Holding substrate, optical connection member, and method for manufacturing holding substrate

Abstract

The invention provides a holding substrate capable of reliably holding each of a plurality of optical fibers and realizing high density of a multi-optical fiber arrangement. The holding substrate (42) holds a plurality of optical fibers. The holding substrate (42) has at least one through-hole (43, 44). The at least one through-hole (43, 44) each includes a plurality of insertion holes (46) extending in the first direction and into which the plurality of optical fibers are inserted in the first direction. Each of the at least one through-hole (43, 44) has a shape in which insertion holes (46) adjacent to each other in a second direction intersecting the first direction are connected when viewed in the first direction. The plurality of insertion holes (46) are arranged in a row in the second direction.

Description

Technical Field

[0001] The present disclosure relates to a holding substrate, an optical connecting component, and a method for manufacturing the optical connecting component. Background Art

[0002] A holding substrate for holding a plurality of optical fibers is known (for example, Patent Document 1 and Patent Document 2). The holding substrate has a plurality of insertion holes into which the plurality of optical fibers are inserted.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. WO2020 / 027125

[0006] Patent Document 2: International Publication No. WO2017 / 026072 Summary of the Invention

[0007] In order to increase the amount of information to be transmitted, it is considered to increase the number of optical fibers. In this regard, it is also required to reliably hold each of the multiple optical fibers and to miniaturize the optical connection component including the multiple optical fibers.

[0008] The present invention aims to provide a holding substrate and an optical connecting component that can reliably hold each of a plurality of optical fibers while achieving a high-density multi-fiber configuration. The present invention aims to provide a method for manufacturing a holding substrate that can easily achieve a structure that can reliably hold each of a plurality of optical fibers while achieving a high-density multi-fiber configuration.

[0009] A retaining substrate according to an embodiment of the present disclosure retains multiple optical fibers. The retaining substrate has at least one through-hole. Each of the at least one through-holes includes multiple insertion holes extending in a first direction and configured to allow insertion of the multiple optical fibers in the first direction. Each of the at least one through-holes has a shape that is connected in a second direction intersecting the first direction when viewed from the first direction. The multiple insertion holes are arranged in a row in the second direction.

[0010] An optical connection component according to an embodiment of the present disclosure includes a plurality of optical fibers and a retaining substrate. The retaining substrate retains the plurality of optical fibers. The retaining substrate has at least one through-hole. Each of the at least one through-holes includes a plurality of insertion holes extending in a first direction and configured to allow insertion of the plurality of optical fibers in the first direction. Each of the at least one through-holes has a shape that is connected in a second direction intersecting the first direction when viewed along the first direction. The plurality of insertion holes are arranged in a row in the second direction.

[0011] A method for manufacturing a retaining substrate according to an embodiment of the present disclosure includes the following steps: preparing a substrate to be processed; and forming at least one through-hole in the substrate by etching. Each of the at least one through-holes includes a plurality of insertion holes extending in a first direction and configured to allow insertion of a plurality of optical fibers in the first direction. Each of the at least one through-holes has a shape that is connected in a second direction intersecting the first direction when viewed from the first direction. The plurality of insertion holes are arranged in a row in the second direction.

[0012] Effects of the Invention

[0013] According to the present disclosure, a high-density multi-fiber arrangement can be achieved while each of the plurality of optical fibers is securely held. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view showing an example of an optical connecting component in the embodiment.

[0015] Figure 2 yes Figure 1 The optical connection components are shown in an exploded perspective view.

[0016] Figure 3 yes Figure 1 A side view of the optical connection component is shown.

[0017] Figure 4 This is a perspective view of a holding substrate included in the optical connecting component.

[0018] Figure 5 It is a top view of the holding substrate.

[0019] Figure 6 It is a partial enlarged view of the holding substrate.

[0020] Figure 7 It is a cross-sectional view of the holding substrate.

