Heat dissipation sleeve and air pump thereof

Abstract

The invention relates to the technical field of air pump accessories, in particular to a heat dissipation sleeve and an air pump thereof.The heat dissipation sleeve is characterized in that a containing cavity used for containing the air pump is formed in the heat dissipation sleeve, one end of the heat dissipation sleeve is of a closed structure, the other end of the heat dissipation sleeve is provided with an opening, and at least two sets of air channels are formed in the inner wall of the heat dissipation sleeve; the air channel comprises an air inlet channel and an air outlet channel, airflow flows into the heat dissipation sleeve from the air inlet channel and flows out through the air outlet channel, the air outlet channel extends to the open end of the heat dissipation sleeve from the closed end of the heat dissipation sleeve, and the air inlet channel extends to an air inlet of the air pump from the open end of the heat dissipation sleeve. The contradiction between noise suppression and heat dissipation enhancement of small and medium-sized air pumps in the prior art is effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of air pump accessories, and in particular to a heat dissipation sleeve and an air pump thereof. Background Art

[0002] Due to their compact size and integrated fan blade heat dissipation structure, small air pumps have significant application value in space-constrained scenarios such as microelectronic devices and portable instruments. However, this type of air pump has two inherent defects during operation: 1. Prominent noise pollution. The airflow turbulence and air shear effect generated by the exposed fan blades during high-speed rotation can cause high-frequency howling, especially in the closed equipment cavity, which is prone to resonance, seriously restricting their application in noise-sensitive environments (such as medical equipment and maternal and child products); 2. Limited heat dissipation efficiency. The miniaturized design leads to a serious lack of heat dissipation surface area. The heat exchange efficiency relying solely on forced convection of the fan blades has approached the physical limit. Especially under continuous high-load conditions, the air pump temperature rise curve is steep, which leads to the risk of magnet demagnetization and the reduction of electronic component life.

[0003] The improvement solutions currently commonly adopted in the industry include: adding a metal heat dissipation sleeve, which can expand the heat conduction area, but the closed structure hinders the airflow path, which in turn weakens the active heat dissipation ability of the fan blades; filling with thermal grease or adding heat dissipation fins, which have poor compatibility with volume-sensitive micro-scenarios and cannot solve the problem of high-frequency noise.

[0004] None of the above solutions can synergistically resolve the contradiction between noise suppression and enhanced heat dissipation: noise reduction measures often sacrifice heat dissipation efficiency, while enhanced heat dissipation designs can amplify noise radiation. Therefore, an innovative structure is urgently needed to achieve a simultaneous leap in air pump heat dissipation performance and noise characteristics while maintaining the advantages of miniaturization. Summary of the Invention

[0005] The present application provides a heat dissipation sleeve and an air pump thereof, so as to at least resolve the contradiction between noise suppression and heat dissipation enhancement of small air pumps in the related art.

[0006] In order to achieve the above-mentioned purpose, the present application provides a heat dissipation sleeve, wherein a accommodating cavity for accommodating an air pump is formed inside the heat dissipation sleeve, one end of the heat dissipation sleeve is a closed structure, and the other end is provided with an opening, and at least two groups of air ducts are formed on the inner wall of the heat dissipation sleeve, and the air ducts include an air inlet duct and an air outlet duct. The air flow flows into the heat dissipation sleeve from the air inlet duct and flows out through the air outlet duct. The air outlet duct extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve, and the air inlet duct extends from the open end of the heat dissipation sleeve to the air inlet of the air pump.

[0007] In some embodiments, the air duct is a spiral structure, the air outlet duct spirally extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve, and the air inlet duct spirally extends from the open end of the heat dissipation sleeve to the air inlet of the air pump.

[0008] In some embodiments, the air passage is an open structure inside the heat dissipation sleeve.

[0009] In some embodiments, the air channel is a groove structure that spirals on the inner wall of the heat dissipation sleeve and is recessed relative to the inner wall of the heat dissipation sleeve, and the inner wall of the heat dissipation sleeve is in contact with the surface of the air pump accommodated in the heat dissipation sleeve.

[0010] In some embodiments, spoilers inclined against the airflow direction are provided along the width of the air duct, and the spoilers are evenly distributed on the air duct.

[0011] In some embodiments, heat dissipation bumps corresponding to the positions of the air ducts are distributed on the outer surface of the heat dissipation sleeve.

