A large aperture multi-zone uniform cooling polishing device and double-sided polishing equipment

Abstract

The application discloses a large-diameter multi-partition uniform cooling polishing device and a double-sided polishing equipment, wherein the polishing device comprises a rotating spindle assembly, a polishing disc assembly and a multi-partition cooling system; the rotating spindle assembly comprises a T-shaped spindle and a bearing assembly, the T-shaped spindle is rotatably supported on a base through the bearing, and six groups of water inlet channels and water return channels are integrated in the T-shaped spindle; the polishing disc assembly comprises a polishing disc with a diameter of 700-2600 mm, the polishing disc adopts a split structure combined by a back disc and a working disc, a polishing pad is mounted on the upper surface of the polishing disc, and the lower surface of the polishing disc is fixedly connected with the T-shaped spindle; the multi-partition cooling system comprises a labyrinth convection flow channel of six cooling partitions and an integrated shunt water tank matched with the labyrinth convection flow channel. The application can accelerate the temperature regulation thermal response and reduce the disc surface thermal deformation through the working disc thin-walled cavity structure and the synchronous cooling circulation of the six groups of fluid channels, and the radial ribs, the meandering ribs and the circumferential connecting ribs contained in the labyrinth convection flow channel can realize the reverse flow of the cooling liquid, balance the cold and hot gradients, and further weaken the local temperature difference of the disc surface.

Description

Technical Field

[0001] This application belongs to the field of high-precision processing equipment technology, specifically relating to a large-diameter multi-zone uniform cooling and polishing device for high-precision polishing of semiconductor wafers, optical components, etc., and a double-sided polishing device including the device. Background Technology

[0002] As the size of semiconductor wafers and optical components increases, traditional polishing disc cooling systems face the following technical challenges:

[0003] Uneven cooling leads to excessive temperature differences on the plate surface;

[0004] Large-sized, thin-walled disks are prone to thermal deformation.

[0005] Low cooling efficiency affects machining accuracy;

[0006] Slow thermal response limits production efficiency.

[0007] Existing technologies, such as the single-channel cooling scheme used in patents like CN114473848B, cannot meet the temperature control requirements of polishing discs with a diameter of 1600mm or more. Therefore, there is an urgent need to develop new cooling and polishing devices to solve the above problems. Summary of the Invention

[0008] This application provides a large-diameter multi-zone balanced cooling and polishing device and a double-sided polishing apparatus including the device, aiming to solve the existing technical problems of large-diameter polishing discs in the polishing process.

[0009] This application provides a large-diameter, multi-zone isothermal cooling polishing device, comprising: a rotating spindle assembly including a T-shaped spindle and a bearing assembly, the T-shaped spindle being rotatably supported on a base via bearings; a polishing disc assembly including a polishing disc with a diameter of 700-2600 mm, the upper surface of the polishing disc being fitted with a polishing pad, and the lower surface being fixedly connected to the T-shaped spindle; a multi-zone cooling system including: six circumferentially distributed independent cooling zones disposed inside the polishing disc and a labyrinthine convection channel disposed within each zone; an integrated distribution water tank fixed to the base and sleeved on the T-shaped spindle, configured to provide coolant circulation pathways to the labyrinthine convection channels of each zone; a fluid channel system including six spindle inlet channels and six spindle return channels circumferentially spaced within the T-shaped spindle, for communicating with corresponding through holes in the circulation pathways of the integrated distribution water tank; and a quick-connect assembly configured to detachably connect the fluid channel system to the corresponding through holes of the back plate assembly.

[0010] Furthermore, the polishing disc adopts a split structure consisting of a back disc assembly and a working disc. The back disc assembly includes a back disc and six L-shaped guide plates.

[0011] Furthermore, the back plate includes a main shaft connection part and a flow guiding structure part. The main shaft connection part is fixed to the T-shaped main shaft through a flange interface; the flow guiding structure part is provided with 6 L-shaped flow guiding grooves and corresponding water inlet holes and water return holes, and each groove covers the L-shaped flow guiding plate to form a sealed channel.

