Rewashing device for solder resist ink

Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to a solder resist ink rewashing device which comprises a cylinder body, a temperature control mechanism and a driving mechanism, and the driving mechanism is installed outside the cylinder body; the temperature control mechanism is mounted at the bottom of the cylinder body; the filtering mechanism is mounted in the cylinder body; the shaking mechanism is mounted on the filtering mechanism and used for shaking the PCB in the backwashing process to avoid adhesion of ink impurities; and the flushing mechanism is mounted on the cylinder body and is used for flushing the PCB after soaking is finished. According to the invention, a solution in the inner cavity of the cylinder body is filtered every time a PCB is put in, so that the situation that impurities possibly exist in the solution all the time due to circulating filtration, the PCB is in contact with a dirty solution, the backwashing effect is influenced, and the use performance of a semiconductor device is influenced is avoided, and a second filter cotton core plate is driven to shake during lifting, so that the service life of the semiconductor device is prolonged. The self-cleaning of the filter cotton core plate II is realized, and the condition that the filter cotton core plate II is blocked is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a solder resist ink backwashing device. Background Art

[0002] Semiconductor devices such as transistors and integrated circuits need to be mounted on a PCB (Printed Circuit Board) through metal circuits. The PCB provides mechanical support and heat dissipation paths for the devices. During the manufacturing process, the PCB needs to be soldered, which means that the copper circuit surface of the PCB is covered with insulating ink on one side to increase the service life of the PCB. However, during the soldering process, there may be problems such as poor ink curing and incomplete development. Therefore, a soldering ink backwash device is needed to clean the ink on the PCB. The prepared solution is poured into the backwash device and the temperature of the solution is controlled. Then the PCB is placed in the backwash device and the solution is used to separate the PCB.

[0003] Chinese utility model publication number CN207427586U discloses a solder mask backwashing device comprising: a cylinder, an ultrasonic generator, a fixed filter, a controllable separation filter, a heating pipe, and a liquid pumping and circulating device. The cylinder is provided with a backwash tank; the heating pipe is located at the bottom of the cylinder; the fixed filter is located in the backwash tank adjacent to the bottom of the cylinder; and the controllable separation filter is located in the backwash tank adjacent to the top of the cylinder. The prior art improves and optimizes the backwashing device by addressing the problem of backwashing obstruction in plugged plate parts, ultimately achieving clean backwashing of this type of product, ensuring quality and reducing scrap costs.

[0004] However, in the above-mentioned prior art, the liquid in the backwash device is filtered in a circulating manner, which makes it impossible to completely filter the liquid in the backwash device at one time. As a result, some ink impurities will always remain in the liquid in the backwash device. It cannot be guaranteed that the PCB is always in contact with clean liquid, which may cause some ink impurities to remain on the PCB, thereby affecting the performance of the semiconductor device. Summary of the Invention

[0005] The present invention aims to solve the problems existing in the background technology and propose a solder resist ink backwashing device.

[0006] The technical solution of the present invention is: a solder resist ink backwashing device, comprising a cylinder, a temperature control mechanism and a drive mechanism, wherein the drive mechanism is mounted outside the cylinder; the temperature control mechanism is mounted at the bottom of the cylinder; and further comprising:

[0007] A filtering mechanism is installed in the cylinder;

[0008] A shaking mechanism, which is installed on the filter mechanism and is used to shake the PCB during the backwash process to prevent ink impurities from sticking;

[0009] A flushing mechanism, which is mounted on the cylinder body and is used to flush the PCB after soaking;

[0010] The filtering mechanism includes a fine filter component, a groove one, a coarse filter component, a knocking component and a soft block two; the fine filter component is connected to the movable end of the driving mechanism, and the fine filter component is slidably arranged in the cylinder body; the fixed end of the coarse filter component is installed on the lower end surface of the fine filter component; the soft block two is installed on the coarse filter component, and the knocking component is slidably connected in the fine filter component, and is used to slide and knock the soft block two when the fine filter component is raised or lowered; the groove one is opened in the cylinder body, and the movable end of the knocking component slides in the groove one; the fine filter component moves downward in the cylinder body and cooperates with the coarse filter component to filter the solution in the cylinder body, so that the PCB contacts the clean solution, and drives the soft block two to move through the knocking component, so that the coarse filter component vibrates, and the ink impurities on its surface fall off.

