Wireless charging control method and wireless charging device

Abstract

The invention discloses a wireless charging control method and a wireless charging device. The wireless charging device comprises a shell, a control module, a charging coil, a semiconductor cooler and a temperature sensor, wherein the charging coil, the semiconductor cooler and the temperature sensor are arranged in the shell. The wireless charging control method is applied to the wireless charging device, and specifically comprises the following steps: receiving a detection temperature obtained by a temperature sensor; according to the detection temperature, the working state of the semiconductor cooler is controlled, so that the value of the detection temperature is located between a first temperature threshold value and a second temperature threshold value; wherein the first temperature threshold value is smaller than the second temperature threshold value. Therefore, when the electronic equipment is wirelessly charged, the surface temperature of the electronic equipment is controlled within a proper range, the continuous quick charging requirement of the electronic equipment is met, and the problem of water seepage caused by too low temperature of the wireless charging device is avoided.

Description

Technical Field

[0001] The present application relates to the field of wireless charging technology, and in particular to a wireless charging control method and a wireless charging device. Background Art

[0002] With the rapid development of wireless charging technology, more and more electronic products are now using wireless charging devices. However, the heat generated during wireless charging has become a key bottleneck restricting the application of this technology. When the temperature exceeds a safe threshold, some electronic products have incorporated temperature protection mechanisms into their designs. For example, when the temperature exceeds a preset value, it automatically cuts off wireless charging or switches to slow charging mode.

[0003] To address these issues, some existing wireless charging devices use semiconductor refrigeration chips for active cooling. These chips utilize the Peltier effect, generating cold air at the cooling end of the chip to cool the wireless charging device. Heat generated at the heating end of the chip is dissipated through a cooling device such as a fan.

[0004] However, when the semiconductor refrigeration chip is cooled too low, the air around the semiconductor refrigeration chip will reach the dew point, causing the water vapor in the air to condense into water droplets, which can easily cause the wireless charging device to short-circuit.

[0005] Therefore, how to ensure that electronic products can meet the fast charging requirements while not causing water leakage when performing wireless charging has become a technical problem that needs to be solved urgently in the field of wireless charging technology. Summary of the Invention

[0006] The present application provides a wireless charging control method and a wireless charging device to solve the technical problems of existing wireless charging devices when charging and dissipating heat for electronic products, where the heat dissipation is too slow, resulting in the electronic products being unable to continue fast charging, and the heat dissipation is too fast, causing water leakage in the wireless charging device.

[0007] In order to solve the above technical problems, the present application provides a wireless charging control method, which is applied to a wireless charging device for wirelessly charging electronic devices. The wireless charging device includes a shell, a control module, and a charging coil, a semiconductor refrigerator and a temperature sensor arranged inside the shell; wherein, the surface of the shell has a charging contact surface, the charging contact surface is used to contact the electronic device to achieve wireless charging, the charging coil is adjacent to the charging contact surface, the semiconductor refrigerator has a cooling end and a heating end, the cooling end is thermally connected to the charging coil, the heating end and the cooling end are away from each other, and the temperature sensor is located on the side of the semiconductor refrigerator close to the charging coil; the wireless charging control method is applied to the control module, and specifically includes the following steps: receiving the detection temperature obtained by the temperature sensor; controlling the working state of the semiconductor refrigerator according to the detection temperature so that the value of the detection temperature is between a first temperature threshold and a second temperature threshold; wherein the first temperature threshold is less than the second temperature threshold.

[0008] In some embodiments, when the detected temperature is lower than a first temperature threshold, the working state of the semiconductor refrigerator is controlled as follows: the cooling end stops the cooling operation, or the cooling end performs the heating operation.

[0009] In some embodiments, when the detected temperature is greater than a second temperature threshold, the working state of the semiconductor cooler is controlled to be: the cooling end performs a temperature reduction operation.

[0010] In some embodiments, when the detected temperature is greater than or equal to a first temperature threshold and less than or equal to a second temperature threshold, the working state of the semiconductor cooler is controlled to: the semiconductor cooler stops working.

[0011] In some embodiments, the method further includes the steps of adjusting the value interval of the first temperature threshold and / or adjusting the value interval of the second temperature threshold.

[0012] In some embodiments, the first temperature threshold has a value range of greater than or equal to 10 degrees Celsius and less than or equal to 20 degrees Celsius.

[0013] In some embodiments, the second temperature threshold is less than or equal to 38 degrees Celsius.

[0014] In some embodiments, the steps are also included: displaying a human-computer interaction interface, the human-computer interaction interface having a screen display area and corresponding operation items; responding to a user's selection instruction for a corresponding operation item in the screen display area; wherein the corresponding operation items include: setting a first temperature threshold and / or setting a second temperature threshold.

[0015] In some embodiments, the detected temperature includes any one of the following temperatures: the temperature of the electronic device, the temperature of the charging contact surface of the wireless charging device, the temperature of the charging coil of the wireless charging device, and the temperature of the cooling end.

[0016] The present application also provides a wireless charging device, including: a shell, the surface of the shell having a charging contact surface, the charging contact surface being used to contact an electronic device to achieve wireless charging; a charging coil, arranged inside the shell and adjacent to the charging contact surface; a semiconductor refrigerator, arranged inside the shell; the semiconductor refrigerator having a cooling end and a heating end, the cooling end being thermally connected to the charging coil for cooling the charging coil and the shell; the heating end and the cooling end being away from each other; a temperature sensor, arranged inside the shell, on a side of the semiconductor refrigerator close to the charging coil; a control module, electrically connected to the semiconductor refrigerator and the temperature sensor, respectively, and executing the wireless charging control method as described above when the control module is in operation.

