Camera module and vehicle

Abstract

The invention belongs to the technical field of electric appliances, and particularly relates to a camera module and a vehicle. The camera module comprises a circuit board; the lens cone assembly is arranged on the circuit board to form an accommodating cavity, and the lens cone assembly is provided with a first through hole communicated with the accommodating cavity; the first lens is arranged in the accommodating cavity and is coaxial with the first through hole; the ultrasonic assembly is arranged in the containing cavity and connected with the lens cone assembly, the ultrasonic assembly is attached to the first lens, and the ultrasonic assembly is electrically connected with the circuit board; the photosensitive chip is arranged in the containing cavity and electrically connected with the circuit board, and the photosensitive chip and the first lens are oppositely arranged; wherein the first lens is located between the first through hole and the ultrasonic assembly, the first lens is an aspheric lens, and the change of the optical axis direction of the first lens is within 2 microns.

Description

Technical Field

[0001] The present application belongs to the field of electrical technology, and specifically relates to a camera module and a vehicle. Background Art

[0002] As one of the core sensors in intelligent driving systems, automotive cameras play a critical role in autonomous driving, ADAS (Advanced Driver Assistance Systems), and surround view monitoring. They capture high-precision image data in real time, providing crucial environmental awareness support for features like lane keeping, automatic parking, and collision warning. However, in real-world applications, the lens surface is susceptible to a variety of environmental contaminants, including raindrops from rainfall, particle accumulation from road dust, and mud splashes from wading. These contaminants can trigger optical refraction, leading to image blur, reduced contrast, and loss of critical details. This degradation in optical performance directly impacts the recognition accuracy of the visual algorithm. When contaminants reach a critical threshold, it can cause misjudgment or even malfunction of the camera module. Notably, in extreme weather conditions such as heavy rain and sandstorms, and when the vehicle is traveling at high speeds or in complex road conditions, such failures can lead to safety hazards such as delayed lane departure warnings and ineffective pedestrian recognition. In severe cases, they can even cause traffic accidents.

[0003] In the related art, the lens is directly rinsed, but the cleaning effect is poor and the cleaning efficiency is low. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a camera module and a vehicle, which aim to at least to some extent solve the technical problem of direct flushing of the lens, but with poor cleaning effect and low cleaning efficiency.

[0005] The technical solution of the present invention is:

[0006] A camera module comprises: a circuit board; a lens barrel assembly, arranged on the circuit board to form a accommodating cavity, the lens barrel assembly being provided with a first through hole communicating with the accommodating cavity; a first lens, arranged in the accommodating cavity and coaxially arranged with the first through hole; an ultrasonic assembly, arranged in the accommodating cavity and connected to the lens barrel assembly, the ultrasonic assembly being in contact with the first lens, and the ultrasonic assembly being electrically connected to the circuit board; a photosensitive chip, arranged in the accommodating cavity and electrically connected to the circuit board, the photosensitive chip being arranged opposite to the first lens; wherein, the first lens is located between the first through hole and the ultrasonic assembly, the first lens is an aspherical lens, and the optical axis direction of the first lens varies within 2 μm.

[0007] In some embodiments, the ultrasonic component includes: an ultrasonic generator, disposed in the accommodating cavity and connected to the lens barrel assembly; an ultrasonic transducer, disposed in the accommodating cavity and electrically connected to the ultrasonic generator, the ultrasonic transducer being attached to the first lens, and the ultrasonic transducer being electrically connected to the circuit board; wherein, the ultrasonic generator is located between the ultrasonic transducer and the first lens.

[0008] In some embodiments, the ultrasonic generator and the ultrasonic transducer are both provided with a second through hole, and the second through hole is coaxially arranged with the first through hole.

[0009] In some embodiments, the lens barrel assembly includes: a first lens barrel having the first through hole; a second lens barrel having one end connected to the first lens barrel and the other end connected to the circuit board; wherein the first lens and the ultrasonic assembly are both connected to the first lens barrel.

[0010] In some embodiments, the camera module further includes: a plurality of second lenses disposed in the second lens barrel; wherein, the plurality of second lenses are spaced apart along the direction of the first through hole toward the photosensitive chip.

[0011] In some embodiments, the inner diameter of the second lens barrel increases along the direction from the first through hole to the photosensitive chip; and the height of the second lens barrel is greater than the height of the first lens barrel.

[0012] In some embodiments, the camera module also includes: a connector, disposed in the first lens barrel and electrically connected to the ultrasonic component; a first printed circuit, disposed on the inner wall of the first lens barrel and electrically connected to the connector; and a second printed circuit, disposed on the outer wall of the second lens barrel and electrically connected to the first printed circuit and the circuit board.

