Method of manufacturing adhesive member and method of manufacturing display device using the same

Abstract

A method of manufacturing an adhesive member and a method of manufacturing a display device using the same are disclosed. The method of manufacturing an adhesive member includes: providing a preliminary resin layer including a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range; forming an intermediate resin layer by irradiating the preliminary resin layer with first ultraviolet light having a wavelength different from a wavelength in the first wavelength range; and forming the adhesive member by irradiating the intermediate resin layer with second ultraviolet light having a wavelength within the first wavelength range.

Description

Technical Field

[0001] The present disclosure generally relates to a method for manufacturing an adhesive member, and more particularly to a method for manufacturing an adhesive member and a method for manufacturing a display device using the same. Background Art

[0002] With the development of information technology, the importance of display devices as a medium connecting users and information has become increasingly prominent. For example, the use of display devices such as liquid crystal display devices, organic light emitting display devices, plasma display panel devices, and quantum dot display devices is increasing.

[0003] The display device may include a display panel and a functional component provided on the display panel. Examples of the functional component may include a touch component for detecting a user's touch on the display panel, an anti-reflection layer for reducing external light reflection, and a cover window for protecting the display panel. An optically transparent resin ("OCR") may be used as an adhesive component to attach the display panel and the functional component. The OCR may be formed by irradiating ultraviolet light to a resin composition including an oligomer, a monomer, a photopolymerization initiator, and the like. Summary of the Invention

[0004] The embodiment provides a method of manufacturing a bonding member having improved bonding strength.

[0005] The embodiment provides a method of manufacturing a display device using the method of manufacturing an adhesive member.

[0006] A method for manufacturing an adhesive member in one embodiment of the present disclosure includes: providing a preliminary resin layer containing a photopolymerization initiator, the photopolymerization initiator having a maximum absorption wavelength within a first wavelength range; forming an intermediate resin layer by irradiating the preliminary resin layer with a first ultraviolet light having a wavelength different from the wavelength within the first wavelength range; and forming an adhesive member by irradiating the intermediate resin layer with a second ultraviolet light having a wavelength within the first wavelength range.

[0007] In one embodiment, a second starting point of irradiating the second ultraviolet light may be separated from a first starting point of irradiating the first ultraviolet light by a predetermined time interval, and the predetermined time interval may be determined based on fluidity of the preliminary resin layer.

[0008] In one embodiment, in the step of irradiating the intermediate resin layer with the second ultraviolet light, the first ultraviolet light having a wavelength different from a wavelength within the first wavelength range may not be irradiated.

[0009] In one embodiment, in the step of irradiating the intermediate resin layer with the second ultraviolet light, the first ultraviolet light having the wavelength different from the wavelength within the first wavelength range may be simultaneously irradiated to the intermediate resin layer.

[0010] In one embodiment, in the step of irradiating the first ultraviolet light, the first ultraviolet light includes sub-ultraviolet light, so that sub-ultraviolet light having a wavelength smaller than the minimum wavelength in the first wavelength range and sub-ultraviolet light having a wavelength larger than the maximum wavelength in the first wavelength range can be irradiated simultaneously.

[0011] In one embodiment, the irradiating the first ultraviolet light and the second ultraviolet light may be performed by an ultraviolet light irradiation device comprising a plurality of first ultraviolet light emitting units for irradiating the first ultraviolet light and a plurality of second ultraviolet light emitting units for irradiating the second ultraviolet light.

[0012] In one embodiment, the UV irradiation device may irradiate the first UV light when the UV irradiation device is fixed on the preliminary resin layer, and may irradiate the second UV light when the UV irradiation device is fixed on the intermediate resin layer.

[0013] In one embodiment, the ultraviolet light irradiation device may irradiate the first ultraviolet light to the entire area of the preliminary resin layer, and may irradiate the second ultraviolet light to the entire area of the intermediate resin layer.

[0014] In one embodiment, the plurality of first ultraviolet emitting units may be arranged in a matrix form in a plan view. The plurality of second ultraviolet emitting units may be arranged in a matrix form in the plan view.

[0015] A method for manufacturing a display device in one embodiment of the present disclosure includes: forming a preliminary resin layer containing a photopolymerization initiator on a display panel including a substrate, a display element layer and an encapsulation layer, wherein the photopolymerization initiator has a maximum absorption wavelength within a first wavelength range; forming an intermediate resin layer by irradiating the preliminary resin layer with a first ultraviolet light having a wavelength different from the wavelength within the first wavelength range; forming a bonding member by irradiating the intermediate resin layer with a second ultraviolet light having a wavelength within the first wavelength range; and forming a functional member on the bonding member.

[0016] In one embodiment, a start point of irradiating the second ultraviolet light may be spaced apart from a start point of irradiating the first ultraviolet light by a predetermined time interval, and the predetermined time interval may be determined based on fluidity of the preliminary resin layer.

[0017] In one embodiment, in the step of irradiating the intermediate resin layer with the second ultraviolet light, the first ultraviolet light having a wavelength different from a wavelength within the first wavelength range may not be irradiated.

[0018] In one embodiment, in the step of irradiating the intermediate resin layer with the second ultraviolet light, the first ultraviolet light having the wavelength different from the wavelength within the first wavelength range may be simultaneously irradiated to the intermediate resin layer.

[0019] In one embodiment, in the step of irradiating the first ultraviolet light, the first ultraviolet light includes sub-ultraviolet light, so that sub-ultraviolet light having a wavelength smaller than the minimum wavelength in the first wavelength range and sub-ultraviolet light having a wavelength larger than the maximum wavelength in the first wavelength range can be irradiated simultaneously.

[0020] In one embodiment, the preliminary resin layer may be formed using an inkjet printing method.

[0021] In one embodiment, the functional member may include at least one of a touch member, an anti-reflection layer, and a cover window.

[0022] In one embodiment, the irradiating the first ultraviolet light and the irradiating the second ultraviolet light may be performed by an ultraviolet light irradiation device comprising a plurality of first ultraviolet light emitting units for irradiating the first ultraviolet light and a plurality of second ultraviolet light emitting units for irradiating the second ultraviolet light.

[0023] In one embodiment, the UV irradiation device may irradiate the first UV light when the UV irradiation device is fixed on the preliminary resin layer, and may irradiate the second UV light when the UV irradiation device is fixed on the intermediate resin layer.

[0024] In one embodiment, the ultraviolet light irradiation device may irradiate the first ultraviolet light to the entire area of the preliminary resin layer, and may irradiate the second ultraviolet light to the entire area of the intermediate resin layer.

[0025] In one embodiment, the plurality of first ultraviolet emitting units may be arranged in a matrix form in a plan view. The plurality of second ultraviolet emitting units may be arranged in a matrix form in the plan view.