[0017] The present application has the following beneficial effects: The wireless charging control method of the present application is applied to a wireless charging device for wirelessly charging electronic devices. Specifically, the method receives a detected temperature obtained by a temperature sensor; based on the detected temperature, the operating state of a semiconductor cooler is controlled so that the detected temperature value is between a first temperature threshold and a second temperature threshold; wherein the first temperature threshold is less than the second temperature threshold. This ensures that the surface temperature of the electronic device is controlled within an appropriate range during wireless charging, thereby meeting the continuous fast charging requirements of the electronic device and avoiding water seepage caused by excessively low temperature in the wireless charging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application.

[0019] Figure 1 This is a flow chart of an embodiment of a wireless charging control method provided by the present application;

[0020] Figure 2 is a three-dimensional diagram of an embodiment of a wireless charging device provided by the present application;

[0021] Figure 3 This is an exploded schematic diagram of an embodiment of the wireless charging device provided by the present application;

[0022] Figure 4 This is an internal schematic diagram of an embodiment of a wireless charging device provided by the present application;

[0023] Figure 5 is another exploded schematic diagram of an embodiment of the wireless charging device provided by the present application;

[0024] Figure 6 is a three-dimensional diagram of a housing in one embodiment of a wireless charging device provided by the present application;

[0025] Figure 7This is a three-dimensional diagram of a radiator in one embodiment of a wireless charging device provided by the present application;

[0026] Figure 8 is a top view of a radiator in an embodiment of a wireless charging device provided by the present application;

[0027] Figure 9 This is a partial schematic diagram of a radiator in another embodiment of the wireless charging device provided by the present application;

[0028] Figure 10 1 is a top view of a heat dissipation cover in one embodiment of the wireless charging device provided in this application. DETAILED DESCRIPTION

[0029] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0030] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0031] The term "and / or" in this article is simply a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects are in an "or" relationship. In addition, "many" in this article means two or more than two. In addition, the term "at least one" in this article means any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0032] See also Figure 1 , Figure 1 This is a flow chart of an embodiment of the wireless charging control method provided by this application. The method includes the following steps:

[0033] S1: Receive the detected temperature obtained by the temperature sensor.

[0034] S2: According to the detected temperature, the working state of the semiconductor cooler is controlled so that the value of the detected temperature is between a first temperature threshold and a second temperature threshold; wherein the first temperature threshold is smaller than the second temperature threshold.

[0035] The wireless charging control method of the present application is applied to a wireless charging device for wirelessly charging an electronic device. It should be noted that the electronic device in this embodiment can be any electronic device that supports wireless charging, such as a smartphone, a smartwatch, a wireless headset, a tablet computer, a laptop computer, an electric toothbrush, a game controller, a power bank, a smart home device, an automotive device, a medical device, a wireless mouse, a wireless keyboard, a digital camera, and other electronic devices.

[0036] Specifically, see Figures 2 to 4 The wireless charging device 100 of the present application includes a housing 10, a control module 110, and a charging coil 20, a semiconductor cooler 40, and a temperature sensor (not shown) disposed inside the housing 10. In this embodiment, the control module 110 is disposed outside the housing 10, and the wireless charging control method is applied to the control module 110.

[0037] The housing 10 has a charging contact surface 101 on its surface, which is used to contact an electronic device to achieve wireless charging. The charging coil 20 is adjacent to the charging contact surface 101. The semiconductor cooler 40 has a cooling end and a heating end, with the cooling end thermally connected to the charging coil 20 and the heating end facing away from the cooling end. The temperature sensor is located on the side of the semiconductor cooler 40 closest to the charging coil 20. The control module 110 is electrically connected to the semiconductor cooler 40 and the temperature sensor.

[0038] Specifically, the temperature sensor is used to obtain a detected temperature related to the electronic device. In this embodiment, the detected temperature includes any of the following temperatures: the temperature of the electronic device, the temperature of the charging contact surface 101 of the wireless charging device 100, the temperature of the charging coil 20 of the wireless charging device 100, and the temperature of the cooling end of the semiconductor cooler 40.

[0039] Furthermore, the control module 110 is configured to receive a detected temperature (any of the aforementioned temperatures) obtained by the temperature sensor and to control the operating state of the semiconductor cooler 40 based on the detected temperature so that the detected temperature falls between a first temperature threshold and a second temperature threshold, thereby maintaining a continuous fast charging state of the electronic device while avoiding water seepage; wherein the first temperature threshold is less than the second temperature threshold.

[0040] In this embodiment, the operating states of the semiconductor cooler 40 include: stopping operation (stopping heating or cooling); or heating the cooling end while cooling the heating end; or heating the heating end while cooling the cooling end. The same end of the semiconductor cooler 40 (e.g., the cooling end) can switch between heating and cooling operations by changing the direction of the current.

