A clamping device for potting and polishing solder joints of flip-chip chips.

Abstract

This invention discloses a clamping device for potting and polishing solder joints of flip-chip, relating to the field of chip potting technology. The invention includes a base plate, a frame fixedly mounted on the top surface of the base plate, a servo motor fixedly mounted on the top surface of the base plate, a control module internally configured in the servo motor, and the control module controlling the servo motor shaft to rotate intermittently. A disc is fixedly mounted on the top surface of the servo motor shaft, the bottom surface of the disc being rotatably connected to the top surface of the frame. Several PCB placement slots are fixedly mounted on the top surface of the disc. A housing is fixedly mounted on the top surface of the base plate, located on the left side of the frame. A sliding groove is opened on the right side of the housing. An electric telescopic rod is fixedly mounted at the bottom of the housing. This invention uses a semi-circular rubber block to tightly press against the PCB placement slots, thereby avoiding the problem of misalignment between the PCB board and the bottom of the chip causing soldering and potting offset.

Description

Technical Field

[0001] This invention relates to the field of chip potting technology, specifically to a clamping device for potting and polishing solder joints of flip-chip. Background Technology

[0002] The main function of the flip-chip solder joint potting and polishing clamping device is to connect the chip to the PCB with the front side facing down through solder joints. This improves signal transmission speed and bandwidth, reduces adverse effects such as resistance and inductance, and enhances electrical performance. The potting of this equipment ensures the sealing of the chip during the packaging process, while polishing improves the flatness of the solder joints, thereby improving the efficiency and quality of the entire packaging process.

[0003] Patent CN208521906U discloses a clamping device for potting and polishing solder joints of flip-chips. It includes a micro electric grinder for XZ-direction displacement and precise positioning, a chip clamping self-locking mechanism in the XY direction, and a support mechanism. The micro electric grinder for XZ-direction displacement and precise positioning is fixed on one side of the support mechanism, and the chip clamping self-locking mechanism in the XY direction is located in the center of the support mechanism. The micro electric grinder of this patent accurately positions the clamping mechanism vertically and horizontally, which can not only clamp the chip on the device, but also polish the chip solder joints to ensure the quality of polishing.

[0004] However, the current clamping device for potting and polishing the solder joints of flip-chip has the following problems: When using the clamping device for potting and polishing the solder joints of flip-chip, the PCB board is prone to deviate from its position during the continuous soldering and potting process of the chip, which leads to misalignment between the PCB board and the bottom of the chip, causing the soldering and potting to shift. Therefore, we propose a clamping device for potting and polishing the solder joints of flip-chip. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a clamping device for potting and polishing solder joints of flip-chips, thus solving the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a clamping device for potting and polishing solder joints of flip-chip, comprising a base plate, a frame fixedly mounted on the top surface of the base plate, a servo motor fixedly mounted on the top surface of the base plate, a control module internally configured in the servo motor, the control module controlling the servo motor shaft to rotate intermittently, a disk fixedly mounted on the top surface of the servo motor shaft, the bottom surface of the disk being rotatably connected to the top surface of the frame, a plurality of PCB placement slots fixedly mounted on the top surface of the disk, a housing fixedly mounted on the top surface of the base plate, the housing being located on the left side of the frame, a sliding groove being formed on the right side of the housing, an electric telescopic rod fixedly mounted at the bottom inside the housing, a horizontal plate fixedly mounted on the top surface of the telescopic end of the electric telescopic rod, the outer wall of the horizontal plate being slidably connected to the inner wall of the sliding groove of the housing, and a... A cylinder is provided, with one end of a spiral hose fixedly installed on the right side of the cylinder. A suction cup module is fixedly installed on the right side of the bottom surface of the horizontal plate. The other end of the spiral hose, away from the cylinder, is fixedly connected to the top surface of the suction cup module. A cylinder is fixedly installed on the right side of the top surface of the horizontal plate. An L-shaped sliding plate is slidably installed on the right side of the top surface of the horizontal plate. A groove is provided on the top surface of the L-shaped sliding plate. The inner wall of the groove of the L-shaped sliding plate slides in contact with the outer wall of the cylinder. A semi-circular rubber block is fixed on the left side inside the L-shaped sliding plate. Two arc-shaped elastic bars are fixed at one end on the top surface of the L-shaped sliding plate. Two horizontal blocks are fixed on the top surface of the horizontal plate. The ends of the two arc-shaped elastic bars away from the L-shaped sliding plate are embedded in the top surface of the two horizontal blocks. Under the elastic force of the arc-shaped elastic bars, the semi-circular rubber block is pressed tightly against the PCB placement slot, aligning the PCB placement slot with the bottom of the suction cup module. A grinding clamping device is provided on the left side of the bottom surface of the horizontal plate.

