Cabinet type wafer storage device and storage control method

Abstract

The invention relates to the technical field of semiconductors, in particular to a cabinet type wafer storage device and a storage control method, and the cabinet type wafer storage device is composed of a cabinet body, a movable frame, a wafer box conveyor area, a wafer box storage area, a wafer conveying and positioning device and an electrical control module. According to the invention, automatic circulation, conveying and storage of the wafer box and the wafers in the wafer box can be realized, extra equipment or a manual intervention mode is not needed, the operation complexity and potential pollution risk are effectively reduced, the purpose of efficient and automatic material storage and conveying is realized, and the working efficiency is improved. Therefore, the production efficiency and safety are effectively improved, wafer boxes of various sizes and wafers in the wafer boxes can be stored so as to meet various production requirements at the same time, in addition, integrated control and traceability management of the wafer boxes of various sizes and the wafers in the wafer boxes can be achieved, the product quality and the traceability of the manufacturing process are improved, and the production cost is reduced. And automatic material management is realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a cabinet-type wafer storage device and a storage control method. Background Art

[0002] As semiconductor manufacturing technology continues to advance, the requirements for wafer transfer equipment are also increasing. As the key substrate that supports semiconductor circuits, wafers need to be positioned and transferred efficiently and accurately throughout the manufacturing process.

[0003] In existing semiconductor production lines, wafers are usually loaded into wafer boxes for transportation and storage. Existing wafer storage systems are usually used to transport wafer boxes rather than directly transport wafers, which results in the step of transporting wafers to the furnace body wafer boat for heat treatment. It is necessary to use additional equipment or manual intervention to remove the wafers from the wafer box and place them in the furnace body wafer boat, thereby increasing the complexity of the operation and the potential risk of contamination. At the same time, existing wafer storage systems usually rely on robotic technology and automatic control systems, and achieve high-precision wafer transportation by integrating multiple components such as linear drives, servo motors, precision sensors and manipulators. However, existing wafer storage systems can usually only handle a single type of wafer or wafer box and cannot meet multiple production needs at the same time. To this end, the present invention proposes a cabinet-type wafer storage device and a storage control method. Summary of the Invention

[0004] Based on this, it is necessary to provide a cabinet-type wafer storage device and a storage control method to address the above technical issues, so as to solve the problems raised in the above background technology.

[0005] According to a first aspect of the present invention, a cabinet-type wafer storage device is provided, comprising: a cabinet body, a window opened at the back of the cabinet body and used to transfer wafers to a furnace body wafer boat, a wafer box conveyor area arranged inside the cabinet body and used to receive and buffer wafer boxes of various sizes, a wafer box storage area arranged inside the cabinet body and used to store wafer boxes of various sizes, a wafer conveying and positioning device fixedly installed inside the cabinet body and having a wafer probing and positioning function, a second wafer probing detection device fixedly connected to the inside of the cabinet body and used to cooperate with the wafer conveying and positioning device to perform wafer probing detection, and an electrical control module fixedly installed inside the cabinet body, the wafer box conveyor area, the wafer box storage area, the wafer conveying and positioning device and the second wafer probing detection device are electrically connected to the electrical control module respectively, for realizing integrated control and traceability management of wafer boxes of various sizes and the wafers in the wafer boxes during the conveying and storage process, when the car conveys a wafer box of a certain size to After the wafer box conveyor area, the wafer box of corresponding size is received and cached by the wafer box conveyor area, and the cache position information of the wafer box and the wafer box size information are collected and sent to the electrical control module. After receiving the cache position information and the wafer box size information of the wafer box, the electrical control module controls the wafer transfer positioning device at the origin position to clamp the two wafer boxes in the wafer box conveyor area, and executes the detection and positioning instructions during the vertical upward movement of the wafer transfer positioning device to perform wafer probe detection and wafer positioning processing on the wafers in one of the wafer boxes, and when the wafer transfer positioning device moves to the second wafer probe detection device, the second wafer probe detection device is used to perform coordinated wafer probe detection on the wafers in the other wafer box, and after the wafer probe detection and wafer positioning processing are completed, the wafer box is transferred to the wafer box storage area or the wafers in the wafer box are transferred to the furnace body wafer boat through the wafer transfer positioning device.

[0006] Optionally, an inspection door is connected to the front of the cabinet via a hinge, and the inspection door is provided with an input port for transferring the wafer box on the overhead crane to the wafer box conveyor area, and the input port is provided with an external electric gate for isolating the wafer box conveyor area from the external working environment of the cabinet, and the rear end of the wafer box conveyor area is provided with an internal electric gate for isolating the wafer box conveyor area from the internal working environment of the cabinet.

[0007] Optionally, a movable frame is provided inside the cabinet, and the movable frames of the wafer box conveyor area and the wafer box storage area are fixedly connected to the movable frame. The upper and lower ends of the inner side walls of the cabinet are provided with push-pull cable protection modules. The push-pull cable protection module is used to store and protect the cables as the movable frame is pulled out during maintenance work, and to facilitate pulling out and pushing the movable frame.

[0008] Optionally, the wafer box conveyor area includes a main body, a split body rotatably connected to both sides of the main body, and a first driving device for controlling the horizontal rotation of the split body. One end of the first driving device is rotatably connected to the split body, and the other end is rotatably connected to the main body. Driven by the first driving device, the split body is driven to rotate to facilitate the control of the orientation of the wafer box. The main body and the split body are both provided with a first size identification unit for detecting and identifying the size information of the wafer box.

[0009] Optionally, the position of the wafer box storage area corresponds to the position of the window, which is used to improve the convenience of transferring wafers to the furnace body wafer boat. The wafer box storage area includes multiple layers of wafer box storage tables, and each layer of the wafer box storage table is provided with multiple wafer box storage stations, and each of the wafer box storage stations is provided with a second size identification unit for detecting and identifying wafer box size information.

[0010] Optionally, the wafer conveying and positioning device includes an assembly part, a second driving device, an integration part, a multifunctional wafer conveying robot, a first wafer probing and detecting device and a wafer positioning device. The assembly part is fixedly mounted on the inner wall of the cabinet and arranged between the wafer box conveyor area and the window for circulation between the wafer box conveyor area and the window. The second driving device is fixedly mounted on the lower end of the assembly part, and the output end of the second driving device is connected to the integration part. The integration part is slidably connected to the assembly part. Under the drive of the second driving device, the multifunctional wafer conveying robot, the first wafer probing and detecting device and the wafer positioning device are driven by the integration part to perform vertical lifting and moving together. The multifunctional wafer conveying robot, the first wafer probing and detecting device and the wafer positioning device are all fixedly mounted on the integration part. During the vertical upward movement of the device and the wafer positioning device, the multifunctional wafer transfer robot is used to simultaneously transfer two wafer boxes and the wafers in the wafer boxes, and after transferring one of the wafer boxes to the first wafer protrusion detection device to complete the wafer protrusion detection, the wafers in the wafer box are quickly transferred to the wafer positioning device for wafer positioning adjustment, and after the first wafer protrusion detection device completes the wafer protrusion detection, the multifunctional wafer transfer robot is used to correct and adjust the wafers with edge protrusion problems. The multifunctional wafer transfer robot is also provided with a position and quantity detection element, which is used to detect the position and quantity of the wafers in the wafer box when the multifunctional wafer transfer robot transfers the wafer box to the first wafer protrusion detection device. The first wafer protrusion detection device is also provided with a third size recognition unit for detecting and identifying the size information of the wafer box.

