Exposure equipment and method for PCB board processing

Abstract

The present invention relates to the technical field of PCB production, and in particular to an exposure device and method for PCB processing, comprising: an exposure mechanism comprising an exposure platform, an exposure device fixedly connected to the left side of the top of the exposure platform, a placement box slidably connected to the top of the exposure platform, electric telescopic rods fixedly connected to both sides of the left side of the exposure platform, the output end of the electric telescopic rod extending through the interior of the exposure platform and fixedly connected to a connecting seat, the right side of the connecting seat being movably connected to both sides of the left side of the placement box; and a bubble elimination mechanism comprising a squeezing roller located on the right side of the top of the exposure platform, wherein a PCB is loaded and exposed by using the exposure mechanism, and the bubble elimination mechanism is activated during the loading process to squeeze and roll the PCB, thereby achieving bubble elimination; and when unloading after exposure is completed, a developing mechanism is activated to spray a developing liquid on the surface of the PCB during the unloading process for development, thereby achieving automatic development.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board production, and in particular to an exposure device and method for PCB board processing. Background Art

[0002] An exposure machine is a crucial piece of equipment used in semiconductor manufacturing, PCB (Printed Circuit Board) production, and other processes requiring precise pattern transfer. It's primarily used to accurately transfer the pattern on a mask onto a photosensitive material. Generally speaking, an exposure machine consists of a light source system, a mask, and a carrier system. When in use, the PCB is placed on the carrier system, and the light emitted by the light source system passes through the mask, projecting the pattern onto the photosensitive material of the PCB. After the PCB is exposed, a developer is applied to remove the dry film from the unexposed areas and retain the cured resist pattern.

[0003] However, before using the exposure machine to expose the PCB board, it is necessary to manually remove bubbles that exist when the PCB board is coated. At the same time, after the PCB board is exposed, it needs to be moved to the developing equipment to apply developer liquid to the PCB board for development, resulting in low overall processing efficiency. Summary of the Invention

[0004] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract and title of this application to avoid obscuring the purpose of this section, the abstract and the title of the invention, and such simplifications or omissions should not be used to limit the scope of the present invention.

[0005] In view of the above problems existing in the exposure equipment for conventional PCB board processing, the present invention is proposed.

[0006] Therefore, the object of the present invention is to provide an exposure device for PCB board processing, which aims to integrate exposure, bubble elimination and development into one.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: comprising: an exposure mechanism, which includes an exposure platform, an exposure device is fixedly connected to the left side of the top of the exposure platform, a placement box is slidably connected to the top of the exposure platform, both sides of the left side of the exposure platform are fixedly connected to an electric telescopic rod, the output end of the electric telescopic rod passes through the interior of the exposure platform and is fixedly connected to a connecting seat, the right side of the connecting seat is movably connected to the two sides of the left side of the placement box; a bubble elimination mechanism, which includes a squeezing roller, the squeezing roller is located on the right side of the top of the exposure platform, and both sides of the squeezing roller are movably connected to movable The movable part; and the developing mechanism, which includes a spray head, a lifting assembly and a recovery assembly, the two sides of the bottom of the spray head are fixedly connected to the right sides of the two sides of the top of the exposure platform, the right sides of the two sides of the exposure platform are fixedly connected to the liquid injection cylinder, the interior of the liquid injection cylinder is movably connected with a piston rod, the left side of the piston rod passes through the left side of the liquid injection cylinder and is transmission connected to the placement box, movable grooves are provided on both sides of the exposure platform, the interior of the movable groove is slidably connected with a sliding rod, the inner side of the sliding rod is fixedly connected to the left sides of the two sides of the placement box, and the outer side of the sliding rod is fixedly connected to the left side of the piston rod.

