Chip mounting method and system capable of real-time deviation correction

Abstract

The present invention discloses a chip placement method and system capable of real-time deviation correction. The method includes a first visual system acquiring displacement information of the first component, a second visual system acquiring displacement information of a suction mechanism, and a third visual system acquiring displacement information of the second component. The first component is attracted by the suction mechanism to generate displacement information of the first component. A main control module determines the relative displacement of the first component relative to the second component during placement based on the displacement information of the first component, the suction mechanism, and the second component. A motion mechanism adjusts the position of the suction mechanism based on the relative displacement to compensate for the position of the first component in real time, allowing the first component to be placed on the second component. The present invention enables real-time compensation and deviation correction of the first component during placement, improving placement accuracy and quality.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and in particular to a chip mounting method and system capable of real-time deviation correction. Background Art

[0002] In the field of high-precision submicron placement technology, advanced equipment, processes, control algorithms, etc. are required to meet the development needs of increasingly miniaturized and high-density modern electronic devices. It is often used to manufacture high-performance electronic products such as smart phones and computer chips.

[0003] In the field of high-precision submicron placement technology, components are typically placed using a die bonder. During placement, the die bonder aligns the chip position with the substrate and then proceeds directly to placement. However, during the actual placement process, due to the high precision required, the chip's colloid can be squeezed and displaced when it adheres to the substrate, ultimately affecting the chip's placement accuracy. Furthermore, existing die bonders proceed directly to placement after alignment, without real-time compensation during the placement process, which can affect the chip's placement accuracy on the substrate.

[0004] In the process of implementing the present invention, the inventors discovered that the prior art has at least the following problems:

[0005] When mounting chips and substrates, it is impossible to perform real-time compensation during the mounting process, which affects the mounting accuracy. Summary of the Invention

[0006] The purpose of the present invention is to provide a chip mounting method and system capable of real-time deviation correction, so as to solve the technical problem in the prior art that when mounting chips and substrates, real-time compensation cannot be performed during the mounting process, which affects the mounting accuracy.

[0007] The various technical effects that can be produced by the preferred technical solutions among the various technical solutions provided by the present invention are described in detail below.

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] In a first aspect, the present invention provides a chip mounting method capable of real-time deflection correction, wherein during the process of mounting a first component with a second component, the first component is deflected in real time, the method comprising:

[0010] The first visual system acquires displacement information of the first component, the second visual system acquires displacement information of the suction mechanism, and the third visual system acquires displacement information of the second component, wherein the first component is sucked by the suction mechanism to generate the displacement information of the first component;

[0011] The main control module obtains the relative displacement of the first component relative to the second component during the placement process according to the displacement information of the first component, the displacement information of the suction mechanism and the displacement information of the second component;

[0012] The motion mechanism adjusts the position of the suction mechanism according to the relative displacement to compensate the position of the first component in real time, so that the first component can be mounted on the second component.

[0013] Optionally, the first visual system acquires displacement information of the first component, the second visual system acquires displacement information of the suction mechanism, and the third visual system acquires displacement information of the second component, including:

[0014] The first vision system acquires images of a first calibration feature on the first component at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the first calibration feature at the two adjacent moments, and obtains displacement information of the first component based on the first displacement image and the second displacement image of the first calibration feature;

[0015] The second vision system acquires images of a second calibration feature on the suction mechanism at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the second calibration feature at the two adjacent moments, and obtains displacement information of the suction mechanism based on the first displacement image and the second displacement image of the second calibration feature;

[0016] The third vision system acquires images of a third calibration feature on the second element at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the third calibration feature at the two adjacent moments, and obtains displacement information of the second element based on the first displacement image and the second displacement image of the third calibration feature, wherein the second element is carried by a carrying platform.

[0017] Optionally, the first visual system acquires images of a first calibration feature on the first component at two adjacent moments to obtain a first displacement image and a second displacement image corresponding to the first calibration feature at the two adjacent moments, respectively, including:

[0018] The lens assembly, the first beam splitting assembly, the first light source, and the first lens in the first visual system cooperate with each other to obtain the first displacement image and the second displacement image of the first calibration feature on the first element at two adjacent moments, wherein the lens assembly is an infinitely conjugated magnifying lens, and the object plane of the lens assembly is focused on the first calibration feature of the first element.

[0019] Optionally, a plurality of the second marking features are provided on the suction mechanism, and the plurality of the second marking features are arranged in an array on the outer wall of the suction member.

[0020] Optionally, the second calibration feature includes a reflective member and a semi-transparent member, and the semi-transparent member is obliquely arranged above the reflective member; the second visual system is used to obtain the first displacement image and the second displacement image of the second calibration feature on the suction mechanism based on the reflection of the semi-transparent member on the reflective member.

[0021] Optionally, obtaining the displacement information of the suction mechanism according to the first displacement image and the second displacement image of the second calibration feature includes:

[0022] Displacement information of the suction mechanism in the X-axis direction, the Y-axis direction, and the Z-axis direction is obtained according to the first displacement image and the second displacement image of the second calibration feature.

[0023] Optionally, obtaining the relative displacement of the first component relative to the second component during the placement process according to the displacement information of the first component, the displacement information of the suction mechanism, and the displacement information of the second component includes:

[0024] Obtaining a relative displacement of the first element based on the suction mechanism according to the displacement information of the first element;

[0025] obtaining a relative displacement of the suction mechanism based on the second element according to the displacement information of the suction mechanism and the displacement information of the second element;

[0026] The relative displacement of the first element based on the second element is calculated according to the relative displacement of the first element based on the suction mechanism and the relative displacement of the suction mechanism based on the second element.