[0026] A method for manufacturing an adhesive member in one embodiment of the present disclosure may include: providing a preliminary resin layer containing an oligomer, a monomer, and a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range; forming an intermediate resin layer by irradiating the preliminary resin layer with first ultraviolet light having a wavelength different from that within the first wavelength range; and forming the adhesive member by irradiating the intermediate resin layer with second ultraviolet light having a wavelength within the first wavelength range. In other words, the first ultraviolet light having a wavelength different from the maximum absorption wavelength of the photopolymerization initiator may be irradiated first, and the second ultraviolet light having a wavelength within the maximum absorption wavelength range of the photopolymerization initiator may be irradiated subsequently.

[0027] In this case, compared to the case where the first and second ultraviolet light are irradiated simultaneously from the beginning, the photopolymerization initiator can be decomposed relatively slowly. Since the photopolymerization initiator decomposes relatively slowly, the length of the polymer chain formed by covalently bonding the oligomer and the monomer can be relatively increased. As a result, the adhesive strength of the adhesive member containing the polymer can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0029] Figure 1 FIG. 1 is a plan view illustrating an embodiment of a display device according to the present disclosure.

[0030] Figure 2 As an example Figure 1 FIG. 5 is a diagram showing the bent shape of a display device.

[0031] Figure 3 As an example Figure 1 sectional view of a display device.

[0032] Figure 4 For the Figure 1 A cross-sectional view taken along line II'.

[0033] Figure 5 FIG. 1 is a flow chart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure.

[0034] Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 and Figure 15 As an example Figure 5 FIG. 1 is a diagram of a method of manufacturing a display device.

[0035] Figure 16 This is a diagram illustrating the strength of the adhesive force of the adhesive member according to the comparative example.

[0036] Figure 17 This is a diagram illustrating an example of the strength of the adhesive force of the adhesive member. DETAILED DESCRIPTION

[0037] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and redundant descriptions of the same components will be omitted.

[0038] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

[0039] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings herein.

[0040] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to be restrictive. As used herein, the singular forms "one" and "the" are intended to include plural forms, including "at least one", unless the content clearly indicates otherwise. "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more relevant listed items. It will be further understood that the terms "include" or "comprising" when used in this specification specify the presence of stated features, regions, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, parts and / or groups thereof.

[0041] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as illustrated in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is flipped, the element described as being on the "lower" side of the other elements will then be oriented as being on the "upper" side of the other elements. Thus, depending on the specific orientation of the figures, the exemplary term "lower" can encompass both "lower" and "upper" orientations. Similarly, if the device in one of the figures is flipped, the element described as being "below" or "beneath" the other elements will then be oriented as being "above" the other elements. Thus, the exemplary terms "below" or "beneath" can encompass both "upper" and "lower" orientations.

[0042] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). Terms such as "about" can mean within one or more standard deviations, or within, for example, ±30%, 20%, 10%, or 5% of the stated value.

[0043] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0044] Figure 1 FIG. 1 is a plan view illustrating an embodiment of a display device according to the present disclosure. Figure 2 As an example Figure 1 FIG. 5 is a diagram showing the bent shape of a display device.

[0045] In this specification, a plane may be defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. In one embodiment, for example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. A direction perpendicular to the plane (i.e., the thickness direction of the display device DD) may be a third direction DR3. In other words, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2.

[0046] refer to Figure 1 and Figure 2 In one embodiment of the present disclosure, the display device DD may include a substrate SUB, a driving chip D-IC, a plurality of pads PDD, and a circuit board FPCB.

[0047] The substrate SUB may include a display area DA and a non-display area NDA. The display area DA may be defined as an area that displays an image by generating light or adjusting the transmittance of light provided from an external light source. A plurality of pixels PX may be disposed in the display area DA. Each of the pixels PX may generate light in response to a drive signal. In one embodiment, for example, the pixels PX may be arranged in a matrix along a first direction DR1 and a second direction DR2. However, the present disclosure is not limited thereto, and the pixels PX may be arranged in various other configurations.

[0048] The non-display area NDA may be defined as an area where no image is displayed. The non-display area NDA may include a peripheral area PA, a bending area BA, and a pad area PDA.

[0049] The peripheral area PA may be disposed around the display area DA. The peripheral area PA may surround at least a portion of the display area DA. In one embodiment, for example, in a plan view, the peripheral area PA may surround the entire display area DA.

[0050] The bending area BA may extend from one side of the peripheral area PA and may bend downward. Figure 2 As illustrated in FIG, the substrate SUB may be bent in the bending area BA about a reference axis parallel to the first direction DR1. In this case, the pad area PDA may be disposed on the lower surface of the display device DD. The pad area PDA may extend from the bending area BA and may be disposed below the display area DA and / or below the peripheral area PA. When the display device DD is unfolded, the bending area BA may be disposed between the peripheral area PA and the pad area PDA.

[0051] The pad area PDA may be provided on one side of the display area DA (eg, Figure 1 The pad area PDA may be spaced apart from the display area DA in a plan view, with the bending area BA being between the display area DA and the pad area PDA. In one embodiment, for example, the pad area PDA and the display area DA may be spaced apart from each other in the second direction DR2. The pad area PDA may extend in the first direction DR1. The pad PDD may be disposed in the pad area PDA.

[0052] The driver chip D-IC may be disposed in the pad area PDA on the substrate SUB. In one embodiment, for example, the driver chip D-IC may be disposed (e.g., mounted) in the pad area PDA on the substrate SUB. However, the present disclosure is not limited thereto, and the driver chip D-IC may be disposed (e.g., mounted) on the circuit board FPCB as a chip on film ("COF") type.

[0053] The driver chip D-IC may be connected to the pad PDD via an anisotropic conductive film (ACF). The driver chip D-IC may provide a driving signal to the pixel PX. The driving signal may include various signals for driving the pixel PX, such as a driving voltage, a control signal, a data signal, and the like.

[0054] The circuit board FPCB may be disposed in the pad area PDA on the substrate SUB. The circuit board FPCB may be connected to the pads PDD via an anisotropic conductive film. In one embodiment, the circuit board FPCB may be, for example, a flexible printed circuit board.

[0055] Figure 3 As an example Figure 1 sectional view of a display device. Figure 4 For the Figure 1 A cross-sectional view taken along line II'.

[0056] refer to Figure 3 and Figure 4 A display device DD in one embodiment of the present disclosure may include a display panel DP, a first adhesive member ADL1, a touch member TSM, a second adhesive member ADL2, an anti-reflection layer ARL, a third adhesive member ADL3, a cover window CW, first to third panels PLT1, PLT2, and PLT3, a fourth adhesive member ADL4, first and second connection members CNM1 and CNM2, a driver chip D-IC, a circuit board FPCB, and a cover tape CT. The display panel DP may include a substrate SUB, a display element layer DPL, and an encapsulation layer TFE.

