical loads. The bearing support seat 112 and the bottom support frame 111 are processed in combination to ensure that the first angular contact ball bearing 109 and the second angular contact ball bearing 141 have high coaxiality. The bearing pressure ring 113 can eliminate the radial and axial clearances of the first angular contact ball bearing 109 and the second angular contact ball bearing 141, thereby ensuring the rotation accuracy of the bearings.

[0039] In some embodiments, the torque motor 102 is further provided with a first encoder circuit board adapter 101 , a second encoder circuit board adapter 103 , an encoder code disk 104 , an encoder circuit board 105 and an encoder adapter board 106 .

[0040] In some embodiments, reference Figure 3 The bottom support frame 111 includes a main body 1112. The central drive device 1 also includes four first guide assemblies, which are disposed outside the main body 1112 and spaced apart along the outer circumference of the main body 1112. The first guide assemblies include a first guide rail 119, a first slider, and a first guide connector 120. The first guide rail 119 is disposed on the outer surface of the main body 1112, and the first slider is disposed on the first guide rail 119. The first slider is connected to the support plate 3 via the first guide connector 120. The first guide assemblies provide vertical guidance for the central drive device 1, and the provision of four first guide assemblies further ensures the stability of the support plate 3 during its lifting and lowering motion.

[0041] In some embodiments, two of the four first guide assemblies are arranged on the first side surface of the main body 1112, and the other two first guide assemblies are arranged on the second side surface of the main body 1112 opposite to the first side surface of the main body 1112. The two first guide connectors 120 located on the first side surface of the main body 1112 are connected by a first reinforcing beam 124, and the two first guide connectors 120 located on the second side surface of the main body 1112 are connected by a second reinforcing beam 127. This is conducive to ensuring the stability of the guidance.

[0042] In some embodiments, reference Figure 3 and Figure 4 The central drive device 1 also includes a central drive grating scale assembly, which includes a matching central drive grating scale 116 and a central drive grating scale reading head 118. The central drive grating scale 116 is arranged on the bottom support frame 111, and the central drive grating scale reading head 118 is connected to the carrier plate 3.

[0043] In some embodiments, the center-driven grating scale 116 is fixed on the center-driven grating scale fixing seat 117, the center-driven grating scale fixing seat 117 is fixed on the main body 1112 of the bottom support frame 111, the center-driven grating scale reading head 118 is fixed on the center-driven grating scale reading head connector 121, and the center-driven grating scale reading head connector 121 is fixed on the carrier plate 3. The relative position of the center-driven grating scale reading head 118 and the center-driven grating scale 116 provides accurate feedback of the displacement in the direction of motion for the center-driven device 1.

[0044] In some embodiments, reference Figure 2 The central drive device 1 also includes an electric limit assembly, which includes: an electric limit block 131, an upper limit photoelectric switch 132, an upper limit switch adjustment gasket 133, a lower limit photoelectric switch 134, a lower limit switch adjustment gasket 135 and a switch adapter 136. The electric limit block 131 is fixed on the bearing plate 3, the upper limit photoelectric switch 132 is set on the switch adapter 136 through the upper limit switch adjustment gasket 133, and the lower limit photoelectric switch 134 is set on the switch adapter 136 through the lower limit switch adjustment gasket 135. The positions of the lower limit switch adjustment gasket 135 and the upper limit switch adjustment gasket 133 are adjustable relative to the switch adapter 136. The electric limit assembly is used to provide electric limit for the central drive device 1.

[0045] In some embodiments, the central drive device 1 further includes a mechanical limiter 130 , which is fixed on the bottom support frame 111 and located between the nut adapter 110 and the bottom support frame 111 , and is used to provide mechanical limiter for the central drive device 1 .

