Automatic loading system for high-cleanliness semiconductor wafer

Abstract

The invention relates to the technical field of semiconductor processing. The invention discloses an automatic loading system for high-cleanliness semiconductor wafers, and the system comprises a wafer storage module which is provided with a plurality of storage positions and is located in a high-cleanliness environment; the processing and loading module comprises a wafer positioning and bearing sub-module and a reflecting sub-module; the wafer carrying module is composed of a carrying mechanical arm and a wafer adsorption sub-module and is used for carrying wafers; the laser calibration module comprises a laser emission sub-module and a laser identification sub-module and is used for emitting and identifying the reflected laser to the reflection sub-module; the data processing module is used for calculating position deviation according to the reflected laser data; and the control module adjusts the position of the wafer carrying module according to the position deviation. According to the automatic loading system, the first reflection sub-module, the second reflection sub-module and the corresponding laser emission and identification sub-module are utilized, accurate position measurement and adjustment of the semiconductor wafer are achieved, and the accuracy and consistency of each carrying operation are ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to an automatic loading system for high-cleanliness semiconductor wafers. Background Art

[0002] Semiconductor manufacturing places extremely high demands on wafer handling, especially during processing and handling in high-purity environments. Traditional wafer handling methods often face numerous challenges, including but not limited to insufficient positioning accuracy, difficulty maintaining environmental cleanliness, the risk of physical damage, and operational complexity. Traditional methods rely on mechanical means to position and handle wafers, which often leads to inaccurate positioning. Even slight positional deviations can cause serious quality issues, such as circuit shorts or performance degradation. Furthermore, ensuring precise control of wafer position during high-speed handling is particularly challenging, directly impacting production efficiency and product quality. Semiconductor manufacturing requires a highly clean environment to prevent any particles or contaminants from adhering to the wafer surface. However, existing systems struggle to completely prevent the ingress of external contaminants, and inadequate internal air purification measures can easily lead to wafer contamination, compromising final product quality. During handling, contact-based methods, such as clamps, can cause physical damage to the wafer due to uneven pressure distribution. This damage not only reduces product yield but also increases the complexity and cost of subsequent processes. Therefore, finding a method that ensures efficient handling while avoiding physical damage has become an urgent challenge. With the advancement of semiconductor technology, wafer size continues to increase, and the requirements for processing precision are also becoming increasingly stringent. Traditional manual or semi-automatic operation methods can no longer meet the needs of modern industry. Improving the automation level of the entire system and reducing manual intervention have become one of the key factors in improving production efficiency. Summary of the Invention

[0003] In order to address the deficiencies of the prior art, the present invention discloses an automatic loading system for high-cleanliness semiconductor wafers, which provides precise positioning, safe transportation, thorough cleaning, and a stable high-cleanliness working environment for the wafers.

[0004] The present invention discloses an automatic loading system for high-cleanliness semiconductor wafers, which includes a wafer storage module for storing semiconductor wafers. The wafer storage module is provided with a plurality of storage locations for placing wafers, and the wafer storage module is in a high-cleanliness environment.

[0005] A processing loading module, the processing loading module is connected to the wafer storage module, and the processing loading module includes a wafer positioning and carrying submodule for placing semiconductor wafers and a reflection submodule arranged on one side of the wafer positioning and carrying submodule;

[0006] Wafer handling module, the wafer handling module is connected to the wafer storage module and the processing loading module, the wafer handling module includes a handling robot arm and a wafer adsorption submodule installed at the end of the handling robot arm, the handling robot arm is used to transport wafers between the wafer storage module and the processing loading module, and the wafer adsorption submodule is used to adsorb and release wafers;

[0007] A laser calibration module is connected to the end of the wafer adsorption submodule away from the handling robot arm. The laser calibration module includes a laser emission submodule and a laser recognition submodule. The laser emission submodule is used to emit laser light onto the reflection submodule, and the laser recognition submodule is used to absorb the laser light reflected by the reflection submodule. A data processing module is connected to the laser calibration module and is used to calculate the position deviation of the wafer handling module based on the laser light data reflected by the reflection submodule.

[0008] The control module is connected to the wafer handling module, the laser calibration module and the data processing module. The control module controls and adjusts the position of the wafer handled by the wafer handling module according to the position deviation of the wafer handling module calculated by the data processing module.