[0057] The substrate SUB can be bent in the bending area BA about a reference axis parallel to the first direction DR1. The substrate SUB can include a transparent material or an opaque material. The substrate SUB can include or be composed of a transparent resin substrate. A polyimide substrate can be an embodiment of a transparent resin substrate. In this case, the polyimide substrate can include a first organic layer, a first isolation layer, a second organic layer, etc. In an alternative embodiment, the substrate SUB can include a quartz substrate (e.g., a synthetic quartz substrate, a fluorine-doped quartz substrate), a calcium fluoride substrate, a soda-lime glass substrate, a non-alkali glass substrate, etc. These can be used alone or in any combination.

[0058] The display element layer DPL may be provided on the substrate SUB. Figure 4 As illustrated in FIG, the display element layer DPL may include a thin film transistor TFT, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, a light-emitting element LD, and a pixel defining layer PDL. The thin film transistor TFT may include an active pattern ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light-emitting element LD may include a pixel electrode PE, a light-emitting layer EML, and a common electrode CE.

[0059] The active pattern ACT may be disposed on the substrate SUB. The active pattern ACT may include an oxide semiconductor, a silicon semiconductor, an organic semiconductor, or the like. In one embodiment, the oxide semiconductor may include, for example, indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), zinc (Zn), or the like. These may be used alone or in any combination. The silicon semiconductor may include amorphous silicon, polycrystalline silicon, or the like. The active pattern ACT may include a source region, a drain region, and a channel region between the source and drain regions.

[0060] The gate insulating layer GI may be provided on the active pattern ACT and the substrate SUB. In one embodiment, for example, the gate insulating layer GI may cover the active pattern ACT on the substrate SUB and may be provided along the contour of the active pattern ACT with a substantially uniform thickness. The gate insulating layer GI may include an inorganic insulating material. In one embodiment, the inorganic insulating material that may be used for the gate insulating layer GI may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These can be used alone or in any combination with each other.

[0061] The gate electrode GE may be disposed on the gate insulating layer GI. The gate electrode GE may overlap with the channel region of the active pattern ACT. The gate electrode GE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. In embodiments, materials that can be used for the gate electrode GE may include silver (Ag), an alloy containing silver, molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (“ITO”), indium zinc oxide (“IZO”), or the like. These materials may be used alone or in any combination.

[0062] The interlayer insulating layer ILD may be disposed on the gate electrode GE and the gate insulating layer GI. In one embodiment, for example, the interlayer insulating layer ILD may cover the gate electrode GE on the gate insulating layer GI and may be disposed along the contour of the gate electrode GE with a substantially uniform thickness. The interlayer insulating layer ILD may include an inorganic insulating material. In one embodiment, the inorganic insulating material that may be used for the interlayer insulating layer ILD may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These can be used alone or in any combination with each other.

[0063] The source electrode SE and the drain electrode DE may be disposed on the interlayer insulating layer ILD. The source electrode SE may be connected to the source region of the active pattern ACT through a contact hole defined through the gate insulating layer GI and the interlayer insulating layer ILD. The drain electrode DE may be connected to the drain region of the active pattern ACT through a contact hole defined through the gate insulating layer GI and the interlayer insulating layer ILD. Each of the source electrode SE and the drain electrode DE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in any combination.

[0064] Accordingly, a thin film transistor TFT including the active pattern ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE may be formed.

[0065] The via insulating layer VIA may be disposed on the interlayer insulating layer ILD. In one embodiment, for example, the via insulating layer VIA may be disposed on the interlayer insulating layer ILD with a relatively thick thickness to adequately cover the source electrode SE and the drain electrode DE. The via insulating layer VIA may include an organic insulating material. In an embodiment, the organic insulating material that can be used for the via insulating layer VIA may include photoresist, polyacrylic resin, polyimide resin, polyamide resin, siloxane resin, acrylic resin, epoxy resin, etc. These may be used alone or in any combination.

[0066] The pixel electrode PE may be disposed on the through-hole insulating layer VIA. The pixel electrode PE may be connected to the drain electrode DE through a contact hole defined through the through-hole insulating layer VIA. As a result, the pixel electrode PE may be electrically connected to the thin film transistor TFT. The pixel electrode PE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These materials may be used alone or in any combination. In one embodiment, the pixel electrode PE may function as, for example, an anode electrode.

[0067] The pixel defining layer (PDL) may be disposed on the through-hole insulating layer (VIA) and the pixel electrode (PE). The pixel defining layer (PDL) may cover the edge of the pixel electrode (PE) and may expose the upper surface of the pixel electrode (PE). The pixel defining layer (PDL) may include an organic insulating material. In an embodiment, the organic insulating material that can be used for the pixel defining layer (PDL) may include a photoresist, a polyacrylic resin, a polyimide resin, a polyamide resin, a siloxane resin, an acrylic resin, an epoxy resin, or the like. These may be used alone or in any combination.

[0068] The light-emitting layer (EML) may be disposed on the pixel electrode PE. Specifically, the light-emitting layer (EML) may be disposed on the upper surface of the pixel electrode PE exposed by the pixel-defining layer (PDL). The light-emitting layer (EML) may emit light having a predetermined color (e.g., red, green, and / or blue). In one embodiment, the light-emitting layer (EML) may include one or both of an organic light-emitting material and quantum dots.

[0069] In one embodiment, for example, the light emitting layer EML may have a single-layer structure including one light emitting layer. In an alternative embodiment, the light emitting layer EML may have a tandem structure in which a plurality of light emitting layers are stacked.

[0070] The common electrode CE may be disposed on the pixel defining layer (PDL) and the light-emitting layer (EML). The common electrode CE may cover the pixel defining layer (PDL) and the light-emitting layer (EML) and may be disposed with a substantially uniform thickness along the contours of the pixel defining layer (PDL) and the light-emitting layer (EML). In one embodiment, the common electrode CE may comprise, for example, a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These materials may be used alone or in any combination. In one embodiment, the common electrode CE may function as, for example, a cathode electrode.

[0071] Accordingly, a light emitting element LD including the pixel electrode PE, the light emitting layer EML, and the common electrode CE may be formed.

[0072] The encapsulation layer TFE may be provided on the common electrode CE. The encapsulation layer TFE may prevent impurities, moisture, etc. from penetrating into the light emitting element LD from the outside. The encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Specifically, the encapsulation layer TFE may have a structure in which the inorganic encapsulation layer and the organic encapsulation layer are alternately stacked. In one embodiment, the inorganic encapsulation layer may include, for example, silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These may be used alone or in any combination with one another. In one embodiment, for example, the organic encapsulation layer may include a curable polymer such as polyacrylate.

[0073] Although the display device DD of the present disclosure is described by limiting the organic light-emitting display device, the configuration of the present disclosure is not limited thereto. In other embodiments, the display device DD may include a liquid crystal display ("LCD") device, a field emission display ("FED") device, a plasma display panel ("PDP") device, an electrophoretic image display ("EPD") device, an inorganic light-emitting display device, or a quantum dot display device.