[0012] Furthermore, the working disk adopts a thin-walled cavity structure, comprising: a disk surface portion for supporting the polishing pad, wherein the disk surface adopts a thin-walled design to help improve the thermal response speed of the coolant to the temperature regulation of the polishing disk; and a cavity portion comprising an inner peripheral wall, an outer peripheral wall, dividing ribs and guiding ribs extending downward from the disk surface portion, and six circumferentially distributed cooling zones and a labyrinthine convection channel within each zone formed by the above structures.

[0013] Furthermore, the labyrinthine convection channel is formed within each cooling zone by the distribution of the guide ribs, which include: one inner extension rib, a rib radiating radially inward from the outer peripheral wall along the symmetrical centerline of the zone; one pair of radially extending ribs, a pair of ribs radiating radially outward from the inner peripheral wall and symmetrically distributed along the centerline of the zone; one meandering rib, extending in a wave pattern around the above three radial ribs along the meandering groove centerline of the zone, used to extend the coolant path and form a convection channel; and one circumferential connecting rib, used to connect adjacent radial ribs to form a closed-loop channel.

[0014] Furthermore, each partition's closed-loop flow channel has: a flow channel inlet, which is connected to the back plate water inlet through the L-shaped guide groove; a flow channel outlet, which is directly connected to the back plate water return hole; and a temperature equalization structure, configured so that the coolant flows in reverse from the flow channel inlet to the flow channel outlet to equalize the thermal gradient and weaken the local temperature difference on the plate surface.

[0015] Furthermore, the flow channel inlet and flow channel outlet are separated by the circumferential connecting ribs, and are radially adjacent to both sides of the ribs to ensure that the coolant flows in the opposite direction.

[0016] Furthermore, the integrated distribution tank includes: a dual-chamber structure comprising an inlet chamber and a return chamber isolated by a rotary sealing device; and a fluid distribution structure configured to provide independent coolant circulation paths to each zone's labyrinthine convection channel, wherein the inlet chamber is connected to the channel inlet of each zone via six main shaft inlet channels; and the return chamber is connected to the channel outlet of each zone via six main shaft return channels.

[0017] Furthermore, the water inlet chamber is provided with a main inlet, and the water return chamber is provided with a main outlet. The coolant flowing out of the cooling equipment flows into the water inlet chamber through the main inlet, and then is distributed to the labyrinthine convection channels of each zone through the fluid distribution structure and the main shaft water inlet channel for synchronous cooling circulation. Then, it merges with the main shaft return channel and the fluid distribution structure to the water return chamber, and flows back to the cooling equipment through the main outlet.

[0018] Furthermore, it also includes a constant temperature control system, comprising: a temperature sensor, installed in the return water chamber of the integrated distribution tank, to monitor the return water temperature; and a main controller, configured to dynamically adjust the coolant flow rate based on the temperature feedback signal to achieve precise temperature control.

[0019] A second aspect of this application provides a double-sided polishing apparatus, comprising:

[0020] The large-diameter multi-zone uniform cooling and polishing device described above is used to carry multiple planetary wheels loaded with workpieces and to perform high-precision polishing on the lower surface of the workpieces by rotating a uniformly cooled constant-temperature polishing disc.

[0021] The upper polishing disc assembly has a cooling system symmetrically arranged with the lower polishing disc assembly, which is used to press the workpiece onto the lower polishing disc and perform high-precision polishing on the upper surface of the workpiece by rotating the uniformly cooled constant temperature polishing disc.

[0022] The planetary transmission system includes a sun gear, a pin gear ring, and a planetary gear assembly for loading the workpiece. The planetary gear for loading the workpiece meshes with the sun gear and the pin gear ring respectively. The two use different speeds to drive the planetary gear to revolve and rotate. The workpiece performs planetary motion between the up-and-down rotating polishing discs under the drive of the planetary gear.

