Electronic device including flexible display

Abstract

An electronic device according to an embodiment includes: a flexible display; a first housing; a second housing rotatable with respect to the first housing; the hinge structure comprises a first hinge plate and a second hinge plate; a reinforcing member; a flexible printed circuit board; and a protective layer parallel to a boundary between the first housing and the second housing and surrounding a portion of the hinge structure in the deployed state. The rotation angle range of the first hinge plate and the second hinge plate is larger than the rotation angle range of the first shell and the second shell. Various other embodiments may be possible.

Description

Technical Field

[0001] The following description relates to an electronic device including a flexible display. Background Art

[0002] Electronic devices with large-screen displays can increase user usability. With the increasing demand for highly portable electronic devices, electronic devices may include deformable displays. Deformable displays can be slidably deformable or foldable. For example, an electronic device may include multiple housings that can rotate relative to each other via a hinge structure.

[0003] The above information may be provided as related art to assist in understanding the present disclosure. No argument or determination has been made as to whether any of the above description is applicable as prior art with respect to the present disclosure. Summary of the Invention

[0004] Technical Solution

[0005] According to one embodiment, an electronic device may include a flexible display, a first housing, a second housing, a hinge structure, a reinforcement, a flexible printed circuit board (FPCB), and a protective layer. The flexible display may include a first display area, a second display area, and a third display area. The third display area may be located between the first and second display areas. The first housing may support the first display area. The first housing may be disposed below the first display area. The second housing may be configured to be rotatable relative to the first housing about a folding axis. The second housing may support the second display area. The second housing may be disposed below the second display area. The hinge structure may include a first hinge plate and a second hinge plate. The first and second hinge plates may be disposed along a boundary between the first and second housings. The hinge structure may be disposed below the third display area. The reinforcement may support the third display area. The reinforcement may be disposed between the hinge structure and the third display area. A flexible printed circuit board (FPCB) may extend from the first printed circuit board (PCB) in the first housing through the hinge structure to the second printed circuit board (PCB) in the second housing. In an unfolded state in which a first direction facing the first display area and a second direction facing the second display area correspond to each other, a protective layer parallel to the boundary may surround a portion of the first hinge plate adjacent to the second hinge plate. A rotation angle range of the first hinge plate and the second hinge plate may be greater than a rotation angle range of the first housing and the second housing.

[0006] According to one embodiment, an electronic device may include a flexible display, a first housing, a second housing, a hinge structure, a flexible printed circuit board (FPCB), a first protective layer, and a second protective layer. The flexible display may include a first display area, a second display area, and a third display area. The third display area may be located between the first and second display areas. The first housing may be disposed below the first display area. The second housing may be configured to be rotatable relative to the first housing about a folding axis. The second housing may be disposed below the second display area. The hinge structure may include a first hinge plate and a second hinge plate. The first and second hinge plates may be disposed along a boundary between the first and second housings. The hinge structure may be disposed below the third display area. A flexible printed circuit board (FPCB) may extend from the first printed circuit board (PCB) in the first housing through the hinge structure to the second printed circuit board (PCB) in the second housing. In an unfolded state in which a first direction facing the first display area and a second direction facing the second display area correspond to each other, a first protective layer parallel to the boundary may surround a portion of the first hinge plate adjacent to the second hinge plate. In the unfolded state, a second protective layer parallel to the boundary may surround a portion of the second hinge plate adjacent to the first hinge plate. In a folded state in which the first direction and the second direction are opposite to each other, the second hinge plate may be tilted relative to the first hinge plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment.

[0008] Figure 2a An exemplary electronic device is shown in a deployed state.

[0009] Figure 2b An exemplary electronic device is shown in a folded state.

[0010] Figure 3a An exemplary electronic device in which the flexible display is omitted is shown in an unfolded state.

[0011] Figure 3b yes Figure 3a An exemplary enlarged view of portion X of , in which the hinge plate is omitted.

[0012] Figure 4 Schematically showing the Figure 3a 1 is a cross-sectional view of an exemplary electronic device taken along line AA′.

[0013] Figure 5a is a cross-sectional view of an exemplary electronic device in an unfolded state.

[0014] Figure 5b is a cross-sectional view of an exemplary electronic device in a folded state.

[0015] Figure 5c is an exploded view of a hinge structure of an exemplary electronic device.

[0016] Figure 6 An exemplary protective layer is shown in a state prior to being attached to a hinge plate.

[0017] Figure 7 The process of attaching a protective layer of an exemplary electronic device to a hinge plate is shown.

[0018] Figure 8 Schematically showing the Figure 3a sectional view of an exemplary electronic device taken along line BB'.

[0019] Figure 9 A reinforcement member is shown disposed in an exemplary electronic device in an unfolded state, with the flexible display omitted from the exemplary electronic device.

[0020] Figure 10a Schematically showing the Figure 9 A cross-sectional view of an exemplary electronic device taken along line CC'.

[0021] Figure 10b Schematically showing the Figure 9 sectional view of an exemplary electronic device taken along line DD'. DETAILED DESCRIPTION

[0022] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0023] Reference Figure 1In the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or can communicate with at least one of the electronic device 104 and the server 108 via a second network 199 (e.g., a long-range wireless communication network). Depending on the embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. Depending on the embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the aforementioned components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) may be implemented as a single component (eg, display module 160 ).

[0024] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or integrated with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0025] When the main processor 121 is inactive (e.g., sleeping), the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component functionally related to the auxiliary processor 123 (e.g., the camera module 180 or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0026] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0027] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0028] The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0029] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by the touch.

[0031] The audio module 170 can convert sound into an electrical signal, and vice versa. Depending on the embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0032] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0033] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0034] The connection end 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0036] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0040] The wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., New Radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance in high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0041] Antenna module 197 can transmit or receive signals or power to or from an external device (e.g., an external electronic device) outside of electronic device 101. Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). Depending on the embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for the communication scheme used in a communication network (e.g., first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0042] According to various embodiments, antenna module 197 may form a millimeter wave antenna module. According to embodiments, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., array antennas). The RFIC is disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and is capable of supporting a designated high-frequency band (e.g., the millimeter wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., the top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0044] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the results of the execution to the electronic device 101. The electronic device 101 may provide the results as at least a partial response to the request, either with or without further processing. To this end, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. Electronic device 101 may use distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server that utilizes machine learning and / or neural networks. Depending on the embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be used for intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0045] Figure 2a An exemplary electronic device is shown in a deployed state. Figure 2b An exemplary electronic device is shown in a folded state.

[0046] Reference Figure 2a and Figure 2b , electronic devices (e.g. Figure 1 The electronic device 101 may include a first housing 210, a second housing 220, a flexible display 230 (eg Figure 1 display module 160 ) and a hinge structure 250 .

[0047] According to one embodiment, the first housing 210 and the second housing 220 may form at least a portion of the outer surface of the electronic device 101. When the electronic device 101 is used by a user, at least a portion of the outer surface of the electronic device 101 defined by the first housing 210 and the second housing 220 may come into contact with a portion of the user's body. According to one embodiment, the first housing 210 may include a first surface 211, a second surface 212 opposite to the first surface 211, and a first side surface 213 surrounding at least a portion of the first surface 211 and the second surface 212. The first side surface 213 may connect the periphery of the first surface 211 to the periphery of the second surface 212. The first surface 211, the second surface 212, and the first side surface 213 may define an interior space of the first housing 210. According to one embodiment, the first housing 210 may provide a space formed by the first surface 211, the second surface 212, and the first side surface 213 as a space for arranging components of the electronic device 101.

[0048] According to one embodiment, the second housing 220 may include a third surface 221, a fourth surface 222 opposite to the third surface 221, and a second side surface 223 surrounding at least a portion of the third surface 221 and the fourth surface 222. The second side surface 223 may connect the perimeter of the third surface 221 to the perimeter of the fourth surface 222. The third surface 221, the fourth surface 222, and the second side surface 223 may define an interior space of the second housing 220. According to one embodiment, the second housing 220 may provide a space formed by the third surface 221, the fourth surface 222, and the second side surface 223 surrounding at least a portion of the third surface 221 and the fourth surface 222 as a space for mounting components of the electronic device 101. According to one embodiment, the second housing 220 may be coupled to the first housing 210 so as to be rotatable relative to the first housing 210.

[0049] According to one embodiment, the first and second side surfaces 213 and 223 may include a conductive portion 225 and a non-conductive portion 226. According to one embodiment, the conductive portion 225 may operate as an antenna radiator. The electronic device 101 may communicate with an external electronic device using the antenna radiator formed by the conductive portion 225.

[0050] According to one embodiment, the flexible display 230 can be configured to display visual information. According to one embodiment, the flexible display 230 can be disposed on the first surface 211 of the first housing 210, the third surface 221 of the second housing 220, and the hinge structure 250. For example, the flexible display 230 can include a first display area 231 disposed on the first surface 211 of the first housing, a second display area 232 disposed on the third surface 221 of the second housing, and a third display area 233 disposed between the first and second display areas 231 and 232. The third display area 233 can be disposed on the hinge structure 250. The first, second, and third display areas 231, 232, and 233 can form the front surface of the flexible display 230. According to one embodiment, the flexible display 230 can also include a sub-display panel 230a disposed on the fourth surface 222 of the second housing 220. According to one embodiment, the flexible display 230 can include a window exposed to the exterior of the electronic device 101. The window may protect the surface of the flexible display 230 and transmit visual information provided by the flexible display 230 to the outside of the electronic device 101 by including a substantially transparent material. For example, the window may include glass (e.g., ultra-thin glass (UTG)) and / or polymer (e.g., polyimide (PI)), but is not limited thereto.