[0011] Preferably, the fine filter assembly includes a lifting plate and a filter cotton core plate;

[0012] The lifting plate is connected to the driving mechanism, the edge of the lifting plate is in close contact with the cylinder body and sealed, and the filter cotton core plate is installed in the lifting plate.

[0013] Preferably, the coarse filter assembly includes an elastic member and a filter cotton core plate;

[0014] The elastic member is installed on the lower end surface of the lifting plate; there are multiple elastic members, and the filter cotton core plate 2 is installed between the multiple elastic members. The filter cotton core plate 2 is attached to the lower end surface of the filter cotton core plate 1; the filter aperture of the filter cotton core plate 1 is 3μm, and the filter aperture of the filter cotton core plate 2 is 50μm.

[0015] Preferably, the knocking assembly includes a second groove, a rectangular block, a first soft block and a sealing wheel;

[0016] Groove 2 is opened on the side of the lifting plate; the rectangular block is slidably arranged in groove 2, the rectangular block passes through groove 2 and soft block 1 is installed, the sealing wheel slides in groove 1 and is rotatably connected with the rectangular block; when lifting, the sealing wheel moves along groove 1, causing the rectangular block to move along groove 2, and soft block 1 pushes soft block 2 to move.

[0017] Preferably, the rocking mechanism includes a guide frame, a guide rod, a rocking frame, a walking rod and a clamping member;

[0018] The guide frame is mounted on the lifting plate;

[0019] The guide rod slides in the guide frame, the guide rod is installed on the rocking frame, the walking rod slides in the groove and is connected to the rocking frame, and the clamping piece is installed in the rocking frame; when lifting, the walking rod moves along the groove, driving the rocking frame and the clamping piece to rock, so that the ink on the PCB falls off.

[0020] Preferably, the flushing mechanism includes a piston cylinder, a liquid inlet pipe, a spring, a piston plate, a lifting assembly and a flushing assembly;

[0021] The piston barrel is installed outside the cylinder body;

[0022] The fixed end of spring one is connected to the piston cylinder, and its movable end is connected to the piston plate. The piston plate is slidably connected to the piston cylinder. The liquid inlet pipe is installed on the piston cylinder, and the piston cylinder is connected to the cylinder body through the liquid inlet pipe; the two ends of the lifting assembly away from the cylinder body are connected to the piston plate; the liquid inlet end of the flushing assembly is connected to the piston cylinder, and its liquid outlet end is located on the cylinder body; the lifting plate drives the piston plate to descend in the inner cavity of the piston cylinder through the lifting assembly, and negative pressure is generated in the piston cylinder, and the clean solution is drawn into the piston cylinder through the liquid inlet pipe. After the PCB is soaked, the solution is sprayed from the flushing assembly to the PCB.

[0023] Preferably, the lifting assembly includes a second rod, a third rod, a first circular plate, and a second circular plate;

[0024] The two ends of the second rod away from the cylinder body are respectively connected to the piston plates;

[0025] Rod three is installed on rod two, and rod three is located in the cylinder body; circular plate one and circular plate two are installed on rod three, and the lifting plate is sleeved on rod three and located between circular plate one and circular plate two.

[0026] Preferably, the flushing assembly includes a liquid outlet pipe, a flushing member and a tapered portion;

[0027] The liquid outlet pipe is connected to the upper end of the piston cylinder, and the liquid outlet pipe is connected to the flushing part. There are multiple flushing parts and clamping parts, and the multiple flushing parts are respectively located between the multiple clamping parts. When the lifting plate rises, the solution entering the inner cavity of the piston cylinder is sprayed to the surface of the PCB through the liquid outlet pipe and the flushing part to flush it.

[0028] Preferably, it further comprises a tapered portion, which is mounted on the cylinder body, wherein the height of the connection between the liquid inlet pipe and the cylinder body is lower than the tapered portion, and the height of the second circular plate is lower than the liquid inlet pipe; in the initial state, the liquid level line in the inner cavity of the cylinder body is located below the tapered portion; and the upper end surfaces of the lifting plate and the first filter cotton core plate are both inclined toward the direction of the tapered portion;

[0029] The lifting plate descends over the liquid inlet pipe, driving the circular plate 2 to descend. The clean solution enters the piston cylinder from the liquid inlet pipe. When the lifting plate rises, the piston cylinder cavity is already filled with solution, and the elasticity of the liquid inlet pipe cannot reset the piston plate. The lifting plate rises to lift the circular plate 1, thereby spraying the solution in the piston cylinder cavity from the flushing part.

