Compliance-sensing integrated bending auxiliary material plate and manufacturing method

Abstract

The invention discloses a compliance-perception integrated bent auxiliary material plate which is characterized by comprising an upper-layer fiber plate, a perception module piece and a lower-layer fiber plate which are integrated through an integrated hot press molding process, and the upper-layer fiber plate and the lower-layer fiber plate are high-performance resin-based reinforced fabrics. A strain type sensing unit and an external wiring port are arranged in the sensing module sheet, the strain type sensing unit senses local deformation of the auxiliary material plate after being loaded and converts the local deformation into a corresponding electrical signal, and the electrical signal is led to the outside through the external wiring port. According to the invention, a sandwich type integrated hot press molding process is used, in the same molding cycle of heating, pressurizing and cooling, the resin matrix synchronously solidifies the fiber layer and the sensing module sheet into a whole, the structure is more compact, the sensing unit and the matrix are firmly combined, the signal is stable, the production process is simplified, and the assembly difficulty and cost are reduced.

Description

Technical Field

[0001] The present invention relates to the field of flexible robots, and in particular to a compliance-perception integrated bending auxiliary material plate and a manufacturing method thereof. Background Art

[0002] In the field of robotics, especially flexible robotics, there is an increasing demand for compliant and sensing components. Compliant components typically have deformable properties, enabling compliant responses and avoiding damage to the mechanical structure caused by posture errors. Sensing components, on the other hand, are primarily used to sense deformation or load conditions and provide feedback on the robot's operating status. Traditionally, compliance and sensing functions are typically implemented using independent components, which are located in different parts of the robotic system. This design approach leads to the complexity of the mechanical structure and the cumbersomeness of the system layout, increasing assembly difficulty and overall cost. In addition, the independent configuration of compliant and sensing components also limits the compactness of the mechanical structure, making it difficult to meet application scenarios with limited space or high lightweight requirements.

[0003] With the expansion of robotic applications, especially the increasing demand for precise operations and interaction with complex environments, integrated components that combine compliance with high-precision sensing capabilities are becoming increasingly important. However, a mature manufacturing process that can effectively embed compliance and strain sensing units within a single component is currently lacking. This is especially true when it comes to the molding of complex components, which is particularly lacking in effective processing methods.

[0004] In existing technologies, the integration of compliance and sensing functions often involves post-assembly or separate processing followed by gluing. This approach makes it difficult to ensure a tight fit and precise positioning between the strain sensing unit and the elastic element. Furthermore, existing integration methods are often limited to flat panels or simple curved surfaces, lacking effective methods for forming complex shapes such as curved, torsionally oriented, or multi-curved components.

[0005] Therefore, it is of great significance to develop a compliant-perceiving integrated bending auxiliary plate and manufacturing method suitable for the forming of complex components. Summary of the Invention

[0006] In view of the above-mentioned defects of the prior art, the technical problems to be solved by the present invention are:

[0007] 1. The compliance components are separated from the sensing components, the post-attachment assembly positioning is inaccurate, the bonding reliability is poor, the structure is bloated and the assembly process is cumbersome;

[0008] 2. Existing integration methods are mainly targeted at flat plates or simple curved surfaces, and it is difficult to achieve compliance-sensing integration on curved, multi-curved, or torsional parts;

[0009] 3. Conventional wires or PCBs are easily damaged during the high-temperature and high-pressure molding process, and the reliability of signal extraction is insufficient.

[0010] To achieve the above-mentioned objectives, the present invention provides a compliant-perceiving integrated bending auxiliary material board, comprising an upper fiberboard 100, a sensing module sheet 200 and a lower fiberboard 300, which are integrated through an integrated hot pressing molding process. The upper fiberboard 100 and the lower fiberboard 300 are made of high-performance resin-based reinforced fabrics. The sensing module sheet 200 is provided with a strain-type sensing unit 201 and an external wiring port 202. The strain-type sensing unit senses the local deformation of the auxiliary material board after being loaded and converts it into a corresponding electrical signal, which is then led to the outside through the external wiring port 202.

[0011] Furthermore, the high performance resin-based reinforcement fabric is a carbon fiber fabric or a glass fiber fabric.

[0012] Furthermore, the resin in the high performance resin-based reinforcing fabric is a thermoplastic resin or a thermosetting resin.

[0013] Furthermore, the sensing module 200 is a resistive, capacitive or piezoelectric structure.

[0014] Furthermore, the sensing module piece 200 is a high-temperature resistant flexible PCB.