[0011] Optionally, the second wafer protrusion detection device is arranged at the rear end of the wafer box storage area, and the second wafer protrusion detection device is provided with a fourth size recognition unit for detecting and identifying the size information of the wafer box. After the multifunctional wafer transfer robot transfers a wafer box on the wafer box conveyor area to the first wafer protrusion detection device for wafer protrusion detection, the multifunctional wafer transfer robot again clamps another wafer box on the wafer box conveyor area, and under the drive of the second drive device, transfers the other wafer box to the second wafer protrusion detection device through the multifunctional wafer transfer robot for coordinated wafer protrusion detection, so as to improve the efficiency of wafer protrusion detection in a limited space.

[0012] Optionally, the first size identification unit, the second size identification unit, the third size identification unit and the fourth size identification unit all include a limit block, a common pressure sensing identification element arranged on the side of the limit block and a plurality of pressure sensing identification elements. The common pressure sensing identification element is used to perform common pressure sensing detection on wafer boxes of all sizes. Each of the pressure sensing identification elements is used to identify the size information of a wafer box of a certain size under the coordinated action of the common pressure sensing identification component, and send the identified wafer box size information to the electrical control module to realize traceability management of wafer boxes of different sizes and the wafers in the wafer boxes.

[0013] Optionally, a filter is provided on the top of the cabinet.

[0014] According to the second aspect of the present invention, a storage control method for a cabinet-type wafer storage device is provided, comprising the following steps: Step 1: first, the cabinet-type wafer storage device is firmly installed at the front end of the input port of the furnace body wafer boat, and the cabinet-type wafer storage device is powered on; Step 2: Open the external electric gate, transport the wafer box to the wafer box conveyor area by the overhead crane, use the main body or the split part of the wafer box conveyor area to receive and cache the wafer box, and collect and send the cache position information of the wafer box and the wafer box size information to the electrical control module through the first size recognition unit, at which time the internal electric gate is in a closed state; Step 3: Close the gate until the wafer box conveyor area has completed receiving and caching the wafer box. The external electric gate opens the internal electric gate. After the electrical control module receives the cache position information of the wafer box and the wafer box size information, it controls the multifunctional wafer transfer robot at the origin position to clamp the two wafer boxes in the wafer box conveyor area. In the process of clamping each wafer box, the position and quantity detection elements are used to detect the position and quantity of the wafers in the wafer box, and the position and quantity detection information are sent to the electrical control module. Subsequently, the two wafer boxes are respectively transferred to the first wafer probing detection device and the second wafer probing detection device for wafer probing detection; Step 4: When the multifunctional wafer transfer robot transfers a wafer box on the wafer box conveyor area to the first wafer probing detection device for After the wafer probing detection, the multifunctional wafer transfer robot again grips another wafer box on the wafer box conveyor area, and drives the integrated part, the multifunctional wafer transfer robot, the first wafer probing detection device and the wafer positioning device to move vertically upward through the second driving device, and transfers the other wafer box to the second wafer probing detection device for coordinated wafer probing detection, thereby improving the efficiency of wafer probing detection in a limited space. When the wafers in the wafer box are subjected to wafer probing detection by the first wafer probing detection device or the second wafer probing detection device, if the wafers in the wafer box have edge probing problems, the multifunctional wafer transfer robot is used to perform wafer probing on the wafers with edge probing problems. Corrective adjustment: if there is no edge protrusion problem with the wafers in the wafer box, proceed to step five; step five: transfer the wafers in the wafer box on the first wafer protrusion detection device or the second wafer protrusion detection device to the wafer positioning device through the multifunctional wafer transfer robot; step six: adjust the positioning of the wafers through the wafer positioning device, and then put the positioned adjusted wafers back into the corresponding wafer box through the multifunctional wafer transfer robot; step seven: repeat steps five and six until all wafers have been positioned and adjusted and put back into the corresponding wafer boxes, and then transfer the wafer box to the wafer box storage area or transfer the wafers in the wafer box to the furnace body wafer boat through the multifunctional wafer transfer robot.

[0015] The advantages and beneficial effects of the present invention are as follows: the present invention provides a cabinet-type wafer storage device and storage control method, the cabinet-type wafer storage device integrates a wafer box conveyor area, a wafer box storage area, a wafer conveying positioning device, a second wafer probing detection device and an electrical control module, and has a high degree of integration. It can not only realize the automatic circulation, transmission and storage of the wafer box and the wafers inside it, but also automatically realize the warehousing and outbound operations of the wafer box and the wafers inside it without the need for additional equipment or manual intervention, effectively reducing the complexity of the operation and the potential risk of contamination, so as to realize efficient and automated material The purpose of storage and transmission is to effectively improve production efficiency and safety. It can also store wafer boxes of various sizes and the wafers inside them to meet multiple production needs at the same time, and then meet the needs of production expansion. In addition, it can also realize the integrated control and traceability management of wafer boxes of various sizes and the wafers in the wafer boxes, improve product quality and the traceability of the manufacturing process, and realize automated material management; through the collaborative processing process of the first wafer probe detection device and the second wafer probe detection device, the two wafer boxes can be respectively subjected to wafer probe detection, so as to improve the efficiency of wafer probe detection in a limited space. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the cabinet-type wafer storage device of the present invention.

[0017] Figure 2 FIG. 2 is a schematic structural diagram of the cabinet-type wafer storage device of the present invention from another angle.

[0018] Figure 3 It is a schematic structural diagram of the interior of the cabinet of the present invention.

[0019] Figure 4 It is a structural schematic diagram of the movable frame of the present invention.

[0020] Figure 5 It is a partial enlarged view of the wafer box conveyor area of the present invention.

[0021] Figure 6 It is a structural schematic diagram of the push-pull cable protection module of the present invention.

[0022] Figure 7 It is a schematic diagram of the installation positions of the external electric gate and the internal electric gate of the present invention.

[0023] Figure 8 It is a structural schematic diagram of the wafer transfer positioning device of the present invention.

[0024] Figure 9 It is a partially enlarged view of the wafer transfer positioning device of the present invention.

[0025] Figure 10Schematic diagram of the installation position of the slider of the present invention.

[0026] Figure 11 It is a structural schematic diagram of the cable protection structure of the present invention.

[0027] Figure 12 It is a structural schematic diagram of the multifunctional wafer transfer robot of the present invention.

[0028] Figure 13 It is a schematic structural diagram of the interior of the shell of the present invention.

[0029] Figure 14 This is a schematic diagram of the installation position of the position and quantity identification components of the present invention.

[0030] Figure numerals: cabinet 1, input port 2, signal light 3, embedded door handle 4, display 5, emergency stop button 6, filter 7, inspection door 8, window 9, wafer box storage area 10, wafer transfer positioning device 11, second wafer probe detection device 12, wafer box storage table 13, wafer box conveyor area 14, electrical control module 15, movable frame 16, wafer box storage station 17, main body 18, split part 19, limit block 20, first drive device 21, common pressure sensing identification element 22, first pressure sensing identification element 23, second pressure sensing identification element 24, first linear guide 25, second linear guide 26, anti-collision block 27, connecting block 28, connecting plate 29, first drag chain 30, first drag chain plate 31, external electric gate 32, internal electric gate 33, machine body 34, wafer probe detection platform 35, wafer locator 36, first protrusion detection element 37, bracket 38, limit block base plate 39, second protrusion detection element 40, slide back plate 41, second drag chain 42, vertical slide 43, mounting frame 44, robotic arm 45, multifunctional wafer transfer robot 46, locator placement platform 47, slider 48, slide cover 49, vertical assembly gap 50, second drag chain plate 51, ceramic chuck 52, base 53, shell 54, wafer clamp shell 55, frame 56, second clamping block 57, first clamping block 58, second support block 59, first support block 60, baffle 61, solenoid valve seat 62, solenoid valve 63, air guide tube 64, speed control valve 65, third drive device 66, moving block 67, vertical slide 68, horizontal slide 69, active transmission rod 70, passive transmission rod 71, position and quantity identification element 72, wafer positioning platform 73, pillar 74. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. In addition, the following embodiments and features in the embodiments may be combined with each other unless there is a conflict. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0033] Reference Attachment Figure 1-13 A cabinet-type wafer storage device includes: a cabinet 1, a movable frame 16, a wafer box conveyor area 14, a wafer box storage area 10, a wafer conveying positioning device 11, a second wafer protrusion detection device 12 and an electrical control module 15.