[0027] Optionally, the motion mechanism adjusts the position of the suction mechanism according to the relative displacement to compensate for the position of the first component in real time so that the first component is mounted on the second component, including:

[0028] The motion mechanism is connected to the suction mechanism, and the motion mechanism includes an X-axis motion structure, a Y-axis motion structure, a Z-axis motion structure, and an R-axis motion structure. The X-axis motion structure, the Y-axis motion structure, the Z-axis motion structure, and the R-axis motion structure drive the suction mechanism to move in the X-axis direction, the Y-axis direction, the Z-axis direction, and the R-axis direction according to the relative displacement, so as to compensate the position of the first component in real time. After the position compensation, the first component is mounted on the second component.

[0029] In a second aspect, the present invention further provides a chip mounting system capable of real-time correction, which is used to perform the above-mentioned chip mounting method capable of real-time correction, comprising: a first vision system, a second vision system, a third vision system, a suction mechanism, a motion mechanism, and a carrier;

[0030] The suction mechanism is used to suck the first component;

[0031] The carrying platform is used to carry the second component;

[0032] The first visual system, the second visual system and the third visual system are located above the suction mechanism and the carrying platform, and are used to respectively obtain the displacement information of the first component, the displacement information of the suction mechanism and the displacement information of the second component in real time;

[0033] The motion mechanism is connected to the suction mechanism and is used to drive the suction mechanism to move its position; the motion mechanism also compensates the position of the first element in real time according to the relative displacement of the first element based on the second element.

[0034] Optionally, the first visual system includes a mirror group, a first beam splitter group, a first light source and a first lens; the mirror group, the first beam splitter group, the first light source and the first lens cooperate with each other to obtain a displacement image of a first calibration feature on the first element in real time, wherein the mirror group is an infinitely conjugated magnifying lens, and the object plane is focused on the first calibration feature of the first element.

[0035] Implementing one of the above technical solutions of the present invention has the following advantages or beneficial effects:

[0036] The chip placement method with real-time deviation correction described in this invention first uses a first, second, and third vision system to capture displacement information of a first component being picked up by a pickup mechanism, displacement information of the pickup mechanism, and displacement information of a second component. This information determines the positional changes of the first, pickup, and second components during the placement process. The main control module then calculates the relative displacement of the first component relative to the second component during the placement process based on the displacement information of the first, pickup, and second components. This relative displacement reflects the change in position of the first component relative to the second component, providing an important basis for subsequent compensation of the first component's position.

[0037] Finally, the motion mechanism adjusts the position of the suction mechanism based on the relative displacement of the first component relative to the second component, thereby adjusting the position of the first component being sucked by the suction mechanism in real time and compensating for the position of the first component in real time, allowing the first component to be accurately placed on the second component. Overall, the method described in this embodiment achieves real-time compensation and real-time deviation correction of the first component by acquiring displacement information in real time and calculating the relative displacement of the first component with respect to the second component based on the displacement information. This method can improve the placement accuracy and quality of the first and second components, thereby enhancing the accuracy and reliability of placement. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive work. In the drawings:

[0039] Figure 1 1 is a flow chart of a chip mounting method capable of real-time deviation correction according to a first embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the overall structure of a chip placement system capable of real-time deviation correction according to a second embodiment of the present invention;

[0041] Figure 3 2. It is a cross-sectional view of the first vision system, the second vision system, and the third vision system in the chip mounting system capable of real-time correction according to the second embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the connection between the motion mechanism and the suction mechanism in the chip placement system capable of real-time deviation correction according to the second embodiment of the present invention;

[0043] Figure 5 This is a schematic diagram of the connection between the suction mechanism and the mirror assembly in the chip mounting system capable of real-time deviation correction according to the second embodiment of the present invention.

[0044] In the figure: 1. first visual system; 11. lens group; 111. microscope objective lens; 12. first beam splitter group; 121. first beam splitter; 122. second beam splitter; 123. third beam splitter; 13. first light source; 14. first lens; 2. second visual system; 21. fourth beam splitter; 22. second light source; 23. second lens; 3. third visual system; 31. fifth beam splitter; 32. third light source; 33. third lens; 4. suction mechanism; 41. suction member; 411. suction part; 412. suction shell; 42. second calibration feature; 421. calibration seat; 422. reflector; 423. semi-transparent member; 43. vacuum pipe; 5. motion mechanism; 51. motion structure; 52. connecting arm; 6. support platform; 7. first element; 8. second element; 81. third calibration feature. DETAILED DESCRIPTION

[0045] In order to make the objects, technical solutions and advantages of the present invention clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, in which various exemplary embodiments that may be used to implement the present invention are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods and devices that are consistent with some aspects of the present disclosure as detailed in the appended claims, and other embodiments may also be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and essence of the present invention.

[0046] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", etc. indicate the orientation or position relationship based on the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the elements referred to must have a specific orientation, be constructed and operate in a specific orientation. The terms "first", "second", etc. are only used for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "plurality" means two or more. The terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0047] In order to illustrate the technical solution of the present invention, a specific embodiment is provided below, in which only the parts related to the embodiment of the present invention are shown.

[0048] Example 1:

[0049] like Figure 1 As shown, the present invention provides a chip mounting method capable of real-time deviation correction. During the process of mounting the first component with the second component, the first component is subjected to real-time deviation correction. The method includes:

[0050] S10, the first visual system acquires displacement information of the first component, the second visual system acquires displacement information of the suction mechanism, and the third visual system acquires displacement information of the second component, wherein the displacement information of the first component is generated when the first component is sucked by the suction mechanism;

[0051] S20, the main control module obtains the relative displacement of the first component relative to the second component during the placement process according to the displacement information of the first component, the displacement information of the suction mechanism, and the displacement information of the second component;

[0052] S30 , the motion mechanism adjusts the position of the suction mechanism according to the relative displacement to compensate the position of the first component in real time, so that the first component is mounted on the second component.