[0012] In some embodiments, a heat-conducting sleeve for being sleeved on the air pump is provided inside the heat-dissipating sleeve, and heat-dissipating protrusions are formed on the outer wall of the heat-conducting sleeve.

[0013] In some embodiments, the heat dissipation bumps are arranged in a pyramid-shaped array structure.

[0014] In some embodiments, an air inlet hole connecting the inside and outside of the heat dissipation sleeve is formed on the side wall of the heat dissipation sleeve near the open end, one end of the air inlet duct is connected to the air inlet hole, and the other end is connected to the air inlet of the air pump.

[0015] The present application also provides an air pump, comprising a heat dissipation sleeve as described in any one of the above items, wherein the heat dissipation sleeve is mounted on or integrated into the air pump and guides the airflow generated by the air pump to flow through the air pump body.

[0016] Based on the above content, the beneficial effects of the technical solution of this application compared with the existing technology are:

[0017] 1. At least two sets of spiral air ducts are formed on the inner wall of the heat dissipation sleeve. The air inlet and outlet ducts form an airflow loop, so that there is a continuous and flowing airflow in the heat dissipation sleeve to achieve active directional air cooling for the air pump. The heat dissipation sleeve is made of silicone material, which can effectively reduce the noise of the air pump.

[0018] 2. A pyramid array structure of heat dissipation bumps is formed on the surface of the heat dissipation sleeve, further enhancing the heat dissipation effect of the heat dissipation sleeve;

[0019] 3. A spoiler is set in the air duct in the opposite direction of the airflow to achieve the effect of noise reduction by disrupting the airflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0021] Figure 1 This is a schematic diagram of the assembly of the heat dissipation sleeve and the air pump according to an embodiment of the present application;

[0022] Figure 2 It is an exploded view of an embodiment of the present application;

[0023] Figure 3 This is a schematic diagram of the air inlet and outlet ducts of an embodiment of the present application;

[0024] Figure 4 This is a cross-sectional view of the assembly of the heat dissipation sleeve, heat conductive sleeve, and air pump according to an embodiment of the present application;

[0025] Figure 5 is a cross-sectional view of a heat dissipation sleeve according to an embodiment of the present application;

[0026] Figure 6 This is a schematic diagram of the heat dissipation sleeve structure according to an embodiment of the present application;

[0027] Figure 7 This is a schematic diagram of the structure of the heat-conducting sleeve according to an embodiment of the present application;

[0028] Figure 8 This is a schematic diagram of the spoiler in the tilted state in the airway according to an embodiment of the present application.

[0029] Explanation of the reference numerals: heat dissipation sleeve 1; closed end 1.1; open end 1.2; air inlet 1.3; fixing portion 1.4; air outlet 2; air pump 3; air inlet 3.1; spoiler 4; heat dissipation bump 5; thermally conductive sleeve 6; air inlet 7. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for ordinary technicians in the field related to the contents disclosed in the present application, some changes such as design, manufacturing or production based on the technical contents disclosed in the present application are only conventional technical means and should not be understood as the contents disclosed in the present application being insufficient.

[0031] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it refer to independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments unless there is a conflict.

[0032] Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by persons of ordinary skill in the art to which this application belongs. The terms "a," "an," "an," "the," and similar expressions used herein do not denote limitations on quantity and may refer to either the singular or the plural. The terms "comprise," "include," "have," and any variations thereof, used herein, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or modules (units) is not limited to the listed steps or units but may also include steps or units not listed, or may include other steps or units inherent to the process, method, product, or apparatus. The terms "connected," "connected," "coupled," and similar expressions used herein are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. As used herein, "plurality" means greater than or equal to two. "And / or" describes an association between associated objects, indicating that three possible relationships exist. For example, "A and / or B" may mean: A exists alone; A and B exist simultaneously; or B exists alone. The terms "first", "second", "third" and the like involved in this application are merely used to distinguish similar objects and do not represent a specific ordering of the objects.

[0033] The present application provides a heat dissipation sleeve, wherein a accommodating cavity for accommodating an air pump is formed inside the heat dissipation sleeve, one end of the heat dissipation sleeve is a closed structure, and the other end is provided with an opening, and at least two groups of air ducts are formed on the inner wall of the heat dissipation sleeve, the air ducts including an air inlet duct and an air outlet duct, the air flow flows into the heat dissipation sleeve from the air inlet duct and flows out through the air outlet duct, the air outlet duct extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve, and the air inlet duct extends from the open end of the heat dissipation sleeve to the air inlet of the air pump.