[0013] In some embodiments, the camera module further includes a cleaning module, and the liquid outlet of the cleaning module is opposite to the first lens.

[0014] In some embodiments, the cleaning module includes: a water inlet pipe; a water tank connected to the water inlet pipe; a water pump connected to the water tank; a water outlet pipe connected to the water pump; and a nozzle connected to the water outlet pipe, wherein the nozzle is configured as the liquid outlet of the cleaning module.

[0015] Based on the same inventive concept, the present application also provides a vehicle, comprising the camera module.

[0016] The beneficial effects of the present invention include at least:

[0017] Since the lens barrel assembly is arranged on the circuit board to form a storage cavity, the lens barrel assembly is supported by the circuit board. Since the lens barrel assembly is provided with a first through hole connected to the storage cavity, the first lens is arranged in the storage cavity and is coaxially arranged with the first through hole. The photosensitive chip is arranged in the storage cavity and is electrically connected to the circuit board. The photosensitive chip is arranged opposite to the first lens. Therefore, the first through hole provided on the lens barrel assembly serves as a light entrance. External light enters the storage cavity through the first through hole. The first lens uses its optical properties to converge and correct the incoming light to ensure that the light is focused in an appropriate manner. After being processed by the first lens, the light will be accurately projected onto the photosensitive chip. The photosensitive chip can convert the received light signal into an electrical signal, that is, image data, thereby completing the image acquisition process. Moreover, since the first lens and the photosensitive chip are arranged in the storage cavity, the cavity wall of the storage cavity can protect the first lens and the photosensitive chip, ensuring the safety of the first lens and the photosensitive chip.

[0018] Since the ultrasonic component is attached to the first lens and is electrically connected to the circuit board, when the first lens needs to be cleaned, the circuit board can supply power to the ultrasonic component, and the ultrasonic component can vibrate rapidly, thereby generating high-frequency, low-amplitude ultrasonic waves. The ultrasonic component can transmit wave energy to the outer surface of the first lens through the first lens in contact with it. This high-frequency, low-amplitude wave energy can remove water droplets, water mist, dust, frost and other dirt on the outer surface of the first lens that are not conducive to imaging effects, thereby ensuring the cleanliness of the first lens, reducing the impact of dirt on the image acquisition process, and having a good cleaning effect and high cleaning efficiency.

[0019] In the related art, the ultrasonic component is arranged outside the lens barrel component, and additional installation space needs to be allocated for it, which causes the entire camera module to occupy a larger volume inside the device.

[0020] Since the ultrasonic component is arranged in the accommodating cavity and is connected to the lens barrel assembly, the ultrasonic component is accommodated by the accommodating cavity and supported by the lens barrel assembly. That is to say, the ultrasonic component is not arranged outside the lens barrel assembly, which makes full use of the space of the idle or underutilized accommodating cavity and avoids space waste. This allows the camera module to integrate more functional components in a limited space, making the structure of the camera module more compact, reducing redundant space and unnecessary connection structures between components, and reducing the overall size and weight of the module.

[0021] When the ultrasonic component removes dirt from the outer surface of the first lens, since the first lens is located between the first through hole and the ultrasonic component and the first lens is an aspherical lens, the optical axis direction of the first lens changes within 2μm. Therefore, the influence of the amplitude of the ultrasonic vibration generated by the ultrasonic component on the position of the first lens is reduced, thereby effectively ensuring that the resolution of the camera module can be stable at above 0.7, so that the camera module can capture clear and detail-rich images in various usage scenarios, meeting users' needs for high-quality imaging.

[0022] By reducing the impact of ultrasonic vibrations on the first lens, the camera module maintains its dirt removal function while preventing abnormal vibrations from affecting other functions, such as autofocus and optical image stabilization. This ensures stable operation in a variety of complex usage scenarios, providing reliable service to users. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 is a schematic structural diagram of a camera module in some embodiments;

[0025] Figure 2 for Figure 1 A schematic structural diagram of the first lens barrel of the middle camera module;

[0026] Figure 3 Schematic diagram of the structure of the cleaning module of the camera module in some embodiments.

