High-heat-dissipation corrosion-resistant PCB label

Abstract

The invention discloses a high-heat-dissipation corrosion-resistant PCB label, and relates to the technical field of PCB labels, the high-heat-dissipation corrosion-resistant PCB label comprises a polyimide film, the lower end of the polyimide film is provided with heat-conducting silicone grease, the upper end of the polyimide film is provided with a conductive adhesive, the upper end of the conductive adhesive is provided with a printing layer, and the upper end of the printing layer is coated with a fluorocarbon coating. Heat dissipation aluminum sheets are attached to the left end and the right end of the polyimide film. According to the invention, the polyimide film, the heat-conducting silicone grease, the conductive adhesive and the heat dissipation aluminum sheet are arranged, and the heat-conducting silicone grease can be used for filling a gap between the PCB tag and a heat dissipation device through multiple different materials, so that the heat conduction efficiency is improved, heat can be more effectively transferred to the heat dissipation device from the PCB tag, and the heat dissipation efficiency is improved. The conductive adhesive can be used for connecting circuit elements and lines and has good conductivity, cohesiveness and corrosion resistance, the heat dissipation area is increased through the heat dissipation aluminum sheet, heat dissipation is accelerated, and the heat dissipation effect of the PCB tag is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB labels, in particular to a high-heat-dissipating and corrosion-resistant PCB label. Background Art

[0002] In the field of modern battery technology, battery cells are the core components of batteries. Their performance and structural design play a decisive role in the overall efficiency of batteries. With the continuous expansion of battery application scenarios, from common portable electronic devices to large-scale energy systems such as electric vehicles and energy storage power stations, the demand for diversified battery cells has become increasingly prominent. Among them, the need for flexible adjustment of battery cell spacing has also emerged. In the assembly and application of battery modules, battery cell spacing is a key parameter. In traditional battery module design and manufacturing, battery cells are usually arranged and assembled at a fixed spacing. For example, in some early battery modules, battery cells are fixed in a predetermined position by a specific bracket or shell structure. The spacing is determined during production and is difficult to change later. This fixed spacing setting has many limitations in specific application scenarios. In order to better install and use battery cells, a high-heat dissipation and corrosion-resistant PCB label is required.

[0003] The existing battery cells cannot be adjusted in spacing during operation, and the entire battery cell cannot be shielded and protected. Therefore, a high heat dissipation and corrosion-resistant PCB label is urgently needed. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide a high heat dissipation and corrosion-resistant PCB label to solve the problem that the existing battery cells cannot be adjusted in spacing when in use and cannot shield and protect the entire battery cell.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-heat dissipation and corrosion-resistant PCB label, comprising a polyimide film, wherein thermal grease is provided at the lower end of the polyimide film, conductive adhesive is provided at the upper end of the polyimide film, a printed layer is provided at the upper end of the conductive adhesive, and a fluorocarbon coating is coated on the upper end of the printed layer. Heat dissipation aluminum sheets are attached to the left and right ends of the polyimide film.

[0006] Preferably, the polyimide film is in close contact with the thermal grease, and the polyimide film is in close contact with the heat dissipation aluminum sheet.

[0007] Preferably, the conductive adhesive is evenly applied on the upper surface of the polyimide film.

[0008] Preferably, the conductive adhesive is adhesively connected to the printed layer.

[0009] Preferably, the surface of the printing layer is coated with fluorocarbon coating.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. The present invention provides a polyimide film, thermal grease, conductive adhesive, and heat dissipation aluminum sheet. By providing a variety of different materials, the thermal grease can be used to fill the gap between the PCB label and the heat dissipation device, improving the heat conduction efficiency and enabling heat to be more effectively transferred from the PCB label to the heat dissipation device. The conductive adhesive can be used to connect circuit components and lines, and has good conductivity, adhesion, and corrosion resistance. The heat dissipation aluminum sheet increases the heat dissipation area, accelerates heat dissipation, and improves the heat dissipation effect of the PCB label.