[0053] It should be noted that the chip mounting method with real-time deviation correction described in this embodiment is used to compensate the position of the first component in real time and correct the deviation of the first component in real time during the process of mounting the first component and the second component.

[0054] The chip placement method with real-time deviation correction described in this embodiment first uses a first, second, and third vision system to capture displacement information of a first component being picked up by a pickup mechanism, displacement information of the pickup mechanism, and displacement information of a second component. This information determines the positional changes of the first, pickup, and second components during the placement process. The main control module then calculates the relative displacement of the first component relative to the second component during the placement process based on the displacement information of the first component, the pickup mechanism, and the second component. This relative displacement reflects the change in position of the first component relative to the second component, providing an important basis for subsequent compensation of the first component's position.

[0055] Finally, the motion mechanism adjusts the position of the suction mechanism based on the relative displacement of the first component relative to the second component, thereby adjusting the position of the first component being sucked by the suction mechanism in real time and compensating for the position of the first component in real time, allowing the first component to be accurately placed on the second component. Overall, the method described in this embodiment achieves real-time compensation and real-time deviation correction of the first component by acquiring displacement information in real time and calculating the relative displacement of the first component with respect to the second component based on the displacement information. This method can improve the placement accuracy and quality of the first and second components, thereby enhancing the accuracy and reliability of placement.

[0056] It should be noted that, using the method described in this embodiment, the first component is a chip and the second component is a substrate, and the mounting accuracy can reach 0.2 microns.

[0057] Next, we will combine Figure 1 The specific implementation steps of the chip mounting method capable of real-time deviation correction provided by this embodiment are described in detail.

[0058] Before executing step S10 , the first component has been sucked by the sucking mechanism, and the second component has been placed on the carrying platform accordingly.

[0059] First, step S10 is executed. The first visual system acquires displacement information of the first component, the second visual system acquires displacement information of the suction mechanism, and the third visual system acquires displacement information of the second component. The displacement information of the first component is generated when the first component is sucked by the suction mechanism. The displacement information includes displacement amount and displacement direction.

[0060] Specifically, when acquiring displacement information, the displacement information of the first element, the suction mechanism, and the second element is acquired. The first element is provided with a first calibration feature, which is located on the upper surface of the first element and can be photographed and acquired by the first vision system; the suction mechanism is provided with a second calibration feature, which is located on the outer side of the suction member and is provided in plurality, and can be photographed and acquired by the second vision system; and the second element is provided with a third calibration feature, which is located on the upper surface of the second element and is provided in plurality, and can be photographed and acquired by the third vision system.

[0061] In this embodiment, the calibration features are characteristic points and areas with specific identification functions. By real-time recognition and tracking of the calibration features, the positions and displacements of the first component, the suction mechanism, and the second component can be determined.

[0062] More specifically, when acquiring displacement information, the first visual system, the second visual system, and the third visual system are used to photograph the first calibration feature on the first component, the second calibration feature on the suction mechanism, and the third calibration feature on the second component, respectively, to provide accurate position information for subsequent operations and improve the accuracy and reliability of subsequent mounting of the first component on the second component.

[0063] Specifically, when the first visual system, the second visual system, and the third visual system acquire the displacement information of the first component sucked by the sucking mechanism, the displacement information of the sucking mechanism, and the displacement information of the second component, the following steps are specifically included:

[0064] The first visual system acquires images of a first calibration feature on the first component at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the first calibration feature at the two adjacent moments, and obtains displacement information of the first component based on the first displacement image and the second displacement image of the first calibration feature.

[0065] The second visual system acquires images of the second calibration feature on the suction mechanism at two adjacent moments, obtains the first displacement image and the second displacement image corresponding to the second calibration feature at the two adjacent moments, and obtains the displacement information of the suction mechanism based on the first displacement image and the second displacement image of the second calibration feature.

[0066] The third vision system acquires images of the third calibration feature on the second element at two adjacent moments, obtains first displacement images and second displacement images corresponding to the third calibration feature at the two adjacent moments, and obtains displacement information of the second element based on the first displacement image and second displacement image of the third calibration feature, wherein the second element is carried by the carrying platform.

[0067] The above steps can be performed simultaneously or at a suitable time according to actual conditions.

[0068] Hereinafter, the first visual system acquiring the displacement information of the first component in real time, the second visual system acquiring the displacement information of the suction mechanism in real time, and the third visual system acquiring the displacement information of the second component in real time will be described in detail.

[0069] The first visual system acquires images of a first calibration feature on the first component at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the first calibration feature at the two adjacent moments, and obtains displacement information of the first component based on the first displacement image and the second displacement image of the first calibration feature.

[0070] Specifically, the suction mechanism is provided with a suction member for sucking the first component. For ease of description, the suction mechanism will be used instead of the suction member. As the suction mechanism moves the first component, the first vision system captures images of the first calibration feature on the first component at multiple moments in time, acquiring the position of the first calibration feature on the first component in real time to determine the displacement of the first component at multiple moments in time.

[0071] Let's take an example: Assume the first vision system captures images at a five-second interval. Initially, the first vision system captures an image of the first calibration feature on the current first component, obtaining a first displacement image of the first calibration feature. At five seconds, the first vision system captures an image of the first calibration feature on the current first component, obtaining a second displacement image of the first calibration feature. At this point, the images captured at the start and the fifth second are adjacent moments, and the images captured at these two moments are the first displacement image and the second displacement image of the first calibration feature, respectively. Subsequently, the displacement information of the first component can be obtained based on the first and second displacement images. Subsequently, the image captured at the tenth second becomes the second displacement image, which is compared with the first displacement image captured at the fifth second. This repetitive process allows for real-time acquisition of images of the first calibration feature on the first component, obtaining real-time displacement information of the first component, facilitating subsequent real-time compensation of the first component's position.