[0027] In the attached figure:

[0028] Circuit board 10;

[0029] Lens barrel assembly 20, first through hole 21, first lens barrel 22, second lens barrel 23, connecting member 24, third through hole 24;

[0030] Accommodating chamber 30;

[0031] a first lens 40;

[0032] Ultrasonic component 50, ultrasonic generator 51, ultrasonic transducer 52, second through hole 53;

[0033] Photosensitive chip 60;

[0034] Connector 70;

[0035] First printed circuit 80;

[0036] Second printed circuit 90;

[0037] Cleaning module 100, water inlet pipe 101, water tank 102, water pump 103, water outlet pipe 104, nozzle 105;

[0038] The second lens 110 . DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0040] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative position relationship and movement status of various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0041] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0042] In addition, in the present invention, descriptions such as "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0043] The present application is described below with reference to specific embodiments and with reference to the accompanying drawings:

[0044] The camera module and vehicle provided in this embodiment are intended to at least to some extent resolve the technical problem of direct washing of lenses, which has poor cleaning effect and low cleaning efficiency.

[0045] Figure 1 is a schematic structural diagram of a camera module in some embodiments; Figure 2 for Figure 1 Schematic diagram of the structure of the first lens barrel of the camera module. Figure 1 and Figure 2 The camera module of the present embodiment includes: a circuit board 10, a lens barrel assembly 20, a first lens 40, an ultrasonic assembly 50, and a photosensitive chip 60. The lens barrel assembly 20 is disposed on the circuit board 10 to form a receiving cavity 30. The lens barrel assembly 20 defines a first through hole 21 that communicates with the receiving cavity 30. The first lens 40 is disposed within the receiving cavity 30 and is coaxially arranged with the first through hole 21. The ultrasonic assembly 50 is disposed within the receiving cavity 30 and connected to the lens barrel assembly 20. The ultrasonic assembly 50 is abutted against the first lens 40 and electrically connected to the circuit board 10. The photosensitive chip 60 is disposed within the receiving cavity 30 and is electrically connected to the circuit board 10. The photosensitive chip 60 is disposed opposite the first lens 40. The first lens 40 is located between the first through hole 21 and the ultrasonic assembly 50. The first lens 40 is an aspherical lens, and the optical axis direction of the first lens 40 varies within 2μm.

[0046] Since the lens barrel assembly 20 is arranged on the circuit board 10 to form a accommodating cavity 30, the lens barrel assembly 20 is supported by the circuit board 10. Since the lens barrel assembly 20 is provided with a first through hole 21 that is connected to the accommodating cavity 30, the first lens 40 is provided in the accommodating cavity 30 and is coaxially arranged with the first through hole 21. The photosensitive chip 60 is provided in the accommodating cavity 30 and is electrically connected to the circuit board 10. The photosensitive chip 60 is arranged opposite to the first lens 40. Therefore, the first through hole 21 opened on the lens barrel assembly 20 serves as a light entrance, and external light enters the accommodating cavity 30 through the first through hole 21. The first lens 40 uses its optical properties to converge and correct the incoming light to ensure that the light is focused in an appropriate manner. When the light is processed by the first lens 40, it will be accurately projected onto the photosensitive chip 60. The photosensitive chip 60 can convert the received light signal into an electrical signal, that is, image data, thereby completing the image acquisition process. Moreover, since the first lens 40 and the photosensitive chip 60 are arranged in the accommodating cavity 30, the cavity wall of the accommodating cavity 30 can protect the first lens 40 and the photosensitive chip 60, ensuring the safety of the first lens 40 and the photosensitive chip 60.

[0047] Since the ultrasonic component 50 is attached to the first lens 40 and is electrically connected to the circuit board 10, when the first lens 40 needs to be cleaned, the circuit board 10 can supply power to the ultrasonic component 50, and the ultrasonic component 50 can vibrate rapidly, thereby generating high-frequency, low-amplitude ultrasonic waves. The ultrasonic component 50 can transmit wave energy to the outer surface of the first lens 40 through the first lens 40 in contact with it. This high-frequency, low-amplitude wave energy can remove water droplets, water mist, dust, frost and other dirt on the outer surface of the first lens 40 that are not conducive to imaging effects, thereby ensuring the cleanliness of the first lens 40 and reducing the impact of dirt on the image acquisition process. The cleaning effect is good and the cleaning efficiency is high.

[0048] In the related art, the ultrasonic component is arranged outside the lens barrel component, and additional installation space needs to be allocated for it, which causes the entire camera module to occupy a larger volume inside the device.

[0049] Since the ultrasonic component 50 is arranged in the accommodating cavity 30 and is connected to the lens barrel assembly 20, the ultrasonic component 50 is accommodated by the accommodating cavity 30 and supported by the lens barrel assembly 20. That is to say, the ultrasonic component 50 is not arranged outside the lens barrel assembly 20, which makes full use of the idle or underutilized space of the accommodating cavity 30 and avoids space waste, so that the camera module can integrate more functional components in a limited space, making the structure of the camera module more compact, reducing redundant space and unnecessary connection structures between components, and reducing the overall size and weight of the module.