[0009] Furthermore, the automatic loading system further comprises a second reflection submodule, which is connected to an end of the wafer adsorption submodule away from the transport robot arm;

[0010] The automatic loading system also includes a second laser calibration module, which is arranged on one side of the wafer positioning and carrying submodule. The second laser calibration module includes a second laser emitting submodule and a second laser identification submodule. The second laser emitting submodule is used to emit laser light onto the second reflecting submodule, and the second laser identification submodule is used to absorb the laser reflected by the second reflecting submodule.

[0011] Furthermore, the laser data reflected by the reflection submodule includes: laser reflection angle, reflection spot position, laser intensity, laser phase offset and polarization state parameters.

[0012] Furthermore, the reflective submodule includes a reflector, and the material of the reflector is one of optical glass, aluminum alloy and a multi-layer dielectric film structure.

[0013] Furthermore, when the reflector is made of optical glass: the surface of the optical glass is first ground and polished to a surface roughness of nanometer level, and then silver-plated, with the thickness of the silver layer controlled between 100-150 nanometers. After silver plating, a silicon dioxide protective film with a thickness of 20-30 nanometers is deposited on the surface of the silver layer by physical vapor deposition;

[0014] When the reflector is made of aluminum alloy: the aluminum alloy is processed and formed, and the surface of the aluminum alloy is anodized to form a dense oxide film with a thickness of 20-30 microns. Then, it is electroplated with nickel to a thickness of 5-10 microns. After nickel plating, the nickel-plated surface is precisely polished to achieve a surface roughness of submicron level;

[0015] When the reflector is a multi-layer dielectric film structure: the multi-layer dielectric film structure is composed of alternately deposited high-refractive index material titanium dioxide and low-refractive index material silicon dioxide. The dielectric film is deposited layer by layer on the optical substrate through the physical vapor deposition process. The number of layers of the entire multi-layer dielectric film is 10-20.

[0016] Furthermore, the automatic loading system also includes a clean environment maintenance module, which is connected to the peripheral space of the wafer storage module, the processing loading module and the wafer handling module. The clean environment maintenance module includes an air purification sub-module, a pressure control sub-module and a gas circulation sub-module. The air purification sub-module is used to filter particulate matter in the air, the pressure control sub-module is used to maintain positive pressure in the automatic loading system, and the gas circulation sub-module is used to circulate the gas in the automatic loading system.

[0017] Furthermore, the data processing module calculates the position deviation of the wafer handling module based on the reflected laser data using an algorithm, and the specific algorithm is at least one of the least squares method, Kalman filter algorithm, neural network algorithm, Hough transform algorithm, genetic algorithm and particle swarm algorithm.

[0018] Furthermore, the wafer adsorption submodule is a vacuum adsorption submodule, and the wafer adsorption submodule includes an adsorption plate and a vacuum pipe connected to the adsorption plate. A vacuum control valve is provided on the vacuum pipe for controlling the adsorption and release operations of the adsorption plate.

[0019] Furthermore, the wafer positioning and carrying submodule of the processing loading module includes a temperature regulating submodule, which is used to regulate the temperature of the carrying surface before the wafer is placed to eliminate positioning errors caused by thermal expansion or contraction.

[0020] Furthermore, the wafer adsorption submodule also includes a non-contact cleaning component, which includes a dry ice spray head. The dry ice spray head performs non-contact cleaning on the wafer surface to remove organic pollutants before adsorbing the wafer through the control module.

[0021] Beneficial effects of the present invention:

[0022] The present invention provides an automatic loading system for high-cleanliness semiconductor wafers, which utilizes a laser calibration module including a first and a second reflection submodule and corresponding laser emission and identification submodules to achieve precise position measurement and adjustment of semiconductor wafers. The accuracy and consistency of each wafer handling operation are ensured, and product defects caused by inaccurate positioning are greatly reduced. The present invention provides an automatic loading system for high-cleanliness semiconductor wafers, which provides additional accuracy improvement and fault backup mechanism by introducing a second reflection submodule and a second laser calibration module, thereby increasing the reliability and stability of the system. Even in the event of a failure of a single component, the continuity of the production process can be guaranteed. The automatic loading system of the present invention uses data analysis of multiple parameters such as laser reflection angle, spot position, light intensity, phase offset and polarization state, which not only improves the positioning accuracy, but also enhances the ability to detect the surface status of the wafer, which helps to promptly discover and deal with potential problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a workflow diagram of an automatic loading system in an embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the specific implementation manner of the present invention will be clearly and completely described below.

