Thermoelectric cooling phase change heat dissipation system of vapor chamber

Abstract

The invention relates to the technical field of heat dissipation systems, in particular to a vapor chamber thermoelectric cooling phase change heat dissipation system. The closed space of the vapor chamber quickly absorbs the heat of the chip through phase change heat transfer, the cold end of the TEC refrigeration sheet is directly attached to the vapor chamber substrate, the cooling capacity of a local area is actively enhanced, the traditional liquid cooling heat resistance bottleneck is broken through, the liquid cooling plate efficiently transfers a large amount of heat accumulated at the hot end of the TEC refrigeration sheet, and after the three parts are fixed and integrated, the heat dissipation efficiency is improved. Not only is hyperconventional temperature control realized through active refrigeration of the TEC refrigeration sheet, especially for transient high-heat loads such as a vehicle-mounted domain controller, but also the heat dissipation coverage range of the single TEC refrigeration sheet is expanded by utilizing the soaking characteristic of a closed space serving as a phase change cavity in the temperature-uniforming plate, and meanwhile, the modular design greatly compresses the volume of the system, reduces a welding sealing surface, and improves the reliability of the system. The leakage risk and the material cost are reduced; the technical problems that an existing liquid cooling plate is low in heat dissipation efficiency, high in cost and prone to leakage are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation systems, and in particular to a phase-change heat dissipation system with thermoelectric cooling using a vapor chamber. Background Art

[0002] As the performance of in-vehicle domain controllers continues to improve, the power of single chips also increases accordingly, and heat dissipation issues have gradually become a focus of attention. Traditional heat dissipation methods usually use an entire liquid cooling plate as the heat dissipation system, that is, all chips are arranged on a liquid cooling plate. Although this method can alleviate the heat dissipation problem to a certain extent, it is limited by the inherent limitations of liquid cooling technology. Its heat dissipation efficiency is not sufficient to cope with the increasing chip power. In addition, because the internal cavity of the liquid cooling plate is formed by fixing and sealing multiple plates through methods such as welding, the larger cavity increases the risk of liquid leakage and there is a problem of insufficient space utilization, resulting in relatively high costs. Summary of the Invention

[0003] In view of the shortcomings of the existing technology, the present invention provides a temperature vapor chamber thermoelectric cooling phase change heat dissipation system, which solves the technical problems of low heat dissipation efficiency, high cost and easy leakage of existing liquid cooling plates.

[0004] To solve the above technical problems, the present invention provides the following technical solutions: a vapor chamber thermoelectric cooling phase change heat dissipation system, the heat dissipation system comprising: A temperature vapor chamber for mounting chips, the temperature vapor chamber comprising a substrate as a mounting carrier, a closed space for liquid phase change conversion provided within the substrate, and a plurality of heat dissipation bosses for mounting chips provided on one side of the substrate, the projections of the heat dissipation bosses on the substrate being located within the area enclosed by the projections of the closed space on the substrate; A TEC cooling sheet is arranged on a side of the substrate away from the heat dissipation boss and corresponding to the position of the enclosed space, and the cold end of the TEC cooling sheet is in contact with the surface of the substrate; A liquid cooling plate is installed at the hot end of the TEC cooling plate for cooling through fluid heat exchange. The inner cavity of the liquid cooling plate is connected to the external pipeline, and the temperature distribution plate, TEC cooling plate and liquid cooling plate are relatively fixed.

[0005] Preferably, a groove is provided at the center of the substrate, and a cooling plate boss is provided at the cold end of the TEC cooling plate, which is in contact with the inner wall of the groove.

[0006] Preferably, the enclosed space is provided with several groups of fan blade assemblies for forming vortexes at its center position, the positions of the several groups of fan blade assemblies respectively correspond to the positions of several heat dissipation bosses, and also includes guide columns connecting the upper and lower inner walls of the enclosed space.

[0007] Preferably, the fan blade assembly includes a plurality of fan blade bodies arranged in an array around a center position thereof, and the extension direction of the fan blade bodies on the mounting surface of the fan blade assembly is staggered with the center position of the fan blade assembly.

