Optical signal transmission device and active optical cable

Abstract

The invention relates to an optical signal transmission device and an active optical cable. The optical signal transmission device comprises a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface. The first optical module assembly and the second optical module assembly are connected with an external device through an electrical interface. Wherein the first optical module assembly comprises a first sending assembly and a first receiving assembly, and the input end of the first sending assembly and the output end of the first receiving assembly are connected with external equipment through electrical interfaces; the output end of the first transmitting assembly and the input end of the first receiving assembly are connected with the optical interface; the second optical module assembly comprises a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are both connected with one end of the digital signal processor, and the other end of the digital signal processor is connected with external equipment through an electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are connected with the optical interface.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical signal transmission device and an active optical cable. Background Art

[0002] With the development of communications technology, optical communications have been widely used in various fields due to their high communication capacity and low loss. When information is transmitted via optical fiber, various types of optical signal transmission devices have emerged, such as optical transceiver modules. Optical transceiver modules consist of a transmitter that converts electrical signals into optical signals and a receiver that converts optical signals into electrical signals.

[0003] However, current optical transceiver modules have the problem of high power consumption. Summary of the Invention

[0004] Based on this, it is necessary to provide an optical signal transmission device and an active optical cable that can reduce the power consumption of an optical transceiver module in order to address the above technical problems.

[0005] In a first aspect, the present application provides an optical signal transmission device, comprising: a first optical module assembly, a second optical module assembly, an electrical interface, and an optical interface; the first optical module assembly and the second optical module assembly are both connected to an external device via the electrical interface; the first optical module assembly and the second optical module assembly are both connected to the optical interface;

[0006] The first optical module assembly includes a first transmitting assembly and a first receiving assembly, the input end of the first transmitting assembly and the output end of the first receiving assembly are both connected to the external device through the electrical interface; the output end of the first transmitting assembly and the input end of the first receiving assembly are both connected to the optical interface;

[0007] The second optical module assembly includes a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are both connected to one end of the digital signal processor, and the other end of the digital signal processor is connected to the external device through the electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are both connected to the optical interface.

[0008] In one embodiment, the optical signal transmission device also includes a circuit board, the first optical module assembly and the second optical module assembly are arranged in series along a preset direction on one side surface of the circuit board, the electrical interface is arranged at one end of the circuit board, the optical interface is arranged at a distance from the other end of the circuit board in the preset direction, and the first optical module assembly is arranged at a position on the circuit board close to the electrical interface, and the second optical module assembly is arranged at a position on the circuit board close to the optical interface.

[0009] In one embodiment, the first transmitting component is any one of a 4-channel transmitting component, an 8-channel transmitting component, and a 16-channel transmitting component; the first receiving component is any one of a 4-channel receiving component, an 8-channel receiving component, and a 16-channel receiving component; the number of channels of the first receiving component and the first transmitting component is the same;

[0010] The second sending component is any one of a 4-channel sending component, an 8-channel sending component, and a 16-channel sending component; the second receiving component is any one of a 4-channel receiving component, an 8-channel receiving component, and a 16-channel receiving component; the number of channels of the second receiving component and the second sending component are the same.

[0011] In one embodiment, the first sending component includes a driver, a first silicon photonic chip, a first lens, a first laser and a first optical fiber array component. The driver, one end of the first lens and the first optical fiber array component are all connected to the first silicon photonic chip, and the other end of the first lens is connected to the first laser.

[0012] In one embodiment, the second sending component includes a second silicon photonic chip, a second lens, a second laser, and a second optical fiber array component. One end of the second lens and the second optical fiber array component are connected to the second silicon photonic chip, and the other end of the second lens is connected to the second laser.

[0013] In one embodiment, the first transmitting component further includes a polarization-maintaining optical fiber, one end of the first lens is connected to the first silicon photonic chip through the polarization-maintaining optical fiber, and the first lens and the first laser are arranged on a circuit board near the optical interface.

[0014] In one embodiment, the first receiving component includes a first photodiode, a third optical fiber array component and a first transimpedance amplifier; one end of the first photodiode is connected to the third optical fiber array component, and the other end of the first photodiode is connected to the first transimpedance amplifier.

[0015] In one embodiment, the second receiving component includes a second photodiode, a fourth fiber array component, and a second transimpedance amplifier; one end of the second photodiode is connected to the fourth fiber array component, and the other end of the second photodiode is connected to the second transimpedance amplifier.

[0016] In a second aspect, the present application further provides an active optical cable, which includes a first optical signal transmission device, a second optical signal transmission device and a transmission optical fiber, wherein the first optical signal transmission device and the second optical signal transmission device are connected via the transmission optical fiber.

[0017] In one embodiment, the first optical signal transmission device includes a third optical module assembly, a fourth optical module assembly, a first electrical interface, and a first optical interface; the third optical module assembly and the fourth optical module assembly are both connected to a first external device via the first electrical interface; the third optical module assembly and the fourth optical module assembly are both connected to the first optical interface;

[0018] The second optical signal transmission device includes a fifth optical module assembly, a sixth optical module assembly, a second electrical interface, and a second optical interface; the fifth optical module assembly and the sixth optical module assembly are both connected to a second external device via the second electrical interface; the fifth optical module assembly and the sixth optical module assembly are both connected to the second optical interface;

[0019] Among them, the fourth optical module assembly and the sixth optical module assembly include digital signal processors; the third optical module assembly is connected to the sixth optical module assembly through the first optical interface, the transmission optical fiber, and the second optical interface, and the fourth optical module assembly is connected to the fifth optical module assembly through the first optical interface, the transmission optical fiber, and the second optical interface.