[0051] According to one embodiment, at least one camera 240 may be configured to obtain an image based on receiving light from an object outside the electronic device 101. According to one embodiment, the at least one camera 240 may include a first camera 241, a second camera 242, and a third camera 243. The first camera 241 may be disposed in the first housing 210. For example, the first camera 241 may be disposed within the first housing 210. At least some of the first cameras 241 may be visible through the second surface 212 of the first housing 210. The first cameras 241 may be supported by a bracket (not shown) within the first housing 210. When the electronic device 101 is viewed from above, the first housing 210 may include at least one opening 241a that overlaps with the first camera 241. The first camera 241 may obtain an image based on receiving light from outside the electronic device 101 through the at least one opening 241a.

[0052] According to one embodiment, the second camera 242 may be disposed in the second housing 220. For example, the second camera 242 may be disposed inside the second housing 220. The second camera 242 may be visible through the sub-display panel 230a. When the electronic device 101 is viewed from above, the second housing 220 may include at least one opening 242a that overlaps with the second camera 242. The second camera 242 may receive light from outside the electronic device 101 through the at least one opening 242a to obtain an image.

[0053] According to one embodiment, the third camera 243 may be disposed in the first housing 210. For example, the third camera 243 may be disposed inside the first housing 210, and at least a portion of the third camera 243 may be visible through the first surface 211 of the first housing 210. For another example, the third camera 243 may be disposed inside the first housing 210, and at least a portion of the third camera 243 may be visible through the first display area 231 of the flexible display 230. The first display area 231 of the flexible display 230 may include at least one opening that overlaps with the third camera 243 when the flexible display 230 is viewed from above. The third camera 243 may obtain an image based on light received from outside the flexible display 230 through the at least one opening.

[0054] According to one embodiment, the second camera 242 and the third camera 243 may be positioned below the flexible display 230 (e.g., facing the interior of the first housing 210 or the interior of the second housing 220). For example, the second camera 242 and the third camera 243 may be under-display cameras (UDCs). If the second camera 242 and the third camera 243 are UDCs, the area of the flexible display 230 corresponding to the location of each of the second camera 242 and the third camera 243 may not be an inactive area. The inactive area of the flexible display 230 may refer to an area of the flexible display 230 that does not include pixels or does not emit light toward the outside of the electronic device 101. For another example, the second camera 242 and the third camera 243 may be punch-hole cameras. If the second camera 242 and the third camera 243 are punch-hole cameras, the area of the flexible display 230 corresponding to the location of each of the second camera 242 and the third camera 243 may be an inactive area.

[0055] According to one embodiment, the hinge structure 250 may rotatably connect the first shell 210 and the second shell 220. The hinge structure 250 may be disposed between the first shell 210 and the second shell 220 of the electronic device 101 so that the electronic device 101 may be bent, curved, or folded. For example, the hinge structure 250 may be disposed between a portion of the first side surface 213 and a portion of the second side surface 223. The hinge structure 250 may change the electronic device 101 into an unfolded state in which the first display area 231 and the second display area 232 face the same direction or a folded state in which the first display area 231 and the second display area 232 face directions opposite to each other. When the electronic device 101 is in the folded state, the first shell 210 and the second shell 220 may be covered or overlapped by being disposed parallel to each other. The hinge structure 250 will Figure 5c Give an example.

[0056] Figure 3aAn exemplary electronic device is shown in an unfolded state, with the flexible display omitted. Figure 3b yes Figure 3a An exemplary enlarged view of portion X of , in which the hinge plate is omitted. Figure 4 Schematically showing the Figure 3a 1 is a cross-sectional view of an exemplary electronic device taken along line AA′.

[0057] Reference Figure 3a 、 Figure 3b and Figure 4 According to an embodiment, the electronic device 101 may include a first housing 210, a second housing 220, a flexible display 230, a hinge structure 250, a flexible printed circuit board 320, a reinforcement member (eg Figure 4 reinforcement 310 ) and / or protective layer 400 .

[0058] The electronic device 101 according to an embodiment may include a first housing 210 and a second housing 220 rotatably coupled to each other. A hinge structure 250 provided between the first housing 210 and the second housing 220 may rotatably couple the first housing 210 and the second housing 220. For example, the second housing 220 may be configured to be rotatable relative to the first housing 210 based on a folding axis f. Figure 3a and Figure 3b Omitted, but refer to Figure 2a , flexible displays (e.g. Figure 2a The flexible display 230 may include a first display area (eg, a first display area) provided on the first housing 210. Figure 2a a first display area 231 ) and a second display area (eg, a first display area 231 ) provided on the second housing 220 . Figure 2a and a third display area (eg, a second display area 232 ) between the first display area 231 and the second display area 232 . Figure 2a The third display area 233 may be disposed on the hinge structure 250. The flexible display 230 may be configured to provide multiple states, including an unfolded state and a folded state. In the unfolded state, a first direction facing the first display area 231 and a second direction facing the second display area 232 correspond to each other. In the folded state, the first and second directions are opposite to each other.

[0059] According to one embodiment, the hinge structure 250 may include a first hinge plate 252 and a second hinge plate 253. The hinge structure 250 may be provided in the third display area (eg, Figure 2aThe first hinge plate 252 and the second hinge plate 253 may be positioned along the boundary between the first housing 210 and the second housing 220. For example, the first hinge plate 252 may be positioned along the boundary of the first housing 210 adjacent to the second housing 220. The second hinge plate 253 may be positioned along the boundary of the second housing 220 adjacent to the first housing 210.

[0060] According to one embodiment, the first hinge plate 252 and the second hinge plate 253 may rotatably connect the first housing 210 and the second housing 220 by being respectively coupled to the first housing 210 and the second housing 220. For example, the first hinge plate 252 may be coupled to the first housing 210. The second hinge plate 253 may be coupled to the second housing 220. The first housing 210 and the second housing 220 may be rotatable according to the rotation of the first hinge plate 252 and the second hinge plate 253.

[0061] According to one embodiment, the first hinge plate 252 and the second hinge plate 253 may be rotatably connected to a hinge bracket (eg, Figure 5c When a user applies external force to fold or unfold the electronic device 101, the first housing 210 and the second housing 220 can be folded or unfolded relative to each other through the rotational movement of the first hinge plate 252 and the second hinge plate 253. Since the first housing 210 and the second housing 220 can be symmetrical with the hinge structure 250 interposed between the first housing 210 and the second housing 220, the description of the first hinge plate 252 can also be applied to the second hinge plate 253.

[0062] According to one embodiment, the flexible printed circuit board 320 can be electrically connected to the first printed circuit board 261 in the first housing 210 and the second printed circuit board 262 in the second housing 220. According to one embodiment, the first printed circuit board 261 and the second printed circuit board 262 can be configured to provide electrical connections for electronic components in the electronic device 101. For example, the first printed circuit board 261 can be a plurality of electronic components (e.g., Figure 1 For example, the second printed circuit board 262 can be used for a plurality of electronic components (such as a sub-display panel (such as a processor 120) disposed in the second housing 220. Figure 2aThe first housing 210 and the second housing 220 are connected by the hinge structure 250, so they can be formed separately from each other. For the electrical connection between the electronic components in the first housing 210 and the electronic components in the second housing 220, the flexible printed circuit board 320 can electrically connect the first printed circuit board 261 and the second printed circuit board 262. The flexible printed circuit board 320 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the plurality of conductive layers. The flexible printed circuit board 320 can provide an electrical connection between the first printed circuit board 261 and the second printed circuit board 262 by using wiring and conductive paths formed in the conductive layers.

[0063] Reference Figure 3b , the flexible printed circuit board 320 can extend from the interior of the first shell 210 through the hinge structure 250 to the interior of the second shell 220. For example, the flexible printed circuit board 320 can extend from the interior of the first shell 210 to the hinge structure 250 through the first opening 218. The flexible printed circuit board 320 can extend from the hinge structure 250 to the interior of the second shell 220 through the second opening 228. In the unfolded state, the flexible printed circuit board 320 may include a first portion 321, a second portion 322, and a third portion 323. The first portion 321 can extend from the interior of the first shell 210 to the hinge cover 251 through the first opening 218. The second portion 322 can extend from the interior of the second shell 220 to the hinge cover 251 through the second opening 228. The third portion 323 can be disposed between the first portion 321 and the second portion 322 and can extend along the hinge cover 251. Figure 5a and Figure 5b The detailed structure of the flexible printed circuit board 320 in the unfolded state is illustrated.

[0064] According to one embodiment, when a portion of the flexible printed circuit board 320 passes through the hinge structure 250, the portion of the flexible printed circuit board 320 can be disposed on the first hinge plate (eg, Figure 3a The first hinge plate 252) and the second hinge plate (eg Figure 3aBecause this portion of the flexible printed circuit board 320 is located below the first and second hinge plates 252, 253, the first and / or second hinge plates 252, 253 may contact the flexible printed circuit board 320 when the state of the electronic device 101 changes. For example, when the state of the electronic device 101 changes from a folded state to an unfolded state, the lower surfaces of the first and / or second hinge plates 252, 253 may contact the flexible printed circuit board 320. As the state of the electronic device 101 repeatedly changes, the flexible printed circuit board 320, the first and / or second hinge plates 252, 253 may be damaged or worn due to the contact. When the folded / unfolded state of the electronic device 101 changes, this damage or wear may generate noise due to the physical interaction of the contacting surfaces.

[0065] Reference Figure 4 , the reinforcement 310 can support the third display area 233. Figure 3a The reinforcement member 310 omitted in the embodiment may be provided between the hinge structure 250 and the third display area 233. For example, the reinforcement member 310 may be provided by at least partially overlapping the first hinge plate 252 and the second hinge plate 253.

