Semiconductor copper lead frame cleaning machine

Abstract

The invention relates to the technical field of semiconductors, and discloses a semiconductor copper lead frame cleaning machine which comprises a cleaning tank, a mounting plate is fixedly connected to the top of the cleaning tank, a driving motor is fixedly connected to the top of the mounting plate, sliding rail plates are fixedly connected to the two sides of the inner wall of the cleaning tank, and a top cover is arranged at the top of the cleaning tank. The semiconductor copper lead frame cleaning machine further comprises a storage box and a lifting rod. According to the semiconductor copper lead frame cleaning machine, ascending and descending of the storage box are achieved through cooperation of structures, rotation of the storage box is achieved in the process, water on the surface of a lead frame is separated through centrifugal force generated by rotation, and finally the lead frame in the storage box is lifted out by driving a lifting rod to move upwards through overturning of the storage box. According to the lead frame cleaning device, a user can conveniently take the lead frame, dirt and water adsorbed after the lead frame is cleaned are reduced, meanwhile, the storage box automatically sinks and ascends, manpower is greatly saved, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductors, and in particular to a semiconductor copper lead frame cleaning machine. Background Art

[0002] With the rapid development of semiconductor technology, semiconductor copper lead frames are increasingly used in electronic devices. However, during the production process, various stains and impurities often adhere to the surface of the copper lead frame. These stains and impurities not only affect the appearance quality of the product, but may also have adverse effects on the performance and reliability of the product.

[0003] In the process of semiconductor production, the cleanliness of its lead frame plays a vital role in the final quality of the product. The traditional cleaning process usually requires the user to manually place the lead frame into the cleaning solution and manually remove it after cleaning. This requires the lead frame to be manually salvaged from the cleaning liquid, and the lead frame is in a static state during cleaning. The dirt separated after immersion or ultrasonic cleaning may be adsorbed on its surface again, causing secondary pollution. This also leads to poor cleaning effect of the lead frame and dirt still exists on its surface, which has a negative impact on the subsequent processing and use of the lead frame. In addition, when the lead frame is taken out of the cleaning tank after cleaning, the liquid and dirt in the cleaning tank may be brought out, causing the lead frame to absorb a large amount of liquid, which has a certain impact on its subsequent drying efficiency, thereby affecting the cleaning quality and subsequent drying efficiency of the lead frame. At the same time, there is a safety hazard of excessive contact between the user's hands and the cleaning liquid. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the existing technology has the disadvantage of easily absorbing dirt and bringing out moisture after cleaning, which affects the subsequent drying efficiency and the cleanliness after cleaning. For this reason, we propose a semiconductor copper lead frame cleaning machine.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solution: a semiconductor copper lead frame cleaning machine, comprising a cleaning tank, a mounting plate fixedly connected to the top of the cleaning tank, a drive motor fixedly connected to the top of the mounting plate, slide plates fixedly connected to both sides of the inner wall of the cleaning tank, a top cover provided on the top of the cleaning tank, and the semiconductor copper lead frame cleaning machine also comprising a storage box and a lifting rod;

[0006] A conveying mechanism is installed on the surface of the mounting plate to enable the storage box to rotate in a circular manner, thereby achieving the upward and downward movement of the storage box, and to move horizontally when descending into the cleaning tank to remove dirt dropped from the lead frame inside the storage box;

[0007] A rotating mechanism, the rotating mechanism being in driving connection with the conveying mechanism so that the storage box deflects 90 degrees when descending to fit the surface of the top cover, thereby sealing the top position of the storage box;

[0008] a dehydration mechanism, the dehydration mechanism being in driving connection with the conveying mechanism so that the lead frame inside the storage box rotates when it is lifted after cleaning, and the centrifugal force generated by the rotation of the storage box removes moisture adsorbed on the surface of the lead frame;

[0009] The lifting mechanism is connected to the rotating mechanism in a transmission manner so that when the storage box is rotated 90 degrees by the rotating mechanism, the lifting rod is driven to descend, and then when it is reset to the initial state, the lifting rod is driven to rise to slightly lift the lead frame inside the storage box upward.