[0074] like Figure 3As illustrated in FIG, the touch member TSM may be disposed on the display panel DP. The touch member TSM may overlap a portion of the peripheral area PA and the display area DA. The touch member TSM may be attached to the upper surface of the display panel DP via a first adhesive member ADL1. In an alternative embodiment, the touch member TSM may be disposed directly on the display panel DP. In other words, the touch member TSM may be disposed directly on the display panel DP without an adhesive member.

[0075] The touch member TSM can detect a user's touch. In one embodiment, for example, the touch member TSM can obtain coordinate information based on an external input such as a user's touch. The touch member TSM can detect the external input using a mutual capacitance method and / or a self-capacitance method.

[0076] The first adhesive member ADL1 may be disposed between the encapsulation layer TFE and the touch member TSM. The first adhesive member ADL1 may overlap a portion of the peripheral area PA and the display area DA. The first adhesive member ADL1 may attach the encapsulation layer TFE and the touch member TSM.

[0077] An anti-reflection layer (ARL) may be disposed in the display area DA on the touch member TSM. The anti-reflection layer (ARL) may be attached to the upper surface of the touch member TSM via a second adhesive member (ADL2). The anti-reflection layer (ARL) may reduce external light reflection from the display device DD. The anti-reflection layer (ARL) may include a polarizer and / or a phase retarder. In an alternative embodiment, the anti-reflection layer (ARL) may include color filters and a black matrix disposed between the color filters. The color filters may be arranged to take into account the emission colors of the light-emitting elements LD included in the display element layer (DPL).

[0078] The second adhesive member ADL2 may be disposed between the touch member TSM and the anti-reflection layer ARL. The second adhesive member ADL2 may overlap the display area DA. The second adhesive member ADL2 may attach the touch member TSM and the anti-reflection layer ARL.

[0079] A cover window CW may be disposed on the anti-reflection layer ARL. The cover window CW may be attached to the upper surface of the anti-reflection layer ARL via a third adhesive member ADL3. The cover window CW may cover and protect the display panel DP. The cover window CW may include a transparent material. In one embodiment, the cover window CW may include, for example, glass or plastic.

[0080] The third adhesive member ADL3 may be disposed between the anti-reflection layer ARL and the cover window CW. The third adhesive member ADL3 may overlap the display area DA. The third adhesive member ADL3 may attach the anti-reflection layer ARL and the cover window CW.

[0081] Each of the first, second, and third adhesive members ADL1, ADL2, and ADL3 may include a pressure-sensitive adhesive ("PSA") film, an optically clear adhesive ("OCA") film, or an optically clear resin ("OCR"). In one embodiment, each of the first, second, and third adhesive members ADL1, ADL2, and ADL3 may include an optically clear resin.

[0082] The first panel PLT1 may be disposed under the substrate SUB. The first panel PLT1 may supplement the rigidity of the substrate SUB. The first panel PLT1 may include an organic material. In an embodiment, the organic material that can be used for the first panel PLT1 may include polyethylene terephthalate ("PET"), polyimide ("PI"), polyethylene naphthalate ("PEN"), etc. However, the present disclosure is not limited thereto.

[0083] The second panel PLT2 may be disposed below the first panel PLT1. The second panel PLT2 may be attached to the lower surface of the first panel PLT1 via a fourth adhesive member ADL4. The second panel PLT2 may protect the substrate SUB from external impact. In one embodiment, the second panel PLT2 may include, for example, a foam tape or a foam pad.

[0084] The fourth adhesive member ADL4 may be disposed between the first panel PLT1 and the second panel PLT2. The fourth adhesive member ADL4 may overlap a portion of the peripheral area PA and the display area DA. The fourth adhesive member ADL4 may attach the first panel PLT1 and the second panel PLT2. In one embodiment, the fourth adhesive member ADL4 may include, for example, a pressure-sensitive adhesive film, an optically clear adhesive film, or an optically clear resin. In one embodiment, the fourth adhesive member ADL4 may include a pressure-sensitive adhesive film.

[0085] The third plate PLT3 may be disposed below the substrate SUB in the pad area PDA. The third plate PLT3 may supplement the rigidity of the substrate SUB. The third plate PLT3 may include an organic material. In an embodiment, the organic material that can be used for the third plate PLT3 may include polyethylene terephthalate ("PET"), polyimide ("PI"), polyethylene naphthalate ("PEN"), etc. However, the present disclosure is not limited thereto.

[0086] The first connection member CNM1 may be disposed between the second board PLT2 and the circuit board FPCB. The first connection member CNM1 may directly contact the second board PLT2 and the circuit board FPCB and may fix the circuit board FPCB.

[0087] The second connection member CNM2 may be disposed between the second and third panels PLT2 and PLT3. The second connection member CNM2 may directly contact the second and third panels PLT2 and PLT3 and may maintain the substrate SUB in a bent state.

[0088] The driving chip D-IC may be provided in the pad area PDA on the substrate SUB. The driving chip D-IC may be connected to the pads (PDD, see Figure 1 ).

[0089] The circuit board FPCB may be disposed in the pad area PDA on the substrate SUB and may be connected to the pads through an anisotropic conductive film.

[0090] A cover tape CT may be disposed in the pad area PDA on the substrate SUB. The cover tape CT may cover the circuit board FPCB and the driver chip D-IC. The cover tape CT may protect the driver chip D-IC from external impacts. Furthermore, the cover tape CT may shield electromagnetic interference noise generated by the circuit board FPCB. In one embodiment, the cover tape CT may comprise, for example, copper (Cu) or aluminum (Al).

[0091] Figure 5 FIG. 1 is a flow chart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure. Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 and Figure 15 As an example Figure 5 Hereinafter, the method of manufacturing a display device will be omitted. Figure 3 The description of the method of connecting the first to third boards PLT1, PLT2 and PLT3, the first connection member CNM1 and the second connection member CNM2 will be omitted. Figure 3 Description of the driver chip D-IC, circuit board FPCB and covering method with CT.

[0092] refer to Figure 3 and Figure 5, a method MM of manufacturing a display device in an embodiment of the present disclosure may include: providing a display panel DP (S100); forming a preliminary resin layer including a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range on the display panel DP (S200); forming an intermediate resin layer by irradiating the preliminary resin layer with a first ultraviolet light having a wavelength different from the wavelength within the first wavelength range (S300); forming a first adhesive member by irradiating the intermediate resin layer with a second ultraviolet light having a wavelength within the first wavelength range (S400); and forming a touch member TSM on the first adhesive member (S500).

[0093] refer to Figure 6 , a display panel DP ( S100 ) may be provided.