[0041] Specifically, when the detected temperature is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, the control module 110 controls the working state of the semiconductor refrigerator 40 to be: the semiconductor refrigerator 40 stops working; when the detected temperature is within this temperature range, the electronic device can be fast charged normally, and the temperature is suitable at this time, and condensation will not occur to cause a short circuit, so controlling the semiconductor refrigerator 40 to stop working can effectively save power. When the detected temperature is less than the first temperature threshold, in order to avoid the semiconductor refrigerator 40 temperature being too low and causing water seepage, the control module 110 controls the working state of the semiconductor refrigerator 40 to be: the cooling end stops the cooling operation, or the cooling end performs the heating operation (the heating end performs the corresponding operation). When the detected temperature is greater than the second temperature threshold, in order to avoid the electronic device stopping charging or entering a slow charging state, the control module 110 controls the working state of the semiconductor refrigerator 40 to be: the cooling end performs the cooling operation (the heating end performs the corresponding operation) to reduce the charging temperature.

[0042] Furthermore, the semiconductor refrigerator 40 is used to receive control instructions from the control module 110 and perform a cooling operation (or a heating operation or a shutdown operation depending on the situation).

[0043] In this embodiment, the value ranges of the first temperature threshold and the second temperature threshold are respectively: the first temperature threshold is greater than or equal to 10 degrees Celsius and less than or equal to 20 degrees Celsius, and the second temperature threshold is less than or equal to 38 degrees Celsius.

[0044] It should be noted that the specific values of the first and second temperature thresholds in this application can be adjusted according to actual needs. For example, if the maximum heat tolerance of the electronic device to be charged is 35 degrees Celsius, the second temperature threshold can be set to 34 degrees Celsius. The same applies to other electronic devices with different heat tolerances and will not be further described here.

[0045] Therefore, in some other embodiments, the wireless charging control method of the present application further includes the steps of: adjusting the value range of the first temperature threshold and / or adjusting the value range of the second temperature threshold. Specifically, when replacing different electronic devices (i.e., charging different electronic devices), if their charging temperature requirements are different, the control module 110 can adjust the control range of the detection temperature according to actual needs, i.e., adjust the value range of the first temperature threshold and / or adjust the value range of the second temperature threshold, so that different electronic devices can be quickly charged at an appropriate temperature.

[0046] Furthermore, the wireless charging control method of the present application further includes the steps of: displaying a human-computer interaction interface having a screen display area and corresponding operation items; and responding to a user's selection of an operation item corresponding to the screen display area. The corresponding operation items include setting a first temperature threshold and / or setting a second temperature threshold.

[0047] Specifically, the user selects a corresponding operation item (e.g., setting a first temperature threshold and / or setting a second temperature threshold) via a screen display area (e.g., a display screen) of the human-computer interaction interface. The control module 110 responds to the user's selection instruction for the corresponding operation item in the screen display area. For example, if the user selects to set a first temperature threshold via the screen display area, the control module 110 controls the adjustment of the first temperature threshold in response to the selection instruction.

[0048] The wireless charging control method of the present application receives a detected temperature from a temperature sensor and controls the semiconductor cooler 40 to increase or decrease the temperature when the detected temperature is less than a first temperature threshold or greater than a second temperature threshold. This ensures that the surface temperature of the electronic device is kept within an appropriate range during wireless charging, meeting the electronic device's continuous fast charging needs while preventing water seepage caused by excessively low temperatures in the wireless charging device.

[0049] Based on the same inventive concept, the present application also provides a wireless charging device, which includes a housing, a charging coil, a semiconductor refrigerator, a temperature sensor, and a control module. When the control module is running, the aforementioned wireless charging control method is executed.

[0050] Specific, combined Figures 2 to 10As shown in FIG. 1 , as an embodiment of a wireless charging device 100, the wireless charging device 100 includes a housing 10, a charging coil 20, a heat conduction member 30, a semiconductor cooler 40, a heat sink 50, a moisture absorber 70, a temperature sensor (not shown), and a control module 110. The housing 10 has a charging contact surface 101 on its surface, which is used to contact an electronic device to achieve wireless charging. The charging coil 20 is disposed inside the housing 10, and the charging coil 20 is adjacent to the charging contact surface 101. The heat conduction member 30 is disposed inside the housing 10, and the heat conduction member 30 is located on the side of the charging coil 20 away from the charging contact surface 101. The heat conduction member 30 is thermally connected to the charging coil 20. The semiconductor cooler 40 is disposed inside the housing 10. The semiconductor cooler 40 has a cooling end and a heating end. The cooling end is thermally connected to the heat conduction member 30. The cooling end is used to absorb heat and can cool the charging coil 20 and the housing 10 through the heat conduction member 30. The heating end It is away from the cooling end and is used to release heat; the radiator 50 is arranged inside the shell 10 and is in contact with the heating end, so as to dissipate the heat of the heating end; the moisture absorbing component 70 is in contact with the heat conducting component 30, and the moisture absorbing component 70 can absorb the condensed water generated on the surface of the heat conducting component 30 when the semiconductor refrigerator 40 is working, so as to avoid excessive condensed water causing a short circuit inside the wireless charging device 100; the temperature sensor is arranged inside the shell 10, on the side of the semiconductor refrigerator 40 close to the charging coil 20, to detect the temperature of the charging contact surface 101 or the charging coil 20, and indirectly reflect the temperature of the electronic device and the semiconductor refrigerator 40; the control module 110 is electrically connected to the semiconductor refrigerator 40 and the temperature sensor respectively.