[0066] For example, the electronic device 101 may include a first support plate 234 disposed below the flexible display 230. The first support plate 234 may provide rigidity to the flexible display 230 by supporting the flexible display 230. For example, the first support plate 234 may be a metal sheet, but is not limited thereto. Because the third display area 233 of the flexible display 230 can bend in the folded state, the portion of the first support plate 234 corresponding to the third display area 233 may have a lattice structure 234a including a plurality of openings and / or a plurality of recesses. When the electronic device 101 is in the folded state, the portion of the first support plate 234 corresponding to the third display area 233 can bend using the lattice structure 234a.

[0067] According to one embodiment, in the unfolded state, the first display area 231 and the second display area 232 can be configured to receive user input. For example, the electronic device 101 can include an electromagnetic induction panel 236 disposed below the first display area 231 and the second display area 232. For example, at least a portion of the electromagnetic induction panel 236 can be attached to the first hinge plate 252 and / or the second hinge plate 253 to support at least a portion of the flexible display 230 (e.g., at least a portion of the third display area 233). For example, at least a portion of the electromagnetic induction panel 236 can be attached to the first hinge plate 252 and / or the second hinge plate 253 via a support strap 236a, but the present invention is not limited thereto. The electromagnetic induction panel 236 can be configured to receive input from an external electronic device. For example, the external electronic device can be, but is not limited to, an electronic pen or stylus configured to provide touch input via the electromagnetic induction panel 236. The electromagnetic induction panel 236 can be configured to receive hover input or touch input directed to the first display area 231 and / or the second display area 232. For example, the electromagnetic induction panel 236 may be referred to as an electromagnetic resonance (EMR) panel and / or a digitizer. The electromagnetic induction panel 236 may include a conductive pattern forming at least one closed loop. The conductive pattern can receive electromagnetic signals from an external electronic device (e.g., a stylus). Because the third display area 233 is curved when folded, the electromagnetic induction panel 236 may be omitted from the area corresponding to the third display area 233. A protective plate 235 for supporting the third display area 233 may be provided in the area corresponding to the third display area 233. For example, the protective plate 235 may be made of, but is not limited to, thermoplastic polyurethane (TPU).

[0068] According to one embodiment, the electronic device 101 may include a second support plate 237a and a third plate for supporting a portion of the flexible display 230. The second support plate 237a may be disposed below the first display area 231. The third support plate 237b may be disposed below the second display area 232. For example, the second support plate 237a may be disposed below the electromagnetic induction panel 236 corresponding to the first display area 231. The third support plate 237b may be disposed below the electromagnetic induction panel 236 corresponding to the second display area 232. In the unfolded state, the second support plate 237a and the third support plate 237b may provide rigidity to the first display area 231 and the second display area 232.

[0069] According to one embodiment, the second support plate 237a and the third support plate 237b can be rigid to support the first display area 231 and the second display area 232. Since the third display area 233 is curved in the folded state, the second support plate 237a and the third support plate 237b can be spaced apart from each other so that the area corresponding to the third display area 233 is interposed therebetween. Since the second support plate 237a and the third support plate 237b are spaced apart from each other, a step can be formed between the second support plate 237a and the third support plate 237b. According to one embodiment, the reinforcement 310 can be configured to compensate for this step and provide rigidity to the third display area 233. For example, the reinforcement 310 can be a sheet material including stainless steel, but is not limited thereto.

[0070] According to one embodiment, the reinforcement 310 can be attached to either the first hinge plate 252 or the second hinge plate 253. For example, a portion of the reinforcement 310 can be attached to the second hinge plate 253 via an adhesive tape 313. In the unfolded state, the reinforcement 310 can support the third display area 233 by maintaining a flat shape. In the folded state, the reinforcement 310 can bend. Because the reinforcement 310 is attached to either the first hinge plate 252 or the second hinge plate 253, the reinforcement 310 can bend without stretching. For example, if the reinforcement 310 is attached to the first hinge plate 252, as the electronic device 101 changes from the folded state to the unfolded state, the reinforcement 310 can bend while moving along the first hinge plate 252. Since the reinforcement 310 is positioned above the first and second hinge plates 252, 253, the first and / or second hinge plates 252, 253 may contact the reinforcement 310 when the electronic device 101 changes state. For example, when the state of the electronic device 101 changes from a folded state to an unfolded state, the upper surfaces of the first hinge plate 252 and / or the second hinge plate 253 may contact the flexible printed circuit board 320. As the state of the electronic device 101 repeatedly changes, the reinforcement 310, the first hinge plate 252, and / or the second hinge plate 253 may be damaged or worn due to the contact. When the folded / unfolded state of the electronic device 101 changes, this damage or wear may generate noise due to the physical interaction of the contacting surfaces.

[0071] Reference Figure 4The protective layer 400 may surround a portion of the first hinge plate 252 and a portion of the second hinge plate 253. For example, the protective layer 400 may be a protective film surrounding portions of the hinge plates 252 and 253, but is not limited thereto. For example, the protective layer 400 may include a first protective layer 410 surrounding a portion of the first hinge plate 252 and / or a second protective layer 420 surrounding a portion of the second hinge plate 253. The protective layer 400 may be configured to separate the first and second hinge plates 252 and 253 from the reinforcement 310 and / or the flexible printed circuit board 320 when the state of the electronic device 101 changes. For example, the protective layer 400 may reduce contact between the reinforcement 310 and the first hinge plate 252 by surrounding the space between the reinforcement 310 and the first hinge plate 252. For example, the protective layer 400 may reduce contact between the flexible printed circuit board 320 and the first hinge plate 252 by surrounding the space between the flexible printed circuit board 320 and the second hinge plate 253. The electronic device 101 according to an embodiment may include a first protective layer 410 surrounding a portion of the first hinge plate 252 and / or a second protective layer 420 surrounding a portion of the second hinge plate 253. When the state of the electronic device 101 is repeatedly changed, the portion of the first hinge plate 252 that contacts the flexible printed circuit board 320 and / or the reinforcement 310 may be protected by the protective layer 400. The protective layer 400 may be configured to reduce damage to the first hinge plate 252, the second hinge plate 253, the reinforcement 310, and / or the flexible printed circuit board 320 by reducing contact, and to reduce noise caused by the damage.

[0072] Figure 5a is a cross-sectional view of an exemplary electronic device in an unfolded state. Figure 5b is a cross-sectional view of an exemplary electronic device in a folded state. Figure 5c is an exploded view of a hinge structure of an exemplary electronic device.

[0073] Reference Figure 5a and Figure 5b The protective layer 400 may surround a portion of the first hinge plate 252 and / or a portion of the second hinge plate 253. The protective layer 400 may include a first protective layer 410 surrounding a portion of the first hinge plate 252 and / or a second protective layer 420 surrounding a portion of the second hinge plate 253.

[0074] According to one embodiment, the first hinge plate 252 may include a first surface 252a, a second surface 252b, and a third surface 252c. The first surface 252a may face the flexible display 230 (e.g., the third display area 233). For example, the first surface 252a may be a surface of the first hinge plate 252 facing the +z direction. The second surface 252b may be opposite to the first surface 252a. For example, the second surface 252b may be a surface of the first hinge plate 252 facing the -z direction. The third surface 252c may be a surface between the first surface 252a and the second surface 252b that faces the second hinge plate 253 in the unfolded state. For example, referring to Figure 5a , the third surface 252 c may be a surface of the first hinge plate 252 facing the +x direction.

[0075] According to one embodiment, the second hinge plate 253 may include a fourth surface 253a, a fifth surface 253b, and a sixth surface 253c. The fourth surface 253a may face the flexible display 230 (e.g., the third display area 233). For example, the fourth surface 253a may be a surface of the second hinge plate 253 facing the +z direction. The fifth surface 253b may be opposite to the fourth surface 253a. For example, the fifth surface 253b may be a surface of the second hinge plate 253 facing the -z direction. The sixth surface 253c may be a surface between the fourth surface 253a and the fifth surface 253b that faces the first hinge plate 252 in the unfolded state. For example, referring to Figure 5a , the sixth surface 253 c may be a surface of the second hinge plate 253 facing the +x direction.

[0076] According to one embodiment, in the unfolded state, the first protection layer 410 may be parallel to the boundary between the first housing 210 and the second housing 220 and may surround a portion of the first hinge plate 252 adjacent to the second hinge plate 253. Figure 5a The portion of the first hinge plate 252 may include a portion of the first surface 252a, a portion of the second surface 252b, and the third surface 252c. The first protective layer 410 may at least partially surround the first surface 252a, the second surface 252b, and the third surface 252c.

[0077] According to one embodiment, in the unfolded state, the second protection layer 420 may be parallel to the boundary between the first housing 210 and the second housing 220 and may surround a portion of the second hinge plate 253 adjacent to the first hinge plate 252. Figure 5a The portion of the second hinge plate 253 may include a portion of the fourth surface 253a, a portion of the fifth surface 253b, and the sixth surface 253c. The second protective layer 420 may at least partially surround the fourth surface 253a, the fifth surface 253b, and the sixth surface 253c.