[0034] The present application also provides an air pump, comprising the above-mentioned heat dissipation sleeve, which is mounted on or integrated into the air pump and guides the airflow generated by the air pump to flow through the air pump body.

[0035] Implementation example Figures 1 to 8As shown, a heat dissipation sleeve is made of high-elasticity silicone with a thermal conductivity coefficient of ≥3.0W / (m·k) and a Shore hardness of 40~60A. It can be tightly wrapped around the surface of the air pump 3 and has good thermal conductivity, while also having a vibration and noise reduction performance of more than 6db.

[0036] Specifically, the heat dissipation jacket 1 has an internal cavity for accommodating the air pump 3. One end of the heat dissipation jacket 1 is closed, and the other end is provided with an opening for installing the air pump 3. The inner wall of the heat dissipation jacket 1 is formed with at least two sets of spiral air channels (two sets of spiral air channels in this embodiment). These two sets of air channels are open structures within the heat dissipation jacket 1. Specifically, the air channels are groove-like structures that spiral around the inner wall of the heat dissipation jacket 1 and are recessed relative to the inner wall of the heat dissipation jacket 1.

[0037] Specifically, the two groups of air ducts are the air inlet duct 7 and the air outlet duct 2. The air outlet duct 2 spirals from the closed end 1.1 of the heat dissipation sleeve 1 to the open end 1.2 of the heat dissipation sleeve 1, and the air inlet duct 7 spirals from the open end 1.2 of the heat dissipation sleeve 1 to the air inlet 3.1 of the air pump 3. When the air pump 3 is installed in the heat dissipation sleeve 1, the inner wall of the heat dissipation sleeve 1 fits with the surface of the air pump 3 contained in the heat dissipation sleeve 1, and the grooved air duct constructs a "inlet-outlet" two-way gas circulation channel between the heat dissipation sleeve 1 and the surface of the air pump 3. The air flow flows into the heat dissipation sleeve 1 from the air inlet duct 7 and flows out through the air outlet duct 2, forming a closed air flow loop. Moreover, due to the grooved structure of the air inlet duct 7 and the air outlet duct 2, the circulation of cold air passing through the surface of the air pump 3 during the gas circulation process is conducive to achieving full-range temperature balance for the air pump 3.

[0038] Furthermore, when the number of air ducts is greater than two groups, there may be a variety of combinations, such as one group of air inlet ducts 7 and two groups of air outlet ducts 2, or any combination of two groups of air inlet ducts 7 and two groups of air outlet ducts 2.

[0039] Furthermore, the heat dissipation sleeve 1 has an air inlet 1.3 formed on the side wall near the open end 1.2, which connects the inside and outside of the heat dissipation sleeve 1. One end of the air inlet duct 7 is connected to the air inlet 1.3, and the other end is connected to the air inlet 3.1 of the air pump 3 after circling around the air pump 3. The air outlet duct 2 extends to the edge of the open end 1.2, so that the air flow can easily flow out from the edge of the open end 1.2. The air flow flows in from the air inlet 1.3, passes through the air inlet duct 7, and circles on the surface of the air pump 3 until it flows into the air inlet 3.1 of the air pump 3. Then, it is blown out from the air outlet duct 2 at the closed end 1.1 of the heat dissipation sleeve 1, circling along the surface of the air pump 3 until it flows out from the edge of the open end 1.2 of the heat dissipation sleeve 1, forming a cycle.

[0040] Furthermore, both the inlet duct 7 and the outlet duct 2 are provided with horizontally and tilted spoilers 4 along their widths, with the spoilers 4 spaced evenly across the ducts. The spoilers 4 are tilted in the direction opposite to the airflow. For example, if the airflow is flowing from direction a to direction b, the a-end of the spoiler 4 is closer to the bottom of the airflow groove than the b-end, causing the spoiler 4 to oppose the airflow. The installation of spoilers 4 on the inlet duct 7 and the outlet duct 2 disrupts the airflow, thereby achieving noise reduction and silencing effects.

[0041] Specifically, the spoiler 4 in this embodiment is an inclined spoiler.