[0072] In this embodiment, a first visual system is used to acquire an image of the first calibration feature on the first component in real time, and by comparing the images of the first calibration feature on the first component at two adjacent moments, it is possible to accurately calculate whether there is a deviation in the position of the first component at two adjacent moments, thereby realizing real-time monitoring of the first component.

[0073] More specifically, during the shooting process, the first visual system will only acquire the image of the first calibration feature on the first element absorbed by the absorption mechanism. The first visual system includes a lens group, a first spectroscopic group, a first light source and a first lens. The lens group is located in the absorption mechanism and is an infinitely conjugated magnifying lens. The object plane of the lens group is focused on the first calibration feature of the first element. The first spectroscopic group, the first light source and the first lens are mounted above the absorption mechanism. The first light source is used to emit light. The light source forms an optical path under the action of the first spectroscopic group and hits the first calibration feature of the first element. The first lens and the lens group cooperate with each other to form an infinitely conjugated lens, and imaging is performed under the action of the first lens. Among them, the lens group is a lens group formed by three or five microscope objective lenses. The first spectroscopic group is a plurality of optical paths designed accordingly according to actual requirements, and is not specifically limited in this embodiment.

[0074] Because of the use of a lens assembly, the first vision system accurately captures an image of the calibration feature on the first component, regardless of how the first component is moved by the suction mechanism and the motion mechanism. Therefore, as long as the first calibration feature on the first component remains unchanged relative to the lens assembly, the image captured by the first lens in the first vision system will remain unchanged. However, if the position of the first component shifts on the suction mechanism, the first component will change relative to the lens assembly, and the image captured by the first lens in the first vision system will change accordingly.

[0075] Based on the images of the first calibration feature on the first component captured by the first vision system, position changes of the first component can be detected in real time. When the position of the first component changes, differences will appear in the images captured by the first vision system at two consecutive moments. These differences can be identified and analyzed using image processing algorithms, allowing the precise calculation of the displacement and direction of the first component at each moment.

[0076] The second visual system acquires images of the second calibration feature on the suction mechanism at two adjacent moments, obtains the first displacement image and the second displacement image corresponding to the second calibration feature at the two adjacent moments, and obtains the displacement information of the suction mechanism based on the first displacement image and the second displacement image of the second calibration feature.

[0077] Specifically, when the suction mechanism, under the action of the motion mechanism, moves the first component, positional deviations may occur during this displacement process, thereby affecting the placement accuracy of the first and second components. Therefore, a second vision system is required to capture first and second displacement images of the second calibration feature on the suction mechanism at two adjacent moments in time to obtain displacement information of the suction mechanism. The capture process of the second vision system is identical to that of the first vision system and will not be detailed here.

[0078] The second visual system includes a second spectroscopic group, a second light source and a second lens. During the actual shooting process, the second light source emits light, and the second spectroscopic group cooperates with the first spectroscopic group in the first visual system to form a shooting light path, so that the second lens shoots the image of the second calibration feature on the absorption mechanism from top to bottom.

[0079] It should be noted that the displacement information of the suction mechanism includes displacement information of the suction mechanism in the X-axis direction, the Y-axis direction, and the Z-axis direction. The acquisition of the displacement information of the suction mechanism in the X-axis direction, the Y-axis direction, and the Z-axis direction is related to the second calibration feature on the suction mechanism.

[0080] The suction mechanism is provided with multiple second calibration features, arranged in an array on the outer wall of the suction member. In this embodiment, to better capture displacement information of the suction mechanism, four second calibration features are selected. Two of these second calibration features, each located opposite to the other, can indicate the position of the suction mechanism in the Z and Y axes, respectively, under the influence of the second vision system. Each second calibration feature can indicate displacement information of the suction mechanism in the Z axis, under the influence of the second vision system.

[0081] More specifically, to facilitate the second vision system's real-time acquisition of displacement information from the suction mechanism, the suction mechanism's second calibration features are also designed accordingly. Each second calibration feature comprises a reflective element and a semi-transparent element, with the semi-transparent element positioned diagonally above the reflective element. The second vision system is configured to capture first and second displacement images of the second calibration feature on the suction mechanism based on the reflection of the semi-transparent element on the reflective element. The semi-transparent element includes a translucent portion and a non-translucent portion, which are arranged alternately.

[0082] The displacement information of the suction mechanism in the X-axis direction, the Y-axis direction and the Z-axis direction is obtained by the first displacement image of the second calibration feature on the suction mechanism obtained by the second vision system at the previous moment and the second displacement image of the second calibration feature on the suction mechanism obtained at the next moment.

[0083] The displacement information of the suction mechanism in the X and Y axes is determined by two opposing second calibration features. The displacement information of the suction mechanism in the Z axis is determined by each second calibration feature. Because the translucent elements on the second calibration features are positioned at an angle, the second vision system is compatible with the depth of field of the translucent elements and can obtain the displacement information of the suction mechanism in the Z axis.

[0084] The second vision system captures the displacement of the suction mechanism in real time as it is driven by the motion mechanism. This not only allows the movement of the suction mechanism itself to be monitored, but also its displacement information, providing crucial information for subsequent adjustments to the first component's position during the placement process.

