Active heat dissipation mechanism and manufacturing method thereof

Abstract

The present invention relates to an active heat dissipation mechanism and a method for manufacturing the same, the active heat dissipation mechanism of the present invention comprising: a heat transfer plate main body having a refrigerant flow space having a predetermined thickness therein; the refrigerant flowing space of the heat conduction plate main body is filled with the refrigerant, the heat conduction plate main body is made of a metal material capable of transferring heat from the outer side to the inner side of the refrigerant flowing space, and the refrigerant is made of water. The water can realize phase change from a liquid state to a gas state or from the gas state to the liquid state by virtue of the heat conductivity of the heat conduction plate main body, so that the heat dissipation performance is greatly improved.

Description

Technical Field

[0001] The present invention relates to an active heat dissipation apparatus and a manufacturing method thereof. More specifically, the present invention relates to an active heat dissipation apparatus and a manufacturing method thereof that can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., an electronic device) through a phase change of a refrigerant that is more effective than the refrigerant's own thermal conductivity. Background Art

[0002] Wireless communication technology (e.g., Multiple Input Multiple Output (MIMO) technology) is a technology that significantly increases data transmission capacity by using multiple antennas, and is a spatial multiplexing technology that transmits different data through separate transmitting antennas in a transmitter and distinguishes the transmitted data through appropriate signal processing in a receiver.

[0003] Therefore, increasing the number of transmitting and receiving antennas simultaneously increases channel capacity, enabling the transmission of more data. For example, if the number of antennas were increased to 10, the channel capacity could be approximately 10 times greater than that of a conventional single-antenna system using the same frequency band. In transceivers employing MIMO technology as described above, the number of transmitters and filters increases as the number of antennas increases.

[0004] As mentioned above, as the number of transmitters and filters increases, there is a problem of increasing the number of heat-generating components. To prevent the performance of antenna devices from degrading, MIMO technology has pioneered research on heat dissipation mechanisms that effectively dissipate heat generated by multiple heat-generating components.

[0005] Figure 1 is an exploded perspective view showing an example of an antenna device according to the related art.

[0006] like Figure 1 As shown, a heat generating device (eg, an electronic device) may be implemented as an antenna device.

[0007] like Figure 1As shown, the existing antenna device includes: an antenna shell body 10, which is arranged in the shape of a rectangular box with an opening at the front and a relatively thin front-to-back thickness, and a plurality of heat dissipation fins 11 are integrally formed on the rear surface; a main board (not shown), which is stacked and arranged on the rear surface inside the antenna shell body 10; and an antenna board 15, which is stacked and arranged on the front surface inside the antenna shell body 10.

[0008] A plurality of power supply related components and elements for calibrating power supply control are mounted on the main board, and the heat generated by the components during the power supply process is dissipated to the outside through a plurality of heat dissipation fins 11 at the rear of the antenna housing body 10 .

[0009] Furthermore, the PSU board 40 on which the PSU components are mounted is stacked or arranged at the same height below the main board, and is designed so that the heat generated by the PSU components is also dissipated to the outside through the plurality of heat dissipation fins 11 at the rear of the antenna housing body 10 .

[0010] A plurality of RF filters (not shown) are arranged on the front surface of the main board, and the rear surface of the antenna board 15 is arranged to be stacked on the front surfaces of the plurality of RF filters.

[0011] A plurality of patch-type or dipole-type radiating elements 17 may be installed on the front surface of the antenna board 15, and a radome panel 50 may be provided on the front surface of the antenna shell body 10 to protect the internal components from external influences while allowing the plurality of radiating elements to radiate smoothly.

[0012] However, the existing antenna device has a design in which a radome panel 50 is provided at the front, and the system heat generated inside needs to be concentratedly dissipated to the rear of the antenna housing body 10 , so the heat dissipation performance of the plurality of heat dissipation fins 11 needs to be improved.

[0013] Here, as a solution for improving the heat dissipation performance of the plurality of heat dissipation fins 11, the following manufacturing method can be considered: using a material with better thermal conductivity to form it as a whole with the antenna housing body 10, and separating its outermost front end from the heat generating element as a heat source to the external space as far as possible.

[0014] However, there are not only limitations in improving thermal conductivity by the material of the multiple heat dissipation fins 11 themselves, but also the following problem: even when the outermost front ends of the multiple heat dissipation fins 11 are kept away from the heating element, the heat concentration phenomenon in the area adjacent to the heating element into which the heat flows cannot be eliminated, and becomes a factor that increases the size of the product in the thickness direction and hinders the ultra-thinness of the product.

[0015] In addition, in the related field of heat dissipation technology, a thermally conductive material (metal) generally used as the material of the plurality of heat dissipation fins 11 may be, for example, an aluminum (Al) alloy.

[0016] Among metal materials, silver (Au, 418.6), copper (Cu, 372.1) and gold (Ag, 295.3) are examples of metals with higher thermal conductivity (unit: W / mK) than aluminum (Al). However, these metals are relatively expensive compared to aluminum. Therefore, from an economic (cost) perspective, they cannot be widely used to cover a large heat dissipation area.

[0017] However, since pure aluminum (Al) alone cannot meet the strength and ductility requirements, it is usually processed and manufactured in the form of an aluminum alloy roughly mixed with silicon and magnesium. In this case, due to its low castability, its applicability is extremely limited to the manufacture of small or simple-shaped parts. Although its cost is lower than the above-mentioned silver, copper and gold, it still has the disadvantage of high manufacturing cost.

[0018] Furthermore, it is difficult for the heat dissipation fins 11 made of aluminum alloy to overcome the above-mentioned material limitations. Recently, a refrigerant-type heat dissipation system has attracted much attention, which uses a phase change material as a refrigerant to fill a closed interior and dissipate heat through the temperature difference between the latent heat and the sensible heat used during the phase change of the refrigerant.

[0019] In this refrigerant-type heat dissipation system, the core element for maximizing the heat dissipation performance is the phase-changing refrigerant. The aluminum alloy heat dissipation fins 11 can only form a closed refrigerant flow space for the refrigerant to flow due to phase change, while transferring the heat generated by the heating element as the heat-generating object to the refrigerant as much as possible according to its own thermal conductivity.

[0020] Therefore, the heat sink fins that form a refrigerant flow space filled with a refrigerant as a phase change substance should be processed and designed in a way that minimizes the physical distance between the heating element and the refrigerant. This is the most preferred design point in improving heat dissipation performance. The heat sink fins 11 studied and developed so far still prefer high-priced aluminum alloy materials because the existing aluminum alloy material is the most widely used material.

[0021] However, in the case of pure aluminum, due to the good elongation related to the processability of the metal, the heat sink fin 11 can be manufactured with its thickness minimized. However, in order to enhance the strength and flexibility, the elongation of the heat sink fin 11 made of aluminum alloy material is reduced, and there are limitations in minimizing its thickness.

[0022] Furthermore, when the metal material constituting the heat dissipation fins 11 is aluminum and water is selected as the refrigerant, when filling the refrigerant, the aluminum material and water undergo an oxidation reaction in the initial stage to generate aluminum oxide. During this process, a part of it is replaced by hydrogen, causing the internal pressure to increase. Usually, in the heat dissipation mechanism of aluminum material, it is necessary to select a special refrigerant such as Honeywell refrigerant or CFC (Freon gas) to prevent this chemical reaction. Therefore, the disadvantage of reducing the range of refrigerant selection is pointed out.

[0023] Phase change refers to the phenomenon in which the inherent state of a liquid, gas, or solid changes when a large amount of energy is stored or stored heat is released.

[0024] A phase change refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical bonding or formation. The heat used when a substance is subjected to energy but does not undergo a phase change is called sensible heat, while the heat used when a phase change occurs is called latent heat.

[0025] However, because temperature and pressure are directly proportional, there's a problem with increasing the heat sink's temperature causing the pressure to rise as well. If the pressure inside a sealed heat sink increases due to the high temperature transferred from the heating element, it could rupture the heat sink itself. To address this issue, it's necessary to prevent pressure increases. This requires a sufficient internal volume within the heat sink to achieve pressure equilibrium during the phase change cycle.

[0026] Furthermore, the refrigerant filled in the heat dissipation mechanism must be of a type that does not chemically react with the metal material of the heat dissipation mechanism to prevent an increase in the internal pressure of the heat dissipation mechanism.

[0027] For example, when the metal material constituting the heat dissipation mechanism is aluminum (Al) and the refrigerant is water, when filling the refrigerant, the aluminum material and water undergo an oxidation reaction in the initial stage to produce aluminum oxide. During this process, a part of it is replaced by hydrogen, resulting in a problem of increased internal pressure. Usually, special refrigerants such as Honeywell refrigerant or CFC (Freon gas) are selected in the heat dissipation mechanism of aluminum material to prevent this chemical reaction.

[0028] However, in recent years, many countries have been restricting the use of special refrigerants other than water, such as Honeywell refrigerants and CFCs (Freon gas). As mentioned above, if the heat dissipation mechanism is damaged due to increased internal pressure or during product transportation, transfer, or installation, there is a concern that these special refrigerants may leak to the outside, potentially contaminating the atmosphere and the external environment.

[0029] However, if special refrigerants are excluded as usable refrigerants, the thermal conductivity is higher than that of other metal materials, so the use of heat dissipation mechanisms commonly used with aluminum materials can only be limited. Therefore, in the manufacturing industry of related heat dissipation mechanisms, research related to replacement of metal materials constituting heat dissipation mechanisms and heat dissipation design is being actively carried out recently.

[0030] In addition, as research materials related to the above-mentioned shortcomings, as a paper by co-author Liqiang Deng in the International Journal of Thermal Sciences (published on August 15, 2022, hereinafter referred to as the "existing paper"), the following briefly introduces "Thermal study of the natural air cooling using roll bond flat heatpipe as plate fin under multi-heat source condition".

[0031] Figure 2 This is a schematic diagram showing the manufacturing process of a roll-bonded flat heat pipe (hereinafter referred to as "RBFHP") described in a prior art paper (see FIG. 4 of the prior art paper). Figure 3 yes Figure 2 Schematic diagram of the experimental device of RBFHP (existing paper Figure 6 ).

[0032] like Figure 2 As shown, the RBFHP of the existing paper uses a pre-designed mold to print non-bonding graphite on the first aluminum sheet and then stack it on the second aluminum sheet. The two aluminum sheets are then rolled and joined in the order of hot rolling-cold rolling-annealing, and the feed pipe is welded. High-pressure gas is injected into the interior of the plate from the inlet to expand the unbonded part, thereby forming an autonomously connected chamber.

[0033] The existing paper puts forward the following conclusions: The RBFHP formed as described above is Figure 3 The test conditions shown (four evenly distributed heat sources) show better results than ordinary aluminum plates (fins).

[0034] However, since the RBFHP in the prior art is manufactured by the roller bonding method as described above, there is a problem that the refrigerant (especially liquid-phase refrigerant) is difficult to be arranged close to the joint end (ie, edge end) closest to the heat source position.

[0035] That is, in the roller bonding method, the edge ends must be joined, and at least the overlapping and joined portion needs to be separated from the heat source (heat generating element). Therefore, heat conduction resistance is generated depending on the material of the element itself.

[0036] The manufacturing method of RBFHP in existing papers is limited to the roller bonding method or the reason for adopting this method is that the optimal method for internally forming two aluminum plates is considered to be an inevitable method because it is realistically impossible to bend the aluminum plates themselves.

[0037] In addition, in the existing RBFHP, when the vaporized refrigerant moves near the heat source and moves to the condensation area for condensation, in order to maximize its area, although it has a honeycomb structure (honeycomb structure), the flow range where the gas-phase refrigerant quickly moves to the upper end farthest from the heat source becomes longer. Since the return path of the liquid-phase refrigerant condensed in the condensation area and the flow range of the gas-phase refrigerant overlap with each other, it can be expected that a large flow resistance problem will occur. Summary of the Invention

[0038] Technical issues

[0039] In order to solve the above technical problems, the object of the present invention is to provide an active heat dissipation mechanism and a manufacturing method thereof that can improve the heat dissipation performance of a heat-generating device (electronic device).

[0040] At the same time, another object of the present invention is to provide an active heat dissipation mechanism and a manufacturing method thereof that can maximize the heat transfer capability of the refrigerant filled therein.

[0041] Furthermore, another object of the present invention is to provide an active heat dissipation mechanism with excellent manufacturability and a method for manufacturing the same.

[0042] Furthermore, another object of the present invention is to expand the scope of use of water as a refrigerant, and to replace aluminum (Al) materials with higher thermal conductivity among common metal materials with metal materials with lower thermal conductivity, thereby enabling the production of low-cost products and providing an active heat dissipation mechanism and its manufacturing method that can exhibit the same or better heat dissipation performance as existing ones.

[0043] Furthermore, another object of the present invention is to provide an active heat dissipation mechanism and a method for manufacturing the same that can employ and apply water as a refrigerant capable of undergoing phase change, thereby fully satisfying the requirements of various countries.

[0044] The technical problems that the present invention intends to solve are not limited to the technical problems mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0045] Solutions to the Problem

[0046] An embodiment of the active heat dissipation mechanism of the present invention includes: a heat conducting plate body having a refrigerant flow space of a predetermined thickness inside; and a refrigerant filled in the refrigerant flow space of the heat conducting plate body, wherein the heat conducting plate body is formed of a metal material that can transfer heat from the outside to the inside of the refrigerant flow space, and the refrigerant is formed of water, which can achieve a phase change from liquid to gas or from gas to liquid by means of the thermal conductivity of the heat conducting plate body itself.

[0047] Here, the water forming the refrigerant may include one of natural water, distilled water, pure water, and ultrapure water.

[0048] Furthermore, the water forming the refrigerant may be purified water and may be ultrapure water having a resistivity of 18 MΩ·cm or more at 25°C.

[0049] Furthermore, the water forming the refrigerant may be purified water having a resistivity of 5 Ω.cm to 18 MΩ.cm at 25°C.

[0050] Furthermore, the metal material of the heat conducting plate body may include one of platinum, gold, silver, iridium, tungsten, titanium, copper, and SUS that do not chemically react with water formed by the refrigerant.

[0051] Furthermore, the metal material of the heat conducting plate body may be SUS (stainless steel) which does not chemically react with water formed by the refrigerant.

[0052] Furthermore, the metal material of the heat conducting plate body may be SUS material having an elongation that can be processed to a thickness less than 1 / 3 of a limit thickness, where the limit thickness is the minimum thickness when aluminum material having a predetermined tensile strength or higher is used.

[0053] Furthermore, the metal material of the heat conducting plate body may be a SUS material having an elongation sufficient to be processed into a plurality of strength-reinforced portions, and the plurality of strength-reinforced portions protrude toward the inside of the refrigerant flow space through the stamping process.

[0054] Furthermore, the thickness of the heat conducting plate body may be less than 1 / 3 of a limit thickness, where the limit thickness is the minimum thickness when the metal material is aluminum having a predetermined tensile strength or greater.

[0055] Furthermore, the metal material of the heat conducting plate body is SUS, and the thermal conductivity of the SUS is less than 1 / 10 of the thermal conductivity of the heat conducting plate body made of aluminum having a predetermined tensile strength or higher.

[0056] Furthermore, the heat transfer plate body is pressed into the press-in portion in a forced insertion manner, and the press-in portion is configured to directly receive heat from the heat sink serving as the heat dissipation target, and has an interior between a pair of groove ribs. In the case where the heat transfer plate body includes a press-in end portion, and the press-in end portion includes a first refrigerant flow path for providing an evaporation area for capturing liquid refrigerant in the refrigerant, the metal material of the heat transfer plate body can be an SUS material that can be processed in such a manner that at least a portion of the first refrigerant flow path provided inside the press-in end portion is located further in the internal space than the outer ends of the pair of groove ribs of the press-in portion.

[0057] Furthermore, the heat conduction plate body is processed to have a thickness such that at least a portion of the first refrigerant flow path is located inside a pair of groove ribs of a pressing portion having the same shape and size as a pressing portion set to a thickness twice that of a maximum thickness, wherein the maximum thickness is the minimum thickness when the metal material is an aluminum material having a predetermined tensile strength or greater.

[0058] Effects of the Invention

[0059] According to an embodiment of the active heat dissipation mechanism and the manufacturing method thereof of the present invention, the following multiple effects can be achieved.

[0060] First, the heat concentration phenomenon caused by the rising airflow of heat can be minimized on the back of the heat dissipation housing body, and active heat transfer generated by the phase change of the refrigerant can be achieved, thereby greatly improving the overall heat dissipation performance.

[0061] Secondly, by shortening the gas-liquid cycle of the refrigerant filled inside, the heat transfer capacity is maximized, thereby achieving the effect of improving the heat dissipation performance.

[0062] Third, the material of the heat transfer plate body constituting the refrigerant flow space where the refrigerant changes phase and flows is replaced with SUS, a metal material that is inferior to aluminum. This can achieve higher heat dissipation performance than the existing material composed of aluminum.

[0063] Fourth, the refrigerant can be limited to water for selection and use, which can achieve the effect of ensuring design diversity in product use and manufacturing, especially in countries that restrict the use of refrigerants.

[0064] Fifth, compared with metal materials with relatively excellent thermal conductivity, heat dissipation mechanisms with the same or better heat dissipation performance can be manufactured using metal materials with relatively low thermal conductivity, thereby achieving the effect of saving manufacturing costs and simplifying the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1An exploded perspective view showing an example of an antenna device according to the prior art.

[0066] Figure 2 This is a schematic diagram showing a manufacturing process of a roll bond flat heat pipe (hereinafter referred to as "RBFHP") described in a conventional paper (see FIG. 4 of the conventional paper).

[0067] Figure 3 yes Figure 2 Schematic diagram of the experimental device of RBFHP (existing paper Figure 6 ).

[0068] Figure 4a and Figure 4b 1 is a perspective view showing two configuration examples of the back side of an antenna device of an active heat dissipation mechanism according to an embodiment of the present invention.

[0069] Figure 5a and Figure 5b are shown separately Figure 4a and Figure 4b An exploded perspective view of the back side of the antenna device.

[0070] Figure 6 It shows that the Figure 5a An exploded perspective view of the installation state of the active heat dissipation mechanism of one embodiment of the present invention, showing a press-fit portion on the back side of the antenna device.

[0071] Figure 7 It shows the Figure 6 A cross-sectional view and a partially enlarged view of the setting state of the active heat dissipation mechanism according to an embodiment of the present invention are shown.

[0072] Figure 8 It shows the Figure 6 A cutaway perspective view and a partially enlarged view of the setting state of the active heat dissipation mechanism of an embodiment of the present invention of the press-in portion.

[0073] Figure 9 It shows Figure 8 A cutaway perspective view of the internal structure of a single active heat dissipation mechanism in a structure.

[0074] Figure 10 is shown for illustration purposes only. Figure 4a and Figure 5a A side cross-sectional view of the back side of the internal structure of the groove structure.

[0075] Figure 11 It shows the Figure 4a and Figure 5a A partial three-dimensional view of the setting state of the active heat dissipation mechanism of one embodiment of the present invention showing the press-in portion in the structure.

[0076] Figure 12 It is a perspective view showing the manufacturing process of the active heat dissipation mechanism according to one embodiment of the present invention.

[0077] Figure 13 It shows Figure 12 FIG. 1 is a plan view of a heat conducting plate body before bending in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

[0078] Figure 14 The present invention is an active heat dissipation mechanism according to an embodiment of the present invention, and an enlarged perspective view and an enlarged plan view of a press-fit end portion in the structure thereof and a modified example thereof.

[0079] Figure 15 It is shown in Figure 14 Cross-sectional views of the structures (d) and (e) with the absorber removed.

[0080] Figure 16 and Figure 17 1 is a three-dimensional diagram and a partial enlarged diagram of an active heat dissipation mechanism before and after bending according to an embodiment of the present invention.

[0081] Figure 18 FIG. 1 is a plan view of a bent active heat dissipation mechanism according to an embodiment of the present invention.

[0082] Figure 19 It is along Figure 18 Cross-sectional view taken along line CC.

[0083] Figure 20 and Figure 21 This is a perspective view showing an example of an absorber in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

[0084] Figures 22a to 22d 1 is a diagram of a heat conducting plate body before bending according to first to fourth modified examples 200T-1 to 200T-4 of a partial structure in an embodiment of the present invention.

[0085] Figure 23 It shows that the composite Figures 22a to 22d An expanded view of the heat conducting plate body of the fifth modified example 200T-5 of the multiple modified examples.

[0086] Figure 24 It is a development view showing a heat transfer plate main body according to a sixth modification.

[0087] Figure 25 The active heat dissipation mechanism 200D ( Figure 25 (a)) and the active heat dissipation mechanism 200 ( Figure 25 (b) is a cross-sectional view of the setting state of the press-fit portion.

[0088] Figure 26 It is along Figure 4b The cross-sectional view taken along line AA and its partial enlarged view.

[0089] Figure 27 It is along Figure 4b The sectional stereoscopic view taken along line AA and its partial enlarged view.

[0090] Figure 28 It is along Figure 4b A sectional stereoscopic view taken along line BB and a partially enlarged view thereof.

[0091] Figure 29 FIG. 4 is a perspective view showing an active heat dissipation mechanism according to another embodiment of the present invention.

[0092] Figure 30 yes Figure 29 Exploded three-dimensional diagram.

[0093] Figure 31 yes Figure 29 Cutaway stereogram ( Figure 31 (a)), its partial enlarged view ( Figure 31 (b)) and the cross-sectional view of the part ( Figure 31 (c)).

[0094] Figure 32 1 is a cross-sectional view showing a coupled state of a press-fit portion of an active heat dissipation mechanism according to another embodiment of the present invention.

[0095] Figure 33 Is to show the comparison by Figure 25 The temperature curve of the heating element 140 of the active heat dissipation mechanism 200D of the comparative example and the active heat dissipation mechanism 200 of an embodiment of the present invention ( Figure 33 (a)) and comparison chart ( Figure 33 (b)).