[0050] When the ultrasonic component 50 removes dirt from the outer surface of the first lens 40, since the first lens 40 is located between the first through hole 21 and the ultrasonic component 50, the first lens 40 is an aspherical lens, and the optical axis direction of the first lens 40 changes within 2μm. Therefore, the influence of the amplitude of the ultrasonic vibration generated by the ultrasonic component 50 on the position of the first lens 40 is reduced, thereby effectively ensuring that the resolution of the camera module can be stable at above 0.7, so that the camera module can capture clear and detail-rich images in various usage scenarios, meeting users' needs for high-quality imaging.

[0051] By reducing the impact of ultrasonic vibrations on the first lens 40, the camera module maintains its dirt removal function while preventing abnormal vibrations of the first lens 40 from affecting the normal operation of other functions, such as autofocus and optical image stabilization. This ensures stable operation of the camera module in a variety of complex usage scenarios, providing reliable service to users.

[0052] In some embodiments, the circuit board 10 may be a PCBA (Printed Circuit Board Assembly) circuit board 10, which can effectively control the signal transmission path and characteristic impedance through precise circuit layout and design, and reduce signal reflection, crosstalk and attenuation.

[0053] In some embodiments, the frequency and intensity of the ultrasonic waves of the ultrasonic component 50 can be adjusted to meet the dirt removal requirements in different environments.

[0054] Combine Figure 1 and Figure 2 In some embodiments, to enable the ultrasonic assembly 50 to generate ultrasonic waves, the ultrasonic assembly 50 includes an ultrasonic generator 51 and an ultrasonic transducer 52. The ultrasonic generator 51 is disposed within the accommodating cavity 30 and is connected to the lens barrel assembly 20, which supports the ultrasonic generator 51. The ultrasonic transducer 52 is disposed within the accommodating cavity 30 and is electrically connected to the ultrasonic generator 51. The ultrasonic transducer 52 is abutted against the first lens 40 and electrically connected to the circuit board 10. The ultrasonic generator 51 is located between the ultrasonic transducer 52 and the first lens 40.

[0055] The ultrasonic transducer 52 may be, but is not limited to, a piezoelectric motor, an electrostrictive motor, a memory metal telescopic motor, and a magnetostrictive motor.

[0056] When a cleaning command is received, the ultrasonic generator 51 is powered on, and the ultrasonic generator 51 generates a high-frequency electrical signal through energy conversion, and transmits the high-frequency electrical signal to the ultrasonic transducer 52. After receiving the high-frequency electrical signal, the ultrasonic transducer 52 will vibrate rapidly (convert electrical energy into mechanical energy), thereby generating high-frequency, low-amplitude ultrasonic waves. The ultrasonic transducer 52 transmits the wave energy to the outer surface of the first lens 40 through the first lens 40 in contact with it. This high-frequency, low-amplitude wave energy can remove water droplets, water mist, dust, frost and other dirt on the outer surface of the first lens 40 that are not conducive to imaging effects, thereby ensuring the cleanliness of the first lens 40 and reducing the influence of dirt on the image acquisition process. The cleaning effect is good and the cleaning efficiency is high.

[0057] Since the ultrasonic generator 51 and the ultrasonic transducer 52 are both arranged in the accommodating cavity 30, the ultrasonic generator 51 and the ultrasonic transducer 52 are accommodated by the accommodating cavity 30, that is, the ultrasonic generator 51 and the ultrasonic transducer 52 are not arranged outside the lens barrel assembly 20, which makes full use of the idle or underutilized space of the accommodating cavity 30 and avoids space waste, so that the camera module can integrate more functional components in a limited space, making the structure of the camera module more compact, reducing redundant space and unnecessary connection structures between components, and reducing the overall size and weight of the module.

[0058] Combine Figure 1 and Figure 2 In some embodiments, in order to prevent the ultrasonic generator 51 and the ultrasonic transducer 52 from blocking the propagation of the light path, the ultrasonic generator 51 and the ultrasonic transducer 52 are both provided with a second through hole 53, and the second through hole 53 is coaxially arranged with the first through hole 21. The light path entering the accommodating cavity 30 through the first through hole 21 and the first lens 40 will pass through the second through hole 53 to reach the photosensitive chip 60 to ensure the normal propagation of the light path.