[0008] As a preferred solution of the exposure equipment for PCB board processing described in the present invention, the lifting assembly includes a transmission block, two transmission blocks are provided, the bottom of the transmission block is movably connected to the right sides of both sides of the top of the placement box, the outer side of the top of the inner wall of the movable part is fixedly connected with an extension block, the bottom of the extension block is fixedly connected with a force-bearing plate, the left side of the force-bearing plate is movably connected to the right side of the transmission block, the right side surface of the transmission block and the left side of the force-bearing plate are both inclined, the outer side of the left side of the transmission block is inclined, the inner side of the left side of the transmission block is fixedly connected with a tension spring, the other end of the tension spring is fixedly connected to a limiting plate, the bottom of the limiting plate is fixedly connected to the right sides of both sides of the top of the placement box, both sides of the top of the placement box are fixedly connected with support bars, the right side of the support bar is inclined, and the support bar is located on the left side of the force-bearing plate.

[0009] As a preferred solution of the exposure equipment for PCB board processing described in the present invention, the recycling component includes a recycling box, which is located at the bottom of the right side of the placement box, and the left sides of the tops of both sides of the recycling box are movably connected with connecting plates, the top of the left side of the connecting plate is fixedly connected to the bottom of the right side of the placement box, and the bottom of the recycling box is fixedly connected to a counterweight block.

[0010] As a preferred solution of the exposure equipment for PCB board processing described in the present invention, wherein: the top of the right side of the liquid injection cylinder is connected to a first one-way valve, the bottom of the right side of the liquid injection cylinder is connected to a second one-way valve, the liquid injection cylinder is connected to the spray head through the first one-way valve, and the liquid injection cylinder is connected to the external developer through the second one-way valve.

[0011] As a preferred solution of the exposure equipment for PCB board processing described in the present invention, the right sides of both sides of the top of the exposure platform are fixedly connected to limit rails, and the inner walls of the limit rails are slidably connected to the surface of the movable part.

[0012] As a preferred solution of the exposure equipment for PCB board processing of the present invention, a spring is fixedly connected to the outer side of the top of the movable part, and the other end of the spring is fixedly connected to the top of the inner wall of the limiting rail.

[0013] As a preferred solution of the exposure equipment for PCB board processing described in the present invention, a guide groove inclined to the right is provided at the bottom of the inner wall of the placement box, and several guide grooves are provided and distributed at equal distances, and the guide grooves are opened to the right side of the placement box.

[0014] As a preferred solution of the exposure equipment for PCB board processing described in the present invention, a leakage hole is provided on the top of the right side of the inner wall of the placement box, and a plurality of leakage holes are provided and are distributed at equal distances.

[0015] The beneficial effects of the present invention are as follows: an exposure mechanism is used for exposure, and a bubble elimination mechanism is started to eliminate bubbles before exposure, and a developing mechanism is started to develop after exposure is completed.

[0016] In view of the above-mentioned problems existing in the exposure equipment for conventional PCB board processing, the present invention is proposed.

[0017] Therefore, the object of the present invention is to provide an exposure method for an exposure device for PCB board processing, the purpose of which is to improve processing efficiency by integrating exposure, bubble elimination and development into one.

[0018] In order to solve the above technical problems, the present invention provides the following technical solutions: comprising:

[0019] Exposure using an exposure mechanism;

[0020] Start the bubble elimination mechanism to eliminate bubbles before exposure;

[0021] After the exposure is completed, the developing mechanism is started to develop.

[0022] As a preferred embodiment of the exposure method of the exposure device for PCB board processing of the present invention, the method further comprises:

[0023] Use the exposure mechanism to load and expose the PCB board;

[0024] During the loading process, the bubble elimination mechanism is activated to squeeze and roll the PCB board to eliminate bubbles;

[0025] When the exposure is completed and the material is unloaded, the developing mechanism is started to spray the developing liquid on the surface of the PCB board in the unloading process for development, realizing automatic development.