[0010] Preferably, the conveying mechanism includes:

[0011] A tooth chain, two first gears are installed on one side of the mounting plate, the output end of the drive motor is fixedly connected to the first gear, the surface of the first gear is meshed with the inner wall of the tooth chain, one side of the tooth chain is fixedly connected to a rotating rod, the surface of the rotating rod is rotatably connected to a Z-shaped plate, the inner walls of the two slide rail plates are slidably connected to a sliding rod, and a sleeve is fixedly connected between the two sliding rods, the Z-shaped plate is slidably connected to the inner wall of the sleeve, and the bottom of the Z-shaped plate is rotatably connected to an L-shaped plate through a rotating shaft, and a storage box is installed at the bottom of the L-shaped plate.

[0012] Preferably, the rotating mechanism includes:

[0013] The L-shaped frame has a middle portion of the L-shaped plate fixedly connected to a limiting rod, a surface of the limiting rod is slidably connected to an inner wall of the L-shaped frame, and the top cover is fixedly connected to the front end of the Z-shaped plate.

[0014] Preferably, the dehydration mechanism includes:

[0015] The bracket is fixedly connected to the top of the cleaning tank, the bottom of the storage box is fixedly connected to a second gear, the bottom of the second gear is rotatably connected to the L-shaped plate through a rotating shaft, a tooth groove is opened on one side of the bracket, and the surface of the second gear is meshed with the tooth groove.

[0016] Preferably, the lifting mechanism includes:

[0017] The cam is fixed to a position adjacent to the L-shaped plate, and the cam is secured to the bottom of the L-shaped plate with a plurality of movable wheels. The cam is secured to the bottom of the L-shaped plate with a plurality of movable wheels. The cam is secured to the bottom of the L-shaped plate with a plurality of movable wheels.

[0018] Preferably, two ultrasonic cleaning devices are installed on the inner wall of the cleaning tank, a control terminal is installed at the front end of the cleaning tank, and pipes are installed on both sides of the cleaning tank.

[0019] Preferably, two semicircular plates are fixedly connected to both sides of the two raised plates, and the surfaces of the semicircular plates are embedded in one end of the slide plate.

[0020] Preferably, the top of the storage box abuts against the surface of the top cover, and the fixed wheel is the rotation center point of the L-shaped plate.

[0021] Technical effects and advantages of the present invention:

[0022] In the present invention, the lead frame is placed inside a storage box and lowered into the cleaning tank for soaking for a period of time. Then, an ultrasonic cleaning device is operated to generate ultrasonic waves to ultrasonically clean the lead frame, thereby shaking off dirt on the surface of the lead frame and forcing the dirt to separate from the lead frame. Finally, the storage box is moved up and lifted out of the cleaning tank to complete the cleaning.

[0023] In the present invention, the storage box is lowered and rotated to be aligned with the top cover, so as to close the storage box and ensure that the lead frame inside the storage box will not fall out. After a period of ultrasonic cleaning, the storage box moves to the right in an arc trajectory. Combined with the resistance in the water and the descending process of the arc, the dirt adsorbed on the inside of the storage box and the surface of the lead frame is forced to move away from the other side, thereby preventing the surface from adsorbing dirt after cleaning and affecting the final cleaning quality. At the same time, the storage box is in a vertical state at the initial position, which is convenient for placing the lead frame. It is in a flat state during cleaning to prevent one end of the lead frame from being bent and damaged by force.

[0024] In the present invention, after the lead frame in the storage box is cleaned, it is lifted out of the cleaning tank, so that the second gear contacts and rubs with the tooth groove to drive the second gear to rotate. The rotation of the second gear drives the storage box to run synchronously, so that the storage box generates centrifugal force, and dirt and moisture adsorbed on the surface of the storage box and the lead frame are thrown out, thereby reducing surface moisture and residual materials carried out, so as to facilitate drying of the lead frame after it is taken out.

