Heat dissipation structure and manufacturing method of OSFP (Optical Small Form-factor Pluggable) optical module

Abstract

The invention discloses a heat dissipation structure of an OSFP optical module, which comprises a cage and an optical module body, and further comprises an upper heat dissipation pipe surface and a lower heat dissipation pipe surface, cooling liquid circulates in the upper heat dissipation pipe surface and the lower heat dissipation pipe surface, and the upper heat dissipation pipe surface and the lower heat dissipation pipe surface are respectively connected to the upper surface and the lower surface of the optical module body. Outlets on one sides of the upper radiating tube surface and the lower radiating tube surface are connected through a connecting tube, outlets on the other sides of the upper radiating tube surface and the lower radiating tube surface are respectively connected with a sealing structure or a circulating structure, and the part, covering the upper radiating tube surface and the lower radiating tube surface, of the optical module body is inserted into the cage. The OSFP optical module has the advantage that the heat dissipation efficiency is improved on the basis of not changing the protocol structure of the OSFP optical module body. The invention further discloses a manufacturing method of the heat dissipation structure of the OSFP optical module, and the method adopts low-cost materials and processes to improve the materials, forming and assembling modes of the upper shell heat sink and the lower shell heat sink.

Description

Technical Field

[0001] The present invention relates to the field of OSFP optical modules, and in particular to a heat dissipation structure, a manufacturing method and an assembly method of an OSFP optical module. Background Art

[0002] With the rapid development of the optical communications industry, optical modules are achieving higher speeds and higher density of electronic components. However, the size of optical modules has been fixed by standard protocols, which results in an increasing amount of heat generated per unit volume. The heat dissipation problem of high-speed optical modules needs to be solved urgently.

[0003] OSFP modules are the largest optical modules currently used in the packaging of 800G, 1.6T, and even 3.2T optical modules. Due to their use in high-speed modules, the standard developers took into account the need for heat dissipation and provided ample space above and below them. The standard also recommends several heat dissipation arrangements. Modules with large upper surface areas typically utilize heat sink fins to increase convection heat dissipation. Modules with limited lower surface areas typically utilize direct heat conduction for heat dissipation. This is also the heat dissipation approach used by mainstream modules on the market.

[0004] While fin-type heat dissipation is effective, it alone cannot provide an optimal solution for high-speed modules with increasing power consumption. Furthermore, optical modules are designed to be used within a cage, which is soldered to the switch's PCB. This results in poor heat dissipation on the module's underside and large temperature differences across the module. These factors hinder the development of high-speed products.

[0005] Therefore, the present invention proposes a heat dissipation structure and manufacturing method for an OSFP optical module, which adopts low-cost materials and processes, and improves the materials, forming, and assembly methods of the upper and lower shell heat sinks, thereby achieving efficient heat dissipation capabilities for the OSFP type optical module without changing the protocol structure of the optical module. Summary of the Invention

[0006] The technical problem to be solved by the present invention is that the existing OSFP optical module cannot provide an optimal solution by relying solely on heat dissipation fins, and the heat dissipation difference on the lower surface of the module leads to a large temperature difference in the entire module.

[0007] To solve the above technical problems, the first objective of the present invention is to propose a heat dissipation structure for an OSFP optical module, namely, an upper heat dissipation pipe surface and a lower heat dissipation pipe surface are respectively provided on the upper and lower surfaces of the optical module body to avoid the problem of poor heat dissipation on the lower surface of the module. At the same time, the upper and lower heat dissipation pipe surfaces include two heat dissipation methods: water cooling and heat conduction by heat dissipation fins to improve the heat dissipation efficiency of the OSFP optical module.

[0008] The specific technical solutions adopted are as follows: A heat dissipation structure and manufacturing method for an OSFP optical module, comprising a cage and an optical module body, characterized in that the structure further comprises an upper heat dissipation pipe surface and a lower heat dissipation pipe surface, wherein the upper heat dissipation pipe surface and the lower heat dissipation pipe surface are respectively connected to the upper and lower surfaces of the optical module body, the outlets on one side of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface are connected by a connecting pipe, and the outlets on the other side of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface are respectively connected to a sealing structure or a circulation structure, and the portion of the optical module body covering the upper heat dissipation pipe surface and the lower heat dissipation pipe surface is inserted into the cage.