[0023] The polishing slurry supply system includes a multi-channel distributor and corresponding fluid delivery lines for supplying polishing slurry to the surfaces of the polishing pads on the upper and lower plates.

[0024] The beneficial effects of this application include:

[0025] 1. Thermal-mechanical synergistic optimization of the working disc: The thermal resistance can be reduced by the thin-walled design of the disc surface; at the same time, the axial stiffness is improved by the integrated design of the guide rib cavity, which improves the thermal response speed and enhances the mechanical properties of the disc surface against thermal deformation.

[0026] 2. High-efficiency and balanced cooling: Through the counter-flow design, the heat gradient is balanced, the local temperature difference on the plate is weakened, and the heat exchange efficiency is improved;

[0027] 3. Ultra-high temperature uniformity: Through 6-zone synchronous precise temperature control cooling + labyrinth convection channel design, uniform isothermal cooling of the polishing pad is achieved, ensuring high-precision and stable operation of the pad surface flatness;

[0028] 4. Process adaptability: The integrated distribution tank with 6 sets of inlet / outlet circulation channels significantly increases the total circulation flow of coolant and significantly shortens the thermal response time for temperature regulation, making it adaptable to polishing different materials and different polishing process parameters. Attached Figure Description

[0029] The advantages of this application will become clearer and easier to understand through the detailed description taken in conjunction with the following accompanying drawings, but these drawings are merely illustrative and do not limit the scope of protection of the invention, wherein:

[0030] Figure 1 This is a three-dimensional structural schematic diagram of the double-sided polishing device provided in Embodiment 1 of this application;

[0031] Figure 2 This is a schematic diagram of the structure of the large-diameter uniform cooling and polishing device for the lower plate provided in Example 2;

[0032] Figure 3 The rib distribution of the 6-zone labyrinthine convection channel and the counter-current circulation route of the coolant are shown in the AA direction for the polishing device.

[0033] Figure 4 The distribution of the six sets of spindle water inlet channels and spindle water return channels within the T-shaped spindle is shown in the BB direction for the polishing device.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10. Lower plate large-diameter multi-zone uniform cooling and polishing device; 20. Upper polishing disc assembly; 30. Sun gear; 40. Pin ring; 50. Polishing fluid supply system; 60. Planetary wheel for loading workpieces; 110. Rotary spindle assembly; 111. Base; 112. Bearing; 113. T-shaped spindle; 1131. Spindle water inlet channel; 1132. Spindle water return channel; 114. Quick-connect assembly; 120. Polishing disc assembly; 121. Back plate; 1210. L-shaped guide channel; 1211. Back plate water inlet; 1212. Back plate water return hole; 122. Working disc; 1220. Working disc cavity; 1221. Working disc surface; 1222. Inner peripheral wall; 1223. Outer peripheral wall; 1224. Dividing rib; 1225. Inner extension rib; 1226. Outer extension rib; 1227. Winding rib; 1228. Circumferential connecting rib; 123. L-shaped guide plate; 1231. Guide plate water inlet; 124. Polishing pad; 125. Flow channel inlet; 126. Flow channel outlet; 130. Integrated diversion water tank; 1310. Inlet chamber; 1311. Main inlet; 1320. Return chamber; 1321. Main outlet; 140. Constant temperature control system; 141. Temperature sensor; 142. Main controller. Detailed Implementation

[0036] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0037] Example 1

[0038] like Figure 1 As shown, the double-sided polishing equipment provided in Embodiment 1 of this application includes:

[0039] The lower plate is equipped with a large-diameter, multi-zone uniform cooling and polishing device 10, which is installed as the lower polishing plate.

[0040] The upper polishing disc assembly 20 has a cooling system that is symmetrically arranged with the lower polishing disc assembly;

[0041] The planetary transmission system includes a sun gear 30, a pinion ring 40, and a planetary gear 60 for loading the workpiece;

[0042] The polishing slurry supply system 50 includes a multi-channel distributor and corresponding fluid delivery pipelines.