[0021] Figure 8 It is a plan view of a holding substrate in a modified example of this embodiment.

[0022] Figure 9 It is a perspective view of a holding substrate in a comparative example.

[0023] Figure 10 It is a figure which shows the method of applying an adhesive to a holding substrate in a comparative example.

[0024] Figure 11 It is a figure which shows the method of applying an adhesive to a holding substrate in this embodiment. DETAILED DESCRIPTION

[0025] [Description of Embodiments of the Present Disclosure]

[0026] First, the contents of the embodiments of the present disclosure will be individually listed and described.

[0027] (1) A retaining substrate according to an embodiment of the present disclosure retains at least one optical fiber. The retaining substrate has at least one through-hole. Each of the at least one through-holes includes a plurality of insertion holes extending in a first direction and configured to allow insertion of a plurality of optical fibers in the first direction. Each of the at least one through-holes has a shape that is connected in a second direction intersecting the first direction when viewed along the first direction. The plurality of insertion holes are arranged in a row in the second direction.

[0028] In this holding substrate, at least one through-hole is formed by connecting multiple insertion holes extending in a first direction and extending in a second direction intersecting the first direction when viewed along the first direction. The multiple insertion holes are arranged in a row in the second direction. In this case, each of the multiple optical fibers can be securely held while achieving a high-density multi-fiber configuration.

[0029] (2) In the holding substrate of (1) above, the holding substrate may have a plurality of through holes. The plurality of through holes may be arranged in a third direction intersecting the first direction and the second direction when viewed along the first direction.

[0030] (3) In the holding substrate of (1) or (2) above, the plurality of insertion holes may include a first insertion hole, a second insertion hole, and a third insertion hole arranged in a row in the second direction. Alternatively, when viewed along the first direction, the first insertion hole and the second insertion hole may be connected to each other in the second direction, and the second insertion hole and the third insertion hole may be connected to each other in the second direction. In this case, while each of the plurality of optical fibers is reliably held, a further high-density multi-fiber arrangement can be achieved.

[0031] (4) In the holding substrate of any one of (1) to (3) above, each of the plurality of insertion holes may have a circular cross-sectional shape. In this case, each of the plurality of optical fibers can be reliably held while further increasing the density of the multi-fiber arrangement.

[0032] (5) In the holding substrate of any one of (1) to (4) above, when the minimum width of a portion where adjacent insertion holes are connected in the third direction is "L4" and the maximum width of the insertion holes is "L2", the following relationship may be satisfied: 0 < L4 < 0.75 × L2. In this case, each of the plurality of optical fibers can be more reliably held.

[0033] (6) An optical connection component according to an embodiment of the present disclosure includes a plurality of optical fibers and a retaining substrate. The retaining substrate retains the plurality of optical fibers. The retaining substrate has a through hole. The through hole is shaped such that, when viewed from the first direction, the plurality of insertion holes, which extend in a first direction and into which the plurality of optical fibers are inserted, are connected in a second direction intersecting the first direction. The plurality of insertion holes are arranged in a row in the second direction. The plurality of optical fibers are inserted into the through holes while being arranged in a row in the second direction, and extend from the through holes to be arranged in a plurality of rows.

[0034] In this optical connection component, the through hole is formed by connecting multiple insertion holes extending in a first direction in a second direction intersecting the first direction when viewed from the first direction. The multiple insertion holes are arranged in a row in the second direction. Therefore, each of the multiple optical fibers can be reliably retained. In addition, the multiple optical fibers are inserted into the through hole while being arranged in a row in the second direction, and extend from the through hole to be arranged in multiple rows. In this case, the multiple optical fibers originally arranged in multiple rows are inserted into the through hole while being arranged in a row. Therefore, a high-density multi-fiber configuration can be achieved.