[0020] The above-mentioned optical signal transmission device and active optical cable, the optical signal transmission device includes: a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are both connected to the external device through the electrical interface; the first optical module assembly and the second optical module assembly are both connected to the optical interface; wherein, the first optical module assembly includes a first sending component and a first receiving component, the input end of the first sending component and the output end of the first receiving component are both connected to the external device through the electrical interface; the output end of the first sending component and the input end of the first receiving component are both connected to the optical interface; the second optical module assembly includes a second sending component, a second receiving component and a digital signal processor, the input end of the second sending component and the output end of the second receiving component are both connected to one end of the digital signal processor, and the other end of the digital signal processor is connected to the external device through the electrical interface; the output end of the second sending component and the input end of the second receiving component are both connected to the optical interface. Since the first optical module assembly does not include a digital signal processor, and the second optical module assembly includes a digital signal processor, the embodiment of the present application can form an optical signal transmission device with a hybrid architecture in which half of the device has a DSP and the other half does not have a DSP. This can minimize the usage scenarios and duration of the digital signal processor in the optical signal transmission device while ensuring the effectiveness of optical signal transmission, thereby reducing the power consumption of the optical transceiver module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments of the present application or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 is a schematic structural diagram of an optical signal transmission device in one embodiment;

[0023] Figure 2A is a first structural schematic diagram of an optical signal transmission device including a circuit board in one embodiment;

[0024] Figure 2B is a second structural schematic diagram of an optical signal transmission device including a circuit board in one embodiment;

[0025] Figure 2C for Figure 2B A magnified schematic diagram of area A in the middle;

[0026] Figure 3 Schematic diagram of the structure of an 8-channel optical signal transmission device in one embodiment;

[0027] Figure 4Schematic diagram of the structure of a 16-channel optical signal transmission device in one embodiment;

[0028] Figure 5A Schematic diagram of the structure of an 8-channel optical signal transmission device DR8 in one embodiment;

[0029] Figure 5B A top view of an overall 8-channel optical signal transmission device DR8 in one embodiment;

[0030] Figure 5C A top view of an optical fiber array assembly in an 8-channel optical signal transmission device DR8 according to an embodiment;

[0031] Figure 6A 16-channel optical signal transmission device DR16 according to an embodiment;

[0032] Figure 6B A top view of a 16-channel optical signal transmission device DR16 in one embodiment;

[0033] Figure 6C A schematic diagram of an optical fiber array assembly in a 16-channel optical signal transmission device DR16 according to an embodiment;

[0034] Figure 7A is a schematic diagram of a packaged optical signal transmission device in one embodiment;

[0035] Figure 7B is a schematic diagram of an optical signal transmission device before packaging in one embodiment;

[0036] Figure 8 1 is a schematic structural diagram of an active optical cable in one embodiment;

[0037] Figure 9 is a schematic diagram of a signal link in one embodiment;

[0038] Figure 10 Schematic diagram of the structure of a 16-channel active optical cable in one embodiment;

[0039] Figure 11 FIG. 4 is a schematic structural diagram of a 32-channel active optical cable in one embodiment.

[0040] The reference numerals are as follows:

[0041] First optical module assembly 1; second optical module assembly 2; electrical interface 3; optical interface 4; first transmitting assembly 11; first receiving assembly 12; second transmitting assembly 21; second receiving assembly 22; digital signal processor 23; circuit board 5;

[0042] Driver 111a corresponding to 8 channels; first silicon photonic chip 112a corresponding to 8 channels; first fiber array assembly 113a corresponding to 8 channels; first lens 114a corresponding to 8 channels; first laser 115a corresponding to 8 channels; first photodiode 121a corresponding to 8 channels; third fiber array assembly 122a corresponding to 8 channels; first transimpedance amplifier 123a corresponding to 8 channels; second silicon photonic chip 211a corresponding to 8 channels; second fiber array assembly 212a corresponding to 8 channels; second lens 213a corresponding to 8 channels; second laser 214a corresponding to 8 channels; second photodiode 221a corresponding to 8 channels; fourth fiber array assembly 222a corresponding to 8 channels; second transimpedance amplifier 223a corresponding to 8 channels; first tungsten copper base 6a corresponding to 8 channels; second tungsten copper base 7a corresponding to 8 channels;

[0043] Driver 111b corresponding to 16 channels; first silicon photonic chip 112b corresponding to 16 channels; first fiber array assembly 113b corresponding to 16 channels; first lens 114b corresponding to 16 channels; first laser 115b corresponding to 16 channels; polarization-maintaining fiber 116; first photodiode 121b corresponding to 16 channels; third fiber array assembly 122b corresponding to 16 channels; first transimpedance amplifier 123b corresponding to 16 channels; second silicon photonic chip 211b corresponding to 16 channels; second fiber array assembly 212b corresponding to 16 channels; second lens 213b corresponding to 16 channels; second laser 214b corresponding to 16 channels; second photodiode 221b corresponding to 16 channels; fourth fiber array assembly 222b corresponding to 16 channels; second transimpedance amplifier 223b corresponding to 16 channels; first tungsten-copper base 6b corresponding to 16 channels; second tungsten-copper base 7b corresponding to 16 channels; ceramic 8; heat sink 9;

[0044] First optical signal transmission device A; second optical signal transmission device B; transmission optical fiber C; third optical module assembly A1; fourth optical module assembly A2; first electrical interface A3; first optical interface A4; fifth optical module assembly B1; sixth optical module assembly B2; second electrical interface B3; second optical interface B4; third sending assembly A11; third receiving assembly A12; fourth sending assembly A21; fourth receiving assembly A22; first digital signal processor A23; fifth sending assembly B11; fifth receiving assembly B12; sixth sending assembly B21; sixth receiving assembly B22; second digital signal processor B23. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0049] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0050] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0051] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0052] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0053] With the development of communications technology, optical communications have been widely used in various fields due to their high communication capacity and low loss. When information is transmitted via optical fiber, various types of optical signal transmission devices have emerged, such as optical transceiver modules (or optical modules). Optical transceiver modules consist of a transmitter that converts electrical signals into optical signals, and a receiver that converts optical signals into electrical signals.

[0054] However, the increasing speed of optical transceivers has also led to high power consumption. Traditional high-speed optical modules, such as the 800G DR8, 1.6T DR8, and 1.6T DR16, consume very high power when operating on switches with throughputs of 51.6Tb / s, 115.2Tb / s, and above. This poses significant challenges to the use of clustered optical modules and the reliability and lifespan of pluggable optical modules. Furthermore, the two main high-temperature points in high-speed optical modules are the DSP (Digital Signal Processor) and the laser, particularly the DSP. Overheating of these components is a significant factor in module failure. Therefore, to effectively dissipate heat for the DSP during high-intensity data processing and transmission, it is necessary to further reduce the power consumption of high-density optical modules. This poses significant challenges to power consumption and heat dissipation. Consequently, current high-speed optical transceivers suffer from high power consumption.

[0055] In one embodiment, Figure 1 As shown, Figure 1 1 is a schematic structural diagram of an optical signal transmission device in one embodiment. The optical signal transmission device includes: a first optical module assembly 1, a second optical module assembly 2, an electrical interface 3, and an optical interface 4. The first optical module assembly 1 and the second optical module assembly 2 are both connected to an external device via the electrical interface 3. The first optical module assembly 1 and the second optical module assembly 2 are both connected to the optical interface 4.