[0008] Preferably, the side of the fan blade body away from the heat dissipation boss is inclined toward the center of the fan blade assembly.

[0009] Preferably, a high-density area in which the density of guide columns is greater than that of other areas is provided in the enclosed space around the fan blade assembly.

[0010] Preferably, a fixing plate is provided on a side of the liquid cooling plate away from the TEC refrigeration plate, and a plurality of fasteners for fixing are provided between the fixing plate and the temperature uniformity plate.

[0011] By means of the above technical solution, the present invention provides a vapor chamber thermoelectric cooling phase change heat dissipation system, which has at least the following beneficial effects: 1. The enclosed space of the vapor chamber of the present invention utilizes phase change heat transfer to rapidly absorb heat from the chip. The cold end of the TEC cooling plate is directly attached to the vapor chamber substrate, actively enhancing local cooling capacity and breaking through the thermal resistance bottleneck of traditional liquid cooling. The liquid cold plate efficiently transfers the heat accumulated at the hot end of the TEC cooling plate. After the three are fixedly integrated, extraordinary temperature control is achieved through the active cooling of the TEC cooling plate, especially for transient high heat loads such as vehicle-mounted domain controllers. The vapor chamber also utilizes the heat-dissipating characteristics of the enclosed space of the phase change cavity to expand the heat dissipation coverage of a single TEC cooling plate. At the same time, the modular design significantly reduces the system volume, reduces the welding sealing surface, reduces the risk of leakage and material costs, and solves the problems of large volume and low space utilization of traditional liquid cold plates.

[0012] 2. The embedded fitting of the central groove of the substrate and the cold-end boss of the TEC refrigeration plate of the present invention shortens the local heat conduction path to the thickness of a single-layer substrate, significantly reducing the interface thermal resistance. This design enables the heat dissipation boss at the corresponding position to obtain super cooling capacity, and the highest-power chip can be arranged here to directly benefit from the extreme temperature control of the TEC refrigeration plate, while the other heat dissipation bosses achieve synergistic heat dissipation through the heat-averaging effect of the phase change cavity of the temperature spreader. Without increasing the number of TEC refrigeration plates, this structure realizes the targeted allocation of heat dissipation resources through physical space reconstruction, taking into account both system cost and overheating protection requirements of key chips, and is particularly suitable for application scenarios with differentiated power of multiple chips.

[0013] 3. The present invention forms a directional vortex at the corresponding position of the heat dissipation boss through the staggered arrangement of the inclined fan blade body, driving the condensed liquid to flow through the high-temperature area at high speed. The unique configuration of the fan blade body tilted toward the center not only guides the cold fluid to converge to form a vortex to flush the heat-absorbing surface, but also prevents the condensed liquid droplets from falling directly into the vortex core and interfering with the flow stability. This active turbulence mechanism significantly improves the liquid evaporation rate and vapor diffusion uniformity, and is more than 30% higher than the passive phase change efficiency of the traditional temperature dispersion plate. At the same time, the guide column ensures the orderly reflux of the condensate, forming a closed-loop phase change cycle, which effectively suppresses the risk of local drying and overheating.

[0014] 4. The high-density guide column area around the fan blade assembly of the present invention forms a "low-temperature liquid reservoir". The low-temperature condensate formed at the top of the cavity due to the action of the TEC refrigeration plate is quickly captured by the dense guide columns and guided to the middle area of the fan blade assembly. This design establishes a low-temperature fluid enrichment zone around the fan blade assembly, and produces a strong thermal siphon effect through the significant temperature difference between the high-temperature substrate, which drives the cold fluid to automatically flow into the vortex area of the fan blade assembly at high speed. This self-sustaining cycle not only reduces flow energy consumption, but also amplifies the fluid velocity through the temperature difference, thereby doubling the evaporation-condensation cycle rate. At the same time, the high-density guide columns enhance structural rigidity, suppress cavity deformation, and improve system reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 is a schematic diagram of the heat dissipation boss of the present invention; Figure 3 is a side view of the present invention; Figure 4 is a schematic diagram of the groove of the present invention; Figure 5 is a cross-sectional view of a temperature homogenizing plate of the present invention; Figure 6 Schematic diagram of the refrigeration fin boss of the present invention; Figure 7 is a schematic diagram of a fan blade assembly of the present invention; Figure 8 Schematic diagram of the liquid flow direction at the fan blade assembly of the present invention.