[0034] In this embodiment, refer to the attached Figure 2 A window 9 for transferring wafers to the furnace body crystal boat is provided on the back of the cabinet 1. The position of the window 9 corresponds to the position of the wafer box storage area 10, so that the wafers in the wafer box can be transferred to the furnace body crystal boat for heat treatment, thereby reducing the complexity of the operation and the potential risk of contamination.

[0035] In this embodiment, refer to the attached Figure 4 The movable frame 16 is arranged inside the cabinet 1, and is connected to the inner wall of the cabinet 1 through a push-pull cable protection module. The lower end of the movable frame 16 is fixedly installed with a wafer box conveyor area 14 for receiving and caching wafer boxes of various sizes, and the upper end of the movable frame 16 is fixedly installed with a wafer box storage area 10 for storing wafer boxes of various sizes.

[0036] In this embodiment, refer to the attached Figure 6, during the maintenance work, in order to protect the cables that are pushed and pulled as the mobile frame 16 moves and to realize the push-pull movement of the mobile frame 16, the present application designs a push-pull cable protection module, wherein the push-pull cable protection module includes a first linear guide 25, a second linear guide 26, an anti-collision block 27, a connecting block 28, a connecting plate 29, a first drag chain 30 and a first drag chain plate 31. During assembly, the first linear guide 25 and the second linear guide 26 are fixed to the inner wall of the cabinet 1 from top to bottom in sequence, and the length extension direction of the first linear guide 25 and the second linear guide 26 is the same as the push-pull movement direction of the mobile frame 16. The first linear guide 25 and the second linear guide 26 are fixed to the anti-collision block 27 at one end close to the inspection door 8, which is used to prevent the first linear guide 25 and the second linear guide 26 from falling off due to external collision. 25 and the second linear guide rail 26 are both slidably connected with a connecting block 28, and the two connecting blocks 28 are fixedly connected to the connecting plate 29, which is used to realize the reciprocating movement of the connecting plate 29 on the first linear guide rail 25 and the second linear guide rail 26 through the connecting block 28. The connecting plate 29 is fixedly connected to the movable frame 16, which is used to realize the push-pull movement of the movable frame 16. One end of the first drag chain 30 is fixedly connected to the first drag chain plate 31, and the other end is fixedly connected to the connecting plate 29. The first drag chain plate 31 is fixedly connected to the movable frame 16, and the cables of the electrical components that need to be protected (mainly the cables of the electrical components on the wafer box conveyor area 14 and the wafer box storage area 10 installed on the movable frame 16) are centrally installed in the first drag chain 30, so as to arrange the wiring neatly and protect the cables, thereby protecting the cables from wear, pulling and damage caused by the push-pull movement of the movable frame 16.

[0037] In this embodiment, in order to facilitate maintenance, the present application also has an inspection door 8 connected to the front of the cabinet 1 by a hinge. In order to increase the sealing between the inspection door 8 and the cabinet 1, a seal is also provided between the inspection door 8 and the cabinet 1. The seal can be made of a rubber sealing gasket, and the seal is arranged at the connection between the inspection door 8 and the cabinet 1, thereby ensuring the cleanliness of the internal environment of the cabinet 1, so as to ensure the safety of the wafers when they are transported or stored inside the cabinet 1.

[0038] In this embodiment, refer to the attached Figure 1 In order to meet production needs and facilitate operation, the inspection door 8 of the present application is also provided with an embedded door handle 4 for convenient opening and closing of the inspection door 8, an emergency stop button 6 for emergency shutdown, a display 5 for displaying the content of interactive operations with an external computer, a signal light 3 for displaying the operating status of the cabinet-type wafer storage device, and an interface for connecting to external devices (such as USB3.0, CAT6, etc.).

[0039] In this embodiment, refer to the attached Figure 1 and attached Figure 7The inspection door 8 is provided with an input port 2 for transferring the wafer box on the overhead crane to the wafer box conveyor area 14, and an external electric gate 32 is provided at the input port 2 for isolating the wafer box conveyor area 14 from the external working environment of the cabinet 1, and an internal electric gate 33 is provided at the rear end of the wafer box conveyor area 14 for isolating the wafer box conveyor area 14 from the internal working environment of the cabinet 1; the external electric gate 32 and the internal electric gate 33 are respectively provided at the front and rear ends of the wafer box conveyor area 14. When working, the external electric gate 32 is first opened to allow the overhead crane to transport the wafer box to the wafer box conveyor area 14, and then the internal electric gate 33 is closed to realize the loading process of the wafer box. Subsequently, the external electric gate 32 is closed and the internal electric gate 33 is opened, so that the wafer box can be circulated, transported and stored in the closed cabinet 1, which not only ensures the cleanliness of the internal environment of the cabinet 1, but also ensures the safety of the wafers.

[0040] In this embodiment, refer to the attached Figure 5 The wafer box conveyor area 14 includes a main body 18, a split part 19 rotatably connected to both sides of the main body 18, and a first driving device 21 for controlling the horizontal rotation of the split part 19. One end of the first driving device 21 is rotatably connected to the split part 19, and the other end is rotatably connected to the main body 18. Driven by the first driving device 21, the split part 19 is driven to rotate to facilitate the control of the orientation of the wafer box. A first size recognition unit for detecting and identifying the size information of the wafer box is provided on both the main body 18 and the split part 19.

[0041] In this embodiment, refer to the attached Figure 5 The wafer cassette conveyor area 14 of the present application can be used to buffer three wafer cassettes, namely, one wafer cassette each on the main body 18 and the two sub-sections 19. Furthermore, to facilitate the multifunctional wafer conveying robot 46 to grasp the wafer cassettes, the first drive device 21 is used to rotate the sub-sections 19, thereby conveniently controlling the orientation of the wafer cassettes and thus facilitating the grasping of the wafer cassettes. The first drive device 21 can use a slow-speed cylinder to achieve rotational control of the sub-sections 19.

[0042] In this embodiment, refer to the attached Figure 5In order to detect and identify the size information of the wafer box, a first size identification unit is provided on both the main body 18 and the split body 19, wherein the first size identification unit includes a limit block 20, a common pressure sensing identification element 22 arranged on the side of the limit block 20, and multiple pressure sensing identification elements. The common pressure sensing identification element 22 is used to perform common pressure sensing detection on wafer boxes of all sizes. Each pressure sensing identification element is used to identify the size information of a wafer box of a certain size under the coordinated action of the common pressure sensing identification component, and send the identified wafer box size information to the electrical control module 15 to realize traceability management of wafer boxes of different sizes and the wafers in the wafer boxes.