[0056] The first optical module assembly 1 includes a first transmitting assembly 11 and a first receiving assembly 12. The input end of the first transmitting assembly 11 and the output end of the first receiving assembly 12 are both connected to the external device through the electrical interface 3; the output end of the first transmitting assembly 11 and the input end of the first receiving assembly 12 are both connected to the optical interface 4;

[0057] The second optical module assembly 2 includes a second sending assembly 21, a second receiving assembly 22 and a digital signal processor 23. The input end of the second sending assembly 21 and the output end of the second receiving assembly 22 are both connected to one end of the digital signal processor 23, and the other end of the digital signal processor 23 is connected to an external device through an electrical interface 3; the output end of the second sending assembly 21 and the input end of the second receiving assembly 22 are both connected to the optical interface 4.

[0058] The first optical module assembly 1 is used to implement optical signal transmission and optoelectronic conversion without a DSP, while the second optical module assembly 2 is used to implement optical signal transmission and optoelectronic conversion with a DSP. The first optical module assembly 1 includes a first transmitting component 11 and a first receiving component 12. The first transmitting component 11 may include, but is not limited to, silicon photonic chips and lasers, and the first receiving component 12 may include, but is not limited to, photodiodes and transimpedance amplifiers. It should be noted that the first optical module assembly 1 does not include a digital signal processor (DSP). The second optical module assembly 2 includes a second transmitting component 21, a second receiving component 22, and a digital signal processor 23. The second transmitting component 21 may include, but is not limited to, silicon photonic chips and lasers, and the second receiving component 22 may include, but is not limited to, photodiodes and transimpedance amplifiers. It should be noted that the second optical module assembly 2 includes a digital signal processor (DSP). This allows for a hybrid optical signal transmission device with a half DSP architecture and a half without a DSP.

[0059] It should be noted that the characteristic of this hybrid architecture of the embodiment of the present application is that a DSP that fully supports bidirectional signal processing is used inside the optical module. This DSP only participates in the signal processing of half of the transmitting link and half of the receiving link inside the optical module. The other half of the transmitting and receiving links respectively adopt the linear LPO (Linear-drive Pluggable Optics, linear drive pluggable optical module) method. Therefore, for optical module transmission, only one end of the transmitting or receiving link has a DSP to process the signal. For example, the second transmitting component 21 with DSP processing at the transmitting end can be called LRO (Linear Receive Optics, linear receiving optical module), and the second receiving component 22 with DSP processing at the receiving end can be called LTO (Linear Transmit Optics, linear transmitting optical module). The advantages of this hybrid architecture optical signal transmission device are that compared with traditional optical modules with DSP, it saves half of the power consumption, delay, and cost; compared with pure LPO optical modules, it improves link performance, stability, and interoperability between devices.

[0060] The electrical interface 3 may include, but is not limited to, components such as gold fingers, and is electrically connected to the digital signal processor 23. The electrical interface 3 is used to provide a drive signal to drive the silicon photonic chip. Optionally, the drive signal received by the electrical interface 3 can directly drive the silicon photonic chip; alternatively, the electrical interface 3 can be combined with the digital signal processor to jointly drive the silicon photonic chip.

[0061] External devices may include, but are not limited to, any device such as a switch. Optical interface 4 is a pluggable optical port, through which other devices (such as any other optical signal transmission device, optical fiber, etc.) can be pluggably connected or disconnected from the optical signal transmission device. Optionally, the optical port may be an MPO (Multi-fiber Push On, a high-density optical fiber connector), or the optical port may be another parallel optical port, or the optical port may be an interface designed in a pigtail manner. Of course, the embodiments of the present application do not limit the optical port.

[0062] In addition, the optical module in the embodiment of the present application can not only be a 1.6T OSFP-XD DR8 (Octal Small Form-factor Pluggable - Extra Dense Dual-Rate8, ultra-dense, octal small pluggable, dual-rate eight-channel) optical module, or the optical module in the embodiment of the present application can also be a 1.6T OSFP-XD DR16 optical module, or the optical module in the embodiment of the present application can also be a 1.6T OSFP DR8 (Octal Small Form-factor Pluggable Dual-Rate8, octal small pluggable, dual-rate eight-channel) optical module, or the optical module in the embodiment of the present application can also be an 800G OSFP DR8 optical module, or the optical module in the embodiment of the present application can also be an 800G QDD DR8 (Quad Small Form Factor Pluggable-Double Density Dual-Rate8, high-density, octal small pluggable, and supporting dual-wavelength 8-channel transmission) optical module.

[0063] In the embodiment of the present application, the electrical interface 3 can provide a driving signal to the first transmitting component 11, and the first transmitting component 11 can output at least one optical signal to the optical interface 4 according to the driving signal. In addition, when the optical interface 4 receives at least one optical signal, the optical interface 4 can transmit the at least one optical signal to the first receiving component 12. The first receiving component 12 can perform photoelectric conversion on the at least one optical signal to generate an electrical signal corresponding to the at least one optical signal, and transmit the electrical signal corresponding to the at least one optical signal to the electrical interface 3. Furthermore, the electrical interface 3 can transmit the electrical signal corresponding to the at least one optical signal to an external device.

[0064] The electrical interface 3 can provide a driving signal for the second transmitting component 21 and transmit the driving signal to the digital signal processor 23. The digital signal processor 23 can then perform at least one processing operation on the driving signal, such as signal amplification and equalization, and transmit the processed driving signal to the second transmitting component 21. The second transmitting component 21 can then output at least one optical signal to the optical interface 4 based on the processed driving signal. Furthermore, when the optical interface 4 receives at least one optical signal, the optical interface 4 can transmit the at least one optical signal to the second receiving component 22. The second receiving component 22 can perform photoelectric conversion on the at least one optical signal to generate an electrical signal corresponding to the at least one optical signal, and transmit the electrical signal corresponding to the at least one optical signal to the digital signal processor 23. The digital signal processor 23 can then perform at least one processing operation on the electrical signal, such as signal amplification and equalization, and transmit the processed electrical signal to the electrical interface 3. Furthermore, the electrical interface 3 can transmit the processed electrical signal to an external device.