[0016] In the figure: 1. Temperature distribution plate; 11. Base plate; 12. Enclosed space; 13. Heat dissipation boss; 14. Groove; 2. TEC cooling plate; 3. Liquid cooling plate; 4. Cooling plate boss; 5. Fan blade assembly; 6. Guide column; 7. Fan blade body; 8. High-density area; 9. Fixing plate; 10. Fastener. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] In order to solve the technical problems of low heat dissipation efficiency, high cost and easy leakage of existing liquid cooling plates, this application provides a phase change heat dissipation system with thermoelectric cooling of a temperature vapor chamber, which can effectively solve the heat dissipation problem, reduce costs, and improve the reliability and compatibility of the system. Figures 1-6 As shown, the heat dissipation system includes a temperature distribution plate 1, a cooling plate 2 and a liquid cooling plate 3; The temperature equalizing plate 1 includes a substrate 11 as a mounting carrier, and a closed space 12 for liquid phase change conversion is provided in the substrate 11. Several heat dissipation bosses 13 for mounting chips are provided on one side of the substrate 11. The chip will generate a large amount of heat during operation, thereby exchanging heat with the heat dissipation bosses 13 and increasing the temperature of the heat dissipation bosses 13. The chip and the heat dissipation bosses 13 can be covered with heat-conducting material to improve the heat conduction efficiency between the chip and the heat dissipation bosses 13. The projection of the heat dissipation bosses 13 on the substrate 11 is located in the area surrounded by the projection of the closed space 12 on the substrate 11. When the temperature of the heat dissipation bosses 13 rises, the temperature of the closed space 12 and the position corresponding to the position of the heat dissipation bosses 13 on the substrate 11 will rise. At this time, the liquid in the closed space 12 evaporates under the action of the heat transmitted from the heat dissipation bosses 13. The evaporated gas will condense after reaching the position corresponding to the TEC refrigeration plate 2 on the substrate 11, so that the heat in the evaporated gas is taken away by the TEC refrigeration plate 2.

[0019] The TEC refrigeration sheet 2 is arranged on the side of the substrate 11 away from the heat dissipation boss 13 and corresponding to the position of the confined space 12. The cold end of the TEC refrigeration sheet 2 is in contact with the surface of the substrate 11, so that the temperature at the position of the substrate 11 corresponding to the cold end of the TEC refrigeration sheet 2 is lower, so as to cool the substrate 11, thereby taking away the heat transferred from the chip to the temperature equalizing plate 1. Compared with the method of using only water cooling for cooling, the cooling method using the TEC refrigeration sheet 2 has higher heat dissipation efficiency.

[0020] The liquid cooling plate 3 is arranged at the hot end of the TEC cooling sheet 2 and cools the TEC cooling sheet 2 by means of fluid heat exchange. Due to the principle of conservation of energy, the cold end temperature of the TEC cooling sheet 2 is low, which will make the hot end temperature of the TEC cooling sheet 2 relatively high. Therefore, in order to ensure the reduction of the hot end temperature of the TEC cooling sheet 2 and make it operate normally, the inner cavity of the liquid cooling plate 3 is connected with the external pipeline, and the temperature of the hot end of the TEC cooling sheet 2 is taken away by the flow of fluid. The temperature averaging plate 1, TEC cooling sheet 2 and liquid cooling plate 3 are relatively fixed, so that the temperature on the chip is quickly reduced through the mutual cooperation of the temperature averaging plate 1, TEC cooling sheet 2 and liquid cooling plate 3, ensuring that the chip can still operate under high power. The volume of the heat dissipation system is smaller than that of the prior art, and the chips required are integrated on different heat dissipation systems, that is, several chips are installed on each heat dissipation system, so that the volume of the modular structure can be smaller and more convenient to install. It can realize extraordinary temperature control through the active cooling of the TEC cooling plate 2, especially for transient high heat loads such as vehicle-mounted domain controllers, and use the heat dissipation characteristics of the enclosed space 12 of the temperature equalizing plate 1 as the phase change cavity to expand the heat dissipation coverage of the single TEC cooling plate 2. At the same time, the modular design greatly compresses the system volume, reduces the welding sealing surface, reduces the leakage risk and material cost, and solves the problems of large volume and low space utilization of traditional liquid cooling plates.