[0043] In this embodiment, refer to the attached Figure 5 , taking 6-inch and 8-inch wafer boxes as examples, there is one common pressure sensing identification element 22 and two pressure sensing identification elements (both are pressure sensors). The two pressure sensing identification elements can be distinguished by a first pressure sensing identification element 23 and a second pressure sensing identification element 24. When a 6-inch wafer box is placed on the main body 18 or the split part 19, the common pressure sensing identification element 22 and the first pressure sensing identification element 23 sense and detect pressure together, and it can be determined that the size information of the wafer box is 6 inches. When an 8-inch wafer box is placed on the main body 18 or the split part 19, the common pressure sensing identification element 22 and the second pressure sensing identification element 24 sense and detect pressure together, and it can be determined that the size information of the wafer box is 8 inches, so as to collect and feed back the wafer box size information to the electrical control module 15, thereby realizing traceability management of the corresponding wafer box and the wafers therein.

[0044] In this embodiment, the wafer box storage area 10 includes multiple layers of wafer box storage platforms 13, each layer of wafer box storage platforms 13 is provided with multiple wafer box storage stations 17, and each wafer box storage station 17 is provided with a second size recognition unit for detecting and identifying wafer box size information.

[0045] In this embodiment, refer to the attached Figure 4 The present application designs a three-tiered wafer cassette storage platform 13, each tier of which includes three wafer cassette storage stations 17. This means that the three-tiered wafer cassette storage platform 13 can store nine wafer cassettes. Furthermore, the second size recognition unit involved in the present application has the same structure and operating principle as the first size recognition unit, and will not be further described here.

[0046] In this embodiment, refer to the attached Figure 8-9The wafer conveying and positioning device 11 includes an assembly part, a second driving device, an integration part, a multifunctional wafer conveying robot 46, a first wafer probing detection device and a wafer positioning device. The assembly part is fixedly installed on the inner wall of the cabinet 1 and is arranged between the wafer box conveyor area 14 and the window 9 for circulation between the wafer box conveyor area 14 and the window 9. The second driving device is fixedly installed at the lower end of the assembly part, and the output end of the second driving device is connected to the integration part. The integration part is slidably connected to the assembly part. Under the drive of the second driving device, the multifunctional wafer conveying robot 46, the first wafer probing detection device and the wafer positioning device are driven by the integration part to perform vertical lifting and lowering movements together. The multifunctional wafer conveying robot 46, the first wafer probing detection device and the wafer positioning device are all fixedly installed on the integration part, and the first wafer probing detection device and the wafer positioning device are symmetrically arranged on both sides of the multifunctional wafer conveying robot 46. During the vertical upward movement of the wafer transfer robot 46, the first wafer protrusion detection device and the wafer positioning device, the multifunctional wafer transfer robot 46 is used to simultaneously transfer two wafer boxes and the wafers in the wafer boxes, and after transferring one of the wafer boxes to the first wafer protrusion detection device to complete the wafer protrusion detection, the wafers in the wafer box are quickly transferred to the wafer positioning device for wafer positioning adjustment, and after the first wafer protrusion detection device completes the wafer protrusion detection, the multifunctional wafer transfer robot 46 is used to correct and adjust the wafers with edge protrusion problems. The multifunctional wafer transfer robot 46 is also provided with a position and quantity detection element for detecting the position and quantity of the wafers in the wafer box when the multifunctional wafer transfer robot 46 transfers the wafer box to the first wafer protrusion detection device. The first wafer protrusion detection device is also provided with a third size recognition unit for detecting and identifying the size information of the wafer box.

[0047] In this embodiment, refer to the attached Figure 8 and attached Figure 10 The assembly part includes a slide back plate 41, a vertical slide 43 and a slide upper cover 49. The slide back plate 41 is fixed to the inner wall of the cabinet 1, the vertical slide 43 is fixed to the front end of the slide back plate 41, and the slide upper cover 49 is fixed to the front end of the vertical slide 43. A vertical assembly gap 50 is formed between the vertical slide 43 and the slide upper cover 49. The integration part is slidably connected to the vertical assembly gap 50, and the second driving device can be used to drive the integration part to perform vertical lifting and lowering movements along the length extension direction of the vertical assembly gap 50.

[0048] In this embodiment, refer to the attached Figure 8 and attached Figure 10The integrated portion includes a slider 48 and a mounting frame 44. The slider 48 is slidably connected to the vertical assembly gap 50. The mounting frame 44 is fixed to the slider 48. The multifunctional wafer transfer robot 46, the first wafer probe detection device, and the wafer positioning device are fixed to the mounting frame 44. The first wafer probe detection device and the wafer positioning device are arranged on both sides of the multifunctional wafer transfer robot 46. Under the driving action of the second drive device, the mounting frame 44 and the multifunctional wafer transfer robot 46, the first wafer probe detection device, and the wafer positioning device thereon are driven by the slider 48 to perform vertical lifting and movement. In addition, the second drive device involved in this application can use a cylinder or a motor to realize the vertical lifting and movement control of the multifunctional wafer transfer robot 46, the first wafer probe detection device, and the wafer positioning device.

[0049] In this embodiment, refer to the attached Figure 11 In order to protect the cables that are vertically lifted and lowered by the multifunctional wafer transfer robot 46, the first wafer probe detection device and the wafer positioning device, the present application designs a cable protection structure, wherein the cable protection structure includes a second drag chain plate 51 and a second drag chain 42, the second drag chain plate 51 is fixed to the slider 48, one end of the second drag chain 42 is fixed to the drag chain plate, and the other end is fixed to the vertical slide 43, and the cables of the electrical components that need to be protected (mainly the cables of the multifunctional wafer transfer robot 46, the first wafer probe detection device and the wafer positioning device) are centrally installed in the second drag chain 42. On the one hand, the wiring is more neat, and on the other hand, the cables can be well protected to protect the cables from wear and pulling.

[0050] In this embodiment, refer to the attached Figure 8 The multifunctional wafer transfer robot 46 includes a body 34 with its own vertical transmission, a robot arm 45, a base 53, a wafer clamp and a wafer box clamp.

[0051] For further information, see the attached Figure 8 The body 34 is a commercially available product, and its models include but are not limited to the UTX-FS6000ASYST wafer semiconductor robot body, etc. It can be flexibly selected according to actual production needs. As long as it can realize its own lifting and moving, it is no longer limited here.

[0052] For further information, see the attached Figure 8 The robot arm 45 includes two sub-robot arms controlled by three joint axes for rotating on a horizontal plane to realize horizontal transportation of wafers.

[0053] Furthermore, the base 53 is fixedly mounted on the joint shaft at the uppermost end of the robot arm 45 , and the wafer clamp and wafer box clamp are respectively arranged on both sides of the base 53 for synchronously transporting the wafer box and wafers, and effectively reducing space occupancy.

[0054] For further information, see the attached Figure 12 The wafer clamp includes a wafer clamp control unit arranged inside the base 53 and a wafer clamp part arranged on the side of the base 53. The wafer clamp control unit includes an electromagnetic valve seat 62 fixed to the inside of the base 53, an electromagnetic valve 63 fixed to the electromagnetic valve seat 62, an air guide tube 64 and a speed regulating valve 65 arranged on the air guide tube 64. The electromagnetic valve 63 is connected to the wafer clamp part through the air guide tube 64 to control the wafer clamp part to clamp or release the wafer. At the same time, under the action of the speed regulating valve 65, the flow rate of the air flow is regulated. It is able to control the adsorption force of the wafer clamping part on the wafer to avoid the wafer from falling off or being damaged due to too little or too much adsorption force; the wafer clamping part includes a wafer clamping part shell 55 and a ceramic chuck 52 arranged on the wafer clamping part shell 55, and the wafer clamping part shell 55 and the ceramic chuck 52 are both provided with interconnected air passages, the air passage inside the wafer clamping part shell 55 is connected to the air duct 64, and the surface of the ceramic chuck 52 is provided with a plurality of adsorption ports connected to the internal air passages thereof, so as to realize adsorption-type clamping or release of the wafer.