[0007] The grinding clamp device includes two vertical rings. Two vertical rings are fixed to the left side of the bottom surface of the horizontal plate. An electric telescopic rod is fixedly installed on the inner wall of the two vertical rings. An L-shaped grinding plate is fixed to the right side of the telescopic end of the electric telescopic rod. Two clamping columns are fixed to the right side of the inside of the L-shaped grinding plate. A scraper is embedded on the right side of the L-shaped grinding plate. The abrasive cloth on the L-shaped grinding plate grinds the solder balls under the chip. The clamping columns limit the chip. The scraper scrapes off the solder ball debris, allowing the equipment to stably grind the solder balls under the chip.

[0008] Heating devices are provided on the left and right sides of the two horizontal blocks, and a fanning device is provided on the outer wall of the heating device.

[0009] According to the above technical solution, the servo motor is located in the middle of the frame, the semi-circular rubber block is located on the right side of the horizontal plate, the PCB placement slot is on the movement trajectory of the semi-circular rubber block, the bottom of the L-shaped grinding plate is provided with abrasive cloth, the right side of the top surface of the scraper is provided with a chamfer, and the chip adsorbed by the suction cup module is located on the movement trajectory of the scraper.

[0010] According to the above technical solution, the heating device includes four L-shaped blocks, two U-shaped plates, and two resistance heaters. The four L-shaped blocks are respectively fixed on the left and right sides of the two horizontal blocks, the two U-shaped plates are fixed on the bottom surface of each L-shaped block, and the two resistance heaters are respectively fixed on the left and right sides of the inner wall of the two U-shaped plates. The resistance heaters transfer heat to the PCB placement slot, and the solder beads on the chip melt and solder on the PCB board. The glue on the PCB board quickly adheres to the chip, allowing the chip and the PCB board to be quickly encapsulated together.

[0011] According to the above technical solution, the heating device further includes four square blocks, two arc-shaped spring sheets, and two rubber pads. The four square blocks are respectively fixed on the left and right sides of the two U-shaped plates, the two arc-shaped spring sheets are respectively embedded in the bottom surface of the four square blocks, and the two rubber pads are fixed on the bottom surface of the two arc-shaped spring sheets. Under the elastic force of the arc-shaped spring sheets, the contact speed between the chip on the suction cup module and the PCB board in the PCB placement slot is reduced.

[0012] According to the above technical solution, the two spiral plates are located on the front and back of the suction cup module, respectively, the two arc-shaped springs are located below the two spiral plates, and the disc is on the movement trajectory of the two rubber pads.

[0013] According to the above technical solution, the fanning device includes two U-shaped plates, two vertical strip plates, two thin rods, two rollers, and several fan plates. The two U-shaped plates are fixed to the outer walls of four square blocks, the two vertical strip plates are fixed to the right side of the housing, the two thin rods are inserted through and rotatably installed in the middle of the inner walls of the two vertical strip plates, the two rollers are fixed to the left side of the two thin rods, and the two rollers are located on the side of the two vertical strip plates that are far apart from each other. The several fan plates are respectively fixed to the outer walls of the two thin rods, and the several fan plates are located in the middle of the inside of the two U-shaped plates. The fan plates fan the residual heat in the U-shaped plates, allowing the residual heat in the U-shaped plates to be transferred to the potted chip.

[0014] According to the above technical solution, the fanning device further includes two sliders, four short rods, and four rectangular plates. The two sliders are slidably installed on the right side of the two vertical plates. The inner walls of the two sliders are rotatably connected to the outer walls of the two thin rods. The four short rods are respectively fixed on the top and bottom surfaces of the two sliders. The four rectangular plates are respectively fixed on the middle left side of the four short rods. The rectangular plates scrape away foreign objects on the vertical plates, keeping the surface of the vertical plates clean.