[0059] In some embodiments, since both the ultrasonic generator 51 and the ultrasonic transducer 52 are provided with the second through hole 53, the weight of the ultrasonic generator 51 and the ultrasonic transducer 52 can be reduced, thereby facilitating the support of the ultrasonic generator 51 by the lens barrel assembly 20, reducing the possibility of the ultrasonic generator 51 falling, and ensuring the stability of the installation of the ultrasonic generator 51. At the same time, material costs are reduced.

[0060] In some embodiments, in order to achieve the connection between the ultrasonic generator 51 and the lens barrel assembly 20, the ultrasonic generator 51 is bonded to the lens barrel assembly 20. The ultrasonic generator 51 is bonded to the lens barrel assembly 20 by glue.

[0061] In some embodiments, since the ultrasonic generator 51 is bonded to the lens barrel assembly 20 by glue, the glue has the effect of absorbing energy and reducing vibration. Therefore, when the ultrasonic assembly 50 removes dirt on the outer surface of the first lens 40, the vibration of the ultrasonic transducer 52 can be transmitted to the ultrasonic generator 51. The glue absorbs energy and reduces vibration, which can reduce the vibration transmitted from the ultrasonic generator 51 to the lens barrel assembly 20, and then reduce the vibration transmitted from the lens barrel assembly 20 to the first lens 40, further reducing the impact on the position of the first lens 40.

[0062] Combine Figure 2In some embodiments, to connect the lens barrel assembly 20 to the circuit board 10, the lens barrel assembly 20 includes a first lens barrel 22 and a second lens barrel 23. The first lens barrel 22 defines a first through hole 21. One end of the second lens barrel 23 is connected to the first lens barrel 22, and the other end is connected to the circuit board 10. The first lens 40 and the ultrasonic assembly 50 are both connected to the first lens barrel 22, and are supported by the first lens barrel 22.

[0063] The first lens 40 is connected to the first lens barrel 22, which provides a stable mounting location for the first lens 40. During camera module operation, this stable mounting environment reduces the possibility of positional shifting of the first lens 21 due to external vibration or inherent vibration, thereby ensuring image clarity and stability and minimizing issues such as image blur and ghosting.

[0064] The ultrasonic assembly 50 is connected to the first lens barrel 22. When cleaning the first lens 40, it generates high-frequency vibrations, transferring vibrational energy to the surface of the first lens 40. This vibration breaks down the adhesion of dirt to the lens surface, causing it to fall off. Compared to traditional manual cleaning methods, ultrasonic cleaning is more efficient and thorough, and does not scratch the lens surface. For example, after prolonged use, dust, fingerprints, and other stains may accumulate on the surface of the first lens 40. Ultrasonic cleaning can quickly restore the lens's cleanliness, ensuring image quality.

[0065] Because both the first lens 40 and the ultrasonic assembly 50 are connected to the first lens barrel 22, and the second lens barrel 23 connects the first lens barrel 22 to the circuit board 10, a relatively independent cleaning area is formed. During ultrasonic cleaning, the cleaning energy is primarily concentrated on the surface of the first lens 40, without affecting electronic components such as the circuit board 10. This prevents camera module failures caused by damage to electronic components during ultrasonic cleaning, thereby improving the reliability and service life of the camera module.

[0066] In some embodiments, the ultrasonic generator 51 of the ultrasonic assembly 50 is connected to the first lens barrel 22 , and the ultrasonic generator 51 of the ultrasonic assembly 50 is supported by the first lens barrel 22 to ensure the stability of the installation of the ultrasonic generator 51 of the ultrasonic assembly 50 .

[0067] In some embodiments, in order to achieve the connection between the first lens barrel 22 and the second lens barrel 23, the first lens barrel 22 is bonded to the second lens barrel 23. The first lens barrel 22 is bonded to the second lens barrel 23 by glue.

[0068] In some embodiments, since the first lens barrel 22 is bonded to the second lens barrel 23 by glue, the glue has the effect of absorbing energy and reducing vibration. Therefore, when the ultrasonic component 50 removes dirt on the outer surface of the first lens 40, the vibration of the ultrasonic component 50 can be transmitted to the first lens barrel 22. The glue absorbs energy and reduces vibration, which can reduce the vibration of the first lens barrel 22 transmitted to the second lens barrel 23. Subsequently, the vibration of the second lens barrel 23 transmitted to the photosensitive chip 60 through the circuit board 10 can be reduced, thereby ensuring the imaging effect of the photosensitive chip 60.

