Dehumidification device and vehicle

Abstract

The invention discloses a dehumidification device which is characterized by comprising a shell, a heat exchanger, a heat exchanger and a heat exchanger. The dehumidification assembly comprises a first part and a second part, and the dehumidification assembly is configured to be switched between a first state and a second state; in the first state, the first part is a cold part, the second part is a hot part, the air duct assembly is used for guiding airflow to be dehumidified to flow through the first part and guiding external dry airflow to flow through the second part, and in the second state, the first part is the hot part, and the second part is the cold part. The air duct assembly is used for guiding airflow to be dehumidified to flow through the second part and guiding external dry airflow to flow through the first part. According to the dehumidification device, the to-be-dehumidified airflow can flow through the cold part to be dehumidified, external dry airflow flows through the hot part to dry the dehumidification assembly, continuous dehumidification is achieved, and the working efficiency of the dehumidification device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of dehumidification, and in particular to a dehumidification device and a vehicle. Background Art

[0002] In related technologies, automobiles mainly use the air conditioning evaporator for dehumidification, which limits the system's energy efficiency ratio (Cooling Performance Rate, hereinafter referred to as COP). At the same time, evaporator cooling and dehumidification easily lead to evaporator frosting. During the defrosting process, the dehumidification work is suspended, and continuous dehumidification cannot be achieved, which affects the dehumidification efficiency. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a dehumidification device to achieve efficient dehumidification.

[0004] Another object of the present invention is to provide a vehicle comprising the above-mentioned dehumidification device.

[0005] According to an embodiment of the first aspect of the present invention, a dehumidification device includes: a shell, the shell having an air duct assembly; a dehumidification assembly, the dehumidification assembly including a first part and a second part, and the dehumidification assembly is configured to switch between a first state and a second state; in the first state, the first part is a cold part, and the second part is a hot part, and the air duct assembly is used to guide the air flow to be dehumidified to flow through the first part, and to guide the external dry air flow to flow through the second part; in the second state, the first part is a hot part, and the second part is a cold part, and the air duct assembly is used to guide the air flow to be dehumidified to flow through the second part, and to guide the external dry air flow through the first part.

[0006] According to the dehumidification device of an embodiment of the present invention, the shell includes an air duct assembly, and the dehumidification assembly includes a first part and a second part. The dehumidification assembly can also switch between the first state and the second state. When the dehumidification assembly is in the first state, the first part is the cold part and the second part is the hot part. The air duct assembly guides the airflow to be dehumidified to flow through the first part, that is, the cold part, for dehumidification; after dehumidification to a certain extent, the dehumidification assembly switches to the second state, the first part is the hot part and the second part is the cold part. The air duct assembly guides the airflow to be dehumidified to flow through the second part, that is, the cold part, to continue dehumidification. At the same time, the air duct assembly also guides the external dry airflow to flow through the first part, that is, the hot part, to dry the dehumidification assembly so as to continue to dehumidify the airflow to be dehumidified. Such a cycle can achieve continuous dehumidification of the dehumidification device and improve the dehumidification efficiency.

[0007] According to the dehumidification device of an embodiment of the present invention, the dehumidification component has two working states. By switching the working states, under the action of the air duct component, the air flow to be dehumidified flows through the cold part all the time for dehumidification, and the dry air flow flows through the hot part all the time to dry the dehumidification component, thereby achieving continuous dehumidification and improving the working efficiency of the dehumidification device.

[0008] According to some embodiments of the present invention, the dehumidification component includes a semiconductor refrigeration plate, the semiconductor refrigeration plate includes a cold end and a hot end, and the cold end and the hot end are switchable; in a first state, the first part includes the cold end, and the second part includes the hot end; in a second state, the first part includes the hot end, and the second part includes the cold end.

[0009] According to some embodiments of the present invention, the semiconductor refrigeration plate is configured to separate the cavity of the shell into a first air duct and a second air duct, the first part is arranged in the first air duct, and the second part is arranged in the second air duct.

[0010] According to some embodiments of the present invention, a rubber sealing ring is provided between the semiconductor refrigeration plate and the housing.

[0011] According to some embodiments of the present invention, the air duct assembly includes a first air door, and the first air door is used to guide the air flow to be dehumidified to flow through the cold part.

[0012] According to some embodiments of the present invention, the air duct assembly further includes a second air door configured to guide the dry air flow to flow through the hot portion.

[0013] According to some embodiments of the present invention, the dehumidification component includes a drying element, which is arranged in the shell; the drying element located in the cold part is configured to dry the airflow to be dehumidified, and the drying element located in the hot part is configured to be dried by the dry airflow.

[0014] According to some embodiments of the present invention, the dehumidification assembly further includes a heat dissipation component, the heat dissipation component is connected to the semiconductor refrigeration plate, and the drying element is arranged on the heat dissipation component.

[0015] According to some embodiments of the present invention, the heat dissipation component includes a fin heat sink.

[0016] According to some embodiments of the present invention, the fin heat sink includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are connected to both sides of the semiconductor refrigeration plate.

[0017] According to some embodiments of the present invention, the cross-sectional shape of the heat dissipation fins includes one of a positive direction, a rectangle, a circle, and an ellipse.