[0035] (7) In the optical connection component of (6) above, the plurality of optical fibers may include: a coating portion covered by a coating film; a bent portion exposed from the coating portion and bent; and a connecting portion connected to a retaining substrate. Alternatively, in each of the plurality of optical fibers, the coating portion, the bent portion, and the connecting portion are arranged in sequence. The larger the coating portion, the more damage caused by contact between the plurality of optical fibers can be suppressed. On the other hand, for the formation of the bent portion, it is considered to bend the optical fiber by heating. In this case, if the bent portion is covered by the coating film, the coating film may melt. According to the above configuration, the bent portion can be easily formed while suppressing damage caused by contact between the plurality of optical fibers.

[0036] (8) The method for manufacturing a retaining substrate according to an embodiment of the present disclosure includes the following steps: preparing a substrate to be processed; and forming at least one through-hole in the substrate to be processed by etching, into which a plurality of optical fibers are inserted. Each of the at least one through-holes includes a plurality of insertion holes extending in a first direction and into which the plurality of optical fibers are inserted. Each of the at least one through-holes has a shape that is connected in a second direction intersecting the first direction when viewed along the first direction. The plurality of insertion holes are arranged in a row in the second direction.

[0037] In this method for manufacturing a retaining substrate, at least one through-hole for inserting multiple optical fibers is formed in the substrate being processed by etching. Each of the at least one through-holes is formed by connecting multiple insertion holes extending in a first direction, when viewed from the first direction, in a second direction intersecting the first direction. The multiple insertion holes are arranged in a row in the second direction. In this case, a structure that securely retains each of the multiple optical fibers while achieving a high-density multi-fiber configuration is easily achieved.

[0038] [Details of the embodiments of the present disclosure]

[0039] Specific examples of embodiments of the present disclosure are described below with reference to the accompanying drawings. The present invention is not limited to these examples, but is defined by the claims and is intended to include all modifications within the meaning and scope of the claims. Identical elements are denoted by the same reference numerals in the description of the drawings, and duplicate descriptions are omitted.

[0040] Figure 1 It is a perspective view showing an example of an optical connecting component according to an embodiment. Figure 2 yes Figure 1 The optical connection components are shown in an exploded perspective view. Figure 3 yes Figure 1 A side view of an optical connecting component is shown. Optical connecting component 1 includes an optical fiber ribbon 2 and an optical fiber fixing component 4. Optical connecting component 1 may include, for example, multiple optical fiber ribbons 2. These multiple optical fiber ribbons 2 may include, for example, optical fiber ribbon 21, optical fiber ribbon 22, optical fiber ribbon 23, and optical fiber ribbon 24. Alternatively, optical connecting component 1 may include only one optical fiber ribbon 2.

[0041] The optical fiber ribbons 21, 22, 23, and 24 all have a bent portion in the middle. The first ends of the optical fiber ribbons 21, 22, 23, and 24 are fixed to the electronic substrate via the retaining substrate 42, and the second ends of the optical fiber ribbons 21, 22, 23, and 24 are connected to the house wiring via a connector (omitted in the figure).

[0042] Each of optical fiber ribbons 21, 22, 23, and 24 includes a plurality of optical fibers 31 arranged along the X-axis. Optical fibers 31 are, for example, glass fibers. The outer diameter of optical fibers 31 is, for example, 125 μm. Optical fibers 31 are single-core fibers having a single core. Alternatively, optical fibers 31 may be multi-core fibers comprising glass fibers having multiple cores.

[0043] The plurality of optical fibers 31 include a coating portion 36 covered by a coating 35 and an exposed portion 37 exposed from the coating 35. The exposed portion 37 includes a straight portion 37a, a curved portion 37b, a straight portion 37c, and a connecting portion 37d. The straight portion 37a extends from the coating 35 in the Z-axis direction, for example. The curved portion 37b is connected to the straight portion 37a, bends from the straight portion 37a, and connects to the straight portion 37c. The straight portion 37c extends from the curved portion 37b in the Y-axis direction. The connecting portion 37d extends from the straight portion 37c in the Y-axis direction and is connected to the optical fiber fixing member 4. In each of the plurality of optical fibers 31, the coating portion 36, the curved portion 37b, and the connecting portion 37d are arranged in this order. For example, the curved portion 37b is bent by heating the optical fiber 31.