[0015] In a second aspect, the present invention provides a method for manufacturing a compliant-sensing integrated curved auxiliary material plate, comprising the following steps:

[0016] S1: Lay a release cloth or apply a high-temperature fluoropolymer release agent on the lower part 500 and the upper part 400 of the mold;

[0017] S2: The lower fiberboard 300 is precisely laid on the lower half of the mold 500, and the sensing module 200 is laid on the surface of the lower fiberboard 300 according to the designed positioning. The upper fiberboard 100 is laid on top of the sensing module 200. The three-layer structure is stacked and positioned.

[0018] S3: Covering the upper mold part 400, and performing a pressurization process on the upper mold part 400 and the lower mold part 500;

[0019] S4: The entire mold is uniformly heated, and after reaching the preset temperature, the temperature is maintained constant for a certain period of time. After the entire mold is cooled to room temperature, the mold is demoulded and the integrated bending auxiliary material plate is taken out.

[0020] Furthermore, the resin in the high-performance resin-based reinforced fabric is a thermoplastic resin, the preset temperature is between 180° C. and 250° C., and the constant temperature maintaining time is more than 10 minutes.

[0021] In another case, the resin in the high-performance resin-based reinforced fabric is a thermosetting resin, the preset temperature is between 120° C. and 160° C., and the constant temperature maintaining time is more than 40 minutes.

[0022] Furthermore, the mold is preset with a slot for the external wiring port 202 .

[0023] Furthermore, the pressurizing process is performed by using bolt fastening or a hydraulic press.

[0024] Furthermore, the pressure range of the pressurization process is 0.1 MPa to 10 MPa.

[0025] Technical Effects

[0026] 1. This invention utilizes a sandwich-style integrated hot-pressing process (co-curing the lower fiberboard layer, sensor module sheet, and upper fiberboard layer simultaneously). During the heating-pressurizing-cooling cycle, the resin matrix simultaneously solidifies the fiber layer and sensor module sheet into a single unit. Mold geometry ensures alignment of the strain-sensing unit within the fiber layer. This eliminates the need for post-bonding steps, resulting in a more compact structure, a secure bond between the sensor unit and the matrix, stable signals, a simplified production process, and reduced assembly complexity and cost.

[0027] 2. The present invention can adapt to the design of precision molds with complex curved surfaces. The upper and lower molds are precisely machined according to the target curved surface, and the overall closure is achieved through bolts or hydraulic partition locking. The uniform temperature field and controlled pressurization ensure that the resin can fully flow and fill in the complex geometry, and the molding of complex free-form surface parts such as bends and multiple curved surfaces can be completed in one go. The compliance and sensing functions are integrated simultaneously, broadening the scope of application in flexible robots and special parts.

[0028] 3. The high-temperature resistant flexible PCB of the present invention is linked to the reserved slot of the mold, adopts a high-temperature compatible flexible PCB (such as a PI insulated flexible PCB), and presets a slot for the external wiring port 202 in the mold, so that the PCB maintains controlled bending and avoids pulling during the molding and demolding process. After molding, the PCB is complete and the signal path is reliable. The plug-and-play interface eliminates the need for secondary welding or wiring, thereby improving overall durability and facilitating subsequent maintenance and system integration.

[0029] The concept, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a finished product image of a compliant-perceiving integrated curved auxiliary material plate according to a preferred embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the detailed internal structure of a compliant-sensing integrated bending auxiliary material plate according to a preferred embodiment of the present invention;

[0032] Figure 3 This is a detailed structural diagram of the internal sensing module of the compliance-sensing integrated bending auxiliary material plate of a preferred embodiment of the present invention;

[0033] Figure 4 It is a schematic diagram of the assembly of a compliant-sensing integrated bending auxiliary material plate forming mold in a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0034] The following describes several preferred embodiments of the present invention with reference to the accompanying drawings to make its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0035] In the drawings, components with identical structures are denoted by the same reference numerals, and components with similar structures or functions are denoted by similar reference numerals. The size and thickness of each component shown in the drawings are arbitrary and are not limited by the present invention. For clarity, the thickness of components in some places in the drawings is appropriately exaggerated.

[0036] For the convenience of description, the words "up", "down", "left" and "right" appearing in the present invention only indicate that they are consistent with the up, down, left and right directions in the drawings, and do not limit the structure. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they cannot be understood as limiting the present invention.