[0009] Furthermore, the optical module body includes an upper cover, a lower shell and a PCB board. The upper cover and the lower shell are connected, and the PCB board is installed inside the upper cover and the lower shell. The bottom side of the lower shell is connected to a pull ring, and the PCB board is installed inside the upper cover and the lower shell to protect the PCB board. The pull ring facilitates the insertion and removal of the optical module body in the cage.

[0010] Furthermore, a first mounting groove for mounting an upper heat dissipation pipe surface is provided on the outer surface of the upper cover, and a second mounting groove for mounting a lower heat dissipation pipe surface is provided on the outer surface of the lower shell. The parts of the upper cover and the lower shell provided with the first mounting groove and the second mounting groove are plugged into the inside of the cage, and sunken first mounting grooves and second mounting grooves are provided on the surfaces of the upper cover and the lower shell to improve the heat dissipation efficiency of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface.

[0011] Furthermore, the upper heat dissipation pipe surface and the lower heat dissipation pipe surface are respectively connected to the inside of the first mounting groove and the second mounting groove, and the area of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface is larger than the area of the PCB board, ensuring that the contact area between the upper heat dissipation pipe surface and the lower heat dissipation pipe surface and the optical module body is large enough to ensure the heat conduction effect.

[0012] Furthermore, the upper heat dissipation pipe surface includes a first copper tube assembly and heat dissipation fins. The first copper tube assembly is installed inside the first installation groove. The surface of the first copper tube assembly is connected to the heat dissipation fins, which not only dissipates heat through the coolant inside the first assembly but also conducts heat through the heat dissipation fins.

[0013] Furthermore, the lower heat dissipation pipe surface is a second copper pipe assembly, and the second copper pipe assembly is installed inside the second installation groove, dissipating heat on both sides to improve heat dissipation efficiency.

[0014] Furthermore, the first copper tube assembly and the second copper tube assembly are formed by bending copper tube material, the copper tube material is T2 copper tube material, and the diameter of the copper tube material is 0.5-4mm. The first copper tube assembly and the second copper tube assembly are simple to manufacture, which reduces the manufacturing cost of the entire heat dissipation structure.

[0015] Furthermore, the sealing structure is a pipe cap, which seals the upper heat dissipation pipe surface outlet and the lower heat dissipation pipe surface outlet to form a heat conductor.

[0016] Furthermore, the circulation structure includes an upper liquid guide pipe, a lower liquid guide pipe and a circulation pump. The upper liquid guide pipe and the lower liquid guide pipe pass through the cage and are respectively connected to the circulation pump that drives the coolant circulation. The upper liquid guide pipe and the lower liquid guide pipe are respectively connected to the outlet on one side of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface.

[0017] The second objective of the present invention is to provide a method for manufacturing a heat dissipation structure of an OSFP optical module, comprising the following steps:.

[0018] S1: Fill the copper tube with soft material and preheat it; S2: The copper tube material is repeatedly bent 90° in a bending die using a preheated filler bending process to form a first copper tube assembly and a second copper tube assembly; S3: Electrolessly tinning the surfaces of the first copper tube assembly and the second copper tube assembly, and then filling the gap between the cylindrical surfaces of the copper tube materials with solder to increase the contact area with the optical module body; S4: Installing the first copper tube assembly and the second copper tube assembly on the upper surface and the lower surface of the optical module body respectively; S5: Installing heat dissipation fins on the first copper tube assembly installed on the upper surface of the optical module body to form an upper heat dissipation pipe surface, and the second copper tube assembly to form a lower heat dissipation pipe surface; S6: Connect one side outlet of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface through a connecting pipe; S7: The outlets on the other side of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface are connected to provide a cooling water circulation structure or a connection sealing structure for sealing.

[0019] The upper heat dissipation pipe surface and the lower heat dissipation pipe surface are formed by bending the copper tube material, which simplifies the manufacturing process of the heat dissipation structure and reduces the manufacturing cost of the heat dissipation structure.