[0015] According to the above technical solution, the two U-shaped plates are located on the side where the two spiral plates are far apart from each other, and the four rectangular plates are slidably arranged on the side where the two spiral plates are far apart from each other.

[0016] This invention provides a clamping device for potting and polishing solder joints of flip-chip chips. It has the following advantages:

[0017] (1) The present invention uses a housing, an electric telescopic rod one, a horizontal plate, a cylinder, a spiral hose, a suction cup module, a cylinder, an L-shaped sliding plate, a semi-circular rubber block, an arc-shaped elastic bar, a horizontal block, a vertical ring, an electric telescopic rod two, an L-shaped grinding plate and a clamping column in conjunction with a scraper. Under the elastic force of the arc-shaped elastic bar, the semi-circular rubber block is tightly pressed against the PCB placement slot, so that the PCB placement slot is aligned with the bottom of the suction cup module, preventing the PCB board from being misaligned with the bottom of the chip and causing the soldering and potting offset. In addition, the sandpaper on the L-shaped grinding plate polishes the solder balls under the chip, the clamping column limits the chip, and the scraper scrapes off the polished solder ball debris, so that the equipment can stably polish the solder balls under the chip, preventing the chip from having solder ball polishing debris attached to it, which would cause poor chip soldering and potting effect.

[0018] (2) The present invention uses a heating device to make the L-shaped block, the U-shaped plate, the resistance heater, the square block and the arc-shaped spring piece work together with the rubber pad. The resistance heater transfers heat to the PCB placement slot, the solder balls on the chip melt and solder on the PCB board, and the glue on the PCB board quickly adheres to the chip, so that the chip and the PCB board are quickly encapsulated together. This prevents the glue on the PCB board from adhering to the chip too slowly, which would result in poor continuous encapsulation effect of the equipment. In addition, under the elastic force of the arc-shaped spring piece, the contact speed between the chip on the suction cup module and the PCB board in the PCB placement slot is slowed down, preventing the chip from hitting the PCB board and causing damage to the workpiece.

[0019] (3) The present invention uses a fan-driven device to make the U-shaped plate, vertical strip plate, thin rod, roller, strip fan plate, slider and short rod work together with the rectangular plate. The strip fan plate fans the residual heat in the U-shaped plate, so that the residual heat in the U-shaped plate is transferred to the potted chip, preventing the chip from being separated from the PCB board due to rapid cooling and cracking of the adhesive in the PCB board. In addition, the rectangular plate scrapes away foreign objects on the vertical strip plate, keeping the surface of the vertical strip plate clean and preventing foreign objects on the vertical strip plate from causing equipment jamming. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the entire invention;

[0021] Figure 2 This is a cross-sectional schematic diagram of the entire invention;

[0022] Figure 3 This is a cross-sectional view of the housing of the present invention;

[0023] Figure 4 For the present invention Figure 3 A magnified view of a portion of point A in the middle;

[0024] Figure 5 For the present invention Figure 3 A magnified view of a portion of point B in the middle;

[0025] Figure 6 This is a cross-sectional schematic diagram of the heating device of the present invention;

[0026] Figure 7 For the present invention Figure 6 A magnified view of a portion of point C in the middle;

[0027] Figure 8 This is a cross-sectional schematic diagram of the fan-operating device of the present invention;

[0028] Figure 9 For the present invention Figure 8 A magnified view of a portion of point D.