[0030] Compared with the prior art, the above technical solution of the present invention has the following beneficial technical effects:

[0031] The PCB is placed on the clamping part, and the driving device is started to drive the lifting plate to descend in the inner cavity of the cylinder. First, the solution is coarsely filtered through the filter cotton core plate 2, and then filtered twice through the filter cotton core plate 1. The filtered solution is located above the inner cavity of the cylinder to soak the PCB. After the soaking is completed, the driving device drives the lifting plate to rise, and moves along the groove 1 through the sealing wheel, thereby driving the soft block 1 to push the soft block 2 to move a distance. After that, the soft block 1 and the soft block 2 are staggered, and the elastic part drives the filter cotton core plate 2 to shake, and the larger ink particles and impurities on the filter cotton core plate 2 are shaken off, thereby realizing the filtration of the solution in the inner cavity of the cylinder each time the PCB is placed, thereby avoiding the impurities that may always exist in the solution due to circular filtration, causing the PCB to contact with the dirtier solution, affecting the backwash effect, and thus affecting the performance of the semiconductor device, and during the lifting, the filter cotton core plate 2 is driven to shake, thereby realizing the self-cleaning of the filter cotton core plate 2 and avoiding the blockage of the filter cotton core plate 2.

[0032] During the lifting process of the lifting plate, the walking rod moves along the groove, thereby driving the shaking frame to shake back and forth along the guide frame, and then driving the PCB in the clamping part to shake, thereby shaking off the ink impurities remaining on the PCB into the solution, avoiding residual ink on the PCB.

[0033] And in the process of the lifting plate descending, it drives the circular plate 2 to descend, thereby driving the piston plate to descend in the inner cavity of the piston cylinder, and draws the clean solution in the inner cavity of the cylinder into the inner cavity of the piston cylinder through the liquid inlet pipe. When the lifting plate rises, it drives the piston plate to squeeze the solution in the inner cavity of the piston cylinder into the liquid outlet pipe, and flushes it from the flushing part to the PCB along the liquid outlet pipe, thereby flushing the ink in some micropores on the PCB board to ensure that the ink will not remain, thereby not affecting the performance of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the structure of the present invention;

[0035] Figure 2 It is a structural schematic diagram of the cylinder body proposed by the present invention;

[0036] Figure 3 This is a schematic diagram of the connection between the rod 3, plate 1 and plate 2 proposed by the present invention;

[0037] Figure 4 For the present invention Figure 3 A in the middle is an enlarged schematic diagram;

[0038] Figure 5 This is a schematic structural diagram of the slot 1, the walking rod and the sealing wheel proposed in the present invention;

[0039] Figure 6 This is a schematic structural diagram of the elastic member and the filter cotton core plate 2 proposed by the present invention;

[0040] Figure 7 For the present invention Figure 6 The enlarged schematic diagram of point B in the middle;

[0041] Figure 8 This is a schematic structural diagram of the lifting plate and the tapered portion proposed in the present invention.

[0042] Figure numerals: 1. cylinder body; 2. driving device; 3. rod 1; 4. lifting plate; 5. filter cotton core plate 1; 6. filter cotton core plate 2; 7. groove 1; 8. guide frame; 9. guide rod; 10. rocking frame; 11. walking rod; 12. groove 2; 13. rectangular block; 14. soft block 1; 15. soft block 2; 16. sealing wheel; 17. piston cylinder; 18. liquid inlet pipe; 19. spring 1; 20. piston plate; 21. rod 2; 22. rod 3; 23. circular plate 1; 24. circular plate 2; 25. elastic part; 26. liquid outlet pipe; 27. flushing part; 28. conical part; 29. heating device; 30. clamping part; 31. control valve; 32. heat pipe. DETAILED DESCRIPTION

[0043] Example 1, as Figures 1-8 As shown, the present invention proposes a solder resist ink backwashing device, which includes a cylinder 1, a filtering mechanism, a shaking mechanism, a flushing mechanism, a temperature control mechanism and a driving mechanism. The driving mechanism is installed outside the cylinder 1; the temperature control mechanism is installed at the bottom of the cylinder 1; and further includes:

[0044] The filter mechanism is installed in the cylinder 1;

[0045] The shaking mechanism is installed on the filter mechanism to shake the PCB during the backwash process to prevent ink impurities from sticking;

[0046] The flushing mechanism is mounted on the cylinder 1 and is used to flush the PCB after soaking.