[0021] Although the TEC cooling sheet 2 has high heat dissipation efficiency, its volume is small, so the chip cannot be directly arranged on the TEC cooling sheet 2. Therefore, the present application uses the TEC cooling sheet 2 to cool the temperature averaging plate 1, and several chips are installed on the temperature averaging plate 1 to realize heat transfer, thereby realizing cooling of several chips through the TEC cooling sheet 2. In order to further improve the cooling effect of the TEC cooling sheet 2 on the chip, as shown in FIG. Figure 4 and Figure 6 As shown, a groove 14 is provided at the center of the substrate 11, and a cooling plate boss 4 is provided at the cold end of the TEC cooling plate 2, which is in contact with the inner wall of the groove 14, so that the position of the cooling plate boss 4 is only separated from the heat dissipation boss 13 for mounting the chip by one layer of substrate 11, so that a higher-power chip can be arranged on the heat dissipation boss 13 corresponding to the position of the cooling plate boss 4, so as to achieve more efficient heat dissipation of the chip here with the help of the TEC cooling plate 2, and the cooling of the heat dissipation boss 13 at other positions is achieved by heat exchange in the enclosed space 12.

[0022] The liquid in the enclosed space 12 is evaporated by absorbing the heat transmitted by the chip. In order to improve the heat exchange efficiency between the liquid and the heat on the substrate 11, as shown in FIG. Figure 5 and Figure 7As shown, several groups of fan blade assemblies 5 for forming vortices at the center position thereof are arranged in the confined space 12, and the positions of the several groups of fan blade assemblies 5 correspond to the positions of the several heat dissipation bosses 13, so that vortices are formed at the positions corresponding to the heat dissipation bosses 13 in the confined space 12 to improve the heat exchange efficiency between the fluid and the heat on the substrate 11. It also includes a guide column 6 connecting the upper and lower inner walls of the confined space 12 to allow the condensed liquid on the inner wall on one side of the confined space 12 close to the TEC refrigeration plate 2 to flow back to the other side.

[0023] There are many structures for forming vortexes. The following provides a structure of the fan blade assembly 5 suitable for this application, including a plurality of fan blade bodies 7 arranged in an array around the center position of the fan blade assembly 5. The condensed reflux liquid with a lower temperature will flow into the center position of the fan blade assembly 5 along the gap between the two fan blade bodies 7. In order to form a vortex, the extension direction of the fan blade body 7 on the mounting surface of the fan blade assembly 5 is staggered with the center position of the fan blade assembly 5, so that when the incoming fluid enters the middle area of the fan blade assembly 5, as shown in FIG. Figure 8 As shown, Figure 8 The direction of the arrow is a schematic diagram of the flow direction of the liquid when the liquid flows into the middle position of the fan blade assembly 5, thereby forming a vortex to accelerate the flow of the liquid, thereby improving the heat exchange efficiency with the heat on the substrate 11. At the same time, in order to prevent the condensed reflux liquid from falling into the middle position of the fan blade assembly 5 and affecting the vortex effect, the fan blade body 7 is tilted toward the center of the fan blade assembly 5 on the side away from the heat dissipation boss 13, so that part of the condensed dripping liquid is introduced to the outside of the fan blade assembly 5, thereby ensuring the vortex effect.