[0025] The present invention discloses an automatic loading system for high-cleanliness semiconductor wafers, which includes a wafer storage module for storing semiconductor wafers, the wafer storage module is provided with multiple storage locations for placing wafers, and the wafer storage module is in a high-cleanliness environment. A processing loading module, the processing loading module is connected to the wafer storage module, the processing loading module includes a wafer positioning and carrying submodule for placing semiconductor wafers, and a reflective submodule arranged on one side of the wafer positioning and carrying submodule. A wafer handling module, the wafer handling module is connected to the wafer storage module and the processing loading module, the wafer handling module includes a handling robot arm and a wafer adsorption submodule installed at the end of the handling robot arm, the handling robot arm is used to transport wafers between the wafer storage module and the processing loading module, and the wafer adsorption submodule is used to adsorb and release wafers. A laser calibration module, the laser calibration module is connected to the end of the wafer adsorption submodule away from the handling robot arm, the laser calibration module includes a laser emission submodule and a laser recognition submodule, the laser emission submodule is used to emit laser light onto the reflective submodule, and the laser recognition submodule is used to absorb laser light reflected by the reflective submodule. The data processing module is connected to the laser calibration module and is used to calculate the position deviation of the wafer handling module based on the laser data reflected by the reflector module. The control module is connected to the wafer handling module, the laser calibration module, and the data processing module and controls and adjusts the position of the wafers being handled by the wafer handling module based on the position deviation of the wafer handling module calculated by the data processing module.

[0026] The automatic loading system for high-cleanliness semiconductor wafers of the present invention, through the combination of the aforementioned functional modules, achieves efficient, precise, and reliable processing of semiconductor wafers. It is particularly suitable for scenarios requiring strict control of environmental cleanliness and operational precision. The wafer storage module provides a high-cleanliness environment for storing semiconductor wafers. It features multiple storage locations to ensure that each wafer is stored under optimal conditions. This effectively prevents contamination and damage, as even tiny particles or impurities can affect the performance of the final product. The processing and loading module is connected to the wafer storage module and includes a wafer positioning and support submodule and a reflector submodule. The positioning and support submodule provides a stable placement platform for the wafer, while the reflector submodule works in conjunction with the laser calibration module to ensure precise wafer positioning. The laser calibration module consists of a laser emission submodule and a laser recognition submodule. These work together to precisely measure and locate the wafer position by emitting laser light toward the reflector submodule, with the laser recognition submodule receiving the laser light data reflected by the reflector submodule. The wafer handling module includes a handling robot arm and a wafer suction submodule. The handling robot arm can flexibly move between the wafer storage module and the processing and loading module, while the wafer suction submodule is responsible for safely sucking and releasing wafers to prevent any possible physical damage. A laser calibration module is connected to the end of the wafer suction submodule away from the handling robot arm, further ensuring positioning accuracy during the handling process. The data processing module analyzes the data obtained from the laser calibration module and calculates the position deviation of the wafer handling module. The calculated position deviation is used to adjust the handling path in real time to compensate for any possible position error. The control module is connected to the wafer handling module, laser calibration module, and data processing module. Based on the position deviation information provided by the data processing module, it dynamically adjusts the movement of the handling robot arm to ensure that each wafer handling is as close to the ideal state as possible. Through laser positioning technology, precise handling mechanisms, and intelligent data analysis and control systems, the automatic loading system not only improves the efficiency and accuracy of semiconductor wafer processing, but also significantly reduces product defects caused by improper operation or inaccurate positioning.