[0096] Figure 34 This table shows the results of measuring the time it takes for the active heat dissipation mechanism 200D of the comparative example composed of the heat conduction plate bodies 200D-1 and 200D-2 made of aluminum and the active heat dissipation mechanism 200 of an embodiment of the present invention made of SUS to reach 50°C, 60°C and 70°C respectively.

[0097] Figure 35This is a graph comparing the temperature of ordinary aluminum heat sinks (AL6063_REF) that do not use refrigerant, two specifications of RBFHP products estimated to be the existing paper (roller-bonded fins (292*115 and 310*90)), and an active heat dissipation mechanism (PTX (310*90)) of an embodiment of the present invention according to the position of each heat source (heating element).

[0098] Figure 36 FIG. 1 is a flow chart illustrating a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention.

[0099] Figure 37 FIG. 4 is a flow chart illustrating a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

[0100] Description of Reference Signs

[0101] 100: Antenna device 110: Heat dissipation housing body

[0102] 200: Active heat dissipation mechanism 200-1: Heat conduction plate on one side

[0103] 200-2: Heat conducting plate on the other side 201: Press into the end

[0104] 203: heat dissipation plate 205: refrigerant flow space

[0105] 210: First refrigerant flow path 215: Inclined guide

[0106] 220: Second refrigerant flow path 230: Third refrigerant flow path

[0107] 240: Multiple strength reinforcement parts 241: Wire reinforcement part

[0108] 242: Point reinforcement 250: Absorber fixing guide

[0109] 300: Absorber 301: Auxiliary absorber

[0110] 301-1: Upper auxiliary absorber 301-2: Lower auxiliary absorber

[0111] 1200: Active heat dissipation mechanism 1261, 1262: Auxiliary absorber setting part

[0112] 1263: Multiple fixed ribs T: arbitrary reference line

[0113] S10: Stamping process S20: Bending process

[0114] S30: Absorber installation step S40: Joining step

[0115] S50: Refrigerant filling process S60: Heat dissipation mechanism fastening process DETAILED DESCRIPTION

[0116] Hereinafter, embodiments of the active heat dissipation mechanism and the manufacturing method thereof of the present invention will be described in detail with reference to the accompanying drawings.

[0117] It should be noted that when assigning reference numerals to the structural elements of the various drawings, the same reference numerals are assigned to the same structural elements as much as possible, even if they are assigned to different drawings. In addition, in the process of describing the embodiments of the present invention, if it is determined that the detailed description of the relevant well-known structure or function hinders the understanding of the embodiments of the present invention, the detailed description will be omitted.

[0118] When describing the structural elements of the embodiments of the present invention, terms such as first, second, A, B, (a), (b) may be used. These terms are only used to distinguish one structural element from other structural elements, and the nature, order or sequence of the corresponding structural elements are not limited by these terms. In addition, unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meaning as commonly understood by people with conventional knowledge in the technical field to which the present invention belongs. Terms that are the same as those defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the relevant technology, and should not be interpreted as ideal or overly formal unless clearly defined in this application.

[0119] 1. Setting form of heat dissipation mechanism - antenna device

[0120] Figure 4a and Figure 4b 1 is a perspective view showing two configuration examples of the back side of an antenna device of an active heat dissipation mechanism according to an embodiment of the present invention. Figure 5a and Figure 5b are shown separately Figure 4a and Figure 4b An exploded perspective view of the back side of the antenna device.

[0121] Generally, heat generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of the present invention is a company engaged in other wireless communication equipment manufacturing industries. The representative heat generating device (electronic device) in wireless communication equipment is the antenna device. Below, the antenna device is described as a specific example.

[0122] However, the active heat dissipation mechanism according to the embodiments of the present invention described below is not necessarily to be limited to the application in antenna devices.

[0123] like Figure 4a and Figure 4bAs shown, the antenna device 100 using the active heat dissipation mechanism 200, 1200 of the embodiment of the present invention includes: a heat dissipation housing body 110, which forms a receiving space with an opening toward the front and is formed in a rectangular parallelepiped shape that is generally longer in the vertical direction and has a thin front-to-back receiving width.

[0124] The heat dissipation housing body 110 can be made of a heat conductive material (especially a metal material) so as to be connected to the heating element described later (for example, see FIG. 22 and FIG. 23 ). Figure 23 ' 140 ') for surface thermal contact to effectively transfer heat.

[0125] Although not shown in the figure, the inside of the receiving space of the heat dissipation housing body 110 is provided with a clamshell (see Figure 7 Reference numeral "125") is a medium that can be stacked and configured with a motherboard (refer to Figure 7 The main board is designated as "120" in the figure and serves as a substrate for a power amplifier (PAU: Power Amplifier Unit) and a digital transceiver unit (DTU: Digital Transceiving Unit). The main board can be equipped with a plurality of micro bellows filter (MBF: Micro Bellows Filter) elements on the front surface and a heating element 140 on the back surface.

[0126] Here, the motherboard 120 can be defined as a heating element 140 that generates a large amount of heat when driven, such as a radio frequency integrated circuit (RFIC) or a power amplifier (PA). However, it should be noted that in the embodiments of the present invention, only an electronic device is used as an antenna device for illustration, and the heating element 140 is not limited to the above-described structure. For example, a semiconductor or a PC CPU, which are representative heating elements, can also be used as the heating element 140.

[0127] A radome panel 50 may be provided on the front surface of the accommodation space of the heat dissipation housing body 110 , thereby protecting the radiating element implemented as the antenna element from external influences while allowing the radiating element to radiate smoothly.

[0128] However, as described below, for antenna devices in electronic devices that require greater heat dissipation, an antenna cover panel 50 that is not suitable for heat dissipation is provided on the front surface of the heat dissipation housing body 110. Due to the above factors, it is more necessary to concentrate the heat dissipation through the remaining parts other than the front surface of the heat dissipation housing body 110, and an effective heat dissipation design is required through a limited heat dissipation area.

[0129] In addition, the active heat dissipation mechanism 200 or 1200 according to the embodiment of the present invention may be provided on the back side of the heat dissipation housing body 110 .

[0130] The active heat dissipation mechanism 200, 1200 of the embodiment of the present invention is provided in the form of a heat dissipation fin. Strictly speaking, it is different from the fixed heat dissipation fins 200F-1, 200F-2 described later, and is characterized in that it is provided as a vapor chamber type having a thin thickness and filled with a refrigerant as a substance that can change phase by heat supplied from the outside.

[0131] Here, the active heat dissipation mechanism 200 in the embodiment of the present invention may include an absorber 300 that absorbs liquid refrigerant in the refrigerant and holds it near the heating element 140 , and promotes evaporation of the liquid refrigerant into gaseous refrigerant.

[0132] However, the concept of retaining liquid refrigerant by the absorber 300 is not limited to simply absorbing and storing liquid refrigerant. It should be understood that the absorption force (or capillary force) is used to at least make the liquid refrigerant flow in the opposite direction (upper side) relative to the direction of gravity to a position higher than its liquid level.

[0133] Typically, a wick component is disposed within a well-known vapor chamber. The wick component has a wick structure with multiple pores. The wick component can be manufactured by sintering a metal powder to form multiple pores that allow liquid refrigerant, which is filled within a heat-conductive panel component, to move toward the heating element via capillary force while allowing gaseous refrigerant to flow freely to the outside.

[0134] However, the wick component is not limited to the aforementioned sintered metal wick component. In particular, as long as it can absorb and disperse liquid refrigerant or promote its gasification, it can be defined as a concept that includes all possible materials, such as fiber materials, despite being referred to as the absorber 300. This will be described in more detail below.

[0135] 2-1. First Setting Example (One Embodiment of the Present Invention) and Setting of the Pressing Portion

[0136] Figure 6 It shows that the Figure 5a An exploded perspective view of the installation state of the active heat dissipation mechanism of an embodiment of the present invention, which includes a press-fit portion on the back side of the antenna device. Figure 7 It shows that the Figure 6 An exploded perspective view of the installation state of the active heat dissipation mechanism of an embodiment of the present invention, which includes a press-fit portion on the back side of the antenna device. Figure 8 It shows the Figure 6 A cross-sectional view and a partially enlarged view of the installation state of the active heat dissipation mechanism of an embodiment of the present invention, Figure 9 It shows the Figure 8 A cutaway perspective view and a partially enlarged view of the installation state of the active heat dissipation mechanism according to an embodiment of the present invention, Figure 10 It shows Figure 8 A cutaway perspective view of the internal structure of a single active heat dissipation mechanism in the structure, Figure 11 is shown for illustration purposes only. Figure 4a and Figure 5a The back side cross-sectional view of the internal structure of the groove structure, Figure 12 It shows the Figure 4a and Figure 5a A partial three-dimensional view of the setting state of the active heat dissipation mechanism of one embodiment of the present invention showing the press-in portion in the structure.

[0137] like Figure 4a and Figure 5a As shown, a groove (trench) structure 170 may be provided on the back of the heat dissipation housing body 110 implemented using the first setting example, with the middle portion between the left end and the right end being empty along the upper and lower parts.

[0138] Here, multiple press-in portions 150 can be provided on the back side of the heat dissipation housing body 110, corresponding to the left and right sides of the groove structure 170, so that multiple active heat dissipation mechanisms 200 according to one embodiment of the present invention are arranged upwardly and tilted toward the left and right ends, respectively. Specifically, the press-in portions 150 are arranged in an upward-left and upward-right orientation, centered around the groove structure 170, and the pair of active heat dissipation mechanisms 200 secured to the press-in portions 150 can be formed into a "V" shape, with the plurality of active heat dissipation mechanisms 200 arranged in a patterned manner in the vertical direction.

[0139] In addition, the active heat dissipation mechanism 200 of an embodiment of the present invention may be provided in plurality, and all of them are formed into rectangular shapes having the same specifications and being formed in the same length direction, such as Figure 4a As shown, when an active heat dissipation mechanism 200 having the same specifications is installed on a plurality of press-fit portions 150, one inverted triangle-shaped position on the upper portion of the back surface of the heat dissipation housing body 110 and two right-angled triangle-shaped positions on the left and right sides of the lower portion of the back surface of the heat dissipation housing body 110 may not be occupied by the active heat dissipation mechanism 200, and fixed heat dissipation fins 200F-1 and 200F-2 may be arranged therein.

[0140] Here, if Figure 4aAs shown, the fixed heat dissipation fins 200F-1 and 200F-2 include: an upper fixed heat dissipation fin 200F-1, which is arranged on the upper side of the back portion of the heat dissipation housing body 110 that is not occupied by the active heat dissipation mechanism 200 of an embodiment of the present invention; and a lower fixed heat dissipation fin 200F-2, which is arranged on the left and right lower sides of the back portion of the heat dissipation housing body 110 that is not occupied by the active heat dissipation mechanism 200 of an embodiment of the present invention.

[0141] This type of fixed heat dissipation fins 200F-1, 200F-2 can be set as ordinary heat dissipation fins that do not contain refrigerant inside, which is different from the active heat dissipation mechanism 200, 1200 of the embodiment of the present invention, and can be processed using aluminum or aluminum alloy materials with excellent thermal conductivity among metal materials.

[0142] That is, it is previously stated that, unlike the active heat dissipation mechanism 200 according to an embodiment of the present invention, the upper fixed heat dissipation fins 200F-1 and the lower fixed heat dissipation fins 200F-2 are structures that are not filled with refrigerant and transfer heat based on the thermal conductivity of the metal material itself.

[0143] However, if Figure 1 a and Figure 2 As shown in a, the fixed heat dissipation fins 200F-1 and 200F-2 do not need to be separated from each other. Figure 1 b and Figure 2 As shown in FIG. 2 b , an active heat dissipation mechanism 1200 according to another embodiment of the present invention may also be provided with fixed heat dissipation fins 200F only in the lower portion not occupied by the active heat dissipation mechanism 1200 .

[0144] The area provided with the groove structure 170 formed on the back side of the heat dissipation housing body 110 implemented using the first setting example and the area (inverted triangle area) 130 where the upper fixed heat dissipation fin 200F-1 among the fixed heat dissipation fins 200F-1 and 200F-2 is provided can be provided with a heat transfer medium 135 formed in a common vapor chamber type.

[0145] The area provided with the groove structure 170 formed on the back side of the heat dissipation housing body 110 implemented using the first setting example and the area (inverted triangle area) 130 where the upper fixed heat dissipation fin 200F-1 among the fixed heat dissipation fins 200F-1 and 200F-2 is provided can be provided with a heat transfer medium 135 formed in a common vapor chamber type.

[0146] The vapor chamber type heat transfer medium 135 may be filled with a predetermined refrigerant. That is, the vapor chamber type heat transfer medium 135 may be embedded in the back of the heat dissipation housing body 110 so as to be filled with the refrigerant.

[0147] At the same time, similar to the heat transfer medium 135 provided in the inverted triangle region 130 , the region corresponding to the groove structure 170 may also be filled with a predetermined refrigerant.

[0148] However, if Figure 5a As shown, the groove structure 170 is formed longer along the up and down direction (gravity direction) from the lower vertex of the inverted triangle area 130 set on the back side of the heat dissipation shell body 110, and the liquid refrigerant filled in the interior of the groove structure 170 needs to be evenly dispersed and maintained in the up and down length direction.

[0149] To this end, inside the groove structure 170, the heat transferred from the heating element 140 or the inside of the heat dissipation shell body 110 can not only easily and evenly realize the refrigerant vaporization throughout the entire upper and lower length range, but also regardless of the upper and lower positions, in order to maintain a uniform liquid phase refrigerant, it can further include a main body absorber 350.

[0150] The main absorbent body 350 can be constructed from either a nonwoven fabric itself, a nonwoven fabric bonded to a metal braid, or a metal sintered body formed by sintering metal powder. When absorbing liquids, such as liquid refrigerants, fiber materials like nonwoven fabrics have difficulty maintaining their shape in the vertical direction (direction of gravity) due to the load of the liquid. Therefore, the copper wire braid described above can be used to maintain its shape. As long as the shape of the main absorbent body 350 can be maintained, the nonwoven fabric can be bonded to the copper wire braid or spirally wrapped around the copper wire braid on the outer circumference of the nonwoven fabric.

[0151] However, the main body absorber 350 arranged in the groove structure 170 can be interpreted as being the same as the absorber 300 of the active heat dissipation mechanism 200, 1200 of the embodiments of the present invention described later in terms of its function. In particular, in terms of enabling the liquid refrigerant filled in each interior to flow upwards more than the liquid surface of the naturally formed liquid refrigerant, it can be regarded as a structure performing the same function.

[0152] Here, the heat transfer medium 135 and the groove structure 170 may be independently provided without being communicated with each other.

[0153] In particular, the liquid refrigerant inside the groove structure 170 filled in the back side of the heat dissipation housing body 110 undergoes a phase change of vaporization to gas in the evaporation zone (Vaporization zone) located relatively lower and defined by the groove structure 170 due to the temperature change of the heat transferred from the heating element 140, thereby being able to perform partial heat dissipation.

[0154] Furthermore, in the inverted triangle region 130 having the upper fixed heat dissipation fin 200F-1 as the condensation zone located relatively above, partial heat dissipation can also be performed by causing a phase change from liquid to gas by the main body absorber 350.

[0155] In the groove structure 170 and the inverted triangle area 130 , the vaporized gas phase refrigerant repeatedly performs a gas-liquid cycle causing a phase change from liquefied to liquid through heat exchange with the external air, thereby performing a partial heat dissipation function on the back of the heat dissipation housing body 110 .

[0156] For reference, the refrigerant filled in the refrigerant flow space inside the active heat dissipation mechanism 200 equivalent to the embodiment of the present invention described later and the refrigerant filled in the above-mentioned inverted triangle area 130 and the groove structure 170 are independent, so that the same specifications of refrigerants can be filled, or different specifications of refrigerants can be filled according to the heat generation and installation position of the heating element 140.

[0157] In addition, if Figure 4a and Figure 5a As shown, a pair of groove ribs 150a, 150b (see the following) may be formed on the back of the heat dissipation housing body 110 implemented using the first setting example. Figure 32 ) is provided in a pressing-in portion 150, which is used to press in the active heat dissipation mechanism 200 of an embodiment of the present invention which is provided in multiple forms.

[0158] As described above, in an embodiment of the present invention implemented using the first setting example, the active heat dissipation mechanism 200 is configured with the groove structure 170 as the center and tilted upward toward the left end and the right end. At this point, a plurality of press-in portions 150 can also be provided, and can be configured in a "V" shape based on the groove structure 170.

[0159] That is, Figure 4a 、 Figure 5a and Figures 6 to 11 As shown, the active heat dissipation mechanism 200 according to an embodiment of the present invention can be press-fitted into the plurality of press-fit portions 150 formed on the back surface of the heat dissipation housing body 110 by means of a press-fit insertion method.

[0160] At this time, although not shown in the figure, it is preferred that the press-in portion 150 is press-inserted after being subjected to thermal epoxy treatment to improve heat transfer efficiency.

[0161] Here, if Figure 10As shown, the press-in portion 150 is recessed from the front to the rear so as to accommodate the heating surface of the heating element 140 on the inner side surface corresponding to the back side of the heat dissipation shell body 110, or can be configured to form at least one of the heating coupling surfaces 145 that protrude from the rear to the front through the heating surface toward the heating element 140.

[0162] And, as Figure 11 As shown, the press-in portion 150 can be formed at an angle so that the refrigerant (especially, liquid refrigerant) filled in the interior of the active heat dissipation mechanism 200 of an embodiment of the present invention can be easily captured by gravity toward the lower side in the direction of gravity, so that the rear end of the heat dissipation plate portion 203 described later is located on the upper side compared to the press-in end portion 201 described later.

[0163] For more details, refer to Figure 11 As shown in the coordinate diagram, as described above, the press-in portion 150 is formed to be inclined upward on the left and right sides respectively based on the groove structure 170, and can be formed on the back portion of the heat dissipation housing body 110 in a manner that is inclined at a predetermined angle (refer to arrow "a") based on the coordinate Y represented along the left and right horizontal directions.

[0164] And, refer to Figure 11 , the pressing portion 150 may be formed so that the rear end portion of the active heat dissipation mechanism 200 of an embodiment of the present invention pressed into the pressing portion 150 is tilted upward at a predetermined angle (see arrow "b") based on the coordinate X.

[0165] Therefore, when the refrigerant flow space of the active heat dissipation mechanism 200 of an embodiment of the present invention is filled with liquid refrigerant (liquid-phase refrigerant), the refrigerant naturally flows toward the side of the pressing end 201 located in the direction of gravity, and the gaseous refrigerant (gas-phase refrigerant) can naturally diffuse and flow from the pressing end 201 to the side of the heat dissipation plate 203.

[0166] However, as long as the condensed liquid refrigerant is arranged in a manner that the flow thereof is uniformly guided by the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 described later, as described above, the press-fit portion 150 does not need to be at a predetermined angle (see FIG. Figure 11 It is formed obliquely in the manner of arrows "a" and "b").

[0167] 2-2. Second setting example

[0168] Reference Figure 4b and Figure 5b On the back side of the heat dissipation housing body 110 implemented using the second configuration example, an active heat dissipation mechanism 1200 according to another embodiment of the present invention may be disposed long along the vertical straight direction.

[0169] Therefore, on the back side of the heat dissipation housing body 110 implemented using the second setting example, the press-in portion 150 provided for combination with the active heat dissipation mechanism 1200 of another embodiment of the present invention is also configured longer along the vertical straight direction, and each press-in portion 150 can be formed in parallel along the left-right direction at a predetermined distance.

[0170] Here, if Figure 4a and Figure 5a As shown, the back structure of the heat dissipation housing body 110 implemented by the first setting example is based on the middle part of the left and right width directions. In order to achieve the effect of evenly dissipating the heat generated by the heating elements 140 respectively concentrated on the left and right parts to the left and right sides, the active heat dissipation mechanism 200 of an embodiment of the present invention has a structure with multiple groove structures 170 as the basis and arranged in a "V" shape. On the contrary, as Figure 4b and Figure 5b As shown, on the back side of the heat dissipation housing body 110 implemented using the second setting example, an active heat dissipation mechanism 1200 of another embodiment of the present invention is arranged in a long vertical direction, thereby being designed to prevent the rising airflow of hot air generated by heat dissipation from being subjected to flow resistance directly upward.

[0171] In the following, for the sake of convenience, the active heat dissipation mechanism 200 arranged on the back of the heat dissipation housing body 110 implemented by using the first setting example is defined as "the active heat dissipation mechanism 200 of one embodiment of the present invention", and the active heat dissipation mechanism 1200 arranged on the back of the heat dissipation housing body 110 implemented by using the second setting example is defined as "the active heat dissipation mechanism 1200 of another embodiment of the present invention" for distinguishing and explaining. However, each embodiment only differs in its appearance and setting shape. Therefore, the settings can be mixed regardless of the above-mentioned setting examples.

[0172] 3. First refrigerant flow path (overall flow path) and second refrigerant flow path (liquid-phase refrigerant guide flow path)

[0173] Figure 12 is a perspective view showing the manufacturing process of an active heat dissipation mechanism according to an embodiment of the present invention. Figure 13 It shows Figure 12 A plan view of the heat conducting plate body before bending in the structure of the active heat dissipation mechanism according to an embodiment of the present invention is shown. Figure 14 It is an enlarged perspective view and an enlarged plan view showing an active heat dissipation mechanism according to an embodiment of the present invention and a press-fit end portion in its structure and a modified example thereof, Figure 15 It is shown in Figure 14 Cross-sectional views of the structures of (d) and (e) with the absorber 300 removed.

[0174] Reference Figures 12 to 15The active heat dissipation mechanism 200 of one embodiment of the present invention is a single metal plate component, which may include a bending process S20 and a joining process S40 (see the following description). Figure 33 ) A heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) having a refrigerant flow space filled with refrigerant and allowing the refrigerant to flow.

[0175] That is, the active heat dissipation mechanism 200 of one embodiment of the present invention is a heat conducting plate body (a heat conducting plate 200-1 on one side and a heat conducting plate 200-2 on the other side) as a single metal plate component. Figure 10 After being bent (bending) based on a predetermined arbitrary reference line T (bending step S20), bonding (bonding step S40) is performed to form a sealed refrigerant flow space 205 inside.

