High-speed 4G communication module of concentrator

Abstract

The invention relates to the technical field of communication, and discloses a concentrator high-speed 4G communication module, which comprises an Ethernet interface used for external connection; the USB interface is used for external connection; the intelligent MCU is used for controlling data exchange between the USB interface and the 4G communication chip; the all-Netcom 4G communication chip is used for providing a data transmission channel; the intelligent MCU is an ARM (Advanced RISC Machines) Cortex-M series processor; the all-Netcom 4G communication chip supports FDD-LTE (Frequency Division Duplexing Long Term Evolution), TD-LTE (Time Division Long Term Evolution) The Ethernet interface and the USB interface are respectively designed by adopting an industrial-grade circuit; in the module, after a concentrator receives a data packet sent by a subordinate device, the data packet is transmitted to an intelligent MCU through an Ethernet interface. Through intelligent selection of the optimal network path, good communication quality can be maintained even in a severe network environment, the robustness of the system and the user experience are improved, the uplink communication speed of the concentrator is greatly improved, the uplink communication speed reaches about 20 times of that of a traditional scheme, and the real-time performance and the accuracy of data transmission are greatly enhanced.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a concentrator high-speed 4G communication module. Background Art

[0002] The rapid development of the power industry, particularly the promotion and application of smart grids and the power Internet of Things (IoT), has placed higher demands on communication modules for data transmission in power companies' automated metering (AMI) systems. As a core component in these systems, concentrators are primarily responsible for collecting data from downstream metering devices and uploading it to the master station. To meet the requirements for efficient and stable transmission of power data, concentrators must possess high bandwidth, high reliability, and excellent anti-interference capabilities. These capabilities are crucial for improving power management, ensuring data accuracy, and guaranteeing stable power system operation.

[0003] Conventional concentrator communication modules typically rely on serial ports (RS-232 / RS-485) and GPRS (2G / 3G) for data transmission. While these communication methods met initial needs to a certain extent, with the expansion of power systems and the increasing demands for data transmission speed, stability, and security, traditional solutions are becoming inadequate. To address these issues, the industry has attempted to upgrade GPRS modules, introduce higher-level wireless communication technologies (such as 4G), or replace the entire concentrator. However, these approaches still have limitations and have failed to fundamentally improve communication performance and compatibility.

[0004] A major problem with existing technologies is that the serial ports and GPRS communication technology used in traditional concentrators are unable to meet the high-speed, high-capacity data transmission requirements of modern power systems. Especially in complex power environments, unstable and slow data transmission has become a bottleneck restricting system performance. Furthermore, upgrading the communication module or replacing the concentrator often requires high costs and a long implementation cycle, and it is difficult to ensure good compatibility with existing systems. Therefore, there is an urgent need for a new communication module that can overcome the limitations of traditional serial ports, utilize high-speed and stable 4G communication technology, and maintain compatibility with equipment from different manufacturers, thereby effectively improving data upload efficiency and reducing overall system complexity and cost. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a concentrator high-speed 4G communication module, which solves the deficiencies of traditional concentrator communication modules in data transmission rate, stability and system compatibility.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a concentrator high-speed 4G communication module, comprising: Ethernet interface for external connection; USB interface for external connection; Intelligent MCU, used to control data exchange between the USB interface and the 4G communication chip; Full-network 4G communication chip, used to provide data transmission channels.

[0007] Preferably, the intelligent MCU is an ARM Cortex-M series processor.

[0008] Preferably, the full-network 4G communication chip supports FDD-LTE, TD-LTE, WCDMA, and GSM standards.

[0009] Preferably, the Ethernet interface and USB interface respectively adopt industrial-grade circuit design.

[0010] Preferably, in the module, after the concentrator receives the data packet sent by the lower-level device, it transmits it to the intelligent MCU through the Ethernet interface; The intelligent MCU parses and converts the data format to generate data frames suitable for 4G transmission; The intelligent MCU drives the all-network 4G communication chip to start data transmission and upload data by selecting the optimal channel.

[0011] Preferably, the intelligent MCU automatically selects the best available channel for data uploading based on the configured network parameters.