[0037] Example 1

[0038] As described in the background technology, in order to solve the problem that the compliance and sensing functions cannot be effectively integrated in the prior art and the process application range is limited, the present invention proposes a compliance-sensing integrated bending auxiliary material plate, the specific structure of which is as follows: Figure 1 and Figure 2As shown. In this embodiment, the curved auxiliary material plate includes an upper fiberboard 100, a sensing module sheet 200 and a lower fiberboard 300, and the three are integrated through an integrated hot pressing molding process. The upper fiberboard 100 and the lower fiberboard 300 are made of high-performance resin-based reinforced fabrics, and the high-performance resin-based reinforced fabrics include but are not limited to carbon fiber fabrics and glass fiber fabrics. The sensing module sheet 200 adopts a high-temperature resistant flexible PCB, and the sensing module sheet 200 is provided with a strain-type sensing unit 201 and an external wiring port 202. The types of the strain-type sensing unit 201 include but are not limited to resistive, capacitive, and piezoelectric structures. The strain-type sensing unit 201 can effectively sense the local deformation of the auxiliary material board after being loaded and convert it into a corresponding electrical signal. The electrical signal is led out to the outside through the external wiring port 202 to realize real-time monitoring of the deformation state of the overall structure and the load size. The shell of the external wiring port 202 can be made of PEEK engineering plastic, which can withstand temperatures of up to 260°C.

[0039] Example 2

[0040] Figure 4 A method for manufacturing a compliant-sensing integrated curved auxiliary material plate is shown.

[0041] During the implementation of the specific process,

[0042] First, a release cloth is laid on the mold lower part 500 and the mold upper part 400 or a high-temperature fluoropolymer release agent is applied.

[0043] Then the lower fiberboard 300 is precisely laid on the lower half of the mold 500; then the sensing module 200 is laid on the surface of the lower fiberboard 300 according to the designed positioning. The mold can reserve a slot for the external wiring port 202 to ensure that the PCB is complete and the signal path is reliable after molding. The interface is plug-and-play, eliminating the need for secondary welding or patching; then the upper fiberboard 100 is laid on top of the sensing module 200, and the three-layer structure is stacked and positioned.

[0044] The upper part 400 of the mold is closed and pressurized by bolt tightening or hydraulic press. The pressurization range can be controlled between 0.1MPa and 10MPa. The specific pressure is determined according to the number and thickness of the auxiliary material plates.

[0045] In this embodiment, when the resin in the upper and lower fiberboards is a thermoplastic resin (including but not limited to PET, PEN, LCP, PEEK, PA6, PA12), the entire mold is evenly heated to between 180°C and 250°C through an electric heating table or a special oven, and this temperature is kept constant for not less than 10 minutes, so that the resin is fully melted and penetrates the fiber fabric, and is tightly combined under pressure and cooled and crystallized. Subsequently, a gradual cooling method is adopted to ensure stable product performance. After the mold is cooled to room temperature, it can be demolded.

[0046] When the resin in the upper and lower fiberboards is a thermosetting resin (such as epoxy resin, phenolic resin, BCB, cyanate ester, etc.), the mold is heated to a temperature range of 120°C to 160°C through the same heating equipment and maintained at a constant temperature for no less than 40 minutes to ensure that the resin is completely cross-linked and cured, and to achieve full fusion of the fiber fabric and the sensing module sheet. The cooling process is natural or air-cooled until it reaches room temperature and then demolded and taken out.

[0047] In this embodiment, the sensing module 200 may be pre-processed in advance. The pre-processing method is as follows:

[0048] When the resin in the upper and lower fiberboards is a thermoplastic resin (including but not limited to PET, PEN, LCP, PEEK), the sensing module preferably uses a polyetheretherketone (PEEK) flexible printed circuit board. The pretreatment steps of the polyetheretherketone (PEEK) flexible printed circuit board are hollowing and sandblasting, as follows:

[0049] Hollowing: A width of more than 1.0 mm is retained along all line edges and component edges of the polyetheretherketone (PEEK) flexible printed circuit board, and the rest of the area is hollowed out to ensure that both the rigidity of the board and the permeability of the resin are taken into account during molding.

[0050] Sandblasting: Use 50μm~75μm glass beads for sandblasting for 30s~60s to obtain a surface roughness of Ra=0.3μm~0.7μm to enhance the mechanical meshing properties of the resin.

[0051] When the resin in the upper and lower fiberboards is a thermosetting resin (such as epoxy resin, phenolic resin, BCB, cyanate ester, etc.), the sensing module 200 preferably uses a polyimide (PI) flexible printed circuit board. The pretreatment steps of the polyimide (PI) flexible printed circuit board are hollowing, mechanical roughening, and chemical activation, as follows:

[0052] Hollowing: A width of more than 0.5mm is retained along all edges of the circuits and components of the polyimide (PI) flexible printed circuit board, and the rest of the area is hollowed out to facilitate full penetration and wrapping of the resin from bottom to top during the molding process;

[0053] Mechanical roughening: Use #400-#600 sandpaper to lightly polish the surface of the polyimide (PI) flexible printed circuit board at room temperature to form a micron-scale concave-convex structure with a surface arithmetic average height Ra≈0.5μm-1.0μm;

[0054] Chemical activation: The polished polyimide (PI) flexible printed circuit board is immersed in a 0.1 mol / L alkaline persulfate solution for 5 to 10 minutes, then rinsed with deionized water and dried at 80°C for 20 minutes to introduce hydroxyl and carboxyl functional groups on the surface, thereby improving the chemical bonding strength with the thermosetting resin.