[0025] In the present invention, after the storage box is cleaned once and reset to its initial position, the lifting rod is driven to rise and lift the lead frame inside the storage box upward, so that the lead frame slightly extends from the opening of the storage box, so that the user can take out the lead frame inside the storage box. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0027] Figure 2 This is a cross-sectional view of the internal structure of the casing of the present invention;

[0028] Figure 3 It is an exploded view of the main structure of the present invention;

[0029] Figure 4 It is a vertical cross-sectional view of the structure of the present invention;

[0030] Figure 5 It is an exploded view of the rotating mechanism and the lifting mechanism of the present invention;

[0031] Figure 6 This is an exploded view of the lifting rod and storage box position structure of the present invention.

[0032] Legend: 1. Cleaning tank; 2. Mounting plate; 3. Driving motor; 4. Slide plate; 5. Top cover; 6. Storage box; 7. Lifting rod; 8. Tooth chain; 9. First gear; 10. Rotating rod; 11. Z-shaped plate; 12. Slide rod; 13. Housing; 14. L-shaped plate; 15. L-shaped frame; 16. Limiting rod; 17. Pipeline; 18. Fixed wheel; 19. Moving wheel; 20. Slide groove; 21. Slide plate; 22. Double tooth plate; 23. Bracket; 24. Second gear; 25. Long groove; 26. Raised plate; 27. Ultrasonic cleaning device; 28. Control terminal; 29. Semicircular plate; 30. Tooth groove. DETAILED DESCRIPTION

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0034] Reference Figures 1-6 As shown, the present invention provides a technical solution: a semiconductor copper lead frame cleaning machine, comprising a cleaning tank 1, a mounting plate 2 fixedly connected to the top of the cleaning tank 1, a drive motor 3 fixedly connected to the top of the mounting plate 2, slide plates 4 fixedly connected to both sides of the inner wall of the cleaning tank 1, a top cover 5 provided on the top of the cleaning tank 1, and the semiconductor copper lead frame cleaning machine also comprising a storage box 6 and a lifting rod 7;

[0035] A conveying mechanism is installed on the surface of the mounting plate 2 to enable the storage box 6 to rotate in a circular manner, thereby achieving the upward and downward movement of the storage box 6, and to move horizontally when descending into the cleaning tank 1 to remove the dirt that falls from the lead frame inside the storage box 6;

[0036] The rotating mechanism is in transmission connection with the conveying mechanism, so that the storage box 6 deflects 90 degrees when it descends and fits against the surface of the top cover 5, thereby sealing the top position of the storage box 6;

[0037] The dehydration mechanism is connected to the conveying mechanism in a transmission manner so that the lead frame inside the storage box 6 rotates when it is raised after cleaning, and the centrifugal force generated by the rotation of the storage box 6 is used to throw away the water adsorbed on the surface of the lead frame;

[0038] The lifting mechanism is connected to the rotating mechanism in a transmission manner so that when the storage box 6 is rotated ninety degrees by the rotating mechanism, the lifting rod 7 is driven to descend, and then when it is reset to the initial state, the lifting rod 7 is driven to rise and slightly lift the lead frame inside the storage box 6 upward.