[0065] In the above-mentioned optical signal transmission device, the optical signal transmission device includes: a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are both connected to the external device through the electrical interface; the first optical module assembly and the second optical module assembly are both connected to the optical interface; wherein, the first optical module assembly includes a first sending assembly and a first receiving assembly, the input end of the first sending assembly and the output end of the first receiving assembly are both connected to the external device through the electrical interface; the output end of the first sending assembly and the input end of the first receiving assembly are both connected to the optical interface; the second optical module assembly includes a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are both connected to one end of the digital signal processor, and the other end of the digital signal processor is connected to the external device through the electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are both connected to the optical interface. Since the first optical module assembly does not include a digital signal processor, and the second optical module assembly includes a digital signal processor, the embodiment of the present application can form an optical signal transmission device with a hybrid architecture in which half of the device has a DSP and the other half does not have a DSP. This can minimize the usage scenarios and duration of the digital signal processor in the optical signal transmission device while ensuring the effectiveness of optical signal transmission. This can further reduce the power consumption of the optical transceiver module and optimize the operation of the cluster optical module.

[0066] In one embodiment, Figure 2A 、 Figure 2B 、 Figure 2C As shown, Figure 2A FIG1 is a first structural diagram of an optical signal transmission device including a circuit board in one embodiment. Figure 2Bis a second structural diagram of an optical signal transmission device including a circuit board in one embodiment, Figure 2C for Figure 2B An enlarged schematic diagram of area A in the center. The optical signal transmission device further includes a printed circuit board (PCB) 5. A first optical module assembly 1 and a second optical module assembly 2 are arranged serially along a predetermined direction on one side of the PCB 5. An electrical interface 3 is provided at one end of the PCB 5. An optical interface 4 is spaced apart from the other end of the PCB 5 along a predetermined direction. The first optical module assembly 1 is provided on the PCB 5 near the electrical interface 3, and the second optical module assembly 2 is provided on the PCB 5 near the optical interface 4.

[0067] In this embodiment of the present application, the driver, transimpedance amplifier (TIA), laser, photodiode (PD), and other components in the first optical module assembly 1 and the driver, transimpedance amplifier (TIA), laser, photodiode (PD), and other components in the second optical module assembly 2 are all mounted on a circuit board 5 using silver adhesive. The light is then coupled into the corresponding fiber array assembly (FA) through a lens. It should be noted that the TX / RX (Transmit / Receive) terminals of the first optical module assembly 1 are located at the electrical interface 3, while the TX / RX terminals of the second optical module assembly 2 are located near the optical interface 4.

[0068] The principle of the above design is to take into account the SI (Signal Integrity) in the optical transceiver module. For example, for an 8-channel optical transceiver module:

[0069] For channels 1 to 4 (CH1-CH4), the high-speed TX1-TX4 link of the second transmitting component 21 is relatively long. Therefore, firstly, while ensuring sufficient optical device space, the DSP should be placed as close to the gold finger as possible to reduce link loss. Secondly, the driver should be placed as close to the DSP as possible to reduce losses. The high-speed RX1-RX4 link of the first receiving component 12 is relatively short. Therefore, without DSP signal compensation processing, the TIA needs to be placed as close to the gold finger as possible to minimize losses.

[0070] For channels 5 to 8 (CH5-CH8), the TX5-TX8 high-speed link of the first transmitting component 11 is relatively short. Therefore, DSP signal compensation processing is lacking, requiring the driver to be placed as close to the gold finger as possible to minimize losses. The RX5-RX8 high-speed link of the second receiving component 22 is relatively long. Therefore, firstly, while ensuring sufficient optical device space, the DSP should be placed as close to the gold finger as possible to reduce link losses; secondly, the TIA should be placed as close to the DSP as possible to reduce losses.

[0071] In this embodiment, by arranging the first optical module assembly near the electrical interface on the circuit board and arranging the second optical module assembly near the optical interface on the circuit board, the signal integrity and power consumption of the optical signal transmission device can be balanced as much as possible.

[0072] In one embodiment, the first transmitting component is any one of a 4-channel transmitting component, an 8-channel transmitting component, and a 16-channel transmitting component; the first receiving component is any one of a 4-channel receiving component, an 8-channel receiving component, and a 16-channel receiving component; the number of channels of the first receiving component and the first transmitting component is the same;

[0073] The second sending component is any one of a 4-channel sending component, an 8-channel sending component, and a 16-channel sending component; the second receiving component is any one of a 4-channel receiving component, an 8-channel receiving component, and a 16-channel receiving component; the number of channels of the second receiving component and the second sending component is the same.

[0074] For example, Figure 3 As shown, Figure 3 FIG. 1 is a schematic structural diagram of an 8-channel optical signal transmission device in one embodiment; FIG. Figure 4 As shown, Figure 4 1 is a schematic structural diagram of a 16-channel optical signal transmission device in an embodiment, wherein the components included in the optical signal transmission device can refer to the above embodiments and are not described in detail here.

[0075] In one embodiment, the above-mentioned first sending component includes a driver, a first silicon photonic chip, a first lens, a first laser and a first optical fiber array component. The driver, one end of the first lens and the first optical fiber array component are all connected to the first silicon photonic chip, and the other end of the first lens is connected to the first laser.

[0076] Optionally, one end of the first lens can be directly connected to the first silicon photonic chip, or one end of the first lens can be indirectly connected to the first silicon photonic chip via an optical fiber. Of course, this is not limited to this embodiment of the present application. It should be noted that in silicon photonic technology, when there are few channels and the PCB layout space allows, the light source (i.e., laser) at the LPO end can be placed in front, that is, one end of the first lens can be directly connected to the first silicon photonic chip, thereby eliminating optical components such as polarization-maintaining fiber.

[0077] In one embodiment, the second sending component includes a second silicon photonic chip, a second lens, a second laser and a second optical fiber array component. One end of the second lens and the second optical fiber array component are connected to the second silicon photonic chip, and the other end of the second lens is connected to the second laser.

[0078] In one embodiment, the first receiving component includes a first photodiode, a third fiber array component and a first transimpedance amplifier; one end of the first photodiode is connected to the third fiber array component, and the other end of the first photodiode is connected to the first transimpedance amplifier.

[0079] In one embodiment, the second receiving component includes a second photodiode, a fourth fiber array component and a second transimpedance amplifier; one end of the second photodiode is connected to the fourth fiber array component, and the other end of the second photodiode is connected to the second transimpedance amplifier.

[0080] The first silicon photonic chip is connected to the optical interface via a first fiber array assembly, and the second silicon photonic chip is connected to the optical interface via a second fiber array assembly. A PIC (Photonic Integrated Circuit) is provided in the silicon photonic chip, and materials such as the PIC can be processed using an FC chip (Flip Chip). The silicon photonic chip includes a multi-channel modulator, which is used to amplitude-modulate at least one optical signal to obtain an amplitude-modulated optical signal, and transmit the amplitude-modulated optical signal to the optical interface 4 via a corresponding fiber array assembly (TX FA, Transmit Fiber Array, the fiber array assembly at the transmitting end). Exemplarily, both the first laser and the second laser can be VCSELs (Vertical-Cavity Surface-Emitting Lasers), which are semiconductor laser products.