[0055] After the conforming-sensing integrated bending auxiliary material plate is demoulded, a signal connectivity test can be performed on the circuit connecting the external wiring port 202 and the sensing module 200 to ensure that all strain sensing units 201 are in normal working condition.

[0056] like Figure 3 As shown, when the strain sensing unit 201 is in use of the auxiliary material board, the structure is locally deformed when subjected to external loads, causing changes in the resistance or capacitance of the strain unit. The change signal is transmitted to the signal processing system via the external wiring port 202. By knowing the elastic model and deformation characteristics of the auxiliary material board, the overall load state and deformation distribution of the auxiliary material board can be accurately calculated.

[0057] In actual applications, the mold lower section 500 and upper section 400 can be designed with various structural forms, including but not limited to curved shapes, complex multi-surface shapes, or spiral twists, to fully meet the needs of various robotic and mechanical component applications. Furthermore, parameters such as the thickness, fiber orientation, fiber type, and number of plies of the auxiliary material can be flexibly adjusted to meet actual project requirements, providing extensive design freedom.

[0058] The manufacturing process of the compliant-perceiving integrated bending auxiliary plate disclosed in this embodiment has the characteristics of simple process operation, high dimensional accuracy of the formed product, stable structural performance, and reliable perception accuracy. It is particularly suitable for fields with high requirements for structural compliance and deformation perception, such as robot end effectors, robotic arm connection parts, and flexible transmission components. The preferred specific embodiments of the present invention are described in detail above. It should be understood that ordinary technology in this field can make many modifications and changes based on the concept of the present invention without creative labor. Therefore, all technical solutions that can be obtained by technical personnel in this technical field through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of existing technology should be within the scope of protection determined by the claims.

Claims

1. A compliant-sensing integrated curved auxiliary material plate, characterized by: The invention comprises an upper fiberboard (100), a sensing module sheet (200) and a lower fiberboard (300), which are integrated through an integrated hot pressing process. The upper fiberboard (100) and the lower fiberboard (300) are high-performance resin-based reinforced fabrics. The sensing module sheet (200) comprises a strain sensing unit (201) and an external wiring port (202). The strain sensing unit (201) senses the local deformation of the auxiliary material board after being loaded and converts it into a corresponding electrical signal, which is then led to the outside through the external wiring port (202).

2. The compliant-sensing integrated curved auxiliary material plate according to claim 1, characterized in that: The high-performance resin-based reinforcing fabric is a carbon fiber fabric or a glass fiber fabric.

3. The compliant-sensing integrated curved auxiliary material plate according to claim 1, characterized in that: The resin in the high-performance resin-based reinforced fabric is a thermoplastic resin or a thermosetting resin.

4. The compliant-sensing integrated curved auxiliary material plate according to claim 1, characterized in that: The sensing module (200) is a resistive, capacitive or piezoelectric structure.

5. A method for manufacturing the compliant-sensing integrated bending auxiliary plate according to any one of claims 1 to 4, characterized in that: The following steps are involved: S1: Laying a release cloth or applying a high-temperature fluoropolymer release agent on the lower half (500) and the upper half (400) of the mold; S2: accurately laying the lower fiberboard (300) on the lower half of the mold (500), laying the sensing module sheet (200) on the surface of the lower fiberboard (300) according to the designed positioning, and laying the upper fiberboard (100) on top of the sensing module sheet (200), and completing the stacking and positioning of the three-layer structure; S3: Covering the upper part (400) of the mold, and performing a pressurization process on the upper part (400) of the mold and the lower part (500) of the mold; S4: The entire mold is uniformly heated, and after reaching the preset temperature, the temperature is maintained constant for a certain period of time. After the entire mold is cooled to room temperature, the mold is demoulded and the integrated bending auxiliary material plate is taken out.

6. A manufacturing method according to claim 5, characterized in that: The resin in the high-performance resin-based reinforced fabric is a thermoplastic resin, the preset temperature is between 180° C. and 250° C., and the constant temperature maintaining time is more than 10 minutes.

7. A manufacturing method according to claim 5, characterized in that: The resin in the high-performance resin-based reinforced fabric is a thermosetting resin, the preset temperature is between 120° C. and 160° C., and the constant temperature maintaining time is more than 40 minutes.

8. A manufacturing method according to claim 5, characterized in that: The mold is pre-set with a slot for an external wiring port (202).

9. A manufacturing method according to claim 5, characterized in that: The pressurizing process is performed by using bolts or a hydraulic press.

10. A manufacturing method according to claim 5, characterized in that: The pressure range of the pressurization process is 0.1 MPa to 10 MPa.

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