[0018] According to some embodiments of the present invention, the heat dissipation ribs are provided with openings. According to some embodiments of the present invention, the shape of the opening includes circle, triangle, rectangle, ellipse or polygon.

[0019] According to some embodiments of the present invention, a plurality of heat dissipation fins are arranged at intervals on both sides of the cooling fin.

[0020] According to some embodiments of the present invention, the heat dissipation component is welded to the semiconductor refrigeration plate.

[0021] According to some embodiments of the present invention, the drying element is a solid adsorbent.

[0022] According to some embodiments of the present invention, the drying element is coated on the outer surface of the heat dissipation component.

[0023] According to some embodiments of the present invention, the shell is provided with a first air outlet and a second air outlet, the air inlet of the air flow to be dehumidified is the first air outlet, and the air outlet of the air flow to be dehumidified is the second air outlet.

[0024] According to some embodiments of the present invention, along the flow direction of the airflow to be dehumidified, the diameter of at least part of the first air outlet gradually increases, and the diameter of at least part of the second air outlet gradually decreases.

[0025] According to some embodiments of the present invention, the housing further defines a third air outlet and a fourth air outlet, the air inlet of the dry air flow is the third air outlet, and the air outlet of the dry air flow is the fourth air outlet.

[0026] According to some embodiments of the present invention, a gas driving device is further included, and the gas driving device is arranged at the third air outlet and / or the fourth air outlet to control the flow direction of the drying airflow.

[0027] According to some embodiments of the present invention, the gas driving device is a fan.

[0028] According to some embodiments of the present invention, a humidity sensor is further included. The humidity sensor is disposed in the air duct and is used to detect the humidity of the gas in the air duct.

[0029] A vehicle according to an embodiment of a second aspect of the present invention includes the dehumidification device according to the embodiment of the first aspect of the present invention.

[0030] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments with reference to the following drawings, in which: Figure 1 This is one of the structural schematic diagrams of a dehumidification device according to an embodiment of the present invention; Figure 2 This is a second structural schematic diagram of a dehumidification device according to an embodiment of the present invention; Figure 3 is a cross-sectional schematic diagram of a dehumidification component in a dehumidification device in a first state according to an embodiment of the present invention; Figure 4 is a cross-sectional schematic diagram of a dehumidification component in a dehumidification device according to an embodiment of the present invention in a second state; Figure 5 This is a schematic structural diagram of a dehumidification component in a dehumidification device according to an embodiment of the present invention; Figure 6 A schematic cross-sectional view of a dehumidification device according to an embodiment of the present invention.

[0032] Reference numerals: 100: Dehumidification device; 10: Shell; 11: First air duct; 111: First air outlet; 112: Second air outlet; 12: Second air duct; 121: Third air outlet; 122: Fourth air outlet; 15: First sub-shell; 16: Second sub-shell; 17: Third sub-shell; 18: Fourth sub-shell; 19: Fifth sub-shell; 20: Dehumidification assembly; 21: Semiconductor refrigeration chip; 211: Cold end; 212: Hot end; 22: Heat dissipation ribs; 23: Solid adsorbent; 30: Air duct assembly; 31: First air gate; 311: First sub-air gate; 312: Second sub-air gate; 32: Second air gate; 321: Third sub-air gate; 322: Fourth sub-air gate; 323: Fifth sub-air gate; 324: Sixth sub-air gate; 40: Gas drive device; 50: Humidity sensor. DETAILED DESCRIPTION

[0033] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0036] Reference below Figures 1-6 A dehumidification device 100 according to an embodiment of the first aspect of the present invention will be described.

[0037] like Figures 1-6 As shown, the dehumidification device 100 according to the first embodiment of the present invention includes: a shell 10 and a dehumidification component 20.

[0038] Specifically, the shell 10 includes an air duct assembly 30, the dehumidification assembly 20 includes a first part and a second part, and the dehumidification assembly 20 is configured to switch between a first state and a second state; in the first state, the first part is a cold part, and the second part is a hot part, and the air duct assembly 30 is used to guide the air flow to be dehumidified through the first part, and to guide the external dry air flow through the second part; in the second state, the first part is a hot part, and the second part is a cold part, and the air duct assembly 30 is used to guide the air flow to be dehumidified through the second part, and to guide the external dry air flow through the first part.

[0039] like Figure 1-6As shown, the housing 10 includes an air duct assembly 30, and the dehumidification assembly 20 includes a first part and a second part. The dehumidification assembly 20 can switch between the first state and the second state. When the dehumidification assembly 20 is in the first state, the first part is the cold part and the second part is the hot part. The air duct assembly 30 guides the airflow to be dehumidified to flow through the first part, that is, the cold part, to dehumidify the airflow to be dehumidified; after dehumidification to a certain extent, the dehumidification assembly 20 switches to the second state, the first part is the hot part and the second part is the cold part. The air duct assembly 30 guides the airflow to be dehumidified to flow through the second part, that is, the cold part to continue dehumidification. At the same time, the air duct assembly 30 also guides the external dry airflow to flow through the first part, that is, the hot part, to dry the dehumidification assembly so as to continue to dehumidify the airflow to be dehumidified. Such a cycle can achieve continuous dehumidification of the dehumidification device 100 and improve the dehumidification efficiency.