[0176] That is, the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) can be formed as a single metal plate component in a predetermined manner to form a refrigerant flow space 205. In particular, the active heat dissipation mechanism 200 of an embodiment of the present invention can directly form at least the first refrigerant flow path 210 described later in the refrigerant flow space 205 in which the refrigerant is filled and flows by bending in a predetermined manner (including the bending process S20 and the joining process S40 described later).

[0177] Here, the refrigerant flow space 205 may include: a first refrigerant flow path 210, which is arranged in a position relatively located on the lower side based on the relative gravity direction, so that the capture (retention) or water storage of the liquid refrigerant becomes easy, and an evaporation area is formed to change the phase of the liquid refrigerant (liquid-phase refrigerant) into the gaseous refrigerant (gas-phase refrigerant); and a second refrigerant flow path 220, which is arranged in a condensation area at a position other than the first refrigerant flow path 210, and guides the flow of the liquid-phase refrigerant that has changed its phase from the gaseous refrigerant (gas-phase refrigerant) to the above-mentioned evaporation area.

[0178] That is, as the portion where the first refrigerant flow path 210 is provided, the portion formed by the bending (bending process S20) is defined as an evaporation area where the liquid refrigerant in the refrigerant evaporates, and the remaining portion outside the evaporation area is defined as a condensation area, the second refrigerant flow path 220 can be provided in the condensation area.

[0179] In particular, the first refrigerant flow path 210 is a portion that is deformed in shape by bending in the predetermined manner of a single metal plate component. For the heating element 140 or the press-fit portion 150 on which the heating element 140 is provided, it is formed to be separated by only a spacing distance according to the material thickness of the metal plate component so that the liquid-phase refrigerant in the refrigerant is filled.

[0180] In this case, first refrigerant flow path 210, which serves to store and retain the liquid refrigerant in refrigerant flow space 205, can be arranged vertically in the direction of gravity, or with at least its upper and lower ends inclined relative to the direction of gravity. Therefore, the liquid level of the liquid refrigerant stored in first refrigerant flow path 210 is located at least at the lower end of the inclined arrangement. This principle also applies to active heat dissipation mechanism 1200 according to another embodiment of the present invention, described later.

[0181] In more detail, the active heat dissipation mechanism 200 of one embodiment of the present invention can be configured by placing a single heat conducting plate body (a heat conducting plate 200-1 on one side and a heat conducting plate 200-2 on the other side) along a predetermined arbitrary reference line T (see Figure 12 ) as a reference to be bent (bending step S20) and joined (joining step S40) to form a sealed refrigerant flow space 205 inside.

[0182] Therefore, the first refrigerant flow path 210, as a portion whose shape is deformed by the bending (bending process S20), can be defined as a refrigerant filling and flow space in which the refrigerant is filled with liquid refrigerant, with the heating element 140 or the press-fit portion 150 provided with the heating element 140 being separated only by a spacing distance according to the material thickness of the metal plate part.

[0183] Specifically, the "separation distance based on material thickness" refers to the distance separating the first refrigerant flow path 210 from the heating element 140 or the press-fit portion 150 equipped with the heating element 140. However, the first refrigerant flow path 210 is not simply defined as a space that captures liquid-phase refrigerant. Therefore, the evaporation area at one end of the width direction that receives heat from the heating element 140, which is the heat dissipation target, is more significant.

[0184] Moreover, the definition of the first refrigerant flow path 210 in the active heat dissipation mechanism 200 of one embodiment of the present invention is different from the definition of the first refrigerant flow path 1210 of the active heat dissipation mechanism 1200 of another embodiment of the present invention described later. Here, the common technical structure of the first refrigerant flow path 210 being directly inserted into the evaporation area or the press-in portion 150 at one end in the width direction of the heat supply from the heating element 140 as the heat dissipation object through the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2) is of great significance.

[0185] For example, the active heat dissipation mechanism of the present invention is not necessarily limited to the bending manufacturing method of the above-mentioned embodiment 200 .

[0186] That is, Figure 4b and Figure 5b and the following Figures 23 to 29 As shown, by joining two separate metal plate members in a joining manner (joining step S40 ), an active heat dissipation mechanism 1200 according to another embodiment of the present invention in which a sealed refrigerant flow space 205 is formed can also be manufactured.

[0187] As described above, the first refrigerant flow path 1210 in the active heat dissipation mechanism 1200 of another embodiment of the present invention is manufactured by bonding, which differs from the active heat dissipation mechanism 200 of the first embodiment of the present invention. This is because the positional or configuration features based on the spacing distance based on the material thickness cannot be directly applied to the active heat dissipation mechanism 1200 of another embodiment of the present invention. The specific features of the active heat dissipation mechanism 1200 of another embodiment of the present invention will be described in more detail below.

[0188] In addition, multiple second refrigerant flow paths 220 are formed in the condensation area other than the first refrigerant flow path 210, which serve as flow paths from the other end of the width direction of the heat transfer plate body (the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side) to the liquid phase refrigerant in the refrigerant, through which the liquid phase refrigerant condensed from gas to liquid can flow toward the side of the first refrigerant flow path 210 by surface tension or gravity.

[0189] In more detail, if the gaseous refrigerant (gas-phase refrigerant) is condensed into a liquid refrigerant (liquid-phase refrigerant) through a heat exchange process with the external air in the condensation area, the original position volume of the second refrigerant flow path 220 in the refrigerant flow space 205 where condensation is taking place gradually increases, and when flowing in the direction of gravity, a flow path is provided in a manner that flows toward the side of the first refrigerant flow path 210 and supplies a uniform amount of liquid-phase refrigerant.

[0190] In particular, as described below, the second refrigerant flow path 220 can be positioned between a plurality of inclined guides 215, and when the liquid-phase refrigerant condensed in the condensation area flows toward the first refrigerant flow path 210 side, the dispersed flow toward the second refrigerant flow path 220 side adjacent to the second refrigerant flow path 220 serving as a magnetic flow path can be suppressed by surface tension.

[0191] That is, since the flow space of the plurality of inclined guides 215 is smaller than the flow space of the second refrigerant flow path 220 , surface tension is applied, thereby suppressing the flow toward the adjacent second refrigerant flow path 220 side.

[0192] As described above, if the dispersed flow of the condensed liquid-phase refrigerant is suppressed by multiple inclined guides 215 and the second refrigerant flow path 220, the phenomenon of the liquid-phase refrigerant falling directly below the direction of gravity can be minimized. By connecting each lower end to the first refrigerant flow path 210 at uniform intervals, the liquid-phase refrigerant condensed in the condensation area will not be heavier and can be supplied to the first refrigerant flow path 210 side in a uniform amount.

[0193] Meanwhile, the plurality of second refrigerant flow paths 220 may be defined between the plurality of inclined guides 215 protruding from the inner sides of the refrigerant flow space 205 facing each other on the heat conducting plate bodies (the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 ).

[0194] Reference Figure 12 (a) In an active heat dissipation mechanism 200 according to an embodiment of the present invention, a heat conduction plate body (a heat conduction plate 200-1 on one side and a heat conduction plate 200-2 on the other side) made of a single component of a predetermined thermally conductive material may be formed by a stamping process S10 before a bending process S20 to be described later to form the first refrigerant flow path 210 and the second refrigerant flow path 220 and a plurality of inclined guides 215 to be described later for realizing these.

[0195] At this time, the heat transfer plate body (the one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) in the flat stretched state before the bending step S20 is formed to have a width in the left-right direction less than Figure 12 In the case of a rectangle having a length in the vertical direction of the figure, the arbitrary reference line T is arranged to cross the center portion of the left end and the right end in the vertical direction, and can become the bending step S20 described later (refer to Figure 12 (b) and (c)) of the benchmark.

[0196] At this time, the center part of the left and right ends of the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2) is the middle part, which can be understood as the part that becomes the boundary between one side heat conduction plate 200-1 and the other side heat conduction plate 200-2.

[0197] Reference Figure 12 (b) and (c) can be bent by a bending jig (not shown) so that the heat conducting plate 200-1 on the left side and the heat conducting plate 200-2 on the right side contact each other based on an arbitrary reference line T.

[0198] At this time, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 may be formed additionally according to the embodiment, and the joining step S40 (see Figure 12The plurality of strength reinforcement parts 240 required for (d)) may be formed so as to face each other and be in surface contact with each other.

[0199] Reference Figure 12 (d) If the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side of the heat conducting plate body (the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side) are in surface contact with each other, then while being joined to each other along their edge ends using a predetermined joining method, each of the multiple strength reinforcement parts 240 in surface contact with each other can be joined to each other using a predetermined joining method.

[0200] At this time, for the refrigerant filling process and caulking process described later, one end and the other end of the first refrigerant flow path 210 formed by the bending process S20 can connect the refrigerant flow space 205 with the outside, and the remaining parts (heat dissipation plate part 203) can be sealed and combined to completely block the refrigerant flow space 205 from the outside.

[0201] In more detail, Figure 12 As shown, the active heat dissipation mechanism 200 of one embodiment of the present invention is based on an arbitrary reference line T defined as a straight line along the vertical direction. The heat conducting plate body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) can include: the one side heat conducting plate 200-1, which forms the left end portion before the bending step S20; and the other side heat conducting plate 200-2, which forms the right end portion before the bending step S20. Here, the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 can be understood as defining the heat conducting plate body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) before the bending step S20.

[0202] However, the heat conducting plate body (the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 ) may be redefined as a structure after the bending step S20 described later.

[0203] For example, the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) as a part formed by the bending process S20 and the joining process S40 described later may include: a press-in end portion 201, which is pressed and combined with the press-in portion 150 that is inclined upward to the left and right sides respectively with the groove structure 170 formed on the back side of the heat dissipation shell body 110 as the heat dissipation object as the center; a heat dissipation plate portion 203, which is a portion defined by the edge end portion of the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) except the press-in end portion 201, and performs heat dissipation according to the phase change of the refrigerant and the heat exchange with the external air (external air).

[0204] However, heat sink portion 203, excluding the aforementioned press-fit end portion 201, is preferably defined as the entire area where heat is dissipated after heat exchange between the refrigerant (particularly, the gas-phase refrigerant) filled therein and the outside air (external air). Heat exchange between the gas-phase refrigerant in heat sink portion 203 and the external air means that the gas-phase refrigerant condenses and changes phase to liquid-phase refrigerant.

[0205] In addition, the heat dissipation plate portion 203 may be formed with a plurality of strength reinforcement portions 240 protruding from the inner surface of the one heat conducting plate 200 - 1 and the inner surface of the other heat conducting plate 200 - 2 separated in the thickness direction toward the refrigerant flow space 205 .

[0206] At the same time, as described below, multiple strength reinforcement parts 240 are formed simultaneously with the second refrigerant flow path 220, the third refrigerant flow path 230 and the multiple inclined guide members 215 through the stamping process S10, and after the bending process S20 and the joining process S40, when observed from the outside, it can be understood that they are formed by being recessed from the outside to the inside of the heat dissipation plate part 203.

[0207] If the first refrigerant flow path 210 is located downward relative to the direction of gravity, and the refrigerant that has primarily changed phase to liquid (liquid-phase refrigerant) in the refrigerant flow space 205 flows downward along the direction of gravity, then this can be defined as a flow path that captures the liquid refrigerant on the same inclined guide 215 and uniformly moves and disperses the liquid-phase refrigerant throughout the entire evaporation region where it has changed to a gaseous phase due to heat transferred from the multiple heating elements 140 of the heat dissipation housing body 110. In this case, the uniform movement and dispersion of the liquid-phase refrigerant in the function of the first refrigerant flow path 210 can refer to the concept of transferring the liquid-phase refrigerant in at least a direction different from the direction of gravity through the absorber 300 described later.

[0208] Furthermore, the term "uniform movement and dispersion of the liquid-phase refrigerant" in the function of the first refrigerant flow path 210 can be understood to mean that the liquid-phase refrigerant is uniformly supplied and transferred through the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 formed obliquely with respect to the single first refrigerant flow path 210. This will be described in more detail in the description of the absorber 300.

[0209] By inserting and disposing the absorber 300 described later in the first refrigerant flow path 210 , it is possible to promote the collection and dispersion of the liquid-phase refrigerant and the transfer of the liquid-phase refrigerant in a direction different from the direction of gravity.

[0210] Here, if Figure 13As shown, after the bending step S20, the first refrigerant flow path 210 can be formed symmetrically with respect to the arbitrary reference line T along the thickness direction of the refrigerant flow space 205. Therefore, the first refrigerant flow path 210 can be newly defined as a flow path including the arbitrary reference line T as the reference of the bending step S20.

[0211] 4. The first refrigerant flow path and the press-in end portion, and the second refrigerant flow path and the heat dissipation plate portion

[0212] As mentioned above, Figures 14 to 16 As shown, the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) can be bent with an arbitrary reference line T as a reference on the one side heat transfer plate 200-1 and the other side heat transfer plate 200-2, and a first refrigerant flow path 210 can be formed inside, and a press-in end portion 201 can be formed outside to be combined with a press-in portion 150 formed on the back side of the heat dissipation shell body 110 as a heat dissipation object.

[0213] Furthermore, as described above, the heat conducting plate body (the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 ) may further include a heat dissipation plate portion 203 , which is defined as the remaining portion except the press-fit end portion 201 .

[0214] After the bending step S20 of the heat dissipation plate portion 203 , the edges of the one side heat conduction plate 200 - 1 and the other side heat conduction plate 200 - 2 are joined to each other in a predetermined manner, thereby sealing the refrigerant flow space 205 .

[0215] Here, the predetermined joining method may be one of welding and bonding. Preferably, laser welding may be used among the welding methods. However, laser welding is not required; any joining method may be used as long as it provides a sufficient sealing force to prevent leakage of the refrigerant filled therein.

[0216] In addition, if Figure 14 and Figure 15 As shown, the end of the press-in end portion 201 inserted into the press-in portion 150 may include a circular cross section (see Figure 14 (b) and (d) Figure 15 (a)) or plane section (refer to Figure 14 (c) and (e) of Figure 15 (b)) is formed by bending in one of the ways.

[0217] In more detail, Figure 14 (b) and (d) and Figure 15 As shown in (a), the press-in end portion 201 can be formed into a semicircular arc-shaped cross section having a radius of R1, as shown in FIG. Figure 14 (c) and (e) and Figure 15As shown in (b), an edge end portion may be formed to have a rounded surface with a radius R2 smaller than R1, and the remaining portion may be formed to have a flat end portion.

[0218] In the case of the press-fit end portion 201 implemented in a manner having an R1 value (see Figure 15 (a)) has an advantage in terms of process because it can be formed through a single bending step S20. On the contrary, it has a disadvantage that the first refrigerant flow path 210 occupies a relatively small volume relative to the press-fit portion 150.

[0219] On the contrary, in the case of the press-fit end portion 201 implemented in a manner having an R2 value (see Figure 15 (b) of the embodiment of the present invention) has a disadvantage in terms of the process of forming the first refrigerant flow path 210 by performing the bending process S20 twice. In addition, there is an advantage that the volume occupied by the first refrigerant flow path 210 relative to the press-fit portion 150 is relatively large.

[0220] In this case, the outer side surface of the press-in end portion 201 may be inserted by press-fitting after the press-in portion 150 formed on the back surface of the heat dissipation housing body 110 is subjected to thermal epoxy treatment.

[0221] Furthermore, when the press-in end portion 201 is inserted into the press-in portion 150, at least a portion of the first refrigerant flow path 210 can flow into the inner side of the front end of the press-in portion 150. The following describes in more detail the mounting structure of the active heat dissipation mechanism 200 according to one embodiment of the present invention and the active heat dissipation mechanism 1200 according to another embodiment of the present invention relative to the press-in portion 150.

[0222] In addition, if Figures 12 to 15 As shown, the multiple second refrigerant flow paths 220 can play the following role: the refrigerant that changes phase into gas-phase refrigerant (gas-phase refrigerant) and flows toward the heat dissipation plate portion 203 side, and after heat exchange with the external air, is condensed into liquid-phase refrigerant (liquid-phase refrigerant) again and naturally flows to the first refrigerant flow path 210 side.

[0223] In more detail, Figures 12 to 15 As shown, the second refrigerant flow path 220 is set in the condensation area formed at a position outside the first refrigerant flow path 210, which can be defined as the space between multiple inclined guides 215 that guide the flow of liquid refrigerant that changes from gas phase to liquid phase to the evaporation area.

[0224] Here, if Figure 13 As shown, the plurality of inclined guides 215 defining the second refrigerant flow path 220 may be provided to protrude from the inner side surfaces of the one side heat transfer plate 200 - 1 and the other side heat transfer plate 200 - 2 toward the refrigerant flow space 205 after the bending step S20 described later.

[0225] The plurality of inclined guide members 215 can be arranged in a straight line that is inclined downward in the direction of gravity toward the first refrigerant flow path 210. Therefore, the liquid refrigerant condensed on the heat dissipation plate portion 203 side can naturally condense and flow toward the first refrigerant flow path 210 along the plurality of downwardly inclined guide members 215, thereby increasing the circulation speed of the liquid refrigerant.

[0226] Here, the plurality of second refrigerant flow paths 220 or the plurality of inclined guide members 215 can be arranged in parallel with each other. The liquid-phase refrigerant condensed in a wider condensation area than the evaporation area roughly defined as the first refrigerant flow path 210 is closely and evenly arranged in parallel with the second refrigerant flow paths 220, or the flow of the liquid-phase refrigerant can be dispersed by the inclined guide members 215, thereby providing an advantage of uniform heat dissipation performance throughout the entire condensation area.

[0227] Furthermore, a plurality of inclined guides 215 are respectively formed on one side heat conduction plate 200 - 1 and the other side heat conduction plate 200 - 2 , and the front ends thereof protruding toward the refrigerant flow space 205 can be formed to be separated from each other without being joined in the refrigerant flow space 205 .

[0228] As described above, since the second refrigerant flow path 220 functions to guide the flow of the liquid-phase refrigerant in the direction of gravity, it is preferable that the second refrigerant flow path 220 have a thickness dimension sufficient to naturally form a flow in the direction of gravity without being stopped by surface tension, an inherent characteristic of liquids. Furthermore, the second refrigerant flow path 220 can be configured to suppress the dispersed flow of the liquid-phase refrigerant toward adjacent second refrigerant flow paths 220 due to surface tension or gravity after the liquid-phase refrigerant condenses to a predetermined size or greater.

[0229] At the same time, at least one of one end and the other end of the multiple second refrigerant flow paths 220 or the multiple inclined guide members 215 is connected to the evaporation area or the first refrigerant flow path 210 formed in the evaporation area, and the end connected to the side of the first refrigerant flow path 210 formed in the evaporation area or the evaporation area (i.e., one of the one end and the other end) is located on the lower side in the direction of gravity relative to the other end of the one end and the other end.

[0230] Therefore, when at least one of one end and the other end of the multiple second refrigerant flow paths 220 is defined as "one end", the one end has the same meaning as the "lower end" located on the lower side based on the direction of gravity, and conversely, when another of the one end and the other end of the multiple second refrigerant flow paths 220 is defined as "the other end", the other end can have the same meaning as the "upper end" located on the upper side based on the direction of gravity.

[0231] Further, as described above, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be formed such that at least one of one end and the other end is connected to the first refrigerant flow path 210 and the one end and the other end are connected in a straight line.

[0232] According to the straight line shape of the multiple second refrigerant flow paths 220 as described above, the distance between one end of the first refrigerant flow path 210 side that is closest to the heating element 140 and receives heat and the other end on the outermost end side of the condensation area that actively condenses through heat exchange with the external air is minimized. The straight line shape of the second refrigerant flow path 220 itself is the optimal shape that can minimize the overlapping length (flow resistance length) of the liquid-phase refrigerant flow path and the gas-phase refrigerant flow path.

[0233] For example, although not shown in the figure, the difference between the second refrigerant flow path 220 having a straight line shape and the case where the second refrigerant flow path 220 is formed into a honeycomb structure (honeycomb structure) only considering ensuring the heat dissipation area of the condensation area corresponding to the heat dissipation plate portion 203 will be briefly described as follows.

[0234] That is, in the case where the second refrigerant flow path 220 is formed into a honeycomb structure, when the liquid-phase refrigerant receives heat in the evaporation area corresponding to the injection end 201 and changes phase into the gas-phase refrigerant and then diffuses and flows to the outer end side, the liquid-phase refrigerant acts as a flow resistance to prevent the liquid-phase refrigerant from flowing in a straight line to the other end side of the heat dissipation plate portion 203 corresponding to the minimum distance, so it is difficult to expect active gas-liquid circulation.

[0235] In contrast, in the case of the active heat dissipation mechanism 200 of an embodiment of the present invention, the difference is that the gas-liquid circulation from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end portion serving as the end of the condensation area (i.e., the other end in the width direction) adopts a straight line structure that proceeds smoothly without any particular flow resistance and a gas-liquid flow separation structure described later.

[0236] That is, in the active heat dissipation mechanism 200 of one embodiment of the present invention, unlike the case of the honeycomb structure, in order to guide the liquid phase flow of the liquid phase refrigerant after the phase change in the gas phase refrigerant in the refrigerant flow space 205, multiple refrigerant flow paths are formed to branch from one end in the width direction of the first refrigerant flow path 210 located on the lower side in the gravity direction without branching from the other end in the width direction.

[0237] This can be confirmed to be a completely different heat dissipation mechanism from the RBFHP of the "conventional paper" introduced in the "background art" section, in which a honeycomb structure (honeycomb structure) is provided in the form of a refrigerant flow path.

[0238] That is, in the RBFHP of the existing paper, the edge ends of two material sheets are joined by roller joining. Even if the refrigerant is filled at least inside, in order for the liquid-phase refrigerant to initially receive the heat actually transferred from the heat generating element, there is a concern that the thermal fluidity may decrease due to the thermal resistance of the material itself, corresponding to the length of the edge end serving as the joining portion. After the liquid-phase refrigerant receives heat and is converted into a gas-phase refrigerant, as the flow path toward the outer end side becomes longer due to the honeycomb structure, resistance to the flow in the opposite direction to the condensed liquid-phase refrigerant is generated, making it difficult to expect active gas-liquid circulation.

