Calibration method, device and system of probe card test mother board

Abstract

The invention discloses a calibration method, device and system for a probe card test mother board. The method comprises the following steps: controlling a first fixing piece to drive a measuring head of a measuring device to be inserted into a first through hole; controlling the test chuck to move so as to enable the test chuck to be in contact with the measuring head and enable the measuring head to generate displacement; acquiring a first measurement value of the measurement device; controlling the first fixing piece to drive the measuring head of the measuring device to be inserted into the other at least two first through holes in sequence, and obtaining a plurality of first measuring values of the measuring device in sequence; and controlling a leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values. According to the application, the leveling mechanism is controlled to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, so that the parallel degree of the probe card test mother board and the test chuck can be improved, and the situation that the test result is distorted or the probe card is damaged when the test chuck is adopted to test the probe card subsequently is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of probe card testing, and in particular to a calibration method, device and system for testing a motherboard with a probe card. Background Art

[0002] In today's rapidly developing chip industry, wafer inspection is a crucial step in the chip production process. Before the chips are packaged, wafer inspection is performed using probe cards to avoid inefficient processing of substandard wafers. Probe cards contain multiple probes that directly contact the wafer's pads or bumps, transmitting test signals to determine if the wafer is qualified. The probe card itself also needs to be tested. During the probe card testing process, the probe card is usually fixed to the probe card test motherboard, and then the probe card test motherboard is placed on the probe test system. The probes on the test chuck of the probe test system are then used to perform performance tests on the probes on the probe card to ensure that the probe card can work properly when testing wafers. However, during actual testing, due to various factors, including installation errors, it's often difficult to maintain a parallel position between the probe card and the test chuck. This can cause the probes on the test chuck to lose precise alignment with the probes on the probe card, distorting test results and failing to accurately reflect the probe card's performance. It can even damage the probe card during testing. Currently, the industry lacks a calibration method that effectively adjusts the probe card's test motherboard to maintain parallelism with the test chuck. Summary of the Invention

[0003] In response to the shortcomings of the existing technology, the present application provides a calibration method, device and system for a probe card test motherboard. By controlling the first fixing member to drive the measuring head of the measuring device to insert into at least three first through holes of the calibration device and obtain the first measurement value, the leveling mechanism is controlled based on all the first measurement values to adjust the probe card test motherboard to be parallel to the test chuck, which can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the distortion of test results or damage to the probe card when the test chuck is used to test the probe card subsequently.

[0004] In order to solve the above problems, the present invention provides the following technical solutions: In a first aspect, an embodiment of the present application provides a calibration method for a probe card testing motherboard, wherein the calibration device for the probe card testing motherboard includes a main body and at least three first through holes provided on the main body, wherein the first through holes are used to insert a measuring head of a measuring device; The calibration method of the probe card testing motherboard includes: When the probe card test motherboard on which the probe card and the calibration device are mounted is fixed to the leveling mechanism of the probe test system, and the measuring device is fixed to the first fixing member, controlling the first fixing member to drive the measuring head of the measuring device to insert into one of the first through holes, wherein the first fixing member is used to position the main body of the measuring device on a plane parallel to the calibration device; controlling the movement of a test chuck of a test device of the probe test system so that the test chuck contacts the measuring head and causes the measuring head to be displaced; obtaining a first measurement value of the measuring device; controlling the first fixing member to drive the measuring head of the measuring device to sequentially insert into the other at least two first through holes, and sequentially obtaining a plurality of first measurement values of the measuring device; The leveling mechanism is controlled based on all the first measurement values to adjust the probe card test mother board to be parallel to the test chuck.

[0005] In some embodiments, the calibration device further comprises a second through hole for inserting a test cartridge calibration device, wherein the test cartridge calibration device comprises a calibration needle. After controlling the leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, the method further includes: When the test chuck calibration device is inserted into the second through hole, controlling the visual detection component of the test device to obtain a needle tip image of the calibration needle; controlling the movement of the test chuck based on the needle tip image so that the probe of the test device contacts the calibration needle and the probe of the test device penetrates the test chuck; acquiring first movement data of the test chuck when a first electrical signal indicating that the probe of the test device has contacted the calibration pin is detected; The relative position of the probe and a reference position point of the test chuck is determined based on the first movement data.