[0012] Preferably, the module connects the Ethernet interface, USB interface, smart MCU and full-network 4G communication chip into an integral structure through the circuit on the PCB board.

[0013] Preferably, the module complies with the State Grid 2013 version of the standard concentrator type I remote communication module interface specification.

[0014] Preferably, the average data throughput of the module is above 60 Mbps.

[0015] The present invention provides a concentrator high-speed 4G communication module. It has the following beneficial effects: 1. This invention uses a full-network 4G communication chip, supporting multiple communication standards such as FDD-LTE, TD-LTE, WCDMA, and GSM. Compared with traditional GPRS or serial communication, the module's transmission rate is increased by about 20 times, enabling fast and stable data upload in complex power environments. Under the control of the intelligent MCU, the module automatically selects the optimal channel under different network conditions, ensuring efficient and stable data transmission, effectively solving the problems of slow and unstable data transmission existing in traditional technologies.

[0016] 2. This invention utilizes Ethernet and USB interfaces, eliminating the traditional concentrator's reliance on serial ports. This design not only maintains excellent compatibility with legacy systems but also facilitates seamless integration with terminal devices from different manufacturers. Whether upgrading existing systems or integrating into new equipment, data access and transmission are easily achieved, reducing the difficulty and cost of system transformation.

[0017] 3. The concentrator high-speed 4G communication module of this invention integrates multiple functions into a single module. Using an intelligent MCU, it centrally controls the Ethernet interface, USB interface, and 4G communication chip, reducing the complexity of multiple modules required for coordination in traditional systems. This simplified design not only reduces overall system costs but also reduces maintenance and operational complexity, thereby improving system reliability and operability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a module schematic diagram of the present invention. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the present specification. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] Please see the attached Figure 1 , an embodiment of the present invention provides a concentrator high-speed 4G communication module, comprising: 1. Ethernet interface In this embodiment, the Ethernet interface of the concentrator's high-speed 4G communication module serves as a connection channel with downstream devices (such as electricity meters and sensors), responsible for rapid data transmission. The Ethernet interface utilizes an industrial-grade design, supporting Ethernet and TCP / IP protocols, ensuring stable operation in high-interference power environments. This interface is primarily used to transmit power data from downstream devices to the concentrator's intelligent MCU for subsequent data processing and forwarding. The Ethernet interface supports a standard RJ45 connector, ensuring compatibility with a wide range of devices, particularly those from different manufacturers. The maximum data transmission rate supported is 1 Gbps, enabling efficient transmission of large amounts of power data from downstream devices, avoiding the bottlenecks associated with traditional communication methods.

[0021] After downstream devices collect power usage data, it's first transmitted to the concentrator via an Ethernet interface. The Ethernet interface encapsulates the data and transmits it to the intelligent MCU for analysis. The intelligent MCU converts the parsed data into a format suitable for 4G communication. The data is then passed to the all-network 4G communication chip for upload to a remote master station or cloud platform. During data transmission, the Ethernet interface enables full-duplex communication, supporting simultaneous data reception and transmission, thereby improving data exchange efficiency.