[0239] In contrast, in the case of an active heat dissipation mechanism 200 according to an embodiment of the present invention, a heat transfer plate body (a heat transfer plate 200-1 on one side and a heat transfer plate 200-2 on the other side) is spaced apart from the heating element 140 or the press-fit portion 150 on which the heating element 140 is provided by a thickness equivalent to that of the heat transfer plate body through the bending process S20 of a single metal plate component, and is close to the first refrigerant flow path 210 for entering which the liquid-phase refrigerant is provided. A straight line structure and a gas-liquid flow separation structure are applied in which gas-liquid circulation proceeds smoothly without any particular flow resistance from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end portion (i.e., the other end in the width direction) which is the end portion of the condensation area, thereby realizing a completely different heat dissipation mechanism.

[0240] That is, in order to guide the liquid phase flow of the liquid phase refrigerant transformed from the gas phase refrigerant in the refrigerant flow space, multiple second refrigerant flow paths 220 are formed to branch from one end in the width direction of the first refrigerant flow path 210 located on the lower side in the gravity direction without branching from the other end in the width direction.

[0241] In addition, as described above, the multiple inclined guide members 215 not only define the second refrigerant flow path 220 between each inclined guide member 215 as a flow path for guiding the flow of liquid-phase refrigerant in the direction of gravity, but can also perform the function of defining the third refrigerant flow path 230 described later corresponding to the separation portion in the thickness direction.

[0242] In this case, when the plurality of inclined guide members 215 are based on the premise that the first refrigerant flow path 210 is relatively located at the lower part in the gravity direction due to the tilt adjustment of the entire heat dissipation shell body 110, it is preferred that a pattern is formed in a manner inclined relative to the first refrigerant flow path 210 to form a flow path for the liquid phase refrigerant (liquid phase refrigerant) to flow.

[0243] Here, the second refrigerant flow path 220, defined as the gap space between the plurality of inclined guides 215, may be a refrigerant flow path that extends upwardly and obliquely from the first refrigerant flow path 210 corresponding to the arbitrary reference line T toward the widthwise end portions of the heat transfer plate bodies (the one-side heat transfer plate 200-1 and the other-side heat transfer plate 200-2). This is to facilitate the movement of liquid-phase refrigerant liquefied on the heat dissipation plate portion 203 side toward the first refrigerant flow path 210 having the absorber 300 due to its own weight.

[0244] 5. Third refrigerant flow path

[0245] Figure 16 and Figure 17 1 is a three-dimensional diagram and a partial enlarged diagram of an active heat dissipation mechanism before and after bending according to an embodiment of the present invention. Figure 18 FIG. 1 is a plan view of a bent active heat dissipation mechanism according to an embodiment of the present invention. Figure 19 It is along Figure 18 Cross-sectional view taken along line CC.

[0246] refer to Figures 16 to 19 The active heat dissipation mechanism 200 according to an embodiment of the present invention may further include a third refrigerant flow path 230 .

[0247] Here, after the heat transfer plate body (the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side) completes the bending process S20 and the joining process S40, a surface of the heat transfer plate 200-1 on one side and a portion of a surface of the heat transfer plate 200-2 on the other side are joined to each other with an arbitrary reference line T as a reference to form a refrigerant flow space 205, and the refrigerant flow space 205 can form the first refrigerant flow path 210 and the second refrigerant flow path 220 together with the joining process S40, as well as the third refrigerant flow path 230 added according to the embodiment.

[0248] Reference edge Figure 17In the cross-sectional view taken along line EE, the second refrigerant flow path 220 is formed in the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side. In contrast to being defined as being formed between adjacent multiple inclined guide members 215 in a direction other than the thickness direction of the refrigerant flow space 205, the third refrigerant flow path 230 can be defined as the space between the inclined guide member 215 formed in the heat conducting plate 200-1 on one side and the inclined guide member 215 formed in the heat conducting plate 200-2 on the other side in the thickness direction of the refrigerant flow space 205. However, it should be noted that when defining the second refrigerant flow path 220, excluding the thickness direction means that the reference direction of the definition is not the thickness direction, and should not be interpreted as excluding the volume occupied by the thickness direction as the corresponding volume and space.

[0249] In more detail, the third refrigerant flow path 230 is a case where the inclined guide members 215 are formed to protrude further toward the refrigerant flow space 205 than the second refrigerant flow path 220, and the thickness length of the refrigerant flow space 205 can be set to be smaller than the area of the second refrigerant flow path 220. That is, the third refrigerant flow path 230 can be defined by the plurality of inclined guide members 215 as an area having a thickness smaller than that of the second refrigerant flow path 220.

[0250] At the same time, the third refrigerant flow path 230 is a portion in which multiple inclined guide members 215 are formed on the facing surfaces of one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 in the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2), which can be defined as a portion that is not connected and separated from each other in the refrigerant flow space 205.

[0251] The third refrigerant flow path 230 can function as a gas flow path, so that the refrigerant filled in the refrigerant flow space 205 can be easily diffused and flowed throughout the heat sink portion 203 after being transformed into a gas-phase refrigerant in the evaporation region of the first refrigerant flow path 210. The gas-phase refrigerant evaporated in the first refrigerant flow path 210, which is the evaporation region, moves toward the heat sink portion 203 and is smoothly and evenly dispersed through the third refrigerant flow path 230, thereby performing heat dissipation and condensation.

[0252] For example, while the liquid-phase refrigerant naturally flows through the space between the inclined guides 215 adjacent to the second refrigerant flow path 220 , the gas-phase refrigerant actively flows through the third refrigerant flow path 230 which is a space not occupied by the liquid-phase refrigerant.

[0253] However, this does not mean that the liquid-phase refrigerant is completely separated from the gas-phase refrigerant through the third refrigerant flow path 230 and is not occupied. Preferably, it should be understood that the gas-phase refrigerant flows more actively through the third refrigerant flow path 230 .

[0254] That is, the phase change of the refrigerant is not formed by a complete division between the liquid-phase refrigerant and the gas-phase refrigerant, so it is difficult to distinguish and define accurately, but generally speaking, the second refrigerant flow path 220 is relatively large in the thickness direction, so it becomes the path where the liquid-phase refrigerant mainly flows, and the third refrigerant flow path 230 can be the path where the gas-phase refrigerant mainly flows.

[0255] In more detail, since the gas-phase refrigerant has greater activity than the liquid-phase refrigerant, the third refrigerant flow path 230 having a relatively small size in the thickness direction can be the main flow path, and considering the surface tension of the liquid refrigerant itself, the second refrigerant flow path 220 having a larger size than the third refrigerant flow path 230 in the thickness direction can be the main flow path of the liquid refrigerant.

[0256] In addition, the third refrigerant flow path 230 may also be defined as a refrigerant flow path that connects spaces between the second refrigerant flow paths 220 that are spaced apart in parallel.

[0257] For example, the second refrigerant flow path 220 can be formed by processing one side and the other side of the heat conducting plate body (the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) through a stamping process S10 before bending, with an arbitrary reference line T in the middle portion where the first refrigerant flow path 210 is provided as a reference, so that the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 are processed to protrude to the portion forming the refrigerant flow space, but after bending to form the third refrigerant flow path 230, they can form a certain pattern shape, thereby being divided by the third refrigerant flow path 230. Of course, it should be noted that the "division" here does not refer to a complete physical and spatial division, but refers to the shape and position that distinguish the second refrigerant flow path 220 from the third refrigerant flow path 230.

[0258] In addition, if Figure 16 As shown, the heat conducting plate bodies (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) can be bent at the two ends in the width direction corresponding to an arbitrary reference line T and joined to each other in surface contact.

[0259] At this time, as described above, the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 are formed symmetrically on the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 with an arbitrary reference line T as the center, and each thickness direction size has an internal size that is twice the depth of the recess formed on the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 by the stamping process S10 described later.

[0260] In more detail, Figure 19 As shown, the first refrigerant flow path 210 is a portion formed by the bending process S20 described later, and is a portion where the press-in end 201 is formed by the press-in portion 150 of the heat dissipation shell body 110 directly contacting the heating surface of the plurality of heating elements 140. The size of the outer side surface of the portion forming the press-in end 201 can be approximately greater than or equal to the thickness 220L of the second refrigerant flow path 220.

[0261] At the same time, if Figure 19 As shown, the maximum dimension 220L of the second refrigerant flow path 220 in the thickness direction may be greater than the maximum dimension 230L of the third refrigerant flow path 230 in the thickness direction.

[0262] This is because, during the stamping process S10 performed before the bending process S20 of the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2), the second refrigerant flow path 220 is not crimped, and only the edge end portion forming the heat dissipation plate portion 203, multiple inclined guides 215, the third refrigerant flow path 230 and multiple strength reinforcement portions 240 described later are crimped into shape.

[0263] 6. Multiple strength reinforcement parts

[0264] In addition, if Figures 16 to 19 As shown, the active heat dissipation mechanism 200 of an embodiment of the present invention may further include: a plurality of strength reinforcement portions 240, formed on at least one of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side, and protruding a predetermined length from the inner surface of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side toward the refrigerant flow space 205 and formed in a mutually opposing manner.

[0265] In more detail, when the refrigerant flow space 205 is formed by bending and joining a single metal plate part, the heat conduction plate 200-1 on one side before bending forms the edge ends in the width direction and the length direction on one side with an arbitrary reference line T as a reference, and the heat conduction plate 200-2 on the other side before bending forms the edge ends in the width direction and the length direction on the other side with an arbitrary reference line T as a reference.

[0266] Similarly, in the case where the refrigerant flow space 205 is formed by joining two metal plate parts, before joining, the heat conduction plate 200-1 on one side forms the edge ends in the width direction and the length direction on one side based on the edge end portion forming the first refrigerant flow path 210, and before joining, the heat conduction plate 200-2 on the other side can form the edge ends in the width direction and the length direction on the other side based on the edge end portion forming the first refrigerant flow path 210.

[0267] Here, the plurality of strength reinforcements 240 are portions other than the reference line T or the evaporation region forming the first refrigerant flow path 210 , and may be formed on at least one of the one side heat conduction plate 200 - 1 and the other side heat conduction plate 200 - 2 constituting the condensation region.

[0268] Multiple strength reinforcement parts 240 are usually formed on at least one of the planar side heat conduction plate 200-1 and the other side heat conduction plate 200-2, which can play a role in strengthening the strength to prevent sagging or pressing caused by internal pressure (internal pressure) caused by external pressure or phase change of refrigerant.

[0269] Here, the front end surfaces of the multiple strength reinforcement parts 240 are formed to protrude more than the front end surfaces of the multiple inclined guide members 215 toward the refrigerant flow space 205 side in the thickness direction equivalent to the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) after bending.

[0270] At this time, the front ends of the multiple strength reinforcement parts 240 protrude toward the refrigerant flow space 205 side, preferably, at least during the joining process S40 after the bending process S20 described later, the mutually facing parts of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side protrude to the extent of surface contact in a manner that allows them to be joined to each other by a predetermined joining method.

[0271] However, the plurality of strength reinforcing portions 240 do not necessarily need to be in surface contact with each other after being bent, and may be spaced apart from each other in the refrigerant flow space 205 as shown in the above-mentioned inclined guide 215 .

[0272] However, when the plurality of strength reinforcing portions 240 are limited to a structure to be joined to each other by welding or the like in the joining step S40 described later, they are preferably formed so as to protrude and contact each other in the refrigerant flow space 205. This is because simply forming the plurality of strength reinforcing portions 240 can also serve to reinforce the strength of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2.

[0273] In this case, the plurality of strength reinforcements 240 may be formed by sheet metal processing during the punching process S10 so as to be smaller than the minimum thickness within the refrigerant flow space 205 formed by at least the plurality of second refrigerant flow paths 220 .

[0274] Here, the second refrigerant flow path 220 is defined as a space between two adjacent inclined guide members 215 in the plurality of inclined guide members 215 except for the thickness direction. Figure 17 The minimum thickness of the second refrigerant flow path 220 in the refrigerant flow space 205 may be interpreted as having the same meaning as the thickness of the third refrigerant flow path 230 .

[0275] As described above, in the active heat dissipation mechanism 200 according to an embodiment of the present invention, the plurality of strength reinforcement portions 240 are processed to be at least smaller than the thickness of the third refrigerant flow path 230 (or the minimum thickness of the second refrigerant flow path 220), thereby further increasing the contact surface area with the gas-phase refrigerant freely flowing through the third refrigerant flow path 230, thereby enabling the effect of achieving refrigerant condensation in a shorter time.

[0276] And, as Figure 13 As shown, the plurality of strength reinforcements 240 are symmetrically formed on the heat conducting plate 200 - 1 and the heat conducting plate 200 - 2 on the other side with respect to an arbitrary reference line T, and may be formed only on the plurality of inclined guides 215 .

[0277] Here, the plurality of inclined guide members 215 are also processed into the planar form of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side through the stamping process S10, thereby performing the first strength reinforcement function, and the plurality of strength reinforcement parts 240 are again processed on the plurality of inclined guide members 215 that have undergone the first processing, thereby being able to perform the second strength reinforcement function.

[0278] However, according to the embodiment, as another embodiment described later (refer to the Figure 20 a's 200T-1, Figure 20 b) may also be formed at a portion other than the inclined guide 215 (ie, a portion not related to the inclined guide 215). This will be described in more detail in the following description of the corresponding embodiment.

[0279] Here, multiple strength reinforcements 240 are formed on the opposing surfaces of the heat conducting plate bodies (the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side), and their front end surfaces can be arranged to face each other within the refrigerant flow space 205 or the first refrigerant flow path 210 to the third refrigerant flow path 230. Furthermore, the opposing and contacting surfaces of the multiple strength reinforcements 240 arranged to face each other can be joined by laser welding.

[0280] In particular, it is preferred that multiple strength-reinforced portions 240 be formed on the third refrigerant flow path 230, which primarily serves as a flow path for the gas-phase refrigerant, to increase the condensation surface area where the gas-phase refrigerant, which has undergone a phase change to a gaseous state, contacts and condenses during flow. However, as described above, the third refrigerant flow path 230 can be defined as the space between the plurality of inclined guide members 215 in the thickness direction. Therefore, in this context, the concept of multiple strength-reinforced portions 240 formed on the plurality of inclined guide members 215 is the same as that of the plurality of inclined guide members 215.

[0281] Here, the plurality of strength reinforcing parts 240 may be formed in any shape as long as they can reinforce the strength of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2. Figure 16 and Figure 17 As shown, a dot reinforcement portion 242 having a circular cross-sectional shape and a line reinforcement portion 241 having only a semicircular cross-sectional shape at a longitudinal end and formed as a straight line in the longitudinal direction may be included.

[0282] In more detail, multiple wire reinforcement parts 241 are formed long along the width direction of the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2), and are formed on multiple inclined guide members 215. When the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 are bent and joined, they can be arranged opposite to each other.

[0283] Similarly, multiple point reinforcements 242 are formed between each of the multiple line reinforcements 241 and on the multiple inclined guides 215. When the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side are bent and joined, they can be arranged opposite to each other.

[0284] Here, the plurality of line reinforcements 241 and the plurality of point reinforcements 242 may be alternately arranged one by one on one inclined guide 215 .

[0285] However, the plurality of strength reinforcement portions 240 do not necessarily need to be divided into a plurality of line reinforcement portions 241 and a plurality of point reinforcement portions 242. Figure 20 As shown in FIG. 1 a , of course, the dot reinforcement portions 242 may be arranged in an elliptical shape similar to the dot reinforcement portions 242 at uniform intervals with respect to the entire heat dissipation plate portion 203 .

[0286] 7. Absorber

[0287] Figure 20 and Figure 21 This is a perspective view showing an example of an absorber in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

[0288] like Figure 11 、 Figure 14 、 Figure 20 and Figure 21 As shown, the active heat dissipation mechanism 200 of an embodiment of the present invention may further include: an absorber 300, which absorbs the liquid-phase refrigerant in the state of the refrigerant guided through the second refrigerant flow path 220 and evenly disperses it in the first refrigerant flow path 210 which is arranged relative to the direction of gravity or inclined relative to the direction of gravity.

[0289] In more detail, the absorber 300 is close to the press-in portion 150 provided on the back side of the heat dissipation shell body 110 which is the heat dissipation object, and is arranged in the first refrigerant flow path 210 which forms an evaporation area for changing the refrigerant from the liquid phase to the gas phase. By means of capillary force or absorption force, the liquid phase refrigerant in the refrigerant can be caused to rise to the upper side at least further than its absorption point.

[0290] To this end, the absorber 300 may include a plurality of holes (not shown in the figure) to absorb and retain the liquid refrigerant and to disperse the liquid refrigerant in the gravity direction or at least in a direction opposite to the gravity direction (ie, downward direction).

[0291] The absorber 300 as described above can prevent shape deformation due to sagging in the direction of gravity by a supporting structure (eg, the frame holding portion 320 ) described later while maintaining the absorption rate of the liquid-phase refrigerant by the plurality of holes.

[0292] Here, the absorber 300 is a metal sintered body formed by sintering a powder of a metal material, and is a concept including a wick component having a wick structure arranged inside a general vapor chamber, but is not limited to this. On the first refrigerant flow path 210 arranged obliquely relative to the direction of gravity, the liquid refrigerant is captured and transferred as a whole in the upper and lower directions, thereby improving the limitations of the thermal conductivity material of the existing general heat dissipation fins and maximizing the heat dissipation performance. This concept can include all of these.

[0293] In addition, in the absorber 300, the closer to the pressing end 201 side, the easier it is for the heat transferred through the heating element 140 to make the phase change from liquid refrigerant to gas refrigerant more active. Preferably, it is arranged as close as possible to the pressing end 201 side where the width in the width direction of the refrigerant flow space 205 is relatively narrow.

[0294] However, the absorber 300 does not necessarily need to be installed only near the press-in end 201 side, and can of course be installed in a manner uniformly distributed throughout the heat dissipation plate portion 203 except the press-in end 201, which corresponds to the evaporation area where the refrigerant can evaporate.

[0295] However, in the case of an active heat dissipation mechanism 200 of an embodiment of the present invention, the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) set up using a single component is bent, and the edge ends corresponding to the heat dissipation plate part 203 are joined to each other, and then the absorber 300 is installed in the opening parts at both ends of the first refrigerant flow path 210 side. In this regard, due to the manufacturing method, the evaporation area of the refrigerant can be limited to the first refrigerant flow path 210.

[0296] Here, the absorbent body 300 can comprise one of a nonwoven fabric with multiple pores (a wick structure), a nonwoven fabric supported by metal threads or a metal braid, and a sintered metal body formed by sintering metal powder. Similar to the main absorbent body 350, the metal material can include copper, which has excellent thermal conductivity, and the nonwoven fabric can be supported by thin copper threads or a copper braid woven with these threads.

[0297] That is, the absorber 300 may be a non-woven fabric made of a fiber material. In this case, the non-woven fabric material itself is a very soft material, and when the liquid refrigerant is absorbed, it may be difficult to maintain a vertical shape due to the weight of the absorbed liquid refrigerant. Therefore, the non-woven fabric may be supported by a braid made of copper wire or a copper wire material woven with copper wire.

[0298] Here, the non-woven fabric is constructed by being inserted into a braided body made of copper wire and maintaining its shape, so that the non-woven fabric provided as the absorber 300 can be stably fixed and prevented from flowing in the direction of gravity (i.e., the up and down direction) or in the first refrigerant flow path 210 arranged at an angle relative to the direction of gravity.

[0299] However, the nonwoven fabric does not need to be supported so as to be inserted into the braid of copper wires. A support structure in which a single copper wire vertically penetrates the nonwoven fabric or spirally surrounds the nonwoven fabric may be employed.

[0300] Here, within the limit that the absorber 300 can maintain its shape even under the load of the liquid refrigerant it holds, the non-woven fabric can be combined with the inside of a braided body made of copper wire, or it can be arranged in a spiral form around the copper wire itself or the braided body made of copper wire on the outer peripheral surface of the non-woven fabric.

[0301] In more detail, Figure 20 and Figure 21 As shown, the absorber 300 includes: an absorption main body 310, which has a predetermined absorption rate for liquid refrigerant and is deformed in shape by an external force including a predetermined gravity or above; and a skeleton retaining part 320, which is connected to the absorption main body 310 to prevent the absorption main body 310 from being deformed in shape due to external force.

[0302] Here, the absorbent body 310 can be formed from a nonwoven fabric, cotton, or sponge that has multiple pores (a type of wick structure) as described above. While the absorbent body 310 made of nonwoven fabric, cotton, or sponge can be positioned elongated in the vertical direction of gravity due to the material properties, if liquid is contained in the pores, its outer shape may sag in the direction of gravity due to the weight of the liquid.

[0303] As described above, if the absorption body 310 sags due to the presence of liquid, and the uppermost end position is changed to the lower portion on the first refrigerant flow path 210 , the evaporation area may be reduced by the degree of the change.

[0304] The frame holding portion 320 prevents the absorbent body 310 from deforming in shape, such as sagging, and can be formed in a tube shape with a hollow portion (not shown) inside of the absorbent body 310.

[0305] Preferably, since the frame holding portion 320 also has a structure for transferring heat transferred from the external heating element 140 to the absorbing body portion 310, the frame holding portion 320 is preferably made of a metal material having a predetermined thermal conductivity or higher. For example, the metal material constituting the frame holding portion 320 can be copper.

[0306] And, as Figure 20 As shown, the skeleton holding portion 320 is made of metal wire woven into a tube shape (see reference numeral "321"), or as shown in FIG. Figure 21 As shown, a metal wire made of a single metal material may be spirally wound around the outer peripheral surface of the absorbent body 310 (see reference numeral 322 ).

[0307] For more details, refer to Figure 20 The skeleton retaining portion 321 is woven into a tube shape using metal (copper) wires made of metal material, so that the liquid refrigerant flowing through multiple second refrigerant flow paths 220 and guided to the first refrigerant flow path 210 side can penetrate into the internal absorption main body 310.