[0081] One end of the first photodiode is connected to the optical interface via a third fiber array assembly, and one end of the second photodiode is connected to the optical interface via a fourth fiber array assembly. The photodiode (PD) is used to receive an optical signal through a corresponding fiber array assembly (RX FA, Receive Fiber Array, the fiber array assembly at the receiving end), perform photoelectric conversion on the optical signal to obtain an electrical signal after photoelectric conversion, and transmit the electrical signal after photoelectric conversion to a transimpedance amplifier (TIA). A linear transimpedance amplifier (TIA) is used to amplify the electrical signal after photoelectric conversion to generate an electrical signal corresponding to the at least one optical signal.

[0082] In one embodiment, one end of the first lens may be directly connected to the first silicon photonic chip.

[0083] In an exemplary embodiment, Figure 5A As shown, Figure 5A FIG. 8 is a schematic structural diagram of an 8-channel optical signal transmission device DR8 in one embodiment; Figure 5B As shown, Figure 5B FIG. 8 is a top view of an overall 8-channel optical signal transmission device DR8 in one embodiment; FIG. Figure 5C As shown, Figure 5C This is a top view of the fiber array assembly in an 8-channel optical signal transmission device DR8 in one embodiment. The optical signal transmission device DR8 includes a first optical module assembly 1, a second optical module assembly 2, an electrical interface 3, an optical interface 4, and a circuit board 5. The first optical module assembly 1 includes a first transmitting assembly 11 and a first receiving assembly 12. The second optical module assembly 2 includes a second transmitting assembly 21, a second receiving assembly 22, and a digital signal processor 23. The first transmitting assembly 11 includes a driver 111a corresponding to the 8 channels, a first silicon photonic chip 112a corresponding to the 8 channels, a first fiber array assembly 113a corresponding to the 8 channels, a first lens 114a corresponding to the 8 channels, and a first laser 111 corresponding to the 8 channels. 5a, the first receiving component 12 includes a first photodiode 121a corresponding to the 8 channels, a third optical fiber array component 122a corresponding to the 8 channels, and a first transimpedance amplifier 123a corresponding to the 8 channels. The second sending component 21 includes a second silicon photonic chip 211a corresponding to the 8 channels, a second optical fiber array component 212a corresponding to the 8 channels, a second lens 213a corresponding to the 8 channels, and a second laser 214a corresponding to the 8 channels. The second receiving component 22 includes a second photodiode 221a corresponding to the 8 channels, a fourth optical fiber array component 222a corresponding to the 8 channels, and a second transimpedance amplifier 223a corresponding to the 8 channels.

[0084] Combine Figure 5BAs shown, the optical signal transmission device DR8 also includes materials such as a first tungsten copper base 6a corresponding to 8 channels and a second tungsten copper base 7a corresponding to 8 channels, wherein the first tungsten copper base 6a and the second tungsten copper base 7a are bonded to the PCB slot with epoxy glue, and the driver (Driver) 111a, the first silicon photonic chip 112a corresponding to the 8 channels, the first photodiode 121a and the first transimpedance amplifier 123a are fixed on the first tungsten copper base 6a and the circuit board 5 through silver glue patches, and the second silicon photonic chip 211a, the second photodiode 221a and the second transimpedance amplifier 223a corresponding to the 8 channels are fixed on the second tungsten copper base 7a and the circuit board 5 through silver glue patches.

[0085] For signal routing, 8x100G PAM4 (4-Level Pulse Amplitude Modulation) electrical signals are input through electrical interface 3. These 4x100G PAM4 electrical signals are directly transmitted to LPO driver 111a, which drives the first silicon photonics chip 112a via the eight channels of driver 111a. Driver 111a's CTLE (Continuous-Time Linear Equalizer) performs signal processing. Furthermore, a first laser 115a generates an optical signal, which is then transmitted to the first silicon photonics chip 112a through a first lens 114a. The first silicon photonics chip 112a then performs silicon photonics modulation on the optical signal, couples the modulated optical signal to the first fiber array assembly 113a, and transmits the modulated optical signal to optical interface 4. When the optical signal is input to the optical interface 4 through the optical fiber cable, the optical signal can be coupled to the second photodiode 221a through the fourth optical fiber array component 222a, and the optical signal can be photoelectrically converted by the second photodiode 221a to obtain a converted electrical signal, and then the converted electrical signal can be amplified by the second transimpedance amplifier 223a, and the amplified electrical signal can be signal-processed by the digital signal processor 23. After that, the signal-processed electrical signal can be output to the external device through the electrical interface 3.

[0086] The other 4*100G PAM4 electrical signal is transmitted to the digital signal processor 23, which processes the 4*100G PAM4 electrical signal and inputs the processed 4*100G PAM4 electrical signal into the second silicon photonic chip 211a, wherein the second silicon photonic chip 211a has a built-in driver. Furthermore, an optical signal is generated by the second laser 214a, and the optical signal is transmitted to the second silicon photonic chip 211a through the second lens 213a. Thus, the second silicon photonic chip 211a can perform silicon photonic modulation on the optical signal based on the processed 4*100G PAM4 electrical signal, couple the modulated optical signal to the second optical fiber array assembly 212a, and then transmit the modulated optical signal to the optical interface 4 through the second optical fiber array assembly 212a. When an optical signal is input to the optical interface 4 through an optical fiber cable, the optical signal can be coupled to the first photodiode 121a through the third optical fiber array component 122a, and the optical signal can be photoelectrically converted by the first photodiode 121a to obtain a converted electrical signal. The converted electrical signal is then amplified and EQ (equalization) processed by the first transimpedance amplifier 123a. Thereafter, the amplified and EQ-processed electrical signal can be output to an external device through the electrical interface 3.

[0087] In one embodiment, the first transmitting component further includes a polarization-maintaining optical fiber, one end of the first lens is connected to the first silicon photonic chip via the polarization-maintaining optical fiber, and the first lens and the first laser are arranged on the circuit board near the optical interface.