[0020] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention improves the heat dissipation efficiency of the heat dissipation structure by respectively providing an upper heat dissipation pipe surface and a lower heat dissipation pipe surface on the upper and lower surfaces of the optical module body; 2. The present invention realizes liquid cooling of the optical module body by using the upper and lower heat dissipation pipe surfaces, and improves the heat dissipation efficiency by coordinating the heat dissipation of the heat fins inside the upper and lower heat dissipation pipe surfaces; 3. The upper and lower heat dissipation pipe surfaces of the present invention are installed on the outer surface of the optical module body, which is convenient for manufacturing and assembly, does not occupy the internal space of the module, and does not affect the insertion and removal of the optical module body in the cage; 4. The upper heat dissipation pipe surface and the lower heat dissipation pipe of the present invention are formed by bending T2 copper pipes, which are easy to manufacture and have low cost; 5. The heat dissipation structure of the present invention can adjust the outlets on one side of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface to be connected with the sealing structure or the circulation structure according to the power and heat dissipation requirements of the optical module body to meet the needs of multiple scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is an exploded schematic diagram of the structure of the OSFP optical module of the present invention; Figure 2 Schematic diagram of the three-dimensional structure of the OSFP optical module of the present invention; Figure 3 Schematic diagram of the exploded structure of the heat dissipation structure of the OSFP optical module of the present invention; Figure 4 It is a schematic diagram of the connection between the upper heat dissipation pipe surface and the lower heat dissipation pipe surface; Figure 5 This is a structural diagram of the upper heat dissipation pipe surface and the lower heat dissipation pipe surface when working alone; Figure 6 This is a schematic diagram of the structure of the heat dissipation pipe surface installed on the upper shell; Figure 7 This is a structural diagram of the lower heat dissipation pipe surface installed on the lower shell; Figure 8 Schematic diagram of the internal structure of the heat dissipation structure connection circulation structure of the OSFP optical module of the present invention; Figure 9 It is a schematic diagram of the heat dissipation structure connection loop structure of the OSFP optical module of the present invention.

[0022] Among them, 100, cage; 200, upper cover; 300, lower shell; 400, soldering or thermal adhesive; 500, PCB board; 600, pull ring; 700, pipe cap; 800, circulation pump; 201, upper heat dissipation pipe surface; 202, upper liquid guide pipe; 203, heat dissipation fin; 204, first installation slot; 205, first copper tube assembly; 301, lower heat dissipation pipe surface; 302, lower liquid guide pipe; 303, connecting pipe; 304, second installation slot; 305, second copper tube assembly. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clear, the following Figures 1-9 The present invention is further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other. Example 1

[0024] like Figure 1-9 As shown, this embodiment is a heat dissipation structure of an OSFP optical module, including a cage 100 and an optical module body, and also includes an upper heat dissipation pipe surface 201 and a lower heat dissipation pipe surface 301 .

[0025] The optical module body is plugged into the cage 100. The plugging method of the optical module body and the cage 100 is the existing technology, mainly using physical guide rails to limit the plugging. There is a row of gold-plated copper foil contacts, namely gold fingers, at the bottom of the optical module body. When inserted, these contacts precisely mate with the elastic contact pieces inside the cage 100 and then perform mechanical locking.

[0026] The cage 100 protects the optical module body and shields external electromagnetic interference. The cage 100 is usually made of metal material with good thermal conductivity, which can help the optical module dissipate heat.

[0027] The optical module body needs to be frequently plugged in and out in the cage 100 , so this application does not change the original protocol structure of the optical module body, ensuring that the optical module body can be used normally in the cage 100 .

[0028] The upper heat pipe surface 201 and the lower heat pipe surface 301 are respectively installed on the upper surface and the lower surface of the optical module body. The outlets on the same side of the upper heat pipe surface 201 and the lower heat pipe surface 301 are connected by a connecting pipe 303 to realize the flow of cooling water on the upper heat pipe surface 201 and the lower heat pipe surface 301. The upper heat pipe surface 201 and the lower heat pipe surface 301 simultaneously perform water cooling on the optical module body to ensure the heat dissipation effect of the entire heat dissipation structure.