[0039] Reference Figure 1-Figure 5 As shown, in this embodiment: the conveying mechanism includes:

[0040] A toothed chain 8, two first gears 9 are installed on one side of the mounting plate 2, the output end of the drive motor 3 is fixedly connected to the first gear 9, the surface of the first gear 9 is meshed with the inner wall of the toothed chain 8, one side of the toothed chain 8 is fixedly connected to a rotating rod 10, the surface of the rotating rod 10 is rotatably connected to a Z-shaped plate 11, the inner walls of the two slide rail plates 4 are slidably connected to a slide rod 12, and a sleeve 13 is fixedly connected between the two slide rods 12. The Z-shaped plate 11 is slidably connected to the inner wall of the sleeve 13, and the bottom of the Z-shaped plate 11 is rotatably connected to an L-shaped plate 14 through a rotating shaft. The bottom of the L-shaped plate 14 is installed with a storage box 6, and also includes a rotating mechanism, which includes:

[0041] The L-shaped frame 15 and the middle part of the L-shaped plate 14 are fixedly connected to the limiting rod 16, and the surface of the limiting rod 16 is slidably connected to the inner wall of the L-shaped frame 15. The top cover 5 is fixedly connected to the front end of the Z-shaped plate 11. When it is necessary to use this device to clean the semiconductor copper lead frame, the user places the semiconductor copper lead frame into a single compartment of the storage box 6, and then starts the drive motor 3 to rotate the first gear 9, which is engaged with the first gear 9 through the tooth chain 8, so that the first gear 9 drives the tooth chain 8 to rotate counterclockwise. When the toothed chain 8 rotates, the rotating rod 10 will be driven to move synchronously, so that the rotating rod 10 will move up and down following the rotation of the toothed chain 8. When the rotating rod 10 is at the top of the toothed chain 8 and moves in the arc, the rotating rod 10 will move left or right along the arc, which will also cause the rotating rod 10 to drive the Z-shaped plate 11 to slide left or right on the inner wall of the housing 13. After that, when the rotating rod 10 continues to move in a straight line, it will drive the Z-shaped plate 11 to push the housing 13 up or down. The housing 13 will also descend or rise along the inner wall of the slide plate 4 to achieve the constraint of the movement of the housing 13 and the movement trajectory of the Z-shaped plate 11. When the Z-shaped plate 11 moves downward from the top, the two ends of the limit rod 16 will also slide along the inner wall of the L-shaped frame 15. Through the straight track at the top of the L-shaped frame 15, when the L-shaped plate 14 follows the Z-shaped plate 11 to move downward, the limit rod 16 is restricted by the inner wall of the L-shaped frame 15. The downward movement process will cause the limit rod 16 to slide forward along the inner wall of the L-shaped frame 15, which makes the L-shaped plate 14 move downward. 14 and the storage box 6 are deflected. After the Z-shaped plate 11 is lowered and presses the L-shaped plate 14 and the limiting rod 16 to deflect by a certain angle, the limiting rod 16 will slide forward into the vertical downward groove of the L-shaped frame 15. Then the limiting rod 16 will descend along the L-shaped frame 15. At this time, the storage box 6 and the L-shaped plate 14 have been deflected 90 degrees along the bottom of the Z-shaped plate 11 as the center of the circle, which makes the top of the storage box 6 rotate to fit with the top cover 5. In this step, the storage box 6 is closed by fitting the top cover 5 with the top of the storage box 6.