[0047] The temperature control mechanism includes a heating device 29, which is installed on the outside of the cylinder body 1. A heat pipe 32 is provided at one end of the heating device 29 located in the inner cavity of the cylinder body 1. The prepared solution is added to the inner cavity of the cylinder body 1, and the heating device 29 and the heat pipe 32 are started. The solution in the inner cavity of the cylinder body 1 is heated by the heat pipe 32, and the solution is kept at a suitable temperature to ensure that the solution can effectively remove the ink on the PCB.

[0048] A control valve 31 is installed at the bottom end of the cylinder body 1. When the solution in the inner cavity of the cylinder body 1 has been used for a long time, the solution in the inner cavity of the cylinder body 1 can be discharged through the control valve 31 for complete replacement.

[0049] The driving mechanism includes a driving device 2, which is installed on the outside of the cylinder body 1. The driving device 2 is transmission-connected to a rod 3, and the bottom end of the middle part of the rod 3 is fixedly connected to the lifting plate 4.

[0050] The filtering mechanism includes a fine filter component, a groove 7, a coarse filter component, a knocking component and a soft block 2 15; the fine filter component is connected to the movable end of the driving mechanism, and the fine filter component is slidably arranged in the cylinder body 1; the fixed end of the coarse filter component is installed on the lower end surface of the fine filter component; the soft block 2 15 is installed on the coarse filter component, and the knocking component is slidably connected in the fine filter component, and is used to slide and knock the soft block 2 15 when the fine filter component is raised or lowered; the groove 1 7 is opened in the cylinder body 1, and the groove 1 7 is S-shaped, and the movable end of the knocking component slides in the groove 1 7; the fine filter component moves downward in the cylinder body 1, and cooperates with the coarse filter component to filter the solution in the cylinder body 1, so that the PCB contacts the clean solution, and drives the soft block 2 15 to move through the knocking component, so that the coarse filter component vibrates, so that the ink impurities on its surface fall off into the solution.

[0051] Preferably, the fine filter assembly includes a lifting plate 4 and a filter cotton core plate 5;

[0052] The lifting plate 4 is connected to the driving mechanism, the edge of the lifting plate 4 is sealed with the cylinder body 1, and the filter cotton core plate 5 is installed in the lifting plate 4.

[0053] The coarse filter assembly includes an elastic member 25 and a filter cotton core plate 6;

[0054] The elastic member 25 is installed on the lower end surface of the lifting plate 4; there are multiple elastic members 25, and the filter cotton core plate 2 6 is installed between the multiple elastic members 25. The filter cotton core plate 2 6 is attached to the lower end surface of the filter cotton core plate 1 5; the filter cotton core plate 1 5 has a filtration pore size of 30 μm, and the filter cotton core plate 2 6 has a filtration pore size of 50 μm, so that the combination of the filter cotton core plate 1 5 and the filter cotton core plate 2 6 can filter ink impurities.

[0055] The knocking assembly includes a second groove 12, a rectangular block 13, a soft block 14 and a sealing wheel 16;

[0056] Groove 2 12 is provided on the side of the lifting plate 4; the rectangular block 13 is slidably arranged in groove 2 12, and the rectangular block 13 passes through groove 2 12 to install the soft block 14, and the sealing wheel 16 slides in groove 1 7 and is rotatably connected with the rectangular block 13; when the lifting plate 4 is lifted or lowered, the sealing wheel 16 is driven to move along groove 1 7, so that the rectangular block 13 moves along groove 2 12, and the soft block 14 pushes the soft block 2 15 to move a certain distance, so that the multiple elastic members 25 are stretched or contracted, but because the soft block 14 and the soft block 2 15 are both soft, after the soft block 14 drives the soft block 2 15 to move a certain distance, the two will be staggered. At this time, after the soft block 2 15 loses the push of the soft block 14, it is elastically reset and vibrates back and forth through the elasticity of the elastic member 25, thereby driving the filter cotton core plate 2 6 to shake, and shaking off the ink impurities on the filter cotton core plate 2 6.