[0040] In the prior art, dehumidification devices 100 can only dehumidify intermittently, resulting in low efficiency. In this solution, the dehumidification assembly 20 has two operating states. By switching between these two operating states, the air duct assembly 30 allows the airflow to flow continuously through the cold section for dehumidification, while the dry airflow flows continuously through the hot section for drying the dehumidification assembly 20. This achieves continuous dehumidification and improves the efficiency of the dehumidification device 100.

[0041] According to some embodiments of the present invention, the dehumidification component 20 includes a semiconductor refrigeration plate 21, which includes a cold end 211 and a hot end 212, and the cold end 211 and the hot end 212 are switchable; in a first state, the first part includes the cold end 211, and the second part includes the hot end 212; in a second state, the first part includes the hot end 212, and the second part includes the cold end 211.

[0042] like Figure 3-5 As shown, the semiconductor refrigeration plate 21 can achieve switching between the cold end 211 and the hot end 212 by reversing the power supply. In the first state, the first part includes the cold end 211 and the second part includes the hot end 212. When dehumidification reaches a certain level, the power supply of the semiconductor refrigeration plate 21 is reversed to achieve the switching between the cold end 211 and the hot end 212. The first part includes the hot end 212 and the second part includes the cold end 211, ensuring that the airflow to be dehumidified flows through the cold end 211 of the semiconductor for dehumidification, and the external dry airflow flows through the hot end 212 of the semiconductor to dry the dehumidification component 20. In the related art, the adsorption dehumidification device 100 requires an additional heat source or electric heating to drive the regeneration of the dehumidification device 100. Here, the heat generated by the hot end 212 of the semiconductor refrigeration plate 21 is directly utilized, which reduces the system's dependence on additional heat sources, improves the system's energy efficiency, and simplifies the system's structural design.

[0043] According to some embodiments of the present invention, the semiconductor refrigeration plate 21 is configured to separate the cavity of the shell 10 into a first air duct 11 and a second air duct 12 , the first part is arranged in the first air duct 11 , and the second part is arranged in the second air duct 12 .

[0044] like Figure 3-4 As shown, the semiconductor refrigeration plate 21 is configured to separate the cavity of the shell 10 into a first air duct 11 and a second air duct 12. The upper part of the shell 10 is the first air duct 11, and the lower part of the shell 10 is the second air duct 12, which is used for the circulation of the air flow to be dehumidified and the external dry air flow.

[0045] According to some embodiments of the present invention, a rubber sealing ring is provided between the semiconductor refrigeration plate 21 and the housing 10 for sealing the first air duct 11 and the second air duct 12 to completely isolate the air flow to be dehumidified from the external dry air flow.

[0046] like Figure 3 As shown, in the first state, the semiconductor cold end 211 is located in the first air duct 11, and the semiconductor hot end 212 is located in the second air duct 12. The air flow to be dehumidified flows through the first air duct 11 and is dehumidified by the cold end 211 of the semiconductor; the external dry air flow flows through the second air duct 12 and is dried by the hot end 212 of the semiconductor to dry the dehumidification component 20.

[0047] like Figure 3 As shown, in the second state, the semiconductor cold end 211 is located in the second air duct 12, and the semiconductor hot end 212 is located in the first air duct 11. The airflow to be dehumidified flows through the second air duct 12 and is dehumidified by the semiconductor cold end 211. The external dry airflow flows through the first air duct 11 and is dehumidified by the semiconductor hot end 212, drying the dehumidification component 20 and the air inside the device. The airflow to be dehumidified switches between the first air duct 11 and the second air duct 12, achieving continuous dehumidification.

[0048] According to some embodiments of the present invention, the air duct assembly 30 includes a first air door 31 , and the first air door 31 is used to guide the air flow to be dehumidified to flow through the cold part.

[0049] like Figure 3-4 As shown, when the dehumidification component 20 switches between the first state and the second state, the first damper 31 is used to control the air flow to be dehumidified to flow through the cold part of the dehumidification component 20, so that the dehumidification device 100 can dehumidify the air flow to be dehumidified regardless of whether the dehumidification component 20 is in the first state or the second state.

[0050] In some optional embodiments, the first damper 31 includes a first sub-damper 311 and a second sub-damper 312, the first sub-damper 311 is located on the right side of the semiconductor refrigeration sheet 21, and the second sub-damper 312 is located on the left side of the semiconductor refrigeration sheet 21, and both are movably connected to the semiconductor refrigeration sheet 21, and the semiconductor refrigeration sheet 21, the first sub-damper 311 and the second sub-damper 312 are configured to separate the cavity of the shell 10 into a first air duct 11 and a second air duct 12. The first air duct 11 and the second air duct 12 are both straight in and straight out, and the air flow to be dehumidified and the external drying air flow both flow in a straight line in the device. Dead corners and vortices are not easily generated in the flow field, and the wind resistance, noise and ventilation are good. The lengths of the first air duct 11 and the second air duct 12 can be adjusted or angled according to changes in the actual installation position.