[0006] In some embodiments, the calibration device further includes a third through hole, and before controlling the visual inspection component of the test device to acquire the needle tip image of the calibration needle when the test chuck calibration device is inserted into the second through hole, the method further includes: When the conductive member is inserted into the third through hole, the test chuck is controlled to move so that the probe of the test device contacts the conductive member, and the length of the conductive member extending beyond the surface of the probe card test motherboard facing the test chuck is a preset standard length; acquiring second movement data of the test chuck when a second electrical signal indicating that the surface of the test chuck has contacted the conductive member is detected; A relative distance between a surface of the test chuck and a surface of the probe card test mother board facing the test chuck is determined based on the second movement data and the preset standard length.

[0007] In some embodiments, controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values includes: Calculate a calibration measurement value based on all the first measurement values and a preset calculation method; The leveling mechanism is controlled based on the calibration measurement value to adjust the probe card test mother board to be parallel to the test chuck.

[0008] In some embodiments, the at least three first through holes include at least three first measurement through holes and a second measurement through hole, the first measurement through holes being used to insert a measurement head of the measurement device to obtain the first measurement values. After controlling the leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, the method further includes: Controlling the first fixing member to drive the measuring head of the measuring device to insert into the second measuring through hole; obtaining a second measurement value of the measuring device; When the difference between the second measurement value and the calibration measurement value is less than a first preset difference, it is determined that the probe card test motherboard is parallel to the test chuck; otherwise, based on all the first measurement values and the second measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck.

[0009] In a second aspect, an embodiment of the present application provides a calibration device for a probe card test motherboard, which is applied to the calibration method for a probe card test motherboard as described in the first aspect. The calibration device includes a main body and at least three first through holes arranged on the main body, and the first through holes are used to insert a measuring head of a measuring device.

[0010] In some embodiments, the at least three first through holes include at least three first measurement through holes and second measurement through holes, the first measurement through holes being used to insert a measurement head of the measurement device to obtain a first measurement value, and the second measurement through holes being used to insert a measurement head of the measurement device to obtain a second measurement value; There are three first measurement through holes, and the three first measurement through holes are three vertices of an equilateral triangle; There is one second measuring through hole, and the second measuring through hole is the center of the equilateral triangle.

[0011] In some embodiments, the calibration device further comprises a second through hole, wherein the second through hole is used to insert the test chuck calibration device; and / or The calibration device further includes a third through hole, wherein the third through hole is used for inserting a conductive member.

[0012] In some embodiments, the calibration device further includes a groove for accommodating a second fixing member, and the second fixing member is used to fix the test cartridge calibration device when the test cartridge calibration device is inserted into the second through hole.

[0013] In the third aspect, an embodiment of the present application provides a calibration system for a probe card test motherboard, comprising a calibration device for the probe card test motherboard as described in the second aspect, a measuring device, a first fixing member, a test chuck calibration device, and a second fixing member, the measuring device comprising a main body and a measuring head, the first fixing member being used to fix the measuring device and make the main body of the measuring device located on a plane parallel to the calibration device, the test chuck calibration device comprising a calibration needle, and the second fixing member being used to fix the test chuck calibration device when the test chuck calibration device is inserted into the second through hole of the calibration device.

[0014] The present application provides a calibration method, device and system for a probe card test motherboard. The present application controls a first fixing member to drive a measuring head of a measuring device to insert into at least three first through holes of a calibration device and obtain a first measurement value. Based on all the first measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck. This can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the distortion of test results or damage to the probe card when the test chuck is used to test the probe card subsequently. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the first embodiment of the calibration device for testing a motherboard with a probe card provided in an embodiment of the present application.

[0016] Figure 2 It is a flow chart of the first embodiment of the calibration method for testing a motherboard with a probe card provided in an embodiment of the present application.

[0017] Figure 3 Schematic diagram of a probe testing system provided in an embodiment of the present application.

[0018] Figure 4 Schematic diagram of the first fixing member and the measuring device provided in an embodiment of the present application.

[0019] Figure 5 It is a schematic diagram of the second embodiment of the calibration device for testing a motherboard with a probe card provided in an embodiment of the present application.