[0027] As an embodiment, the automatic loading system also includes a second reflective submodule, which is connected to the end of the wafer adsorption submodule away from the transport robot arm. The automatic loading system also includes a second laser calibration module, which is arranged on one side of the wafer positioning and carrying submodule. The second laser calibration module includes a second laser emitting submodule and a second laser identification submodule. The second laser emitting submodule is used to emit laser light onto the second reflective submodule, and the second laser identification submodule is used to absorb the laser light reflected by the second reflective submodule. The present invention connects the second reflective submodule to the end of the wafer adsorption submodule away from the transport robot arm, and arranges the second laser calibration module including the second laser emitting submodule and the second laser identification submodule on the side of the wafer positioning and carrying submodule, thereby achieving double confirmation of the wafer position. This design can significantly improve the positioning accuracy of the system, ensuring that the position of each wafer transport and placement is more accurate. If the first laser calibration system fails or has a measurement error, the second system can be put into use immediately as a backup to ensure that the entire operation process will not be interrupted. By combining the functions of the data processing module and comparative analysis of data from the two laser calibration modules, the positional deviation of the wafer handling module can be more accurately calculated, allowing the control module to adjust the handling path in real time. This not only improves the success rate of individual operations but also helps optimize handling strategies and reduce cumulative errors over the long term. The addition of a second reflector module and a second laser calibration module enhances the robustness of the entire system, ensuring high operational stability and accuracy even under changing environmental conditions or equipment aging. This is a significant advantage for semiconductor production lines that require long-term continuous operation and strict precision requirements. Complex wafer processing tasks require greater flexibility and precision to meet specific process requirements. The dual-laser calibration system configuration allows the system to excel in a wider range of applications, whether handling multi-step processes or wafers with unusual shapes.

[0028] In one embodiment, the laser data reflected by the reflection submodule includes: laser reflection angle, reflected spot location, laser intensity, laser phase offset, and polarization state parameters. By analyzing the laser reflection angle and reflected spot location, the wafer's position and posture can be more accurately determined. Using changes in laser intensity and phase offset, the system can more accurately determine the wafer surface condition, such as the presence of defects or contaminants, ensuring that only wafers that meet standards are processed further. This helps reduce defective rates and improve production efficiency. The introduction of polarization state parameters enables the system to perform more precise operations on surfaces with different materials or coatings. Different materials respond differently to the laser's polarization state. Monitoring this parameter allows for better adaptation to diverse processing requirements and maintains system stability and consistency. By integrating these multiple parameters, the system not only determines basic wafer position information but also adjusts the transport path and speed accordingly to account for uncertainties such as environmental changes and equipment wear. Detailed laser data helps engineers quickly diagnose potential system issues and take appropriate preventative measures. For example, a sudden drop in laser intensity could indicate contamination or damage to the optical components, while an abnormal change in polarization could indicate a change in the wafer surface condition. These early warning signals enable timely action to avoid further losses. Detailed data on laser light reflected from the reflector module not only significantly improves the automatic loading system's positioning accuracy, detection reliability, and operational stability, but also provides greater adaptability and ease of maintenance.

[0029] As an embodiment, the reflector module includes a reflector, and the reflector is made of one of optical glass, aluminum alloy, and a multi-layer dielectric film structure. When the reflector is optical glass: the optical glass surface is first ground and polished to a nanometer-level surface roughness, and then silver-plated. The thickness of the silver layer is controlled between 100-150 nanometers. After silver plating, a 20-30 nanometer-thick silicon dioxide protective film is deposited on the silver layer by physical vapor deposition. When the reflector is aluminum alloy: the aluminum alloy is processed and formed, and the aluminum alloy surface is anodized to form a dense oxide film with a thickness of 20-30 microns. It is then electroplated with nickel to a thickness of 5-10 microns. After nickel plating, the nickel-plated surface is precision polished to a submicron-level surface roughness. When the reflector is a multilayer dielectric film structure: The multilayer dielectric film structure consists of alternating layers of high-refractive-index titanium dioxide and low-refractive-index silicon dioxide. The dielectric films are deposited layer by layer on an optical substrate using a physical vapor deposition process, with the total number of layers ranging from 10 to 20. Optical glass can provide very high reflectivity while maintaining low wavefront distortion. High-quality optical glass reduces light loss during transmission, ensuring the accuracy of laser data such as reflection angle and spot position. Aluminum alloy reflectors are not only lightweight but also possess excellent mechanical strength and corrosion resistance. This makes the reflector less susceptible to damage during wafer handling and ensures long-term stable operation under diverse environmental conditions. Furthermore, aluminum alloy has excellent thermal conductivity, which helps dissipate heat and prevents deformation caused by temperature fluctuations that affect reflection performance. The application of a multilayer dielectric film structure allows the spectral characteristics of the reflector to be customized according to specific requirements. For example, improving reflection efficiency within a specific wavelength range or achieving specific polarization state conversion can be achieved.