[0057] In the process of descending, the sealing wheel 16 is in contact with the inner wall of the groove 7, thereby preventing the solution below the filter cotton core plate 2 6 from entering the top of the filter cotton core plate 1 5 and the filter cotton core plate 2 6 through the groove 7.

[0058] Example 2, as Figure 1-Figure 7 As shown, the solder resist ink backwashing device proposed by the present invention, compared with the first embodiment, the shaking mechanism of this embodiment includes a guide frame 8, a guide rod 9, a shaking frame 10, a walking rod 11 and a clamping member 30;

[0059] The guide frame 8 is mounted on the lifting plate 4;

[0060] The guide rod 9 slides in the guide frame 8, the guide rod 9 is installed on the rocking frame 10, the walking rod 11 slides in the groove 7 and is connected to the rocking frame 10, and the clamping piece 30 is installed in the rocking frame 10; when lifting, the walking rod 11 moves along the groove 7, so that the guide rod 9 on the rocking frame 10 moves back and forth in the inner cavity of the guide frame 8, thereby driving the rocking frame 10 and the clamping piece 30 to rock, so that the ink on the PCB falls off.

[0061] Example 3, as Figures 1-8 As shown, the solder resist ink backwashing device proposed by the present invention, compared with the second embodiment, the flushing mechanism in this embodiment includes a piston cylinder 17, a liquid inlet pipe 18, a spring 19, a piston plate 20, a lifting assembly and a flushing assembly;

[0062] The piston cylinder 17 is installed outside the cylinder body 1;

[0063] The fixed end of spring 19 is connected to the piston cylinder 17, and its movable end is connected to the piston plate 20. The piston plate 20 is slidably connected to the piston cylinder 17. The liquid inlet pipe 18 is installed on the piston cylinder 17, and the piston cylinder 17 is connected to the cylinder body 1 through the liquid inlet pipe 18; the two ends of the lifting assembly away from the cylinder body 1 are connected to the piston plate 20; the liquid inlet end of the flushing assembly is connected to the piston cylinder 17, and the liquid outlet end is located on the cylinder body 1; the lifting plate 4 drives the piston plate 20 to descend in the inner cavity of the piston cylinder 17 through the lifting assembly, and a negative pressure is generated in the piston cylinder 17, and the clean solution is drawn into the piston cylinder 17 through the liquid inlet pipe 18. After the PCB is soaked, the solution is sprayed from the flushing assembly to the PCB to remove the ink at the micropores of the PCB.

[0064] The lifting assembly includes a second rod 21, a third rod 22, a first circular plate 23 and a second circular plate 24;

[0065] The two ends of the rod 21 away from the cylinder body 1 are respectively connected to the piston plate 20;

[0066] Rod three 22 is installed on rod two 21, and rod three 22 is located in cylinder body 1; circular plate one 23 and circular plate two 24 are installed on rod three 22, and lifting plate 4 is sleeved on rod three 22 and located between circular plate one 23 and circular plate two 24.

[0067] The flushing assembly includes a liquid outlet pipe 26, a flushing member 27 and a tapered portion 28;

[0068] The liquid outlet pipe 26 is connected to the upper end of the piston cylinder 17, and the liquid outlet pipe 26 is connected to the flushing part 27. There are multiple flushing parts 27 and clamping parts 30, and the multiple flushing parts 27 are respectively located between the multiple clamping parts 30; when the lifting plate 4 rises, the solution entering the inner cavity of the piston cylinder 17 is sprayed onto the surface of the PCB through the liquid outlet pipe 26 and the flushing part 27 to flush it.

[0069] The liquid inlet pipe 18 and the liquid outlet pipe 26 are both composed of a one-way valve and a pipeline. The one-way valve is installed on the pipeline. The solution in the inner cavity of the cylinder body 1 enters the inner cavity of the piston cylinder 17 from the liquid inlet pipe 18, and the solution in the inner cavity of the piston cylinder 17 cannot be discharged from the liquid inlet pipe 18; the solution in the inner cavity of the piston cylinder 17 is discharged from the liquid outlet pipe 26, and external substances cannot enter the piston cylinder 17 from the liquid outlet pipe 26.