[0308] At this time, the skeleton holding portion 321 of the braided body woven into a tubular shape can be woven to have gaps that allow at least the liquid refrigerant in the refrigerant to be transferred from the outside to the internal absorption body portion 310 due to surface tension. In this case, the gaseous refrigerant that has changed phase from the liquid refrigerant through the absorption body portion 310 can be easily dispersed to the outside through the woven gaps.

[0309] And, refer to Figure 21 The skeleton holding portion 322 may be configured such that a single metal (copper) plate (or wire) is spirally wound around the outside of the absorption main body portion 310 .

[0310] Here, the metal plate (or metal wire) preferably has a shape-retaining force sufficient to prevent the metal plate (or metal wire) from sagging downward due to gravity even when the absorption body 310 contains a sufficient amount of liquid-phase refrigerant.

[0311] In addition, if Figure 20As shown, the frame holding portion 321 of the absorbent body 300 may be formed in a cylindrical shape, and the absorbent main body portion 310 may be formed in a cylindrical shape so as to be inserted into the frame holding portion 321 formed in a cylindrical shape.

[0312] As described above, in the active heat dissipation mechanism 200 of one embodiment of the present invention, the absorber 300 is formed by separately manufacturing and combining the absorption main body 310 and the skeleton retaining part 320, but there is no need to additionally include the skeleton retaining part 320. When the absorption main body 310 does not undergo shape deformation such as sagging even when containing liquid refrigerant due to its own shape retention force, it may be sufficient to only provide the absorption main body 310.

[0313] The absorber 300 of the above-mentioned embodiment includes an absorption main body 310 formed of a material selected from non-woven fabric, cotton and sponge, and a skeleton retaining part 320 formed of a braided body woven into a tube shape using a metal (copper) wire material or wrapped into a spiral shape, thereby preventing sagging downward regardless of the amount of liquid refrigerant contained in the absorption main body 310, thereby enabling a uniform amount of liquid refrigerant to change phase on the first refrigerant flow path 210.

[0314] And, as Figure 14 As shown, the active heat dissipation mechanism 200 according to an embodiment of the present invention may further include a plurality of absorber fixing guides 250 .

[0315] The plurality of absorber fixing guides 250 can play a role in stably fixing the absorber 300, which is arranged long in the direction of gravity (i.e., the vertical direction), within the refrigerant flow space 205 (especially, the first refrigerant flow path 210). In particular, when the absorber 300 is made of only non-woven fabric and is not supported by a woven metal body such as the frame holding portion 320, the plurality of absorber fixing guides 250 play a role in preventing it from sagging in the direction of gravity when absorbing liquid refrigerant.

[0316] During the punching step S10 , the plurality of absorber fixing guides 250 may be formed together with the first to third refrigerant flow paths 210 to 230 and the plurality of inclined guides 215 or the plurality of strength reinforcements 240 .

[0317] In more detail, if a non-woven fabric absorber 300 is used to absorb liquid refrigerant, there is a concern that multiple absorber fixing guides 250 may droop in the direction of gravity. In order to prevent this, they are formed to protrude toward the refrigerant flow space 205. When the edge ends of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side are joined to each other through the joining process S40, the absorber 300 can be pressed and stably fixed.

[0318] Here, when the non-woven fabric is located inside the metal braid and supported, the structure where the absorber 300 is actually supported by the plurality of absorber fixing guides 250 may be the outer surface of the braid.

[0319] In addition, multiple absorber fixing guides 250 press the outer side surface of the absorber 300 or the woven fabric whose shape is easily deformed by external force, and can also simultaneously perform the function of ensuring a predetermined space for the gaseous refrigerant (gas-phase refrigerant) that evaporates in the first refrigerant flow path 210 to flow.

[0320] As described above, the absorber 300 is built into the interior of the first refrigerant flow path 210. The liquid-phase refrigerant condensed and liquefied from the heat dissipation plate portion 203 side moves to a position close to the heating element 140 and is retained by the absorption force (or capillary force) of the absorber 300. After the phase is changed into the gas-phase refrigerant by the heat transferred from the heating element 140, the gas-phase refrigerant can diffuse again by the diffusion principle of gas and flow to the entire heat dissipation plate portion 203.

[0321] The gas-phase refrigerant moving toward the heat dissipation plate portion 203 is smoothly and evenly dispersed to the entire heat dissipation plate portion 203 through the third refrigerant flow path 230, and is condensed while performing heat dissipation through heat exchange with the external air. The condensed liquid-phase refrigerant can again easily move toward the direction of gravity, i.e., the first refrigerant flow path 210, along the second refrigerant flow path 220 whose dimension in the thickness direction is larger than that of the multiple inclined guides 215.

[0322] The heat generated from the heating element 140 is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored in the first refrigerant flow path 210 side with the absorber 300 is in liquid state inside the absorber 300. After the phase is changed to gaseous state by the heat transferred from the heating element 140, it preferably flows to the heat dissipation plate part 203 of the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) as a whole through the third refrigerant flow path 230 and performs heat dissipation.

[0323] Hereinafter, a circulation phenomenon in which the liquid-phase refrigerant pressed into the end portion 201 side changes phase into gas-phase refrigerant and then diffuses to the heat sink portion 203 side, and then changes phase from the gas-phase refrigerant on the heat sink portion 203 side into liquid-phase refrigerant and then returns to the refrigerant pressed into the end portion 201 side is defined as one cycle, and the time required to realize one cycle is defined as the "gas-liquid circulation time".

[0324] According to the active heat dissipation mechanism 200 of one embodiment of the present invention described above and the multiple modified examples 200T-1, 200T-2, 200T-3, 200T-4, 200T-5 described later and the active heat dissipation mechanism 1200 of another embodiment of the present invention described later, the first refrigerant flow path 210, 1210, the second refrigerant flow path 220, 1220 and the third refrigerant flow path 230 and the multiple inclined guide members 215, 1215 and the multiple strength reinforcement parts 240, 1240 included should be understood that the specific shapes and configuration designs are designed to minimize the cycle time of the above-mentioned gas-liquid cycle to activate the gas-liquid circulation, thereby maximizing the heat dissipation performance.

[0325] 8. First to Fourth Modifications

[0326] Figure 22a and Figure 22d 1 and 2. It is a pre-bending expansion diagram of a heat conducting plate body of a first modified example 200T-1 and a fourth modified example 200T-4 of a partial structure in one embodiment of the present invention.

[0327] Reference Figures 22a to 22d The first modification example 200T-1 and the fourth modification example 200T-4 are shown to illustrate the differences from the embodiment 200 of the present invention as follows.

[0328] That is, Figure 22a As shown, in the first variant 200T-1 of the present invention, as shown in the above-mentioned embodiment 200, the multiple strength reinforcement parts 240 can be only provided in the multiple inclined guide members 215 that divide the second refrigerant flow path 220, and unlike the above-mentioned embodiment 200, a part 240' of the multiple strength reinforcement parts can be designed to be provided in an outer portion that is not related to the second refrigerant flow path 220 or the third refrigerant flow path 230 and the multiple inclined guide members 215.

[0329] And, refer to Figure 22b , the active heat dissipation mechanism 200T-2 of the second variant of the present invention is compared with the reference Figures 9 to 21 Compared with the active heat dissipation mechanism 200 of an embodiment of the present invention, the following differences can be found.

[0330] That is, Figure 22b As shown, in the second variant of the active heat dissipation mechanism 200T-2 of the present invention, only a plurality of inclined guide members 215 are formed on one of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side, and the other of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side can be formed with only a plurality of strength reinforcement portions 240 in the form of point reinforcement portions 242.

[0331] In this case, the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) of the active heat dissipation mechanism 200T-2 according to the second variant can be arranged in the refrigerant flow space 205 after the bending process S20, so that the front end faces of multiple joints and the front end faces of multiple inclined guide members 215 are almost in contact with each other or in surface contact.

[0332] In more detail, according to the active heat dissipation mechanism 200T-2 of the second variant, in one of the heat transfer plates 200-1 on the left and right sides of the first refrigerant flow path 210 that performs the function equivalent to the refrigerant summary flow path, the multiple second refrigerant flow paths 220 defined between the above-mentioned multiple inclined guide members 215 are formed inclined toward the end portions in the corresponding width direction, and in the other 200-1, multiple point reinforcement portions 242 can be provided so that the end faces of the multiple inclined guide members 215 that form the multiple second refrigerant flow paths 220 after the bending process S20 described later are opposite to each other.

[0333] In this case, there is no need to provide a separate strength reinforcing portion 240 on the other side heat transfer plate 200 - 2 , and it is understood that the plurality of inclined guide members 215 provided with the second refrigerant flow path 220 also perform the function of the strength reinforcing portion 240 .

[0334] That is, in the case of the embodiment 200 of the present invention described above, the plurality of strength reinforcement portions 240 are not distinguished between the left side heat conducting plate 200-1 corresponding to the heat conducting plate body (the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) and the right side heat conducting plate 200-2, but are provided in a mixed manner in the form of a plurality of line reinforcement portions 241 and a plurality of point reinforcement portions 242. Figure 22b In the second variant of the active heat dissipation mechanism 200T-2 of the present invention, different strength reinforcement elements are respectively provided on the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2), which is equivalent to the left side, and the other side heat conduction plate 200-2, which is equivalent to the right side.

[0335] In this case, the surface portion of the heat transfer plate 200-2 on the other side provided with multiple inclined guide members 215 is located at the lower part in the direction of gravity, which is conducive to the smooth flow guidance of the liquid-phase refrigerant. Therefore, preferably, when it is set on the heat dissipation shell body 110, it is located on the lower side relative to the gravity direction, and the surface portion of the heat transfer plate 200-1 on one side with multiple point reinforcement parts 242 is conducive to the smooth flow of the gas-phase refrigerant. When it is set on the heat dissipation shell body 110, it is preferably located on the relatively upper side relative to the gravity direction.

[0336] In addition, refer to Figure 22c and Figure 22d According to the active heat dissipation mechanism of the third variant 200T-3 and the fourth variant 200T-4, after the bending process S20 is performed on the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 without distinguishing the heat conducting plate main body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2), multiple point reinforcement parts 242 can be formed as multiple strength reinforcement parts 240 for welding to each other.

[0337] In this case, the multiple point reinforcement portions 242 can be formed to include a first refrigerant flow path 210 like the active heat dissipation mechanism 200 according to an embodiment of the present invention, or can be formed to have a circular horizontal cross-section as shown in the third variant 200T-3, or can be formed to have a hexagonal horizontal cross-section as shown in the fourth variant 200T-4.

[0338] In particular, compared with the active heat dissipation mechanism 200 according to an embodiment of the present invention described above, the third variant 200T-3 and the fourth variant 200T-4 are designs that only include the third refrigerant flow path 230 but do not include the inclined second refrigerant flow path 220, thereby having the advantage of allowing liquid-phase refrigerant and gas-phase refrigerant to flow evenly and easily throughout the entire range.

[0339] Here, as described above, the mutual joining of the plurality of point reinforcement portions 242 by welding (refer to the joining process S40 described later) provides the advantage of increasing the rigidity of the entire heat conducting plate body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) after the bending process S20.

[0340] However, as described above, the active heat dissipation mechanism 200 and its variations 200T-1, 200T-2, 200T-3, and 200T-4 according to an embodiment of the present invention have a core structure that is filled with refrigerant and improves the heat dissipation performance through the phase change of the refrigerant. In this regard, the internal structure design of the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) also needs to be optimally adapted to its installation position or gravity and the phase change of the refrigerant.

[0341] 9. Fifth and Sixth Modifications

[0342] Figure 23 It shows that the composite Figures 22a to 22d The expanded view of the heat conducting plate body of the fifth modified example 200T-5 of the multiple modified examples, Figure 24 It is a development view showing a heat transfer plate main body according to a sixth modification.

[0343] Reference Figure 23The press-in portion 150 formed on the back side of the heat dissipation housing body 110 is based on the groove structure 170, and the closer it is to the outer end (one end) in the left and right width directions, the more it forms an upwardly inclined "V" shape. At this point, in an embodiment 200 of the present invention and its modified examples 200T-1, 200T-2, 200T-3, and 200T-4, when the press-in end portion 201 is fixed to the press-in portion 150, the "upper side (Upper Part)" and "lower side (Lower Part)" areas can be relatively distinguished.

[0344] This division of the upper and lower areas is also the same when the heat conducting plate bodies (the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 ) are arranged vertically along the gravity direction (ie, the up-down direction).

[0345] The heat generated from the heating element 140 is preferentially transferred to the side of the first refrigerant flow path 210 where the absorber 300 is provided. Most of the refrigerant stored on the side of the first refrigerant flow path 210 where the absorber 300 is provided is in a liquid-phase refrigerant state. After being phase-changed into a gas-phase refrigerant by the heat transferred from the heating element 140, it is preferably performed heat dissipation by heat exchange with the external air (outside air) while flowing as a whole to the side of the heat dissipation plate portion 203 including the third refrigerant flow path 230.

[0346] Here, the volume of refrigerant flow space 205 occupied by the refrigerant during the phase change to the gaseous phase can only be relatively small compared to the volume of the liquid-phase refrigerant. Therefore, the liquid-phase refrigerant level is located in the aforementioned lower region. On the side of first refrigerant flow path 210 corresponding to the upper side of the liquid-phase refrigerant level, absorber 300 can absorb the liquid-phase refrigerant through capillary forces and move it upward. Therefore, the liquid level of first refrigerant flow path 210 is formed between its upper and lower ends, and should be understood as being located relatively close to the lower side in the direction of gravity within refrigerant flow space 205.

[0347] However, in this case, when the first refrigerant flow path 210 is arranged to be long in the vertical direction (gravity direction), there is also a problem that the upward dispersion by the absorber 300 is also limited.

[0348] In order to overcome the limitations of the above-mentioned absorber 300, the active heat dissipation mechanism 200T-5 of the fifth variant of the present invention is arranged in a state where the press-in portion 150 is formed on the back side of the heat dissipation shell body 110. With the direction of gravity as a reference, the portion located in the relatively upper area can minimize as much as possible the flow of a large amount of liquid refrigerant that changes phase according to the heat exchange of the gas refrigerant directly downward while guiding the liquid refrigerant to flow relatively downward toward the first refrigerant flow path 210 or the upper area of the absorber 300.

[0349] Here, each of the plurality of inclined guides 215 may be formed with only the plurality of wire reinforcement parts 241 among the plurality of strength reinforcement parts 240 described above.

[0350] Also, preferably, the plurality of wire reinforcements 241 are formed to protrude further toward the refrigerant flow space 205 than the plurality of inclined guides 215 so as to be able to engage with each other in the refrigerant flow space 205 .

[0351] At this time, if Figure 23 As shown, the multiple line reinforcement portions 241 are formed with almost similar lengths or similar pattern forms with respect to the multiple inclined guide members 215, except for the different protrusion amounts toward the refrigerant flow space 205 side, and can be distinguished and named as multiple line pattern portions 241P, which can be understood as a structure that performs the same function as the above-mentioned multiple inclined guide members 215.

[0352] Therefore, a space between adjacent plurality of line pattern portions 241P may be understood as the second refrigerant flow path 220 , and a space between the plurality of line pattern portions 241P in the thickness direction may be understood as the third refrigerant flow path 230 .

[0353] However, the multiple inclined guide members 215 and the multiple line pattern portions 241P cannot be understood as being completely physically separated from each other. Instead, as shown in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the multiple inclined guide members 215 and the multiple line pattern portions 241P can be understood as having the same structure to the extent that they provide a main flow path for the liquid-phase refrigerant.

[0354] In addition, refer to Figure 23 Preferably, a refrigerant flow path that enables the gas-phase refrigerant that changes phase from liquid-phase refrigerant to flow smoothly is provided at a relatively lower portion, and only a plurality of point reinforcement portions 242 among the plurality of strength reinforcement portions 240 may be provided. In this case, as described above, in order to distinguish it from the active heat dissipation mechanism 200 according to an embodiment of the present invention, the plurality of point reinforcement portions 242 may be divided and named as dot pattern portions 242P.

[0355] Therefore, although the names of the plurality of dot pattern portions 242P are different, it should be understood that they are structures that perform the same functions as the plurality of dot reinforcement portions 242 described above.

[0356] However, in the active heat dissipation mechanism 200T-5 of the fifth variation of the present invention, the "lower region" where the plurality of dot pattern portions 242P are provided does not have a structure that performs the same function as the plurality of inclined guides 215 that guide the flow of liquid refrigerant. Instead, the plurality of line reinforcement portions 241 or the plurality of line pattern portions 241P may be arranged parallel to the longitudinal direction.

[0357] That is, when multiple wire reinforcement portions 241 or multiple wire pattern portions 241P are concentratedly arranged at a predetermined density or above in the same inclined form as the multiple inclined guides 215 in consideration of the surface tension of the liquid refrigerant, the amount of liquid refrigerant falling directly downward can be minimized.

[0358] As mentioned above, Figure 23 As shown, the active heat dissipation mechanism 200T-5 of the fifth variant of the present invention can be configured to arrange multiple line pattern portions 241P more concentratedly at a position corresponding to the relatively upper area, so that the maximum amount of liquid refrigerant that becomes liquid after condensation according to the heat exchange of the gas-phase refrigerant is guided to the upper area of the first refrigerant flow path 210 or the absorber 300, and multiple dot pattern portions 242P can be arranged more concentratedly at a position corresponding to the relatively lower area, for rapid diffusion and dispersed flow of the gas-phase refrigerant that changes phase by evaporation in the first refrigerant flow path 210.

[0359] In addition, in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention and the active heat dissipation mechanisms 200T-1, 200T-2, 200T-3, 200T-4, and 200T-5 according to the modified examples of the present invention, an embodiment is described in which the second refrigerant flow path 220 can be arranged in an inclined straight line form, or can be indirectly formed by a plurality of strength reinforcement parts 240 without directly forming the second refrigerant flow path 220. However, in the following active heat dissipation mechanism 200T-6 according to the sixth modified example, a technical feature is proposed in which the second refrigerant flow path 220 and the third refrigerant flow path 230 are formed with each of the strength reinforcement parts 240 arranged in the form of a midpoint reinforcement part of the plurality of strength reinforcement parts 240 as the center.

[0360] In more detail, Figure 24 As shown, the active heat dissipation mechanism 200T-6 of the sixth variant of the present invention may include a plurality of strength reinforcement portions 240 in the form of point reinforcement portions arranged at a uniform density in the heat dissipation plate portion 203 of the condensation area except for the press-in end portion 201 corresponding to the evaporation area.

[0361] A plurality of strength reinforcements 240 may be formed on the entirety of the one and other heat conducting plates 200A and 200B to protrude toward the refrigerant flow spaces 205 formed in the thickness directions of the one and other heat conducting plates 200A and 200B, respectively.

[0362] Here, multiple strength reinforcement parts 240 are arranged in the form of small circular dots. The strength reinforcement parts 240 formed in the condensation area can be formed relatively densely in the entire heat dissipation plate part 203. On the contrary, the strength reinforcement parts 240 formed in the heat dissipation plate part 203 adjacent to the evaporation area can be separated and set in a relatively low density manner.

[0363] As described above, the reason why the density of the strength reinforcing portion 240 is set differently depending on whether the distance is short or long based on the evaporation region is as follows.

[0364] First, a plurality of strength reinforcement portions 240 of the heat dissipation plate portion 203 serving as the condensation area are formed in a portion slightly separated from the evaporation area and are relatively densely formed over the entire condensation area. At this point, the second refrigerant flow path 220 and the third refrigerant flow path 230 described later are also tightly and densely formed, and can appropriately prevent shaking (flow) between the heat transfer plate 200A on one side and the heat transfer plate 200B on the other side caused by changes in internal pressure during gas-liquid circulation of the refrigerant (or during phase change). The plurality of strength reinforcement portions 240, the second refrigerant flow path 220, and the third refrigerant flow path 230 formed in the sheet metal process through the stamping process can enhance their own rigidity.

[0365] Secondly, the area corresponding to the heat sink 203 near the evaporation region primarily stores liquid refrigerant. If the heat sink 203 in the condensation region is tightly joined using multiple reinforcements 240, there is a concern that the joined areas may break as the refrigerant freezes due to the increased volume of the refrigerant. Therefore, slightly spaced linear reinforcements 241 are employed and joined to the heat sink 203 near the evaporation region (or the press-fit end 201), and the density of the point reinforcements 240 provided between them is reduced. This minimizes stress when the refrigerant freezes, while also allowing for some volume expansion and contraction.

[0366] In addition, the refrigerant flow space 205 may include: a second refrigerant flow path 220, which is formed in the form of a point reinforcement portion of the condensation portion and is sheet metal processed in a predetermined pattern around the strength reinforcement portion 240; and a third refrigerant flow path 230, which is formed between the second refrigerant flow path 220 and the strength reinforcement portion 240 and is sheet metal processed in a form that is less concave relative to the strength reinforcement portion 240.

[0367] Typically, since the thickness of the refrigerant flow space 205 of the second refrigerant flow path 220 is formed to be larger than the thickness in the third refrigerant flow path 230, when the gas-phase refrigerant is condensed into liquid-phase refrigerant through heat exchange in the heat dissipation plate portion 203 serving as the condensation area, it is used to disperse the liquid-phase refrigerant flowing downward in the direction of gravity due to surface tension or gravity, and guide the flow of the liquid-phase refrigerant, so that the liquid-phase refrigerant is collected on the side of the heat dissipation plate portion 203 close to the evaporation area.

[0368] On the contrary, the thickness of the third refrigerant flow path 230 is smaller than the thickness of the second refrigerant flow path 220. At this point, if the liquid-phase refrigerant evaporates into the gas-phase refrigerant in the evaporation area, the evaporated gas-phase refrigerant can diffuse and disperse through the third refrigerant flow path 230 having a relatively narrow thickness and flow to the entire heat dissipation plate portion 203 serving as the condensation area, thereby promoting heat exchange.