[0085] The third vision system acquires images of the third calibration feature on the second element at two adjacent moments, obtains first displacement images and second displacement images corresponding to the third calibration feature at the two adjacent moments, and obtains displacement information of the second element based on the first displacement image and second displacement image of the third calibration feature, wherein the second element is carried by the carrying platform.

[0086] Specifically, the second component is supported by the carrier. During the placement process of the first and second components, the second component's position is fixed. However, during the actual placement process, the second component may shift slightly on the carrier due to external factors, affecting subsequent placement. Therefore, a third vision system is also required to capture images of the second calibration feature on the second component at two adjacent moments to determine the second component's position and ensure the accuracy of the placement of the first and second components.

[0087] The third vision system differs from the first and second vision systems in how they capture images. The first and second vision systems need to capture the real-time displacement of the first component and the suction mechanism during motion, requiring a shorter time interval to ensure accuracy. The third vision system, on the other hand, can capture the displacement of the second component in real time, or simply capture the third calibration feature on the second component twice to obtain the displacement information.

[0088] If only two images are taken of the third calibration feature on the second component, the first image can be taken after the pickup mechanism picks up the first component, and the second image can be taken just before the first component is placed. Based on these two images, the displacement information of the second component can be directly obtained.

[0089] The third visual system includes a third spectroscopic group, a third light source and a third lens. During the actual shooting process, the third light source emits light, and the third spectroscopic group cooperates with the first spectroscopic group in the first visual system to form a shooting light path, so that the third lens shoots the image of the third calibration feature of the absorption mechanism from top to bottom.

[0090] It should be noted that the second lens and the third lens in this embodiment are both telephoto lenses. The first beam splitting group, the second beam splitting group and the third beam splitting group all include a plurality of beam splitters, which are half-reflecting half-mirror lenses.

[0091] As described above, the first, second, and third vision systems capture displacement information of the first component, the suction mechanism, and the second component. This displacement information is subsequently analyzed to provide important parameters for placement of the first and second components, ensuring accurate placement.

[0092] Then, step S20 is executed, where the main control obtains the relative displacement of the first component relative to the second component during the placement process according to the displacement information of the first component, the displacement information of the suction mechanism, and the displacement information of the second component.

[0093] Specifically, the displacement information of the first element is the real-time change of the first element under the action of the suction mechanism, the displacement information of the suction mechanism is the real-time change of the suction mechanism under the action of the motion mechanism, and the displacement information of the second element is the change of the second element on the supporting platform.

[0094] Therefore, the main control module can obtain the relative displacement of the first element based on the suction mechanism according to the displacement information of the first element; obtain the relative displacement of the suction mechanism based on the second element according to the displacement information of the suction mechanism and the displacement information of the second element; and calculate the relative displacement of the first element based on the second element according to the relative displacement of the first element based on the suction mechanism and the relative displacement of the suction mechanism based on the second element.

[0095] Specifically, because the first component is being picked up by the pickup mechanism, when the first vision system captures an image of the calibration feature on the first component, the image already includes the relative displacement of the first calibration feature on the first component relative to the pickup mechanism. Furthermore, based on the displacement information of the pickup mechanism and the displacement information of the calibration feature on the second component, the relative displacement of the pickup mechanism relative to the second component can be determined.

[0096] Finally, after obtaining the relative displacement of the first element based on the suction mechanism and the relative displacement of the suction mechanism based on the second element, the two relative displacement information are used to perform corresponding calculations (in this embodiment, operations such as vector addition can be used) to obtain the relative displacement of the first element relative to the second element.

[0097] According to the above steps, it is helpful to confirm the positional relationship between the first component and the second component, thereby providing a prerequisite for subsequent accurate placement and ensuring the accuracy of placement.

[0098] Finally, step S30 is executed, where the motion mechanism adjusts the position of the suction mechanism according to the relative displacement to compensate for the position of the first component and perform deviation correction so that the first component can be accurately placed on the second component. The motion mechanism can be controlled by the main control module.

[0099] Specifically, the motion mechanism is connected to the suction mechanism, and the motion mechanism includes an X-axis motion structure, a Y-axis motion structure, a Z-axis motion structure and an R-axis motion structure. The motion mechanism is used to drive the suction mechanism to move in the X-axis direction, the Y-axis direction, the Z-axis direction and the R-axis direction, so that the first component is positioned and then mounted on the second component.

[0100] In this embodiment, the motion mechanism is connected to the suction mechanism and can drive the suction mechanism to move in the X-axis, Y-axis, Z-axis, and R-axis directions. During the placement of the first and second components, the motion mechanism can drive the suction assembly to move, allowing the first component to approach the second component under the action of the suction mechanism. At the same time, the motion mechanism can also compensate for the position of the first component in real time based on the relative displacement of the first component with respect to the second component, making precise corrections to ensure the accuracy of the placement of the first component on the second component.

[0101] In general, the chip mounting method with real-time deviation correction described in this embodiment adjusts the position of the first component in real time according to the relative displacement of the first component based on the second component through the coordinated work of the first visual system, the second visual system, the third visual system, the suction mechanism and the motion mechanism, thereby achieving precise mounting of the first component and the second component, and having high mounting accuracy and mounting reliability.

[0102] The embodiment is only a special example and does not represent only one way of implementing the present invention.

[0103] Example 2:

[0104] The present invention also provides a chip mounting system capable of real-time correction, which is used to execute the chip mounting method capable of real-time correction described in the first embodiment. Figure 2-Figure 5 As shown, the chip mounting system includes: a first vision system 1, a second vision system 2, a third vision system 3, a suction mechanism 4, a motion mechanism 5 and a carrier 6; the suction mechanism 4 is used to suck the first component 7; the carrier 6 is used to carry the second component 8; the first vision system 1, the second vision system 2 and the third vision system 3 are located above the suction mechanism 4 and the carrier 6, and are respectively used to obtain the displacement information of the first component 7, the displacement information of the suction mechanism 4 and the displacement information of the second component 8 in real time; the motion mechanism 5 is connected to the suction mechanism 4, and is used to drive the suction mechanism 4 to move the position; the motion mechanism 5 also compensates the position of the first component 7 in real time according to the relative displacement of the first component 7 based on the second component 8.