[0043] like Figure 1 As shown, in this embodiment, taking a polishing disc with a diameter of 1600 mm as an example, high-precision double-sided polishing can be performed on the upper and lower surfaces of five large-diameter sheet components with a diameter of 510 mm simultaneously. Before polishing begins, a batch of five workpieces is placed in five planetary gears 60 on the workpiece loading and unloading table. The planetary gears 60 carrying the workpieces are moved radially along the polishing disc to above the lower polishing disc and engage against the pins of the sun gear 30. The five planetary gears 60 are then evenly distributed circumferentially on the lower polishing disc using an indexing device. After the workpieces are loaded, the upper polishing disc moves downward through a servo pressure control device and softly contacts the upper surface of the workpiece, i.e., the pressure on the workpiece is close to 0 N. The polishing process begins softly with the polishing disc cooling system and polishing fluid supply system 50 activated first. That is, the four axes of the upper and lower polishing discs, sun gear 30, and pin gear 40 gradually accelerate from 0 rpm to a stable polishing state synchronously and proportionally through a pre-set direction and optimized rotational speed ratio. At the same time, the pressure on the upper disc is gradually increased or decreased according to a set program. During the polishing process, the planetary wheel 60 meshes with the sun gear 30 and the pin ring 40, respectively. The sun gear 30 and the pin ring 40 rotate at different speeds, driving the planetary wheel 60 to revolve and rotate. Driven by the planetary wheel 60, the workpiece undergoes planetary motion between the upper and lower rotating polishing discs. Simultaneously, polishing fluid flowing evenly from the upper polishing disc flows between the workpiece and the upper and lower polishing pads 124, forming a thin liquid film. The micro-mechanical friction of the abrasive particles removes material from the workpiece surface. The removed material particles dissolve in the flowing liquid and are carried away, achieving simultaneous planarization of both sides of the workpiece, thus achieving global planarization. After polishing, the five planetary wheels 60 carrying the workpieces are moved sequentially to the loading and unloading table using an indexing device. After removing the planetary wheels 60, the workpieces are transported to the post-processing unit.

[0044] In this embodiment, while keeping the pin ring 40 unchanged, another optional configuration consisting of a polishing disc, a sun gear, and a planetary gear can be provided. Depending on the required production capacity, workpiece size, and polishing precision, another configuration can be selected, enabling simultaneous high-precision double-sided polishing of six large-diameter sheet elements with a diameter of 460 mm in a single batch.

[0045] Understandably, in the double-sided polishing process, the surface shape accuracy of the upper and lower polishing discs is essentially copied to the workpiece. For the workpiece to achieve extremely high flatness and thickness consistency, the flatness of the polishing discs themselves must maintain a very stable and high precision. Therefore, in the field of high-precision polishing of large-diameter components, it is crucial to equip double-sided polishing equipment with a large-diameter, multi-zone uniform cooling polishing device 10 to reduce thermal deformation of the polishing discs.

[0046] Example 2

[0047] like Figure 2 , Figure 3 , Figure 4 As shown, Embodiment 2 of this application provides a large-diameter multi-zone uniform cooling and polishing device 10, which is used to perform rapid and uniform constant temperature cooling control on the polishing disc during high-precision double-sided polishing of large-diameter components, thereby reducing thermal deformation.

[0048] like Figure 2 As shown, the large-diameter multi-zone uniform cooling and polishing device 10 includes: a rotating spindle assembly 110, a polishing disc assembly 120, an integrated water distribution tank 130, and a constant temperature control system 140.

[0049] like Figure 2 As shown, the rotary spindle assembly 110 includes a T-shaped spindle 113 and a bearing 112, with the T-shaped spindle 113 rotatably supported on the base 111 via the bearing 112; the polishing disc assembly 120 includes a polishing disc with a diameter of 700-2600 mm, the upper surface of which is equipped with a polishing pad 124, and the lower surface is fixedly connected to the T-shaped spindle 113; the integrated diversion water tank 130 is fixed to the base 111 and sleeved on the T-shaped spindle 113; and the constant temperature control system 140 includes a temperature sensor 141 and a main controller 142.