[0029] In the diagram: 1. Base plate; 2. Frame; 3. Servo motor; 4. Disc; 5. PCB placement slot; 6. Housing; 7. Heating device; 71. L-shaped block; 72. U-shaped plate; 73. Resistance heater; 74. Square block; 75. Arc-shaped spring; 76. Rubber pad; 8. Fan-shaped device; 81. U-shaped plate; 82. Vertical strip plate; 83. Thin rod; 84. Roller; 85. Strip fan plate; 86. Slider; 87. Short rod; 88. Rectangular plate; 9. Electric telescopic rod one; 10. Horizontal plate; 11. Cylinder; 12. Spiral hose; 13. Suction cup module; 14. Cylinder; 15. L-shaped sliding plate; 16. Semi-circular rubber block; 17. Arc-shaped spring; 18. Horizontal block; 19. Vertical ring; 20. Electric telescopic rod two; 21. L-shaped grinding plate; 22. Clamping column; 23. Scraper. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] Please see Figures 1-9 One embodiment of the present invention is: a clamping device for potting and polishing solder joints of flip-chip, including a base plate 1, a frame 2 fixedly mounted on the top surface of the base plate 1, a servo motor 3 fixedly mounted on the top surface of the base plate 1, a control module inside the servo motor, the control module of the servo motor controlling the servo motor shaft to rotate intermittently, a disk 4 fixed on the top surface of the servo motor 3 shaft, the bottom surface of the disk 4 being rotatably connected to the top surface of the frame 2, a plurality of PCB placement slots 5 fixed on the top surface of the disk 4, and the servo motor 3 being located in the middle inside the frame 2;

[0032] A housing 6 is fixedly installed on the top surface of the base plate 1. The housing 6 is located on the left side of the frame 2. A sliding groove is provided on the right side of the housing 6. An electric telescopic rod 9 is fixedly installed at the bottom inside the housing 6. A horizontal plate 10 is fixedly installed on the top surface of the telescopic end of the electric telescopic rod 9. The outer wall of the horizontal plate 10 is slidably connected to the inner wall of the sliding groove of the housing 6. A cylinder 11 is fixedly installed on the top surface of the housing 6. One end of a spiral hose 12 is fixedly installed on the right side of the cylinder 11. A suction cup module 13 is fixedly installed on the right side of the bottom surface of the horizontal plate 10. The other end of the spiral hose 12, away from the cylinder 11, is fixedly connected to the top surface of the suction cup module 13. A cylinder 14 is fixedly installed on the right side of the top surface of the horizontal plate 10. An L-shaped sliding plate 15 is slidably installed on the right side of the top surface of the horizontal plate 10. A sliding groove is provided on the top surface of the L-shaped sliding plate 15. The inner wall of the slide groove of the slide plate 15 slides in contact with the outer wall of the cylinder 14. A semi-circular rubber block 16 is fixed on the left side inside the L-shaped slide plate 15. Two arc-shaped elastic strips 17 are fixed at one end on the top surface of the L-shaped slide plate 15. Two horizontal blocks 18 are fixed on the top surface of the horizontal plate 10. The ends of the two arc-shaped elastic strips 17 away from the L-shaped slide plate 15 are embedded in the top surface of the two horizontal blocks 18. The semi-circular rubber block 16 is located on the right side of the horizontal plate 10. The PCB placement slot 5 is on the movement trajectory of the semi-circular rubber block 16. Under the elastic force of the arc-shaped elastic strips 17, the semi-circular rubber block 16 presses tightly against the PCB placement slot 5, so that the PCB placement slot 5 is aligned with the bottom of the suction cup module 13, avoiding misalignment between the PCB board and the bottom of the chip during use of the clamping device, which would cause soldering and potting offset.

[0033] A grinding clamping device is provided on the left side of the bottom surface of the horizontal plate 10. The grinding clamping device includes two vertical rings 19. Two vertical rings 19 are fixed on the left side of the bottom surface of the horizontal plate 10. An electric telescopic rod 20 is fixedly installed on the inner wall of the two vertical rings 19. An L-shaped grinding plate 21 is fixed on the right side of the telescopic end of the electric telescopic rod 20. Two clamping posts 22 are fixed on the right side of the inside of the L-shaped grinding plate 21. A scraper 23 is embedded on the right side of the L-shaped grinding plate 21. Abrasive cloth is provided at the bottom of the inside of the L-shaped grinding plate 21. A chamfer is provided on the right side of the top surface of the scraper 23. The chip adsorbed by the suction cup module 13 is located on the movement trajectory of the scraper 23. The abrasive cloth on the L-shaped grinding plate 21 polishes the solder balls under the chip. The clamping posts 22 limit the chip. During the reciprocating movement of the scraper 23, the scraper 23 scrapes off the solder ball debris, so that the equipment can stably polish the solder balls under the chip and avoid poor chip soldering and potting effect caused by the chip having solder ball polishing debris attached to it when the clamping device is in use.