[0044] The optical fiber fixing component 4 includes a resin ferrule 41 and a holding substrate 42. Figures 1 to 3 As shown, the resin insert 41 is substantially L-shaped when viewed from the side and is placed on the holding substrate 42. Figure 2 As shown, the resin ferrule 41 includes a surface 41 a.

[0045] The straight portions 37a, curved portions 37b, and straight portions 37c of the plurality of optical fibers 31 are arranged along the surface 41a. The resin ferrule 41 includes side surfaces 41b on the sides of the surface 41a, facing the side ends of the optical fiber ribbons 21, 22, 23, and 24. The resin ferrule 41 includes a resin portion 12 that covers the optical fibers 31. The resin portion 12 is made of, for example, acrylic resin, epoxy resin, or silicone.

[0046] The resin ferrule 41 is made of, for example, metal or engineering plastic. Examples of the metal include stainless steel, and examples of the engineering plastic include polyphenylene sulfide and liquid crystal polymer.

[0047] The resin ferrule 41 may have a shape other than the substantially L-shape. For example, the resin ferrule 41 may have a shape applicable to a straight optical fiber that does not bend.

[0048] The holding substrate 42 is, for example, a glass substrate. The glass substrate includes, for example, molten quartz glass or borosilicate glass. Figure 4 and Figure 5As shown, the retaining substrate 42 includes, for example, a rectangular glass plate. The retaining substrate 42 is, for example, capable of transmitting ultraviolet rays, and the rectangular surface 15a is arranged opposite to the resin insert 41, and the rectangular back surface 15b is also arranged opposite to the electronic substrate. The back surface 15b is fixed to the electronic substrate using a UV adhesive. Here, being capable of transmitting ultraviolet rays means that, for example, a material with a thickness of 1 mm is irradiated with ultraviolet rays with a wavelength of 350 nm or more and 400 nm or less, and the transmittance is 10% or more. The retaining substrate 42 may also be, for example, a silicon substrate. In the case where the retaining substrate 42 is not capable of transmitting ultraviolet rays, the retaining substrate 42 may also be fixed to the electronic substrate by a thermosetting adhesive.

[0049] like Figure 4 and Figure 5 As shown, the holding substrate 42 has at least one through-hole 43, 44. In the example shown in this embodiment, the holding substrate 42 has a plurality of through-holes 43, 44. The holding substrate 42 may have only one through-hole 43. The connecting portion 37d is connected to the holding substrate 42.

[0050] Through holes 43 and 44 extend in the thickness direction (first direction) of holding substrate 42, penetrating holding substrate 42. The thickness between front surface 15a and back surface 15b of holding substrate 42 is as thin as, for example, approximately 1 mm. Through holes 43 and 44 penetrate both front surface 15a and back surface 15b. Through holes 43 and 44 extend in a direction (second direction) intersecting the thickness direction of holding substrate 42.

[0051] The thickness direction of the holding substrate 42 corresponds to the Y-axis direction, and the direction intersecting the thickness direction of the holding substrate 42 corresponds to the X-axis direction. In the example shown in this embodiment, the plurality of through holes 43 and 44 are arranged in the Z-axis direction, which intersects the Y-axis direction and the X-axis direction, when viewed along the Y-axis direction. The Y-axis direction corresponds to the first direction D1, the X-axis direction corresponds to the second direction D2, and the Z-axis direction corresponds to the third direction D3.