[0042] After that, the driving motor 3 continues to operate to drive the storage box 6 and the L-shaped plate 14 to move into the cleaning tank 1, and stops when the rotating rod 10 moves to the bottom of the vertical position on the left side of the toothed chain 8, so that the storage box 6 is in contact with the cleaning liquid and ultrasonic cleaning is performed. In this process, the rotating rod 10 stays for a period of time so that the storage box 6 is in the cleaning tank 1 to ensure that the semiconductor copper lead frame is fully immersed and cleaned. After a period of time, the lead frame is cleaned, and the driving motor 3 is started again to drive the toothed chain 8 and the rotating rod 10 to move. In this process, the rotating rod 10 will rotate from the bottom left side of the toothed chain 8 along the arc at the bottom of the toothed chain 8, which also makes the rotating rod 10 move from left to right, and then drive the Z-shaped plate 11 and the storage box 6 to perform the same operation. This movement makes the storage box 6 move to one side in the cleaning water, and the dirt cleaned by the lead frame is shaken off in the opposite direction by the resistance between the storage box 6 and the water when it moves, so as to reduce the dirt adsorbed on the surface of the storage box 6 and the lead frame, and the storage box 6 moves to the right along the arc track at the bottom of the toothed chain 8. This makes the storage box 6 first descend and then rise when it moves to the right. The force of the storage box 6 when it moves downward swings the dirt at the bottom of its inner wall upward. The storage box 6 moves to the right again and creates resistance with the water to swing the dirt to a farther distance, effectively preventing the dirt from adhering to the lead frame or cleaning machine parts again. As the storage box 6 continues to move to the right and rises gradually away from the cleaning water area, when the rotating rod 10 rotates and rises to drive the limiting rod 16 to move to the corner of the L-shaped frame 15, the limiting rod 16 will be deflected downward by the gravity of the top structure of the L-shaped plate 14, and the L-shaped plate The continued rise of 14 will also cause the limiting rod 16 to slide into the parallel groove at the top of the L-shaped frame 15, which will cause the L-shaped plate 14 to rotate in the opposite direction. When the limiting rod 16 slides into the other end along the inner wall of the L-shaped frame 15, the L-shaped plate 14 will also rotate to the initial position, and the storage box 6 will move away from the side of the top cover 5, so that the top of the storage box 6 is in an open state, and the user can take out the semiconductor copper lead frame inside the storage box 6 to complete the cleaning work. After that, the user can put in the next batch of semiconductor copper lead frames that need to be cleaned for cleaning;

[0043] The cleaning of the cleaning box 6 is completed by the lifting of the toothed chain 8, and the cleaning of the cleaning box 6 is completed by the lifting of the toothed chain 8.

[0044] Reference Figure 1-Figure 5 As shown, in this embodiment: the dehydration mechanism includes:

[0045] The bracket 23 is fixedly connected to the top of the cleaning tank 1, and the bottom of the storage box 6 is fixedly connected to the second gear 24. The bottom of the second gear 24 is rotatably connected to the L-shaped plate 14 through a rotating shaft. A tooth groove 30 is provided on one side of the bracket 23, and the surface of the second gear 24 is engaged with the tooth groove 30. When the storage box 6 is in the cleaning tank 1 and completes immersion and ultrasonic cleaning, the rotating rod 10 rotates from the left side of the bottom of the tooth chain 8 to the right side of the tooth chain 8. At this time, the subsequent operation process of the rotating rod 10 will rise linearly along the right side of the tooth chain 8, and after the storage box 6 moves upward and to the right through the bottom of the tooth chain 8, the surface of the second gear 24 will be aligned with the left side of the tooth groove 30. After that, the storage box 6 and the L-shaped plate 14 rise, and the second gear 24 will contact the surface of the tooth groove 30. The surface of the second gear 24 is engaged with the tooth groove 30, so that the second gear 24 rotates continuously along the surface of the tooth groove 30. , which also enables the second gear 24 to drive the storage box 6 to rotate along the bottom of the L-shaped plate 14. The centrifugal force generated by the rotation of the storage box 6 causes the moisture adsorbed in the storage box 6 and the moisture adsorbed on the lead frame after cleaning to be thrown away to the surrounding areas, thereby reducing the moisture on the surface of the storage box 6 and the lead frame, and achieving simple drying of the lead frame after cleaning, so as to facilitate the subsequent drying process after the lead frame is cleaned. The centrifugal force generated by the rotation of the storage box 6 can reduce the possibility of the storage box 6 and the lead frame absorbing cleaning dirt, and avoid secondary contamination of the lead frame after cleaning. In addition, the user can install partitions around the top of the cleaning tank 1 that do not hinder the operation and operation of the storage box 6 according to actual usage, so as to reduce the possibility of the storage box 6 taking out the lead frame from the inside of the cleaning tank 1 and being contaminated by the outside world. At the same time, it can block the moisture thrown out by the storage box 6 during rotation, and avoid the storage box 6 from polluting the surrounding environment when throwing water.