[0051] According to some embodiments of the present invention, the air duct assembly 30 further includes a second air door 32 , which is configured to guide the external drying air flow to flow through the hot portion.

[0052] like Figure 3-4 As shown, when the dehumidification component 20 switches between the first state and the second state, the second damper 32 is used to control the external dry air flow to flow through the hot part of the dehumidification component 20, so that the dehumidification device 100 can dry the dehumidification component regardless of whether the dehumidification component 20 is in the first state or the second state. Under the coordinated control of the first damper 31 and the second damper 32, it is ensured that the dehumidification device 100 can perform continuous dehumidification.

[0053] In some optional embodiments, the second damper 32 includes a third sub-damper 321, a fourth sub-damper 322, a fifth sub-damper 323, and a sixth sub-damper 324, wherein the third sub-damper 321 and the fourth sub-damper 322 are distributed on the left and right sides of the upper side of the shell, and the fifth sub-damper 323 and the sixth sub-damper 324 are distributed on the left and right sides of the lower side of the shell, and are all movably connected to the shell 10.

[0054] like Figure 3 As shown, when the dehumidification component 20 is in the first state, the upper side of the semiconductor refrigeration plate 21 is the cold end 211, and the lower side is the hot end 212, the first sub-air door 311 and the second sub-air door 312 are connected to the lower half of the shell 10, the third sub-air door 321 and the fourth sub-air door 322 are closed, and the fifth sub-air door 323 and the sixth sub-air door 324 are opened, so that the air flow to be dehumidified passes through the upper first air duct 11 for dehumidification, and the external dry air flow passes through the lower second air duct 12 for drying.

[0055] like Figure 4As shown, after dehumidification reaches a certain level, the dehumidification component 20 switches to the second state, and the semiconductor refrigeration plate 21 is reversed through the power supply with the upper side as the hot end 212 and the lower side as the cold end 211. The first sub-air door 311 and the second sub-air door 312 are connected to the upper half of the shell 10, the third sub-air door 321 and the fourth sub-air door 322 are opened, and the fifth sub-air door 323 and the sixth sub-air door 324 are closed, so that the air flow to be dehumidified passes through the second air duct 12 on the lower side for dehumidification, and the dry air flow passes through the first air duct 11 on the upper side for drying.

[0056] According to some embodiments of the present invention, the dehumidification component 20 includes a drying element, which is arranged in the shell 10; the drying element located in the cold part is configured to dry the airflow to be dehumidified, thereby realizing dehumidification of the airflow to be dehumidified, and the drying element located in the hot part is configured to dry the dried airflow, and the dehumidified airflow can continue to be dehumidified after drying, thereby finally realizing the continuous dehumidification function of the dehumidification device 100.

[0057] According to some embodiments of the present invention, the dehumidification component 20 also includes a heat dissipation component, which is connected to the semiconductor refrigeration plate 21 and is used to increase the heat exchange area of the semiconductor refrigeration plate 21 and improve the heat exchange efficiency; the drying element is arranged on the heat dissipation component to increase the contact area between the drying element and the air and improve the dehumidification efficiency.

[0058] According to some embodiments of the present invention, the cross-sectional shape of the heat dissipation fin 22 includes one of a positive direction, a rectangle, a circle, and an ellipse, so as to increase the heat dissipation area of the heat dissipation fin 22 .

[0059] According to some embodiments of the present invention, the heat dissipation fins 22 are provided with openings for air circulation to improve dehumidification efficiency.

[0060] According to some embodiments of the present invention, the shape of the opening includes circular, triangular, rectangular, elliptical or polygonal, as long as it allows air to circulate.

[0061] like Figure 5 As shown, according to some embodiments of the present invention, a plurality of heat dissipation fins 22 are spaced apart on both sides of the refrigeration fin, thereby increasing the heat exchange area of the hot end 212 and the cold end 211 of the refrigeration fin and improving the heat exchange efficiency.

[0062] According to some embodiments of the present invention, the drying element is a solid adsorbent 23. The solid adsorbent 23 at the cold end 211 can adsorb and dehumidify the airflow to be dehumidified, and the dry air at the hot end 212 can desorb the solid adsorbent 23. The desorbed solid dehumidifier can be used again to dehumidify the airflow to be dehumidified.

[0063] In some optional embodiments, the solid adsorbent 23 may be a material with adsorption function, such as silica gel, molecular sieve, or synthetic material.

[0064] According to some embodiments of the present invention, the drying element is coated on the outer surface of the heat dissipation component, which can increase the contact area between the drying element and the air.

[0065] In some optional embodiments, both the cold end 211 and the hot end 212 of the semiconductor cooler are equipped with heat sinks, located in the first and second air ducts 11, 12 of the dehumidification device 100, respectively. Solid adsorbent 23 is coated on the surface of the heat sinks. While the cold end 211 of the semiconductor cooler promotes the solid adsorbent 23 to absorb water vapor from the airflow to be dehumidified, the hot end 212 of the semiconductor cooler acts as a heat source, generating heat to desorb the water-laden solid adsorbent 23 and remove it with the hot air. By reversing the power supply of the semiconductor cooler, the operating modes of the two chambers can be reversed, with the cold end 211 becoming the hot end 212 and the hot end 212 becoming the cold end 211, resulting in a cyclic operation and continuous dehumidification.