[0046] In some embodiments, reference Figures 1 to 7 The bottom support frame 111 includes a main body 1112 and an extension 1113 connected to each other. The bearing support seat 112 is arranged at one end of the main body 1112 facing the bearing plate 3, and the extension 1113 extends outward from one end of the main body 1112 away from the bearing support seat 112; Figure 5 and Figure 6 The supporting drive device 2 includes a driving frame 206, a fixing frame 207, a second lead screw 203, a second lead screw nut, a lead screw synchronous pulley 202, a synchronous belt 263, a motor synchronous pulley 264 and a driving reduction motor 265; wherein the fixing frame 207 is arranged on the side of the main body 1112, the first end of the second lead screw 203 is connected to the fixing frame 207 through the upper positioning bearing 209, the second end of the second lead screw 203 is connected to the extension part 1113 through the lower positioning bearing 204, and the second end of the second lead screw 203 passes through the extension part 1113 Connected to the screw synchronous pulley 202, the driving reduction motor 265 is arranged on the extension part 1113, and the rotating shaft of the driving reduction motor 265 is connected to the motor synchronous pulley 264, the driving reduction motor 265 drives the motor synchronous pulley 264 to rotate, and the motor synchronous pulley 264 transmits power to the screw synchronous pulley 202 through the synchronous belt 263. The second screw nut is assembled on the outer ring of the second screw 203, and the driving frame 206 is connected to the second screw nut. The driving frame 206 serves as the free end of the support driving device 2 in non-connected contact with the supporting plate 3.

[0047] Among them, the rotating shaft of the driving reduction motor 265 drives the motor synchronous pulley 264 to rotate, and the motor synchronous pulley 264 transmits power to the screw synchronous pulley 202 through the synchronous belt 263. The screw synchronous pulley 202 drives the second screw 203 to rotate, and the second screw nut moves up and down relative to the second screw 203 along the z-axis direction, thereby driving the drive frame 206 to move up and down along the z-axis direction to support the supporting plate 3.

[0048] In some embodiments, the fixing frame 207 has a third screw extension hole, the first end of the second screw 203 is set in the third screw extension hole through the upper positioning bearing 209, and an upper positioning bearing pressure ring 210 is provided between the upper positioning bearing 209 and the inner ring of the third screw extension hole, and the fixing frame 207 is provided with an upper positioning bearing pressure cover 212, which is opposite to the third screw extension hole and is located on the top of the upper positioning bearing 209; the extension portion 1113 has a fourth screw extension hole, and the second screw 203 is provided with a fourth screw extension hole. The second end of 3 passes through the fourth screw extension hole, and the second screw 203 is assembled in the fourth screw extension hole through the lower locating bearing 204. The second end of the second screw 203 is fixed to the screw synchronous pulley 202 through the second coupling 201. The extension portion 1113 is provided with a lower locating bearing cover 205. The lower locating bearing cover 205 is opposite to the fourth screw extension hole and is located on the top of the lower locating bearing 204. The lower locating bearings 204 are paired angular contact ball bearings, and the upper locating bearing 209 is an angular contact ball bearing.

[0049] The lower locating bearing 204 utilizes a pair of angular contact ball bearings, providing radial and axial positioning and load bearing for the second lead screw 203. The upper locating bearing 209 utilizes a single angular contact ball bearing, providing auxiliary positioning for the second lead screw 203. The fixed frame 207 and the bottom support frame 111 are machined together to ensure high coaxiality between their bearing mounting holes (the third and fourth lead screw extension holes). The second coupling 201 and the lower locating bearing gland 205 eliminate play in the lower locating bearing 204, ensuring bearing rotational accuracy. The upper locating bearing gland 212 and the upper locating bearing pressure ring 210 eliminate play in the upper locating bearing 209, ensuring bearing rotational accuracy.

[0050] In some embodiments, reference Figure 6 The supporting drive device 2 also includes: a second guide assembly, the second guide assembly includes a second guide rail, a second slider 271 and a second guide connecting member 272, the second guide rail is arranged on the side of the main body 1112, the second slider 271 is connected to the second guide rail, and the second slider 271 is connected to the driving frame 206 through the second guide connecting member 272, and the second guide assembly is used to provide a guiding function for the supporting drive device 2.