[0094] The display panel DP may include a substrate SUB, a display element layer DPL, and an encapsulation layer TFE. The display element layer DPL may be disposed on the substrate SUB. The display element layer DPL may include Figure 4 The thin film transistor TFT, gate insulating layer GI, interlayer insulating layer ILD, through hole insulating layer VIA, light emitting element LD and pixel defining layer PDL are shown in FIG. The encapsulation layer TFE may be provided on the display element layer DPL. The encapsulation layer TFE may cover the display element layer DPL.

[0095] refer to Figure 7 and Figure 8 , a preliminary resin layer PRE1 including a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range may be formed on the display panel DP ( S200 ).

[0096] A preliminary resin layer PRE1 may be formed on the display panel DP. Specifically, the preliminary resin layer PRE1 may be formed on the encapsulation layer TFE. In one embodiment, the preliminary resin layer PRE1 may be formed using an inkjet printing method. Specifically, the preliminary resin layer PRE1 may be applied to the resin area REA on the encapsulation layer TFE by inkjet printing. The resin area REA may be defined as a region where the preliminary resin layer PRE1 is cured to form a first adhesive member (ADL1, see Figure 13 ) area.

[0097] The preliminary resin layer PRE1 may include oligomers, monomers, a photopolymerization initiator, and a solvent. When the preliminary resin layer PRE1 is irradiated with ultraviolet light, the photopolymerization initiator may initiate a polymerization reaction between the oligomers and the monomers. The photopolymerization initiator may include at least one of a free radical initiator and a cationic initiator.

[0098] In one embodiment, free radical initiators may include, for example, oxime ester initiators, acetophenone initiators, acylphosphine oxide initiators, and phosphinate initiators. Acetophenone initiators may include 2-methyl-1-[(4-methylthio)phenyl]-2-(4-morpholino)-1-propanol, 2-benzyl-2-(dimethylamino)-4-morpholinobutyrophenone, and 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl)butan-1-one. Acylphosphine oxide initiators may include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis-2,4,6-trimethylbenzoylphenylphosphine oxide, and bis-2,4,4-trimethylbenzylphosphine oxide. Phosphinate initiators may include ethyl-(2,4,6-trimethylbenzoyl)phenylphosphinate. These may be used alone or in any combination.

[0099] In one embodiment, the cationic initiator may include, for example, arylsulfonium hexafluoroantimony salt, aryliodine hexafluoroantimony salt (e.g., diphenyliodine hexafluoroantimony salt), arylsulfonium hexafluorophosphate, diaryliodine hexafluorophosphate (e.g., diphenyliodine hexafluorophosphate), etc. These may be used alone or in any combination.

[0100] The photopolymerization initiator may have a maximum absorption wavelength within a first wavelength range. Here, the maximum absorption wavelength may refer to a wavelength having a maximum light absorption value within the light absorption spectrum of the photopolymerization initiator. In one embodiment, the first wavelength range may be, for example, from about 360 nanometers to about 370 nanometers. However, the present disclosure is not limited thereto, and the maximum absorption wavelength may have different wavelength ranges depending on the type of photopolymerization initiator.

[0101] In one embodiment, the solvent may include, for example, a ketone solvent or an ether solvent. Ketone solvents may include methyl ethyl ketone, acetophenone, cyclopentanone, ethyl isopropyl ketone, 2-hexanone, isophorone, mesityl oxide, methyl isobutyl ketone, 3-methyl-2-pentanone, 2-pentanone, 3-pentanone, etc. Ether solvents may include cyclopentyl methyl ether ("CPME"), diethylene glycol diethyl ether, dimethoxymethane, methyl tert-butyl ether, 2-(2-methoxyethoxy)ethanol, propylene glycol ether, etc. These may be used alone or in any combination.

[0102] refer to Figure 9 、 Figure 10 and Figure 11 , the intermediate resin layer PRE2 may be formed by irradiating the preliminary resin layer PRE1 with first ultraviolet light L1 having a wavelength different from that within the first wavelength range ( S300 ).

[0103] like Figure 9As illustrated in FIG, an ultraviolet irradiation apparatus LPA may be provided to irradiate the preliminary resin layer PRE1 with ultraviolet light. The ultraviolet irradiation apparatus LPA may include an emission circuit board LPCB and a plurality of ultraviolet emitting units LP disposed (eg, mounted) on the emission circuit board LPCB.

[0104] The emission circuit board LPCB can provide power to drive the ultraviolet emission unit LP. In one embodiment, the emission circuit board LPCB can be, for example, a printed circuit board.

[0105] Each of the ultraviolet emitting units LP may include an active layer, an n-type semiconductor layer, and a p-type semiconductor layer, and may emit ultraviolet light of a certain wavelength (e.g., a predetermined wavelength) depending on the composition of the active layer. That is, each of the ultraviolet emitting units LP may be configured to generate ultraviolet light of a desired wavelength by adjusting the composition of the active layer. The ultraviolet emitting units LP may include a plurality of first ultraviolet emitting units LP1 and a plurality of second ultraviolet emitting units LP2.

[0106] The first ultraviolet emitting units LP1 may be repeatedly arranged along the first direction DR1 and the second direction DR2. In one embodiment, for example, the first ultraviolet emitting units LP1 may be arranged in a matrix in a plan view. The first ultraviolet emitting units LP1 may irradiate the preliminary resin layer PRE1 with first ultraviolet light L1 having a wavelength different from that within the first wavelength range. Each of the first ultraviolet emitting units LP1 may include a first sub-emitting unit SLP1, a second sub-emitting unit SLP2, and a third sub-emitting unit SLP3.

[0107] The first sub-emission unit SLP1, the second sub-emission unit SLP2, and the third sub-emission unit SLP3 can respectively emit ultraviolet light of different wavelengths (also referred to as sub-ultraviolet light of the first ultraviolet light L1). The first sub-emission unit SLP1 can irradiate ultraviolet light having a wavelength smaller than the minimum wavelength in the first wavelength range (also referred to as sub-ultraviolet light of the first ultraviolet light L1). Each of the second sub-emission unit SLP2 and the third sub-emission unit SLP3 can irradiate ultraviolet light having a wavelength larger than the maximum wavelength in the first wavelength range (also referred to as sub-ultraviolet light of the first ultraviolet light L1). In one embodiment, for example, when the first wavelength range is approximately 360 nanometers to approximately 370 nanometers, the first sub-emission unit SLP1 can emit ultraviolet light having a wavelength of approximately 310 nanometers, the second sub-emission unit SLP2 can emit ultraviolet light having a wavelength of approximately 385 nanometers, and the third sub-emission unit SLP3 can emit ultraviolet light having a wavelength of approximately 405 nanometers.