[0066] In conventional solid adsorption dehumidification, after adsorbing water vapor, the solid adsorbent 23 must desorb before dehumidification can resume. This intermittent operation results in low dehumidification efficiency. In this application, while one portion of the solid adsorbent 23 is adsorbing, another portion can simultaneously desorb, creating a cyclical operation that improves dehumidification efficiency. Furthermore, solid adsorption dehumidification does not involve phase transitions in water vapor, eliminating the need to consume excess energy for latent heat exchange.

[0067] like Figure 5 As shown, in some optional embodiments, columnar fin heat sinks are connected to both ends of the semiconductor refrigeration plate 21 to increase the heat exchange area, and a solid adsorbent 23 is coated on the heat sink. The characteristics of heat exchange at both ends of the semiconductor refrigeration plate 21 when connected forwardly / reversely are utilized to achieve continuous adsorption and desorption of the solid adsorbent 23, and effectively utilize the energy of the hot end 212 of the semiconductor refrigeration plate 21 to meet the dehumidification needs of the system's airflow to be dehumidified.

[0068] According to some embodiments of the present invention, housing 10 is provided with a first air vent 111 and a second air vent 112. The air inlet for the air to be dehumidified is first air vent 111, and the air outlet for the air to be dehumidified is second air vent 112. When dehumidification assembly 20 is in either the first or second state, the air to be dehumidified enters housing 10 through first air vent 111 and exits through second air vent 112 after dehumidification.

[0069] According to some embodiments of the present invention, along the flow direction of the air flow to be dehumidified, at least part of the diameter of the first air outlet 111 gradually increases, and at least part of the diameter of the second air outlet 112 gradually decreases, in order to better connect with the inlet and outlet pipes.

[0070] According to some embodiments of the present invention, the housing 10 further defines a third air vent 121 and a fourth air vent 122. The third air vent 121 is the inlet for external dry air flow, and the fourth air vent 122 is the outlet for dry air flow. When the dehumidification assembly 20 is in either the first or second state, the dry air enters the housing 10 through the third air vent 121 and exits the dehumidification assembly 20 through the fourth air vent 122 after drying the dehumidification assembly 20.

[0071] According to some embodiments of the present invention, a gas driving device 40 is further included. The gas driving device 40 is disposed at the third air outlet 121 and / or the fourth air outlet 122 to control the flow direction of the drying airflow.

[0072] like Figure 3 、 4 As shown in Figures 6 and 7, the gas drive device 40 can be set separately at the third air outlet 121 to promote the inflow of dry airflow, and can also be set separately at the fourth air outlet 122 to promote the outflow of airflow. In addition, the gas drive device 40 can also be set at both the third air outlet 121 and the fourth air outlet 122 to promote the inflow and outflow of dry airflow, thereby improving work efficiency.

[0073] like Figure 1 、 2 As shown in Figures 6 and 7, in some optional embodiments, the housing 10 of the dehumidification device 100 is composed of five parts, namely, from right to left, a first sub-housing 15, a second sub-housing 16, a third sub-housing 17, a fourth sub-housing 18, and a fifth sub-housing 19. The sub-housings 10 are connected by welding, and each sub-housing 10 is hollow to form an air flow channel. The first sub-housing 15 is formed with a first air vent 111, which is the air inlet of the air flow to be dehumidified; the fifth sub-housing 19 is formed with a second air vent 112, which is the air outlet of the air flow to be dehumidified after drying; the third sub-housing 17 is a rectangular hollow pipe passage. The left and right ends of the first and fifth housings 10 gradually decrease in diameter, and the tapered nozzles can be adjusted to connect to the corresponding air ducts for dehumidification.

[0074] like Figure 1 、 2 As shown in Figures 6 and 7, in some optional embodiments, the dimensions of the second sub-housing 16 and the fourth sub-housing 18 in the front-to-back and top-to-bottom directions are approximately the same as those of the third sub-housing 17, forming a flow channel for external dry airflow. The second sub-housing 16 and the fourth sub-housing 18 are in communication with the interiors of the first sub-housing 15, the third sub-housing 17, and the fifth sub-housing 19. The third air vent 121, provided in the second sub-housing 16, serves as the inlet for the dry airflow; the fourth air vent 122, provided in the fourth sub-housing 18, serves as the outlet for the external dry airflow after desorption of the water-laden solid adsorbent 23.

[0075] like Figure 4-6As shown, in some optional embodiments, the semiconductor refrigeration plate 21 is located in the middle of the third sub-shell 17. The semiconductor refrigeration plate 21 and the first damper 31 together divide the cavity of the shell 10 into two upper and lower air ducts. In one of the air ducts, the cold end 211 of the semiconductor refrigeration plate 21 is used to cool the humid air and increase the adsorption and dehumidification capacity. In the other air duct, the hot end 212 of the semiconductor refrigeration plate 21 is used to heat the solid adsorbent 23 for desorption. A rubber sealing ring is provided between the semiconductor refrigeration plate 21 and the third shell 10 to prevent the air and condensed water from one side of the air duct from leaking to the other side of the air duct, thereby affecting the dehumidification effect of the dehumidification device 100. The first damper 31 is arranged at the first air inlet 111 and the second air outlet 112 of the air flow to be dehumidified to adjust the flow of the air flow to be dehumidified in the first air duct 11 or the second air duct 12.