[0088] In an exemplary embodiment, Figure 6A As shown, Figure 6A FIG. 1 is a schematic structural diagram of a 16-channel optical signal transmission device DR16 in one embodiment; Figure 6B As shown, Figure 6B FIG1 is a top view of a 16-channel optical signal transmission device DR16 in one embodiment; Figure 6C As shown, Figure 6CThe figure is a schematic diagram of an optical fiber array assembly in a 16-channel optical signal transmission device DR16 in one embodiment. The optical signal transmission device DR16 includes a first optical module assembly 1 and a second optical module assembly 2, an electrical interface 3, an optical interface 4, and a circuit board 5. The first optical module assembly 1 includes a first transmitting assembly 11 and a first receiving assembly 12. The second optical module assembly 2 includes a second transmitting assembly 21, a second receiving assembly 22, and a digital signal processor 23. The first transmitting assembly 11 includes a driver 111b corresponding to the 16 channels, a first silicon photonic chip 112b corresponding to the 16 channels, a first optical fiber array assembly 113b corresponding to the 16 channels, a first lens 114b corresponding to the 16 channels, a first laser 115b corresponding to the 16 channels, and a polarization-maintaining light source. The optical fiber 116, the first receiving component 12 includes a first photodiode 121b corresponding to the 16 channels, a third optical fiber array component 122b corresponding to the 16 channels, and a first transimpedance amplifier 123b corresponding to the 16 channels. The second sending component 21 includes a second silicon photonic chip 211b corresponding to the 16 channels, a second optical fiber array component 212b corresponding to the 16 channels, a second lens 213b corresponding to the 16 channels, and a second laser 214b corresponding to the 16 channels. The second receiving component 22 includes a second photodiode 221b corresponding to the 16 channels, a fourth optical fiber array component 222b corresponding to the 16 channels, and a second transimpedance amplifier 223b corresponding to the 16 channels.

[0089] Combine Figure 6A and Figure 6BAs shown, the optical signal transmission device DR16 also includes a first tungsten copper base 6b corresponding to 16 channels, a second tungsten copper base 7b corresponding to 16 channels, ceramic 8, a heat sink 9 and other materials. Among them, the first tungsten copper base 6b and the second tungsten copper base 7b are bonded to the PCB slot using high-temperature glue, and then bonded to the PCB half slot through the front of the ceramic 8. The digital signal processor 23 is flip-chip mounted on the circuit board 5. The driver 111b corresponding to the 16 channels, the first silicon photonic chip 112b, the first laser 115b, the first photodiode 121b and the first transimpedance amplifier 123b corresponding to the 16 channels are fixed to the first tungsten copper base 6b, the ceramic 8 and the circuit board 5 and other components through silver glue patches. The second silicon photonic chip 211b, the second laser 214b, the second photodiode 221b and the second transimpedance amplifier 223b corresponding to the 16 channels are fixed to the second tungsten copper base 7b, the ceramic 8 and the circuit board 5 and other components through silver glue patches. Alternatively, the laser can be eutecticized into a COC (Chip on Carrier) and then bonded to a TEC (Thermo Electric Cooler) or directly to a heat sink using silver glue. It should be noted that the DR16 cannot move the laser forward or position it in front of the substrate because placing the laser in front of the substrate would not meet the required PCB SI routing requirements.

[0090] For signal routing, 16*100G PAM4‌ (‌4-Level Pulse Amplitude Modulation) electrical signals are input through electrical interface 3. Among them, 8*100G PAM4 electrical signals are directly transmitted to the LPO driver (Driver) 111b, which drives the first silicon photonic chip 112b through the driver 111b corresponding to the 16 channels. In addition, because the LPO link channels are arranged close to the gold fingers in this embodiment of the application, the light source of the LPO short silicon photonics is located at the COC at the optical port end. The optical signal can be generated by the first laser 115b and coupled to at least one polarization-maintaining fiber 116 in the polarization-maintaining fiber array through the first lens 114b. The polarization-maintaining fiber 116 is connected to the first fiber array assembly 113b, so that the optical signal can be transmitted to the first silicon photonic chip 112b through the polarization-maintaining fiber 116 and the first fiber array assembly 113b. Furthermore, the first silicon photonic chip 112b can perform silicon photonic modulation on the optical signal and couple the modulated optical signal to the first optical fiber array assembly 113b. The modulated optical signal is then transmitted to the optical interface 4 via the ordinary optical fiber in the first optical fiber array assembly 113b. The optical fibers in each of the above optical fiber array assemblies are all ordinary optical fibers.

[0091] When the optical signal is input to the optical interface 4 through the optical fiber cable, the optical signal can be coupled to the second photodiode 221b through the fourth optical fiber array component 222b, and the optical signal can be photoelectrically converted by the second photodiode 221b to obtain a converted electrical signal, and then the converted electrical signal is amplified by the second transimpedance amplifier 223b, and the amplified electrical signal is signal-processed by the digital signal processor 23. After that, the signal-processed electrical signal can be output to the external device through the electrical interface 3.

[0092] The other 8*100G PAM4 electrical signals are transmitted to the digital signal processor 23, which processes the 8*100G PAM4 electrical signals and inputs the processed 8*100G PAM4 electrical signals into the second silicon photonic chip 211b, wherein the second silicon photonic chip 211b has a built-in driver. Furthermore, an optical signal is generated by the second laser 214b, and the optical signal is transmitted to the second silicon photonic chip 211b through the second lens 213b. Thus, the second silicon photonic chip 211b can perform silicon photonic modulation on the optical signal based on the processed 8*100G PAM4 electrical signals, couple the modulated optical signal to the second optical fiber array assembly 212b, and then transmit the modulated optical signal to the optical interface 4 through the second optical fiber array assembly 212b. When an optical signal is input to the optical interface 4 through an optical fiber cable, the optical signal can be coupled to the first photodiode 121b through the third optical fiber array component 122b, and the optical signal can be photoelectrically converted by the first photodiode 121b to obtain a converted electrical signal. The converted electrical signal is then amplified and EQ (equalization) processed by the first transimpedance amplifier 123b. Thereafter, the amplified and EQ-processed electrical signal can be output to an external device through the electrical interface 3.

[0093] In an exemplary embodiment, Figure 7A As shown, Figure 7A FIG. 1 is a schematic diagram of a packaged optical signal transmission device in one embodiment; FIG. Figure 7B As shown, Figure 7B FIG2 is a schematic diagram of an optical signal transmission device before packaging in an embodiment. The present embodiment does not limit the packaging method of the optical signal transmission device. The components of the optical signal transmission device have been introduced in the above embodiments and will not be described again here.