[0105] In this embodiment, the first vision system 1 acquires displacement information of the first component 7, the second vision system 2 is used to obtain displacement information of the suction mechanism 4 in real time, and the third vision system 3 is used to obtain displacement information of the second component 8. Subsequently, the relative displacement of the first component 7 relative to the second component 8 during the placement process is determined based on the displacement information of the first component 7, the displacement information of the suction mechanism 4, and the displacement information of the second component 8. The motion mechanism 5 adjusts the position of the suction mechanism 4 based on the relative displacement, thereby adjusting the position of the first component 7 in real time and ensuring accurate placement of the first component 7 on the second component 8.

[0106] The chip mounting system capable of real-time deviation correction described in this embodiment adjusts the position of the first component 7 in real time according to the relative displacement of the first component 7 based on the second component 8 through the coordinated work of the first visual system 1, the second visual system 2, the third visual system 3, the suction mechanism 4 and the motion mechanism 5, thereby achieving precise mounting of the first component 7 and the second component 8, and having high mounting accuracy and mounting reliability.

[0107] Next, we will combine Figure 2-Figure 5 The chip mounting system capable of real-time deviation correction described in this embodiment is described in detail.

[0108] The first vision system 1 is used to capture in real time an image of the first calibration feature on the first component 7 sucked by the suction mechanism 4 . It should be noted that the first calibration feature on the first component 7 is a calibration pattern located on the top of the first component 7 .

[0109] like Figure 3 As shown, the first visual system 1 includes a lens assembly 11, a first beam splitter assembly 12, a first light source 13, and a first lens 14. The lens assembly 11 is located within the suction mechanism 4 or extends outward from the suction mechanism 4. However, it should be noted that regardless of the arrangement of the lens assembly 11, it is necessary to ensure that the suction mechanism 4 is in a sealed state after suctioning the first component 7.

[0110] The lens is an infinitely conjugated magnifying lens. The object plane of the lens assembly 11 is focused on the first calibration feature of the first element 7. The first beam splitter group 12, the first light source 13, and the first lens 14 are mounted above the suction mechanism 4. The first lens 14 is arranged opposite the lens assembly 11. The first light source 13 is used to emit light. The light source forms an optical path under the action of the first beam splitter group 12 and hits the first calibration feature of the first element 7. The first lens 14 cooperates with the lens assembly 11 to form an infinitely conjugated lens, and imaging is performed under the action of the first lens 14. The lens assembly 11 is formed by three or five microscope objective lenses 111.

[0111] The first beam splitter group 12 is designed to correspond to the actual required optical path. In this embodiment, the first beam splitter group 12 includes a first beam splitter 121, a second beam splitter 122, and a third beam splitter 123. The light emitted by the first light source 13 is projected onto the first element 7 through the lens group 11 under the action of the first beam splitter 121, the second beam splitter 122, and the third beam splitter 123. The first lens 14 then captures an image of the first calibration feature on the first element 7.

[0112] Due to the use of the lens assembly 11, as long as the first calibration feature on the first element 7 does not change relative to the lens assembly 11, the image captured by the first lens 14 in the first vision system 1 will not change. However, if the position of the first element 7 is displaced on the suction mechanism 4, the first element 7 will change relative to the lens assembly 11, and the image captured by the first lens 14 in the first vision system 1 will change accordingly.

[0113] The second vision system 2 is used to capture the image of the second calibration feature 42 on the suctioned mechanism 4 in real time.

[0114] First, if Figure 2-Figure 5 As shown, the suction mechanism 4 is introduced. The suction mechanism 4 is used to suck the first component 7. The suction mechanism 4 includes a suction member 41 and a plurality of second marking features 42 arranged in an array outside the suction member 41.

[0115] In order to facilitate the second visual system 2 to obtain the displacement information of the suction mechanism 4 in real time, the second calibration feature 42 is designed accordingly. Figure 5 As shown, the second calibration feature 42 includes a reflective member 422 and a semi-transparent member 423 disposed on a calibration base 421. The semi-transparent member 423 is disposed obliquely above the reflective member 422. The second vision system 2 is configured to obtain a first displacement image and a second displacement image of the second calibration feature 42 on the suction mechanism 4 based on the reflection of the semi-transparent member 423 on the reflective member 422. The semi-transparent member 423 includes a translucent portion and a non-translucent portion, which are arranged alternately.

[0116] The design of the second calibration feature 42 enables the second vision system 2 to obtain a displacement image of the second calibration feature 42 and obtain displacement information of the suction mechanism 4 in the X-axis direction, the Y-axis direction and the Z-axis direction based on the image.

[0117] The displacement information of the suction mechanism 4 in the X- and Y-axis directions is determined by the two opposing second calibration features 42. The displacement information of the suction mechanism 4 in the Z-axis direction is determined by each second calibration feature 42. Because the translucent member 423 on the second calibration feature 42 is arranged at an angle, the second vision system 2 is able to accommodate the depth of field of the translucent member 423, facilitating the acquisition of the displacement information of the suction mechanism 4 in the Z-axis direction.

[0118] like Figure 4 As shown, the suction member 41 includes a suction portion 411 and a suction shell 412, wherein the suction portion 411 is located below the suction shell 412. It should be noted that both the suction portion 411 and the suction shell 412 are hollow structures.