[0020] Figure 6 This is a schematic diagram of the third embodiment of the calibration device for testing a motherboard using a probe card provided in an embodiment of the present application.

[0021] Figure 7 Schematic diagram of the structure of the test chuck calibration device provided in an embodiment of the present application.

[0022] Figure 8 It is a flow chart of the second embodiment of the calibration method for testing a motherboard with a probe card provided in an embodiment of the present application.

[0023] Figure 9 This is a schematic diagram of the fourth embodiment of the calibration device for testing a motherboard with a probe card provided in an embodiment of the present application.

[0024] Figure 10 yes Figure 9 Enlarged view of point P in the middle.

[0025] Figure 11 This is a schematic diagram of the fifth embodiment of the calibration device for testing a motherboard using a probe card provided in an embodiment of the present application.

[0026] Figure 12 It is a structural diagram of a calibration system for a probe card testing a motherboard provided in an embodiment of the present application.

[0027] Figure 13 This is a structural diagram of an electronic device provided in an embodiment of the present application.

[0028] Figure 14 This is a structural block diagram of a computer-readable storage medium provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0031] The present application provides a calibration method, device and system for a probe card test motherboard, which controls a first fixing member to drive a measuring head of a measuring device to insert into at least three first through holes of a calibration device and obtain a first measurement value. Based on all the first measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck. This can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the distortion of test results or damage to the probe card when the test chuck is used to test the probe card subsequently.

[0032] The calibration method for testing a motherboard using a probe card provided in the present application will be described in detail below with reference to the accompanying drawings.

[0033] See also Figure 1 , Figure 1 Schematic diagram of the first embodiment of the calibration device for the probe card testing motherboard provided in the embodiment of the present application. Figure 1 As shown, in some embodiments, a calibration device 1 for testing a motherboard with a probe card includes a main body R and at least three first through holes 10 provided on the main body R. The first through holes 10 are used to insert a measuring head of a measuring device.

[0034] like Figure 1 As shown, optionally, the number of the first through holes is 3, and the three first through holes 10 include a first through hole 10A, a first through hole 10B, and a first through hole 10C.

[0035] Optionally, the number of the first through holes may be 4, 5, or 6, etc.

[0036] Optionally, the shape of the first through hole may be any shape, for example, the first through hole may be circular, square or irregular in shape.

[0037] Optionally, the calibration device 1 further includes a mounting hole K, which is used to install a fastener, and the fastener is used to fix the calibration device 1 to the probe card test motherboard.

[0038] Optionally, the fasteners include screws, rivets, etc.

[0039] See also Figure 2 , Figure 2 FIG. 1 is a flow chart of the first embodiment of the calibration method for a probe card testing motherboard provided in an embodiment of the present application. Figure 2 As shown, the calibration method for testing a motherboard with a probe card includes steps S100 to S500.

[0040] Step S100: When the probe card test motherboard with the probe card and calibration device installed is fixed on the leveling mechanism of the probe test system, and the measuring device is fixed to the first fixing member, the first fixing member is controlled to drive the measuring head of the measuring device to insert into a first through hole.

[0041] The first fixing member is used to position the main body of the measuring device on a plane parallel to the calibration device.

[0042] See also Figure 3 , Figure 3 Schematic diagram of the probe test system provided in the embodiment of the present application. Figure 3 As shown, in some embodiments, the probe testing system 2 includes a leveling mechanism 21 , a base 22 , and a testing device. The testing device is used to test the mechanical and electrical properties of the probe. The testing device includes a test chuck 23 . Figure 3 Part of the structure of the probe test system is omitted.

[0043] In some embodiments, the probe card test motherboard 3 includes a cover plate and a probe card fixing plate rotatably connected to the cover plate. The probe card fixing plate is used to mount the probe card. The cover plate is provided with a calibration device fixing position 31 for mounting a calibration device.

[0044] In some embodiments, a leveling mechanism is used to adjust and position a probe card fixing plate in a probe card test motherboard.