[0029] The outlets on the other side of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 can be connected to a sealing structure or a circulation structure according to the power and heat dissipation requirements of the optical module body.

[0030] When the power of the optical module body is low and the heat dissipation demand is small, the connecting tube 303 is removed, the outlet of the connecting tube 303 is connected to the upper heat pipe surface 201 and the lower heat pipe surface 301, and the sealing structure is connected. High thermal conductivity coolant is input into the interior from the other outlet of the upper heat pipe surface 201 and the lower heat pipe surface 301, and the high thermal conductivity coolant is filled into the upper heat pipe surface 201 and the lower heat pipe surface 301. The coolant input outlet of the upper heat pipe surface 20 and the lower heat pipe surface 301 is sealed with the sealing structure to form a liquid-cooled heat dissipation conductor.

[0031] When the power of the optical module body is high and the heat dissipation demand is large, the outlets of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are connected to a circulation structure, and the coolant flows between the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 through the circulation structure to cool the circulating coolant.

[0032] The optical module body includes an upper cover 200, a lower shell 300 and a PCB board 500. The upper cover 200 and the lower shell 300 are welded to form a cavity for installing the PCB board 500. The PCB board 500 is welded and installed inside the cavity. The upper cover 200 and the lower shell 300 play a protective role for the PCB board 500.

[0033] A pull ring 600 is welded to the bottom side of the lower shell 300 to help users remove and insert the optical module body.

[0034] A first mounting groove 204 is provided on the surface of the upper cover 200 and is recessed toward the PCB board 500. A second mounting groove 304 is provided on the surface of the lower shell 300 and is recessed toward the PCB board 500. The upper heat dissipation pipe surface 201 is installed in the first mounting groove 204, and the lower heat dissipation pipe surface 301 is installed in the second mounting groove 304.

[0035] The upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are installed in the first installation groove 204 and the second installation groove 304 by soldering or using thermal conductive adhesive 400.

[0036] The first mounting groove 204 and the second mounting groove 304 form a heat sink space to improve the heat dissipation effect of the heat dissipation structure, and the concave mounting of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 on the surface of the lower shell 300 and the upper cover 200 will not change the protocol structure of the original optical module body.

[0037] The areas of the upper heat pipe surface 201 and the lower heat pipe surface 301 installed on the upper cover 200 and the lower shell 300 are larger than the area of the PCB board 500, ensuring the heat dissipation effect of the PCB board 500, and the upper heat pipe surface 201 and the lower heat pipe surface 301 installed on the upper cover 200 and the lower shell 300 are partially inserted into the cage 100.

[0038] The upper heat dissipation pipe surface 201 includes a first copper tube assembly 205 and a heat dissipation fin 203. The first copper tube assembly 205 is installed inside the first installation groove 204. The first copper tube assembly 205 is installed inside the first installation groove 204 by soldering or thermal conductive glue 400. The surface of the first copper tube assembly 205 is connected to the heat dissipation fin 203. While the first copper tube assembly 205 is liquid-cooled, the heat dissipation fin 203 is also conducted and dissipated, thereby improving the heat dissipation effect.

[0039] The lower heat dissipation pipe surface 301 is a second copper pipe assembly 305, which is installed inside the second installation groove 304 by soldering or thermal conductive adhesive 400, achieving double-sided heat dissipation on the upper and lower surfaces of the optical module body, thereby improving the heat dissipation effect.

[0040] The surface of the first copper tube assembly 205 is fixedly connected to the heat dissipation fins 203 by soldering or bonding with thermal conductive adhesive, so that the optical module body can dissipate heat through the heat dissipation fins 203 while being liquid-cooled by the copper tube assembly, thereby improving the heat dissipation effect of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301.

[0041] When the optical module body is inserted into the cage 100 , the heat dissipation fins 203 contact the inner surface of the cage 100 to ensure heat conduction, and the height of the heat dissipation fins 203 is controlled to control the height of the entire upper heat dissipation pipe surface 201 within the protocol standard.

[0042] The first copper tube assembly 205 and the second copper tube assembly 305 are formed by bending copper tube material back and forth. The copper tube material is T2 copper tube material with a diameter of 0.5-4 mm. The first copper tube assembly 205 and the second copper tube assembly 305 are simple to manufacture, which reduces the manufacturing cost of the entire heat dissipation structure.