[0369] The above-mentioned second refrigerant flow path 220 and the third refrigerant flow path 230 are mainly formed into a predetermined pattern shape with the strength reinforcement portion 240 tightly formed on the side of the heat dissipation plate portion 203 serving as the condensation area as the center. It should be noted that the side of the heat dissipation plate portion 203 close to the evaporation area mainly involves only the storage and evaporation of liquid-phase refrigerant (phase change to gas-phase refrigerant). Therefore, at this point, the second refrigerant flow path 220 and the third refrigerant flow path 230 are not separately distinguished and formed.

[0370] In addition, if Figure 24 As shown, when the pattern shape of the second refrigerant flow paths 220 is formed into a polygon (eg, a honeycomb hexagon or other pentagon), at least one side of adjacent second refrigerant flow paths 220 may be connected to be shared with each other.

[0371] 10. Comparison between Comparative Examples and the Present Invention

[0372] Figure 25 The active heat dissipation mechanism 200D ( Figure 25 (a)) and the active heat dissipation mechanism 200 ( Figure 25 (b) is a cross-sectional view of the setting state of the press-fit portion.

[0373] 10-1. SUS material and bending forming

[0374] In order to smoothly compare the active heat dissipation mechanism 200 of an embodiment of the present invention with the active heat dissipation mechanism 200D of a comparative example, Figure 25 The active heat dissipation mechanism 200D of the comparative example shown in FIG. 1 shows that it is assumed that the press-fit end portion 201 of the active heat dissipation mechanism 200 according to an embodiment of the present invention is inserted into and fixed to the press-fit portion 150 having the same specifications (ie, shape and size).

[0375] First, in order to refer to Figure 25 (b) The active heat dissipation mechanism 200 of an embodiment of the present invention is similar to the reference Figure 25 The active heat dissipation mechanism 200D of the comparative example (a) is compared in detail, and the specifications of the active heat dissipation mechanism 200D are explained in detail based on the comparative example.

[0376] The active heat dissipation mechanism 200D of the comparative example is manufactured by bonding two panel members made of aluminum (Al) having very excellent thermal conductivity through a predetermined bonding process, and assumes that the refrigerant is filled in the refrigerant flow space 205 and flows through a phase change.

[0377] As is known to all, the thermal conductivity of aluminum (Al) is 230W / mk and the specific gravity is 2.7. In the present invention, the thickness of one panel component is 0.5T (hereinafter, "T" represents "mm" in length unit), and the sum of the two panel components is 1T, which means that the thickness of the press-fit portion 150 inserted close to the heating element 140 serving as the heat dissipation target is 1T.

[0378] More specifically, it can be assumed that the one-side heat transfer plate 200D- 1 and the other-side heat transfer plate 200D- 2 of the active heat dissipation mechanism 200D of the comparative example are manufactured under conditions defined by the limit thickness described later.

[0379] For example, as shown in (a) of FIG22 , the heat conducting plate 200D-1 on one side and the heat conducting plate 200D-2 on the other side of the active heat dissipation mechanism 200D of the comparative example can be additionally manufactured to a maximum thickness of 0.5T that cannot be manufactured any thinner, taking into account the aluminum material and based on the strength design requirements and safety design requirements of the product.

[0380] That is, the internal width of the pair of groove ribs 150a and 150b forming the press-fit portion 150 is formed to be twice IT, which is the sum of the thicknesses of the heat conduction plate 200D-1 on one side and the heat conduction plate 200D-2 on the other side of the active heat dissipation mechanism 200D in the comparative example, 0.5T. The press-fit portion 150 having the same shape and size is also applied to the active heat dissipation mechanism 200 of an embodiment of the present invention.

[0381] Here, as one of the factors that determine the above-mentioned "limit thickness", the strength design and safety design of products made of aluminum material are required to have the strength to stably maintain the refrigerant filled inside, and the elongation and processability of pure aluminum material itself are relatively better than those of SUS material, but do not meet the above-mentioned strength. Therefore, in order to have sufficient strength, the aluminum metal plate parts need to undergo additional processes such as heat treatment, cold working or alloying.

[0382] In particular, as shown in the comparative example of active heat dissipation mechanism 200D, when aluminum is used as the main component material of the heat conducting plate body, although it has the advantage of excellent thermal conductivity, due to the above-mentioned high cost, in addition to the problem of increased costs, it also has the following multiple disadvantages.

[0383] First, in the comparative example active heat dissipation mechanism 200D, which utilizes aluminum heat conducting plate bodies 200D-1 and 200D-2, the refrigerant options are very limited. Specifically, when aluminum comes into contact with water, hydrogen is generated, triggering a chemical reaction that converts the aluminum oxide. In particular, the generated hydrogen can lead to an increase in the internal pressure of the refrigerant flow space 205.

[0384] Second, as described above, the increase in the internal pressure of the refrigerant flow space 205 of the active heat dissipation mechanism 200D of the comparative example composed of the heat conduction plate main body 200D-1 and 200D-2 made of aluminum material not only increases the concern of damage to the completed active heat dissipation mechanism 200D itself, but also causes warping between the heat conduction plate 200D-1 on one side and the heat conduction plate 200D-2 on the other side, thereby causing shaking during the gas-liquid circulation of the refrigerant, and also causes problems such as obstruction of smooth gas-liquid circulation. In order to prevent this situation, it is necessary to form strengthening elements such as the strength reinforcement part 240 of the multiple embodiments 200 of the present invention mentioned above during the stamping process S10.

[0385] Third, due to the first and second issues mentioned above, the refrigerant that can be used in the active heat dissipation mechanism 200D of the aluminum comparative example is limited to special refrigerants such as Honeywell refrigerants and CFCs (Freon). Recently, many countries are actively studying restrictions on the use of refrigerants to prevent environmental pollution, which conflicts with the international trend of preventing environmental pollution. Specifically, when producing a product such as the active heat dissipation mechanism 200D of the aluminum comparative example, it may be impossible to market and use the product in every country with such usage regulations.

[0386] Fourth, as mentioned above, when aluminum heat conducting plate bodies 200D-1 and 200D-2 are set to a maximum thickness, there are design limitations in positioning the refrigerant close to the heating element. Specifically, pure aluminum has a relatively good elongation, but as mentioned above, to prevent warping and stably retain the refrigerant within, the strength and safety design requirements of the product are met. While heat treatment, cold working, or alloying of the aluminum sheet metal components increases their strength, this, in turn, reduces their workability during the stamping process. Therefore, while maintaining a uniform thickness of the refrigerant flow space 205, the stamping process for forming the multiple strength reinforcements 240 provided in accordance with embodiment 200 of the present invention to prevent refrigerant oscillation during gas-liquid circulation is impossible.

[0387] Fifth, if a maximum thickness is set for the heat transfer plate 200D-1 and the heat transfer plate 200D-2 as described above, then, as shown in the active heat dissipation mechanism 200 of one embodiment of the present invention, there is actually the following problem: the closest contact point of the refrigerant flow space 205 corresponding to the first refrigerant flow path 210, which collects the liquid refrigerant closest to the heating element 140, is located outside the press-fit portion 150. This problem increases the distance between the heating element 140 and the liquid refrigerant, thereby diluting the advantages of aluminum's excellent thermal conductivity.

[0388] Therefore, in the active heat dissipation mechanism 200D of the comparative example, the metal plate members constituting the heat transfer plate bodies 200D-1 and 200D-2 are made of aluminum, and the description is limited to the case where the metal plate members are made of an aluminum alloy having the predetermined tensile strength or higher.

[0389] As described above, aluminum materials including aluminum alloys have a very excellent thermal conductivity of 230 and a small specific gravity, so aluminum is one of the most commonly used thermal conductive metal materials for heat dissipation elements.

[0390] However, as has been explained, although aluminum has excellent thermal conductivity and specific gravity, it is relatively expensive in terms of cost and has problems such as limited types of refrigerants that can be filled inside.

[0391] Therefore, the active heat dissipation mechanism 200 of one embodiment of the present invention adopts a material with lower cost than aluminum, namely SUS (stainless steel), and changes the design to have heat dissipation performance similar to that of aluminum as its core structural element.

[0392] In more detail, Figure 25 As shown in (a), the active heat dissipation mechanism 200D of the comparative example includes two components, forming a refrigerant flow space 205 filled with and flowing refrigerant therein, and can include flat heat conduction plate bodies 200D-1 and 200D-2 made of aluminum material.

[0393] This is different from the active heat dissipation mechanism 200 of an embodiment of the present invention in that the active heat dissipation mechanism 200 is bent into a single component to form a plurality of refrigerant flow paths 210 , 220 , 230 corresponding to the refrigerant flow space 205 .

[0394] However, even in the case where the heat transfer plate main bodies 200D-1 and 200D-2 are formed by joining two (two) parts as shown in the active heat dissipation mechanism 200D of the comparative example, as shown in the active heat dissipation mechanism 200 of an embodiment of the present invention, while forming the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230, within the limit of setting the absorber 300 at the position equivalent to the first refrigerant flow path 210, the operation of welding the two heat transfer plate main bodies 200D-1 and 200D-2 to each other is also the same.

[0395] That is, in the active heat dissipation mechanism 200D of the comparative example, the two heat conducting plate bodies 200D-1 and 200D-2 may be coupled to each other in a manner facing each other, and the refrigerant flow space 205 may be formed therein.

[0396] Here, the active heat dissipation mechanism 200 of an embodiment of the present invention may differ from the active heat dissipation mechanism 200D of the comparative example including two components in that the active heat dissipation mechanism 200 is provided as a single component and is bent to be symmetrical in the left-right direction.

[0397] Here, in the case of the active heat dissipation mechanism 200D of the comparative example, unlike the active heat dissipation mechanism 200 of an embodiment of the present invention, the reason why the two separated components (heat conduction plate bodies 200D-1, 200D-2) are joined in a predetermined joining manner to form a refrigerant flow space 205 inside is because, in the case of aluminum material, during the metal processing process of being processed into alloy aluminum in order to ensure the predetermined strength, its elongation is reduced, making it difficult to perform precise additional processing.

[0398] For example, as shown in an embodiment 200 of the present invention, when the heat conducting plate bodies 200D-1 and 200D-2 made of aluminum are bent in the bending step S20, the curvature radius of the portion forming the press-fit end portion 201 can only be formed to be relatively large due to its very poor workability.

[0399] This increase in the radius of curvature of the pressed-in end portion 201 not only requires increasing the groove size of the pressed-in portion 150 (i.e., the size between a pair of groove ribs 150a, 150b) manufactured for setting on the back side of the heat dissipation housing body 110 as the heat dissipation object, but also requires increasing the groove size of the pressed-in portion 150 (i.e., the size between a pair of groove ribs 150a, 150b). As a result, it is necessary to increase the size of the heat conduction plate bodies 200D-1 and 200D-2 themselves, resulting in a problem in which the number of settings per unit area on the back side of the heat dissipation housing body 110 is also greatly reduced.

[0400] In more detail, generally, the higher the purity, the more the elongation of metal plate parts made of aluminum material is above 40%, which is greater than the elongation of 35% of metal plate parts made of SUS material (refer to JIS standard SUS304, SUS316, SUS321, SUS410), so the processability is also expected to be good.

[0401] However, as described above, in accordance with the strength design requirements and safety design requirements of the product, when aluminum sheet metal parts are manufactured by heat treatment, cold working, or alloying, the elongation decreases, and thus the workability is also poor.

[0402] Here, the low processability of the metal plate component made of aluminum material manufactured by the above-mentioned heat treatment, cold working or alloying means that due to the above-mentioned limited thickness, there is actually difficulty in reducing the separation distance between the inner side surface of the pressing part 150 that receives heat from the heating element 140 and the refrigerant flow space 205 for realizing the evaporation of the liquid refrigerant (a separate additional processing step is required), and the reinforcing elements such as the heat transfer plate 200D-1 on one side generated during the gas-liquid circulation of the refrigerant and the multiple strength reinforcement parts 240 in an embodiment 200 of the present invention for preventing the shaking phenomenon of the heat transfer plate 200D-2 on the other side are formed by a stamping process (poor processability).

[0403] That is, refer to Figure 25 (a) Observe the active heat dissipation mechanism 200D of the comparative example. Assuming that it is difficult to perform further additional processing due to the thickness limit caused by the design requirement value, when the length of the width between the pair of groove ribs 150a and 150b constituting the press-in portion 150 is designed to match twice the above-mentioned limit thickness, the heating element 140 and the liquid-phase refrigerant are actually closest to the refrigerant flow space 205, and there is a distance that is further outward than the outer end of the press-in portion 150 (the outer end of the pair of groove ribs 150a and 150b). Therefore, there will be a difference in the heat transfer speed and heat transfer amount corresponding to it.

[0404] For example, Figure 25 As shown in (a), when the pair of groove ribs 150a and 150b of the press-fit portion 150 are formed in the same shape and size and the material of the metal plate member constituting the heat transfer plate body 200D-1 and 200D-2 inside 150c is aluminum, when at least a part of the refrigerant flow space 205 corresponding to the first refrigerant flow path is not located inside the groove ribs 150a and 150b of the press-fit portion 150, but is set at 1T which is twice the maximum thickness of 0.5T, as shown in Figure 25As shown in (b) of an active heat dissipation mechanism 200 of an embodiment of the present invention, the heat conduction plate body made of SUS material (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) can include a thickness of twice 0.15T inside 150c of a pair of groove ribs 150a and 150b of the pressing portion 150, and can be processed into a thickness that can accommodate a portion of the first refrigerant flow path 210.

[0405] In addition, if Figure 25 In the active heat dissipation mechanism 200D of the comparative example shown in (a), if the metal plate components constituting the heat conducting plate main body 200D-1, 200D-2 are manufactured with a limit thickness according to the design requirement value, then as the strength thereof increases, the processability decreases, and thus it is difficult to process the reinforcing elements corresponding to the plurality of strength reinforcing portions 240 through a stamping process. Therefore, there is a disadvantage in that other processing methods (for example, an etching process or a turning process) of other metal plate components are required to process the internal structure or reinforcing elements of the refrigerant flow space.

[0406] In contrast, Figure 25 In the case of embodiment 200 of the present invention shown in (b), the metal plate component made of SUS material has very good elongation itself and excellent processability. The internal structure of the refrigerant flow space 205 including the first refrigerant flow path 210 to the third refrigerant flow path 230 and multiple strength reinforcement parts 240 can be simultaneously formed only by a stamping process as a single process, and the contact parts of the multiple strength reinforcement parts 240 are welded together through a joining process, thereby preventing the shaking or expansion and contraction of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side during the gas-liquid circulation of the refrigerant, which has the advantage of preventing unnecessary consumption of energy required for evaporating the liquid refrigerant.

[0407] At the same time, in the case of the active heat dissipation mechanism 200D of the comparative example, as described above, the press-in end portion 201 is formed to have the material thickness (0.5T*2) of the two heat conducting plate main bodies 200D-1 and 200D-2 themselves. In terms of its poor workability, when it is simply combined with the press-in portion 150 by a press-fit method, the fixing force on the heat dissipation shell body 110 is inevitably weak. In order to ensure its fixing force, after the press-in end portion 201 is inserted and combined with the press-in portion 150, it is necessary to increase the combining force by welding. Therefore, there is a cumbersome problem in the operation process.

[0408] Furthermore, when the refrigerant flow space 205 is formed within the heat transfer plate bodies 200D-1 and 200D-2 made of aluminum, as described above, the types of refrigerants that can be filled in the refrigerant flow space 205 may be very limited. For example, when distilled water (water) is used as the refrigerant, it chemically reacts with the aluminum and cannot function as a refrigerant, thus necessitating the exclusion of distilled water from the refrigerant options.

[0409] The active heat dissipation mechanism 200 of one embodiment of the present invention proposes using stainless steel (SUS) material as the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2) to solve the various problems of the heat conduction plate bodies 200D-1 and 200D-2 of the active heat dissipation mechanism 200D of the comparative example using aluminum material mentioned above. When using aluminum material, various shape designs and characteristics can be ensured to ensure corresponding heat dissipation performance.

[0410] In more detail, Figure 25 As shown in (b), the active heat dissipation mechanism 200 of one embodiment of the present invention uses a heat conducting plate body (a heat conducting plate 200-1 on one side and a heat conducting plate 200-2 on the other side) made of a single material to bend and press the end portion 201 with an arbitrary reference line T as a reference through a bending step S20, thereby forming a predetermined curvature (for example, referring to Figure 15 and Figure 16 "R1" or "R2"), and at least a portion of the first refrigerant flow path 210 in the refrigerant flow space 205 can be formed in a manner that flows more inward than the front ends of a pair of groove ribs 150a, 150b constituting the pressing portion 150.

[0411] At this time, the material of the heat conducting plate body (the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 ) in an embodiment 200 of the present invention can be limited to a metal material having an elongation that satisfies the following conditions.

[0412] In more detail, as one of the conditions, assuming that the structure equivalent to the heat conducting plate main body is configured as a plate form of aluminum material similar to the RBFHP in the existing paper, when a pair of groove ribs 150a, 150b are inserted into the inside of the press-fit portion 150 formed on the back side of the heat dissipation housing main body 110 as the heat dissipation object with twice the thickness in a manner without space, the metal material of the heat conducting plate main body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) in one embodiment 200 of the present invention can be limited to a metal material having an elongation of less than 1 / 6 of the thickness of the heat conducting plate main body of the RBFHP in the above-mentioned existing paper that can be bent into the above-mentioned twice thickness.

[0413] For example, the thickness of the aluminum heat conducting plate main body 200D-1, 200D-2 of the active heat dissipation mechanism 200D of the comparative example or the RBFHP of the existing paper is as described above. When 0.5T is inserted into the press-in portion 150, twice the thickness (1T) is inserted. The thickness of the heat conducting plate main body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) in the active heat dissipation mechanism 200 of one embodiment of the present invention can be 0.15T, which is less than 1 / 6 of 1T.

[0414] Here, in the case of the active heat dissipation mechanism 200D of the comparative example, the refrigerant flow space 205 is composed of a one-side heat conduction plate 200D-1 and an other-side heat conduction plate 200D-2, and the respective thicknesses of the one-side heat conduction plate 200-1 and the other-side heat conduction plate 200-2 in the heat conduction plate body (one-side heat conduction plate 200-1 and the other-side heat conduction plate 200-2) in the active heat dissipation mechanism 200 of an embodiment of the present invention can be defined as less than 1 / 3 of 0.5T.

[0415] Furthermore, as described above, preferably, the metal material used for the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) in one embodiment 200 of the present invention has an elongation that allows it to bend so that at least a portion of the first refrigerant flow path 210 is inserted into the inner side of the front end of the pressing portion 150.

[0416] Furthermore, the metal material may be defined as having an elongation capable of forming a plurality of strength reinforcement portions 240 on the plurality of inclined guide members 215 during processing in the stamping step S10 .

[0417] Therefore, the elongation at this time is the same as that of the active heat dissipation mechanism 200D in the comparative example. After the metal material of the heat conducting plate main body 200D-1 and 200D-2 is made of aluminum, it is limited to the case of additional manufacturing (heat treatment, cold working or alloying) in a manner having a predetermined tensile strength or above.

[0418] Furthermore, the thermal conductivity of the metal material used for the heat conducting plate bodies (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) in one embodiment 200 of the present invention can be limited to less than 1 / 10 of the thermal conductivity of aluminum (approximately 230 W / mK). In practice, it is known that the thermal conductivity of the SUS material described below is approximately 20 W / mK, which is less than 1 / 10 of the thermal conductivity of aluminum.

[0419] 10-2. Advantages of using water as refrigerant

[0420] The material most suitable for meeting the aforementioned elongation and thermal conductivity comparison limitations is the SUS material described above. In the active heat dissipation mechanism 200 of one embodiment of the present invention, using SUS as the metal material for the heat conducting plate bodies (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) not only overcomes the aforementioned elongation and thermal conductivity limitations but also offers the advantage of being able to use distilled water as a refrigerant.

[0421] That is, the refrigerant filled in the refrigerant flow space 205 of the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) made of SUS material can be defined as a refrigerant that does not undergo chemical reaction as a metal material with the above-mentioned elongation, in addition to the refrigerant that chemically reacts with the aluminum plate.

[0422] A representative refrigerant that meets this definition is distilled water (water), as described above. When used as a refrigerant, distilled water offers advantages over other refrigerants in terms of cost, heat of vaporization, and surface tension. In particular, distilled water, characterized by high latent and sensible heat, can achieve sufficient heat transfer capabilities even when the pressure-insertion end 201 is positioned relatively high relative to gravity. This ensures a variety of fixed designs for the pressure-insertion portion 201, regardless of the inclination of the second refrigerant flow path 220.

[0423] In more detail, the refrigerant filled in the refrigerant flow space 205 can be composed of distilled water (water), which will not cause any chemical reaction when it comes into contact with the metal heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2), and can change phase from liquid to gas or from gas to liquid by virtue of the thermal conductivity of the heat conduction plate body (one side heat conduction plate 200-1 and the other side heat conduction plate 200-2) itself.

[0424] The “chemical reaction” in this case is a concept that also includes “corrosion” of water used as the refrigerant or additional generation of a substance that changes the internal pressure of the refrigerant flow space 205 .

[0425] However, it is an extremely exceptional case that no chemical reaction occurs at all during the contact between substances, especially after a long period of time. In this regard, the concept of "chemical reaction" here is as follows: it is preferably broadly interpreted as a reaction that affects the phase change conditions of water at least by changing the internal pressure of the refrigerant flow space 205.

[0426] The water constituting the refrigerant may include natural water, distilled water, or ultrapure water. However, when using water, natural water may contain organic and inorganic substances. Therefore, it is preferable to use distilled water purified by vaporization or ultrapure water from which organic and inorganic substances have been removed.

[0427] For reference, distilled water can be divided into single-distilled water, double-distilled water, and triple-distilled water according to the distillation process. The number of levels of distilled water is based on the classification of the purification process and is different from the purity level of water.

[0428] Single-distilled water refers to water that has been distilled only once and is called distilled water (DW). Double-distilled water refers to water obtained by distilling single-distilled water once more. Triple-distilled water refers to water obtained by distilling three times. Deionized water (DI Water) is usually obtained by removing ions from single-distilled water.