[0022] In this embodiment, the Ethernet interface adopts an industrial-grade circuit design, and its physical layer chip is DM9161CEP, which is connected to the GPIO port of the intelligent MCU (103) via the RMII interface, as follows: The interface circuit includes an impedance matching network consisting of two 49.9Ω resistors (R1, R2) with an accuracy of ±1% connected in series, which is soldered between the differential signal lines (TX+, TX-) of the RJ45 connector and the transmitting end of the physical layer chip (U1); The pin definition of the RJ45 connector complies with the ANSI / TIA-1096-A standard, where pins 1 and 2 are used to receive differential signals (RX+, RX-), and pins 3 and 6 are used to transmit differential signals (TX+, TX-). The shield layer is grounded via a 0.1μF capacitor (C1). (3) The configuration register of the physical layer chip (U1) is initialized to: Write 0x2100 to register address 0x00 (enable auto-negotiation function); Register address 0x04 is written to 0x05E1 (set full-duplex mode); Register address 0x16 is written to 0x0003 (CRC check and short packet padding are enabled); (4) The specific connection method of the signal transmission path is: The PD0-PD7 pins of the intelligent MCU (103) are connected to the RMII_TXD[0:1] and RMII_RXD[0:1] signal lines of the physical layer chip (U1); The LED1 pin of the physical layer chip (U1) is connected to the PA0 pin of the intelligent MCU (103) to indicate the link status; (5) The data transmission process includes the following steps: The MODBUS-RTU protocol data frame sent by the lower-level device is input via the RJ45 connector (102); The physical layer chip (U1) performs Manchester decoding and generates parallel data and writes it into the receiving buffer; The intelligent MCU (103) reads the buffer data through an interrupt mode and performs a CRC-16 check; The data packets that pass the verification are converted into TCP / IP format, and the encapsulated target IP address is the preset main station server address (192.168.1.100); (6) Anti-interference measures include: Connect a TVS diode (D1, SMBJ5.0CA) and a 10μF tantalum capacitor (C2) in parallel at the power input. The signal line should be ≥3mm away from the edge of the PCB and covered with ground (GND copper foil width ≥0.5mm); A grounding area is set at the bottom of the physical layer chip (U1) and connected to the ground layer through vias (V1-V8).

[0023] 2.USB interface The USB interface in the concentrator's high-speed 4G communication module serves as a key external connection port, enhancing system compatibility and providing flexible device access. Supporting standard USB 2.0 protocols and featuring plug-and-play functionality, the USB interface facilitates data exchange with devices from different manufacturers (such as electricity meters and sensors) without requiring additional configuration or driver installation. While enabling efficient data exchange, the USB interface significantly enhances system flexibility and compatibility, particularly in field environments where Ethernet connectivity is unavailable.

[0024] When a downstream device connects to the concentrator via a USB port, it transmits real-time collected power data to the concentrator's intelligent MCU. The MCU then parses and processes the data, transferring it to a fully networked 4G communication chip. This data is then uploaded to the power company's main station or cloud platform via the wireless 4G network for storage and analysis. The plug-and-play nature of the USB port allows field personnel to quickly connect devices and exchange data, streamlining on-site operations.

[0025] The physical connector of the USB interface uses a USB Type-B female connector, and its pin definition strictly complies with the USB 2.0 specification. Pin 1 (VBUS) is connected to the 5V power line through a 1A resettable fuse (F1). Pins 2 (D-) and 3 (D+) are connected to the DP and DM signal terminals of the USB3300 control chip (U2) through 22Ω impedance matching resistors (R3 and R4) in series, respectively. Pin 4 (GND) is connected to the PCB ground layer through a star grounding method. The configuration registers of the USB3300 controller chip (U2) are initialized to: Register address 0x00 is written to 0x0004 (enable high-speed mode); Register address 0x08 is written to 0x0080 (sets batch transfer mode); Register address 0x0C is written to 0x0001 (CRC16 check is enabled). The hardware connection between the USB interface and the intelligent MCU is as follows: the TXVALID and RXVALID signal lines of the UTMI interface of the USB3300 control chip (U2) are connected to the PB12 and PB13 pins of the intelligent MCU respectively, and the data bus D0-D7 is connected to the PC0-PC7 pins; The data transfer process includes the following steps: The DL / T 698.45 protocol data frame sent by the lower-level device is input to the Type-B interface through the USB data cable; The USB3300 control chip (U2) performs bit stuffing and NRZI encoding on the data packet to generate the UTMI interface data stream; The intelligent MCU stores the data into the buffer (address 0x2000 0000-0x2000 3FFF) through the DMA channel; The intelligent MCU extracts the payload data and adds a 4-byte PPP protocol header (including the preset master station number 0xA001); Anti-interference measures include: Connect 5pF filter capacitors (C3, C4) and TVS diode arrays (D2, SRV05-4) in parallel on the D+ / D- signal lines. The USB shield is grounded at multiple points through two symmetrically arranged 2.2nF capacitors (C5 and C6); The spacing between differential signal lines should be maintained at 0.2mm±0.02mm, the line width should be 0.15mm, and the spacing between adjacent signal lines should be ≥0.5mm.