[0026] The beneficial effects of the present invention include: using an exposure mechanism to load and expose a PCB board, and starting a bubble elimination mechanism to squeeze and roll the PCB board during the loading process, thereby achieving bubble elimination; when the exposure is completed and the board is unloaded, starting a developing mechanism to spray a developing liquid on the surface of the PCB board during the unloading process for development, thereby achieving automatic development. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Among them:

[0028] Figure 1 This is a schematic diagram of the overall structure provided by the present invention.

[0029] Figure 2 This is a schematic diagram of the three-dimensional structure of the exposure platform provided by the present invention.

[0030] Figure 3 This is a schematic diagram of the three-dimensional structure of the placement box provided by the present invention.

[0031] Figure 4 This is a schematic diagram of the three-dimensional structure of the extrusion roller provided by the present invention.

[0032] Figure 5 This is a schematic diagram of the cross-sectional structure of the liquid injection cylinder provided by the present invention.

[0033] Figure 6 This is a schematic diagram of the three-dimensional structure of the recycling box provided by the present invention.

[0034] Figure 7 This is a schematic diagram of the three-dimensional structure of the transmission block provided by the present invention. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0036] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0037] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0038] Furthermore, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of the present invention, cross-sectional views illustrating device structures may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, the three-dimensional dimensions of length, width, and depth should be included. Example 1

[0039] Reference Figures 1 to 7 , which is the first embodiment of the present invention, provides an exposure method for an exposure device for PCB board processing, which integrates exposure, bubble elimination and development.

[0040] Use the exposure mechanism 100 to load the PCB board, thereby preparing for exposure;

[0041] During the loading process, the bubble elimination mechanism 200 is activated to squeeze and roll the PCB board, so that the bubbles between the PCB board and the covering film are squeezed out and the bubbles are eliminated;

[0042] When the exposure is completed and the material is unloaded, the developing mechanism 300 will be started to spray the developing liquid on the surface of the PCB board during the unloading process for development to achieve automatic development. Before development, the lifting component 302 will be triggered to lift the bubble elimination mechanism 200 to avoid the presence of developing liquid on the bubble elimination mechanism 200, and the excess developing liquid will be recovered through the recovery component 303 during the development process. Example 2

[0043] Reference Figures 1 to 7 , which is a second embodiment of the present invention, provides an exposure mechanism 100, a bubble elimination mechanism 200 and a development mechanism 300 to achieve bubble elimination before exposure and development after exposure.

[0044] The exposure mechanism 100 includes an exposure platform 101, an exposure device 102 is fixedly connected to the left side of the top of the exposure platform 101, a placement box 103 is slidably connected to the top of the exposure platform 101, and both sides of the left side of the exposure platform 101 are fixedly connected to an electric telescopic rod 104, the output end of the electric telescopic rod 104 passes through the interior of the exposure platform 101 and is fixedly connected to a connecting seat 105, and the right side of the connecting seat 105 is movably connected to both sides of the left side of the placement box 103; a bubble elimination mechanism 200 includes a squeezing roller 201, the squeezing roller 201 is located on the right side of the top of the exposure platform 101, and both sides of the squeezing roller 201 are movably connected to movable parts 202; and a developing mechanism 300 includes a spray head 301, a lifting component 302 and a recovery component 303, both sides of the bottom of the spray head 301 are fixedly connected to the right sides of the top of the exposure platform 101, and the right sides of the two sides of the exposure platform 101 are fixedly connected to a liquid injection cylinder 304, and the interior of the liquid injection cylinder 304 is movably connected to a piston rod 3 05, the left side of the piston rod 305 passes through the left side of the liquid injection cylinder 304 and is connected to the placement box 103. Both sides of the exposure platform 101 are provided with movable grooves 306. The interior of the movable grooves 306 is slidably connected to the sliding rods 307. The inner side of the sliding rods 307 is fixedly connected to the left sides of the placement box 103. The outer side of the sliding rods 307 is fixedly connected to the left side of the piston rod 305. The top of the right side of the liquid injection cylinder 304 is connected to the first one-way valve 308. The bottom of the right side of the liquid injection cylinder 304 is connected to the There is a second one-way valve 309, the liquid injection cylinder 304 is connected to the spray head 301 through the first one-way valve 308, and the liquid injection cylinder 304 is connected to the external developer through the second one-way valve 309. The right sides of both sides of the top of the exposure platform 101 are fixedly connected to the limit rail 203, the inner wall of the limit rail 203 is slidably connected to the surface of the movable part 202, and the outer side of the top of the movable part 202 is fixedly connected with a spring 204, and the other end of the spring 204 is fixedly connected to the top of the inner wall of the limit rail 203.