[0050] like Figure 2 and Figure 3As shown, the polishing disc assembly 120 adopts a split structure (back disc 121 + working disc 122). In specific implementation, after the back disc 121 and working disc 122 are processed separately, they are uniformly fixed and connected by a series of circumferentially distributed bolts and seals. Six sets of circumferentially distributed L-shaped guide grooves 1210, water inlet holes 1211, and water return holes 1212 are processed on the upper surface of the back disc 121. Each groove is covered by an L-shaped guide plate 123 to form a sealed flow channel. A guide plate water inlet hole 1231 is processed at the long vertical end of the L-shaped guide plate 123 to connect to the flow channel inlet 125. The back disc water inlet hole 1211 is processed at the short horizontal end of the guide groove 1210 and connects to the flow channel inlet 125 through the guide groove 1210 and the guide plate water inlet 1231. The back plate return water hole 1212 and the back plate inlet water hole 1211 are evenly distributed circumferentially, and the back plate return water hole 1212 is directly connected to the flow channel outlet 126. In this embodiment, the back plate 121 and the guide plate 123 are made of 6061-T6 aluminum alloy. The guide plate 123 is embedded and welded to the upper surface of the back plate 121, and the upper surface of the back plate 121 is precision machined after aging treatment.

[0051] like Figure 2 and Figure 3 As shown, in a specific implementation, the lower surface of the working disk 122 is milled using a five-axis linkage machining center to form the working disk cavity 1220 and the working disk surface 1221, as well as the following peripheral walls and ribs: inner peripheral wall 1222, outer peripheral wall 1223, dividing ribs 1224, inner extension ribs 1225, outer extension ribs 1226, meandering ribs 1227, and circumferential connecting ribs 1228. The six dividing ribs 1224 divide the entire working disk into six enclosed working disk cavities 1220, forming six independent cooling zones. In this example, the material of the working disk 122 can be ductile iron or gray cast iron, the wall thickness of the surface 1221 can be 5-17 mm, and the milling depth of the working disk cavity 1220 can be 2.5-3 times the wall thickness of the surface 1221, ensuring reduced thermal inertia while increasing the axial stiffness of the working disk 122.

[0052] like Figure 3 As shown, a labyrinthine convection channel is formed within the working disc cavity 1220 of each partition by several guide ribs. The guide ribs include: one inner extension rib 1225: extending 80% of the radial length along the partition centerline RR; one outer extension rib 1226: symmetrically distributed (angular spacing 30°) along the partition centerline RR, extending 80% of the radial length; one meandering rib 1227: surrounding the above three radial ribs and extending along the wave-like centerline of the meandering cavity of the partition, used to extend the coolant path and form a convection channel; and one circumferential connecting rib 1228: located at the radial midpoint of the partition and connecting adjacent radial ribs to form a closed-loop channel structure.

[0053] like Figure 3The coolant counter-flow circulation circuit shown has circumferential connecting ribs 1228 that are radially adjacent to the flow channel inlet 125 and flow channel outlet 126. The labyrinthine flow channel layout between them forms a temperature equalization structure, ensuring that the coolant flows in the reverse direction from the flow channel inlet 125 to the flow channel outlet 126. Through real-time heat exchange, the accumulated temperature gradient flowing on both sides of the meandering ribs 1227 is balanced to weaken the local temperature difference in each zone.

[0054] like Figure 2 and Figure 4 As shown, six sets of spindle water inlet channels 1131 and spindle water return channels 1132 are evenly distributed around the T-shaped spindle 113, and are connected to the corresponding back plate water inlet holes 1211 and back plate water return holes 1212 respectively through quick-connect assembly 114.