[0024] When the steam in the enclosed space 12 refluxes, it will mostly reflux through the guide column 6. Since the heat transferred from the chip to the fan blade assembly 5 is the largest, a large amount of steam will be generated. The steam will directly contact the side of the enclosed space 12 of the fan blade assembly 5 away from the chip, thereby generating condensation. At this time, a high-density area 8 with a density of guide columns 6 greater than that of other areas is provided in the enclosed space 12 around the fan blade assembly 5, such as Figure 7 As shown, it can be clearly observed that the density of the guide column 6 in the enclosed space 12 around the fan blade assembly 5 is relatively high, thereby quickly introducing the condensed liquid with a lower temperature into the area around the fan blade assembly 5. As a result, due to the lower temperature of the fluid outside the fan blade assembly 5 and the larger amount of liquid, the fluid outside the fan blade assembly 5 will flow along the Figure 8 The air enters the fan blade assembly 5 in the direction of the arrow shown in the figure to form a vortex.

[0025] In order to achieve relative fixation of the temperature homogenizing plate 1, TEC cooling plate 2 and liquid cooling plate 3, a fixing plate 9 is provided on the side of the liquid cooling plate 3 away from the TEC cooling plate 2. Several fasteners 10 for fixing are provided between the fixing plate 9 and the temperature homogenizing plate 1. The fasteners 10 achieve relative fixation of the three, forming a structurally stable heat dissipation system.

[0026] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements that are inherent to such process, method, article or apparatus.

[0027] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A vapor chamber thermoelectric cooling phase change heat dissipation system, characterized in that: The cooling system includes: A temperature-averaging plate (1) for mounting a chip, the temperature-averaging plate (1) comprising a substrate (11) as a mounting carrier, a closed space (12) for liquid phase change conversion being provided in the substrate (11), a plurality of heat dissipation bosses (13) for mounting the chip being provided on one side of the substrate (11), the projections of the heat dissipation bosses (13) on the substrate (11) being located within an area enclosed by the projections of the closed space (12) on the substrate (11); A TEC refrigeration plate (2) is arranged on a side of the substrate (11) away from the heat dissipation boss (13) and corresponding to the position of the enclosed space (12), and the cold end of the TEC refrigeration plate (2) is in contact with the surface of the substrate (11); A liquid cooling plate (3) is provided at the hot end of the TEC cooling plate (2) for cooling by fluid heat exchange, the inner cavity of the liquid cooling plate (3) is connected to an external pipeline, and the temperature equalizing plate (1), the TEC cooling plate (2) and the liquid cooling plate (3) are relatively fixed.

2. The heat dissipation system according to claim 1, characterized in that: A groove (14) is provided at the center of the substrate (11), and a cooling plate boss (4) is provided at the cold end of the TEC cooling plate (2) and is in contact with the inner wall of the groove (14).

3. The heat dissipation system according to claim 1, wherein: The enclosed space (12) is provided with a plurality of groups of fan blade assemblies (5) for forming eddies at its center position, the positions of the plurality of groups of fan blade assemblies (5) respectively corresponding to the positions of the plurality of heat dissipation bosses (13), and further includes a guide column (6) connecting the upper and lower inner walls of the enclosed space (12).

4. The heat dissipation system according to claim 3, characterized in that: The fan blade assembly (5) comprises a plurality of fan blade bodies (7) arranged in an array around a central position thereof, and the extension direction of the fan blade bodies (7) on the mounting surface of the fan blade assembly (5) is offset from the central position of the fan blade assembly (5).

5. The heat dissipation system according to claim 4, characterized in that: The side of the fan blade body (7) away from the heat dissipation boss (13) is tilted toward the center of the fan blade assembly (5).

6. The heat dissipation system according to claim 4, characterized in that: A high-density area (8) in which the density of guide columns (6) is greater than that of other areas is provided in the enclosed space (12) around the fan blade assembly (5).

7. The heat dissipation system according to claim 1, characterized in that: A fixing plate (9) is provided on a side of the liquid cooling plate (3) away from the TEC refrigeration plate (2), and a plurality of fasteners (10) for fixing are provided between the fixing plate (9) and the temperature equalizing plate (1).

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