[0045] Specifically, the exposure device 102 is started to expose the PCB board. When the placement box 103 moves to the bottom of the exposure device 102, the squeezing roller 201 can roll in the process of squeezing the top of the PCB board, which can squeeze out the bubbles between the top of the PCB board and the covered film, thereby eliminating the bubbles. When the PCB board is pushed out after the exposure is completed, the top of the PCB board is evenly sprayed with developer to remove the dry film in the unexposed area and retain the cured resist layer pattern.

[0046] When the PCB is exposed, the user starts the electric telescopic rod 104 to move the placement box 103 to the right, so that the placement box 103 is exposed. Then, the PCB is placed in the placement box 103, and the electric telescopic rod 104 is started to reset the placement box 103. At this time, the exposure device 102 can be started to expose the PCB. In the process of the electric telescopic rod 104 pulling the placement box 103 to move below the exposure device 102, the elastic force of the spring 204 can push the movable member 202 downward, so that the movable member 202 moves downward along the inner wall of the limit rail 203. Then, the movable member 202 drives the squeezing roller 201 to move downward, so that the PCB drives the squeezing roller 201 to rotate in the process of moving the placement box 103 to the left, so that the squeezing roller 201 can roll in the process of squeezing the top of the PCB, so that the bubbles between the top of the PCB and the covered film can be squeezed out, thereby eliminating the bubbles. When the box 103 moves to the left and brings the PCB to the exposure position, the placement box 103 drives the slide bar 307 to move to the left along the inner wall of the movable groove 306, and then the slide bar 307 drives the piston rod 305 to move to the left, and then the space in the injection cylinder 304 gradually expands, so that the injection cylinder 304 can draw the external developer into the injection cylinder 304 through the second one-way valve 309 that only allows liquid to enter for preparation. When the electric telescopic rod 104 drives the placement box 103 to move to the right and pushes the PCB to the exposure position, the electric telescopic rod 104 drives the placement box 103 to move to the right and pushes the PCB to the exposure position. When ejecting, the placement box 103 will drive the slide bar 307 to move to the right along the inner wall of the movable groove 306, and then the slide bar 307 will drive the piston rod 305 to move to the right, and then the piston rod 305 will compress the space in the liquid injection cylinder 304, so that the developer stored in the liquid injection cylinder 304 is squeezed and discharged into the spray head 301 through the first one-way valve 308 that only allows liquid to be discharged for spraying, so that the top of the pushed-out PCB board is evenly sprayed with the developer, removing the dry film in the unexposed area and retaining the cured resist layer pattern. Example 3

[0047] Reference Figures 1 to 7 , which is the third embodiment of the present invention, provides a lifting component 302 and a recovery component 303 to achieve the bubble elimination function when the developer is sprayed and to recover the excess developer.