[0055] like Figure 2 and Figure 4 As shown, the integrated diversion water tank 130 adopts a dual-chamber structure, including an inlet chamber 1310 and a return chamber 1320 isolated by a rotary sealing device. A fluid distribution structure is provided inside the dual chambers, configured as follows: the inlet chamber 1310 is connected to the flow channel inlet 125 of each zone through the main shaft inlet channel 1131; the return chamber 1320 is connected to the flow channel outlet 126 of each zone through the main shaft return channel 1132.

[0056] like Figure 2 As shown, the water inlet chamber 1310 is provided with a total inlet 1311, and the water return chamber 1320 is provided with a total outlet 1321. The coolant flowing out of the cooling equipment flows into the water inlet chamber 1310 through the total inlet 1311, and then is distributed to the labyrinth convection channels of each zone through the fluid distribution structure and the main shaft water inlet channel 1131 for synchronous cooling circulation. Then, it merges with the main shaft return channel 1132 and the fluid distribution structure to the water return chamber 1320, and flows back to the cooling equipment through the total outlet 1321.

[0057] like Figure 2 and Figure 4 As shown, a temperature sensor 141 is installed in the return water chamber 1320 to monitor the return water temperature and feeds the temperature signal back to the main controller 142 in real time. The main controller 142 dynamically adjusts the coolant flow rate of the cooling equipment by continuously correcting the deviation between the feedback value and the set value, thereby achieving constant and precise temperature control. It is understandable that the temperature sensor 141 can monitor the temperature in various ways. Figure 2This is just one example and is not limited to this. The temperature sensor 141 can also be installed in the return water tank of the external cooling equipment, or it can be installed in the polishing disc to monitor the temperature of the disc surface 1221 or directly monitor the temperature of the polishing pad 124, etc. As long as the flow channel structure and cooling system circulation structure described in this embodiment are used or modified without creativity, they all fall within the protection scope of this application.

[0058] The embodiments of this application are not limited to the above-described embodiments, and those skilled in the art can make various modifications within the scope of the claims. For example, the polishing disc diameter is in the range of 700-2600 mm, and the number of cooling zones (in this embodiment, a multiple of 3, i.e., 6 zones) can be adjusted to other integer multiples of 3 as needed (such as 3, 9, or 12 zones). These improvements are all within the scope of protection of this application.

Claims

1. A large-diameter, multi-zone uniform cooling and polishing device, characterized in that, include: A rotating spindle assembly includes a T-shaped spindle and a bearing assembly, wherein the T-shaped spindle is rotatably supported on a base by bearings; A polishing disc assembly includes a polishing disc with a diameter of 700-2600 mm, wherein a polishing pad is mounted on the upper surface of the polishing disc and the lower surface is fixedly connected to the T-shaped spindle; Multi-zone cooling system, including: The polishing disk is equipped with six circumferentially distributed independent cooling zones and a labyrinthine convection channel within each zone. An integrated distribution tank, fixed to the base and fitted onto a T-shaped main shaft, is configured to provide coolant circulation pathways to the labyrinthine convection channels of each zone; The fluid channel system includes six main shaft water inlet channels and six main shaft water return channels evenly distributed circumferentially inside the T-shaped main shaft, which are used to communicate with the corresponding through holes of the integrated diversion water tank circulation passage; The quick-connect assembly is configured to detachably connect the fluid channel system to the corresponding through-hole of the backplate assembly.

2. The apparatus as claimed in claim 1, characterized in that, The polishing disc adopts a split structure consisting of a back disc assembly and a working disc. The back disc assembly includes a back disc and six L-shaped guide plates.

3. The apparatus as described in claim 2, characterized in that, The back plate includes a main shaft connection part and a flow guiding structure part. The main shaft connection part is fixed to the T-shaped main shaft through a flange interface; the flow guiding structure part is provided with 6 L-shaped flow guiding grooves and corresponding water inlet holes and water return holes, and each groove covers the L-shaped flow guiding plate to form a sealed channel.