[0046] Reference Figure 4-Figure 6 As shown, in this embodiment: the lifting mechanism includes:

[0047] The fixed wheel 18, the number of fixed wheels 18 is two and both are fixedly connected to the bottom of the Z-shaped plate 11, the two sides of the L-shaped plate 14 are rotatably connected with the moving wheel 19, the surface of the moving wheel 19 is meshed with the fixed wheel 18, the bottom of the L-shaped plate 14 is provided with a slide groove 20, the inner wall of the slide groove 20 is slidably connected with a slide plate 21, one side of the slide plate 21 is fixedly connected with a double-toothed plate 22, the surface of the moving wheel 19 is meshed with the surface of the double-toothed plate 22, the interior of the storage box 6 is provided with a long groove 25, the lifting rod 7 is slidably connected to the inner wall of the long groove 25, and both ends of the lifting rod 7 are fixedly connected with a raised plate 26, the surface of the raised plate 26 is embedded in one end of the slide plate 21, and the two sides of the two raised plates 26 are fixedly connected together There are two semicircular plates 29, and the surface of the semicircular plate 29 is embedded in one end of the slide 21. When the storage box 6 completes the dehydration process, it continues to move upward and the L-shaped plate 14 is reset and deflected along the bottom of the Z-shaped plate 11 through the rotating mechanism. The deflection movement of the L-shaped plate 14 will drive the moving wheel 19 to rotate along the surface of the fixed wheel 18. At this time, the L-shaped plate 14 is in a downward rotation, which will drive the moving wheel 19 to rotate clockwise, and the double-toothed plate 22 is meshed with the surface of the moving wheel 19. When the moving wheel 19 rotates clockwise, it will drive the slide 21 to move upward along the slide 20, and the lifting rod 7 slides on the inner wall of the long groove 25. One end of the slide 21 is inserted into the surface of the raised plate 26 and the surface of the semicircular plate 29. This makes it easier for the user to take out the cleaned lead frame from the storage box 6. At this time, the storage box 6 will be in its initial position. When a new lead frame is put in, it will also be slightly lifted out of the top of the storage box 6 by the action of the lifting rod 7. When a new lead frame is put into the storage box 6 and moves downward, the L-shaped plate 14 will be deflected. The moving wheel 19 will be driven to contact the fixed wheel 18 again, causing the moving wheel 19 to rotate in the opposite direction. The direction of rotation of the moving wheel 19 drives the double-toothed plate 22 to descend, causing the slide plate 21 to push down the semicircular plate 29 and the raised plate 26, and reset the lifting rod 7 to the bottom position of the storage box 6, so that the introduced lead frame is completely retracted into the storage box 6. In addition, when the storage box 6 rotates by the second gear 24, one end of the slide plate 21 will move along the surface of the raised plate 26 and the semicircular plate 29, so that the raised plate 26 and the semicircular plate 29 will not be separated from the slide plate 21 due to the rotation of the storage box 6, ensuring that the connection stability between the slide plate 21, the raised plate 26 and the semicircular plate 29 is guaranteed.