[0048] The lifting assembly 302 includes a transmission block 302a, which is provided with two transmission blocks 302a. The bottom of the transmission block 302a is movably connected to the right sides of both sides of the top of the placement box 103. The outer side of the top of the inner wall of the movable part 202 is fixedly connected with an extension block 302b. The bottom of the extension block 302b is fixedly connected with a force-bearing plate 302c. The left side of the force-bearing plate 302c is movably connected to the right side of the transmission block 302a. The right side of the transmission block 302a and the left side of the force-bearing plate 302c are both inclined. The outer side of the left side of the transmission block 302a is inclined. The inner side of the left side of the transmission block 302a is fixedly connected with a tension spring 302d. The other end of the tension spring 302d is fixedly connected to a limiting piece 302e. The bottom of the limiting piece 302e is fixedly connected to the right sides of both sides of the top of the placement box 103. Both sides of the top of the placement box 103 are fixedly connected The support bar 302f, the right side of the support bar 302f is inclined, the support bar 302f is located on the left side of the force-bearing plate 302c, the recovery component 303 includes a recovery box 303a, the recovery box 303a is located at the bottom of the right side of the placement box 103, the left side of the top of both sides of the recovery box 303a is movably connected with a connecting piece 303b, the top of the left side of the connecting piece 303b is fixedly connected to the bottom of the right side of the placement box 103, the bottom of the recovery box 303a is fixedly connected with a counterweight block 303c, the bottom of the inner wall of the placement box 103 is provided with a guide groove 303d inclined to the right, there are several guide grooves 303d and they are equidistantly distributed, the guide groove 303d is opened to the right side of the placement box 103, the top of the right side of the inner wall of the placement box 103 is provided with a leakage hole 303e, there are several leakage holes 303e and they are equidistantly distributed.

[0049] Specifically, when the placement box 103 drives the PCB board to move to the right and push it out, it will drive the squeezing roller 201 to move upward, so that the PCB board pushed out after completing exposure is no longer squeezed by the squeezing roller 201. At the same time, it can also prevent the developer from being sprayed onto the surface of the squeezing roller 201 when the spray head 301 sprays the developer, causing the squeezing roller 201 to smear the developer on the top of the PCB board when removing bubbles next time. When the PCB board is sprayed with the developer, the excess developer is recovered through the recovery box 303a to avoid waste of developer.

[0050] Furthermore, when the placement box 103 drives the PCB board to move to the right and is pushed out, the transmission block 302a and the support bar 302f will be driven to move synchronously to the right. Then, when the transmission block 302a is limited by the limiting piece 302e, the inclined surface on the left side of the force-bearing plate 302c will contact the inclined surface on the right side of the transmission block 302a, and the force-bearing plate 302c will be pushed. Then, the force-bearing plate 302c will move upward a short distance. At this time, the left side of the force-bearing plate 302c will contact the inclined surface on the right side of the support bar 302f. As the support bar 302f moves to the right, the force-bearing plate 302c will be driven to move upward to the top of the support bar 302f, so that the top of the support bar 302f is aligned with the bottom of the force-bearing plate 302c. The support bar 302f is separated from the force-bearing plate 302c and is reset by the spring 204 when the placement box 103 moves to the right. The PCB board is pushed to the left by the placement box 103 to move to the exposure position. During the downward process, the placement box 103 will synchronously drive the transmission block 302a and the support bar 302f to move to the left. First, the support bar 302f will move to the top of the reset force-bearing plate 302c and slide on the inner side of the top of the force-bearing plate 302c and the inner side of the extension block 302b. Then the inclined surface on the left side of the transmission block 302a will contact the right side of the force-bearing plate 302c. At this time, the transmission block 302a will drive the transmission block 302a to rotate as the inclined surface and the force-bearing plate 302c slide. At the same time, the tension spring 302d is pulled to generate tension. After the transmission block 302a is separated from the force-bearing plate 302c, the tension of the tension spring 302d will be released, thereby pulling the transmission block 302a to reset, thereby preparing for the next use. When the PCB board is sprayed with developer, the excess developer can flow out to the right through the guide groove 303d and the leakage hole 303e, and then be recovered through the recovery box 303a. When the placement box 103 moves to the rightmost side, the sliding connection between the slide bar 307 and the movable groove 306 and the lack of support at the bottom of the placement box 103 cause the right side of the placement box 103 to tilt downward, thereby improving the recovery efficiency of the excess developer. In addition, the weight of the recovery box 303a is increased by the counterweight block 303c, so that when the placement box 103 is tilted, the recovery box 303a will rotate, so that the recovery position of the recovery box 303a always faces the position where the placement box 103 pours out the developer, thereby ensuring the stability of the recovery.