[0026] 3. Intelligent MCU (microcontroller unit).

[0027] The intelligent MCU (microcontroller unit) in this embodiment is a core component of the concentrator's high-speed 4G communication module. It coordinates the operations of various modules and controls data parsing, conversion, and transmission. The intelligent MCU utilizes an ARM Cortex-M series processor, which boasts powerful processing capabilities and efficiently parses and processes data, ensuring fast and accurate data transmission to the 4G communication chip. The intelligent MCU parses data received from downstream devices via Ethernet or USB interfaces according to a predetermined network protocol, converts the data into a format suitable for 4G communication, and ultimately transmits it to the 4G communication chip.

[0028] After receiving data transmitted from the Ethernet or USB interface, the intelligent MCU will first parse and convert the data format to ensure that it complies with the requirements of the 4G communication protocol. The intelligent MCU will then drive the full-network 4G communication chip to transmit the data, select the best available channel, and upload the data to the remote master station or cloud platform.

[0029] In this embodiment, the intelligent MCU uses an ARM Cortex-M series processor, which has high computing power and can quickly complete operations such as data parsing, format conversion, and protocol processing. At the same time, the intelligent MCU also has low power consumption, making it suitable for long-term stable operation in the power industry.

[0030] The intelligent MCU's efficient data processing capabilities and low-power design not only improve the efficiency of the entire system, but also ensure accurate data transmission, avoiding data loss or transmission errors caused by processing delays or insufficient computing power.

[0031] In this embodiment, the intelligent MCU utilizes a high-performance ARM Cortex-M series processor, offering strong processing capabilities and low power consumption. This processor efficiently performs data processing and control tasks, coordinating the entire data transmission process. The intelligent MCU not only receives power data transmitted via the Ethernet and USB interfaces but also parses and formats the data according to a specific communication protocol, converting it into data frames suitable for transmission to the all-network 4G communication chip.

[0032] The intelligent MCU uses the STM32F407VGT6 chip (ARM Cortex-M4 core), and its specific implementation is as follows: The MCU's main frequency is configured to 168MHz, locked to an external 8MHz crystal oscillator (Y1) through a PLL clock source. The power pins (VDD / VSS) are connected in parallel with 0.1μF decoupling capacitors (C7-C12) and are placed ≤2mm away from the chip body. Memory configurations include: The on-chip Flash memory (0x0800 0000-0x0803 FFFF) is divided into: 0x0800 0000-0x0800 7FFF: Ethernet protocol stack code area (storing lwIP 2.1.2 protocol stack); 0x0800 8000-0x0800 BFFF: USB host driver code area (storing USBXpress 3.0 library); 0x0800 C000-0x0803 FFFF: application logic code area; The on-chip SRAM (0x2000 0000-0x2002 0000) is allocated as follows: 0x2000 0000-0x2000 3FFF: Ethernet receive ring buffer (256 1522-byte frames); 0x2000 4000-0x2000 7FFF: USB bulk transfer buffer (64 512-byte packets); The data transfer control logic is implemented through the following register configuration: Ethernet DMA configuration (register ETH_DMABMR): Write 0x00002000 (fixed burst length); Write 0x00000001 (enable address alignment); USB host controller configuration (register USB_HCCHAR): Channel 0: write 0x00008300 (maximum packet length 512 bytes, batch transmission); Channel 1: write 0x00000300 (interrupt transmission, polling interval 10ms); The protocol conversion process includes the following machine cycle level operations: Read the MODBUS-RTU frame from the Ethernet buffer (starting address 0x2000 0000) and extract the function code and register address; Check the CRC-16 checksum (polynomial 0x8005). If it is wrong, discard the data packet. Encapsulate valid data into TCP / IPv4 format: The source IP address is fixed at 192.168.0.100 (C0 A8 00 64). Write the preset master station address (C0 A8 01 C8) to the destination IP address. The TCP window size is fixed at 1460 bytes; The data is sent to the 4G module via the SPI interface (30MHz), and a 2-byte length header (big endian) is added to each data packet. The channel selection mechanism is implemented through the preset APN configuration table: When powered on, the device automatically scans the first five digits of the SIM card IMSI number (46000 / 46001 / 46003) to match the corresponding APN.