[0030] As an embodiment, the automatic loading system also includes a clean environment maintenance module, which is connected to the peripheral space of the wafer storage module, the processing loading module and the wafer handling module. The clean environment maintenance module includes an air purification submodule, a pressure control submodule and a gas circulation submodule. The air purification submodule is used to filter particulate matter in the air, the pressure control submodule is used to maintain a positive pressure in the automatic loading system, and the gas circulation submodule is used to circulate the gas in the automatic loading system. The air purification submodule can effectively filter particulate matter, dust and other pollutants in the air, thereby ensuring that the wafers will not be contaminated during storage, handling and processing. The pressure control submodule maintains the positive pressure state of the system, which can prevent external unpurified air from entering the system. The gas circulation submodule circulates the gas in the system, which helps to achieve a uniform distribution of temperature, humidity and air quality in the entire working area.

[0031] As an implementation method, the data processing module calculates the position deviation of the wafer handling module based on the reflected laser data using an algorithm, and the specific algorithm is at least one of the least squares method, Kalman filter algorithm, neural network algorithm, Hough transform algorithm, genetic algorithm and particle swarm algorithm.

[0032] As an embodiment, the wafer adsorption submodule is vacuum adsorption, and the wafer adsorption submodule includes an adsorption plate and a vacuum pipe connected to the adsorption plate. A vacuum control valve is provided on the vacuum pipe for controlling the adsorption and release operations of the adsorption plate.

[0033] As an embodiment, the wafer positioning and carrying submodule of the processing and loading module includes a temperature regulating submodule, which is used to adjust the temperature of the carrying surface before the wafer is placed to eliminate positioning errors caused by thermal expansion or contraction. Compared with the mechanical clamping method, vacuum adsorption exerts more uniform pressure on the wafer, reducing the possibility of local stress concentration, thereby reducing the risk of physical damage to the wafer during transportation. Vacuum adsorption technology is suitable for wafers of different sizes and shapes, and effective adsorption of wafers of various specifications can be achieved by simply adjusting the vacuum degree. By rationally designing the adsorption plate and vacuum pipe, stability and safety can be ensured during transportation. Compared with complex mechanical structures, the structure of the vacuum adsorption system is relatively simple and easy to maintain and clean. It not only reduces maintenance costs, but also reduces downtime due to equipment failure.

[0034] As an embodiment, the wafer adsorption submodule also includes a non-contact cleaning component, and the cleaning component includes a dry ice blasting head. The dry ice blasting head performs non-contact cleaning of the wafer surface to remove organic contaminants before adsorbing the wafer through the control module. Dry ice blasting is a very effective non-contact cleaning method that can effectively remove organic contaminants and other tiny particles on the surface of the wafer. Dry ice quickly sublimates into gas when it comes into contact with the surface, leaving no residue, ensuring the high cleanliness of the wafer surface. Because it is a non-contact cleaning method, dry ice blasting can avoid physical scratches or damage that may be caused by traditional cleaning methods. By thoroughly cleaning the surface of the wafer before adsorbing it, product defects caused by surface contamination, such as circuit shorts or substandard performance, can be significantly reduced. Not only does it improve the quality of the final product, but it also enhances the reliability and consistency of production.

[0035] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. An automatic loading system for high-cleanliness semiconductor wafers, characterized in that: include: A wafer storage module is used to store semiconductor wafers. The wafer storage module is provided with multiple storage locations for placing wafers, and the wafer storage module is in a high-cleanliness environment; A processing loading module, the processing loading module is connected to the wafer storage module, and the processing loading module includes a wafer positioning and carrying submodule for placing semiconductor wafers and a reflection submodule arranged on one side of the wafer positioning and carrying submodule; Wafer handling module, the wafer handling module is connected to the wafer storage module and the processing loading module, the wafer handling module includes a handling robot arm and a wafer adsorption submodule installed at the end of the handling robot arm, the handling robot arm is used to transport wafers between the wafer storage module and the processing loading module, and the wafer adsorption submodule is used to adsorb and release wafers; A laser calibration module is connected to the end of the wafer adsorption submodule away from the handling robot arm. The laser calibration module includes a laser emission submodule and a laser recognition submodule. The laser emission submodule is used to emit laser light onto the reflection submodule, and the laser recognition submodule is used to absorb the laser light reflected by the reflection submodule. A data processing module is connected to the laser calibration module and is used to calculate the position deviation of the wafer handling module based on the laser light data reflected by the reflection submodule. The control module is connected to the wafer handling module, the laser calibration module and the data processing module. The control module controls and adjusts the position of the wafer handled by the wafer handling module according to the position deviation of the wafer handling module calculated by the data processing module.