[0051] In this embodiment, the wireless charging device 100 is capable of wirelessly charging electronic devices. During charging, the cooling end of the semiconductor cooler 40 absorbs heat (i.e., releases cold energy), which is then transferred to the charging coil 20 and housing 10 via the thermal conductive element 30, achieving cooling. The housing 10 is in contact with the electronic device, allowing the cold energy to further act on the electronic device, cooling it and preventing the triggering of the device's temperature protection mechanism, which would otherwise reduce charging speed. The heat sink 50 within the wireless charging device 100 dissipates heat from the heating end through a passive, noiseless process. Furthermore, the heat sink 50 is compact and easily installed within the wireless charging device 100, eliminating the need to resize the housing 10 during the design process. Furthermore, the moisture absorbent 70, in close contact with the thermal conductive element 30, promptly absorbs condensation generated on the surface of the thermal conductive element 30 during operation of the semiconductor cooler 40. This effectively prevents internal short circuits within the wireless charging device 100 caused by condensation accumulation, thereby improving the reliability and safety of the wireless charging device 100.

[0052] Further, combined Figure 6In this embodiment, the shell 10 has a cylindrical structure, which can maximize the use of the internal space and is suitable for integrating components such as the charging coil 20, the heat conduction member 30, the semiconductor cooler 40, etc.; it is also convenient for the user to hold.

[0053] Preferably, in this embodiment, the cross-sectional profile of the housing 10 is circular; in other embodiments, the cross-sectional profile of the housing 10 may also be square, elliptical, elongated, or irregularly shaped.

[0054] Specifically, in this embodiment, the housing 10 has a top panel 11, a circumferential side wall 12, and a bottom opening 13 opposite to the top panel 11; wherein, the charging contact surface 101 is provided on the surface of the top panel 11 for placing the electronic device.

[0055] Further, such as Figure 5 As shown, the charging coil 20 can be in a circular, square, oval, elongated, multi-coil, irregular, flexible, annular, or segmented shape. A circular shape is preferred, as it generates a uniform electromagnetic field distribution, ensuring consistent magnetic field strength within the charging area and improving charging efficiency. Furthermore, the circular shape of the charging coil 20 ensures even heat distribution and prevents local overheating.

[0056] Further, such as Figure 5 As shown, the heat conducting member 30 is a sheet structure, which can be a metal heat conducting sheet, a silicone heat conducting sheet, a graphene heat conducting sheet, etc., which can quickly conduct the cold energy of the cooling end to the charging coil 20 and the housing 10.

[0057] Further, such as Figure 5 As shown, in this embodiment, the semiconductor cooler 40 (TEC) is a solid-state cooling technology based on the Peltier effect, which transfers heat through current. It is made of semiconductor materials and has the characteristics of compact structure, no mechanical moving parts, and fast response speed.

[0058] Further, such as Figure 4 and Figure 5 As shown, the moisture absorbing member 70 is arranged around the circumference of the semiconductor cooler 40 and is in contact with the side of the heat conducting member 30 facing away from the charging coil 20. It can be seen that this arrangement brings the moisture absorbing member 70 closer to the cooling end of the semiconductor cooler 40, thereby achieving a better moisture absorption effect.

[0059] Preferably, the material of the moisture absorbing member 70 can be silica gel, molecular sieve, moisture absorbing cotton and other materials, which can efficiently absorb condensed water.

[0060] Further, in Figure 5In the figure, the hygroscopic member 70 is a sheet-like structure, and a receiving groove 73 for accommodating the semiconductor cooler 40 is provided on the hygroscopic member 70, providing an avoidance space for the installation of the semiconductor cooler 40; and a clearance notch 71 is provided on the hygroscopic member 70 for the wires of the semiconductor cooler 40 to pass through, thereby avoiding direct contact between the wires of the semiconductor cooler 40 and the hygroscopic member 70. At the same time, the wires are accommodated by the clearance notch 71, and the overall structural layout is more regular.

[0061] The moisture absorbent member 70 in this embodiment is an integrally formed sheet structure, which is convenient for processing and assembly. In some other embodiments, the moisture absorbent member 70 may be composed of several parts.

[0062] Furthermore, in order to achieve heat dissipation of the heating end of the semiconductor refrigerator 40, Figures 3 to 9 As shown, the heat sink 50 of the wireless charging device 100 includes a central contact portion 51 that is thermally connected to the heating end and a circumferential heat dissipation portion extending outward from the peripheral edge of the semiconductor cooler 40. The central contact portion 51 is used to contact the heating end to transfer heat from the heating end. The circumferential heat dissipation portion includes at least one circumferential heat dissipation fin 52 connected to the central contact portion 51. The circumferential heat dissipation fin 52 increases the heat dissipation area of the heat sink 50 and further transfers heat from the central contact portion 51 to the surrounding area.

[0063] exist Figure 7 In the embodiment, the circumferential edge of the heat sink 50 extends beyond the circumferential edge of the semiconductor cooler 40, that is, the size of the heat sink 50 is larger than that of the semiconductor cooler 40, so the heat of the circumferential heat dissipation portion of the heat sink 50 can be released toward the heat conducting member 30. Figure 5 Since a hygroscopic member 70 is provided between the circumferential heat dissipation portion and the heat conducting member 30, the hygroscopic member 70 can play a role in heat insulation; the side of the hygroscopic member 70 away from the heat conducting member 30 is in contact with the circumferential heat dissipation portion, thereby isolating the heat of the radiator 50 and preventing the heat from the circumferential heat dissipation portion from being transferred to the heat conducting member 30.