[0108] The second ultraviolet emitting units LP2 may be repeatedly arranged along the first direction DR1 and the second direction DR2. In one embodiment, for example, the second ultraviolet emitting units LP2 may be arranged in a matrix form in a plan view. The second ultraviolet emitting units LP2 may irradiate the second ultraviolet light (L2, see Figure 12 In one embodiment, for example, when the first wavelength range is approximately 360 nanometers to approximately 370 nanometers, the second ultraviolet emitting unit LP2 may emit ultraviolet light having a wavelength of approximately 365 nanometers.

[0109] In one embodiment, an ultraviolet emission group LPG including a first sub-emission unit SLP1, a second sub-emission unit SLP2, a third sub-emission unit SLP3, and a second ultraviolet emission unit LP2 may be defined. The ultraviolet emission group LPG may be arranged in a matrix form along a first direction DR1 and a second direction DR2. Within one ultraviolet emission group LPG, the first sub-emission unit SLP1, the second sub-emission unit SLP2, the third sub-emission unit SLP3, and the second ultraviolet emission unit LP2 may be spaced apart from each other. However, the present disclosure is not limited thereto, and within one ultraviolet emission group LPG, the first sub-emission unit SLP1, the second sub-emission unit SLP2, the third sub-emission unit SLP3, and the second ultraviolet emission unit LP2 may be in contact with each other.

[0110] like Figure 10 As illustrated in FIG, the ultraviolet irradiation apparatus LPA may irradiate the first ultraviolet light L1 while being fixed on the preliminary resin layer PRE1. In other words, when irradiating the first ultraviolet light L1, the relative position between the ultraviolet irradiation apparatus LPA and the preliminary resin layer PRE1 may be fixed.

[0111] The ultraviolet irradiation apparatus LPA may irradiate the first ultraviolet light L1 to the entire area of the preliminary resin layer PRE1. That is, the first ultraviolet emitting units LP1 may be spaced apart from each other by a predetermined distance so that the first ultraviolet light L1 may irradiate the entire area of the preliminary resin layer PRE1.

[0112] The first ultraviolet emitting unit LP1 may irradiate the preliminary resin layer PRE1 with first ultraviolet light L1 having a wavelength different from that within the first wavelength range. Specifically, the first sub-emitting unit SLP1 may irradiate the preliminary resin layer PRE1 with ultraviolet light having a wavelength of approximately 310 nanometers, which is smaller than the minimum wavelength within the first wavelength range. The second sub-emitting unit SLP2 may irradiate the preliminary resin layer PRE1 with ultraviolet light having a wavelength of approximately 385 nanometers, which is larger than the maximum wavelength within the first wavelength range. The third sub-emitting unit SLP3 may irradiate the preliminary resin layer PRE1 with ultraviolet light having a wavelength of approximately 405 nanometers, which is larger than the maximum wavelength within the first wavelength range. The first to third sub-emitting units SLP1, SLP2, and SLP3 may simultaneously irradiate the preliminary resin layer PRE1 with ultraviolet light. However, the present disclosure is not limited thereto, and various ultraviolet lights having wavelengths different from those within the first wavelength range may be irradiated onto the preliminary resin layer PRE1. At this time, the second ultraviolet emitting unit LP2 may not irradiate the preliminary resin layer PRE1 with the second ultraviolet light.

[0113] like Figure 11 As illustrated in FIG, when the preliminary resin layer PRE1 is irradiated with the first ultraviolet light L1, a polymerization reaction between the oligomers and monomers may proceed as the photopolymerization initiator decomposes. Accordingly, an intermediate resin layer PRE2 may be formed. Here, the intermediate resin layer PRE2 may contain a photopolymerization initiator that has not yet initiated a polymerization reaction. In other words, the intermediate resin layer PRE2 may contain a photopolymerization initiator that has not yet decomposed. Accordingly, the intermediate resin layer PRE2 may be defined as a resin composition in which a polymerization reaction between the oligomers and monomers can proceed further in subsequent processes.

[0114] refer to Figure 12 、 Figure 13 and Figure 14 , the first adhesive member ADL1 may be formed by irradiating the intermediate resin layer PRE2 with the second ultraviolet light L2 having a wavelength within the first wavelength range ( S400 ).

[0115] like Figure 12 As illustrated in FIG, when the ultraviolet irradiation apparatus LPA is fixed on the intermediate resin layer PRE2, the ultraviolet irradiation apparatus LPA can irradiate the second ultraviolet light L2. In other words, when irradiating the second ultraviolet light L2, the relative position between the ultraviolet irradiation apparatus LPA and the intermediate resin layer PRE2 can be fixed.

[0116] The ultraviolet irradiation apparatus LPA may irradiate the second ultraviolet light L2 to the entire area of the intermediate resin layer PRE2. That is, the second ultraviolet emitting units LP2 may be spaced apart from each other by a predetermined distance so that the second ultraviolet light L2 may irradiate the entire area of the intermediate resin layer PRE2.

[0117] The second ultraviolet emitting unit LP2 may irradiate the intermediate resin layer PRE2 with the second ultraviolet light L2 having a wavelength within the first wavelength range. Specifically, the second ultraviolet emitting unit LP2 may irradiate the intermediate resin layer PRE2 with the second ultraviolet light L2 having a wavelength of approximately 365 nanometers within the first wavelength range. However, the present disclosure is not limited thereto, and various ultraviolet lights having wavelengths within the first wavelength range may be irradiated onto the intermediate resin layer PRE2.

[0118] like Figure 13 and Figure 14 As illustrated in FIG, when the intermediate resin layer PRE2 is irradiated with the second ultraviolet light L2, the polymerization reaction between the oligomer and the monomer can be completed as the photopolymerization initiator contained in the intermediate resin layer PRE2 is completely decomposed. Accordingly, a first bonding member ADL1 including a polymer in which the oligomer and the monomer are covalently bonded can be formed. The first bonding member ADL1 can be formed throughout the resin area REA on the encapsulation layer TFE. In other words, the first bonding member ADL1 formed by irradiating the preliminary resin layer PRE1 and the intermediate resin layer PRE2 with ultraviolet light can be an optically transparent resin. The first bonding member ADL1 can have double-sided adhesive properties.

[0119] In one embodiment of the present disclosure, a method for manufacturing a bonding member (CM, see Figure 5 ) may include forming an intermediate resin layer PRE2 by irradiating the preliminary resin layer PRE1 with first ultraviolet light L1 having a wavelength different from the wavelength within the first wavelength range (S300), and forming a first adhesive member ADL1 by irradiating the intermediate resin layer PRE2 with second ultraviolet light L2 having a wavelength within the first wavelength range (S400). In one embodiment, the method of manufacturing an adhesive member may include providing the preliminary resin layer PRE1 including a photopolymerization initiator having a maximum absorption wavelength within the first wavelength range.