[0429] Ultrapure water is pure water that has been treated with advanced water purification methods such as reverse osmosis (RO), ion exchange resins, activated carbon filters, and sterilization to remove electrolytes, microorganisms, organic matter, and dissolved gases. It refers to water with a specific resistivity of 18 MΩ·cm or higher at 25°C, indicating that ions have been removed.

[0430] For reference, water having a specific resistance value at 25° C. in the range of 5 MΩ·cm to less than 18 MΩ·cm can be classified as pure water.

[0431] Here, as the refrigerant, not only ultrapure water but also pure water can be used. However, pure water with a resistivity of less than 18 MΩ·cm at 25°C, unlike ultrapure water, may contain trace amounts of electrolytes, microorganisms, organic matter and dissolved gases in the water. In a closed space, organic gases may be generated over time. Since the total dissolved solids (TDS) is above 0.028 ppm, it is preferred to use ultrapure water with a resistivity of 18 MΩ·cm or above at 25°C.

[0432] At the same time, when water is selected and used as the refrigerant, it can be inferred from the problem points of the active heat dissipation mechanism 200D in the comparative example that the metal material of the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) should be limited to a material that does not cause any chemical reaction when in contact with water.

[0433] Therefore, in the active heat dissipation mechanism 200 of one embodiment of the present invention, the metal material of the heat conducting plate bodies (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) is a metal material that does not chemically react with the water constituting the refrigerant, and can include SUS (stainless steel). Here, SUS is the standard name for stainless steel included in the JIS standard.

[0434] Here, as metals that do not react with water used as a refrigerant, platinum, gold, silver, iridium, tungsten, titanium, etc. can be considered, but as mentioned above, stainless steel (SUS) or copper, which has excellent processability and is inexpensive, is preferably used.

[0435] Furthermore, since the active heat dissipation mechanism 200 of an embodiment of the present invention has a greater elongation than the active heat dissipation mechanism 200D of the comparative example made of aluminum alloy or the RBFHP of the prior art, if the press-in end portion 201 is formed in a manner having an outer shape larger than the groove size of the press-in portion 150 and then inserted and coupled by a press-in insertion method in which the press-in portion 150 is forcibly inserted, there is an advantage that sufficient fixing force can be formed without the need for additional steps such as a separate welding step.

[0436] The use of the press-fit method of coupling the press-fit portion 150 of the press-fit end portion 201 as described above has the following advantage: it can prevent the absorbent body 300 made of fiber materials such as non-woven fabric from being damaged by welding heat during the additional welding process.

[0437] As described above, in one embodiment 200 of the present invention, the first refrigerant flow path 210 to the third refrigerant flow path 230 are filled with refrigerant, and phase change actively occurs and heat is dissipated by heat transferred from the heating element 140 provided inside the heat dissipation housing body 110, thereby maximizing the heat dissipation performance.

[0438] In particular, refer to Figure 25 Compared with the active heat dissipation mechanism 200D of the comparative example, in the case of an embodiment 200 of the present invention, at least a portion of the first refrigerant flow path 210 flows into the inner side of the groove formed by the pressing portion 150 (i.e., the inner side of the front end of the pressing portion 150). Since the refrigerant absorbed and captured by the absorber 300 of the first refrigerant flow path 210 can receive heat in a state closer to the heating element 140, the phase change in the evaporation area is more active, which has the advantage of ensuring heat dissipation performance second only to the case of using aluminum material.

[0439] 10-3. Hydrophobic coating materials

[0440] However, when distilled water is used as the refrigerant filling the refrigerant flow space 205 , the very high surface tension of water may cause a problem of reduced fluidity due to the slightly thin inner surface of the refrigerant flow space 205 .

[0441] In order to solve the problem of reduced fluidity of the liquid refrigerant, the active heat dissipation mechanism 200 of an embodiment of the present invention can solve this problem by coating a hydrophobic coating material on the portion corresponding to the inner side surface of the heat conduction plate body (the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side) that forms the refrigerant flow space.

[0442] In the case of the first refrigerant flow path 210, a general flow path is provided regardless of the state of the filled refrigerant, and it is a flow path in which the liquid-phase refrigerant is mainly absorbed by the absorber 300. At this point, there is no big problem, but the second refrigerant flow path 220 and the third refrigerant flow path 230 provide a flow path for the liquid-phase refrigerant to flow along the surface, and a coating layer using a hydrophobic coating material is formed on the inner side of the heat transfer plate body (one side heat transfer plate 200-1 and the other side heat transfer plate 200-2) forming the refrigerant flow space 205. This is to ensure smoother fluidity of the liquid-phase refrigerant.

[0443] However, the coating layer does not necessarily need to be formed using a hydrophobic coating material, and a hydrophilic coating material may also be applied depending on the type of refrigerant or the characteristics of the flow path.

[0444] 11. Another embodiment of the present invention (joining manufacturing) and the heat dissipation housing main body configuration structure

[0445] Figure 26 It is along Figure 4b The cross-sectional view taken along line AA and its partial enlarged view, Figure 27 It is along Figure 4b The sectional stereogram and its partial enlarged diagram taken along the AA line of Figure 28 It is along Figure 4b The sectional stereogram and its partial enlarged diagram taken along the BB line of Figure 29 is a perspective view showing an active heat dissipation mechanism according to another embodiment of the present invention. Figure 30 yes Figure 29 Exploded perspective diagram, Figure 31 yes Figure 29 Cutaway stereogram ( Figure 29 (a)), its partial enlarged view ( Figure 29 (b)) and the cross-sectional view of the part ( Figure 29 (c)), Figure 32 1 is a cross-sectional view showing a coupled state of a press-fit portion of an active heat dissipation mechanism according to another embodiment of the present invention.

[0446] So far, reference Figure 4aand Figure 5a 、 Figures 7 to 24 The active heat dissipation mechanism 200 of an embodiment of the present invention and its modified examples 200T-1, 200T-2, 200T-3, 200T-4, 200T-5, and 200T-6 are described based on the premise that the first refrigerant flow path 210 is formed by bending a single metal plate component or using a bending step S20.

[0447] However, the manufacturing method of the active heat dissipation mechanism of the present invention is not limited to the embodiment 200 of the bending step S20. Figure 4b 、 Figure 5b and Figures 26 to 32 As shown, an active heat dissipation mechanism 1200 of another embodiment of the present invention is proposed and described, which forms a refrigerant flow space 1205 including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 (including a third refrigerant flow path according to the embodiment) by joining two separate metal plate parts in a joining manner.

[0448] In another embodiment of the active heat dissipation mechanism 1200 of the present invention, Figures 26 to 32 As shown, the heat conducting plate bodies 1200-1 and 1200-2 can be formed by joining two separate metal plate members (similar to the joining step S40 described below) to form the refrigerant flow space 1205. This differs from the manufacturing method of the active heat dissipation mechanism 200 of an embodiment of the present invention in that the refrigerant flow space 205 is formed by bending a single metal plate member and then joining the single metal plate members.

[0449] The active heat dissipation mechanism 1200 of another embodiment of the present invention as described above can be used with reference to Figure 4a and Figure 5a The first embodiment of the heat dissipation housing body 110 is combined with the back surface of the heat dissipation housing body 110, but the premise is that Figure 4b and Figure 5b As shown, the back surface of the heat dissipation housing body 110 implemented by the second embodiment is combined and provided with a press-in portion 150 having a different shape including a press-in end portion 201 side suitable for the difference in the above-mentioned manufacturing method.

[0450] Reference Figures 26 to 29 A plurality of press-in portions 150 are arranged long in the up-down direction (i.e., along the vertical direction) on the back portion of the heat dissipation housing body 110 implemented using the second setting example, and the active heat dissipation mechanism 1200 of another embodiment of the present invention can be formed to be spaced apart from each other in the left and right width directions.

[0451] As described above, in the case where the active heat dissipation mechanism 1200 of another embodiment of the present invention is provided on the back portion of the heat dissipation housing body 110 implemented using the second setting example, compared with the active heat dissipation mechanism 200 with a "V" shape pattern in one embodiment of the present invention, the flow resistance of the external air (external air) in the vertical direction up and down is minimized, thereby making the inflow of the external air smooth, and having the advantage of minimizing the flow resistance to the rising airflow by the heat released from each active heat dissipation mechanism 1200.

[0452] Furthermore, on the back side of the heat dissipation housing body 110 implemented using the second setting example, a single press-in portion 150 can be arranged longer in the up-down direction, but considering the limitation of the dispersion force or rising force of the liquid-phase refrigerant in the first refrigerant flow path 1210, it can be arranged in a manner of being divided into two or three areas in the upper and lower parts. In this case, a plurality of fixed heat dissipation fins 200F can be provided in the lower end area which is a part where less heat dissipation is required.

[0453] The active heat dissipation mechanism 1200 of another embodiment of the present invention, which is arranged on the back side of the heat dissipation shell body 110 realized by the second setting example as described above, can be manufactured through the bonding process S40 and can include a side heat conduction plate 1200-1 forming one side surface in the thickness direction of the refrigerant flow space 1205 and another side heat conduction plate 1200-2 forming the other side surface in the thickness direction of the refrigerant flow space 1205 after bonding.

[0454] Here, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 may be formed symmetrically with respect to the joint surface of the one side heat conduction plate 1200 - 1 and the other side heat conduction plate 1200 - 2 .

[0455] However, it is not limited to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 being symmetrically formed on one side of the heat conducting plate 1200-1 and the other side of the heat conducting plate 1200-2, and it is not excluded that Figure 22a and Figure 22b The multiple modified examples 200T-1, 200T-2, 200T-3, 200T-4, 200T-5, and 200T-6 of the active heat dissipation mechanism 200 according to an embodiment of the present invention are asymmetrically formed.

[0456] In addition, in the active heat dissipation mechanism 1200 of another embodiment of the present invention, the first refrigerant flow path 1210 serves as a portion for storing and retaining the liquid-phase refrigerant in the refrigerant filled in the refrigerant flow space 1205, and the upper and lower ends are arranged vertically along the direction of gravity, and the liquid level of the liquid-phase refrigerant is at least located near the lower end of the upper and lower ends of the first refrigerant flow path 1210.

[0457] The bonding surface of the one side heat conducting plate 1200-1 and the other side heat conducting plate 1200-2 can be defined as an edge end portion including a press-fit end portion 1201 corresponding to the evaporation region and a heat dissipation plate portion 1203 corresponding to the condensation region as a bonding area.

[0458] That is, in the case of the active heat dissipation mechanism 200 of one embodiment of the present invention, the portion joined by the joining process S40 described later is the edge end of the heat dissipation plate portion 203 excluding the press-fit end 201 side of the portion formed by the bending process S20. It should be noted that this is different from a part of the joining portion of the active heat dissipation mechanism 1200 of another embodiment of the present invention in which two separate metal plate parts are combined and sealed.

[0459] In more detail, in the active heat dissipation mechanism 1200 of another embodiment of the present invention, the heat conducting plate bodies 1200-1 and 1200-2 are connected to the edge ends of the heat conducting plate 1200-1 on one side and the heat conducting plate 1200-2 on the other side, and one of the widthwise end and the other end of the edge ends (with Figure 25 As a reference, the first refrigerant flow path 1210 is formed inside (equivalent to one end portion as the left end portion), and a press-in end portion 1201 combined with the press-in portion 150 formed on the back side of the heat dissipation shell body 110 as the heat dissipation object can be formed outside one of the one end portion and the other end portion (one end portion) in the width direction of the edge end.

[0460] Furthermore, the heat conducting plate bodies 1200-1 and 1200-2 are formed by joining the edge ends of the heat conducting plate 1200-1 on one side and the heat conducting plate 1200-2 on the other side, and the other end (excluding the press-fit end 1201 where the first refrigerant flow path 1210 is formed) of the width direction of the edge ends and the other end (excluding the press-fit end 1201 where the first refrigerant flow path 1210 is formed) is connected. Figure 30 As a reference, the other end portion as the right end portion is equivalent to the above-mentioned press-in end portion 1201) and the second refrigerant flow path 1220 is formed inside. A heat dissipation plate portion 1203 for heat exchange with the external air can be formed outside one end portion in the width direction of the edge end portion and the other end portion (the other end portion) of the other end portion.

[0461] In addition, if Figure 4b and Figure 5b As shown, the active heat dissipation mechanism 1200 of another embodiment of the present invention is provided on a press-fit portion 150 that is arranged vertically and elongated on the back side of the heat dissipation housing body 110. Therefore, the press-fit end portion 1201 corresponding to the front end portion and the outer end portion of the heat dissipation plate portion 1203 corresponding to the rear end portion can be parallel to each other.

[0462] Therefore, the technical feature mentioned in the description of the active heat dissipation mechanism 200 of one embodiment of the present invention, such as "among the multiple inclined guide members 215, the first refrigerant flow path 210 is located on the lower side of the gravity direction than the second refrigerant flow path 220" can have greater significance in limiting the inclination direction of the second refrigerant flow path 1220 in the active heat dissipation mechanism 1200 of another embodiment of the present invention.

[0463] That is, the first refrigerant flow path 1210 is located on the lower side of the second refrigerant flow path 1220 along the direction of gravity, which means that the parts of one end and the other end of the second refrigerant flow path 1220 corresponding to the outer end side of the heat dissipation plate portion 1203 are inclined and formed in a manner that is higher than the part corresponding to the side of the press-in end 1201 having the first refrigerant flow path 1210 based on the direction of gravity.

[0464] At the same time, if Figure 29 and Figure 30 As shown, the active heat dissipation mechanism 1200 of another embodiment of the present invention may further include: an auxiliary absorber 301 for improving the absorption rate of the liquid refrigerant of the absorber 300 .

[0465] For example, antenna devices that recently apply Massive MIMO (Massive Multiple Input Multiple Output) technology are generally manufactured to be longer in the vertical direction than in the width direction. In order to effectively dissipate heat from a plurality of heating elements 140 spaced apart from each other in the vertical direction using a minimum number of active heat dissipation mechanisms 1200, the active heat dissipation mechanisms 1200 should be manufactured to be as long as possible in the vertical direction. Figure 4b and Figure 5b As shown in the antenna device 100 using the active heat dissipation mechanism 1200 according to another embodiment of the present invention, a portion of the upper end of the active heat dissipation mechanism 1200 can extend upward longer to cover the upper end of the heat dissipation housing body 110.

[0466] However, when the heat transfer plate bodies 1200-1 and 1200-2 are formed longer along one side (for example, in the direction of gravity), the length of the first refrigerant flow path 1210 in the direction of gravity can only be lengthened. It is difficult to draw out and disperse sufficient liquid-phase refrigerant from the lower side in the direction of gravity to the upper end part using only the absorption capacity of the absorber 300 itself to absorb the liquid-phase refrigerant. Moreover, since the absorption rate of the liquid-phase refrigerant along the direction of gravity is different, the heat dissipation performance may also be uneven depending on the position.

[0467] Here, the auxiliary absorber 301, as shown in the active heat dissipation mechanism 200 according to one embodiment of the present invention described above, in addition to performing the basic function of increasing the absorption rate of the absorber 300 itself, further, as shown in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, when the active heat dissipation mechanism 1200 extends further upward than the upper end of the heat dissipation shell body 110 to cover the upper end part of the heat dissipation shell body 110, the liquid-phase refrigerant condensed on the heat dissipation plate portion 1203 side corresponding to the upper side of the heat dissipation shell body 110 can be easily captured on the upper end side of the absorber 300 and absorbed.

[0468] That is, the auxiliary absorber 301 performs a function of easily guiding the liquid-phase refrigerant to be captured to the upper end portion side of the absorber 300 located on the upper side in the gravity direction among the absorbers 300 arranged longer in the longitudinal direction.

[0469] In more detail, preferably, the liquid-phase refrigerant condensed and dropped at the heat sink portion 1203 located on the upper side in the gravity direction is uniformly supplied to the first refrigerant flow path 1210 side along the plurality of second refrigerant flow paths 1220 formed between the plurality of inclined guides 1215 .

[0470] However, in the heat dissipation plate portion 1203, when a portion of the liquid-phase refrigerant condensed on the upper side in the direction of gravity has a very small volume before the surface tension is formed, there is a concern that the liquid-phase refrigerant may fall directly downward through the third refrigerant flow paths 1230 rather than the adjacent second refrigerant flow paths 1220. In this case, there is a problem that the liquid-phase refrigerant cannot be smoothly supplied to the absorber 300 located on the relatively upper side in the direction of gravity.

[0471] Here, since the auxiliary absorber 301 can absorb the condensed refrigerant directly falling from its upper portion and supply liquid-phase refrigerant to each corresponding portion of the absorber 300 , the auxiliary absorber 301 can perform the function of alleviating uneven supply of liquid-phase refrigerant to the absorber 300 .

[0472] That is, Figure 29 and Figure 30 As shown, the liquid refrigerant that condenses and falls from the heat sink portion 1203 located relatively above the gravity direction is captured and supplied to the upper end side of the absorber 300. By dispersing the liquid refrigerant from the position where the liquid refrigerant is supplied to the upper side in the gravity direction and lifting it upward, it can supplement the heat dissipation performance of the existing absorber 300 with a low absorption rate.

[0473] Furthermore, generally, as the high-temperature gas-phase refrigerant evaporated on the lower side in the gravity direction moves concentratedly to the upper side in the refrigerant flow space, it may be difficult to eliminate the heat at the upper end portion in the refrigerant flow space due to the lack of more sufficient condensation space (condensation area), and the auxiliary absorber 301 performs the function of continuously supplying a portion of the liquid-phase refrigerant flowing from the upper side to the lower side of the refrigerant flow space to the first refrigerant flow path 1210 side corresponding to the upper end portion side of the absorber 300, thereby enabling overall uniform heat dissipation.

[0474] In another embodiment of the active heat dissipation mechanism 1200 of the present invention, Figure 29 and Figure 30 As shown, the auxiliary absorber 301 may further include two absorbers 301-1 and 301-2, one at the relatively upper side and the other at the relatively lower side.

[0475] In more detail, the auxiliary absorber 301 may be placed in the auxiliary absorber installation portions 1261 and 1262 in which a portion of the second refrigerant flow path 1220 is deformed to have a wider width.

[0476] In the case where two auxiliary absorbent bodies 301 (see reference numerals 301-1 and 301-2) are provided, Figure 30 As shown, the auxiliary absorber installation portions 1261 and 1262 may be formed at two locations corresponding to respective locations of the auxiliary absorber 301 .

[0477] The auxiliary absorber 301 may include an upper auxiliary absorber 301 - 1 connected to the upper end of the absorber 300 , and a lower auxiliary absorber 301 - 2 connected to the middle of the absorber 300 .

[0478] In addition, the upper auxiliary absorber 301-1 and the lower auxiliary absorber 301-2 can be respectively provided with a pair of auxiliary absorbers 301-1A, 301-1B, 301-2A, 301-2B formed of non-woven fabric in the auxiliary absorber setting parts 1261 and 1262 respectively formed on one side heat conduction plate 1200-1 and the other side heat conduction plate 1200-2.

[0479] In addition, if Figure 30 As shown, a plurality of fixing ribs 1263 for stably fixing the auxiliary absorber 301 may be provided in the refrigerant flow space 1205 .

[0480] The plurality of fixing ribs 1263 are formed to cross the auxiliary absorber installation portions 1261 and 1262 in the width direction, and both ends are respectively joined to the widthwise outer ends of the auxiliary absorber installation portions 1261 and 1262 by welding.

[0481] Here, the auxiliary absorber setting parts 1261 and 1262 are processed and formed into a groove shape to further increase the thickness of the refrigerant flow space 1205 from the inner side surfaces of the one side heat conduction plate 1200-1 and the other side heat conduction plate 1200-2 to the outside, and a gap for inserting and placing the auxiliary absorber 301 can be provided between the auxiliary absorber setting parts 1261 and 1262 and the multiple fixed ribs 1263, and the auxiliary absorber 301 can be set through the gap.

[0482] The plurality of fixing ribs 1263 as described above can prevent the auxiliary absorber 301 from being separated in the thickness direction of the refrigerant flow space 1205 .

[0483] In addition, the active heat dissipation mechanism 1200 of another embodiment of the present invention is made by joining a heat conducting plate 1200-1 on one side and a heat conducting plate 1200-2 on the other side, which are formed by two metal plate members, in a state where the edge ends including the portion corresponding to the press-fit end 1201 are in surface contact with each other, and is made of SUS material with good elongation. In this regard, Figure 32 As shown, the plurality of press-in portions 150 formed on the back surface of the heat dissipation housing body 110 can be combined in a press-fit manner.

[0484] At this time, preferably, at least half of the portion including the edge end portion of the docking joint and corresponding to the first refrigerant flow path 1210 (or the absorber 300) is press-fitted in a manner that is located further inward than the outer ends of a pair of groove ribs 150a, 150b forming the press-fit portion 150.

[0485] As described above, the active heat dissipation mechanism 1200 of another embodiment of the present invention is made of SUS material with good elongation. At this point, even if the absorber 300 made of fiber materials such as non-woven fabrics with slightly poor heat resistance is arranged on the side of the first refrigerant flow path 1210, it has the advantage of being able to be firmly fixed to the back of the heat dissipation shell body 110 by a simple press-fit combination method even without using a welding process.

[0486] Furthermore, when the active heat dissipation mechanism 1200 of another embodiment of the present invention is combined with the active heat dissipation mechanism 1200 manufactured by the same bonding method, Figure 25 When compared with the active heat dissipation mechanism 200D of the comparative example shown in (b), even taking into account the same insertion thickness of the press-in portion 150, the first refrigerant flow path 1210 can be arranged close to the press-in portion 150 while ensuring that the first refrigerant flow path 1210 has a thickness of 0.7T, which is at least 1T (0.5T*2) minus 0.3T (0.15T*2). In fact, it can be expected that the heat dissipation performance can be improved by the phase change of the refrigerant in one embodiment of the present invention.