[0064] Preferably, the hygroscopic member 70 is made of a material that has both water absorption and heat insulation functions, such as thermal insulation cotton; while playing the role of heat insulation and water absorption, the condensed water absorbed by the hygroscopic member 70 can cool the radiator 50, and the temperature of the surface of the radiator 50 can also accelerate the evaporation of the condensed water on the surface of the hygroscopic member 70, so that the condensed water can continue to absorb more condensed water on the surface of the heat conduction member 30.

[0065] like Figure 7As shown, there are multiple circumferential heat dissipation fins 52, and the multiple circumferential heat dissipation fins 52 are arranged around the central contact portion 51 to conduct the heat of the central contact portion 51 in the circumferential direction; one end of each circumferential heat dissipation fin 52 is fixedly connected to the central contact portion 51, and the other end extends in the direction away from the central contact portion 51; there is a heat dissipation gap 53 between two adjacent circumferential heat dissipation fins 52, and the heat dissipation gap 53 can promote air flow and heat dissipation; the surface of the circumferential heat dissipation fins 52 is also coated with an infrared coating, which can actively dissipate heat in the form of infrared radiation, play an active heat dissipation role, thereby enhancing the thermal radiation efficiency of the radiator 50.

[0066] In this embodiment, the radiator 50 is in full contact with the heating end through the central contact portion 51, ensuring that the heat from the heating end can be quickly and efficiently transferred to the central contact portion 51; a plurality of circumferential heat dissipation fins 52 are arranged around the central contact portion 51 to form a radial structure, thereby expanding the surface area of the radiator 50 and improving the efficiency of heat dissipation to the surrounding environment; at the same time, the arrangement of the circumferential heat dissipation fins 52 is also conducive to maximizing the coating of more infrared coatings on the surface of the radiator 50, thereby enhancing the thermal radiation efficiency of the radiator 50.

[0067] In addition, there is a heat dissipation gap 53 between two adjacent circumferential heat dissipation fins 52. The heat dissipation gap 53 provides a channel for air flow, thereby enhancing the natural convection heat dissipation effect. The air can take away heat through the heat dissipation gap 53, further improving the heat dissipation performance. Secondly, the heat dissipation gap 53 between two adjacent circumferential heat dissipation fins 52 is also more conducive to the infrared coating to dissipate heat in the form of radiation. At the same time, the setting of the moisture-absorbing component 70 can also prevent the infrared coating on the surface of the circumferential heat dissipation fin 52 from emitting infrared radiation energy outward, and the infrared radiation energy returns to the heating end again.

[0068] Finally, the heat sink 50 in this embodiment also has the characteristics of compact structure and small size, which can simplify the manufacturing and installation process.

[0069] The infrared coating in this embodiment is described below:

[0070] Existing heat sinks all use passive cooling, meaning that heat from the heat sink's surface is passively removed by air flow. However, without an external force, air is typically relatively static, resulting in poor heat dissipation. Infrared coatings actively dissipate heat in the form of infrared radiation, enhancing the heat radiation efficiency of the heat sink 50. Materials for infrared coatings can include silicon carbide (SiC), aluminum oxide (Al2O3), and graphene.

[0071] Furthermore, in some embodiments, the infrared coating can be made from a mixture of epoxy resin and nano-infrared heat dissipation particles, wherein epoxy resin is a high molecular weight polymer, which refers to a general term for a class of polymers containing two or more epoxy groups in the molecule. It is a condensation product of epichlorohydrin and bisphenol A or polyols. Due to the chemical activity of the epoxy group, it can be opened with a variety of compounds containing active hydrogen, cured and cross-linked to form a network structure, so it is a thermosetting resin. During actual production, the epoxy resin is also mixed with nano-infrared heat dissipation particles. That is, the epoxy resin mainly plays the role of fixing the shape, and the fixed nano-infrared heat dissipation particles are the actual heat dissipation material. Specifically, the nano-infrared heat dissipation particles are a new type of nano-scale material that can radiate infrared rays. For details, see CN102181212B discloses a heat dissipation material and its preparation method. This material has excellent thermal conductivity and stable and uniform heat dissipation. It can dissipate heat in the form of infrared radiation and has a long service life of up to 25,000 hours. Specifically, the nano-infrared heat dissipation particles used in this embodiment have an infrared emissivity greater than 80% and a particle size range of 0.003 to 10 μm. They can be made of one or more of metal oxides, non-metal oxides, metal carbides, non-metal carbides, metal nitrides, and non-metal nitrides, and can be natural or synthetic. The infrared radiating material can be one or more of titanium dioxide, silicon dioxide, aluminum dioxide, iron oxide, manganese oxide, copper oxide, cerium oxide, antimony oxide, tin oxide, silicon carbide, aluminum nitride, boron nitride, lazuli, mullite, tourmaline, vermiculite, perlite, volcanic ash, and coal combustion ash.

[0072] Furthermore, the materials of the central contact portion 51 and the circumferential heat dissipation fins 52 may also be aluminum, copper, ceramics, graphene, phase change materials, etc.

[0073] The central contact portion 51 in this embodiment is described below:

[0074] like Figure 7 As shown, the shape of the center contact portion 51 can be cylindrical, prismatic, etc.; preferably, the center contact portion 51 is a solid structure, so that it can absorb more heat from the heating end; at the same time, it is also beneficial to enhance the overall stability of the radiator 50 and reduce production complexity.