[0120] In other words, the first ultraviolet light L1 having a wavelength different from the maximum absorption wavelength of the photopolymerization initiator may be irradiated first, and the second ultraviolet light L2 having a wavelength within the maximum absorption wavelength range of the photopolymerization initiator may be irradiated subsequently. In this case, the photopolymerization initiator may decompose relatively slowly compared to the case where the first ultraviolet light L1 and the second ultraviolet light L2 are irradiated simultaneously from the beginning. Since the photopolymerization initiator decomposes relatively slowly, the polymerization reaction between the oligomer and the monomer may be completed relatively slowly. Accordingly, the length of the polymer chain formed by covalently bonding the oligomer and the monomer may be relatively increased. Due to the relatively increased length of the polymer chain, the bonding strength of the first bonding member ADL1 comprising the polymer may be improved.

[0121] In one embodiment, the starting point of irradiating the second ultraviolet light L2 (also referred to as the second starting point) may be separated from the starting point of irradiating the first ultraviolet light L1 (also referred to as the first starting point) by a predetermined time interval, and the predetermined time interval may be determined based on the fluidity of the preliminary resin layer PRE1. When the starting point of irradiating the second ultraviolet light L2 is set earlier than an appropriate time, the length of the polymer chain formed by the covalent bonding of the oligomer and the monomer may be relatively reduced. When the starting point of irradiating the second ultraviolet light L2 is set later than an appropriate time, the fluid preliminary resin layer PRE1 may flow outside the display panel DP before curing of the preliminary resin layer PRE1.

[0122] In one embodiment, if Figure 12 As illustrated in FIG, when the second ultraviolet light L2 is irradiated to the intermediate resin layer PRE2, the first ultraviolet light L1 having a wavelength different from that within the first wavelength range may not be irradiated. In other words, when the second ultraviolet emitting unit LP2 irradiates the second ultraviolet light L2 to the intermediate resin layer PRE2, the first ultraviolet emitting unit LP1 may not irradiate the first ultraviolet light L1.

[0123] In another embodiment, when the second ultraviolet light L2 is irradiated onto the intermediate resin layer PRE2, the first ultraviolet light L1 having a wavelength different from that within the first wavelength range may be simultaneously irradiated onto the intermediate resin layer PRE2. In other words, when the second ultraviolet emitting unit LP2 irradiates the second ultraviolet light L2 onto the intermediate resin layer PRE2, the first ultraviolet emitting unit LP1 may also irradiate the first ultraviolet light L1 onto the intermediate resin layer PRE2.

[0124] refer to Figure 15 , a touch member TSM may be formed on the first adhesive member ADL1 (S500). The touch member TSM may cover the entire first adhesive member ADL1. The touch member TSM may be attached to the upper surface of the display panel DP via the first adhesive member ADL1. Specifically, the touch member TSM may be attached to the upper surface of the encapsulation layer TFE via the first adhesive member ADL1. In one embodiment, the touch member TSM may also be referred to as, for example, a first functional member.

[0125] The second adhesive member ADL2 may be formed on the touch member TSM. The second adhesive member ADL2 may include the same material as the first adhesive member ADL1 or be composed of the same material as the first adhesive member ADL1 through the same process as the first adhesive member ADL1. In other words, the second adhesive member ADL2 may be formed by the following steps: forming a preliminary resin layer PRE1 including a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range on the touch member TSM; irradiating the preliminary resin layer PRE1 with first ultraviolet light L1 having a wavelength different from that within the first wavelength range (S300); and irradiating the intermediate resin layer PRE2 with second ultraviolet light L2 having a wavelength within the first wavelength range (S400). The second adhesive member ADL2 may be an optically transparent resin. The second adhesive member ADL2 may have double-sided adhesive properties.

[0126] An anti-reflection layer (ARL) may be formed on the second adhesive member (ADL2). The anti-reflection layer (ARL) may cover the entire second adhesive member (ADL2). The anti-reflection layer (ARL) may be attached to the upper surface of the touch member (TSM) via the second adhesive member (ADL2). In one embodiment, the anti-reflection layer (ARL) may also be referred to as, for example, a second functional member.

[0127] The third adhesive member ADL3 may be formed on the anti-reflection layer ARL. The third adhesive member ADL3 may be formed by the same process as the first and second adhesive members ADL1 and ADL2, or may be made of the same material as the first and second adhesive members ADL1 and ADL2. The third adhesive member ADL3 may be an optically transparent resin. The third adhesive member ADL3 may have double-sided adhesive properties.

[0128] A cover window CW may be formed on the third adhesive member ADL3. The cover window CW may partially overlap the third adhesive member ADL3. The cover window CW may be attached to the upper surface of the anti-reflection layer ARL via the third adhesive member ADL3. In one embodiment, the cover window CW may also be referred to as a third functional member.

[0129] Figure 16 This is a diagram illustrating the strength of the adhesive force of the adhesive member according to the comparative example. Figure 17 The figure is an example of the strength of the adhesive force of the adhesive member. Figure 13 、 Figure 16 and Figure 17 The effects of the present disclosure are described.

[0130] The strength of the adhesive force measured in grams-force per 25 millimeters (gf / 25mm) was measured in the adhesive members satisfying the comparative examples and embodiments. Each of the adhesive members satisfying the comparative examples and embodiments was formed by irradiating a preliminary resin layer containing ethyl 2,4,6-trimethylbenzoylphenylphosphonate as a photopolymerization initiator. ethyl 2,4,6-trimethylbenzoylphenylphosphonate as a photopolymerization initiator has a maximum absorption wavelength of about 360 nanometers to about 370 nanometers. The width (e.g., the length in the first direction DR1) of each of the adhesive members satisfying the comparative examples and embodiments was about 25 millimeters. The thickness (e.g., the length in the third direction DR3) of each of the adhesive members satisfying the comparative examples and embodiments was about 50 microns.

[0131] The bonding member (e.g., Figure 13 The first bonding member ADL1) is formed by the following steps: irradiating a preliminary resin layer containing ethyl 2,4,6-trimethylbenzoylphenylphosphonate with a first ultraviolet light having a wavelength different from the maximum absorption wavelength for the first time, and irradiating the preliminary resin layer with a second ultraviolet light having a wavelength within the maximum absorption wavelength range for a second time. Specifically, ultraviolet light having a wavelength of about 310 nanometers, about 385 nanometers, and about 405 nanometers is irradiated to the preliminary resin layer for about 8 seconds for the first time, and ultraviolet light having a wavelength of about 365 nanometers is irradiated to the preliminary resin layer for about 8 seconds for the second time to form a bonding member that meets the embodiment. When the preliminary resin layer is irradiated with ultraviolet light having a wavelength of about 365 nanometers for about 8 seconds for the second time, ultraviolet light having wavelengths of about 310 nanometers, about 385 nanometers, and about 405 nanometers is not irradiated.