[0094] In one embodiment, Figure 8 As shown, Figure 8This is a schematic structural diagram of an active optical cable in one embodiment. An active optical cable is provided. The active optical cable includes a first optical signal transmission device A, a second optical signal transmission device B, and a transmission optical fiber C. The first optical signal transmission device A and the second optical signal transmission device B are connected by the transmission optical fiber C.

[0095] Among them, the first optical signal transmission device A and the second optical signal transmission device B can both be the optical signal transmission devices introduced in any of the above embodiments, and the specific components in the first optical signal transmission device A and the second optical signal transmission device B are not described in detail here.

[0096] The active optical cable described above includes a first optical signal transmission device, a second optical signal transmission device, and a transmission optical fiber, with the first and second optical signal transmission devices connected by the transmission optical fiber. Because the first and second optical signal transmission devices can each form a hybrid optical signal transmission device with a half DSP and half without a DSP, the active optical cable can minimize the use scenarios and duration of the digital signal processors in the first and second optical signal transmission devices while ensuring the effectiveness of optical signal transmission. This, in turn, reduces the power consumption of the optical transceiver module and optimizes the operation of the cluster optical module.

[0097] In one embodiment, the combination Figure 8 As shown, the first optical signal transmission device A includes a third optical module assembly A1, a fourth optical module assembly A2, a first electrical interface A3 and a first optical interface A4; the third optical module assembly A1 and the fourth optical module assembly A2 are both connected to the first external device through the first electrical interface A3; the third optical module assembly A1 and the fourth optical module assembly A2 are both connected to the first optical interface A4;

[0098] The second optical signal transmission device B includes a fifth optical module assembly B1, a sixth optical module assembly B2, a second electrical interface B3, and a second optical interface B4; the fifth optical module assembly B1 and the sixth optical module assembly B2 are both connected to the second external device via the second electrical interface B3; the fifth optical module assembly B1 and the sixth optical module assembly B2 are both connected to the second optical interface B4;

[0099] Among them, the fourth optical module assembly A2 and the sixth optical module assembly B2 include digital signal processors; the third optical module assembly A1 is connected to the sixth optical module assembly B2 through the first optical interface A4, the transmission optical fiber C, and the second optical interface B4, and the fourth optical module assembly A2 is connected to the fifth optical module assembly B1 through the first optical interface A4, the transmission optical fiber C, and the second optical interface B4.

[0100] In this embodiment of the present application, the third optical module assembly A1 includes a third transmitting assembly A11 and a third receiving assembly A12. The input end of the third transmitting assembly A11 and the output end of the third receiving assembly A12 are both connected to an external device via a first electrical interface A3. The output end of the third transmitting assembly A11 and the input end of the third receiving assembly A12 are both connected to a first optical interface A4. The fourth optical module assembly A2 includes a fourth transmitting assembly A21, a fourth receiving assembly A22, and a first digital signal processor A23. The input end of the fourth transmitting assembly A21 and the output end of the fourth receiving assembly A22 are both connected to one end of the first digital signal processor A23, and the other end of the first digital signal processor A23 is connected to an external device via a first electrical interface A3. The output end of the fourth transmitting assembly A21 and the input end of the fourth receiving assembly A22 are both connected to the first optical interface A4.

[0101] The fifth optical module assembly B1 includes a fifth transmitting assembly B11 and a fifth receiving assembly B12. The input end of the fifth transmitting assembly B11 and the output end of the fifth receiving assembly B12 are both connected to an external device via a second electrical interface B3. The output end of the fifth transmitting assembly B11 and the input end of the fifth receiving assembly B12 are both connected to a second optical interface B4. The sixth optical module assembly B2 includes a sixth transmitting assembly B21, a sixth receiving assembly B22, and a second digital signal processor B23. The input end of the sixth transmitting assembly B21 and the output end of the sixth receiving assembly B22 are both connected to one end of the second digital signal processor B23. The other end of the second digital signal processor B23 is connected to an external device via a second electrical interface B3. The output end of the sixth transmitting assembly B21 and the input end of the sixth receiving assembly B22 are both connected to the second optical interface B4.

[0102] It should be noted that both the fourth optical module assembly A2 and the sixth optical module assembly B2 include a digital signal processor, while neither the third optical module assembly A1 nor the fifth optical module assembly B1 includes a digital signal processor. Specifically, the first optical interface A4 and the second optical interface B4 can be pluggable optical ports, and the transmission fiber C in the active optical cable (AOC) can be pluggably connected to the first optical interface A4 in the first optical signal transmission device A and the second optical interface B4 in the second optical signal transmission device B. Furthermore, when expanded to links involving multiple optical modules, embodiments of the present application can also enhance link interoperability between the hybrid architecture and LPO / LRO / LTO / DSP optical modules, thereby increasing the diversity of switching links.

[0103] In an exemplary embodiment, Figure 9 As shown, Figure 9This is a schematic diagram of a signal chain in one embodiment. Among the 8*100G PAM4 electrical signals from the ASIC (Application-Specific Integrated Circuit), the 4*100G PAM4 electrical signal portion passes through the DSP. This 4*100G PAM4 electrical signal is amplified by the DSP's VGA (Variable Gain Amplifier), equalized by the DSP's DFE (Decision Feedback Equalizer), and finally decoded and encoded by the DSP for signal optimization. Afterwards, the signal-optimized 4*100G PAM4 electrical signal is sent to the fourth transmitting component A21 for driving and electro-optical conversion to obtain a 4*100G PAM4 optical signal. This signal is then transmitted to the fifth receiving component B12 via the transmission optical fiber C. The fifth receiving component B12 can then perform optoelectronic conversion and amplification on the received 4*100G PAM4 optical signal and then directly send the amplified electrical signal to the ASIC for processing.

[0104] Another 4*100G PAM4 electrical signal portion of the ASIC's 8*100G PAM4 electrical signal is directly fed to the third transmitting component A11 for driving and electro-optical conversion, generating a 4*100G PAM4 optical signal. This is then transmitted to the sixth receiving component B22 via transmission fiber C. The sixth receiving component B22 can then perform electro-optical conversion and amplification on the received 4*100G PAM4 optical signal, and then feed the amplified electrical signal to the DSP. The DSP performs signal optimization processing such as amplification, equalization, decoding, and encoding on the amplified optical signal to generate an optimized 4*100G PAM4 electrical signal, which is then fed to the ASIC.