[0075] Furthermore, in order to further enhance the heat dissipation effect of the heat sink 50 , the surface of the central contact portion 51 is also coated with an infrared coating, thereby increasing the coverage area of the infrared coating, that is, the entire surface of the heat sink 50 is coated with the infrared coating.

[0076] The circumferential heat dissipation fins 52 in this embodiment are described below:

[0077] like Figure 8 and Figure 9As shown, the circumferential heat dissipation fins 52 include radial heat dissipation fins 521 and N-stage lateral heat dissipation fins, wherein the radial heat dissipation fins 521 are in a sheet-like structure and have two opposite heat dissipation surfaces 524; one end of the radial heat dissipation fins 521 is fixedly connected to the central contact portion 51, and the other end of the radial heat dissipation fins 521 extends in a direction away from the central contact portion 51; each stage of the lateral heat dissipation fins also has a sheet-like structure, and the N-stage lateral heat dissipation fins are fixed on at least one of the heat dissipation surfaces 524 of the radial heat dissipation fins 521, N≥2, and the N-stage lateral heat dissipation fins are distributed on the heat dissipation surface 524 at intervals along the extension direction of the radial heat dissipation fins 521, one end of each stage of the lateral heat dissipation fins is fixed to the heat dissipation surface 524, and the other end extends in a direction away from the heat dissipation surface 524; wherein the first-stage lateral heat dissipation fins 5221 are close to the central contact portion 51, and the N-stage lateral heat dissipation fins 522n are away from the central contact portion 51.

[0078] In this embodiment, the heat of the center contact portion 51 can be transferred along the length direction of the radial heat sink 521, and the heat dissipation surface 524 of the radial heat sink 521 has N-level lateral heat sinks. During the heat dissipation process, the heat is further dissipated laterally through the N-level lateral heat sinks, thereby improving the heat dissipation efficiency.

[0079] In some embodiments, the radial heat sink 521 has N-level lateral heat sinks on only one side; in other embodiments, both sides of the radial heat sink 521 have N-level lateral heat sinks; or in other embodiments, some radial heat sinks 521 have N-level lateral heat sinks on one side, and some radial heat sinks 521 have N-level lateral heat sinks on both sides.

[0080] like Figure 9 As shown, in this embodiment, among the N levels of lateral heat sinks of a single radial heat sink 521, the extension length L2 of the first-level lateral heat sink 5221 to the N-1-level lateral heat sink 522 (n-1) away from the heat sink surface 524 is the same, and the extension length of the N-level lateral heat sink 522n away from the heat sink surface 524 is greater than the extension length of the first-level lateral heat sink 5221 away from the heat sink surface 524, that is, among the N levels of lateral heat sinks, the outermost N-level lateral heat sink 522n has the largest extension length away from the heat sink surface 524, which is more conducive to holding the radiator and can also increase the heat dissipation area.

[0081] like Figure 9 As shown, in a specific embodiment, each circumferential heat dissipating fin 52 has four levels of lateral heat dissipating fins, namely first-level lateral heat dissipating fins 5221, second-level lateral heat dissipating fins 5222, third-level lateral heat dissipating fins and fourth-level lateral heat dissipating fins, wherein the lengths of the first-level lateral heat dissipating fins 5221, the second-level lateral heat dissipating fins 5222 and the third-level lateral heat dissipating fins are the same, and the length of the fourth-level lateral heat dissipating fins is greater than the length L2 of the first-level lateral heat dissipating fins 5221.

[0082] In some other embodiments, among the N levels of lateral heat sinks of a single radial heat sink 521, the extension length of the first-level lateral heat sink 5221 away from the heat sink surface 524 gradually increases to the extension length of the N-level lateral heat sink 522n away from the heat sink surface 524, that is, the heat sink area of each level of lateral heat sink tends to gradually increase, so that the heat sink effect also increases in a gradient manner, further improving the heat sink effect of the radiator 50.

[0083] Further, such as Figure 7 As shown, the height of each level of lateral heat sinks does not exceed the height of the radial heat sinks 521; the thickness of each level of lateral heat sinks does not exceed the thickness of the radial heat sinks 521; preferably, the height and thickness of the lateral heat sinks are the same as the height and thickness of the radial heat sinks 521.

[0084] In this embodiment, combined with Figure 9 Among the multiple circumferential heat dissipation fins 52, the side heat dissipation fins of the same level are at the same distance from the central contact portion 51 (that is, the distance from the center O of the central contact portion 51 is the same), thereby ensuring that the heat of the central contact portion 51 can be evenly transferred to the surroundings to avoid local heat accumulation; ensuring that the heat dissipation effect of each circumferential heat dissipation fin 52 is balanced, and at the same time it is also beneficial to the manufacturing and processing of the radiator 50.

[0085] like Figure 8 As shown, among the multiple circumferential heat dissipating fins 52, at least four circumferential heat dissipating fins 52 are symmetrically arranged in pairs, and in two adjacent circumferential heat dissipating fins 52, two N-th level lateral heat dissipating fins are connected in the circumferential direction to form a kneading portion 523. The design of the kneading portion 523 not only makes it convenient for the operator to clamp and assemble the radiator 50; at the same time, it also improves the heat dissipation area and efficiency.