[0034] In operation, base plate 1 supports frame 2, frame 2 supports disc 4, and disc 4 supports PCB placement slot 5. A PCB board with glue is placed in PCB placement slot 5. The servo motor 3 on base plate 1 is started, and the shaft of servo motor 3 begins intermittent rotation. The shaft of servo motor 3 drives disc 4 to rotate intermittently forward. Disc 4 rotates intermittently forward on frame 2, driving PCB placement slot 5 to rotate intermittently forward, and PCB placement slot 5 drives PCB board to rotate intermittently forward, allowing the equipment to process continuously without interruption. During the continuous soldering and encapsulation of chips on the PCB board, the PCB board is prone to displacement. At this time, the base plate 1 supports the housing 6, and the housing 6 supports the cylinder 11. The cylinder 11 is activated, and the cylinder 11 draws air through the spiral hose 12, allowing the suction cup below the suction cup module 13 to adhere to the chip. The electric telescopic rod 9 in the housing 6 is activated, and the telescopic end of the electric telescopic rod 9 begins to move downward. The telescopic end of the electric telescopic rod 9 moves downward, causing the horizontal plate 10 to move downward, and the horizontal plate 10 drives the suction cup to move downward. The disk module 13 moves downwards, causing the suction cup module 13 to move the chip downwards. Simultaneously, the horizontal plate 10 moves the cylinder 14 downwards, which in turn moves the L-shaped sliding plate 15 downwards. The L-shaped sliding plate 15 then moves the semi-circular rubber block 16 downwards. The horizontal plate 10 also moves the horizontal block 18 downwards, which in turn moves the arc-shaped elastic strip 17 downwards. As the semi-circular rubber block 16 moves downwards, it contacts the PCB placement slot 5. Under the pressure, the L-shaped sliding plate 15 slides to the right on the horizontal plate 10. The L-shaped slide plate 15 slides to the right on the cylinder 14. The arc-shaped spring strip 17 on the L-shaped slide plate 15 begins to deform. Under the elastic force of the arc-shaped spring strip 17, the semi-circular rubber block 16 is pressed tightly against the PCB placement slot 5, so that the PCB placement slot 5 is aligned with the bottom of the suction cup module 13. This prevents the PCB board in the PCB placement slot 5 from being misaligned with the bottom of the chip during the chip soldering and potting process, thus avoiding the problem of soldering and potting offset caused by the misalignment of the PCB board and the bottom of the chip when the clamping device is in use.

[0035] When the suction cup below the suction cup module 13 adheres to the chip, the horizontal plate 10 supports the vertical ring 19, activating the electric telescopic rod 20 in the vertical ring 19. The telescopic end of the electric telescopic rod 20 begins to reciprocate, driving the L-shaped grinding plate 21 to move left and right reciprocally. The L-shaped grinding plate 21 drives the clamping column 22 to move left and right reciprocally, and the L-shaped grinding plate 21 drives the scraper 23 to move left and right reciprocally. While the suction cup module 13 moves the chip downward, the telescopic end of the electric telescopic rod 20 resets, causing the L-shaped grinding plate 21 to move left and right reciprocally. During the process, the abrasive cloth on the L-shaped grinding plate 21 polishes the solder balls under the chip. As the clamping column 22 moves back and forth, it limits the chip. As the scraper 23 moves back and forth, it scrapes off the solder ball debris, allowing the equipment to stably polish the solder balls under the chip. This prevents the chip from having solder ball polishing debris attached to it during the polishing process, thus avoiding the problem of poor chip soldering and potting effect caused by solder ball polishing debris attached to the chip when the clamping device is in use.