[0105] In an exemplary embodiment, Figure 10 As shown, Figure 10This is a schematic diagram of the structure of a 16-channel active optical cable in an embodiment, wherein the 16-channel active optical cable includes 4 channels of A11, 4 channels of A12, 4 channels of A21, and 4 channels of A22, as well as 4 channels of B11, 4 channels of B12, 4 channels of B21, and 4 channels of B22. Half of the channel links use the DSP function to reduce the power consumption of the optical module, that is, each link has half of the DSP. For example, if TX uses DSP processing, the corresponding RX uses LPO processing; if RX uses DSP processing, TX uses LPO processing. For example, A11 for transmission from channel 5 to channel 8 (TX5-TX8), A12 for reception from channel 1 to channel 4 (RX1-RX4), B11 for transmission from channel 5 to channel 8 (TX5-TX8), and B12 for reception from channel 1 to channel 4 (RX1-RX4) all use LPO processing. A21 for transmission from channel 1 to channel 4 (TX1-TX4), A22 for reception from channel 5 to channel 8 (RX5-RX8), B21 for transmission from channel 1 to channel 4 (TX1-TX4), and B22 for reception from channel 5 to channel 8 (RX5-RX8) all use DSP processing. This reduces power consumption and latency by eliminating some DSP functions throughout the link.

[0106] In an exemplary embodiment, Figure 11 As shown, Figure 11 Schematic diagram of the structure of a 32-channel active optical cable in one embodiment, wherein the 32-channel active optical cable includes 8 channels of A11, 8 channels of A12, 8 channels of A21, 8 channels of A22, and 8 channels of B11, 8 channels of B12, 8 channels of B21, and 8 channels of B22, and uses the DSP function of half-channel links to reduce the power consumption of the optical module. For example, it can be A11 for sending from channel 1 to channel 8 (i.e., TX1~TX8), A11 for receiving from channel 9 to channel 16 (i.e., RX9~RX16), and A12 for sending from channel 1 to channel 8 (i.e., TX1~TX8). A12, B11 for sending from channel 1 to channel 8 (i.e. TX1~TX8), and B12 for receiving from channel 9 to channel 16 (i.e. RX9~RX16) all use LPO processing, while A21 for sending from channel 9 to channel 16 (i.e. TX9~TX16), A22 for receiving from channel 1 to channel 8 (i.e. RX1~RX8), B21 for sending from channel 9 to channel 16 (i.e. TX9~TX16), and B22 for receiving from channel 1 to channel 8 (i.e. RX1~RX8) all use DSP processing.

[0107] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0108] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. An optical signal transmission device, characterized in that: The optical signal transmission device includes: a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are both connected to an external device through the electrical interface; the first optical module assembly and the second optical module assembly are both connected to the optical interface; The first optical module assembly includes a first transmitting assembly and a first receiving assembly, the input end of the first transmitting assembly and the output end of the first receiving assembly are both connected to the external device through the electrical interface; the output end of the first transmitting assembly and the input end of the first receiving assembly are both connected to the optical interface; The second optical module assembly includes a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are both connected to one end of the digital signal processor, and the other end of the digital signal processor is connected to the external device through the electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are both connected to the optical interface.

2. The device according to claim 1, characterized in that The optical signal transmission device also includes a circuit board, the first optical module assembly and the second optical module assembly are arranged in series along a preset direction on one side surface of the circuit board, the electrical interface is arranged at one end of the circuit board, the optical interface is arranged at a distance from the other end of the circuit board in the preset direction, and the first optical module assembly is arranged at a position on the circuit board close to the electrical interface, and the second optical module assembly is arranged at a position on the circuit board close to the optical interface.

3. The device according to claim 1, characterized in that The first transmitting component is any one of a 4-channel transmitting component, an 8-channel transmitting component, and a 16-channel transmitting component; the first receiving component is any one of a 4-channel receiving component, an 8-channel receiving component, and a 16-channel receiving component; the number of channels of the first receiving component and the first transmitting component is the same; The second sending component is any one of a 4-channel sending component, an 8-channel sending component, and a 16-channel sending component; the second receiving component is any one of a 4-channel receiving component, an 8-channel receiving component, and a 16-channel receiving component; the number of channels of the second receiving component and the second sending component are the same.

4. The device according to claim 2 or 3, characterized in that The first sending component includes a driver, a first silicon photonic chip, a first lens, a first laser and a first optical fiber array component. The driver, one end of the first lens and the first optical fiber array component are all connected to the first silicon photonic chip, and the other end of the first lens is connected to the first laser.

5. The device according to claim 4, characterized in that The second sending component includes a second silicon photonic chip, a second lens, a second laser and a second optical fiber array component. One end of the second lens and the second optical fiber array component are connected to the second silicon photonic chip, and the other end of the second lens is connected to the second laser.

6. The device according to claim 5, characterized in that The first sending component also includes a polarization-maintaining optical fiber, one end of the first lens is connected to the first silicon photonic chip through the polarization-maintaining optical fiber, and the first lens and the first laser are arranged on a circuit board near the optical interface.

7. The device according to claim 1, characterized in that The first receiving component includes a first photodiode, a third optical fiber array component and a first transimpedance amplifier; one end of the first photodiode is connected to the third optical fiber array component, and the other end of the first photodiode is connected to the first transimpedance amplifier.

8. The device according to claim 1, characterized in that The second receiving component includes a second photodiode, a fourth optical fiber array component and a second transimpedance amplifier; one end of the second photodiode is connected to the fourth optical fiber array component, and the other end of the second photodiode is connected to the second transimpedance amplifier.

9. An active optical cable, characterized in that: The active optical cable includes a first optical signal transmission device, a second optical signal transmission device and a transmission optical fiber, and the first optical signal transmission device and the second optical signal transmission device are connected through the transmission optical fiber.

10. The optical cable according to claim 9, wherein The first optical signal transmission device includes a third optical module assembly, a fourth optical module assembly, a first electrical interface, and a first optical interface; the third optical module assembly and the fourth optical module assembly are both connected to a first external device via the first electrical interface; the third optical module assembly and the fourth optical module assembly are both connected to the first optical interface; The second optical signal transmission device includes a fifth optical module assembly, a sixth optical module assembly, a second electrical interface, and a second optical interface; the fifth optical module assembly and the sixth optical module assembly are both connected to a second external device via the second electrical interface; the fifth optical module assembly and the sixth optical module assembly are both connected to the second optical interface; Among them, the fourth optical module assembly and the sixth optical module assembly include digital signal processors; the third optical module assembly is connected to the sixth optical module assembly through the first optical interface, the transmission optical fiber, and the second optical interface, and the fourth optical module assembly is connected to the fifth optical module assembly through the first optical interface, the transmission optical fiber, and the second optical interface.

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