[0078] According to one embodiment, the reinforcement member 310 may be arranged to at least partially overlap the first surface 252a and / or the second surface 252b. For example, the reinforcement member 310 may be arranged parallel to the first surface 252a and / or the second surface 252b in the unfolded state. Figure 5b , when the electronic device 101 changes from the unfolded state to the folded state, the reinforcement 310 can bend while moving along the first hinge plate 252 or the second hinge plate 253. For example, a portion of the reinforcement 310 may be attached to the fourth surface 253a by an adhesive tape 313. One end of the reinforcement 310 may be adhered to the fourth surface 253a, and the other end may be slidable. In the case where the electronic device 101 changes from the unfolded state to the folded state in a state in which a portion of the reinforcement 310 is attached to the fourth surface 253a, the space between the first hinge plate 252 and the second hinge plate 253 may be widened. The one end of the reinforcement 310 attached to the fourth surface 253a may move along the second hinge plate 253, and the other end may move along the one end. Figure 5b In the folded state, the portion of the reinforcement member 310 disposed on the fourth surface 253a may be flat along the fourth surface 253a, and the remaining portion of the reinforcement member 310 spaced apart from the fourth surface 253a may be bent along the curved shape of the third display area 233. When the electronic device 101 changes from the folded state to the unfolded state, the reinforcement member 310 may move along the second hinge plate 253 and be disposed flatly relative to the first surface 252a and / or the second surface 252b.

[0079] According to one embodiment, the first protective layer 410 disposed on a portion of the first surface 252a and the second protective layer 420 disposed on a portion of the fourth surface 253a can be configured to separate the first and second hinge plates 252, 253 from the reinforcement 310, such that the first and second hinge plates 252, 253 do not contact the reinforcement 310. As the state of the electronic device 101 changes, when the reinforcement 310 moves along the first or second hinge plate 252, 253, the reinforcement 310 can contact the first protective layer 410 disposed on that portion of the first surface 252a and the second protective layer 420 disposed on that portion of the fourth surface 253a. For example, when the state of the electronic device 101 changes, the first protective layer 410 can surround a portion of the first surface 252a (which the reinforcement 310 can contact when moving), and the second protective layer 420 can surround a portion of the fourth surface 253a. Even when a rotation operation for changing the state of the electronic device 101 (e.g., between an unfolded state and a folded state) is repeated, the reinforcement member 310 can avoid contacting the first hinge plate 252 and the second hinge plate 253 by contacting the first protective layer 410 and the second protective layer 420. According to one embodiment, the protective layer 400 can reduce damage or wear of the first hinge plate 252, the second hinge plate 253, and the reinforcement member 310 by protecting the first surface 252a and / or the fourth surface 253a. The protective layer 400 can reduce noise caused by damage or wear.

[0080] According to one embodiment, the hinge structure 250 may include a hinge cover 251 disposed below the first hinge plate 252 and the second hinge plate 253. The hinge cover 251 may be disposed between the first housing 210 and the second housing 220 to at least partially surround the first hinge plate 252 and the second hinge plate 253. For example, in the folded state, at least a portion of the hinge cover 251 may be exposed to the outside through the space between the first housing 210 and the second housing 220. For example, in the unfolded state, the hinge cover 251 may be covered by the first housing 210 and the second housing 220.

[0081] Reference Figure 5a and Figure 5b , the flexible printed circuit board 320 may have different shapes depending on whether the electronic device 101 is in a folded state or an unfolded state. Figure 5a In the unfolded state, the flexible printed circuit board 320 may include a first portion 321 , a second portion 322 , and a third portion 323 .

[0082] According to one embodiment, in the unfolded state, the first portion 321 can be moved from a first printed circuit board (eg Figure 3a The first printed circuit board 261 extends to a point around the second surface 252b of the first protective layer 410. Figure 5aThe first portion 321 can bend from the first printed circuit board 261 in the first housing 210 toward the first hinge plate 252, contact the first protective layer 410 surrounding the surface of the first hinge plate 252 facing the hinge cover 251 (e.g., the second surface 252b), and extend. For example, the first portion 321 can extend from the first printed circuit board 261 along the first housing 210 in the +x direction. The first portion 321 can bend from a position corresponding to the first opening 218 in the +z direction toward the second surface 252b of the first hinge plate 252. The first portion 321 bent in the +z direction can pass through the first opening 218 and extend in the +z direction to contact the first protective layer 410 surrounding the second surface 252b. The first portion 321 can extend in the +x direction by contacting the first protective layer 410 surrounding the second surface 252b and can extend to a point in the hinge cover 251 corresponding to the first protective layer 410. A portion of the first portion 321 extending in the +x direction by making contact with the first protective layer 410 may be referred to as a first contact portion 321 a .

[0083] According to one embodiment, in the unfolded state, the second portion 322 can be moved from a second printed circuit board (eg Figure 3a The second printed circuit board 262) extends to a point around the fifth surface 253b of the second protective layer 420. Figure 5a The second portion 322 can bend from the second printed circuit board 262 in the second housing 220 toward the second hinge plate 253, contact the second protective layer 420 surrounding the surface of the second hinge plate 253 facing the hinge cover 251 (e.g., the fifth surface 253b), and extend. For example, the second portion 322 can extend from the second printed circuit board 262 along the second housing 220 in the -x direction. The second portion 322 can bend from a position corresponding to the second opening 228 in the +z direction toward the fifth surface 253b of the second hinge plate 253. The second portion 322 bent in the +z direction can pass through the second opening 228 and extend in the +z direction to contact the second protective layer 420 surrounding the fifth surface 253b. The second portion 322 can extend in the -x direction by contacting the second protective layer 420 surrounding the fifth surface 253b and can extend to a point in the hinge cover 251 corresponding to the second protective layer 420. The portion 412 a of the second portion 322 extending in the −x direction by contacting the second protective layer 420 may be referred to as a second contact portion 322 a .

[0084] According to one embodiment, the third portion 323 may be disposed between the first portion 321 and the second portion 322. Figure 5aOne end of the third portion 323 may be bent in the -z direction from the first portion 321 toward the hinge cover 251. The third portion 323 bent in the -z direction may extend in the -z direction to be adjacent to the hinge cover 251. The third portion 323 may be bent in the +x direction by contacting one side of the inner surface of the hinge cover 251 and may extend in the +x direction along the hinge cover 251. The third portion 323 may be bent in the +z direction by contacting the other side of the inner surface of the hinge cover 251. The third portion 323 bent in the +z direction may extend in the +z direction and extend to one end of the second portion 322 that contacts the protective layer 400 surrounding the fifth surface 253b.

[0085] Reference Figure 5b In the folded state, the first hinge plate 252 and the second hinge plate 253 can change the shape of the flexible printed circuit board 320. When the electronic device 101 changes from the folded state to the unfolded state, the first hinge plate 252 and the second hinge plate 253 can rotate while pushing both sides of the third portion 323. When the first housing 210 and the second housing 220 rotate to become parallel to each other, the first portion 321 and the second portion 322 can unfold. In the folded state, the portion of the first hinge plate 252 surrounded by the first protective layer 410 and the portion of the second hinge plate 253 surrounded by the second protective layer 420 can be separated from the flexible printed circuit board 320. In the folded state, the first hinge plate 252 and the second hinge plate 253 can pass through the first protective layer 410 and the second protective layer 420 without directly contacting the flexible printed circuit board 320.

[0086] According to one embodiment, the first protective layer 410 provided in a portion of the second surface 252b and the second protective layer 420 provided in a portion of the fifth surface 253b may be configured to separate the first hinge plate 252 and the second hinge plate 253 from the flexible printed circuit board 320 so that the first hinge plate 252 and the second hinge plate 253 do not contact the flexible printed circuit board 320. Figure 5a and Figure 5bAs shown, in both the unfolded and folded states of the electronic device 101, the protective layer 400 can separate the first hinge plate 252 and the second hinge plate 253 from the flexible printed circuit board 320. In the unfolded state, the protective layer 400 can surround the first hinge plate 252 and / or the second hinge plate 253 to cover the first contact portion 321a and / or the second contact portion 322a. For example, in the unfolded state, the first protective layer 410 can have dimensions that cover the first contact portion 321a of the first portion 321, which extends due to contact with the first protective layer 410. In the unfolded state, the second protective layer 420 can have dimensions that cover the second contact portion 322a of the second portion 322, which extends due to contact with the second protective layer 420. According to one embodiment, the protective layer 400 can reduce damage or wear to the first hinge plate 252, the second hinge plate 253, and the flexible printed circuit board 320 by protecting the second surface 252b and / or the fifth surface 253b. The protective layer 400 may reduce noise that may occur due to damage or wear.

[0087] Reference Figure 5a When the electronic device 101 is in the unfolded state, the first hinge plate 252 and the second hinge plate 253 can be arranged on substantially the same plane. When the electronic device 101 is in the unfolded state, the first housing 210 and the second housing 220 can be arranged on substantially the same plane. For example, in the unfolded state, since the first surface 252a of the first hinge plate 252 and the fourth surface 253a of the second hinge plate 253 face substantially the same direction, the angle between the first surface 252a and the fourth surface 253a can be substantially approximately 180 degrees. For example, in the unfolded state, since the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 face substantially the same direction, the angle between the first surface 211 and the third surface 221 can be substantially approximately 180 degrees.

[0088] Reference Figure 5b , when the electronic device 101 changes from the unfolded state to the folded state, the rotation angle range of the first shell 210 and / or the second shell 220 and the rotation angle range of the first hinge plate 252 and / or the second hinge plate 253 may be different from each other. According to the difference in the rotation angle range, the third display area 233 of the flexible display 230 can bend in a teardrop shape in the folded state. In the folded state, the second hinge plate 253 may not be parallel to the first hinge plate 252 and may have an inclination. For example, in the folded state, the direction facing the first surface 252a of the first hinge plate 252 and the direction facing the fourth surface 253a of the second hinge plate 253 may not face opposite directions to each other and may have an inclination relative to each other. For example, the angle between the first surface 252a and the fourth surface 253a (e.g. Figure 5bThe angle A) may be an acute angle less than 90 degrees.