[0051] The remaining structures are the same as those of Example 2. Example 4

[0052] Reference Figures 1 to 7 , which is the fourth embodiment of the present invention. This embodiment is different from the third embodiment in that: this embodiment provides an exposure device and method for PCB board processing.

[0053] When the user needs to perform exposure processing on the PCB board, the user starts the electric telescopic rod 104 to drive the placement box 103 to move to the right, so that the placement box 103 is exposed. Then the PCB board is placed in the placement box 103, and the electric telescopic rod 104 is started to drive the placement box 103 to return to its original position. At this time, the exposure device 102 can be started to perform exposure processing on the PCB board.

[0054] In the process of the electric telescopic rod 104 pulling the placement box 103 to move below the exposure device 102, the elastic force of the spring 204 can push the movable part 202 to move downward, so that the movable part 202 moves downward along the inner wall of the limit rail 203, and then the movable part 202 drives the squeezing roller 201 to move downward, so that the PCB board drives the squeezing roller 201 to rotate in the process of moving to the left as the placement box 103 moves, so that the squeezing roller 201 can roll in the process of squeezing the top of the PCB board, which can squeeze out the bubbles between the top of the PCB board and the covering film, thereby eliminating the bubbles.

[0055] When the electric telescopic rod 104 drives the placement box 103 to move to the left, thereby moving the PCB to the exposure position, the placement box 103 drives the slide bar 307 to move to the left along the inner wall of the movable groove 306, and then the slide bar 307 drives the piston rod 305 to move to the left, and then the space in the injection cylinder 304 gradually expands, so that the injection cylinder 304 draws the external developer into the injection cylinder 304 through the second one-way valve 309 that only allows liquid to enter for preparation. When the electric telescopic rod 104 drives the placement box 103 to move to the right, the developer is drawn into the injection cylinder 304. When the PCB board is pushed out, the placement box 103 will drive the slide bar 307 to move to the right along the inner wall of the movable groove 306, and then the slide bar 307 will drive the piston rod 305 to move to the right. Then the piston rod 305 will compress the space in the liquid injection cylinder 304, so that the developer stored in the liquid injection cylinder 304 is squeezed and discharged into the spray head 301 through the first one-way valve 308 that only allows liquid to be discharged for spraying, so that the top of the pushed out PCB board is evenly sprayed with the developer, removing the dry film in the unexposed area and retaining the cured resist layer pattern.