[0036] Please see Figures 1-9 Based on the above embodiments, in another embodiment of the present invention, heating devices 7 are provided on the left and right sides of the two horizontal blocks 18. The heating devices 7 include four L-shaped blocks 71, two U-shaped plates 72, and two resistance heaters 73. The four L-shaped blocks 71 are respectively fixed on the left and right sides of the two horizontal blocks 18. The two U-shaped plates 72 are fixed on the bottom surface of each L-shaped block 71. The two resistance heaters 73 are respectively fixed on the left and right sides of the inner wall of the two U-shaped plates 72. The two U-shaped plates 72 are respectively located on the front and back of the suction cup module 13. The resistance heaters 73 transfer heat to the PCB placement slot 5, and the solder beads on the chip melt and solder on the PCB board. The glue on the PCB board quickly adheres to the chip, allowing the chip and the PCB board to be quickly encapsulated together. This avoids the problem of the glue on the PCB board adhering to the chip too slowly during the use of the clamping device, which would result in poor continuous encapsulation effect of the equipment.

[0037] The heating device 7 also includes four square blocks 74, two arc-shaped spring pieces 75, and two rubber pads 76. The four square blocks 74 are fixed to the left and right sides of the two U-shaped plates 72 respectively. The two arc-shaped spring pieces 75 are embedded in the bottom surface of the four square blocks 74 respectively. The two rubber pads 76 are fixed to the bottom surface of the two arc-shaped spring pieces 75. The two arc-shaped spring pieces 75 are located below the two U-shaped plates 72. The disc 4 is on the movement trajectory of the two rubber pads 76. Under the elastic force of the arc-shaped spring pieces 75, the contact speed between the chip on the suction cup module 13 and the PCB board in the PCB placement slot 5 is reduced, so as to avoid the chip hitting the PCB board and causing damage to the workpiece when the clamping device is in use.

[0038] The heating device 7 has a fanning device 8 on its outer wall. The fanning device 8 includes two U-shaped plates 81, two vertical strip plates 82, two thin rods 83, two rollers 84, and several fan plates 85. The two U-shaped plates 81 are fixed to the outer wall of the four squares 74. The two vertical strip plates 82 are fixed to the right side of the housing 6. The two thin rods 83 are installed through and rotatably in the middle of the inner wall of the two vertical strip plates 82. The two rollers 84 are fixed to the left side of the two thin rods 83 and are located on the side of the two vertical strip plates 82 that are far apart from each other. The several fan plates 85 are respectively fixed to the outer wall of the two thin rods 83 and are located in the middle of the inside of the two U-shaped plates 81. The two U-shaped plates 81 are located on the side of the two U-shaped plates 72 that are far apart from each other. The fan plates 85 fan the residual heat in the U-shaped plates 72 and transfer the residual heat in the U-shaped plates 72 to the potted chip, so as to avoid the chip from detaching from the PCB board due to rapid cooling and cracking of the adhesive in the chip and PCB board during use.

[0039] The fan-operated device 8 also includes two sliders 86, four short rods 87, and four rectangular plates 88. The two sliders 86 are slidably mounted on the right side of the two vertical plates 82. The inner walls of the two sliders 86 are rotatably connected to the outer walls of the two thin rods 83. The four short rods 87 are respectively fixed to the top and bottom surfaces of the two sliders 86. The four rectangular plates 88 are respectively fixed to the middle left side of the four short rods 87. The four rectangular plates 88 are slidably positioned on the side of the two U-shaped plates 72 that are far apart from each other. During the upward sliding process, the rectangular plates 88 scrape away foreign objects on the vertical plates 82, keeping the surface of the vertical plates 82 clean and preventing the clamping device from jamming due to foreign objects on the vertical plates 82 during use.

[0040] As the horizontal plate 10 moves the horizontal block 18 downwards, the horizontal block 18 moves the L-shaped block 71 downwards, the L-shaped block 71 moves the U-shaped plate 72 downwards, and the U-shaped plate 72 moves the resistance heater 73 downwards. When the chip on the suction cup module 13 contacts the PCB board in the PCB placement slot 5, the resistance heater 73 is activated and begins to heat up. The resistance heater 73 transfers heat to the PCB placement slot 5, causing the solder balls on the chip to melt and solder on the PCB board. At the same time, the adhesive on the PCB board quickly adheres to the chip, allowing the chip and the PCB board to be quickly encapsulated together. This prevents the adhesive on the PCB board from adhering to the chip too slowly during use, thus avoiding the problem of poor continuous encapsulation effect caused by the adhesive on the PCB board adhering to the chip too slowly during use of the clamping device.