[0069] Combine Figure 2 In some embodiments, to optimize optical performance, improve imaging quality, and meet different shooting requirements, the camera module further includes: a plurality of second lenses 110. The plurality of second lenses 110 are disposed within the second lens barrel 23. The plurality of second lenses 110 are spaced apart along the direction from the first through hole 21 toward the photosensitive chip 60.

[0070] Combine Figure 2 In some embodiments, a plurality of connectors 24 are provided in the second lens barrel 23. The plurality of connectors 24 are arranged at intervals along the direction of the first through hole 21 toward the photosensitive chip 60. The plurality of connectors 24 correspond one-to-one to the plurality of second lenses 110. The second lenses 110 are connected to the corresponding connectors 24. The connectors 24 provide an installation base for the second lenses 110 so that the second lenses 110 can be installed in the second lens barrel 23.

[0071] Combine Figure 2 In some embodiments, in order to prevent the connector 24 from blocking the propagation of the light path, the connector 24 is provided with a third through hole 25, and the third through hole 25 is coaxially arranged with the first through hole 21. The light path entering the accommodating cavity 30 through the first through hole 21 and the first lens 40 will pass through the third through hole 25 and the second lens 110 to reach the photosensitive chip 60 to ensure the normal propagation of the light path.

[0072] In some embodiments, since the connecting member 24 is provided with the third through hole 25 , the weight of the second lens barrel 23 can be reduced, thereby reducing the weight of the camera module and reducing the material cost.

[0073] In some embodiments, the second lens barrel 23 can be integrally formed with the connector 24, so that the second lens barrel 23 and the connector 24 form a continuous whole, thereby ensuring the connection strength between the second lens barrel 23 and the connector 24. At the same time, the integral molding process can shorten the production cycle, increase the production capacity of the production line, and significantly improve production efficiency.

[0074] In some embodiments, in order to achieve the connection between the second lens 110 and the corresponding connecting member 24, the second lens 110 is bonded to the corresponding connecting member 24. The second lens 110 is bonded to the corresponding connecting member 24 by glue.

[0075] In some embodiments, since the second lens 110 is bonded to the corresponding connecting member 24 by glue, the glue has the effect of absorbing energy and reducing vibration. Therefore, when the ultrasonic component 50 removes dirt on the outer surface of the first lens 40, the vibration of the ultrasonic component 50 can be transmitted to the second lens barrel 23 through the first lens barrel 22. When the second lens barrel 23 transmits the vibration to the second lens 110 through the connecting member 24, the glue absorbs energy and reduces vibration, which can reduce the vibration transmitted to the second lens 110 by the connecting member 24, thereby reducing the impact on the positions of multiple second lenses 110.

[0076] In some embodiments, since the first lens barrel 22 is bonded to the second lens barrel 23 by glue, the glue has the effect of absorbing energy and reducing vibration. Therefore, when the ultrasonic component 50 removes dirt on the outer surface of the first lens 40, the vibration of the ultrasonic component 50 can be transmitted to the first lens barrel 22. The glue absorbs energy and reduces vibration, which can reduce the vibration of the first lens barrel 22 transmitted to the second lens barrel 23. Subsequently, the vibration of the second lens barrel 23 transmitted to the multiple second lenses 110 can be reduced, thereby reducing the impact on the positions of the multiple second lenses 110.

[0077] In some embodiments, to reduce the impact on the second lens 110, the inner diameter of the second lens barrel 23 increases along the direction from the first through hole 21 to the photosensitive chip 60. The height of the second lens barrel 23 is greater than that of the first lens barrel 22, that is, the outer dimensions of the second lens barrel 23 are increased.

[0078] When the ultrasonic component 50 removes dirt from the outer surface of the first lens 40, the vibration of the ultrasonic component 50 can be transmitted to the second lens barrel 23 through the first lens barrel 22. Since the outer dimensions of the second lens barrel 23 are increased, the second lens barrel 23 can better block and disperse ultrasonic wave energy, thereby reducing the vibration transmitted to the multiple second lenses 110 by the second lens barrel 23 and reducing the impact on the positions of the multiple second lenses 110.

[0079] In some embodiments, the inner diameter of the second lens barrel 23 may increase linearly or stepwise along the direction from the first through hole 21 to the photosensitive chip 60 .

[0080] Combine Figure 2In some embodiments, to facilitate signal and power transmission, the camera module further comprises a connector 70, a first printed circuit 80, and a second printed circuit 90. The connector 70 is disposed within the first lens barrel 22 and electrically connected to the ultrasonic assembly 50. The connector 70 is electrically connected to the ultrasonic generator 51 of the ultrasonic assembly 50. The first printed circuit 80 is disposed on the inner wall of the first lens barrel 22 and electrically connected to the connector 70. The second printed circuit 90 is disposed on the outer wall of the second lens barrel 23 and electrically connected between the first printed circuit 80 and the circuit board 10.