[0056] When the placement box 103 drives the PCB to move to the right and pushes it out, it will drive the transmission block 302a and the support bar 302f to move to the right synchronously. Then, the transmission block 302a will make the inclined surface on the left side of the force-bearing plate 302c contact the inclined surface on the right side of the transmission block 302a under the limit of the limiting piece 302e, and will push the force-bearing plate 302c. Then, the force-bearing plate 302c will move upward a short distance. At this time, the left side of the force-bearing plate 302c will contact the inclined surface on the right side of the support bar 302f. As the support bar 302e is moved upward, the left side of the force-bearing plate 302c will contact the inclined surface on the right side of the support bar 302f. The movement of 02f to the right will drive the force-bearing plate 302c to move upward to the top of the support bar 302f, so that the top of the support bar 302f and the bottom of the force-bearing plate 302c slide. At this time, the force-bearing plate 302c has moved upward to the maximum distance. As the force-bearing plate 302c moves upward, the squeezing roller 201 is driven upward by the movable part 202, so that the PCB board pushed out after the exposure is completed is no longer squeezed by the squeezing roller 201. At the same time, it can also prevent the developer from being sprayed onto the squeezing roller 201 when the developer is sprayed by the spray head 301. 1 causes the squeezing roller 201 to apply the developer to the top of the PCB board during the next bubble removal. After the placement box 103 moves to the right to the maximum distance, the support bar 302f is separated from the force plate 302c and is pushed to reset by the elastic force of the spring 204. When the placement box 103 drives the PCB board to move to the left to the bottom of the exposure position, the placement box 103 will synchronously drive the transmission block 302a and the support bar 302f to move to the left. First, the support bar 302f will move to the reset force plate 302c. 2c top and the inner side of the top of the force-bearing plate 302c and the inner side of the extension block 302b slide, and then the inclined surface on the left side of the transmission block 302a will contact the right side of the force-bearing plate 302c. At this time, the transmission block 302a will drive the transmission block 302a to rotate as the inclined surface and the force-bearing plate 302c slide, and at the same time, the tension spring 302d is pulled to generate tension. After the transmission block 302a is separated from the force-bearing plate 302c, the tension of the tension spring 302d will be released, thereby pulling the transmission block 302a to reset, so as to prepare for next use.

[0057] When the PCB board is sprayed with developer, the excess developer can flow out to the right through the guide groove 303d and the leakage hole 303e, and then be recovered through the recovery box 303a. When the placement box 103 moves to the rightmost side, the sliding connection between the slide bar 307 and the movable groove 306 and the lack of support at the bottom of the placement box 103 cause the right side of the placement box 103 to tilt downward, thereby improving the recovery efficiency of the excess developer. In addition, the weight of the recovery box 303a is increased by the counterweight block 303c, so that when the placement box 103 is tilted, the recovery box 303a will rotate, so that the recovery position of the recovery box 303a always faces the position where the placement box 103 pours out the developer, thereby ensuring the stability of the recovery.

[0058] In summary, the PCB board is loaded and exposed through the exposure mechanism 100. During the loading process, the bubble elimination mechanism 200 is started to squeeze and roll the PCB board, and the bubbles are squeezed out to achieve bubble elimination. When the exposure is completed and the board is unloaded, the developing mechanism 300 is started to spray the developing liquid on the surface of the PCB board during the unloading process for development.

Claims

1. An exposure device for PCB board processing, characterized by: include, An exposure mechanism (100) comprises an exposure platform (101), an exposure device (102) being fixedly connected to the left side of the top of the exposure platform (101), a placement box (103) being slidably connected to the top of the exposure platform (101), electric telescopic rods (104) being fixedly connected to both sides of the left side of the exposure platform (101), an output end of the electric telescopic rod (104) passing through the interior of the exposure platform (101) and being fixedly connected to a connecting seat (105), and a right side of the connecting seat (105) being movably connected to both sides of the left side of the placement box (103); A bubble elimination mechanism (200) comprising a squeezing roller (201), the squeezing roller (201) being located on the right side of the top of the exposure platform (101), and movable parts (202) being movably connected to both sides of the squeezing roller (201); and, The developing mechanism (300) comprises a spray head (301), a lifting assembly (302) and a recovery assembly (303), wherein the two sides of the bottom of the spray head (301) are fixedly connected to the right sides of the two sides of the top of the exposure platform (101), the right sides of the two sides of the exposure platform (101) are fixedly connected to the injection cylinder (304), the interior of the injection cylinder (304) is movably connected to a piston rod (305), the left side of the piston rod (305) passes through the left side of the injection cylinder (304) and is transmission-connected to the placement box (103), both sides of the exposure platform (101) are provided with movable grooves (306), the interior of the movable grooves (306) is slidably connected to a slide rod (307), the inner side of the slide rod (307) is fixedly connected to the left sides of the two sides of the placement box (103), and the outer side of the slide rod (307) is fixedly connected to the left side of the piston rod (305).