[0089] According to one embodiment, when the electronic device 101 changes from an unfolded state to a folded state, the rotation angle range of the first housing 210 and the second housing 220 may be within a first angle range. For example, the first housing 210 and / or the second housing 220 may rotate from an unfolded state, in which the first housing 210 and the second housing 220 are arranged parallel to each other on substantially the same plane, to a folded state in which the first housing 210 and the second housing 220 are opposite each other. In the unfolded state, the angle between the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 may be approximately 180 degrees. In the folded state, since the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 are parallel to each other, the angle between the first surface 211 and the third surface 221 may be substantially approximately 0°.

[0090] For example, when the electronic device 101 is changed from the unfolded state to the folded state due to an external force (eg, a force applied by a user), the first housing 210 and the second housing 220 can be rotated by approximately 90 degrees (eg, Figure 5b The second housing 220 and the second housing 220 are arranged parallel to each other at an angle B). For example, when the electronic device 101 changes from the unfolded state to the folded state, the second housing 220 can rotate approximately 180 degrees relative to the first housing 210 to face the first housing 210. According to one embodiment, when the electronic device 101 changes from the unfolded state to the folded state, the sum of the rotation angles of the first housing 210 and the second housing 220 can be approximately 180 degrees. For example, the first angle range can be approximately 0° to approximately 180°.

[0091] According to one embodiment, when the electronic device 101 changes from the unfolded state to the folded state, the rotation angle range of the first hinge plate 252 and the second hinge plate 253 may be within a second angle range that is larger than the first angle range. For example, the first hinge plate 252 and the second hinge plate 253 may rotate from the unfolded state to the folded state, where in the unfolded state the first hinge plate 252 and the second hinge plate 253 are arranged parallel to each other on substantially the same plane, and in the folded state the first hinge plate 252 and the second hinge plate 253 have an inclination relative to each other. In the unfolded state, the angle between the first surface 252a of the first hinge plate 252 and the fourth surface 253a of the second hinge plate 253 may be approximately 180 degrees. In the folded state, the first surface 252a of the first hinge plate 252 and the fourth surface 253a of the second hinge plate 253 may form an acute angle relative to each other (e.g., Figure 5b Angle A).

[0092] For example, when the electronic device 101 changes from the unfolded state to the folded state, each of the first hinge plate 252 and the second hinge plate 253 can be rotated by an angle greater than 90 degrees (eg, Figure 5b Angle C) and have an inclination relative to each other. For example, Figure 5b As shown, when the electronic device 101 changes from the unfolded state to the folded state, the first hinge plate 252 and the second hinge plate 253 can each rotate an angle a greater than 90 degrees (e.g., 100 degrees). The angle between the first surface 252a and the fourth surface 253a can be between 2a and 180 degrees (e.g., 20 degrees). According to one embodiment, when the electronic device 101 changes from the unfolded state to the folded state, the sum of the rotation angles of the second hinge plate 253 and the rotation angle of the fourth hinge plate 253 can be greater than 180 degrees. For example, the second angle range can be approximately 0° to approximately 200°. However, this is not limiting.

[0093] The above-mentioned rotation operation of the first hinge plate 252 and the second hinge plate 253 can be achieved by Figure 5c The hinge structure 250 shown is used to achieve this. Figure 5c , the hinge structure 250 may include a first hinge plate 252 , a second hinge plate 253 , and a hinge bracket 255 . The first hinge plate 252 and the second hinge plate 253 may be coupled to the hinge bracket 255 .

[0094] According to one embodiment, the hinge bracket 255 can provide a rotation axis for the first hinge plate 252 and the second hinge plate 253. For example, the hinge bracket 255 can include a first guide groove 255a to which the first hinge plate 252 is slidably connected, and a second guide groove 255b to which the second hinge plate 253 is slidably connected. For example, the first hinge plate 252 can include a first coupling portion 252d that is inserted into and slidable within the first guide groove 255a. For example, the second hinge plate 253 can include a second coupling portion 253d that is inserted into and slidable within the second guide groove 255b. The first hinge plate 252 can slide along the first guide groove 255a via the first coupling portion 252d, and the second hinge plate 253 can slide along the second guide groove 255b via the second coupling portion 253d. Because the first and second guide grooves 255a and 255b have curvatures, the first and second coupling portions 252d and 253d can rotate as they slide. Conventional hinges can rotate about a constant axis of rotation, where the axis of rotation does not change during rotation. Conversely, because the first hinge plate 252 and the second hinge plate 253 rotate while sliding along the first guide groove 255a and the second guide groove 255b, the axis of rotation can change. For example, when the first hinge plate 252 slides along the first guide groove 255a and the second hinge plate 253 slides along the second guide groove 255b, the space between the first hinge plate 252 and the second hinge plate 253 can widen. Due to the widening space between the first hinge plate 252 and the second hinge plate 253, the first hinge plate 252 and the second hinge plate 253 can tilt relative to each other while fully moving along the first guide groove 255a and the second guide groove 255b.

[0095] According to one embodiment, the electronic device 101 can change from an unfolded state to a folded state by moving the first hinge plate 252 and / or the second hinge plate 253. Because the rotation angle range of the first hinge plate 252 and the second hinge plate 253 is different from the rotation angle range of the first housing 210 and the second housing 220, the electronic device 101 according to this embodiment can provide a structure in which the curvature of the flexible display 230 changes smoothly in the folded state. For example, in the folded state, if the first hinge plate 252 and the second hinge plate 253 are arranged parallel to each other, the curvature of the flexible display 230 supported by the first hinge plate 252 and the second hinge plate 253 may change rapidly between the first hinge plate 252 and the second hinge plate 253. According to this embodiment, in the folded state, because the first hinge plate 252 and the second hinge plate 253 are tilted relative to each other, the curvature of the flexible display 230 can change smoothly. Since the curvature of the flexible display 230 changes smoothly, damage to the flexible display 230 can be reduced. For example, in the folded state, the formation of wrinkles in the folded area of the flexible display 230 (eg, the third display area 233 ) may be reduced.

[0096] Figure 6 An exemplary protective layer is shown in a state prior to being attached to a hinge plate. Figure 7 The process of attaching the protective layer of the exemplary electronic device 101 to the hinge plate is shown. Figure 8 Schematically showing the Figure 3a sectional view of an exemplary electronic device taken along line BB'.

[0097] Reference Figure 6 and Figure 7 , the protective layer 400 may be configured with portions having different structures depending on the position at which the hinge plates 252 and 253 are attached. According to one embodiment, since the reinforcement 310 may extend along the third display area 233, the protective layer 400 may cover the entire area of the surfaces of the hinge plates 252 and 253 facing the flexible display 230 (e.g., the first surface 252a and the fourth surface 253a) to separate the contact between the reinforcement 310 disposed above the hinge plates 252 and 253 and the hinge plates 252 and 253. According to one embodiment, since the flexible printed circuit board 320 only passes through a partial area of the hinge structure 250, the protective layer 400 may only cover the surfaces opposite to the surfaces of the hinge plates 252 and 253 facing the flexible display 230 (e.g., the fourth surface 252a and the fourth surface 253a). Figure 5a The hinge plates 252 and 253 are separated from each other by a portion of the second surface 252 b and the fifth surface 253 b to separate the contact between the flexible printed circuit board 320 disposed below the hinge plates 252 and 253 and the hinge plates 252 and 253 .

[0098] Reference Figure 6 and Figure 7 The first protective layer 410 may include a first portion 411 and a second portion 412. For example, the first portion 411 of the first protective layer 410 may be attached to the first surface 252a of the first hinge plate 252. The first portion 411 may extend along the first surface 252a. For example, the length of the first portion 411 may be substantially the same as the length of the first plate. According to one embodiment, the second portion 412 may protrude from a portion of the first portion 411. For example, the second portion 412 may protrude from a portion of the periphery of the first portion 411 that faces the second hinge plate 253. For example, the second portion 412 may protrude from the portion of the first portion 411 in the -x direction.

[0099] The second protective layer 420 may be symmetrical with the first protective layer 410. For example, the second protective layer 420 may include a third portion 421 corresponding to the first portion 411 and a fourth portion 422 corresponding to the second portion 412. The third portion 421 may be attached to the fourth surface 253a of the second hinge plate 253. The third portion 421 may extend along the fourth surface 253a. For example, the length of the third portion 421 may be substantially the same as the length of the second plate. According to one embodiment, the fourth portion 422 may protrude from a portion of the third portion 421. For example, the fourth portion 422 may protrude from a portion of the third portion 421 that faces the first hinge plate 252 within the perimeter of the third portion 421. For example, the fourth portion 422 may protrude from the portion of the third portion 421 in the -x direction.

[0100] Reference Figure 7 The first protective layer 410 may surround a portion of the first hinge plate 252 adjacent to the second hinge plate 253 , and the second protective layer 420 may surround a portion of the second hinge plate 253 adjacent to the first hinge plate 252 .

[0101] Figure 7700a represents a state in which the first portion 411 of the first protective layer 410 is attached to the first surface 252a, and the third portion 421 of the second protective layer 420 is attached to the fourth surface 253a. When the first protective layer 410 is attached to the first hinge plate 252, the first portion 411 may be attached first to the first surface 252a. When the first protective layer 410 is attached to the first surface 252a, the perimeter of the first portion 411, in which the second portion 412 is formed, may be attached to correspond to the perimeter of the first hinge plate 252. While the first portion 411 is attached to the first surface 252a, the second portion 412 protruding from the first portion 411 may protrude from the first surface 252a toward the second hinge plate 253. When the second protective layer 420 is attached to the second hinge plate 253, the third portion 421 may be attached first to the fourth surface 253a. When the second protective layer 420 is attached to the fourth surface 253a, the periphery of the third portion 421 in which the fourth portion 422 is formed may be attached to correspond to the periphery of the second hinge plate 253. In a state in which the third portion 421 is attached to the fourth surface 253a, the fourth portion 422 protruding from the third portion 421 may protrude in a direction from the fourth surface 253a toward the first hinge plate 252.