[0043] The gaps between the cylindrical surfaces of the copper tube material are filled with solder to increase the contact area between the first copper tube assembly 205 and the second copper tube assembly 305 and the upper cover 200 and the lower shell 300, thereby ensuring the heat dissipation effect of the upper heat dissipation tube surface 201 and the lower heat dissipation tube surface 301.

[0044] Both outlets of the copper tube material are provided with external threads and internal threads for connecting to the connecting pipe 303 or the circulation pump 800 .

[0045] The directions of the upper heat pipe surface 201 and the lower heat pipe surface 301 are consistent with the length direction of the optical module body, and the two outlets of the first copper tube assembly 205 and the second copper tube assembly 305 are both arranged in the opening direction of the optical module body, ensuring that the coolant has a long contact time with the surface of the optical module body when flowing in the upper heat pipe surface 201 and the lower heat pipe surface 301, and the outlets of the first copper tube assembly 205 and the second copper tube assembly 305 can facilitate the input and discharge of coolant.

[0046] The outlets on the other side of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are respectively connected to the sealing structure or circulation structure. The sealing structure is a pipe cap 700. The outlets of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are connected to the pipe cap 700 by threads or glue.

[0047] When the power of the optical module body is low and the heat dissipation demand is small, the connecting pipe 303 connecting the upper heat pipe surface 201 and the lower heat pipe surface 301 is removed, and the outlet connecting pipe cap 700 connected to the connecting pipe 303 is sealed. High thermal conductivity coolant is input into the interior from the other outlet of the upper heat pipe surface 201 and the lower heat pipe surface 301, and the high thermal conductivity coolant is filled into the upper heat pipe surface 201 and the lower heat pipe surface 301. The coolant input outlets of the upper heat pipe surface 20 and the lower heat pipe surface 301 are sealed with a sealing structure to form a liquid-cooled heat dissipation conductor.

[0048] The circulation structure includes an upper liquid conduit 202, a lower liquid conduit 302 and a circulation pump 800. One end of the upper liquid conduit 202 and the lower liquid conduit 302 is connected to the circulation pump 800, and the other end of the upper liquid conduit 202 and the lower liquid conduit 302 is connected to the outlet of the first copper tube assembly 205 and the second copper tube assembly 305 of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301. The circulation pump 800 drives the cooling water in the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 to circulate, and the circulation pump 800 is equipped with a cooling system inside to cool the circulating coolant to ensure the heat dissipation effect of the circulation structure.

[0049] The cooling system of the circulation pump 800 in this embodiment is based on existing technology, including air cooling, TEC cooling, etc.

[0050] When the power of the optical module body is high and the heat dissipation demand is large, the circulation pump 800 drives the cooling water to circulate inside the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 and cools the cooling water circulating through the circulation pump 800. Example 2

[0051] A method for manufacturing a heat dissipation structure of an OSFP optical module is provided, comprising the following steps: S1: Fill the copper tube with soft material and preheat it; The copper tube material in step S1 is T2 copper tube material, and the diameter of the copper tube material is 0.5-4 mm. This material is widely available and relatively cheap, which reduces the manufacturing cost of the heat dissipation structure.

[0052] S2: The copper tube material is repeatedly bent 90° in a bending die using a preheated filler bending process to form a first copper tube assembly 205 and a second copper tube assembly 305; In step S2, a preheated filling bending process is used. First, the copper tube is filled with a soft material, in this embodiment, sand, and preheated to prevent wrinkling, cracking, and stress in the tube wall during the bending process. The copper tube is then repeatedly bent 90° in a bending die. The bending process is simple, making the heat dissipation structure manufacturing method simpler than existing technologies.

[0053] S3: Electrolessly tinning the surfaces of the first copper tube assembly 205 and the second copper tube assembly 305, and then filling the gaps between the cylindrical surfaces of the copper tube materials with solder to increase the contact area with the optical module body; S4: Install the first copper tube assembly 205 and the second copper tube assembly 305 on the upper surface and the lower surface of the optical module body respectively; In step S4, concave mounting grooves are respectively provided on the upper and lower surfaces of the optical module body for mounting the first copper tube assembly 205 and the second copper tube assembly 305, so that the mounting of the first copper tube assembly 205 and the second copper tube assembly 305 does not change the volume size of the optical module body.