[0081] When dirt on the outer surface of the first lens 40 is to be removed by the ultrasonic component 50, the circuit board 10 transmits signals and electrical energy to the ultrasonic component 50 in sequence through the second printed circuit 90, the first printed circuit 80 and the connector 70, so that the ultrasonic component 50 can generate ultrasonic waves to remove dirt on the outer surface of the first lens 40.

[0082] Because the first and second printed circuits 80 and 90 can be printed directly on the inner wall of the first lens barrel 22 and the outer wall of the second lens barrel 23 using pre-designed circuit patterns, the wiring process is simplified and the production cycle is shortened. Furthermore, no additional manual operation or additional wiring materials are required, enabling automated production and reducing human intervention. Furthermore, the use of materials is more precise and efficient, reducing costs.

[0083] The first printed circuit 80 and the second printed circuit 90 have precise circuit patterns and stable manufacturing processes, which can effectively avoid problems caused by human factors or process factors and pass the yield rate.

[0084] The connection between the first printed circuit 80 and the second printed circuit 90 is stable and reliable, which reduces the number of connection points and potential failure points, allowing the product to maintain stable performance in various environments and reducing the probability of failure.

[0085] Complex wiring will make the internal circuits of the product disorganized, not only affecting the product's aesthetics but also increasing its size. However, the first printed circuit 80 and the second printed circuit 90 can be hidden on the inner wall of the first lens barrel 22 and the outer wall of the second lens barrel 23, making the product appearance more concise and neat.

[0086] Since no complex wiring space is required, the first printed circuit 80 and the second printed circuit 90 make the internal structure of the product more compact, thereby providing the possibility for miniaturized design of the product.

[0087] In some embodiments, the first printed circuit 80 and the second printed circuit 90 may be printed using laser printing technology, which improves processing accuracy and production efficiency.

[0088] In some embodiments, the first printed circuit 80 can be electrically connected to the connector 70 via soldering, and the second printed circuit 90 can be electrically connected to the first printed circuit 80 and the circuit board 10 via soldering. Solder has excellent conductivity and can form low-resistance connections between the first printed circuit 80 and the connector 70 and the second printed circuit 90, as well as between the second printed circuit 90 and the circuit board 10. After melting, the solder fills the small gaps between the first printed circuit 80 and the connector 70 and the second printed circuit 90, as well as between the second printed circuit 90 and the circuit board 10, maximizing the contact area, thereby reducing contact resistance, minimizing power loss during transmission, and improving circuit efficiency. Furthermore, the solder connection has good mechanical and electrical stability, effectively reducing the impact of external interference on signal transmission. Soldering firmly connects the first printed circuit 80 to the connector 70 and the second printed circuit 90, as well as the second printed circuit 90 to the circuit board 10, reducing loose connections or poor contact caused by factors such as vibration and temperature changes, ensuring stable signal transmission, and improving the reliability and stability of the device. Solder connections also offer a degree of corrosion and temperature resistance, maintaining stable electrical performance under varying environmental conditions. Solder prevents chemical reactions between the metal components of the first printed circuit 80, connector 70, second printed circuit 90, and circuit board 10 and moisture, oxygen, and other environmental factors, reducing the likelihood of corrosion.

[0089] Figure 3 FIG. 1 is a schematic structural diagram of a cleaning module of a camera module in some embodiments. Figure 3 In some embodiments, in order to further ensure the cleaning effect of the first lens 40, the camera module also includes a cleaning module 100, and the liquid outlet of the cleaning module 100 is opposite to the first lens 40. The cleaning liquid is sprayed onto the first lens 40 through the liquid outlet of the cleaning module 100 to achieve preliminary spray washing of the first lens 40.

[0090] After the initial spray cleaning of the first lens 40 is completed, the circuit board 10 can supply power to the ultrasonic component 50, and the ultrasonic component 50 can vibrate rapidly to generate high-frequency, low-amplitude ultrasonic waves. The ultrasonic component 50 can transmit wave energy to the outer surface of the first lens 40 through the first lens 40 in contact with it. This high-frequency, low-amplitude wave energy can remove water droplets, water mist, dust, frost and other dirt on the outer surface of the first lens 40 that are not conducive to the imaging effect, thereby ensuring the cleanliness of the first lens 40 and reducing the impact of dirt on the image acquisition process. The cleaning effect is good and the cleaning efficiency is high.