[0102] Figure 7 700b shows a state in which a portion 412a of the second portion 412 of the first protective layer 410 is attached to the third surface 252c, and a portion 422a of the fourth portion 422 of the second protective layer 420 is attached to the sixth surface 253c. This portion 412a of the second portion 412 can be attached to the third surface 252c. With the second portion 412 protruding from the first hinge plate 252, this portion 412a of the second portion 412 can be attached to the third surface 252c between the first and second surfaces 252a, 252b, while being bent 90 degrees relative to the first portion 411. The remaining portion 412b of the second portion 412 not attached to the third surface 252c can protrude from the periphery of the third surface 252c. This portion 422a of the fourth portion 422 can be attached to the sixth surface 253c. In a state where the second portion 412 protrudes from the second hinge plate 253, the portion 422a of the fourth portion 422 may be attached to the sixth surface 253c between the fourth surface 253a and the fifth surface 253b while being bent 90 degrees relative to the third portion 421. The remaining portion 422b of the fourth portion 422 not attached to the sixth surface 253c may protrude from the periphery of the sixth surface 253c.

[0103] Figure 7700c represents a state in which the first protective layer 410 is completely attached to the first hinge plate 252 and the second protective layer 420 is completely attached to the second hinge plate 253. To allow the first protective layer 410 to surround the portion of the first hinge plate 252 adjacent to the second hinge plate 253, the remaining portion 412b of the second portion 412 can be attached to the second surface 252b. The remaining portion 412b of the second portion 412, which protrudes from the periphery of the third surface 252c, can be attached to the second surface 252b while being bent 90 degrees relative to the portion 412a of the second portion 412. To allow the second protective layer 420 to surround the portion of the second hinge plate 253 adjacent to the first hinge plate 252, the remaining portion 422b of the fourth portion 422 can be attached to the fifth surface 253b. The remaining portion 422 b of the fourth portion 422 protruding from the periphery of the sixth surface 253 c may be attached to the sixth surface 253 c while being bent at 90 degrees with respect to the portion 422 a of the fourth portion 422 .

[0104] According to one embodiment, the protective layer 400 surrounding a portion of the hinge plates 252 and 253 can be integrally formed. To ensure that the integrally formed protective layer 400 surrounds a portion of the hinge plates 252 and 253, the lengths of the second portion 412 and the fourth portion 422 can be longer than the lengths of the third surface 252c and the sixth surface 253c, respectively. To ensure that the integrally formed protective layer 400 surrounds a portion of the hinge plates 252 and 253, the integrally formed protective layer 400 can be securely attached and prevent detachment from the hinge plates 252 and 253. When the electronic device 101 repeatedly changes state (e.g., folded or unfolded), the reinforcement member 310 supporting the third display area 233 may repeatedly contact the protective layer 400. Because the reinforcement member 310 can slide along the first hinge plate 252 or the second hinge plate 253, the protective layer 400 may be damaged by contact between the reinforcement member 310 and the protective layer 400. According to one embodiment, the thickness of the first portion 411 facing the reinforcement member 310 can be thicker than the thickness of the second portion 412. Similarly, the thickness of the third portion 421 may be thicker than the thickness of the fourth portion 422 .

[0105] According to one embodiment, the second portion 412 may protrude from a portion of the periphery of the first portion 411, and the fourth portion 422 may protrude from a portion of the periphery of the third portion 421. The second portion 412 and the fourth portion 422 may be formed at positions corresponding to the area where the flexible printed circuit board 320 passes through the hinge structure 250. When the first portion 411 is attached to the first surface 252a, the position of the second portion 412 may correspond to the area where the flexible printed circuit board 320 passes through the hinge structure 250. When the third portion 421 is attached to the fourth surface 253a, the position of the fourth portion 422 may correspond to the area where the flexible printed circuit board 320 passes through the hinge structure 250. For example, referring again to Figure 4 In the area where the flexible printed circuit board 320 passes through the hinge structure 250, the protective layer 400 may surround the surfaces of the hinge plates 252 and 253 that face the flexible printed circuit board 320. According to one embodiment, the protective layer 400 may cover only the areas of the hinge plates 252 and 253 corresponding to the areas where the flexible printed circuit board 320 passes through the hinge structure 250, without covering the entire areas of the second surface 252b and the fifth surface 253b.

[0106] Reference Figure 8 In areas where the flexible printed circuit board 320 does not pass through the hinge structure 250, the protective layer 400 may not surround the surfaces of the hinge plates 252 and 253 facing the flexible printed circuit board 320, and may surround only the surfaces facing the flexible display 230. Since the protective layer 400 having this structure does not include unnecessary portions, manufacturing can be easy and inexpensive. To allow the protective layer 400 to separate the contact between the flexible printed circuit board 320 and the hinge plates 252 and 253, the widths of the second portion 412 and the fourth portion 422 may be greater than the width of the flexible printed circuit board 320.

[0107] Figure 9 A reinforcement member is shown provided in an exemplary electronic device in an unfolded state, from which a flexible display is omitted. Figure 10a Schematically showing the Figure 9 A cross-sectional view of an exemplary electronic device taken along line CC'. Figure 10b Schematically showing the Figure 9 sectional view of an exemplary electronic device taken along line DD'.

[0108] Reference Figure 9The reinforcement 310 may include a first reinforcement 311 and a second reinforcement 312 that are spaced apart from each other. The first reinforcement 311 may be adjacent to the first housing 210 of the first housing 210 and the second housing 220. The second reinforcement 312 may be spaced apart from the first reinforcement 311 and may be adjacent to the second housing 220 of the first housing 210 and the second housing 220.

[0109] According to one embodiment, the boundary between the first reinforcement 311 and the second reinforcement 312 may not be parallel. For example, the reinforcement 310 may have a first region 310a, a second region 310b, and a third region 310c. In the first region 310a, the gap between the first reinforcement 311 and the second reinforcement 312 corresponds to the folding axis f. In the second region 310b, the gap is spaced apart from the folding axis f in the direction in which the first housing 210 is disposed. In the third region 310c, the gap is spaced apart from the folding axis f in the direction in which the second housing 220 is disposed. For example, the first region 310a may include the folding axis f. For example, the second region 310b may be spaced apart from the folding axis f toward the first housing 210. For example, the third region 310c may be spaced apart from the folding axis f toward the second housing 220.

[0110] Reference Figure 10a The widths of the first reinforcement 311 and the second reinforcement 312 in the first region 310a may be substantially the same. The first reinforcement 311 may be disposed between the flexible display 230 and the first hinge plate 252, and the second reinforcement 312 may be disposed between the flexible display 230 and the second hinge plate 253. The gap between the first reinforcement 311 and the second reinforcement 312 may correspond to the folding axis f. The first reinforcement 311 may be attached to the first hinge plate 252, and the second reinforcement 312 may be attached to the second hinge plate 253. A first protective layer 410 may be disposed between the first reinforcement 311 and the first hinge plate 252 to separate the contact between the first reinforcement 311 and the first hinge plate 252. A second protective layer 420 may be disposed between the second reinforcement 312 and the second hinge plate 253 to separate the contact between the second reinforcement 312 and the second hinge plate 253.

[0111] Reference Figure 10b , in the second region 310b and the third region 310c, the widths of the first reinforcement 311 and the second reinforcement 312 may be different. Figure 10bIn the third region 310c shown, the width of the first reinforcement 311 can be wider than the width of the second reinforcement 312. The first reinforcement 311 can be provided on the first hinge plate 252 and the second hinge plate 253, and the second reinforcement 312 can be provided on the second hinge plate 253. The gap between the first reinforcement 311 and the second reinforcement 312 can be spaced apart from the folding axis f in a direction toward the second housing 220 (e.g., the -x direction). Although not shown, in the second region 310b, the width of the second reinforcement 312 can be wider than the width of the first reinforcement 311. Even in the case where the reinforcement 310 includes separate first and second reinforcements 311 and 312, the protective layer 400 can separate the contact between the reinforcement 310 and the hinge plates 252 and 253. Even when the boundary of the reinforcement 310 is spaced apart from the folding axis f in the second region 310b and the third region 310c, the protective layer 400 can separate the contact between the reinforcement 310 and the hinge plates 252 and 253 by surrounding a portion of the hinge plates 252 and 253. The hinge plates 252 and 253 can be protected by the protective layer 400.