4. The apparatus as claimed in claim 2, characterized in that, The working disk adopts a thin-walled cavity structure and includes: The disc surface, which supports the polishing pad, features a thin-walled design to improve the thermal response speed of the coolant to the temperature regulation of the polishing disc. The cavity section includes an inner peripheral wall, an outer peripheral wall, a dividing rib and a guide rib structure extending downward from the disk surface section, and six circumferentially distributed cooling zones formed by the above structures and a labyrinthine convection channel within each zone.

5. The apparatus as described in claim 4, characterized in that, The labyrinthine convection channel is formed within each cooling zone by the distribution of the guide ribs, the guide ribs comprising: One inner extension rib, a rib that radiates radially inward from the outer peripheral wall along the symmetrical centerline of the partition; 1. Outer extension ribs, a pair of ribs radiating radially outward from the inner peripheral wall and symmetrically distributed along the midline of the partition; One meandering rib extends along the centerline of the meandering groove of the partition, surrounding the above three radial ribs, to extend the coolant path and form a convection channel; One circumferential connecting rib is used to connect adjacent radial ribs to form a closed-loop flow channel.

6. The apparatus as claimed in claim 5, characterized in that, The closed-loop flow channel of each partition has: The flow channel inlet is connected to the back plate water inlet hole through the L-shaped guide groove; The flow channel outlet is directly connected to the back plate return water hole; The temperature equalization structure is configured so that the coolant flows in a counter-current manner from the inlet to the outlet of the flow channel, which is used to equalize the thermal gradient and weaken the local temperature difference on the plate surface.

7. The apparatus as claimed in claim 6, characterized in that, The flow channel inlet and outlet are separated by the circumferential connecting ribs, which are radially adjacent to both sides of the ribs to ensure that the coolant flows in the opposite direction.

8. The apparatus as claimed in claim 1, characterized in that, The integrated diversion tank includes: The dual-chamber structure includes an inlet chamber and a return chamber isolated by a rotary sealing device; The fluid distribution structure is configured to provide independent coolant circulation paths to each zone's labyrinthine convection channel. The water inlet chamber is connected to the flow channel inlet of each zone through 6 main shaft water inlet channels; The return water chamber is connected to the flow channel outlet of each zone through six main shaft return water channels.

9. The apparatus as claimed in claim 8, characterized in that, The water inlet chamber is provided with a main inlet, and the water return chamber is provided with a main outlet. The coolant flowing out of the cooling equipment flows into the water inlet chamber through the main inlet, and then is distributed to the labyrinth convection channels of each zone through the fluid distribution structure and the main shaft water inlet channel for synchronous cooling circulation. Then it merges with the main shaft return channel and the fluid distribution structure to the water return chamber, and flows back to the cooling equipment through the main outlet.

10. The apparatus as claimed in claim 9, characterized in that, It also includes a constant temperature control system, which includes: A temperature sensor is installed in the return water chamber of the integrated distribution tank to monitor the return water temperature; The main controller is configured to dynamically adjust the coolant flow rate based on the temperature feedback signal to achieve precise temperature control.

11. A double-sided polishing device, characterized in that, include: The large-diameter, multi-zone uniform cooling and polishing device for lower plate as described in any one of claims 1-10 is used to carry multiple planetary wheels loaded with workpieces and to perform high-precision polishing on the lower surface of the workpieces by rotating a uniformly cooled constant-temperature polishing disc. The upper polishing disc assembly has a cooling system symmetrically arranged with the lower polishing disc assembly, which is used to press the workpiece onto the lower polishing disc and perform high-precision polishing on the upper surface of the workpiece by rotating the uniformly cooled constant temperature polishing disc. The planetary transmission system includes a sun gear, a pinion ring, and a planetary gear assembly. The planetary gear, which is used to load the workpiece, meshes with the sun gear and the pinion ring respectively. The two gears drive the planetary gear to revolve and rotate on its own axis at different speeds. Driven by the planetary gear, the workpiece performs planetary motion between the up-and-down rotating polishing discs. The polishing slurry supply system includes a multi-channel distributor and corresponding fluid delivery lines for supplying polishing slurry to the surfaces of the polishing pads on the upper and lower plates.

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