[0051] In some embodiments, the support drive device 2 also includes a zero position detection component for detecting the position of the drive frame 206, the zero position detection component includes a first zero position switch 255 and a first zero position baffle 256, the first zero position switch 255 is set on the extension portion 1113, and the first zero position baffle 256 is connected to the drive frame 206.

[0052] In some embodiments, the supporting drive device 2 also includes an outer grating scale assembly 21, and the outer grating scale assembly 21 includes a matching outer grating scale and an outer reading head. The outer grating scale is arranged on the extension part 1113, and the outer reading head is connected to the drive frame 206.

[0053] In some embodiments, the support drive device 2 can also use a standard displacement platform or an electric cylinder to achieve lifting drive.

[0054] The wafer testing lifting mechanism provided by the present invention can also be applied to precision equipment in the fields of mechanical testing, photoelectric testing or processing with large loads.

[0055] The wafer test lifting mechanism provided by the present invention overcomes the defect that the traditional structure cannot simultaneously meet the extreme working conditions of large load and off-load and high precision. It adopts a structural scheme combining a central drive device 1 with four supporting drive devices 2, which can meet the extreme working conditions of wafer detection in conjunction with a large load (hundreds of kilograms) and off-load probe station. At the same time, it is simple to assemble and adjust, easy to control, and has high positioning accuracy.

[0056] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in the present disclosure can be achieved. This is not limited herein.

[0057] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A wafer testing lifting mechanism, characterized in that: The wafer test lifting mechanism is connected to an external mechanism via a base plate, and the wafer test lifting mechanism includes: A carrier plate having a carrier surface for carrying wafers; a central drive device, the central drive device being located on a side of the carrier plate away from the carrier surface, with the center of the central drive device facing the center of the carrier plate, the free end of the central drive device being connected to the carrier plate, and the free end of the central drive device being capable of driving the carrier plate to move up and down along the z-axis; Four supporting driving devices are arranged at intervals around the central driving device, and the four supporting driving devices are located on the side of the supporting plate away from the supporting surface, and the four supporting driving devices correspond one-to-one to the four corners of the supporting plate. The free ends of the supporting driving devices are in non-connected contact with the supporting plate, and the free ends of the supporting driving devices and the free ends of the central driving devices are synchronously lifted and lowered along the z-axis direction.

2. The wafer testing lifting mechanism according to claim 1, characterized in that: The central driving device comprises: Bottom support frame, bearing support seat, torque motor, planetary roller screw, first screw nut and nut adapter; The bearing support seat is arranged at one end of the bottom support frame facing the bearing plate, the planetary roller screw is located in the area surrounded by the bottom support frame and the bearing support seat, and one end of the planetary roller screw is connected to the bearing support seat, the other end of the planetary roller screw is fixed to the mover of the torque motor, and the stator of the torque motor is fixed to the bottom support frame; The first screw nut is assembled on the outer ring of the planetary roller screw, the first screw nut is connected to the nut adapter, and the nut adapter serves as the free end of the central drive device and is fixed to the bearing plate; The mover of the torque motor drives the planetary roller screw to rotate, so that the first screw nut drives the nut adapter to move up and down along the z-axis direction, thereby driving the supporting plate to move up and down.

3. The wafer testing lifting mechanism according to claim 2, wherein: The bearing support seat has a first screw extension hole at one end away from the bottom support frame, and the first end of the planetary roller screw is disposed in the first screw extension hole through a first angular contact ball bearing. The central drive device further includes a bearing pressure ring, which is fixed to the bearing support seat and located on top of the first angular contact ball bearing. The stator of the torque motor is fixed to one end of the bottom support frame away from the bearing support seat, and the end of the bottom support frame away from the bearing support seat has a second screw extension hole, the second end of the planetary roller screw extends from the second screw extension hole and is fixed to the mover of the torque motor through a first coupling, and the planetary roller screw is assembled in the second screw extension hole through a second angular contact ball bearing.