[0052] Each of the through holes 43 and 44 includes a plurality of insertion holes 46 for inserting the connection portions 37d of the plurality of optical fibers 31. Figure 6 As shown, each of the plurality of optical fibers 31 includes a cladding 51 and a core 52. The cladding 51 and the core 52 are made of quartz glass. The plurality of optical fibers 31 are inserted into corresponding insertion holes 46 of the plurality of insertion holes 46 and secured thereto by an adhesive. The adhesive may be made of, for example, epoxy resin, acrylic resin, or silicone.

[0053] The plurality of insertion holes 46 extend in the Y-axis direction. The plurality of insertion holes 46 penetrate the surface 15a and the back surface 15b. The plurality of insertion holes 46 are arranged in a row in the X-axis direction. The through-holes 43 and the through-holes 44 each have a shape formed by connecting the plurality of insertion holes 46 in the X-axis direction. The plurality of insertion holes 46 include a first insertion hole 46a, a second insertion hole 46b, and a third insertion hole 46c arranged in sequence in the X-axis direction. When viewed along the Y-axis direction, the first insertion hole 46a and the second insertion hole 46b are connected to each other in the X-axis direction, and the second insertion hole 46b and the third insertion hole 46c are connected to each other in the X-axis direction.

[0054] like Figure 7 As shown, the holding base plate 42 includes an inclined surface 47 connecting the edges of the plurality of insertion holes 46 and the surface 15a and inclined with respect to the Y-axis direction. The inclined surface 47 gradually expands from the insertion holes 46 toward the surface 15a.

[0055] Each through-hole 43 and through-hole 44 includes a connecting hole 48 that connects adjacent insertion holes 46. Each through-hole 43 and through-hole 44 has a shape formed by connecting multiple insertion holes 46 in the X-axis direction via connecting holes 48. The multiple connecting holes 48 extend in the Y-axis direction. The multiple connecting holes 48 penetrate the front surface 15a and the back surface 15b.

[0056] Each of the multiple insertion holes 46 has a circular cross-sectional shape. When the outer diameter of the optical fiber 31 is "L1," the diameter of each of the multiple insertion holes 46 is "L2," and the pitch "L3" between adjacent insertion holes 46 in the X-axis direction satisfies equations (1) L1 ≤ L2 and (2) L1 ≤ L3 < 2 × L1. When equation (3) L1 ≤ L2 < L1 + 0.002 mm is satisfied, the positioning accuracy of the connection portion 37 d of the optical fiber 31 inserted into the insertion hole 46 is further improved. When equation (4) L1 ≤ L2 < L1 + 0.001 mm is satisfied, the positioning accuracy of the connection portion 37 d of the optical fiber 31 inserted into the insertion hole 46 is further improved. For example, the outer diameter "L1" of the optical fiber 31 is 125 μm, and the pitch "L3" between adjacent insertion holes 46 in the X-axis direction is 127 μm.

[0057] When the minimum width of the connection hole 48 in the X-axis direction is "L4", the equation (5) 0 < L4 < L2 is satisfied. When the equation (6) L4 < 0.75 × L2 is satisfied, the positioning accuracy of the connection portion 37d of the optical fiber 31 inserted into the insertion hole 46 is further improved. When the equation (7) L4 < 0.5 × L2 is satisfied, the positioning accuracy of the connection portion 37d of the optical fiber 31 inserted into the insertion hole 46 is further improved.

[0058] The through holes 43 and 44 can be made, for example, using a process that combines photolithography and dry etching such as reactive ion etching (RIE), or a hole-opening technique using a laser. In this embodiment, the through holes 43 and 44 are formed by laser irradiation and etching. For example, a portion of the processed substrate is modified by laser irradiation, and the modified portion is removed by etching. As a result, the through holes 43 and 44 are formed. In this case, for example, the processed substrate is borosilicate glass. The portion modified by laser irradiation is removed by etching.