2. The exposure device for PCB board processing according to claim 1, characterized in that: The lifting assembly (302) includes a transmission block (302a), two of which are provided. The bottom of the transmission block (302a) is movably connected to the right sides of both sides of the top of the placement box (103). The outer side of the top of the inner wall of the movable part (202) is fixedly connected to an extension block (302b). The bottom of the extension block (302b) is fixedly connected to a force plate (302c). The left side of the force plate (302c) is movably connected to the right side of the transmission block (302a). The right side of the transmission block (302a) and the left side of the force plate (302c) are both The transmission block (302a) is arranged in an inclined manner, and the outer side of the left side of the transmission block (302a) is arranged in an inclined manner. The inner side of the left side of the transmission block (302a) is fixedly connected with a tension spring (302d), and the other end of the tension spring (302d) is fixedly connected with a limiting plate (302e). The bottom of the limiting plate (302e) is fixedly connected to the right sides of both sides of the top of the placement box (103). Both sides of the top of the placement box (103) are fixedly connected with support bars (302f), and the right side of the support bar (302f) is arranged in an inclined manner. The support bar (302f) is located on the left side of the force-bearing plate (302c).

3. The exposure equipment for PCB processing according to claim 2, characterized in that: The recycling component (303) comprises a recycling box (303a), the recycling box (303a) being located at the bottom of the right side of the placement box (103), the tops of both sides of the recycling box (303a) being movably connected to connecting pieces (303b) on the left side, the top of the left side of the connecting piece (303b) being fixedly connected to the bottom of the right side of the placement box (103), and the bottom of the recycling box (303a) being fixedly connected to a counterweight (303c).

4. The exposure device for PCB processing according to claim 1, characterized in that: The top of the right side of the liquid injection cylinder (304) is connected to a first one-way valve (308), and the bottom of the right side of the liquid injection cylinder (304) is connected to a second one-way valve (309). The liquid injection cylinder (304) is connected to the spray head (301) through the first one-way valve (308), and the liquid injection cylinder (304) is connected to the external developer through the second one-way valve (309).

5. The exposure device for PCB processing according to claim 2 or 3, characterized in that: The right sides of both sides of the top of the exposure platform (101) are fixedly connected to limiting rails (203), and the inner walls of the limiting rails (203) are slidably connected to the surface of the movable part (202).

6. The exposure equipment for PCB processing according to claim 5, characterized in that: A spring (204) is fixedly connected to the outer side of the top of the movable part (202), and the other end of the spring (204) is fixedly connected to the top of the inner wall of the limiting rail (203).

7. The exposure equipment for PCB processing according to claim 3, characterized in that: A guide groove (303d) inclined to the right is provided at the bottom of the inner wall of the placement box (103), and a plurality of guide grooves (303d) are provided and distributed at equal distances. The guide grooves (303d) are provided to the right side of the placement box (103).

8. The exposure equipment for PCB processing according to claim 7, characterized in that: A liquid leakage hole (303e) is provided at the top of the right side of the inner wall of the placement box (103), and a plurality of the liquid leakage holes (303e) are provided and are distributed at equal distances.

9. An exposure method for an exposure device for PCB board processing, characterized in that: The exposure device for PCB board processing according to any one of claims 1 to 8 further comprises: exposing using an exposure mechanism (100); Before exposure, the bubble elimination mechanism (200) is activated to eliminate bubbles; After the exposure is completed, the developing mechanism (300) is started to perform development.

10. The exposure method of the exposure equipment for PCB board processing according to claim 9, characterized in that: include, Using an exposure mechanism (100) to load and expose the PCB board; During the loading process, the bubble elimination mechanism (200) is activated to squeeze and roll the PCB board, thereby eliminating bubbles; When the exposure is completed and the material is unloaded, the developing mechanism (300) is started to spray the developing liquid on the surface of the PCB board during the unloading process for development, thereby realizing automatic development.

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