4. The wafer testing lifting mechanism according to claim 2, wherein: The bottom support frame includes a main body, and the central driving device further includes four first guide assemblies, wherein the four first guide assemblies are arranged on the outside of the main body and are spaced apart along the outer circle of the main body; The first guide assembly includes a first guide rail, a first slider and a first guide connector. The first guide rail is arranged on the outer surface of the main body, the first slider is arranged on the first guide rail, and the first slider is connected to the supporting plate through the first guide connector.

5. The wafer testing lifting mechanism according to claim 4, characterized in that: Two of the four first guide assemblies are arranged on the first side surface of the main body, and the other two first guide assemblies are arranged on the second side surface of the main body opposite to the first side surface. The two first guide connecting members located on the first side surface of the main body are connected by a first reinforcing beam, and the two first guide connecting members located on the second side surface of the main body are connected by a second reinforcing beam.

6. The wafer testing lifting mechanism according to claim 2, wherein: The central drive device also includes a matching central drive grating scale and a central drive grating scale reading head. The central drive grating scale is arranged on the bottom support frame, and the central drive grating scale reading head is connected to the supporting plate.

7. The wafer testing lifting mechanism according to claim 2, wherein: The bottom support frame includes a main body and an extension portion connected to each other, the bearing support seat is arranged at one end of the main body facing the bearing plate, and the extension portion extends outward from one end of the main body away from the bearing support seat; The support drive device includes a drive frame, a fixed frame, a second lead screw, a second lead screw nut, a lead screw synchronous pulley, a synchronous belt, a motor synchronous pulley and a driving reduction motor; In which, the fixing frame is arranged on the side surface of the main body, the first end of the second lead screw is connected to the fixing frame through an upper locating bearing, the second end of the second lead screw is connected to the extension portion through a lower locating bearing, and the second end of the second lead screw passes through the extension portion and is connected to the lead screw synchronous pulley, the driving reduction motor is arranged on the extension portion, and the rotating shaft of the driving reduction motor is connected to the motor synchronous pulley, the driving reduction motor drives the motor synchronous pulley to rotate, and the motor synchronous pulley transmits power to the lead screw synchronous pulley through the synchronous belt, the second lead screw nut is assembled on the outer ring of the second lead screw, and the driving frame is connected to the second lead screw nut, and the driving frame serves as the free end of the supporting drive device and is in non-connected contact with the bearing plate.

8. The wafer testing lifting mechanism according to claim 7, characterized in that: The fixing frame has a third lead screw extension hole, the first end of the second lead screw is arranged in the third lead screw extension hole through the upper locating bearing, and an upper locating bearing pressure ring is provided between the upper locating bearing and the inner ring of the third lead screw extension hole, and the fixing frame is provided with an upper locating bearing pressure cover, the upper locating bearing pressure cover is opposite to the third lead screw extension hole, and is located on the top of the upper locating bearing; The extension portion has a fourth screw extension hole, the second end of the second screw passes through the fourth screw extension hole, and the second screw is assembled in the fourth screw extension hole through a lower locating bearing, the second end of the second screw is fixed to the screw synchronous pulley through a second coupling, and the extension portion is provided with a lower locating bearing cover, the lower locating bearing cover is opposite to the fourth screw extension hole, and is located on the top of the lower locating bearing, the lower locating bearings are a pair of angular contact ball bearings, and the upper locating bearings are angular contact ball bearings.

9. The wafer testing lifting mechanism according to claim 7, wherein: The support drive device also includes: The second guide assembly includes a second guide rail, a second slider and a second guide connector. The second guide rail is arranged on the side of the main body. The second slider is connected to the second guide rail, and the second slider is connected to the drive frame through the second guide connector.

10. The wafer testing lifting mechanism according to claim 7, wherein: The supporting drive device also includes a matching outer grating scale and an outer reading head. The outer grating scale is arranged on the extension part, and the outer reading head is connected to the driving frame.

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