[0055] For further information, see the attached Figure 12-14The wafer box clamp includes a wafer box clamp control part on the side of the base 53 and a wafer box clamp part slidably connected to the wafer box clamp control part. The wafer box clamp control part includes a shell 54, a third drive device 66 fixed to the inside of the shell 54 (the third drive device 66 can use a cylinder or a motor to realize the vertical lifting and moving control of the moving block 67), a moving block 67 arranged at the output shaft end of the third drive device 66, a vertical slide 68 fixed to the inside of the shell 54 and slidably connected to the moving block 67, a horizontal slide 69 fixed to the inside of the shell 54 and slidably connected to the wafer box clamp part, and a movable block 67 rotatably connected to the movable block 67. The conveying device is used to drive the wafer box clamping claw part to move horizontally back and forth, wherein the shell 54 is a rectangular structure, the third driving device 66, the moving block 67 and the vertical slide 68 are all arranged at the vertical center line of the shell 54, and the conveying device includes a pair of conveying elements, which are arranged on both sides of the third driving device 66 respectively. Each conveying element includes an active transmission rod 70 and a passive transmission rod 71. One end of the active transmission rod 70 is rotatably connected to the moving block 67, and the other end is rotatably connected to the middle of the passive transmission rod 71. The two ends of the passive transmission rod 71 are respectively connected to the wafer box clamping claw part, and the wafer box is rotated with the third driving device. The device 66 drives the moving block 67 to move vertically upward, which can drive the active transmission rod 70 to rotate inward, and then drive the passive transmission rod 71 and the wafer box clamping claw part to move inward along the horizontal slide 69, thereby realizing the wafer box clamping process. Similarly, as the third driving device 66 drives the moving block 67 to move vertically downward, it can drive the active transmission rod 70 to rotate outward, and then drive the passive transmission rod 71 and the wafer box clamping claw part to move outward along the horizontal slide 69, thereby realizing the wafer box release process; the wafer box clamping claw part includes a frame 56, a first clamping block 58, a second clamping block 57 ... The first support block 60, the second support block 59, the baffle 61 and the position and quantity identification element 72. The frame 56 has a "concave" structure, and the two "convex" ends of the "concave" structure respectively penetrate the shell 54 and are slidably connected to the shell 54. At the same time, the two "convex" ends are fixedly connected to the two ends of the passive transmission rod 71. Compared with the frame 56 with a rectangular structure or the frame 56 with one end (similar to a convex structure), the frame 56 with this "concave" structure can not only improve the stability of the overall structure of the wafer box clamping part during reciprocating translation motion, but also reduce weight and save material costs.At the same time, the "protruding" end of the frame 56 is slidably connected to the horizontal slide 69. In order to further improve the stability of the movement of the frame 56, the number of horizontal slides 69 can be set to 2, that is, the two ends of the frame 56 are respectively slidably matched with the horizontal slide 69. With the transmission action of the transmission device and the guiding action of the horizontal slide 69, the frame 56 performs reciprocating translational motion along the length extension direction of the horizontal slide 69. The first clamping block 58 and the second clamping block 57 are fixed to the frame 56 from the inside to the outside in sequence. The first support block 60 and the second support block 59 are both fixed to the frame 56, and the first support block 60 and the second support block 59 are respectively arranged at the lower ends of the first clamping block 58 and the second clamping block 57. When the driving device drives the frame 56 to perform reciprocating translational motion, the first clamping block 58 and the second clamping block 57 respectively clamp the wafers of corresponding sizes, and under the action of the first support block 60 and the second support block 59, they can prevent the corresponding wafers from being clamped. To improve transport safety, a baffle 61 is provided on the side of the frame 56 facing the wafer cassette to protect the wafers within the cassette. A position and quantity identification element 72 is fixed to the baffle 61 and is used to detect the position and quantity of the wafers within the cassette. The position and quantity identification element 72 can be an FU18M fiber optic sensor. Twenty-five FU18M fiber optic sensors can be installed in a stepped pattern on both sides of the vertical centerline of the baffle 61. It should be noted that the number of FU18M fiber optic sensors installed corresponds to the maximum wafer carrying capacity of the cassette. That is, the maximum wafer carrying capacity of cassettes of different sizes is 25 wafers, and the spacing between adjacent wafers within the cassette is the same. Therefore, after 25 FU18M fiber optic sensors are installed at corresponding positions on the wafers within the cassette, the position and quantity of wafers within cassettes of different sizes can be detected, with a wide detection range.

[0056] In this embodiment, refer to the attached Figure 8-9 The first wafer probe detection device includes a wafer probe detection platform 35, a pillar 74, a bracket 38, a limit block base plate 39, a first probe detection element 37 and a second probe detection element 40. The wafer probe detection platform 35 is fixed to the mounting frame 44, the pillar 74 is fixed to the wafer probe detection platform 35, the limit block base plate 39 is fixed to the top of the pillar 74, one end of the bracket 38 is fixed to the side of the pillar 74, and the other end is fixed to the first probe detection element 37. The second probe detection element 40 is fixed to the wafer probe detection platform 35 and is arranged at the lower end of the first probe detection element 37. During the wafer probe detection process, the first probe detection element 37 and the second probe detection element 40 are used to perform wafer probe detection on the wafer.

[0057] Furthermore, the first and second protrusion detection elements 37 and 40 can employ EX-13A photoelectric sensors. These sensors feature an NPN output, open collector and bright light output modes, and use a red LED as a light source. They have an IP67 protection rating, effectively preventing the intrusion of dust and water. Their operating principle is based on the photoelectric effect. Specifically, the EX-13A photoelectric sensor consists of a transmitter, a receiver, and a detection circuit. The transmitter emits a light beam, while the receiver receives the reflected or transmitted light signal. The detection circuit then converts changes in light intensity into an electrical signal. During the wafer probe inspection process, the multifunctional wafer transfer robot 46 will take out the wafer from the wafer box and transfer it to the wafer positioning device. During this process, the edge of the taken out wafer will enter the detection range formed by the EX-13A photoelectric sensor, realizing the probe detection of the wafer edge. It can also detect defects or features on the wafer. Defects can be detected by comparing the image of the chip to be inspected with the image of the adjacent chip. If there are no defects on the wafer, it can be determined by digital signals, thereby improving the performance and reliability of the final product.

[0058] In this embodiment, the third size recognition unit is arranged on the limit block bottom plate 39 to detect and identify the size information of the wafer box on the first wafer protrusion detection device; in addition, the third size recognition unit involved in this application has the same structural composition and working principle as the first size recognition unit, and will not be repeated here.

[0059] In this embodiment, refer to the attached Figure 8-9 The wafer positioning device includes a locator placement platform 47 fixed on the mounting frame 44 and a wafer locator 36 fixed on the locator placement platform 47. In order to effectively reduce the time for the multifunctional wafer transfer robot 46 to transfer wafers between the first wafer probe detection device and the wafer positioning device, the wafer positioning table 73 of the wafer locator 36 of the present application and the placement area of the limit block bottom plate 39 are located at the same height.