[0033] 4. Full network 4G communication chip In the concentrator's high-speed 4G communication module, the all-network-compatible 4G communication chip is a key component for data upload. This chip supports multiple communication standards, including FDD-LTE, TD-LTE, WCDMA, and GSM, providing stable communication capabilities across diverse network environments. This communication chip enables high-speed, stable data transmission, meeting the high data upload speed and quality requirements of the power information collection system. The all-network-compatible 4G communication chip works in conjunction with the intelligent MCU to ensure efficient data upload to the master station via the 4G network, significantly improving the system's communication performance.

[0034] In this embodiment, the all-network 4G communication chip is the core data transmission component of the concentrator's high-speed 4G communication module. It is responsible for encapsulating data transmitted by the intelligent MCU into a format suitable for 4G network transmission and enabling data upload via the wireless 4G network. This chip supports multiple standards such as FDD-LTE, TD-LTE, WCDMA, and GSM, making it widely compatible and adaptable to network environments provided by different regions and operators, ensuring communication stability and reliability during data upload.

[0035] Specifically, the working principle of the full-network 4G communication chip includes the following steps: Data Reception and Transmission: The intelligent MCU sends the parsed and formatted data to the all-network 4G communication chip. Based on pre-set network parameters, the chip initiates a connection to the carrier's network and selects the appropriate channel for data transmission. This process enables the all-network 4G communication chip to achieve high-speed data uploads.

[0036] The all-network 4G communication chip automatically connects to the network, automatically selecting the optimal signal strength and available network based on the surrounding environment and network load. The chip supports multiple 4G standards and dynamically adjusts channels under varying network conditions (such as weak signal strength or high network load), ensuring stable and efficient data transmission.

[0037] To ensure the security of power data, the all-network 4G communication chip supports data encryption. During the data upload process, all transmitted data is encrypted using an encryption algorithm to prevent illegal interception or tampering during transmission, enhancing system security.

[0038] The all-network 4G communication chip supports multiple communication protocols, making it compatible with different operators' networks. It interacts with the operator's network through a built-in protocol stack, ensuring that data can be successfully uploaded to the remote master station or cloud platform.

[0039] The full-network 4G communication chip uses the ME3630-W module, and its implementation details are as follows: The module is connected to the PCB via a 1.27mm pitch board-to-board connector. The pin definitions are as follows: The module's firmware configuration parameters are stored in the 0x0000F000 address segment of the internal Flash.

[0040] The data transmission process includes the following physical layer operations: Receive TCP / IP data packets (including a 2-byte length header) sent by the smart MCU through the SPI interface; After stripping the length header, add the PPP protocol header (FF 03 00 21) and encapsulate it into a PPP frame. Select a dedicated bearer channel based on the QoS class identifier (QCI=6); The SM4 national secret algorithm is used for data encryption, and the encryption key is solidified in the module security area (0x0001E000-0x0001E00F); The signal is transmitted to the base station via a built-in PA amplifier (output power 23dBm±1dB), with the transmission frequency band locked to Band 3 (1800MHz) and Band 38 (2600MHz). 5.PCB circuit board In the concentrator high-speed 4G communication module of this invention, the PCB (printed circuit board) serves as the carrier and connection platform for all electronic components, playing a vital role in supporting and connecting the various modules. Through a well-designed circuit layout, the PCB not only facilitates signal transmission between modules but also ensures system stability, reliability, and anti-interference capabilities. A sound PCB design also determines the overall system's electrical performance and long-term operational stability. PCB layout and routing are particularly crucial in scenarios involving high-frequency, high-speed data transmission.

[0041] In this embodiment, the PCB circuit board utilizes a multi-layered design to ensure stable and reliable transmission of high-speed data transmission signals. The board is designed with multiple circuit layers, each responsible for a different functional area, such as power supply, signal transmission, and signal isolation. To ensure interconnection and signal integrity between modules, the PCB design utilizes a layout optimized for high-frequency signals, ensuring that electrical signals between modules can complete data exchange with the lowest possible latency.