[0041] As the L-shaped block 71 moves the U-shaped plate 72 downward, the U-shaped plate 72 moves the square block 74 downward, the square block 74 moves the arc-shaped spring piece 75 downward, and the arc-shaped spring piece 75 moves the rubber pad 76 downward. During the downward movement of the rubber pad 76, the rubber pad 76 contacts the disc 4. Under the action of the squeezing force, the arc-shaped spring piece 75 deforms. Under the elastic force of the arc-shaped spring piece 75, the contact speed between the chip on the suction cup module 13 and the PCB board in the PCB placement slot 5 is reduced, preventing the chip on the suction cup module 13 from hitting the PCB board during use, thus avoiding the problem of workpiece damage caused by the chip hitting the PCB board during use of the clamping device.

[0042] When the chip encapsulation is completed, the telescopic end of the electric telescopic rod 9 resets, the U-shaped plate 72 drives the block 74 to move upward, the block 74 drives the U-shaped plate 81 to move upward, the U-shaped plate 81 drives the thin rod 83 to move upward, the thin rod 83 drives the roller 84 to move upward, the roller 84 moves upward on the vertical strip plate 82, and under the action of friction, the roller 84 rolls on the vertical strip plate 82, the roller 84 drives the thin rod 83 to rotate, the thin rod 83 drives the strip fan plate 85 to rotate, the strip fan plate 85 rotates in the U-shaped plate 81, so that the strip fan plate 85 fans the residual heat in the U-shaped plate 72, and transfers the residual heat in the U-shaped plate 72 to the encapsulated chip, preventing the adhesive in the chip and PCB board from cracking due to rapid cooling when the device completes the chip encapsulation, thus avoiding the problem of the chip and PCB board separating due to rapid cooling cracking of the adhesive in the chip and PCB board during use.

[0043] As the U-shaped plate 81 moves the thin rod 83 upward, the thin rod 83 moves the slider 86 upward. The slider 86 slides upward on the vertical plate 82, and the slider 86 moves the short rod 87 upward. The short rod 87 moves the rectangular plate 88 upward, and the rectangular plate 88 slides upward on the vertical plate 82. During the upward sliding process, the rectangular plate 88 scrapes away foreign objects from the vertical plate 82, keeping the surface of the vertical plate 82 clean. This prevents foreign objects from being present on the vertical plate 82 during equipment use, thus avoiding the problem of equipment jamming caused by foreign objects on the vertical plate 82 during the use of the clamping device.