[0070] It also includes a tapered portion 28, which is mounted on the cylinder body 1. The height of the connection between the liquid inlet pipe 18 and the cylinder body 1 is lower than the tapered portion 28, and the height of the circular plate 24 is lower than the liquid inlet pipe 18. In the initial state, the liquid level line in the inner cavity of the cylinder body 1 is located below the tapered portion 28. The upper end surfaces of the lifting plate 4 and the filter cotton core plate 1 5 are both inclined toward the tapered portion 28.

[0071] The lifting plate 4 will drive the circular plate 2 24 to descend only after it descends and passes over the liquid inlet pipe 18. At this time, the solution located at the liquid inlet pipe 18 is a clean solution filtered by the filter cotton core plate 2 6 and the filter cotton core plate 1 5. The clean solution enters the piston cylinder 17 from the liquid inlet pipe 18. When the lifting plate 4 rises, since the inner cavity of the piston cylinder 17 is already filled with solution, the elasticity of the liquid inlet pipe 18 is relatively small, and therefore the piston plate 20 cannot be reset. The lifting plate 4 rises to lift the circular plate 1 23, thereby spraying the solution in the inner cavity of the piston cylinder 17 from the flushing part 27 to the surface of the PCB.

[0072] The flushing member 27 is composed of a flushing pipe and a nozzle, wherein the nozzle is mounted on the flushing pipe.

[0073] In summary, in the present invention, when used for the first time, the prepared solution is added to the inner cavity of the cylinder 1, and then the solution is heated by the heating device 29 and the heat pipe 32, and the solution is always kept at a suitable temperature.

[0074] Then, the PCB with the semiconductor device installed and ready for backwashing is placed in the clamping member 30, and the PCB is clamped and fixed by the clamping member 30. Then, the driving device 2 is started to drive the lifting plate 4 at the bottom end of the rod 1 3 to descend, thereby driving the filter cotton core plate 1 5 and the filter cotton core plate 2 6 to move downward, filtering the ink impurities in the solution in the inner cavity of the cylinder 1. The solution passes through the filter cotton core plate 1 5 and the filter cotton core plate 2 6 and is located above the filter cotton core plate 1 5 and the filter cotton core plate 2 6 to contact the PCB, thereby realizing the filtration of the solution in the inner cavity of the cylinder 1 before each backwash of the PCB, avoiding the presence of some ink impurities in the solution due to circulating filtration, and eliminating the need for frequent replacement of the solution.

[0075] When the lifting plate 4 descends over the liquid inlet pipe 18 and contacts the circular plate 2 24, it pulls the circular plate 24 downward, and then drives the rod 3 22 downward. The rod 3 22 then drives the piston plate 20 at the bottom end of the rod 2 21 to descend in the inner cavity of the piston cylinder 17, thereby extracting the filtered solution in the inner cavity of the cylinder body 1 into the inner cavity of the piston cylinder 17 through the liquid inlet pipe 18 and remaining above the piston plate 20 in the inner cavity of the piston cylinder 17.

[0076] Then the PCB is soaked to remove ink impurities on the PCB surface;

[0077] Then the driving device 2 is started to drive the lifting plate 4 at the bottom end of the rod 3 to rise. During the rising process of the lifting plate 4, the walking rod 11 and the sealing wheel 16 travel in the inner cavity of the groove 1 7. The sealing wheel 16 drives the rectangular block 13 to move back and forth in the inner cavity of the groove 2 12, thereby driving the soft block 14 to move back and forth, so that the soft block 14 pushes the soft block 2 15 to move a distance. At this time, the soft block 2 15 drives the filter cotton core plate 2 6 to move. Since the soft block 14 and the soft block 2 15 are both made of soft materials, after the soft block 14 and the soft block 2 15 are staggered, the elasticity of the elastic member 25 drives the filter cotton core plate 2 6 to vibrate back and forth, thereby shaking off the larger ink particles adsorbed on the filter cotton core plate 2 6, thereby avoiding the blockage of the filter cotton core plate 2 6 during use.