[0042] To reduce signal interference and improve electrical performance, this embodiment utilizes a multi-layer circuit board design. A PCB typically contains at least four layers: a signal layer, a power layer, a ground layer, and a power return layer. By properly arranging the signal layer, ground layer, and power layer layout, electromagnetic interference (EMI) is minimized and signal stability is improved.

[0043] Each module (such as the Ethernet port, USB port, intelligent MCU, and all-network 4G communication chip) is connected via traces on the PCB circuit board. Specifically, the signal transmission lines utilize a differential signaling design, effectively reducing signal interference and noise, ensuring efficient data transmission. Furthermore, to reduce power consumption and increase transmission speed, the circuit board's signal traces utilize short paths and wide bandwidths to minimize signal attenuation and delay during transmission.

[0044] To ensure efficient system operation, the PCB features independent power management areas, ensuring stable power supply to each module. Load balancing is considered in the power circuit design, preventing the impact of power supply voltage fluctuations on the communication modules. The power layer and ground layer are well isolated to prevent interference from power supply noise.

[0045] In high-frequency signal transmission environments, the PCB's anti-interference capabilities are particularly important. To enhance this capability, a large ground plane is used on the circuit board surface, and this ground plane is properly isolated from other signal layers to reduce electromagnetic interference. Furthermore, the PCB design considers heat dissipation, employing a heat dissipation design to ensure that each module maintains a stable operating temperature even under prolonged, high-load operation.

[0046] Working principle: First, the power data collected by the lower-level equipment is transmitted to the inside of the module through the Ethernet interface or USB interface. After receiving the data, the intelligent MCU, as the control core of the system, is responsible for parsing and formatting the data, and converting it into a format suitable for transmission through the all-network 4G communication chip. The intelligent MCU controls the 4G communication chip to select the best network channel to ensure that the data can be uploaded under the optimal network conditions. During the data upload process, the all-network 4G communication chip not only provides a stable communication channel, but also ensures the security of the data through encryption technology. At the same time, the entire system realizes the electrical connection and signal transmission between modules through the PCB circuit board. The power management system ensures the stable operation of each module, and the anti-interference design improves the reliability of the system. Through precise signal control and optimized circuit layout, this module ensures that data transmission always remains efficient and stable in a complex power environment, and has strong anti-interference ability. Through the synergistic effect of the above-mentioned modules, the concentrator high-speed 4G communication module of the present invention can efficiently and stably complete the task of uploading power information, meeting the high requirements of modern power systems for data transmission speed and stability.

[0047] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. Concentrator high-speed 4G communication module, characterized by: include: Ethernet interface for external connection; USB interface for external connection; Intelligent MCU, used to control data exchange between the USB interface and the 4G communication chip; Full-network 4G communication chip, used to provide data transmission channels.

2. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The intelligent MCU is an ARMCortex-M series processor.

3. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The full-network 4G communication chip supports FDD-LTE, TD-LTE, WCDMA, and GSM standards.

4. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The Ethernet interface and USB interface are designed with industrial-grade circuits.

5. The concentrator high-speed 4G communication module according to claim 1, characterized in that: In the module, after the concentrator receives the data packet sent by the lower-level device, it transmits it to the intelligent MCU through the Ethernet interface; The intelligent MCU parses and converts the data format to generate data frames suitable for 4G transmission; The intelligent MCU drives the all-network 4G communication chip to start data transmission and upload data by selecting the optimal channel.

6. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The intelligent MCU automatically selects the best available channel for data upload based on the configured network parameters.

7. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The module connects the Ethernet interface, USB interface, smart MCU and full-network 4G communication chip into an integral structure through the circuit on the PCB board.

8. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The module complies with the State Grid 2013 standard concentrator type I remote communication module interface specification.

9. The concentrator high-speed 4G communication module according to claim 1, characterized in that: The average data throughput of the module is above 60 Mbps.

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