[0060] In this embodiment, the wafer locator 36 involved in this application is a commercially available product, and its model includes but is not limited to the HAL200V-0408S_Aligner calibrator, etc. It can be flexibly selected according to actual production needs. As long as the wafer positioning can be achieved, it is no longer limited here. It should be noted that each wafer has a notch, and the wafer can be positioned by this notch. In the process of positioning the wafer, the wafer is first placed on the wafer positioning table 73 of the wafer locator 36 by the multifunctional wafer transfer robot 46, and then the wafer is driven to rotate by the wafer locator 36. By detecting the position of this notch, the wafer is adjusted to a preset position, specifically adjusted so that the notch position of the wafer corresponds to the preset position, thereby ensuring the accuracy and consistency of the wafer in subsequent processing steps.

[0061] In this embodiment, a second wafer protrusion detection device 12 is also fixedly installed inside the cabinet 1. The second wafer protrusion detection device 12 is arranged at the rear end of the wafer box storage area 10. After the multifunctional wafer transfer robot transfers a wafer box on the wafer box conveyor area to the first wafer protrusion detection device for wafer protrusion detection, the multifunctional wafer transfer robot again clamps another wafer box on the wafer box conveyor area, and under the drive of the second drive device, the multifunctional wafer transfer robot transfers the other wafer box to the second wafer protrusion detection device for coordinated wafer protrusion detection, so as to improve the efficiency of wafer protrusion detection in a limited space.

[0062] In this embodiment, the second wafer protrusion detection device 12 has the same structure and operating principle as the first wafer protrusion detection device, and will not be further described here. The second wafer protrusion detection device 12 and the first wafer protrusion detection device perform wafer protrusion detection together to improve the efficiency of wafer protrusion detection within a limited space. In addition, a fourth size recognition unit is provided on the bottom plate of the limit block of the second wafer protrusion detection device 12 to detect and identify the size information of the wafer box on the second wafer protrusion detection device 12. In addition, the fourth size recognition unit involved in this application has the same structure and operating principle as the first size recognition unit, and will not be further described here.

[0063] In this embodiment, the execution process of the coordinated processing of the second wafer protrusion detection device 12 and the first wafer protrusion detection device includes: first, the multifunctional wafer conveying robot conveys a wafer box on the wafer box conveyor area to the first wafer protrusion detection device for wafer protrusion detection, and then the multifunctional wafer conveying robot clamps another wafer box on the wafer box conveyor area again, and drives the integrated part, the multifunctional wafer conveying robot, the first wafer protrusion detection device and the wafer positioning device to move vertically upward through the second driving device, and conveys the other wafer box to the second wafer protrusion detection device for coordinated wafer protrusion detection, thereby improving the efficiency of the wafer conveying process. The efficiency of wafer protrusion detection in a limited space is improved; when the wafers in the wafer box are subjected to wafer protrusion detection by the first wafer protrusion detection device or the second wafer protrusion detection device, if the wafers in the wafer box have edge protrusion problems, the wafers with edge protrusion problems are corrected and adjusted by the multifunctional wafer transfer robot; then, the second wafer protrusion detection device 12 and the first wafer protrusion detection device respectively transmit their respective protrusion detection data to an external upper control system (such as a host computer), and the upper control system comprehensively analyzes the two protrusion detection data, identifies and eliminates abnormal data, obtains analysis results, and according to the analysis results, can Generate a comprehensive inspection report, and then according to the comprehensive inspection report, dynamically adjust the inspection parameters (such as detection distance) of the second wafer probe inspection device 12 and the first wafer probe inspection device, and apply the optimized inspection parameters to subsequent inspection tasks, which can effectively improve the inspection accuracy and efficiency; at the same time, the collaborative processing flow between the second wafer probe inspection device 12 and the first wafer probe inspection device can be automatically optimized through machine learning algorithms, that is, according to historical probe inspection data and current inspection tasks, predict and adjust the motion trajectory of the vertical slide and the multi-functional wafer transfer robot to reduce inspection time and error; during the inspection process, The operating status and detection data of the second wafer protrusion detection device 12 and the first wafer protrusion detection device are monitored in real time. Once an abnormality is detected (e.g., a deviation in the operating status of the second wafer protrusion detection device 12 or the first wafer protrusion detection device, abnormal detection data, etc.), detection must be immediately stopped and an abnormality handling program initiated. Depending on the type of abnormality, appropriate handling measures, such as recalibration or wafer replacement, can be implemented. The abnormality handling results and improvement measures are fed back to and stored in the upper-level control system for subsequent optimization and improvement. Regular maintenance and upgrades are performed on the cabinet-type wafer storage device to ensure its long-term stable operation. Furthermore, it should be noted that the first wafer protrusion detection device, the second wafer protrusion detection device 12, the multifunctional wafer transfer robot 46, and the wafer cassette storage area 10 are positioned at the same height. During the coordinated wafer protrusion detection process, the multifunctional wafer transfer robot 46 only needs to perform vertical, radial, and joint movements within a very small space to improve the efficiency of wafer protrusion detection.

[0064] In this embodiment, refer to the attached Figure 1 and attached Figure 6 A filter 7 is provided on the top of the cabinet 1. By providing the filter 7, pollutants that may affect the wafer surface and process equipment, including particles, organic matter, metal impurities, etc., can be removed, thereby ensuring the cleanliness of the internal environment of the cabinet 1.

[0065] In this embodiment, in order to facilitate the movement of the cabinet 1, pulleys can be installed at the bottom of the cabinet 1 for movement. At the same time, in order to improve the stability of the cabinet 1 during use, lifting and shock-proof feet can be set at the four corners of the bottom of the cabinet 1 to improve the convenience of using the cabinet 1.

[0066] In this embodiment, refer to the attached Figure 3 The present application also includes an electrical control module 15 fixedly installed inside the cabinet 1. The wafer box conveyor area 14, the wafer box storage area 10 and the wafer conveying positioning device 11 are electrically connected to the electrical control module 15 respectively, and are used to realize integrated control and traceability management of wafer boxes of various sizes and wafers in the wafer boxes during the conveying and storage process. When the vehicle conveys a wafer box of a certain size to the wafer box conveyor area 14, the wafer box of the corresponding size is received and cached through the wafer box conveyor area 14, and the cache position information of the wafer box and the wafer box size information are collected and sent to the electrical control module 15. The electrical control module 15 receives the cache position information of the wafer box and the wafer box size information Afterwards, the wafer transfer positioning device 11 at the origin position is controlled to clamp the two wafer boxes in the wafer box conveyor area 14, and execute the detection and positioning instructions during the vertical upward movement of the wafer transfer positioning device to perform wafer probe detection and wafer positioning processing on the wafers in one of the wafer boxes, and when the wafer transfer positioning device moves to the second wafer probe detection device, the second wafer probe detection device is used to perform coordinated wafer probe detection on the wafers in the other wafer box, and after the wafer probe detection and wafer positioning processing are completed, the wafer box is transferred to the wafer box storage area 10 or the wafers in the wafer box are transferred to the furnace body wafer boat through the wafer transfer positioning device 11. The electrical control module 15 involved in this application is a main control panel, which is a core component used to constitute a cabinet-type wafer storage device, responsible for managing and controlling the storage, circulation and transmission process of wafers. By setting up a main control panel, it is possible to track inventory and material flow in real time, improve product quality and traceability of the manufacturing process, and realize automated material management. At the same time, the main control panel usually requires an external host computer to realize the warehousing and outbound operations of wafer boxes.

[0067] In this embodiment, the present application also provides a storage control method for a cabinet-type wafer storage device, comprising the following steps.

[0068] Step 1: First, firmly install the cabinet-type wafer storage device at the front end of the input port of the furnace body wafer boat, and power on the cabinet-type wafer storage device.