[0076] like Figure 4 As shown, in some optional embodiments, 20 columnar heat sink fins 22 are welded to the upper and lower sides of the semiconductor refrigeration plate 21, respectively, to increase the heat exchange area of the semiconductor refrigeration plate 21. The spacing and size of each columnar heat sink fin 22 are the same, which improves the adsorption and desorption effects of the dehumidification device 100. Solid adsorbent 23 is coated on the columnar heat sink fins 22 to adsorb water vapor in the airflow to be dehumidified. The coating thickness of the solid adsorbent 23 can be adjusted according to the adhesion capacity of the material, the dehumidification requirements, and the desorption limit. The 20 columnar fins are evenly distributed in a rectangular shape of five rows and four columns. Four columns of columnar fins can be arranged in the front-to-back direction, leaving five wet air flow channels for the wet air in the airflow to be dehumidified. When the dehumidified airflow passes through, the solid adsorbent 23 coated on the columnar heat sink fins 22 begins to adsorb water vapor in the wet air.

[0077] In some optional embodiments, the number of heat dissipation fins 22 can be increased to 24, 28, etc. or reduced to 16, 12, etc., and the arrangement of 20 columnar fins in five rows and four columns can be expanded to four rows and five columns, etc.

[0078] According to some embodiments of the present invention, the gas driving device 40 is a fan, which drives the flow of the airflow.

[0079] In some optional embodiments, the fan at the third air outlet 121 is used to introduce external dry air flow into the desorption channel, that is, the channel where the hot end 212 is located, to take away the water vapor on the solid adsorbent 23 and discharge it to the outside through the fourth air outlet 122. The shape of the third air outlet 121 and the fourth air outlet 122 can be adjusted according to the installation position to facilitate the discharge of water vapor, improve the removal efficiency of water vapor, and realize the release and recycling of water vapor.

[0080] According to some embodiments of the present invention, the dehumidification device 100 also includes a humidity sensor 50, which is arranged in the air duct and is used to detect the humidity of the gas in the air duct. The dehumidification device 100 is switched to the first state or the second state according to the detection data of the humidity sensor 50.

[0081] like Figure 3-4 As shown, in some optional embodiments, the humidity sensor 50 is fixed near the inlet and outlet of the first air duct 11 and the second air duct 12 to identify the humidity of the inlet and outlet air and judge the air state to control the operation of the device.

[0082] In some optional embodiments, the semiconductor dehumidification device 100 can be formed into a first air duct 11 and a second air duct 12, with a semiconductor refrigeration plate 21 arranged between the two air ducts. When the semiconductor power supply is connected properly, the upper side is the cold end 211 and the lower side is the hot end 212. At this time, the radiator component in the first air duct 11 is cooled, and the solid adsorbent 23 coated on the radiator component adsorbs water vapor in the air flow to be dehumidified to achieve dehumidification of the humid air. The radiator component in the second air duct 12 is heated, and the solid adsorbent 23 coated on the radiator component is heated to desorb the water vapor, and the water vapor is carried away and discharged by the hot air flowing through. When the humidity sensor 50 detects that the humidity of the wet air at the inlet and outlet of the first air duct 11 is the same, the current flow direction of the semiconductor refrigeration chip 21 is changed, so that the semiconductor refrigeration chip 21 is reversed, and the direction and closed state of the first air door 31 and the second air door 32 are changed at the same time. When the dehumidified air flow enters the lower second air duct 12, the heat sink component in the upper first air duct 11 generates heat to desorb the solid adsorbent 23, and the heat sink component in the lower second air duct 12 cools to promote the solid adsorbent 23 coated thereon to absorb water vapor for dehumidification, and the cycle continues. By reversing the power supply of the semiconductor refrigerator, the functions of the cold end 211 and the hot end 212 are interchanged, thereby switching the working mode of the dehumidification device 100. The dehumidification device 100 can be continuously operated by utilizing the air duct change. The system can continuously absorb moisture and regenerate, achieving an uninterrupted dehumidification effect and avoiding the intermittent shutdown and regeneration. This is particularly important for certain environments that require continuous dehumidification.

[0083] In order to further understand the present application, the present application is described in more detail below with reference to the accompanying drawings and specific embodiments.