[0042] Furthermore, the outer surface of the heat sink 1 is provided with heat dissipation bumps 5 distributed along the air inlet duct 7 and the air outlet duct 2. These bumps 5 expand the heat dissipation area while filling the thin-walled areas, thereby enhancing the stability of the heat sink 1. The heat dissipation bumps 5 are arranged in a pyramid-shaped array structure with a height of 0.6 mm, corresponding to the positions of the air inlet duct 7 and the air outlet duct 2.

[0043] Furthermore, a 3.0mm thick silicone thermally conductive sleeve 6 is installed inside the heat dissipation sleeve 1. This sleeve is placed on the end of the air pump 3 near the opening 1.2. The sleeve 6 is positioned between the air pump 3 and the heat dissipation sleeve 1. The outer wall of the sleeve 6 is formed with heat dissipation bumps 5 arranged in a 0.2mm high pyramid-shaped array. This pyramid microstructure reduces the contact thermal resistance to 0.1k·m² / W, while providing a buffering stress of 5N / m² and suppressing the attenuation rate of 1000Hz high-frequency vibration by ≥20%.

[0044] Furthermore, one or more raised fixing parts 1.4 are provided on the outside of the heat dissipation sleeve 1. Specifically, four fixing parts 1.4 can be provided, which effectively enhances the durability of the structure, prevents the heat dissipation sleeve 1 from falling off due to friction and collision, and prolongs the service life of the device.

[0045] Furthermore, the present application also provides an air pump, including the above-mentioned heat dissipation sleeve 1, which is mounted or integrated on the outer shell of the air pump 3, and guides the airflow generated by the air pump 3 to flow through the main body of the air pump 3 to achieve heat dissipation of the air pump 3.

[0046] Those skilled in the art should understand that the various technical features of the above-described embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the various technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation sleeve, characterized in that: A accommodating cavity for accommodating an air pump is formed inside the heat dissipation sleeve. One end of the heat dissipation sleeve is a closed structure and the other end is provided with an opening. At least two groups of air ducts are formed on the inner wall of the heat dissipation sleeve. The air ducts include an air inlet duct and an air outlet duct. The air flow flows into the heat dissipation sleeve from the air inlet duct and flows out through the air outlet duct. The air outlet duct extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve, and the air inlet duct extends from the open end of the heat dissipation sleeve to the air inlet of the air pump.

2. The heat dissipation sleeve according to claim 1, characterized in that: The air channel is in a spiral structure. The air outlet channel spirally extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve. The air inlet channel spirally extends from the open end of the heat dissipation sleeve to the air inlet of the air pump.

3. The heat dissipation sleeve according to claim 2, characterized in that: The air passage is in an open structure inside the heat dissipation sleeve.

4. The heat dissipation sleeve according to claim 3, characterized in that: The air channel is a groove structure that spirals on the inner wall of the heat dissipation sleeve and is recessed relative to the inner wall of the heat dissipation sleeve. The inner wall of the heat dissipation sleeve is in contact with the surface of the air pump accommodated in the heat dissipation sleeve.

5. The heat dissipation sleeve according to claim 4, characterized in that: The air duct is provided with spoilers inclined against the direction of the airflow along its width, and the spoilers are distributed equidistantly on the air duct.

6. The heat dissipation sleeve according to claim 1, characterized in that: The outer surface of the heat dissipation sleeve is provided with heat dissipation protrusions corresponding to the positions of the air ducts.

7. The heat dissipation sleeve according to claim 1, characterized in that: A heat-conducting sleeve for being sleeved on the air pump is provided inside the heat-dissipating sleeve, and heat-dissipating convex points are formed on the outer wall of the heat-conducting sleeve.

8. The heat dissipation sleeve according to claim 6 or 7, characterized in that: The heat dissipation bumps are arranged in a pyramid-shaped array structure.

9. The heat dissipation sleeve according to any one of claims 1 to 7, characterized in that: An air inlet hole communicating with the inside and outside of the heat dissipation sleeve is formed on the side wall of the heat dissipation sleeve near the open end. One end of the air inlet duct is communicated with the air inlet hole, and the other end is communicated with the air inlet of the air pump.

10. An air pump, characterized in that: It comprises the heat dissipation sleeve according to any one of claims 1 to 9, wherein the heat dissipation sleeve is mounted on or integrated into the air pump and guides the airflow generated by the air pump to flow through the air pump body.

Images