[0059] If the support substrate 42 is ultraviolet-transmissive, for example, a UV adhesive can be used to secure the support substrate 42 to an optical integrated circuit such as a Si-PIC (silicon photonic integrated circuit). Ultraviolet-transmissive means, for example, that the transmittance of a material having a thickness of 1 mm is 10% or greater when irradiated with ultraviolet light having a wavelength of 350 nm to 400 nm. If the support substrate 42 is not ultraviolet-transmissive, for example, a thermosetting adhesive can be used to secure the support substrate 42 to the optical integrated circuit.

[0060] Next, refer to Figure 8 , an optical connecting component in a modified example of this embodiment is described. Figure 8 This is a top view of a retaining substrate in a modified example. This modified example is substantially similar to or identical to the aforementioned embodiment. This modified example differs from the aforementioned embodiment in that the plurality of through-holes in the retaining substrate are connected. The following description focuses on the differences between the aforementioned embodiment and the modified example.

[0061] like Figure 8 As shown, in this variation, the optical connecting component 1 includes a retaining substrate 42A. The retaining substrate 42A has a plurality of through-holes 43A and 44A. The through-holes 43A and 44A extend in the thickness direction of the retaining substrate 42A, penetrating the retaining substrate 42A. The through-holes 43A and 44A penetrate the front surface 15a and the back surface 15b. The through-holes 43A and 44A extend in a direction intersecting the thickness direction of the retaining substrate 42A.

[0062] The thickness direction of the holding substrate 42A corresponds to the Y-axis direction, and the direction intersecting the thickness direction of the holding substrate 42A corresponds to the Y-axis direction. In the example shown in this embodiment, the plurality of through holes 43A and 44A are arranged in the Z-axis direction intersecting the Y-axis direction and the X-axis direction when viewed along the Y-axis direction.

[0063] The through hole 43A and the through hole 44A are connected to each other. For example, the retaining substrate 42A includes a connecting hole 61, a connecting hole 62, and a connecting hole 63 that connect the through hole 43A and the through hole 44A. The connecting holes 61, the connecting holes 62, and the connecting holes 63 extend in the Y-axis direction. A plurality of connecting holes 61 penetrate the surface 15a and the back surface 15b. The connecting holes 61 have a circular cross-section when viewed along the Y-axis direction. The connecting hole 61 is connected to the through hole 43A through the connecting hole 62. The connecting hole 61 is connected to the through hole 44A through the connecting hole 63. In this modified example, the connecting holes 61, the connecting holes 62, and the connecting holes 63 are arranged at a position that does not overlap with the through hole 43A and the through hole 44A when viewed along the Z-axis direction.

[0064] As a further modification of this modification, connecting holes 61, 62, and 63 may be arranged at positions overlapping through-hole 43A and through-hole 44A when viewed in the Z-axis direction. In this case, connecting holes 61, 62, and 63 may be arranged between through-hole 43A and through-hole 44A.

[0065] Next, refer to Figures 9 to 11 , the effects of the holding substrate 42, the optical connecting component 1, and the method for manufacturing the holding substrate 42 are described. Figure 9 It is a perspective view of a holding substrate in a comparative example.

[0066] Figure 10 It is a figure which shows the method of applying an adhesive to a holding substrate in a comparative example. Figure 11 It is a figure which shows the method of applying an adhesive to a holding substrate in this embodiment.

[0067] exist Figure 9 In the holding substrate 142 shown, a plurality of through holes 150 are arranged two-dimensionally when viewed along the Y-axis direction. The plurality of through holes 150 are separated from each other. The plurality of through holes 150 each include an insertion hole 146 for inserting an optical fiber. Only one insertion hole 146 is provided for each through hole 150. In this case, each through hole 150 and the insertion hole 146 penetrates from the surface 115a to the back surface 115b. In this case, the through holes 150 adjacent to each other are separated, so it is difficult to increase the density of the insertion holes 146 adjacent to each other. Moreover, as Figure 10 As shown, when the adhesive 70 is applied, the adhesive 70 is applied to each insertion hole 146 , so there is a possibility that production efficiency may be reduced.