[0054] S5: Install heat dissipation fins 203 on the first copper tube assembly 205 installed on the upper surface of the optical module body to form an upper heat dissipation pipe surface 201. The second copper tube assembly 305 forms a lower heat dissipation pipe surface 301. The upper heat dissipation pipe surface 201 simultaneously has liquid cooling and heat dissipation of the coolant inside the first copper tube assembly 205 and heat conduction and heat dissipation of the heat dissipation fins 203, thereby improving heat dissipation efficiency.

[0055] S6: Connect one side outlet of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 through the connecting pipe 303; The cooling liquid can flow from the upper heat dissipation pipe surface 201 to the lower heat dissipation pipe surface 301 to achieve heat dissipation on the upper and lower surfaces of the optical module body.

[0056] S7: The outlets on the other side of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are connected to provide a cooling water circulation structure or a sealing structure for sealing; Connect the sealing structure or the circulation structure according to the power and heat dissipation requirements of the optical module body.

[0057] When the power of the optical module body is low and the heat dissipation demand is small, the connecting tube 303 is removed, the outlet of the connecting tube 303 is connected to the upper heat pipe surface 201 and the lower heat pipe surface 301, and the sealing structure is connected. High thermal conductivity coolant is input into the interior from the other outlet of the upper heat pipe surface 201 and the lower heat pipe surface 301, and the high thermal conductivity coolant is filled into the upper heat pipe surface 201 and the lower heat pipe surface 301. The coolant input outlet of the upper heat pipe surface 20 and the lower heat pipe surface 301 is sealed with the sealing structure to form a liquid-cooled heat dissipation conductor.

[0058] When the power of the optical module body is high and the heat dissipation demand is large, the outlets of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are connected to a circulation structure, and the coolant flows between the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 through the circulation structure to cool the circulating coolant.

[0059] Heat dissipation principle: The upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 dissipate heat on the upper and lower surfaces of the optical module body. The flow mode of the internal coolant of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 is selected according to the power and heat dissipation requirements of the optical module body. When the power of the optical module body is low and the heat dissipation requirement is small, the connecting pipe 303 is disassembled, the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301 are connected to the outlet connection sealing structure of the connecting pipe 303, and high thermal conductivity coolant is input into the interior from the other outlet of the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301, and the high thermal conductivity coolant is filled in the upper heat dissipation pipe surface 201 and the lower heat dissipation pipe surface 301. The heat pipe surface 301 is sealed with a sealing structure to form a liquid-cooled heat dissipation conductor. When the power of the optical module body is high and the heat dissipation demand is large, the outlets of the upper heat pipe surface 201 and the lower heat pipe surface 301 are connected to a circulation structure. The circulation structure allows the coolant to flow between the upper heat pipe surface 201 and the lower heat pipe surface 301 and cool the circulating coolant, meeting the needs of various scenarios. When the coolant inside the upper heat pipe surface 201 and the lower heat pipe surface 301 dissipates heat for the optical module body, it also dissipates heat through the heat dissipation fins 203, thereby improving heat dissipation efficiency.

[0060] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation structure of an OSFP optical module, comprising a cage (100) and an optical module body, characterized in that: The optical module further comprises an upper heat dissipation tube surface (201) and a lower heat dissipation tube surface (301), wherein cooling liquid circulates inside the upper heat dissipation tube surface (201) and the lower heat dissipation tube surface (301), and the upper heat dissipation tube surface (201) and the lower heat dissipation tube surface (301) are respectively connected to the upper and lower surfaces of the optical module body, and outlets on one side of the upper heat dissipation tube surface (201) and the lower heat dissipation tube surface (301) are connected through a connecting tube (303), and outlets on the other side of the upper heat dissipation tube surface (201) and the lower heat dissipation tube surface (301) are respectively connected to a sealing structure or a circulation structure, and the portion of the optical module body covering the upper heat dissipation tube surface (201) and the lower heat dissipation tube surface (301) is plugged into the cage (100).