[0086] like Figure 7 As shown, in this embodiment, the bottom of the circumferential heat dissipating fins 52 is flush with the central contact portion 51, and the height of the circumferential heat dissipating fins 52 does not exceed the height of the central contact portion 51. In some embodiments, the vertical height of the circumferential heat dissipating fins 52 is the same as the height of the central contact portion 51 to facilitate manufacturing; in other embodiments, the vertical height of the circumferential heat dissipating fins 52 is lower than the height of the central contact portion 51, thereby saving material and reducing the weight of the entire heat sink 50.

[0087] like Figure 9 As shown, in a specific embodiment, the center contact portion 51 is cylindrical and has a uniform cross-section in the axial direction, so that heat can be diffused more evenly from the center to the circumferential heat dissipation fins 52 around it, reducing thermal resistance and improving heat dissipation efficiency; at the same time, the cylindrical structure has lower resistance in air flow, which can optimize the airflow path and improve the ventilation efficiency of the heat dissipation gap 53.

[0088] Further, such as Figure 9 As shown, the ratio between the diameter φ1 of the central contact portion 51 and the radial length L1 of the circumferential heat dissipating fins 52 is in the range of 0.3 to 2.

[0089] In some specific embodiments, the ratio between the diameter φ1 of the central contact portion 51 and the radial length L1 of the circumferential heat dissipating fins 52 is 0.3, that is, the diameter φ1 of the central contact portion 51 is 3:10 to the radial length L1 of the circumferential heat dissipating fins 52. The radial length L1 of the circumferential heat dissipating fins 52 is longer. The radiator 50 of this embodiment is suitable for the heating end with large heat generation and has a good heat dissipation effect.

[0090] In some specific embodiments, the ratio between the diameter φ1 of the central contact portion 51 and the radial length L1 of the circumferential heat dissipating fins 52 is 1, that is, the diameter φ1 of the central contact portion 51 is 1:1 to the radial length L1 of the circumferential heat dissipating fins 52. The diameter φ1 of the central contact portion 51 is the same as the radial length L1 of the circumferential heat dissipating fins 52. The radiator 50 of this embodiment has a balanced structure, which can improve the overall strength and durability of the radiator and reduce processing difficulty and cost.

[0091] In some specific embodiments, the ratio between the diameter φ1 of the central contact portion 51 and the radial length L1 of the circumferential heat dissipating fins 52 is 2, that is, the diameter φ1 of the central contact portion 51 is 2:1 to the radial length L1 of the circumferential heat dissipating fins 52. The radial length L1 of the circumferential heat dissipating fins 52 is shorter. The radiator 50 of this embodiment is suitable for the heating end with low heat generation.

[0092] Further, such as Figure 3 and Figure 5 As shown, the wireless charging device 100 is connected to the electronic device via a magnetic connection. The wireless charging device 100 includes a magnetic member 60, which is a magnetic material or component, such as a magnet. The magnetic member 60 is disposed on the thermal conductive member 30 along the circumference of the charging coil 20. Alternatively, in some embodiments, the magnetic member 60 is disposed on the charging contact surface 101, that is, the magnetic member 60 is located on the surface of the housing 10.

[0093] Preferably, in this embodiment, the magnetic member 60 is an annular structure; or in some embodiments, the magnetic member 60 is a sheet-like structure and has a plurality of sheets distributed in an annular shape.

[0094] Furthermore, the magnetic element 60 surrounds the outside of the charging coil 20, forming a cold chamber within which the charging coil 20 is located. This magnetic element 60 further enhances the protection of the charging coil 20, ensuring its safe operation. Furthermore, the cooling end dissipates cold energy, which is transferred within the cold chamber. This cool energy lowers the temperature of the charging coil 20 within the cold chamber, preventing the high temperature of the charging coil 20 from affecting its normal operation and further improving its efficiency.

[0095] Further, such as Figure 4 and Figure 5 As shown, due to the heavy mass of the radiator 50, in order to improve the stability of the radiator 50 in the housing 10 and prevent the radiator 50 from shaking in the housing 10, the wireless charging device 100 further includes a plurality of positioning members 80 fixed to the radiator 50, and the moisture-absorbing member 70 has a plurality of positioning holes 72. The distribution positions of the positioning holes 72 correspond to the positioning members 80, so that the positioning members 80 can be accommodated in the positioning holes 72, thereby limiting the radial movement of the radiator 50.

[0096] Preferably, there are three positioning members 80 distributed in a triangular shape on the heat sink 50 , which has the characteristics of high stability, high positioning accuracy, simple design, small number and low cost.

[0097] Further, such as Figure 10 As shown, the wireless charging device 100 also includes a heat dissipation cover 90, which is arranged on the side of the radiator 50 away from the semiconductor cooler 40. The shape of the heat dissipation cover 90 is adapted to the shape of the radiator 50. There are heat dissipation holes 91 on the heat dissipation cover 90, and the heat of the radiator 50 can flow to the outside of the shell 10 through the heat dissipation holes 91.

[0098] Preferably, the heat dissipation cover 90 has a plate-like structure, and has multiple heat dissipation holes 91, which are evenly distributed along the circumferential direction of the heat dissipation cover 90; each heat dissipation hole 91 is fan-shaped, and the area occupied by the heat dissipation hole 91 on the heat dissipation cover 90 gradually increases from the center of the heat dissipation cover 90 to the edge of the heat dissipation cover 90, thereby gradually increasing the effect of the radiator 50 dissipating heat, and is also beneficial to increasing the efficiency of the infrared coating in emitting infrared radiation energy outward.