[0048] Reference Figure 1As shown, in this embodiment: two ultrasonic cleaning devices 27 are installed on the inner wall of the cleaning tank 1, a control terminal 28 is installed at the front end of the cleaning tank 1, and pipes 17 are installed on both sides of the cleaning tank 1. The two pipes 17 are distributed on both sides of the cleaning tank 1. At the same time, the pipes 17 are divided into an input pipe and a discharge pipe, and the input pipe is higher than the bottom of the discharge pipe, wherein the discharge pipe is placed at the bottom of the cleaning tank 1 to ensure that the sewage can be completely discharged through the discharge pipe. When the storage box 6 sinks into the cleaning tank 1 and contacts with the clean water for immersion cleaning, the control terminal 28 is used as a controller to control the ultrasonic cleaning device 27 and the drive motor 3 to start. The staff can control and adjust the operating efficiency of the drive motor 3 through the control terminal 28, change the lifting speed of the storage box 6 driven by the tooth chain 8, and the static speed of the storage box 6 driven by the tooth chain 8 to sink into the cleaning tank 1. The cleaning and soaking time is stopped, thereby achieving precise control of the cleaning effect of the lead frame. The adjustment of the lifting speed allows the soaking time and static cleaning time of the lead frame in the cleaning water to be flexibly adjusted, further meeting different cleaning needs. In addition, after the lead frame enters the cleaning tank 1 and is soaked, ultrasonic vibration is generated by the ultrasonic cleaning device 27 for cleaning. The ultrasonic vibration can strongly peel off the dirt and oxides on the surface of the lead frame. At the same time, the impact force generated by the tiny bubbles of the ultrasonic wave when they burst can further refine the cleaning effect, ensuring that every tiny corner of the lead frame can be thoroughly cleaned. In addition, this ultrasonic cleaning method is not only efficient, but also does not damage the lead frame itself, maintaining its original physical properties and surface finish, and providing a good foundation for subsequent packaging processes.

[0049] Reference Figure 4 and Figure 5 As shown, in this embodiment: the top of the storage box 6 abuts against the surface of the top cover 5, the fixed wheel 18 is the rotation center point of the L-shaped plate 14, and when the storage box 6 and the L-shaped plate 14 are deflected, the storage box 6 will be close to the surface of the top cover 5 to achieve closure. In addition, the initial positions of the L-shaped plate 14, the limiting rod 16, the top cover 5, the L-shaped frame 15, the bracket 23, the tooth groove 30, and the storage box 6 can all be slightly inclined. On the basis of not changing the operating trajectory of all the above mechanisms, after the storage box 6 and the L-shaped plate 14 are deflected and rotated, they have a certain inclination angle, so that the storage box 6 The top of the initial position is slightly larger than the horizontal angle of the bottom, which also makes the top cover 5 and the top of the storage box 6 in an inclined contact. When the storage box 6 rotates to dehydrate, the internal lead frame is not easy to slide toward the top cover 5 and cause collision. The slightly inclined design also makes the limiting rod 16 slide along the L-shaped frame 15 to make the L-shaped plate 14 deflect more smoothly. In addition, the L-shaped plate 14 uses the fixed wheel 18 as the rotation center point, ensuring that the moving wheel 19 rotates in a circle along the outer side of the fixed wheel 18 when the L-shaped plate 14 deflects, avoiding the possibility of tooth disengagement between the moving wheel 19 and the fixed wheel 18.

[0050] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor copper lead frame cleaning machine, comprising a cleaning tank (1), characterized in that: The top of the cleaning tank (1) is fixedly connected to a mounting plate (2), the top of the mounting plate (2) is fixedly connected to a driving motor (3), both sides of the inner wall of the cleaning tank (1) are fixedly connected to slide rails (4), the top of the cleaning tank (1) is provided with a top cover (5), and the cleaning machine further comprises a storage box (6) and a lifting rod (7); A conveying mechanism is installed on the surface of the mounting plate (2) to enable the storage box (6) to rotate in a circular manner, thereby realizing the upward and downward movement of the storage box (6), and to move horizontally when descending into the cleaning tank (1), so as to remove dirt that falls from the lead frame inside the storage box (6); A rotating mechanism, the rotating mechanism being in transmission connection with the conveying mechanism so that the storage box (6) deflects 90 degrees when descending to fit the surface of the top cover (5), thereby sealing the top position of the storage box (6); A dehydration mechanism, the dehydration mechanism being in transmission connection with the conveying mechanism, so that the lead frame inside the storage box (6) rotates when it is lifted up after cleaning, and the centrifugal force generated by the rotation of the storage box (6) is used to throw out the water adsorbed on the surface of the lead frame; The lifting mechanism is connected to the rotating mechanism in a transmission manner so that when the storage box (6) is rotated 90 degrees by the rotating mechanism, the lifting rod (7) is driven to descend, and then when it is reset to the initial state, the lifting rod (7) is driven to rise and slightly lift the lead frame inside the storage box (6) upward.