2. The heat dissipation structure of the OSFP optical module according to claim 1, characterized in that: The optical module body comprises an upper cover (200), a lower shell (300) and a PCB board (500); the upper cover (200) and the lower shell (300) are connected; the PCB board (500) is installed inside the upper cover (200) and the lower shell (300); and the bottom side of the lower shell (300) is connected to a pull ring (600).

3. The heat dissipation structure of the OSFP optical module according to claim 2, characterized in that: The outer surface of the upper cover (200) is provided with a first mounting groove (204) for mounting the upper heat dissipation pipe surface (201), and the outer surface of the lower shell (300) is provided with a second mounting groove (304) for mounting the lower heat dissipation pipe surface (301). The portions of the upper cover (200) and the lower shell (300) provided with the first mounting groove (204) and the second mounting groove (304) are inserted into the interior of the cage (100).

4. The heat dissipation structure of the OSFP optical module according to claim 3, characterized in that: The upper heat dissipation pipe surface (201) and the lower heat dissipation pipe surface (301) are respectively connected to the inside of the first installation groove (204) and the second installation groove (304), and the areas of the upper heat dissipation pipe surface (201) and the lower heat dissipation pipe surface (301) are larger than the area of the PCB board (500).

5. The heat dissipation structure of the OSFP optical module according to claim 4, characterized in that: The upper heat dissipation tube surface (201) comprises a first copper tube assembly (205) and heat dissipation fins (203); the first copper tube assembly (205) is installed inside the first installation groove (204); and the surface of the first copper tube assembly (205) is connected to the heat dissipation fins (203).

6. The heat dissipation structure of the OSFP optical module according to claim 5, characterized in that: The lower heat dissipation pipe surface (301) is a second copper pipe assembly (305), and the second copper pipe assembly (305) is installed inside the second installation groove (304).

7. The heat dissipation structure of the OSFP optical module according to claim 6, characterized in that: The first copper tube assembly (205) and the second copper tube assembly (305) are formed by bending a copper tube material, the copper tube material is a T2 copper tube material, and the diameter of the copper tube material is 0.5-4 mm.

8. The heat dissipation structure of the OSFP optical module according to claim 1, characterized in that: The sealing structure is a tube cap (700).

9. The heat dissipation structure of the OSFP optical module according to claim 1, characterized in that: The circulation structure includes an upper liquid guide tube (202), a lower liquid guide tube (302) and a circulation pump (800). The upper liquid guide tube (202) and the lower liquid guide tube (302) pass through the cage (100) and are respectively connected to the circulation pump (800) for driving the circulation of the coolant. The upper liquid guide tube (202) and the lower liquid guide tube (302) are respectively connected to the outlets on one side of the upper heat dissipation pipe surface (201) and the lower heat dissipation pipe surface (301).

10. The method for manufacturing the heat dissipation structure of an OSFP optical module according to any one of claims 1 to 9, characterized in that: The steps include: S1: Fill the copper tube with soft material and preheat it; S2: using a preheated filler bending process to repeatedly bend the copper tube material 90 degrees in a bending die to form a first copper tube assembly (205) and a second copper tube assembly (305); S3: chemically tinning the surfaces of the first copper tube assembly (205) and the second copper tube assembly (305), and then filling the gaps between the cylindrical surfaces of the copper tube materials with solder to increase the contact area with the optical module body; S4: installing the first copper tube assembly (205) and the second copper tube assembly (305) on the upper surface and the lower surface of the optical module body respectively; S5: installing a heat dissipation fin (203) on the first copper tube assembly (205) installed on the upper surface of the optical module body to form an upper heat dissipation tube surface (201), and a second copper tube assembly (305) to form a lower heat dissipation tube surface (301); S6: connecting the outlets on one side of the upper heat dissipation pipe surface (201) and the lower heat dissipation pipe surface (301) via a connecting pipe (303); S7: The outlets on the other side of the upper heat dissipation pipe surface (201) and the lower heat dissipation pipe surface (301) are connected to provide a cooling water circulation structure or a connection sealing structure for sealing.

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