[0084] like Figure 3As shown, in some optional embodiments, initially, the solid adsorbents 23 in the first air duct 11 and the second air duct 12 in the cavity of the housing 10 are both in a dry state. The semiconductor refrigeration plate 21 is powered on, the upper side of the semiconductor refrigeration plate 21 is the cold end 211, and the lower side of the semiconductor refrigeration plate 21 is the hot end 212. At this time, the first air duct 11 is the adsorption side, and the second air duct 12 is the desorption side. The airflow to be dehumidified flows in from the first air port 111, the first damper 31 is opened to the lower side to prevent air from entering the lower cavity, the two small dampers on the upper side of the second damper 32 are closed, and the two small dampers on the lower side of the second damper 32 are opened. The airflow to be dehumidified flows into the upper first air duct 11 for dehumidification, wherein the water vapor is adsorbed by the solid adsorbent 23 coated on the surface of the columnar heat dissipation fins 22. The dry air after dehumidification flows out from the second air port 112, completing the dehumidification of the airflow to be dehumidified. The humidity sensor 50 detects the absolute humidity of the air at the inlet and outlet and feeds back a signal. When the absolute humidity fed back by the outlet humidity sensor 50 remains unchanged, the first damper 31 is activated to rotate.

[0085] like Figure 4 As shown, in some optional embodiments, when the absolute humidity fed back by the inlet and outlet humidity sensors 50 in the first air duct 11 remains unchanged, the semiconductor refrigeration plate 21 is reversed after receiving the signal from the humidity sensor 50. At this time, the semiconductor refrigeration plate 21 and the columnar fins in the first air duct 11 dissipate heat, the first damper 31 is opened to the upper side, the two small dampers above the second damper 32 are opened, and the two small dampers below the second damper 32 are closed. The fan is started, and the dry air is sucked in from the third air outlet 121, flows through the solid adsorbent 23 that is full of water in the upper first air duct 11, and desorbs the water vapor adsorbed on the solid adsorbent 23. The hot air after desorption is discharged from the fourth air outlet 122. At this time, the air flow to be dehumidified enters from the first air outlet 111 from the inlet, flows through the lower second air duct 12, and the water vapor in the air flow to be dehumidified is adsorbed by the dry solid adsorbent 23 in the second air duct 12. The adsorbed dry air flow is discharged from the second air outlet 112. At this time, the first air duct 11 is a desorption channel. When the humidity sensor 50 of the desorption channel detects that the absolute humidity of the inlet and outlet air remains unchanged, the fan stops running and the opening of each damper remains unchanged; the second air duct 12 is an adsorption dehumidification channel. When the humidity sensor 50 of the adsorption channel detects that the absolute humidity of the inlet and outlet air remains unchanged, Figure 2 As shown, the first air door 31 is turned to the lower side, and the first air duct 11 is reopened as an adsorption dehumidification channel. The two small air doors on the upper side of the second air door 32 are closed, and the two small air doors on the lower side of the second air door 32 are opened. The fan is started to introduce dry air flow through the solid adsorbent 23 full of water in the second air duct 12, and the adsorption dehumidification / desorption channel is switched again to achieve continuous dehumidification.

[0086] In some optional embodiments, the operating signals of the various components in the dehumidification device 100 of the present patent are mainly based on the signal of the humidity sensor 50 of the adsorption dehumidification channel. If the dehumidification sensor of the desorption channel feeds back a signal, but the humidity sensor 50 of the adsorption dehumidification channel does not feed back a signal, only the fan is stopped and the other components continue to work; if the humidity sensor 50 of the adsorption dehumidification channel has fed back a signal, but the humidity sensor 50 of the desorption channel has not fed back a signal, then all components switch their working modes, and the adsorption and desorption channels are switched.

[0087] The vehicle according to the second embodiment of the present invention includes the dehumidification device 100 according to the first embodiment of the present invention.

[0088] According to the vehicle of the embodiment of the present invention, by adopting the above-mentioned dehumidification device 100, the vehicle has a good dehumidification effect, so as to fully meet the user's usage needs.

[0089] In some optional embodiments, the dehumidification device 100 may be installed at the main air outlet of the vehicle air conditioner to meet the dehumidification requirements of the vehicle passenger compartment and improve the comfort of the vehicle passengers.

[0090] In some optional embodiments, when the dehumidifier 100 is used in a vehicle, it can be combined with fresh air dehumidification in winter to reduce the proportion of fresh air introduced, save energy, and ultimately improve the vehicle's dehumidification efficiency. For example, when using fresh air dehumidification alone in winter, if the fresh air introduction accounts for 80%, it requires 6000W of energy to meet the passenger compartment environmental comfort. When used in conjunction with the dehumidifier, the fresh air introduction accounts for 40%, consuming 4500W of energy, achieving a 25% energy saving. Furthermore, when the dehumidifier 100 is used in a vehicle, it can be combined with evaporator cooling dehumidification in summer to save energy and improve the vehicle's dehumidification efficiency. For example, to maintain a comfortable interior environment in the summer at a temperature of approximately 25°C and a relative humidity of approximately 50%, a single evaporator cooling dehumidification consumes 3286W of energy, of which 1244W is latent heat exchange, accounting for one-third of the total energy consumption. Activating the dehumidifier 100 can save 1244W of latent heat exchange energy and reduce the energy consumed by cooling the air during cooling dehumidification. During the vehicle dehumidification process, the dehumidification device 100 is selectively used in conjunction with other dehumidification methods to improve the overall dehumidification efficiency of the vehicle.

[0091] Other components and operations of the vehicle according to the embodiment of the present invention are well known to those skilled in the art and will not be described in detail here.