[0119] The purpose of setting the suction shell 412 as a hollow structure is to facilitate the placement of the lens group 11 in the first vision system 1 and provide sufficient space for the placement of the lens group 11, so that the lens group 11 can cooperate with other components in the first vision system 1 to accurately capture the image information of the first calibration feature on the first element 7, thereby ensuring the stability and accuracy of the shooting of the first vision system 1.

[0120] The suction portion 411 is configured as a hollow structure to facilitate cooperation with the vacuum pipe 43 to vacuum-absorb the first component 7. The vacuum pipe 43 can be disposed on the side wall of the suction portion 411 or on the top of the suction shell 412. In this embodiment, the vacuum pipe 43 is preferably disposed on the side wall of the suction portion 411. Placing the vacuum pipe 43 on the side wall of the suction portion 411 can avoid interference with the lens assembly 11 within the suction shell 412, while also facilitating connection to an external vacuum source. When the suction portion 411 absorbs the first component 7, it can more stably adsorb the first component 7, preventing the component from falling or shifting during movement.

[0121] More specifically, the suction portion 411 is conical in shape, with the tip of the cone not completely enclosed. This partially enclosed tip of the suction portion 411 is used to absorb the first component 7. After the suction portion 411 absorbs the first component 7, the suction mechanism 4 is completely enclosed, allowing the first component 7 to be absorbed using the vacuum principle. After the first component 7 is absorbed by the suction portion 411, the first calibration feature on the first component 7 is captured by the first vision system 1 positioned above the suction mechanism 4.

[0122] like Figure 2-Figure 3 As shown, the second visual system 2 includes a second beam splitter group, a second light source 22, and a second lens 23. The second lens 23 is positioned downward, and the second beam splitter group includes a fourth beam splitter 21. During the actual shooting process, the second light source 22 emits light, and the fourth beam splitter 21 cooperates with the second beam splitter 122 and the third beam splitter 123 in the first visual system 1 to form a shooting light path, which projects the light onto the suction mechanism 4. The second lens 23 then captures an image of the second calibration feature 42 on the suction mechanism 4 to obtain displacement information of the suction mechanism 4.

[0123] The motion mechanism 5 is used to drive the suction assembly to move its position so that the first component 7 is placed close to the second component 8 and can compensate the position of the first component 7 in real time according to the relative displacement of the first component 7 based on the second component 8.

[0124] Specifically, if Figure 4As shown, the motion mechanism 5 includes a motion structure 51 and a connecting arm 52. One end of the connecting arm 52 is connected to the motion structure 51, and the other end is directly connected to the suction mechanism 4. The suction mechanism 4 is capable of moving under the action of the connecting arm 52 and the motion structure 51, thereby driving the first component 7, which is held by the suction mechanism 4, to move. It should be noted that the first component 7 is displaced toward the second component 8 under the action of the motion mechanism 5 and the suction mechanism 4. Furthermore, the first component 7 is precisely adjusted under the action of the motion mechanism 5 and the suction mechanism 4.

[0125] The motion structure 51 includes an X-axis motion structure, a Y-axis motion structure, a Z-axis motion structure, and an R-axis motion structure, capable of driving the suction mechanism 4 to move in the X-axis, Y-axis, Z-axis, and Z-axis directions, thereby driving the position of the first component on the suction mechanism 4. The X-axis motion structure, the Y-axis motion structure, the Z-axis motion structure, and the R-axis motion structure respectively enable precise movement of the suction mechanism 4 in four different directions. The X-axis motion structure ensures the horizontal left and right movement of the suction mechanism 4, the Y-axis motion structure is responsible for horizontal forward and backward movement, the Z-axis motion structure controls the vertical lifting and lowering of the suction mechanism 4, and the R-axis motion structure is used to control the rotation of the suction mechanism 4 along the Z-axis. The configuration of the motion structure 51 enables the suction mechanism 4 to flexibly adjust its position, driving the first component 7 to move precisely, meeting the requirements of higher-precision placement. Furthermore, the coordinated operation of the motion structure 51 ensures the stability and accuracy of the suction mechanism 4 during positional movement, further improving the precision and efficiency of placement of the first and second components 7 and 8.

[0126] The third vision system 3 is used to capture an image of the third calibration feature 81 on the second component 8 placed on the support platform 6. It should be noted that the third calibration feature 81 on the second component 8 is a pattern. In order to facilitate the third vision system 3 to better obtain the displacement information of the second component 8, a plurality of third calibration features 81 on the second component 8 can be provided.

[0127] like Figure 2-Figure 3 As shown, the third visual system 3 includes a third beam splitter group, a third light source 32, and a third lens 33. The third lens 33 is set under the signal, and the third beam splitter group includes a fifth beam splitter 31. During the actual shooting process, the third light source 32 emits light, which, in cooperation with the fifth beam splitter 31 and the third beam splitter 123 in the first visual system 1, forms a shooting light path, precisely controls the reflection and transmission path of the light, ensures that the light source accurately hits the second element 8, and then the third lens 33 captures the image of the third calibration feature 81 on the second element 8 to obtain the displacement information of the second element 8.

[0128] It should be noted that the beam splitters in the first beam splitting group 12, the second beam splitting group and the third beam splitting group in this embodiment are all half-reflecting half-mirrors. The characteristic of half-reflecting half-mirrors is that they can partially reflect and partially transmit light, thereby achieving light path distribution and adjustment.

[0129] The use of the third visual system 3 to obtain the displacement information of the second element 8 has been described in the first embodiment and will not be described in detail in this embodiment.