[0044] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A clamping device for potting and polishing solder joints of flip-chip, comprising a base plate (1), a frame (2) fixedly mounted on the top surface of the base plate (1), a servo motor (3) fixedly mounted on the top surface of the base plate (1), a disc (4) fixedly mounted on the top surface of the rotating shaft of the servo motor (3), the bottom surface of the disc (4) being rotatably connected to the top surface of the frame (2), and a plurality of PCB placement slots (5) fixedly mounted on the top surface of the disc (4), characterized in that: The bottom plate (1) top surface is fixedly installed with a shell (6), the shell (6) is located on the left side of the frame (2), the shell (6) is provided with a sliding slot on the right side, the shell (6) is fixedly installed with an electric telescopic rod one (9) at the bottom inside, the electric telescopic rod one (9) is fixed with a horizontal plate (10) on the top surface of the telescopic end, the horizontal plate (10) outer wall and the sliding slot inner wall of the shell (6) are slidably connected, the shell (6) top surface is fixedly installed with a pneumatic cylinder (11), the pneumatic cylinder (11) right side is fixedly installed with one end of a spiral hose (12), the horizontal plate (10) bottom surface right side is fixedly installed with a suction cup module (13), the spiral hose (12) is fixedly connected with the suction cup module (13) top surface away from the pneumatic cylinder (11) far away from the other end, the horizontal plate (10) top surface right side is fixed with a cylinder (14), the horizontal plate (10) top surface right side is slidably installed with an L-shaped sliding plate (15), the L-shaped sliding plate (15) top surface is provided with a sliding slot, the sliding slot inner wall of the L-shaped sliding plate (15) and the cylinder (14) outer wall are slidably contacted, the L-shaped sliding plate (15) inside left side is fixed with a semicircular rubber block (16), the L-shaped sliding plate (15) top surface is fixed with one end of two arc-shaped elastic strips (17), the horizontal plate (10) top surface is fixed with two cross blocks (18), one end of the two arc-shaped elastic strips (17) away from the L-shaped sliding plate (15) is embedded in the top surface of the two cross blocks (18), the horizontal plate (10) bottom surface left side is provided with a grinding clamp device; The grinding clamp device comprises two vertical rings (19), the horizontal plate (10) bottom surface left side is fixed with two vertical rings (19), the two vertical rings (19) inner wall is fixedly installed with an electric telescopic rod two (20), the electric telescopic rod two (20) telescopic end right side is fixed with an L-shaped grinding plate (21), the L-shaped grinding plate (21) inside right side is fixed with two clamping columns (22), the L-shaped grinding plate (21) right side is embedded with a scraper (23); The two cross blocks (18) left and right sides are provided with a heating device (7), the heating device (7) outer wall is provided with a fan device (8); The heating device (7) comprises four L-shaped blocks (71), two back-shaped plates (72) and two resistance heaters (73), four L-shaped blocks (71) are respectively fixed on the left and right sides of the two cross blocks (18), two back-shaped plates (72) are fixed on the bottom surface of each L-shaped block (71), two resistance heaters (73) are respectively fixedly installed on the left and right sides of the inner wall of the two back-shaped plates (72); The heating device (7) further comprises four square blocks (74), two arc-shaped elastic sheets (75) and two rubber pads (76), four square blocks (74) are respectively fixed on the left and right sides of the two back-shaped plates (72), two arc-shaped elastic sheets (75) are respectively embedded in the bottom surface of the four square blocks (74), and two rubber pads (76) are fixed on the bottom surface of the two arc-shaped elastic sheets (75).

2. The clamping device for flip-chip die bumping and polishing according to claim 1, wherein: Said servo motor (3) is located in the middle of the frame (2), the semicircle rubber block (16) is located on the right side of the horizontal plate (10), the PCB placing groove (5) is on the movement track of the semicircle rubber block (16), the L-shaped grinding plate (21) is internally provided with sand cloth at the bottom end, the scraper (23) is provided with a chamfer on the top right side, and the chip adsorbed by the suction cup module (13) is below the movement track of the scraper (23).

3. The clamping device for flip-chip die bumping and polishing according to claim 2, wherein: Two said plate (72) is located in the front and back of suction cup module (13), two said arc spring (75) is located below two plate (72), the disc (4) is in the movement track of two rubber pad (76).

4. The clamping device for flip-chip die bumping and polishing according to claim 3, wherein: Said fan device (8) includes two U-shaped plates (81), two vertical strip plates (82), two thin rods (83), two rollers (84) and several strip fans (85), two said U-shaped plates (81) are fixed on the outer wall of four blocks (74), two said vertical strip plates (82) are fixed on the right side of the shell (6), two said thin rods (83) are through and rotatably installed in the inner wall of two vertical strip plates (82), two said rollers (84) are fixed on the left side of two thin rods (83), two said rollers (84) are located on the side away from each other of two vertical strip plates (82), several said strip fans (85) are fixed on the outer wall of two thin rods (83), and several said strip fans (85) are located in the middle of two U-shaped plates (81).

5. The clamping device for flip-chip die bumping and polishing according to claim 4, wherein: Said fan device (8) further includes two sliding blocks (86), four short rods (87) and four rectangular plates (88), two said sliding blocks (86) are slidably installed on the right side of two vertical strip plates (82), the inner wall of two said sliding blocks (86) is rotatably connected with the outer wall of two thin rods (83), four said short rods (87) are respectively fixed on the top surface and the bottom surface of two sliding blocks (86), and four said rectangular plates (88) are respectively fixed on the left side of four short rods (87).

6. The clamping device for flip-chip die bumping and polishing according to claim 5, wherein: Two said U-shaped plates (81) are located on the side away from each other of two plate (72), and four said rectangular plates (88) are slidably arranged on the side away from each other of two plate (72).

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