[0012] 2. The polyimide film and fluorocarbon coating provided in the present invention have excellent corrosion resistance, weather resistance and self-cleaning properties through the fluorocarbon coating applied on the outermost layer of the PCB label. It can resist the erosion of various chemical substances, protect the surface of the PCB label from damage, and has certain heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front view structural schematic diagram of the present invention;

[0014] Figure 2 Schematic diagram of the structure of the polyimide film and the heat dissipation aluminum sheet of the present invention;

[0015] Figure 3 It is a front view of the structure of the present invention;

[0016] Figure 4 Schematic diagram of the material composition structure of the polyimide film of the present invention.

[0017] In the figure: 1. Polyimide film; 2. Thermal grease; 3. Conductive adhesive; 4. Printing layer; 5. Fluorocarbon coating; 6. Heat dissipation aluminum sheet. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0019] The following describes an embodiment of the present invention based on its overall structure.

[0020] See also Figures 1-4, a high heat dissipation and corrosion-resistant PCB label, including a polyimide film 1, a thermal conductive silicone grease 2 is provided at the lower end of the polyimide film 1, the polyimide film 1 and the thermal conductive silicone grease 2 are tightly adhered, and the polyimide film 1 and the heat dissipation aluminum sheet 6 are tightly adhered, and the thermal conductive silicone grease 2 is used to fill the gap between the PCB label and the heat dissipation device, thereby improving the heat conduction efficiency and enabling heat to be more effectively transferred from the PCB label to the heat dissipation device. A conductive adhesive 3 is provided at the upper end of the polyimide film 1, and the conductive adhesive 3 is evenly applied to the upper end surface of the polyimide film 1. The conductive adhesive 3 is used to connect circuit components and lines and is required to have good conductivity, adhesion and corrosion resistance. A printed layer 4 is provided at the upper end of the conductive adhesive 3, and a fluorocarbon coating 5 is coated on the upper end of the printed layer 4. Heat dissipation aluminum sheets 6 are adhered to the left and right ends of the polyimide film 1, and the surface of the printed layer 4 is coated with fluorocarbon coating 5. The fluorocarbon coating 5 has excellent corrosion resistance, weather resistance and self-cleaning properties, can resist the erosion of various chemicals, protects the surface of the PCB label from damage, and has certain heat dissipation performance.

[0021] Working principle: When in use, first evenly apply thermal grease 2 on the lower end of the polyimide film 1, and at the same time evenly apply conductive glue 3 on the upper end of the polyimide film 1. After the application is completed, the printed layer 4 can be fixedly connected to the polyimide film 1 through the conductive glue 3. After the connection, the fluorocarbon coating 5 can be evenly applied on the outside of the printed layer 4. After the application is completed, the entire PCB label can have good conductivity, adhesion and corrosion resistance when used, and the heat dissipation area is increased by the heat dissipation aluminum sheet, which accelerates heat dissipation and improves the heat dissipation effect of the PCB label. At the same time, when the PCB label is used, it has excellent corrosion resistance, weather resistance and self-cleaning properties, can resist the erosion of various chemical substances, protect the surface of the PCB label from damage, and has certain heat dissipation performance. This completes the use process of the device. The content not described in detail in this manual belongs to the existing technology known to professional and technical personnel in this field.

[0022] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high heat dissipation and corrosion resistant PCB label, comprising a polyimide film (1), characterized in that: The lower end of the polyimide film (1) is provided with a thermal conductive silicone grease (2), the upper end of the polyimide film (1) is provided with a conductive adhesive (3), the upper end of the conductive adhesive (3) is provided with a printing layer (4), the upper end of the printing layer (4) is coated with a fluorocarbon coating (5), and the left and right ends of the polyimide film (1) are attached with heat dissipation aluminum sheets (6).

2. The high heat dissipation and corrosion-resistant PCB label according to claim 1, characterized in that: The polyimide film (1) is tightly fitted to the thermal grease (2), and the polyimide film (1) is tightly fitted to the heat dissipation aluminum sheet (6).

3. The high heat dissipation and corrosion-resistant PCB label according to claim 1, characterized in that: The conductive adhesive (3) is evenly applied on the upper surface of the polyimide film (1).

4. The high heat dissipation and corrosion-resistant PCB label according to claim 1, characterized in that: The conductive adhesive (3) is adhesively connected to the printed layer (4).

5. The high heat dissipation and corrosion-resistant PCB label according to claim 1, characterized in that: The surface of the printing layer (4) is coated with fluorocarbon coating (5).

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