[0092] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0093] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A dehumidification device (100), characterized in that: include: A housing (10), the housing (10) comprising an air duct assembly (30); A dehumidification component (20), the dehumidification component (20) comprising a first portion and a second portion, the dehumidification component (20) being configured to switch between a first state and a second state; In a first state, the first part is a cold part, the second part is a hot part, and the air duct assembly (30) is used to guide the airflow to be dehumidified to flow through the first part, and to guide the external drying airflow to flow through the second part. In the second state, the first part is a hot part, the second part is a cold part, and the air duct assembly (30) is used to guide the airflow to be dehumidified to flow through the second part, and to guide the external drying airflow to flow through the first part.

2. The dehumidification device (100) according to claim 1, characterized in that: The dehumidification component (20) includes a semiconductor refrigeration plate (21), the semiconductor refrigeration plate (21) includes a cold end (211) and a hot end (212), and the cold end (211) and the hot end (212) are switchable; In a first state, the first portion includes the cold end (211), the second portion includes the hot end (212), In a second state, the first portion includes the hot end (212) and the second portion includes the cold end (211).

3. The dehumidification device (100) according to claim 2, characterized in that: The semiconductor refrigeration plate (21) is configured to separate the cavity of the shell (10) into a first air duct (11) and a second air duct (12), the first part is arranged in the first air duct (11), and the second part is arranged in the second air duct (12).

4. The dehumidification device (100) according to claim 3, characterized in that: A rubber sealing ring is provided between the semiconductor refrigeration plate (21) and the housing (10).

5. The dehumidification device (100) according to claim 1, characterized in that The air duct assembly (30) comprises a first air door (31), and the first air door (31) is used to guide the air flow to be dehumidified to flow through the cold part.

6. The dehumidification device (100) according to claim 5, characterized in that: The air duct assembly (30) further includes a second air door (32), and the second air door (32) is used to guide the external dry air flow to flow through the hot part.

7. The dehumidification device (100) according to claim 2, characterized in that: The dehumidification component (20) comprises a drying element, and the drying element is arranged in the housing (10); The drying element located in the cold portion is configured to dry the airflow to be dehumidified. The drying member located in the hot portion is configured to be dried by the drying airflow.

8. The dehumidification device (100) according to claim 7, characterized in that: The dehumidification component (20) further comprises a heat dissipation component, the heat dissipation component is connected to the semiconductor refrigeration plate (21), and the drying element is arranged on the heat dissipation component.

9. The dehumidification device (100) according to claim 8, characterized in that The heat dissipation component includes a fin heat sink.

10. The dehumidification device (100) according to claim 9, characterized in that The fin heat sink comprises a plurality of heat dissipation fins (22), and the plurality of heat dissipation fins (22) are connected to both sides of the semiconductor refrigeration plate (21).

11. The dehumidification device (100) according to claim 10, characterized in that: The cross-sectional shape of the heat dissipation fin (22) includes one of a positive direction, a rectangle, a circle, and an ellipse.

12. The dehumidification device (100) according to claim 10, characterized in that The heat dissipation ribs (22) are provided with openings.

13. The dehumidification device (100) according to claim 12, characterized in that: The shapes of the openings include circular, triangular, rectangular, elliptical or polygonal.

14. The dehumidification device (100) according to claim 10, characterized in that A plurality of heat dissipation ribs (22) are arranged at intervals on both sides of the refrigeration fin.

15. The dehumidification device (100) according to claim 8, characterized in that The heat dissipation component is welded to the semiconductor refrigeration plate (21).

16. The dehumidification device (100) according to claim 7, characterized in that The drying element is a solid adsorbent (23).

17. The dehumidification device (100) according to claim 8, characterized in that The drying element is coated on the outer surface of the heat dissipation component.

18. The dehumidification device (100) according to claim 1, characterized in that The shell (10) is provided with a first air outlet (111) and a second air outlet (112); the air inlet of the air flow to be dehumidified is the first air outlet (111), and the air outlet of the air flow to be dehumidified is the second air outlet (112).

19. The dehumidification device (100) according to claim 18, characterized in that Along the flow direction of the airflow to be dehumidified, at least a portion of the aperture of the first air outlet (111) gradually increases, and at least a portion of the aperture of the second air outlet (112) gradually decreases.

20. The dehumidification device (100) according to claim 18, characterized in that The housing (10) is further provided with a third air outlet (121) and a fourth air outlet (122); the air inlet of the drying air flow is the third air outlet (121), and the air outlet of the drying air flow is the fourth air outlet (122).

21. The dehumidification device (100) according to claim 20, characterized in that It also includes a gas driving device (40), which is arranged at the third air outlet (121) and / or the fourth air outlet (122) to control the flow direction of the drying airflow.

22. The dehumidification device (100) according to claim 21, characterized in that The gas driving device (40) is a fan.

23. The dehumidification device (100) according to claim 1, characterized in that It also includes a humidity sensor (50), which is arranged in the air duct and is used to detect the humidity of the gas in the air duct.

24. A vehicle, characterized in that: The dehumidification device (100) comprises the dehumidification device (100) according to any one of claims 1 to 23.

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