[0069] Step 2: Open the external electric gate 32, transport the wafer box to the wafer box conveyor area 14 by the overhead crane, use the main body 18 or the split part 19 of the wafer box conveyor area 14 to receive and cache the wafer box, and collect and send the cache position information and wafer box size information of the wafer box to the electrical control module 15 through the first size recognition unit. At this time, the internal electric gate 33 is in the closed state.

[0070] Step three: After the wafer box conveyor area 14 has completed receiving and caching the wafer boxes, the external electric gate 32 is closed and the internal electric gate 33 is opened. After the electrical control module 15 receives the cache position information and wafer box size information of the wafer box, it controls the multifunctional wafer conveying robot 46 at the origin position to clamp the two wafer boxes in the wafer box conveyor area 14. In the process of clamping each wafer box, the position and quantity detection elements are used to detect the position and quantity of the wafers in the wafer box, and the position and quantity detection information is sent to the electrical control module 15. Subsequently, the two wafer boxes are respectively conveyed to the first wafer probe detection device and the second wafer probe detection device 12 for wafer probe detection.

[0071] Furthermore, in order to improve the cleanliness of the internal environment of the cabinet 1 , the external electric gate 32 may be opened before the overhead crane transports the wafer box to the wafer box conveyor area 14 each time.

[0072] Furthermore, before the multifunctional wafer transfer robot 46 clamps the wafer box in the wafer box conveyor area 14, it also includes: resetting the origin of the wafer transfer positioning device 11, which specifically includes the following steps: First, the wafer transfer positioning device 11 receives the clamping instruction sent by the electrical control module 15, and it is necessary to determine whether the wafer transfer positioning device 11 is in the origin position. The judgment method can be achieved by setting a position sensor at the origin position, such as an optical position sensor, to monitor whether the wafer transfer positioning device 11 is in the origin position, which has the characteristics of high precision and fast response; if the wafer transfer positioning device 11 is not in the origin position, the second drive device can be used to drive the wafer transfer positioning device 11 to move vertically downward until it returns to the origin position, and then the wafer box clamping operation is performed.

[0073] Step 4: After the multifunctional wafer transfer robot 46 transfers a wafer box on the wafer box conveyor area 14 to the first wafer protrusion detection device for protrusion detection, the multifunctional wafer transfer robot 46 again clamps another wafer box on the wafer box conveyor area 14, and drives the integrated part, the multifunctional wafer transfer robot 46, the first wafer protrusion detection device and the wafer positioning device to move vertically upward through the second driving device, and transfers the other wafer box to the second wafer protrusion detection device 12 for coordinated wafer protrusion detection, thereby improving the efficiency of wafer protrusion detection in a limited space. When the wafers in the wafer box are subjected to protrusion detection by the first wafer protrusion detection device or the second wafer protrusion detection device 12, if the wafers in the wafer box have edge protrusion problems, the multifunctional wafer transfer robot 46 corrects and adjusts the wafers with edge protrusion problems. If the wafers in the wafer box do not have edge protrusion problems, step 5 is performed.

[0074] Step 5: The multifunctional wafer transfer robot 46 transfers the wafers in the wafer box on the first wafer protrusion detection device or the second wafer protrusion detection device 12 to the wafer positioning device.

[0075] Step 6: The wafer is positioned and adjusted by the wafer positioning device, and then the wafer after positioning adjustment is placed back into the corresponding wafer box by the multifunctional wafer transfer robot 46 .

[0076] Step 7: Repeat steps 5 and 6 until all wafers have been positioned and adjusted and placed back into the corresponding wafer boxes, and then use the multifunctional wafer transfer robot 46 to transfer the wafer boxes to the wafer box storage area 10 or transfer the wafers in the wafer boxes to the furnace body wafer boat.

[0077] Furthermore, the wafer box conveyor area 14 involved in the present application can cache up to 3 wafer boxes. In order to improve the efficiency of the probe detection, one of the wafer boxes can be placed on the first wafer probe detection device for wafer probe detection, and then the other wafer box can be placed on the second wafer probe detection device 12 for wafer probe detection, until both wafer boxes have completed wafer probe detection and wafer positioning adjustment and are transferred to the wafer box storage area 10 or the wafers in the wafer box are transferred to the furnace body wafer boat, and then the last wafer box is placed on the first wafer probe detection device for wafer probe detection, and the wafer positioning adjustment is performed on the wafers inside it. Finally, the wafer box after the positioning adjustment is transferred to the wafer box storage area 10 or the wafers in the wafer box are transferred to the furnace body wafer boat to complete the transfer and storage process of the wafer box and its internal wafers inside the cabinet wafer storage device.

[0078] Furthermore, in order to improve the efficiency of the two wafer boxes and the wafers inside them during the wafer probe and wafer positioning adjustment process, the multifunctional wafer transfer robot 46 is used to synchronously transfer wafer boxes and wafers. After a wafer box is placed on the first wafer probe detection device for wafer probe detection, the wafer box clamp of the multifunctional wafer transfer robot 46 is used to clamp another wafer box, and when the second driving device drives the slider 48 and the multifunctional wafer transfer robot 46, the first wafer probe detection structure and the wafer positioning detection structure integrated thereon to perform vertical upward movement, the wafer clamp of the wafer transfer robot is used to clamp the wafer in the wafer box on the first wafer probe detection device to complete the wafer positioning adjustment, so as to effectively improve the wafer probe efficiency and wafer positioning adjustment efficiency.

[0079] The above content is a further detailed description of the present invention in conjunction with specific embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A cabinet-type wafer storage device, characterized in that: include: A cabinet, a window opened on the back of the cabinet and used to transfer wafers to the furnace body wafer boat, a wafer box conveyor area arranged inside the cabinet and used to receive and cache wafer boxes of various sizes, a wafer box storage area arranged inside the cabinet and used to store wafer boxes of various sizes, a wafer conveying and positioning device fixedly installed inside the cabinet and having wafer probe detection and positioning functions, a second wafer probe detection device fixedly connected to the inside of the cabinet and used to cooperate with the wafer conveying and positioning device to perform wafer probe detection, and an electrical control module fixedly installed inside the cabinet. The wafer box conveyor area, the wafer box storage area, the wafer conveying positioning device and the second wafer probe detection device are respectively electrically connected to the electrical control module for realizing integrated control and traceability management of wafer boxes of various sizes and the wafers in the wafer boxes during the conveying and storage process. After the intraday car conveys a wafer box of a certain size to the wafer box conveyor area, the wafer box is passed through the wafer box. The conveyor area receives and caches wafer boxes of corresponding sizes, collects and sends the cache position information of the wafer boxes and the wafer box size information to the electrical control module. After receiving the cache position information and the wafer box size information of the wafer box, the electrical control module controls the wafer transfer and positioning device at the origin position to clamp the two wafer boxes in the wafer box conveyor area, and executes the detection and positioning instructions during the vertical upward movement of the wafer transfer and positioning device to perform wafer probe detection and wafer positioning processing on the wafers in one of the wafer boxes, and when the wafer transfer and positioning device moves to the second wafer probe detection device, the second wafer probe detection device is used to perform coordinated wafer probe detection on the wafers in the other wafer box, and after the wafer probe detection and wafer positioning processing are completed, the wafer box is transferred to the wafer box storage area or the wafers in the wafer box are transferred to the furnace body wafer boat through the wafer transfer and positioning device.