2. The semiconductor copper lead frame cleaning machine according to claim 1, characterized in that: The conveying mechanism comprises: A toothed chain (8), two first gears (9) are installed on one side of the mounting plate (2), the output end of the drive motor (3) is fixedly connected to the first gear (9), the surface of the first gear (9) is meshed with the inner wall of the toothed chain (8), one side of the toothed chain (8) is fixedly connected to a rotating rod (10), the surface of the rotating rod (10) is rotatably connected to a Z-shaped plate (11), the inner walls of the two slide rail plates (4) are slidably connected to a sliding rod (12), a sleeve (13) is fixedly connected between the two sliding rods (12), the Z-shaped plate (11) is slidably connected to the inner wall of the sleeve (13), the bottom of the Z-shaped plate (11) is rotatably connected to an L-shaped plate (14) through a rotating shaft, and a storage box (6) is installed at the bottom of the L-shaped plate (14).

3. The semiconductor copper lead frame cleaning machine according to claim 1, characterized in that: The rotating mechanism comprises: An L-shaped frame (15) is provided, wherein the middle portion of the L-shaped plate (14) is fixedly connected to a limiting rod (16), the surface of the limiting rod (16) is slidably connected to the inner wall of the L-shaped frame (15), and the top cover (5) is fixedly connected to the front end of the Z-shaped plate (11).

4. The semiconductor copper lead frame cleaning machine according to claim 1, characterized in that: The dehydration mechanism comprises: A bracket (23) is fixedly connected to the top of the cleaning tank (1); a second gear (24) is fixedly connected to the bottom of the storage box (6); the bottom of the second gear (24) is rotatably connected to the L-shaped plate (14) via a rotating shaft; a tooth groove (30) is provided on one side of the bracket (23); and a surface of the second gear (24) is meshed with the tooth groove (30).

5. The semiconductor copper lead frame cleaning machine according to claim 1, characterized in that: The lifting mechanism comprises: A fixed wheel (18), wherein the number of the fixed wheels (18) is two and both are fixedly connected to the bottom of the Z-shaped plate (11), the two sides of the L-shaped plate (14) are rotatably connected to a moving wheel (19), the surface of the moving wheel (19) is meshed with the fixed wheel (18), the bottom of the L-shaped plate (14) is provided with a sliding groove (20), the inner wall of the sliding groove (20) is slidably connected to a slide plate (21), one side of the slide plate (21) is fixedly connected to a double-toothed plate (22), the surface of the moving wheel (19) is meshed with the surface of the double-toothed plate (22), a long groove (25) is provided inside the storage box (6), the lifting rod (7) is slidably connected to the inner wall of the long groove (25), both ends of the lifting rod (7) are fixedly connected to a raised plate (26), the surface of the raised plate (26) is embedded in one end of the slide plate (21).

6. The semiconductor copper lead frame cleaning machine according to claim 1, characterized in that: Two ultrasonic cleaning devices (27) are installed on the inner wall of the cleaning tank (1), a control terminal (28) is installed at the front end of the cleaning tank (1), and pipes (17) are installed on both sides of the cleaning tank (1).

7. The semiconductor copper lead frame cleaning machine according to claim 5, characterized in that: Two semicircular plates (29) are fixedly connected to both sides of the two raised plates (26), and the surfaces of the semicircular plates (29) are embedded in one end of the slide plate (21).

8. The semiconductor copper lead frame cleaning machine according to claim 1, characterized in that: The top of the storage box (6) abuts against the surface of the top cover (5), and the fixed wheel (18) is the rotation center point of the L-shaped plate (14).

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