2. The automatic loading system for high-cleanliness semiconductor wafers according to claim 1, characterized in that: The automatic loading system further includes a second reflection submodule connected to an end of the wafer adsorption submodule away from the transport robot arm; The automatic loading system also includes a second laser calibration module, which is arranged on one side of the wafer positioning and carrying submodule. The second laser calibration module includes a second laser emitting submodule and a second laser identification submodule. The second laser emitting submodule is used to emit laser light onto the second reflecting submodule, and the second laser identification submodule is used to absorb the laser reflected by the second reflecting submodule.

3. The automatic loading system for high-cleanliness semiconductor wafers according to claim 2, characterized in that: The laser data reflected by the reflection submodule includes: laser reflection angle, reflection spot position, laser intensity, laser phase offset and polarization state parameters.

4. The automatic loading system for high-cleanliness semiconductor wafers according to claim 1, characterized in that: The reflector module includes a reflector, and the material of the reflector is one of optical glass, aluminum alloy and multi-layer dielectric film structure.

5. The automatic loading system for high-cleanliness semiconductor wafers according to claim 4, characterized in that: When the reflector is made of optical glass: the surface of the optical glass is first ground and polished to a nanometer level, then silver-plated with a thickness of 100-150 nanometers. After silver plating, a 20-30 nanometer thick silicon dioxide protective film is deposited on the surface of the silver layer by physical vapor deposition. When the reflector is made of aluminum alloy: the aluminum alloy is processed and formed, and the surface of the aluminum alloy is anodized to form a dense oxide film with a thickness of 20-30 microns. Then, it is electroplated with nickel to a thickness of 5-10 microns. After nickel plating, the nickel-plated surface is precisely polished to achieve a surface roughness of submicron level; When the reflector is a multi-layer dielectric film structure: the multi-layer dielectric film structure is composed of alternately deposited high-refractive index material titanium dioxide and low-refractive index material silicon dioxide. The dielectric film is deposited layer by layer on the optical substrate through the physical vapor deposition process. The number of layers of the entire multi-layer dielectric film is 10-20.

6. The automatic loading system for high-cleanliness semiconductor wafers according to claim 4, characterized in that: The automatic loading system also includes a clean environment maintenance module, which is connected to the peripheral space of the wafer storage module, the processing loading module and the wafer handling module. The clean environment maintenance module includes an air purification sub-module, a pressure control sub-module and a gas circulation sub-module. The air purification sub-module is used to filter particulate matter in the air, the pressure control sub-module is used to maintain positive pressure in the automatic loading system, and the gas circulation sub-module is used to circulate the gas in the automatic loading system.

7. The automatic loading system for high-cleanliness semiconductor wafers according to claim 1, characterized in that: The data processing module calculates the position deviation of the wafer handling module based on the reflected laser data using an algorithm, wherein the specific algorithm is at least one of the least squares method, Kalman filter algorithm, neural network algorithm, Hough transform algorithm, genetic algorithm and particle swarm algorithm.

8. The automatic loading system for high-cleanliness semiconductor wafers according to claim 1, characterized in that: The wafer adsorption submodule is a vacuum adsorption submodule. The wafer adsorption submodule includes an adsorption plate and a vacuum pipe connected to the adsorption plate. A vacuum control valve is provided on the vacuum pipe to control the adsorption and release operations of the adsorption plate.

9. The automatic loading system for high-cleanliness semiconductor wafers according to claim 1, characterized in that: The wafer positioning and carrying submodule of the processing and loading module includes a temperature regulating submodule, which is used to regulate the temperature of the carrying surface before the wafer is placed to eliminate positioning errors caused by thermal expansion or contraction.

10. The automatic loading system for high-cleanliness semiconductor wafers according to claim 1, characterized in that: The wafer adsorption submodule also includes a non-contact cleaning component, which includes a dry ice jet head. The dry ice jet head performs non-contact cleaning on the wafer surface to remove organic pollutants before adsorbing the wafer through the control module.

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