[0068] In contrast, in the retaining substrate 42 of this embodiment, the plurality of through-holes 43 and 44 each have a shape formed by connecting a plurality of insertion holes 46 extending in the Y-axis direction in the X-axis direction when viewed along the Y-axis. The plurality of insertion holes 46 are arranged in a row in the X-axis direction. The plurality of through-holes 43 and 44 are arranged in the Z-axis direction when viewed along the Y-axis direction. In this case, each of the plurality of optical fibers 31 is securely retained while achieving a high-density multi-fiber arrangement.

[0069] Multiple optical fibers 31 are inserted into through-hole 43 while being arranged in a single row in the X-axis direction, and then extend from through-hole 43 to be arranged in multiple rows. For example, optical fiber ribbon 21, optical fiber ribbon 22, optical fiber ribbon 23, and optical fiber ribbon 24 are arranged in four rows. In this case, multiple optical fibers 31, which were originally arranged in multiple rows, are now arranged in a single row when inserted into through-hole 43. This allows for a higher-density multi-fiber arrangement.

[0070] In the manufacturing method of the above-mentioned holding substrate 42, a plurality of insertion holes 46 for inserting a plurality of optical fibers 31 are formed in the processed substrate by etching. In this case, Figure 11 As shown, adhesive 70 can be applied to multiple insertion holes 46 by applying adhesive 70 once. For example, even if the driving amount of the nozzle applying adhesive 70 is small and the driving accuracy of the nozzle is low, adhesive 70 can be applied to multiple insertion holes 46 included in through-hole 43. In this case, it is easy to realize a structure that can reliably hold each of the multiple optical fibers 31 while achieving a high-density multi-fiber arrangement.

[0071] The plurality of insertion holes 46a, 46b, and 46c are arranged in a row in the X-axis direction. Alternatively, when viewed along the Y-axis, insertion hole 46a and insertion hole 46b may be connected to each other in the X-axis direction, and insertion hole 46b and insertion hole 46c may be connected to each other in the X-axis direction. In this case, each of the plurality of optical fibers 31 can be securely held while achieving a higher density of the multi-fiber arrangement.

[0072] The plurality of insertion holes 46 may each have a circular cross-sectional shape. In this case, while each of the plurality of optical fibers 31 is securely held, a further high-density arrangement of multiple optical fibers can be achieved.

[0073] Alternatively, when the minimum width of the portion connecting adjacent insertion holes 46 in the Z-axis direction is "L4" and the maximum width of the insertion holes 46 is "L2", the following relationship may be satisfied: 0 < L4 < 0.75 × L2. In this case, each of the optical fibers 31 can be more securely held.

[0074] Alternatively, the plurality of optical fibers 31 may include: a coating portion 36 covered by the coating 35; a bent portion 37b exposed from the coating 36 and bent; and a connecting portion 37d connected to the holding substrate 42. Alternatively, in each of the plurality of optical fibers 31, the coating 36, the bent portion 37b, and the connecting portion 37d are arranged in this order. The larger the coating 36, the more damage caused by contact between the plurality of optical fibers 31 can be suppressed. On the other hand, regarding the formation of the bent portion 37b, it is considered to bend the optical fiber 31 by heating. In this case, if the bent portion 37b is covered by the coating 35, the coating 35 may melt. According to the above configuration, the bent portion 37b can be easily formed while suppressing damage caused by contact between the plurality of optical fibers 31.

[0075] While the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the aforementioned embodiments and can be applied to various embodiments. For example, while the two through-holes 43 and 44 are described as being arranged in the Z-axis direction when viewed along the Y-axis, three or more through-holes can also be arranged in the Z-axis direction when viewed along the Y-axis.