[0091] Combine Figure 3In some embodiments, to further ensure the cleaning effect of the first lens 40, the cleaning module 100 includes: a water inlet pipe 101, a water tank 102, a water pump 103, a water outlet pipe 104, and a nozzle 105. The water tank 102 is connected to the water inlet pipe 101. The water pump 103 is connected to the water tank 102. The water outlet pipe 104 is connected to the water pump 103. The nozzle 105 is connected to the water outlet pipe 104 and is configured as the liquid outlet of the cleaning module.

[0092] In some embodiments, cleaning liquid is added to the water tank 102 through the water inlet pipe 101. When there is a need for cleaning, the water pump 103 is started, and the water pump 103 works to pump out the cleaning liquid in the water tank 102, and the cleaning liquid is transported to the nozzle 105 through the water outlet pipe 104. The nozzle 105 sprays the cleaning liquid onto the first lens 40 to achieve preliminary spray washing of the first lens 40.

[0093] In some embodiments, the water pump 103 may be a high-pressure water pump, so that the nozzle 105 sprays a high-pressure water column toward the outer surface of the first lens 40 , and the impact force of the high-pressure water column can wash away dirt on the first lens 40 .

[0094] Based on the same inventive concept, the present application also proposes a vehicle, which adopts the camera module. The specific structure of the camera module refers to the above-mentioned embodiment. Since all the technical solutions of all the above-mentioned embodiments are adopted, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0095] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0096] In the description of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0097] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0098] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0099] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A camera module, characterized in that: include: Circuit board; A lens barrel assembly is provided on the circuit board to form a receiving cavity, and the lens barrel assembly is provided with a first through hole communicating with the receiving cavity; A first lens is disposed in the accommodating cavity and coaxially arranged with the first through hole; an ultrasonic component, disposed in the accommodating cavity and connected to the lens barrel component, the ultrasonic component being attached to the first lens and electrically connected to the circuit board; A photosensitive chip is disposed in the accommodating cavity and electrically connected to the circuit board, and the photosensitive chip is disposed opposite to the first lens; The first lens is located between the first through hole and the ultrasonic component, the first lens is an aspherical lens, and the optical axis direction of the first lens changes within 2 μm.

2. The camera module according to claim 1, wherein: The ultrasonic component comprises: an ultrasonic generator, disposed in the accommodating cavity and connected to the lens barrel assembly; an ultrasonic transducer, disposed in the accommodating cavity and electrically connected to the ultrasonic generator, the ultrasonic transducer being attached to the first lens and electrically connected to the circuit board; Wherein, the ultrasonic generator is located between the ultrasonic transducer and the first lens.

3. The camera module according to claim 2, wherein: The ultrasonic generator and the ultrasonic transducer are both provided with a second through hole, and the second through hole is coaxially arranged with the first through hole.

4. The camera module according to any one of claims 1 to 3, wherein: The lens barrel assembly comprises: A first lens barrel is provided with the first through hole; a second lens barrel, one end of which is connected to the first lens barrel and the other end of which is connected to the circuit board; Wherein, the first lens and the ultrasonic component are both connected to the first lens barrel.

5. The camera module according to claim 4, wherein: The camera module also includes: a plurality of second lenses, disposed in the second lens barrel; Among them, multiple second lenses are arranged at intervals along the direction from the first through hole to the photosensitive chip.

6. The camera module according to claim 4, wherein: The inner diameter of the second lens barrel increases along the direction from the first through hole to the photosensitive chip; The height of the second lens barrel is greater than that of the first lens barrel.

7. The camera module according to claim 4, wherein: The camera module also includes: a connector, disposed in the first lens barrel and electrically connected to the ultrasonic component; a first printed circuit, provided on the inner wall of the first lens barrel and electrically connected to the connector; The second printed circuit is provided on the outer wall of the second lens barrel and is electrically connected to the first printed circuit and the circuit board.

8. The camera module according to any one of claims 1 to 3, wherein: The camera module further includes a cleaning module, and a liquid outlet of the cleaning module is opposite to the first lens.

9. The camera module according to claim 8, wherein: The cleaning module comprises: water inlet pipe; a water tank, connected to the water inlet pipe; a water pump, connected to the water tank; a water outlet pipe, connected to the water pump; A nozzle is connected to the water outlet pipe, and the nozzle is configured as the liquid outlet of the cleaning module.

10. A vehicle, characterized in that: Comprising the camera module as described in any one of claims 1-9.

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