[0078] When the walking rod 11 moves in the inner cavity of the slot 7, it drives the shaking frame 10 to move back and forth, and positions and guides the guide rod 9 through the guide frame 8, thereby positioning and guiding the shaking frame 10, so that the shaking frame 10 can move back and forth stably, and then the shaking frame 10 drives the PCB in the clamping part 30 to shake, thereby shaking off the ink impurities remaining on the surface of the PCB and nearby, and preventing them from being adsorbed on the surface of the PCB.

[0079] During the rising process, the lifting plate 4 contacts the circular plate 1 23 and lifts the circular plate 1 23 upward, thereby driving the piston plate 20 at the bottom end of the rod 21 to move upward in the inner cavity of the piston cylinder 17, thereby squeezing the solution in the inner cavity of the piston cylinder 17 along the liquid outlet pipe 26 to the flushing part 27, and then flushing it to the surface of the PCB through the flushing part 27. As the lifting plate 4 drives the PCB to gradually rise, the flushing part 27 flushes the PCB from top to bottom, thereby flushing some micropores of the PCB to avoid residual ink impurities in the micropores.

[0080] When the lifting plate 4 rises to the conical portion 28, the flushing solution of the flushing member 27 falls above the filter cotton core plate 5, thereby flushing the ink impurities above the filter cotton core plate 5 to the conical portion 28, and then returning to the inner cavity of the cylinder body 1 along the conical portion 28.

[0081] When the solution in the inner cavity of the cylinder 1 has been used for a long time, the control valve 31 can be activated to drain the solution in the inner cavity of the cylinder 1 .

[0082] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A solder resist ink backwashing device, comprising a cylinder (1), a temperature control mechanism and a drive mechanism, wherein the drive mechanism is mounted outside the cylinder (1); the temperature control mechanism is mounted at the bottom of the cylinder (1); and the device is characterized in that: Also includes: A filtering mechanism installed in the cylinder (1); A shaking mechanism, which is installed on the filter mechanism and is used to shake the PCB during the backwash process to prevent ink impurities from sticking; A flushing mechanism, which is mounted on the cylinder (1) and is used to flush the PCB after soaking; The filtering mechanism comprises a fine filter assembly, a first groove (7), a coarse filter assembly, a knocking assembly and a second soft block (15); the fine filter assembly is connected to the movable end of the driving mechanism, and the fine filter assembly is slidably arranged in the cylinder body (1); the fixed end of the coarse filter assembly is installed on the lower end surface of the fine filter assembly; the second soft block (15) is installed on the coarse filter assembly, and the knocking assembly is slidably connected in the fine filter assembly and is used for sliding and knocking the second soft block (15) when the fine filter assembly is raised or lowered; the first groove (7) is provided in the cylinder body (1), and the movable end of the knocking assembly slides in the first groove (7); the fine filter assembly moves downward in the cylinder body (1) and cooperates with the coarse filter assembly to filter the solution in the cylinder body (1), so that the PCB contacts the clean solution, and drives the second soft block (15) to move through the knocking assembly, so that the coarse filter assembly vibrates and ink impurities on its surface fall off.

2. A solder resist ink backwashing device according to claim 1, characterized in that: The fine filter assembly includes a lifting plate (4) and a filter cotton core plate (5); The lifting plate (4) is connected to the driving mechanism, the edge of the lifting plate (4) is in close contact with the cylinder body (1) and sealed, and the filter cotton core plate (5) is installed in the lifting plate (4).

3. A solder resist ink backwashing device according to claim 2, characterized in that: The coarse filter assembly includes an elastic member (25) and a second filter cotton core plate (6); The elastic member (25) is mounted on the lower end surface of the lifting plate (4); a plurality of elastic members (25) are provided, and the second filter cotton core plate (6) is mounted between the plurality of elastic members (25), and the second filter cotton core plate (6) is attached to the lower end surface of the first filter cotton core plate (5); the filter aperture of the first filter cotton core plate (5) is 30 μm, and the filter aperture of the second filter cotton core plate (6) is 50 μm.

4. A solder resist ink backwashing device according to claim 3, characterized in that: The knocking assembly includes a second groove (12), a rectangular block (13), a soft block (14) and a sealing wheel (16); The second groove (12) is provided on the side of the lifting plate (4); the rectangular block (13) is slidably arranged in the second groove (12); the rectangular block (13) penetrates the second groove (12) and is installed with the first soft block (14); the sealing wheel (16) slides in the first groove (7) and is rotatably connected to the rectangular block (13); when lifting, the sealing wheel (16) moves along the first groove (7), so that the rectangular block (13) moves along the second groove (12), and the first soft block (14) pushes the second soft block (15) to move.