[0130] The foregoing is merely a preferred embodiment of the present invention. Those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. Furthermore, under the guidance of the present invention, these features and embodiments may be modified to suit specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be within the scope of the present invention.

Claims

1. A chip mounting method capable of real-time deviation correction, characterized in that: During the process of mounting a first component and a second component, performing real-time deviation correction on the first component, the method comprising: The first visual system acquires displacement information of the first component, the second visual system acquires displacement information of the suction mechanism, and the third visual system acquires displacement information of the second component, wherein the first component is sucked by the suction mechanism to generate the displacement information of the first component; The main control module obtains the relative displacement of the first component based on the second component during the placement process according to the displacement information of the first component, the displacement information of the suction mechanism, and the displacement information of the second component; obtaining the relative displacement of the first component based on the second component during the placement process according to the displacement information of the first component, the displacement information of the suction mechanism, and the displacement information of the second component includes: obtaining the relative displacement of the first component based on the suction mechanism according to the displacement information of the first component; obtaining the relative displacement of the suction mechanism based on the second component according to the displacement information of the suction mechanism and the displacement information of the second component; and calculating the relative displacement of the first component based on the second component according to the relative displacement of the first component based on the suction mechanism and the relative displacement of the suction mechanism based on the second component; The motion mechanism adjusts the position of the suction mechanism according to the relative displacement to compensate the position of the first component in real time, so that the first component can be mounted on the second component.

2. The chip mounting method capable of real-time deviation correction according to claim 1, characterized in that: The first visual system acquires displacement information of the first component, the second visual system acquires displacement information of the suction mechanism, and the third visual system acquires displacement information of the second component, including: The first vision system acquires images of a first calibration feature on the first component at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the first calibration feature at the two adjacent moments, and obtains displacement information of the first component based on the first displacement image and the second displacement image of the first calibration feature; The second vision system acquires images of a second calibration feature on the suction mechanism at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the second calibration feature at the two adjacent moments, and obtains displacement information of the suction mechanism based on the first displacement image and the second displacement image of the second calibration feature; The third vision system acquires images of a third calibration feature on the second element at two adjacent moments, obtains a first displacement image and a second displacement image corresponding to the third calibration feature at the two adjacent moments, and obtains displacement information of the second element based on the first displacement image and the second displacement image of the third calibration feature, wherein the second element is carried by a carrying platform.

3. The chip mounting method capable of real-time deviation correction according to claim 2, characterized in that: The first visual system acquires images of a first calibration feature on the first component at two adjacent moments, and obtains a first displacement image and a second displacement image corresponding to the first calibration feature at the two adjacent moments, respectively, including: The lens assembly, the first beam splitting assembly, the first light source, and the first lens in the first visual system cooperate with each other to obtain the first displacement image and the second displacement image of the first calibration feature on the first element at two adjacent moments, wherein the lens assembly is an infinitely conjugated magnifying lens, and the object plane of the lens assembly is focused on the first calibration feature of the first element.

4. The chip mounting method capable of real-time deviation correction according to claim 2, characterized in that: There are multiple second marking features on the suction mechanism, and the multiple second marking features are arranged in an array on the outer wall of the suction member.

5. The chip mounting method capable of real-time deviation correction according to claim 4, characterized in that: The second calibration feature includes a reflective member and a semi-transparent member, and the semi-transparent member is obliquely arranged above the reflective member; the second visual system is used to obtain the first displacement image and the second displacement image of the second calibration feature on the suction mechanism based on the reflection of the semi-transparent member on the reflective member.

6. The chip mounting method capable of real-time deviation correction according to claim 2, characterized in that: The obtaining of the displacement information of the suction mechanism according to the first displacement image and the second displacement image of the second calibration feature includes: Displacement information of the suction mechanism in the X-axis direction, the Y-axis direction, and the Z-axis direction is obtained according to the first displacement image and the second displacement image of the second calibration feature.

7. The chip mounting method capable of real-time deviation correction according to claim 1, characterized in that: The motion mechanism adjusts the position of the suction mechanism according to the relative displacement to compensate the position of the first component in real time so that the first component is mounted on the second component, including: The motion mechanism is connected to the suction mechanism, and the motion mechanism includes an X-axis motion structure, a Y-axis motion structure, a Z-axis motion structure, and an R-axis motion structure. The X-axis motion structure, the Y-axis motion structure, the Z-axis motion structure, and the R-axis motion structure drive the suction mechanism to move in the X-axis direction, the Y-axis direction, the Z-axis direction, and the R-axis direction according to the relative displacement, so as to compensate the position of the first component in real time. After the position compensation, the first component is mounted on the second component.

8. A chip placement system capable of real-time deviation correction, characterized in that: A chip mounting method capable of real-time correction for executing any one of claims 1 to 7, comprising: a first vision system, a second vision system, a third vision system, a suction mechanism, a motion mechanism, and a carrier; The suction mechanism is used to suck the first component; The carrying platform is used to carry the second component; The first visual system, the second visual system and the third visual system are located above the suction mechanism and the carrying platform, and are used to respectively obtain the displacement information of the first component, the displacement information of the suction mechanism and the displacement information of the second component in real time; The motion mechanism is connected to the suction mechanism and is used to drive the suction mechanism to move its position; the motion mechanism also compensates the position of the first element in real time according to the relative displacement of the first element based on the second element.

9. The chip placement system capable of real-time deviation correction according to claim 8, characterized in that: The first visual system includes a lens group, a first beam splitter group, a first light source and a first lens; the lens group, the first beam splitter group, the first light source and the first lens cooperate with each other to obtain a displacement image of the first calibration feature on the first element in real time, wherein the lens group is an infinitely conjugated magnifying lens, and the object plane is focused on the first calibration feature of the first element.

Images