[0112] According to one embodiment, an electronic device (e.g. Figure 3a The electronic device 101 may include a flexible display (eg Figure 2a flexible display 230), a first housing (eg Figure 3a The first shell 210), the second shell (eg Figure 3a The second housing 220), the hinge structure (eg Figure 5c Hinge structure 250), reinforcement (e.g. Figure 4 reinforcement 310), a flexible printed circuit board (e.g. Figure 5a flexible printed circuit board 320) and a protective layer (eg Figure 5a The flexible display may include a first display area (eg, Figure 2a The first display area 231), the second display area (eg Figure 2a The second display area 232) and the third display area (eg Figure 2a The third display area 233 may be located between the first display area and the second display area. The first housing may support the first display area. The first housing may be disposed below the first display area. The second housing may be configured to be rotatable relative to the first housing based on a folding axis. The second housing may support the second display area. The second housing may be disposed below the second display area. The hinge structure may include a first hinge plate (e.g., Figure 5c The first hinge plate 252) and the second hinge plate (eg Figure 5cThe first hinge plate and the second hinge plate can be arranged along the boundary between the first shell and the second shell. The hinge structure can be arranged below the third display area. The reinforcement can support the third display area. The reinforcement can be arranged between the hinge structure and the third display area. The flexible printed circuit board FPCB can be connected from the first printed circuit board (e.g. Figure 3a The first printed circuit board 261) PCB extends through the hinge structure to the second PCB (eg, Figure 3a The second printed circuit board 262 is positioned adjacent to the first hinge plate. In the unfolded state, in which the first display area faces a first direction corresponding to the second display area, a protective layer parallel to the boundary can cover a portion of the first hinge plate adjacent to the second hinge plate. The rotation angle range of the first and second hinge plates can be greater than the rotation angle range of the first and second shells. According to one embodiment of the present disclosure, the protective layer can protect the hinge plate by surrounding a portion of the hinge plate. The protective layer can be configured to separate contact between the hinge plate and the reinforcement, and contact between the hinge plate and the flexible printed circuit board when the electronic device changes between the folded and unfolded states. According to one embodiment, damage or wear to the reinforcement, flexible printed circuit board, and hinge plate can be reduced, and noise caused by damage or wear can be reduced. According to one embodiment, the hinge structure can rotate the third display area of the flexible display to bend into a teardrop shape in the folded state. For example, when the electronic device changes from the unfolded state to the folded state, the first and second shells can each rotate approximately 90 degrees, and the first and second hinge plates can each rotate approximately 100 degrees. According to one embodiment, in the folded state, the first and second hinge plates are tilted relative to each other, allowing the curvature of the flexible display to change gently. This gentle change in the curvature of the flexible display can reduce damage to the flexible display. For example, in the folded state, wrinkles can be reduced in the folded region of the flexible display (e.g., the third display region).

[0113] According to one embodiment, the protective layer can be configured to separate the first hinge plate from the reinforcement in multiple states including an unfolded state and a folded state, and in the folded state, the first direction and the second direction are opposite to each other. The protective layer can be configured to separate the first hinge plate from the FPCB in the multiple states. According to one embodiment of the present disclosure, the protective layer can separate the contact between the hinge plate and the reinforcement and the contact between the hinge plate and the flexible printed circuit board by surrounding the hinge plate. According to one embodiment, since the protective layer protects the hinge plate, when the state of the electronic device changes, damage or wear of the reinforcement, the flexible printed circuit board and the hinge plate can be reduced, and noise caused by damage or wear can be reduced.

[0114] According to one embodiment, the first hinge plate may include a first surface (eg Figure 5a a first surface 252a), a second surface (e.g. Figure 5a The second surface 252b) and the third surface (eg Figure 5a The first surface may face the flexible display. The second surface may be opposite the first surface. The third surface may face the second hinge plate in the unfolded state. The third surface may be disposed between the first and second surfaces. The protective layer may at least partially surround the first, second, and third surfaces. According to one embodiment of the present disclosure, in the unfolded state, the protective layer may at least partially surround the portion where the hinge plates are adjacent to each other. The portion where the hinge plates are adjacent to each other may be a portion that may contact another component (e.g., a reinforcement and / or a flexible printed circuit board) when the electronic device performs a rotation operation. The protective layer may be disposed around this portion.

[0115] According to an embodiment, the protective layer may include a first portion (eg Figure 6 The first part 411) and the second part (eg Figure 6 The second portion 412 is attached to the first surface of the first hinge plate facing the flexible display. The second portion can protrude from a perimeter of the first portion that faces the second hinge plate. In the unfolded state, the second portion can be attached to a second surface of the first hinge plate opposite the first surface and to a third surface of the first hinge plate facing the second hinge plate between the first and second surfaces.

[0116] According to one embodiment, the first portion may be attached to the first surface, a portion of the second portion may be attached to the third surface in a bent state relative to the first portion, and the remaining portion of the second portion may be attached to the second surface in a bent state relative to the portion of the second portion.

[0117] According to one embodiment, the thickness of the first portion may be thicker than that of the second portion.According to one embodiment of the present disclosure, since the reinforcement is slidable by operation of the hinge plate, the thickness of the first portion contacting the reinforcement may be thicker than that of the second portion.

[0118] According to one embodiment, the second portion may protrude from a portion of the periphery of the first portion at a location corresponding to the area where the FPCB passes through the hinge structure. According to one embodiment of the present disclosure, a protective layer may be attached to surround a portion of the hinge plate. Since the reinforcement extends along the entire area of the hinge plate, the first portion may correspond to a surface of the hinge plate. Since the flexible printed circuit board only contacts a portion of the hinge plate, the second portion may correspond to a portion of the other surface of the hinge plate. The second portion may cover the other surface by protruding from a portion of the periphery of the first portion and bending.

[0119] According to one embodiment, the hinge structure may further include a hinge cover (e.g. Figure 5a The hinge cover 251 can be provided below the first hinge plate and the second hinge plate. The hinge cover can be provided between the first housing and the second housing. In the unfolded state, the flexible printed circuit board can include a first portion (e.g. Figure 5a The first part 321), the second part (e.g. Figure 5a The second part 322) and the third part (e.g. Figure 5a The first portion may be bent from the first PCB toward the first hinge plate in the unfolded state. The first portion may be aligned with a surface (e.g., a surface of the hinge cover facing the first hinge plate) covering the first hinge plate. Figure 5a The second portion may extend in contact with the protective layer covering the second surface 253b of the hinge cover. In the unfolded state, the second portion may bend from the second PCB toward the second hinge plate. The second portion may extend in contact with the protective layer covering the surface of the second hinge plate facing the hinge cover. The third portion may be disposed between the first portion and the second portion. The third portion may be disposed in the hinge cover.

[0120] According to one embodiment, the protective layer may surround the surface of the hinge plate facing the hinge structure in the unfolded state, such that the protective layer contacts a portion of the first portion of the FPCB, and the portion of the first portion extends in contact with the protective layer surrounding the surface of the first hinge plate facing the hinge cover. According to one embodiment of the present disclosure, in the unfolded state, the flexible printed circuit board may include multiple curved regions. In the unfolded state, the multiple curved regions of the flexible printed circuit board may contact the first hinge plate and the second hinge plate. The protective layer may separate the contact between the flexible printed circuit board and the hinge plate by surrounding the hinge plate.

[0121] According to one embodiment, in the unfolded state, the reinforcement member may be flat, and in the folded state where the first direction and the second direction are opposite to each other, the reinforcement member may be bent.

[0122] According to one embodiment, a reinforcement member may be attached to one of the first hinge plate and the second hinge plate. According to one embodiment of the present disclosure, the reinforcement member may provide rigidity to the third display area, which is the flexible area of the flexible display. In the unfolded state, the reinforcement member may be flat to correspond to the third display area. In the folded state, the reinforcement member may be curved to correspond to the third display area.

[0123] According to one embodiment, the reinforcement member may include a first reinforcement member (eg Figure 9 The first reinforcement 411 and the second reinforcement (eg Figure 9The first reinforcement member may be adjacent to the first shell of the first shell and the second shell. The second reinforcement member may be spaced apart from the first reinforcement member. The second reinforcement member may be adjacent to the second shell of the first shell and the second shell.

[0124] According to one embodiment, the reinforcement may have a first region (e.g. Figure 9 The first area 310a), the second area (eg Figure 9 The second region 310b) and the third region (eg Figure 9 The third area 310c of the display panel may be provided. In the first area, the gap between the first reinforcement and the second reinforcement may correspond to the folding axis. In the second area, the gap may be spaced apart from the folding axis in the direction in which the first shell is provided. In the third area, the gap may be spaced apart from the folding axis in the direction in which the second shell is provided. According to an embodiment of the present disclosure, the reinforcement may be formed integrally or may include separate components. For example, the reinforcement may include a first reinforcement adjacent to the first shell and a second reinforcement adjacent to the second shell. The separate reinforcements may support the third display area. The separate reinforcements may correspond to the boundary between the first shell and the second shell, or may be closer to either the first shell or the second shell.

[0125] According to one embodiment, the hinge structure may further include a hinge bracket (e.g. Figure 5c The hinge bracket 255 may include a first guide groove (eg Figure 5c The first guide groove 255a) and the second guide groove (eg Figure 5c The first hinge plate can be slidably connected to the first guide groove. The second hinge plate can be slidably connected to the second guide groove. According to one embodiment of the present disclosure, the first and second hinge plates can be configured to rotate within a rotation angle range that is different from the rotation angle range of the first and second shells. The first and second hinge plates connected to the hinge bracket can be arranged to have an inclination relative to each other when folded. With this arrangement, the third display area can be curved in a teardrop shape.

[0126] According to one embodiment, the electronic device may further include a second protective layer (eg Figure 5a ), which is different from the first protective layer corresponding to the protective layer (e.g., Figure 5a (a first protective layer 410). In the unfolded state, a second protective layer parallel to the boundary may surround the portion of the second hinge plate adjacent to the first hinge plate. According to one embodiment of the present disclosure, each of the first hinge plate and the second hinge plate may be surrounded by a protective layer. The protective layer may include a first protective layer surrounding the first hinge plate and a second hinge plate surrounding the second hinge plate.