2. The cabinet-type wafer storage device according to claim 1, characterized in that: An inspection door is connected to the front of the cabinet by a hinge, and an input port for transferring the wafer box on the overhead crane to the wafer box conveyor area is provided on the inspection door. An external electric gate for isolating the wafer box conveyor area from the working environment outside the cabinet is provided at the input port, and an internal electric gate for isolating the wafer box conveyor area from the working environment inside the cabinet is provided at the rear end of the wafer box conveyor area.

3. The cabinet-type wafer storage device according to claim 2, characterized in that: A movable frame is provided inside the cabinet, and the movable frames of the wafer box conveyor area and the wafer box storage area are fixedly connected to the movable frame. The upper and lower ends of the inner side walls of the cabinet are provided with push-pull cable protection modules. The push-pull cable protection module is used to store and protect the cables as the movable frame is pulled out during maintenance work, and to facilitate pulling out and pushing the movable frame.

4. The cabinet-type wafer storage device according to claim 1, characterized in that: The wafer box conveyor area includes a main body, a split part rotatably connected to both sides of the main body, and a first driving device for controlling the horizontal rotation of the split part. One end of the first driving device is rotatably connected to the split part, and the other end is rotatably connected to the main body. Driven by the first driving device, the split part is driven to rotate to facilitate the control of the orientation of the wafer box. The main body and the split part are both provided with a first size recognition unit for detecting and identifying the size information of the wafer box.

5. The cabinet-type wafer storage device according to claim 4, characterized in that: The position of the wafer box storage area corresponds to the position of the window, which is used to improve the convenience of transferring wafers to the furnace body wafer boat. The wafer box storage area includes multiple layers of wafer box storage tables, and each layer of the wafer box storage table is provided with multiple wafer box storage stations, and each of the wafer box storage stations is provided with a second size identification unit for detecting and identifying the wafer box size information.

6. The cabinet-type wafer storage device according to claim 5, characterized in that: The wafer conveying and positioning device includes an assembly part, a second driving device, an integration part, a multifunctional wafer conveying robot, a first wafer probing detection device and a wafer positioning device. The assembly part is fixedly installed on the inner wall of the cabinet and is arranged between the wafer box conveyor area and the window for circulation between the wafer box conveyor area and the window. The second driving device is fixedly installed at the lower end of the assembly part, and the output end of the second driving device is connected to the integration part. The integration part is slidably connected to the assembly part. Under the drive of the second driving device, the multifunctional wafer conveying robot, the first wafer probing detection device and the wafer positioning device are driven by the integration part to perform vertical lifting and moving together. The multifunctional wafer conveying robot, the first wafer probing detection device and the wafer positioning device are all fixedly installed on the integration part. During the vertical upward movement together with the wafer positioning device, the multifunctional wafer transfer robot is used to simultaneously transfer two wafer boxes and the wafers in the wafer boxes, and after transferring one of the wafer boxes to the first wafer protrusion detection device to complete the wafer protrusion detection, the wafers in the wafer box are quickly transferred to the wafer positioning device for wafer positioning adjustment, and after the first wafer protrusion detection device completes the wafer protrusion detection, the multifunctional wafer transfer robot is used to correct and adjust the wafers with edge protrusion problems. The multifunctional wafer transfer robot is also provided with a position and quantity detection element, which is used to detect the position and quantity of the wafers in the wafer box when the multifunctional wafer transfer robot transfers the wafer box to the first wafer protrusion detection device. The first wafer protrusion detection device is also provided with a third size recognition unit for detecting and identifying the size information of the wafer box.

7. The cabinet-type wafer storage device according to claim 6, characterized in that: The second wafer protrusion detection device is arranged at the rear end of the wafer box storage area. The second wafer protrusion detection device is provided with a fourth size recognition unit for detecting and identifying the size information of the wafer box. After the multifunctional wafer transfer robot transfers a wafer box on the wafer box conveyor area to the first wafer protrusion detection device for wafer protrusion detection, the multifunctional wafer transfer robot again clamps another wafer box on the wafer box conveyor area, and under the drive of the second driving device, the multifunctional wafer transfer robot transfers the other wafer box to the second wafer protrusion detection device for coordinated wafer protrusion detection, so as to improve the efficiency of wafer protrusion detection in a limited space.

8. The cabinet-type wafer storage device according to claim 7, characterized in that: The first size identification unit, the second size identification unit, the third size identification unit and the fourth size identification unit all include a limit block, a common pressure sensing identification element arranged on the side of the limit block and multiple pressure sensing identification elements. The common pressure sensing identification element is used to perform common pressure sensing detection on wafer boxes of all sizes. Each of the pressure sensing identification elements is used to identify the size information of a wafer box of a certain size under the coordinated action of the common pressure sensing identification component, and send the identified wafer box size information to the electrical control module to realize traceability management of wafer boxes of different sizes and the wafers in the wafer boxes.

9. The cabinet-type wafer storage device according to claim 1, characterized in that: A filter is provided on the top of the cabinet.

10. The storage control method of a cabinet-type wafer storage device according to any one of claims 1 to 9, characterized in that: The steps include: Step 1: First, firmly install the cabinet-type wafer storage device at the front end of the input port of the furnace body wafer boat, and power on the cabinet-type wafer storage device; Step 2: Open the external electric gate, transport the wafer cassette to the wafer cassette conveyor area by the overhead crane, receive and buffer the wafer cassette using the main body or sub-body of the wafer cassette conveyor area, and collect and send the buffer position information and wafer cassette size information of the wafer cassette to the electrical control module through the first size recognition unit. At this time, the internal electric gate is in the closed state. Step 3: After the wafer cassette conveyor area has completed receiving and caching the wafer cassettes, the external electric gate is closed and the internal electric gate is opened. After the electrical control module receives the cache position information and wafer cassette size information of the wafer cassette, it controls the multifunctional wafer transfer robot at the origin position to clamp two wafer cassettes in the wafer cassette conveyor area. During the process of clamping each wafer cassette, the position and quantity detection element is used to detect the position and quantity of the wafers in the wafer cassette, and the position and quantity detection information is sent to the electrical control module. Subsequently, the two wafer cassettes are respectively conveyed to the first wafer probe detection device and the second wafer probe detection device for wafer probe detection; Step 4: After the multifunctional wafer transfer robot transfers a wafer box on the wafer box conveyor area to the first wafer protrusion detection device for wafer protrusion detection, the multifunctional wafer transfer robot again clamps another wafer box on the wafer box conveyor area, and drives the integration part, the multifunctional wafer transfer robot, the first wafer protrusion detection device and the wafer positioning device to move vertically upward through the second driving device, and transfers the other wafer box to the second wafer protrusion detection device for coordinated wafer protrusion detection, thereby improving the efficiency of wafer protrusion detection in a limited space. When the wafers in the wafer box are subjected to wafer protrusion detection by the first wafer protrusion detection device or the second wafer protrusion detection device, if edge protrusion problems occur on the wafers in the wafer box, the multifunctional wafer transfer robot corrects and adjusts the wafers with edge protrusion problems. If no edge protrusion problems occur on the wafers in the wafer box, step 5 is performed. Step 5: The multifunctional wafer transfer robot transfers the wafers in the wafer box on the first wafer detection device or the second wafer detection device to the wafer positioning device; Step 6: The wafer is positioned and adjusted by the wafer positioning device, and then the multifunctional wafer transfer robot places the adjusted wafer back into the corresponding wafer box; Step 7: Repeat steps 5 and 6 until all wafers have been positioned and adjusted and placed back into the corresponding wafer boxes. Then, use the multi-functional wafer transfer robot to transfer the wafer boxes to the wafer box storage area or transfer the wafers in the wafer boxes to the furnace body wafer boat.

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