[0487] 12. Comparison of experimental data between comparative examples and the present invention

[0488] Figure 33 is a graph showing the temperature of the heating element 140 of the active heat dissipation mechanism 200D of the comparative example and the active heat dissipation mechanism 200 of an embodiment of the present invention ( Figure 33 (a)) and comparison chart ( Figure 33 (b)).

[0489] In order to verify the heat dissipation performance of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the applicant of the present invention respectively installed an active heat dissipation mechanism 200D of a comparative example and an active heat dissipation mechanism 200 according to an embodiment of the present invention on the back of the same heat dissipation housing body 110, with the same number or the same shape of the press-fit portions 150. After installing five heating elements 140 with an input power of 25W on the motherboard, the following can be done: Figure 33 As shown, the temperature result value of each heating element 140 is obtained.

[0490] Reference Figure 33 The temperature difference between the active heat dissipation mechanism 200D of the comparative example and the embodiment 200 of each of the five heating elements 140 is at least 0.2°C (referring to heating element 1) and at most 2.1°C (referring to heating element 4). It is known that the temperature measurement of the heating element of the active heat dissipation mechanism 200 of an embodiment of the present invention is lower.

[0491] The result of the relatively low temperature of the heat-generating element indicates that, on the contrary, the heat dissipation performance of the active heat dissipation mechanism 200 according to an embodiment of the present invention is better than that of the active heat dissipation mechanism 200D according to the comparative example.

[0492] Figure 34 This table shows the time it takes for two RBFHP products (Roll Bonding Fin, 292*115 and 310*90) in existing papers and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention to reach 50°C, 60°C, and 70°C, respectively. Figure 35 The graph is a comparison of the temperature of ordinary aluminum heat sinks (AL6063_REF) that do not use refrigerant, two specifications of RBFHP products (roll bonding fins (RollBonding Fin, 292*115 and 310*90)) estimated to be from the existing paper, and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention, according to the position of each heat source (heating element).

[0493] Used to obtain Figure 34The results of the experiment are as follows: After immersing two products of the existing paper in two shapes and specifications and a part of the prototype of the active heat dissipation mechanism 200 according to an embodiment of the present invention in a water tank corresponding to the same heat source at the same time, the temperature rise time of the part not in the water tank is obtained.

[0494] However, in order to confirm that the above result values do not differ due to the shape difference of the product itself, the RBFHP of the existing paper is used as two shapes, and the measurement is performed by manufacturing a prototype of the active heat dissipation mechanism 200 of an embodiment of the present invention in the same shape (size).

[0495] Reference Figure 34 The time required for two RBFHP products made of the same aluminum material in the existing paper that utilize the phase change of the refrigerant to reach a specific temperature is approximately faster than that of the product with a product shape in which the length direction is larger than the width (Roll Bonding Fin, 310*90) (i.e., it takes 1 second faster to reach 50°C, 25 seconds faster to reach 60°C, and 36 seconds faster to reach 70°C).

[0496] This is likely due to the active diffusion flow of the gas-phase refrigerant when the evaporation and condensation regions of the refrigerant are separated from each other, and the condensation region is further separated from the evaporation region or separated from each other to some extent. As a result, the width dimension can be slightly reduced, which can be an important indicator for reducing the front-to-back thickness of the antenna device (or electronic device).

[0497] At the same time, if Figure 32 As shown, if the temperature arrival times of the active heat dissipation mechanism 200 (PTX, 310*90) of one embodiment of the present invention and the product of the same shape and specification (Roll Bonding Fin, 310*90) in the two RBFHP products of the above-mentioned existing paper are compared, it can be confirmed that the target temperature is reached in a very short time.

[0498] That is, in the case of the active heat dissipation mechanism 200 (PTX, 310*90) of one embodiment of the present invention, the time to reach the maximum target temperature of 70°C is only 8 seconds, which is nearly 5 times the time to reach the minimum target temperature of 50°C by the product of the RBFHP (RollBonding Fin, 310*90) specification of the existing paper. Compared with the same maximum target temperature, it is nearly 10 times the time to reach the result.

[0499] This indicates that compared with the RBFHP roll bonding fin (Roll Bonding Fin, 310*90) product of the existing paper, the active heat dissipation mechanism 200 (PTX, 310*90) of one embodiment of the present invention performs gas-liquid circulation very actively in the refrigerant flow space.

[0500] That is, compared with the RBFHP product of the existing paper, the active heat dissipation mechanism 200 of an embodiment of the present invention is estimated to be that the spacing distance of the refrigerant flow space 205 (more specifically, the first refrigerant flow path 210) that actually performs heat dissipation is minimized, and compared with the excellent thermal conductivity of the material itself of the metal plate component, the reduction in the spacing distance between the liquid-phase refrigerant in the refrigerant filled in the refrigerant flow space 205 and the heating element 140 is considered to be a good result for more realistically improving the heat dissipation performance.

[0501] As described above, in the case where the time for all condensation areas except the evaporation area to reach the target temperature is minimized, heat dissipation can naturally be achieved with faster and higher performance.

[0502] In addition, export Figure 34 The purpose of the test of the result value is to compare the temperature measurement result value at each position of the heat source (heating element) of the heat dissipation part formed long in the up and down direction as shown in the antenna device, and to confirm the installation suitability of the antenna device by comparing the heat dissipation fins (AL6063_REF) made of ordinary aluminum and the two specifications of products (Roll Bonding Fin, 292*115 and 310*90) presumed to be RBFHP in the existing paper, when the active heat dissipation mechanism 200 (PTX, 310*90) of an embodiment of the present invention does not utilize the phase change of the refrigerant.

[0503] In order to derive its accurate result value, such as Figure 35 As shown, a heat source (heating element) with a uniform power input of 25W was placed at five locations at equal intervals above and below, and the four products mentioned above were replaced as heat dissipation fins and measured.

[0504] Results, such as Figure 35 As shown, it was confirmed that in the case of the heat sink fin (AL6063_REF) product made of ordinary aluminum material, compared with the two specifications of RBFHP products (Roll Bonding Fin, 292*115 and 310*90) presumed to be the existing paper, the temperature of the third heat source in the middle from the bottom heat source itself is relatively high, and the fourth heat source and the top heat source have relatively low temperatures.

[0505] While it's difficult to pinpoint the cause of this result, it's speculated that both RBFHPs in the prior art are significantly affected by rising currents of seemingly relatively hot outside air at higher locations. Therefore, the prior art RBFHPs are not optimally suited for all vertically elongated heat dissipation locations, as in the antenna system. Instead, they should be designed to be interlaced with the aforementioned standard aluminum heat dissipation fins (AL6063_REF) to optimize performance at each location.

[0506] In contrast, in the case of the active heat dissipation mechanism 200 (PTX, 310*90) of one embodiment of the present invention, a good heat source temperature value is presented regardless of the height of the heat source. Therefore, the present invention naturally also has the advantage of being able to be evenly applied to all heat dissipation parts formed long in the up and down directions as shown in the antenna device.

[0507] As described above, the active heat dissipation mechanism 200 according to an embodiment of the present invention provides the following advantages: it can overcome the restrictions on the use and selection of refrigerants that have recently emerged as restrictions of the international community, and can maximize the heat dissipation performance of the product itself.

[0508] 13. Manufacturing method of one embodiment and another embodiment of the present invention

[0509] Figure 36 is a flow chart showing a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention. Figure 37 FIG. 4 is a flow chart illustrating a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

[0510] like Figure 36 As shown, the manufacturing method of the active heat dissipation mechanism of the embodiment of the present invention includes: a stamping step S10, pressing the heat conducting plate body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) made of a heat conductive material as a single component, and processing them to a predetermined depth to make the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 recessed.

[0511] like Figure 12 As shown, the stamping process S10 can be defined as a process of manufacturing a single heat conduction plate body (a heat conduction plate 200-1 on one side and a heat conduction plate 200-2 on the other side) having the same specifications and specifications while bending them relative to each other with an arbitrary reference line T as a reference, so that the first refrigerant flow path 210 to the third refrigerant flow path 230 and multiple strength reinforcement parts 240 are formed symmetrically.

[0512] In addition, the manufacturing method of the active heat dissipation mechanism according to one embodiment of the present invention may include: a bending process S20, after the stamping process S10, folding the one side heat conduction plate 200-1 on one side in the width direction and the other side heat conduction plate 200-2 on the other side in the width direction with an arbitrary reference line T based on the first refrigerant flow path 210 as a reference; and a joining process S40, after the bending process S20, making the edge ends corresponding to the heat dissipation plate parts 203 of the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 and the second refrigerant flow path 220 and the multiple strength reinforcement parts 240 formed on the third refrigerant flow path 230 mutually joined.

[0513] Here, the joining process S40 is performed for the purpose of sealing the refrigerant flow space 205 filled with refrigerant, which is equivalent to the press-in end 201 on the side of the first refrigerant flow path 210, which is the part that has been sealed by the bending process S20. Therefore, as described above, it can be interpreted as a process of joining along the edge end corresponding to the heat dissipation plate part 203.

[0514] In addition, the manufacturing method of the active heat dissipation mechanism of the embodiment of the present invention may also include: an absorber setting step S30, before the joining step S40, an absorber 300 for absorbing and moving liquid refrigerant by capillary force is set at a position corresponding to the first refrigerant flow path 210 near the pressed end 201.

[0515] At this time, the absorber 300 can be inserted into one of the openings at both ends of the first refrigerant flow path 210 in the longitudinal direction formed by the bending process S20, and then filled with refrigerant by the refrigerant filling process S50 described later, and then shielded by filling one of the two ends of the opening to prevent internal refrigerant leakage.

[0516] More specifically, the absorber installation step S30 is a step performed during the bending step S20 , and can be defined as a step of inserting and installing the absorber 300 in the partially formed first refrigerant flow path 210 before the bending step S20 is completed.

[0517] That is, refer to Figure 12 The following is described with reference to the accompanying drawings. In the bending process S20, Figure 12 As shown in (b), after the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side are bent at a certain angle with respect to an arbitrary reference line T to form a portion of the first refrigerant flow path 210, the absorber 300 is arranged in a manner such that the absorber 300 is disposed at the portion where the first refrigerant flow path 210 is formed, the absorber 300 can be placed as shown in FIG. Figure 12 The additional bending step S20 shown in (c) is performed as follows Figure 12 The bonding step S40 shown in (d) is performed.

[0518] At this time, if the bending step S20 is completed, the absorber 300 can be stably fixed at a position corresponding to the first refrigerant flow path 210 by the plurality of absorber fixing guides 250 formed at the first refrigerant flow path 210 .

[0519] Thereafter, when the edge ends of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side are joined by the joining process S40 as described above, the two ends in the length direction of one end and the other end of the press-in end 201 constituting the first refrigerant flow path 210 are in an open state. After one of the two ends of the opening is caulked for the subsequent vacuum process (not shown), after the refrigerant is filled by the refrigerant filling process S50 described later, the caulk finishing process (not shown) described later can be performed to cover the other end of the opening that is not caulked by the caulk operation, thereby preventing internal refrigerant leakage.

[0520] At the same time, the manufacturing method of the active heat dissipation mechanism of an embodiment of the present invention includes: a refrigerant filling process S50, after the joining process S40, filling the refrigerant through one side end or the other side end (i.e., one of the two ends of the opening) in the longitudinal direction of the first refrigerant flow path 210; and a heat dissipation mechanism fastening process S60, after the refrigerant filling process S50, a press-in portion 150 is press-fitted into the heat dissipation housing body 110.

[0521] The refrigerant filling step S50 can be implemented by forming one of the openings at one end and the other end (ie, both ends) of the first refrigerant flow path 210 in the longitudinal direction, and completely sealing the opening after filling the refrigerant to prevent refrigerant leakage.

[0522] However, the manufacturing method of the active heat dissipation mechanism of the embodiment of the present invention may further include: a cleaning process (not shown), before the absorber setting process S30, one of the openings formed at the two ends of the first refrigerant flow path 210 is filled and covered, and the refrigerant flow space is cleaned; and a vacuuming process (not shown), after the cleaning process and before the refrigerant filling process S50 or after the refrigerant filling process S50, the refrigerant flow space is vacuumed through one of the unfilled openings formed in the openings at the two ends of the first refrigerant flow path.

[0523] Here, the cleaning process can be achieved by sequentially immersing the active heat dissipation mechanism 200 of an embodiment of the present invention in a sedimentation tank, an ultrasonic tank, a rinse tank, and a vapor degreasing tank, and finally performing drying to remove moisture. The vacuuming process is generally a process in which the interior of a vacuum-operated device is vacuumed by suction, a refrigerant is filled, the refrigerant is heated and evaporated, and then vacuumed again (a heating vacuuming process), or after filling with refrigerant, the refrigerant is temporarily frozen (solidified) and then vacuumed (a freezing vacuuming method).

[0524] For reference, in the vacuuming process of the former method of filling (injecting) the refrigerant after vacuuming, the vacuum degree changes when the refrigerant is filled (injected). If a high vacuum is formed first and then the refrigerant is filled, it becomes a low vacuum state. From the perspective of a low-cost process method, it is mainly suitable for mass production and the manufacture of low-priced products where price takes precedence over quality.

[0525] At the same time, the latter method includes the filling (injection) of the liquid refrigerant and the vacuum process after the freezing of the liquid refrigerant. Specifically, after the first vacuum is completed, the liquid refrigerant is filled and frozen, and then the second vacuum is performed. Although it goes through a complicated process compared to the former method, it has the advantages of fast response speed, minimizing NCG, and improving Qmax of high vacuum products. In addition, the freezing process of the liquid refrigerant can reduce the capacity of the vacuum equipment and increase the vacuum exhaust speed. It is mainly suitable for small-scale production and the manufacture of high-priced products.

[0526] After the vacuuming process is completed, a caulking finishing process (not shown) may be further included, in which the remaining openings of the first refrigerant flow path 210 that were not caulked for the vacuuming process are caulked.

[0527] In particular, Figure 13 As shown, the active heat dissipation mechanism 200 of an embodiment of the present invention is formed with a part of the pressed-in end 201 corresponding to one end and the other end of the first refrigerant flow path 210, and further protruding outward on one side caulking end 207a and the other side caulking end 207b. During the caulking operation and the caulking finishing process performed after the above-mentioned joining process S40, a predetermined caulking component made of elastic material is used to cover the opening portion, and after the protruding portion is crimped and completely sealed using a crimping caulking tool (not shown), the protruding portion is cut and removed as the portion to be compressed again, so that the caulking operation can be performed.

[0528] At the same time, the manufacturing method of the active heat dissipation mechanism of an embodiment of the present invention can also include at least one of a leakage testing process (not shown) for testing whether the refrigerant is leaking after the caulking finishing process, a performance inspection process (not shown) for finally checking the performance of the active heat dissipation mechanism 200 of the present invention, and a reliability testing process for testing the reliability of the active heat dissipation mechanism 200 of the present invention.

[0529] In addition, although not shown in the figure, the manufacturing method of the active heat dissipation mechanism of an embodiment of the present invention may also include: a coating process (not shown in the figure), forming a hydrophobic coating material on one surface of the heat conducting plate body (one side heat conducting plate 200-1 and the other side heat conducting plate 200-2) in which the refrigerant flow space 205 filled with refrigerant flows by the refrigerant filling process S50 before the bending process S20 (or the absorber setting process S30).

[0530] Here, the description assumes that water (distilled water) is used as the refrigerant and the hydrophobic coating material is limited to the raw material of the coating layer. However, a hydrophilic coating material may be used depending on the type of refrigerant used or the refrigerant flow path.

[0531] In addition, refer to Figure 37 The manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention may be different from the manufacturing method of the active heat dissipation mechanism 200 including the bending step S20 according to one embodiment of the present invention as follows.

[0532] That is, the manufacturing method of the active heat dissipation mechanism 1200 of another embodiment of the present invention may include: a stamping process S10, pressing two separate metal plate parts respectively, thereby processing them to form refrigerant flow spaces including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 with a predetermined depth respectively; a joining process S40, after the stamping process S10, joining along the edge ends of the heat conduction plate main body 1200-1 and 1200-2 set using two separate metal plate parts, thereby simultaneously forming a refrigerant flow space equivalent to the first refrigerant flow path 1210 and the second refrigerant flow path 1220; and a refrigerant filling process S50, filling the refrigerant into the refrigerant flow space.

[0533] The manufacturing method of the active heat dissipation mechanism 200 of one embodiment of the present invention uses a single metal plate component to perform a stamping process S10 to form a refrigerant flow space including a first refrigerant flow path 210 and a second refrigerant flow path 220, and forms an edge end except for the side of the pressed end 201 through a bending process S20, and is manufactured in a state that can be joined by the subsequent joining process S40.

[0534] In contrast, in a manufacturing method of an active heat dissipation mechanism 1200 according to another embodiment of the present invention, two separate metal plate components are respectively subjected to a stamping process S10 to form portions corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 together with the edge ends serving as their outer shapes. In the absence of the above-mentioned bending process S20, the edge ends of the two separate metal plate components can be directly joined in a joining process S40 for joining.

[0535] Of course, in the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the absorber setting step S30 of setting the absorber 300 or the auxiliary absorber 301 may also be performed before the bonding step S40.

[0536] Furthermore, in the case where the active heat dissipation mechanism 1200 of another embodiment of the present invention includes a plurality of strength reinforcement parts 1240, the joining process S40 should be interpreted as a concept including a process of joining the edge ends of two separate metal plate parts in a predetermined manner while joining the plurality of strength reinforcement parts 1240 to each other.

[0537] However, in the manufacturing method of the active heat dissipation mechanism 1200 of another embodiment of the present invention, in order to perform the cleaning process and the vacuum process performed after the bonding process S40, the subsequent filling and finishing process can be performed after the one end and the other end side of the part corresponding to the pressed end 1201 side are formed in a manner that is open.

[0538] According to the active heat dissipation mechanism 200, 1200 of the embodiment of the present invention having the structure as described above, heat transfer and heat dissipation are achieved by actively changing the phase of the refrigerant filled inside. Since it can overcome the material limitations of the existing heat dissipation fins themselves used for heat dissipation and achieve higher heat dissipation performance, it has the advantage of significantly improving the performance of antenna devices or similar electronic devices.

[0539] The above describes in detail an embodiment of the active heat dissipation mechanism of the present invention with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the above-described embodiment. Persons skilled in the art of the present invention can readily implement various modifications within the scope of the present invention. Therefore, the true scope of the present invention should be determined by the claims.

[0540] Industrial applicability

[0541] The present invention provides an active heat dissipation mechanism that can actively transfer heat generated from a heat-generating device (eg, electronic device) through a phase change of a refrigerant that is more effective than the refrigerant's own heat-conducting material properties, thereby improving heat dissipation performance.

Claims

1. An active heat dissipation mechanism, characterized in that: include: The heat conducting plate body has a refrigerant flow space of predetermined thickness inside. as well as Refrigerant, filling the refrigerant flow space of the heat conducting plate body, The heat conducting plate body is formed of a metal material that transfers heat from the outside to the inside of the refrigerant flow space. The refrigerant is formed by water, and the water achieves a phase change from liquid to gas or from gas to liquid by means of the thermal conductivity of the heat conducting plate body itself.

2. The active heat dissipation mechanism according to claim 1, characterized in that: The water forming the refrigerant includes one of natural water, distilled water, pure water, and ultrapure water.

3. The active heat dissipation mechanism according to claim 1, characterized in that: The water forming the refrigerant is ultrapure water that has been purified and has a specific resistance of 18 MΩ·cm or more.

4. The active heat dissipation mechanism according to claim 1, characterized in that: The water forming the refrigerant is pure water that has been subjected to a water purification method and has a specific resistance value of 5Ω.cm to 18MΩ.cm.

5. The active heat dissipation mechanism according to claim 1, characterized in that: The metal material of the heat conducting plate body includes one of platinum, gold, silver, iridium, tungsten, titanium, copper and stainless steel that does not chemically react with water formed by the refrigerant.

6. The active heat dissipation mechanism according to claim 1, characterized in that: The metal material of the heat conducting plate body is stainless steel that does not chemically react with water formed by the refrigerant.

7. The active heat dissipation mechanism according to claim 1, characterized in that: The metal material of the heat conducting plate body is stainless steel having an elongation that is processed to a thickness less than 1 / 3 of a limit thickness, where the limit thickness is the minimum thickness when aluminum having a predetermined tensile strength or greater is used.

8. The active heat dissipation mechanism according to claim 7, characterized in that: The metal material of the heat conducting plate body is stainless steel with an elongation that can be processed into a plurality of strength-reinforced parts, and the plurality of strength-reinforced parts protrude toward the inside of the refrigerant flow space through the stamping process.

9. The active heat dissipation mechanism according to claim 1, characterized in that: The thickness of the heat conducting plate body is less than 1 / 3 of the limit thickness, where the limit thickness is the minimum thickness when the metal material is aluminum having a predetermined tensile strength or greater.

10. The active heat dissipation mechanism according to claim 1, wherein: The metal material of the heat conducting plate body is stainless steel, and the thermal conductivity of the stainless steel is less than 1 / 10 of the thermal conductivity of the heat conducting plate body made of aluminum having a predetermined tensile strength or higher.

11. The active heat dissipation mechanism according to claim 1, characterized in that: The heat conducting plate body is pressed into the press-in portion in a forced insertion manner. The press-in portion is configured to directly receive heat from a heat dissipation object and has an inner portion between a pair of groove ribs. In the case where the heat transfer plate body includes a press-fit end portion, and the press-fit end portion includes a first refrigerant flow path for providing an evaporation region for collecting liquid refrigerant in the refrigerant, The metal material of the heat transfer plate body is stainless steel that can be processed so that at least a portion of the first refrigerant flow path provided inside the press-fit end portion is positioned inside the space beyond the outer ends of the pair of groove ribs of the press-fit portion.

12. The active heat dissipation mechanism according to claim 6, characterized in that: The heat transfer plate body is processed so that at least a portion of the first refrigerant flow path is located inside a pair of groove ribs of a pressing portion having the same shape and size as a pressing portion set to a thickness twice the maximum thickness, and the maximum thickness is the minimum thickness when the metal material is aluminum having a predetermined tensile strength or greater.

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