[0127] According to one embodiment, an electronic device (e.g. Figure 3a The electronic device 101 may include a flexible display (eg Figure 2a flexible display 230), a first housing (eg Figure 3a The first shell 210), the second shell (eg Figure 3a The second housing 220), the hinge structure (eg Figure 5c hinge structure 250), flexible printed circuit board (eg Figure 5a Flexible printed circuit board 320), a first protective layer (eg Figure 5a a first protective layer 410 and a second protective layer (eg Figure 5a The flexible display may include a first display area (eg, Figure 2a The first display area 231), the second display area (eg Figure 2a The second display area 232) and the third display area (eg Figure 2a The third display area 233 may be located between the first display area and the second display area. The first housing may be disposed below the first display area. The second housing may be configured to be rotatable relative to the first housing based on a folding axis. The second housing may be disposed below the second display area. The hinge structure may include a first hinge plate (e.g., Figure 5c The first hinge plate 252) and the second hinge plate (eg Figure 5c The first hinge plate and the second hinge plate can be arranged along the boundary between the first shell and the second shell. The hinge structure can be arranged below the third display area. The flexible printed circuit board FPCB can be connected from the first printed circuit board (e.g. Figure 3a The first printed circuit board 261) PCB extends through the hinge structure to the second PCB (eg, Figure 3a (The second printed circuit board 262 is positioned adjacent to the first hinge plate.) In the unfolded state, a first protective layer parallel to the boundary can surround the portion of the first hinge plate adjacent to the second hinge plate. In the unfolded state, a first direction facing the first display area and a second direction facing the second display area correspond to each other. In the unfolded state, a second protective layer parallel to the boundary can surround the portion of the second hinge plate adjacent to the first hinge plate. In the folded state, where the first and second directions are opposite to each other, the second hinge plate can tilt relative to the first hinge plate.

[0128] According to one embodiment, the electronic device may further include a reinforcement member (eg Figure 4The reinforcement 310 may support the third display area. The reinforcement may be disposed between the hinge structure and the third display area. The first and second protective layers may be configured to separate the first and second hinge plates from the reinforcement and from the flexible printed circuit board in a plurality of states, including an unfolded state and a folded state.

[0129] According to one embodiment, the first hinge plate may include a first surface (eg Figure 5a a first surface 252a), a second surface (e.g. Figure 5a The second surface 252b) and the third surface (eg Figure 5a The first surface may face the flexible display. The second surface may be opposite to the first surface. The third surface may face the second hinge plate in the unfolded state. The third surface may be disposed between the first surface and the second surface. The protective layer may at least partially surround the first surface, the second surface, and the third surface. The second hinge plate may include a fourth surface (e.g., Figure 5a The fourth surface 253a), the fifth surface (eg Figure 5a The fifth surface 253b) and the sixth surface (eg Figure 5a The first protective layer may at least partially surround the first surface, the second surface, and the third surface. The second protective layer may at least partially surround the fourth surface, the fifth surface, and the sixth surface.

[0130] According to one embodiment, the hinge structure may further include a hinge cover (e.g. Figure 5a The hinge cover 251 can be provided below the first hinge plate and the second hinge plate. The hinge cover can be provided between the first housing and the second housing. In the unfolded state, the flexible printed circuit board can include a first portion (e.g. Figure 5a The first part 321), the second part (e.g. Figure 5a The second part 322) and the third part (e.g. Figure 5a The first portion may be bent from the first PCB toward the first hinge plate in the unfolded state. The first portion may be aligned with a surface (e.g., a surface of the hinge cover facing the first hinge plate) covering the first hinge plate. Figure 5a The second portion may extend in contact with the protective layer covering the second surface 253b of the hinge cover. In the unfolded state, the second portion may bend from the second PCB toward the second hinge plate. The second portion may extend in contact with the protective layer covering the surface of the second hinge plate facing the hinge cover. The third portion may be disposed between the first portion and the second portion. The third portion may be disposed in the hinge cover.

[0131] According to one embodiment, in the unfolded state, the first protective layer may contact the first portion to separate the first hinge plate from the flexible printed circuit board. In the unfolded state, the second protective layer may contact the second portion to separate the second hinge plate from the flexible printed circuit board.

[0132] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the aforementioned ones.

[0133] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments and include various variations, equivalents, or replacements of the corresponding embodiments. With respect to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of a noun corresponding to an item may include one or more things. As used herein, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B, and C," and "at least one of A, B, or C" may include any one or all possible combinations of the items listed together in the corresponding one of the phrases. As used herein, terms such as "first" and "second" or "first" and "second" may be used to simply distinguish a corresponding component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled” or “connected” to another element (e.g., a second element) with or without the term “operably” or “communicatively”, it means that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0134] As used in conjunction with various embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component or its smallest unit or portion adapted to perform one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0135] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute it under the control of the processor with or without one or more other components. This allows the machine to be operated to perform at least one function in accordance with the called at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves). However, this term does not distinguish between situations where data is stored semi-permanently and situations where data is stored temporarily in the storage medium.

[0136] According to one embodiment, the methods according to various embodiments of the present disclosure may be included in and provided by a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), distributed online (e.g., by downloading or uploading) via an app store (e.g., PlayStore™), or distributed directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory on a manufacturer's server, an app store's server, or a relay server.

[0137] According to various embodiments, each of the above-mentioned components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as performed by the corresponding one of the multiple components before integration. According to various embodiments, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device comprising: A flexible display comprising a first display area, a second display area, and a third display area between the first display area and the second display area; a first housing, located below the first display area and supporting at least a portion of the first display area; a second housing, below the second display area, supporting at least a portion of the second display area and configured to be rotatable relative to the first housing based on a folding axis; a hinge structure, below the third display area, comprising a first hinge plate and a second hinge plate positioned along a boundary between the first housing and the second housing; a reinforcement member, between the hinge structure and the third display area, supporting at least a portion of the third display area; a flexible printed circuit board (FPCB) extending from the first printed circuit board (PCB) in the first housing through the hinge structure to the second PCB in the second housing; as well as a protective layer, parallel to the boundary, surrounding a portion of the first hinge plate adjacent to the second hinge plate in an expanded state in which a first direction facing the first display area and a second direction facing the second display area correspond to each other, The rotation angle range of the first hinge plate and the second hinge plate is greater than the rotation angle range of the first shell and the second shell.

2. The electronic device according to claim 1, The protective layer is configured to separate the first hinge plate from the reinforcement and from the FPCB in a plurality of states including the unfolded state and a folded state in which the first direction and the second direction are opposite to each other.

3. The electronic device according to any one of claims 1 and 2, The first hinge plate comprises: a first surface facing the flexible display, a second surface, opposite to the first surface, and a third surface between the first surface and the second surface, facing the second hinge plate in the expanded state, and The protective layer at least partially surrounds the first surface, the second surface and the third surface.

4. The electronic device according to any one of claims 1 to 3, The protective layer comprises: a first portion attached to a first surface of the first hinge plate facing the flexible display, and The second part protrudes from the periphery of the first part facing the second hinge plate, is attached to the second surface of the first hinge plate opposite to the first surface and the third surface of the first hinge plate between the first surface and the second surface, and the third surface of the first hinge plate faces the second hinge plate in the expanded state.

5. The electronic device according to any one of claims 1 to 4, wherein the first portion is attached to the first surface, wherein a portion of the second portion is attached to the third surface in a state bent relative to the first portion, wherein the remaining portion of the second part is attached to the second surface in a state of being bent relative to the portion of the second part.

6. The electronic device according to any one of claims 1 to 5, The thickness of the first portion is thicker than that of the second portion.

7. The electronic device according to any one of claims 1 to 6, The second portion protrudes from a portion of the periphery of the first portion at a position corresponding to a region where the FPCB passes through the hinge structure.

8. The electronic device according to any one of claims 1 to 7, The hinge structure further comprises a hinge cover, which is disposed between the first housing and the second housing and below the first hinge plate and the second hinge plate, and The FPCB comprises: The first portion is bent from the first PCB toward the first hinge plate in the unfolded state and extends in contact with the protection layer covering the surface of the first hinge plate facing the hinge cover. a second portion that is bent from the second PCB toward the second hinge plate in the expanded state and extends in contact with the protection layer covering the surface of the second hinge plate facing the hinge cover, and A third portion is provided in the hinged cover between the first portion and the second portion.

9. The electronic device according to any one of claims 1 to 8, wherein in the unfolded state the protective layer surrounds the surface of the hinge plate facing the hinge structure such that the protective layer contacts a portion of the first part, which extends in contact with the protective layer surrounding the surface of the first hinge plate facing the hinge cover.

10. The electronic device according to any one of claims 1 to 9, wherein the reinforcement is flat in the deployed state, and The reinforcing member is bent in a folded state in which the first direction and the second direction are opposite to each other.

11. The electronic device according to any one of claims 1 to 10, wherein the reinforcement is attached to one of the first hinge plate and the second hinge plate.

12. The electronic device according to any one of claims 1 to 11, The reinforcement member comprises: a first reinforcement member adjacent to the first shell of the first shell and the second shell, and A second reinforcement member is spaced apart from the first reinforcement member and is adjacent to the second shell of the first shell and the second shell.

13. The electronic device according to any one of claims 1 to 12, The reinforcement member comprises: a first region in which a gap between the first reinforcement and the second reinforcement corresponds to the folding axis, a second region in which the gap is spaced apart from the folding axis in a direction in which the first housing is arranged, and A third region in which the gap is spaced apart from the folding axis in a direction in which the second housing is provided.

14. The electronic device according to any one of claims 1 to 13, The hinge structure further comprises a hinge bracket, and the hinge bracket comprises: a first guide groove, the first hinge plate being slidably connected to the first guide groove, and The second guide groove is provided, and the second hinge plate is slidably connected to the second guide groove.

15. The electronic device according to any one of claims 1 to 14, further comprising a second protective layer different from the first protective layer corresponding to the protective layer, In the expanded state, the second protective layer parallel to the boundary surrounds a portion of the second hinge plate adjacent to the first hinge plate.

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