5. A solder resist ink cleaning device according to claim 4, characterized in that: The rocking mechanism comprises a guide frame (8), a guide rod (9), a rocking frame (10), a walking rod (11) and a clamping member (30); The guide frame (8) is mounted on the lifting plate (4); The guide rod (9) slides in the guide frame (8), the guide rod (9) is installed on the shaking frame (10), the walking rod (11) slides in the groove (7) and is connected to the shaking frame (10), and the clamping member (30) is installed in the shaking frame (10); when lifting, the walking rod (11) moves along the groove (7), driving the shaking frame (10) and the clamping member (30) to shake, so that the ink on the PCB falls off.

6. A solder resist ink cleaning device according to claim 5, characterized in that: The flushing mechanism comprises a piston cylinder (17), a liquid inlet pipe (18), a spring (19), a piston plate (20), a lifting assembly and a flushing assembly; The piston cylinder (17) is installed outside the cylinder body (1); The fixed end of the spring 1 (19) is connected to the piston cylinder (17), and the movable end thereof is connected to the piston plate (20). The piston plate (20) is slidably connected in the piston cylinder (17). The liquid inlet pipe (18) is installed on the piston cylinder (17). The piston cylinder (17) is connected to the cylinder body (1) through the liquid inlet pipe (18); the two ends of the lifting assembly away from the cylinder body (1) are connected to the piston plate (20); the liquid inlet end of the flushing assembly is connected to the piston cylinder (17), and the liquid outlet end thereof is located on the cylinder body (1); the lifting plate (4) drives the piston plate (20) to descend in the inner cavity of the piston cylinder (17) through the lifting assembly, and negative pressure is generated in the piston cylinder (17), and clean solution is drawn into the piston cylinder (17) through the liquid inlet pipe (18). After the PCB is soaked, the solution is sprayed from the flushing assembly to the PCB.

7. A solder resist ink backwashing device according to claim 6, characterized in that: The lifting assembly includes a second rod (21), a third rod (22), a first circular plate (23) and a second circular plate (24); The two ends of the second rod (21) away from the cylinder body (1) are respectively connected to the piston plate (20); Rod three (22) is mounted on rod two (21), and rod three (22) is located in the cylinder body (1); circular plate one (23) and circular plate two (24) are mounted on rod three (22), and a lifting plate (4) is sleeved on rod three (22) and located between circular plate one (23) and circular plate two (24).

8. The solder resist ink cleaning device according to claim 7, characterized in that: The flushing assembly includes a liquid outlet pipe (26), a flushing member (27) and a tapered portion (28); The liquid outlet pipe (26) is connected to the upper end of the piston cylinder (17), and the liquid outlet pipe (26) is connected to the flushing member (27). A plurality of flushing members (27) and a plurality of clamping members (30) are provided, and the plurality of flushing members (27) are respectively located between the plurality of clamping members (30). When the lifting plate (4) rises, the solution entering the inner cavity of the piston cylinder (17) is sprayed onto the surface of the PCB through the liquid outlet pipe (26) and the flushing member (27) to flush the PCB.

9. A solder resist ink backwashing device according to claim 8, characterized in that: The invention also includes a conical portion (28), which is mounted on the cylinder body (1); the height of the connection between the liquid inlet pipe (18) and the cylinder body (1) is lower than the conical portion (28); and the height of the second plate (24) is lower than the liquid inlet pipe (18); in the initial state, the liquid level line of the inner cavity of the cylinder body (1) is located below the conical portion (28); and the upper end surfaces of the lifting plate (4) and the filter cotton core plate (5) are inclined toward the conical portion (28); The lifting plate (4) descends over the liquid inlet pipe (18) and drives the circular plate 2 (24) to descend. Clean solution enters the piston cylinder (17) from the liquid inlet pipe (18). When the lifting plate (4) rises, since the inner cavity of the piston cylinder (17) is already filled with solution, the elasticity of the liquid inlet pipe (18) cannot reset the piston plate (20). The lifting plate (4) rises and lifts the plate 1 (23), thereby spraying the solution in the inner cavity of the piston cylinder (17) from the flushing member (27).

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