[0045] In some embodiments, the leveling mechanism 21 includes a fixed plate vacuum chuck 211 and a fixed plate flipping mechanism 212. The fixed plate vacuum chuck 211 is used to fix the probe card test motherboard 3 by adsorbing it in a vacuum adsorption manner.

[0046] In some embodiments, the probe testing system 2 further includes a testing device positioning mechanism (not shown). The testing device positioning mechanism is used to drive the testing device to move. This application does not impose any limitation on the specific structure of the testing device positioning mechanism.

[0047] Exemplarily, the test device is mounted above a test device positioning mechanism and can move with the test device positioning mechanism. The test device positioning mechanism includes a first motion axis module, a second motion axis module, and a third motion axis module, arranged sequentially from bottom to top. The first motion axis module, the second motion axis module, and the third motion axis module can move in different directions.

[0048] Optionally, the first motion axis module and the second motion axis module are used to drive the third motion axis module to move in the horizontal direction, and the third motion axis module is used to drive the testing device to move in the vertical direction.

[0049] In some embodiments, the testing apparatus further includes a plurality of probes passing through a test chuck, a pressure testing mechanism, and a visual inspection assembly (not shown). The test chuck is configured to contact the probes under test on the probe card, allowing the multiple probes of the testing apparatus to test the probes under test. The visual inspection assembly is configured to perform visual inspection of the probes under test.

[0050] Optionally, the plurality of probes include an electrical performance test probe and a pressure test probe.

[0051] like Figure 3 As shown, in some embodiments, the test chuck 23 includes a test through-hole 231 , and a probe of a testing device can pass through the test chuck 23 through the test through-hole 231 .

[0052] Optionally, there are multiple test through holes 231 , for example, there are 2, 3 or 5 test through holes 231 , etc. Each test through hole 231 allows a probe of a test device to pass through the test chuck 23 .

[0053] In some embodiments, the test cartridge 23 further includes a visual window 232 .

[0054] Optionally, the visual window 232 includes a light-transmitting hole and a light-transmitting plate installed in the light-transmitting hole. The visual detection component is arranged below the visual window 232 , and the camera of the visual detection component obtains the needle tip image of the probe through the visual window 232 .

[0055] See also Figure 4 , Figure 4 Schematic diagram of the first fixing member and the measuring device provided in the embodiment of the present application. Figure 4 As shown, in some embodiments, the measuring device 4 includes a main body and a measuring head 43, and the main body includes a display unit 41 and a measuring rod 42. When the measuring head 43 is displaced relative to the measuring rod 42, the display unit 41 can display the measured value, which is the distance the measuring head 43 is displaced.

[0056] In some embodiments, the display unit 41 may transmit the measured value to an electronic device.

[0057] Optionally, the electronic device may obtain the measurement value by acquiring an image of the measuring device 4 .

[0058] Optionally, the measuring device comprises a dial indicator.

[0059] In some embodiments, the first fixture 5 includes a first surface A1 that contacts the calibration device 1, a second surface A2 that contacts the measuring device 4, and a third measuring through hole 51 for inserting the measuring head 43 of the measuring device 4. The first surface A1 is opposite to and parallel to the second surface A2.

[0060] Optionally, the first fixing member 5 is a column, for example, the first fixing member 5 can be a prism or a cylinder.

[0061] When the measuring rod 42 of the measuring device 4 is inserted into the third measuring hole 51, the measuring device 4 is fixed to the first fixing member 5, and the measuring head 43 extends beyond the first surface A1. At this time, the entire body of the measuring device 4 is located in a plane parallel to the second surface A2.

[0062] In some embodiments, when the measuring device is fixed to the first fixing member, the robotic arm is controlled to move the first fixing member so that the first fixing member drives the measuring head of the measuring device to be inserted into a first through hole.

[0063] In other embodiments, when the measuring device is fixed to the first fixing member, the first fixing member is manually controlled to drive the measuring head of the measuring device to be inserted into a first through hole.

[0064] Alternatively, the first fixture can be placed on the calibration device, or the first surface A1 of the first fixture can be parallel to the surface of the calibration device contacting the probe card test motherboard. The surface of the calibration device contacting the probe card test motherboard is parallel to the surface of the probe card test motherboard facing the test chuck. In this case, the entire main body of the measurement device 4 is located in a plane parallel to the surface of the probe card test motherboard facing the test chuck.