[0099] In some other embodiments, the heat dissipation holes 91 are in a circular or square shape. In addition, in this embodiment, the heat dissipation cover 90 is disposed adjacent to the bottom opening 13 of the housing 10 , and can dissipate heat to the surrounding environment through the bottom opening 13 .

[0100] Preferably, combined Figure 2 The wireless charging device 100 may be equipped with a display screen, which is provided in the control module 110. The display screen may intuitively display information such as charging status, power, voltage, current, and even provide more intelligent functions.

[0101] In summary, this application has the following beneficial effects:

[0102] First, the wireless charging control method of the present application is applied to a wireless charging device 100. Specifically, by receiving a detected temperature obtained by a temperature sensor and determining whether the detected temperature is less than a first temperature threshold or greater than a second temperature threshold, the semiconductor cooler 40 is controlled to perform a heating operation or a cooling operation, wherein the first temperature threshold is less than the second temperature threshold. This ensures that the surface temperature of the electronic device is controlled within an appropriate range during wireless charging, meeting the continuous fast charging needs of the electronic device while avoiding water seepage caused by excessively low temperatures in the wireless charging device 100.

[0103] Second, the wireless charging device 100 of the present application can wirelessly charge electronic devices. During the charging process, the semiconductor cooler 40 in the wireless charging device 100 cools the electronic device, preventing the triggering of the electronic device's temperature protection mechanism, keeping the electronic device at an appropriate charging temperature and enabling rapid charging.

[0104] Third, the radiator 50 in the wireless charging device 100 of the present application dissipates heat from the heating end of the semiconductor cooler 40 in a passive heat dissipation manner without generating noise; and the radiator 50 is small in size and easy to install in the wireless charging device 100 without redesigning the structure of the wireless charging device 100.

[0105] Fourthly, the control module 110 in the wireless charging device 100 of the present application can control the semiconductor cooler 40 to perform a temperature increase operation or a temperature decrease operation within a fixed temperature range, and has a wide range of applications and strong practicality.

[0106] Finally, it should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0107] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0108] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

[0109] Those skilled in the art will understand that in the above-mentioned method of the specific implementation method, the writing order of each step does not mean a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined by its function and possible internal logic.

Claims

1. A wireless charging control method, applied to a wireless charging device for wirelessly charging an electronic device, characterized in that: The wireless charging device includes a housing, a control module, and a charging coil, a semiconductor cooler, and a temperature sensor disposed within the housing. The housing has a charging contact surface configured to contact the electronic device to achieve wireless charging. The charging coil is adjacent to the charging contact surface. The semiconductor cooler has a cooling end and a heating end, the cooling end being thermally connected to the charging coil, the heating end and the cooling end facing away from each other. The temperature sensor is located on a side of the semiconductor cooler proximal to the charging coil. The wireless charging control method is applied to the control module and specifically includes the following steps: receiving a detected temperature obtained by the temperature sensor; According to the detected temperature, the working state of the semiconductor cooler is controlled so that the value of the detected temperature is between a first temperature threshold and a second temperature threshold; wherein the first temperature threshold is less than the second temperature threshold.

2. The wireless charging control method according to claim 1, wherein: When the detected temperature is lower than the first temperature threshold, the working state of the semiconductor refrigerator is controlled to be: the cooling end stops the temperature reduction operation, or the cooling end performs the temperature increase operation.

3. The wireless charging control method according to claim 1, wherein: When the detected temperature is greater than the second temperature threshold, the working state of the semiconductor refrigerator is controlled to be: the cooling end performs a temperature reduction operation.

4. The wireless charging control method according to claim 1, wherein: When the detected temperature is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, the working state of the semiconductor refrigerator is controlled to: the semiconductor refrigerator stops working.

5. The wireless charging control method according to claim 1, wherein: Also includes the steps: Adjust the value interval of the first temperature threshold and / or adjust the value interval of the second temperature threshold.

6. The wireless charging control method according to claim 5, wherein: The first temperature threshold has a value range of greater than or equal to 10 degrees Celsius and less than or equal to 20 degrees Celsius.

7. The wireless charging control method according to claim 5, wherein: The second temperature threshold is less than or equal to 38 degrees Celsius.

8. The wireless charging control method according to claim 1, wherein: Also includes the steps: Displaying a human-computer interaction interface, wherein the human-computer interaction interface has a screen display area and corresponding operation items; In response to a user's selection instruction for a corresponding operation item in the screen display area, the corresponding operation item includes: setting the first temperature threshold and / or setting the second temperature threshold.

9. The wireless charging control method according to any one of claims 1 to 8, wherein: The detected temperature includes any one of the following temperatures: the temperature of the electronic device, the temperature of the charging contact surface of the wireless charging device, the temperature of the charging coil of the wireless charging device, and the temperature of the cooling end.

10. A wireless charging device, characterized in that: include: A housing, wherein a surface of the housing has a charging contact surface, the charging contact surface being used to contact the electronic device to achieve wireless charging; a charging coil disposed inside the housing and adjacent to the charging contact surface; a semiconductor cooler disposed inside the housing; the semiconductor cooler having a cooling end and a heating end, the cooling end being thermally connected to the charging coil for cooling the charging coil and the housing; the heating end and the cooling end facing away from each other; a temperature sensor disposed inside the housing and located on a side of the semiconductor cooler close to the charging coil; A control module is electrically connected to the semiconductor cooler and the temperature sensor, respectively, and the control module executes the wireless charging control method according to any one of claims 1 to 9 when running.

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