[0132] A bonding member satisfying the comparative example was formed by simultaneously irradiating a preliminary resin layer containing ethyl 2,4,6-trimethylbenzoylphenylphosphonate with a first ultraviolet light having a wavelength different from the maximum absorption wavelength and a second ultraviolet light having a wavelength within the maximum absorption wavelength range. Specifically, ultraviolet light having wavelengths of approximately 310 nanometers, approximately 365 nanometers, approximately 385 nanometers, and approximately 405 nanometers was simultaneously irradiated onto the preliminary resin layer for approximately 8 seconds to form the bonding member satisfying the comparative example.

[0133] Results, such as Figure 16 As illustrated in FIG, the strength of the adhesive force of the adhesive member satisfying the comparative example was measured to have a value of about 461.57 gf / 25 mm. Figure 17 As shown in FIG, the adhesive strength of the adhesive member satisfying the embodiment was measured to have a value of about 570.39 gf / 25 mm. From these results, it can be seen that the adhesive strength of the adhesive member satisfying the embodiment is improved by about 23.58% compared to the adhesive strength of the adhesive member satisfying the comparative example.

[0134] The present disclosure can be applied to various display devices. In one embodiment, the present disclosure is applicable to various display devices, such as display devices for vehicles, ships, and aircraft, portable communication devices, display devices for exhibitions or information transmission, medical display devices, etc.

[0135] The foregoing is an illustration of the embodiments of the present disclosure and should not be construed as limiting thereof. Although some embodiments have been described with reference to the accompanying drawings, it will be readily understood by those skilled in the art that many changes and modifications may be made therein without departing from the spirit and scope of the present disclosure as defined in the appended claims.

Claims

1. A method for manufacturing a bonded component, the method comprising: providing a preliminary resin layer including a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range; forming an intermediate resin layer by irradiating the preliminary resin layer with first ultraviolet light having a wavelength different from that within the first wavelength range; and The bonding member is formed by irradiating the intermediate resin layer with second ultraviolet light having a wavelength within the first wavelength range.

2. The method according to claim 1, wherein: A second starting point of irradiating the second ultraviolet light is separated from a first starting point of irradiating the first ultraviolet light by a predetermined time interval, and The predetermined time interval is determined based on the fluidity of the preliminary resin layer.

3. The method according to claim 1, wherein in the step of irradiating the second ultraviolet light to the intermediate resin layer, The first ultraviolet light having the wavelength different from the wavelength within the first wavelength range is not irradiated.

4. The method according to claim 1, wherein in the step of irradiating the second ultraviolet light to the intermediate resin layer, The first ultraviolet light having the wavelength different from the wavelength within the first wavelength range is simultaneously irradiated to the intermediate resin layer.

5. The method according to claim 1, wherein in the step of irradiating the first ultraviolet light, The first ultraviolet light includes sub-ultraviolet light such that sub-ultraviolet light having a wavelength smaller than a minimum wavelength in the first wavelength range and sub-ultraviolet light having a wavelength larger than a maximum wavelength in the first wavelength range are irradiated simultaneously.

6. The method according to claim 1, wherein the irradiating the first ultraviolet light and the irradiating the second ultraviolet light are performed by an ultraviolet light irradiation device, the ultraviolet light irradiation device comprising a plurality of first ultraviolet light emitting units for irradiating the first ultraviolet light and a plurality of second ultraviolet light emitting units for irradiating the second ultraviolet light.

7. The method according to claim 6, wherein: When the ultraviolet light irradiation device is fixed on the preliminary resin layer, the ultraviolet light irradiation device irradiates the first ultraviolet light, and The ultraviolet light irradiation device irradiates the second ultraviolet light while the ultraviolet light irradiation device is fixed on the intermediate resin layer.

8. The method according to claim 7, wherein: The ultraviolet light irradiation device irradiates the first ultraviolet light to the entire area of the preliminary resin layer, and The ultraviolet light irradiation device irradiates the second ultraviolet light to the entire area of the intermediate resin layer.

9. The method according to claim 6, wherein: The plurality of first ultraviolet emitting units are arranged in a matrix form in a plan view, and The plurality of second ultraviolet emitting units are arranged in a matrix form in the plan view.

10. A method for manufacturing a display device, the method comprising: forming a preliminary resin layer including a photopolymerization initiator having a maximum absorption wavelength within a first wavelength range on a display panel including a substrate, a display element layer, and an encapsulation layer; forming an intermediate resin layer by irradiating the preliminary resin layer with first ultraviolet light having a wavelength different from a wavelength within the first wavelength range; forming a bonding member by irradiating the intermediate resin layer with second ultraviolet light having a wavelength within the first wavelength range; and A functional member is formed on the bonding member.

11. The method according to claim 10, wherein: A second starting point of irradiating the second ultraviolet light is separated from a first starting point of irradiating the first ultraviolet light by a predetermined time interval, and The predetermined time interval is determined based on the fluidity of the preliminary resin layer.

12. The method according to claim 10, wherein in the step of irradiating the second ultraviolet light to the intermediate resin layer, The first ultraviolet light having the wavelength different from the wavelength within the first wavelength range is not irradiated.

13. The method according to claim 10, wherein in the step of irradiating the second ultraviolet light to the intermediate resin layer, The first ultraviolet light having the wavelength different from the wavelength within the first wavelength range is simultaneously irradiated to the intermediate resin layer.

14. The method according to claim 10, wherein in the step of irradiating the first ultraviolet light, The first ultraviolet light includes sub-ultraviolet light such that sub-ultraviolet light having a wavelength smaller than a minimum wavelength in the first wavelength range and sub-ultraviolet light having a wavelength larger than a maximum wavelength in the first wavelength range are irradiated simultaneously. The method according to claim 10 , wherein the preliminary resin layer is formed using an inkjet printing method. 16 . The method according to claim 10 , wherein the functional member comprises at least one of a touch member, an anti-reflection layer, and a cover window.

17. The method according to claim 10, wherein the irradiating the first ultraviolet light and the irradiating the second ultraviolet light are performed by an ultraviolet light irradiation device, the ultraviolet light irradiation device comprising a plurality of first ultraviolet light emitting units for irradiating the first ultraviolet light and a plurality of second ultraviolet light emitting units for irradiating the second ultraviolet light.

18. The method according to claim 17, wherein: When the ultraviolet light irradiation device is fixed on the preliminary resin layer, the ultraviolet light irradiation device irradiates the first ultraviolet light, and The ultraviolet light irradiation device irradiates the second ultraviolet light while the ultraviolet light irradiation device is fixed on the intermediate resin layer.

19. The method according to claim 18, wherein: The ultraviolet light irradiation device irradiates the first ultraviolet light to the entire area of the preliminary resin layer, and The ultraviolet light irradiation device irradiates the second ultraviolet light to the entire area of the intermediate resin layer.

20. The method of claim 17, wherein: The plurality of first ultraviolet emitting units are arranged in a matrix form in a plan view, and The plurality of second ultraviolet emitting units are arranged in a matrix form in the plan view.

Images