[0076] Description of Reference Numerals

[0077] 1: Optical connecting components;

[0078] 2: Optical fiber ribbon;

[0079] 4: Optical fiber fixing components;

[0080] 12: resin part;

[0081] 15a: surface;

[0082] 15b: back;

[0083] 21: Optical fiber ribbon;

[0084] 22: Optical fiber ribbon;

[0085] 23: Optical fiber ribbon;

[0086] 24: optical fiber ribbon;

[0087] 31: optical fiber;

[0088] 35: coating;

[0089] 36: Covered part;

[0090] 37: exposed part;

[0091] 37a: straight line portion;

[0092] 37b: curved part;

[0093] 37c: straight line part;

[0094] 37d: connecting part;

[0095] 41: Resin ferrule;

[0096] 41a: surface;

[0097] 41b: side;

[0098] 42: Maintain substrate;

[0099] 42A: holding substrate;

[0100] 43: through hole;

[0101] 43A: through hole;

[0102] 44: through hole;

[0103] 44A: through hole;

[0104] 46: Insertion hole;

[0105] 46a: first insertion hole;

[0106] 46b: second insertion hole;

[0107] 46c: third insertion hole;

[0108] 47: inclined surface;

[0109] 48: connecting hole;

[0110] 51: cladding;

[0111] 52: fiber core;

[0112] 61: connecting hole;

[0113] 62: connecting hole;

[0114] 63: connecting hole;

[0115] 70: adhesive;

[0116] 115a: surface;

[0117] 115b: back;

[0118] 142: Maintaining the substrate;

[0119] 146: insertion hole;

[0120] 150: through hole;

[0121] D1: first direction;

[0122] D2: second direction;

[0123] D3: Third direction.

Claims

1. A holding substrate holding a plurality of optical fibers, wherein: The holding substrate has at least one through hole, Each of the at least one through hole includes a plurality of insertion holes extending in a first direction and through which the plurality of optical fibers are inserted. Each of the at least one through-holes is shaped so as to be connected in a second direction intersecting the first direction when viewed along the first direction. The plurality of insertion holes are arranged in a row in the second direction.

2. The holding substrate according to claim 1, wherein The holding substrate has a plurality of through holes, The plurality of through holes are arranged in a third direction intersecting the first direction and the second direction when viewed along the first direction.

3. The holding substrate according to claim 1 or 2, wherein: The plurality of insertion holes include a first insertion hole, a second insertion hole, and a third insertion hole arranged in a row in the second direction. When viewed along the first direction, the first insertion hole and the second insertion hole are connected to each other in the second direction, and the second insertion hole and the third insertion hole are connected to each other in the second direction.

4. The holding substrate according to any one of claims 1 to 3, wherein Each of the plurality of insertion holes has a circular cross-sectional shape.

5. The holding substrate according to any one of claims 1 to 4, wherein In the third direction, when the minimum width of a portion where adjacent insertion holes are connected is L4 and the maximum width of the insertion holes is L2, the following conditions are satisfied: 0<L4<0.75×L2.

6. An optical connecting component comprising: multiple optical fibers; and The holding substrate according to any one of claims 1 to 5, holding the plurality of optical fibers, The plurality of optical fibers are inserted into the through hole in a state of being arranged in a line in the second direction.

7. The optical connecting component according to claim 6, wherein: The plurality of optical fibers include: a coating portion covered by a coating film; a bent portion exposed from the coating portion and bent; and a connecting portion connected to the holding substrate. In each of the plurality of optical fibers, the coating portion, the bent portion, and the connecting portion are arranged in this order.

8. A method for manufacturing a holding substrate, comprising the following steps: preparing a substrate to be processed; and At least one through hole is formed in the processed substrate by etching, Each of the at least one through hole includes a plurality of insertion holes extending in a first direction and for inserting a plurality of optical fibers in the first direction. Each of the at least one through-holes is shaped so as to be connected in a second direction intersecting the first direction when viewed along the first direction. The plurality of insertion holes are arranged in a row in the second direction.

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