[0065] In some embodiments, a through hole corresponding to the position of the first through hole on the calibration device is provided on the probe card test motherboard, so that the measuring head of the measuring device is inserted into the first through hole and also inserted into the corresponding through hole on the probe card test motherboard, thereby allowing the measuring head to penetrate the probe card test motherboard and extend beyond the probe card test motherboard close to the surface of the test chuck, so that the measuring head can contact the test chuck.

[0066] Step S200: controlling the movement of a test chuck of a test device of a probe test system so that the test chuck contacts a measuring head and causes the measuring head to move.

[0067] Optionally, when the first fixing member 5 is placed on the calibration device 1, or when the first surface A1 of the first fixing member is parallel to the surface of the probe card test motherboard contacted by the calibration device, the measuring head 43 contacts the test chuck 23, so the plane where the measuring head 43 is located is the plane where the surface of the test chuck 23 is located.

[0068] Step S300: Acquire a first measurement value of a measuring device.

[0069] The first measurement value of the measuring device is the distance between the plane where the current test chuck is close to the surface of the probe card test motherboard and the plane where the surface of the probe card test motherboard is close to the test chuck minus the standard distance, which is the distance beyond the surface of the probe card test motherboard when the measuring head does not contact the test chuck.

[0070] Step S400: controlling the first fixing member to drive the measuring head of the measuring device to sequentially insert into the other at least two first through holes, and sequentially obtaining a plurality of first measurement values of the measuring device.

[0071] Step S500: controlling a leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all first measurement values.

[0072] In some embodiments, when all the first measurement values are not the same value or the difference between every two first measurement values is not less than a first preset difference, it can be determined that the probe card test motherboard is not parallel to the test chuck, and the leveling mechanism can be controlled based on all the first measurement values to adjust the probe card test motherboard to be parallel to the test chuck.

[0073] In some embodiments, when all first measurement values are the same value or the difference between every two first measurement values is less than a first preset difference, it can be determined that the probe card test motherboard is parallel to the test chuck, and there is no need to adjust the position of the probe card test motherboard.

[0074] In some embodiments, step S500 includes steps S510 to S520.

[0075] Step S510: Calculate a calibration measurement value based on all first measurement values and a preset calculation method.

[0076] In some embodiments, the calibration measurement is the mean, median, mode, etc. of all first measurements.

[0077] Optionally, the calibration measurement value is any first measurement value.

[0078] Step S520: controlling the leveling mechanism based on the calibration measurement value to adjust the probe card test motherboard to be parallel to the test chuck.

[0079] As described above, the first measurement value of the measuring device is the distance between the plane where the current test chuck is close to the surface of the probe card test mother board and the plane where the surface of the probe card test mother board is close to the test chuck minus the standard distance, which is the distance beyond the surface of the probe card test mother board when the measuring head does not contact the test chuck.

[0080] In some embodiments, the plane where the surface of the test chuck close to the probe card test motherboard is located is defined as the calibration plane, the plane where the surface of the probe card test motherboard close to the test chuck is located is defined as the plane to be calibrated, and adjusting the probe card test motherboard to be parallel to the test chuck means adjusting the plane to be calibrated to be parallel to the calibration plane.

[0081] In some embodiments, a first difference between the calibration measurement value and all the first measurement values is calculated, an adjustment distance of the leveling mechanism is calculated based on all the first differences, and the leveling mechanism is controlled based on the adjustment distance of the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck.

[0082] For example, the adjustment distance of the leveling mechanism may include adjusting the height of the fixed plate vacuum suction cup 211 .

[0083] In some embodiments, after step S500 , it may be checked whether the probe card test motherboard has been adjusted to be parallel to the test chuck.

[0084] See also Figure 5 , Figure 5 Schematic diagram of the second embodiment of the calibration device for the probe card test motherboard provided in the embodiment of the present application. Figure 5 As shown, in some embodiments, the at least three first through holes include at least three first measurement through holes and a second measurement through hole 10D. The at least three first measurement through holes include a first through hole 10A, a second through hole 10B, and a first through hole 10C. The first measurement through holes are used to insert a measurement head of a measurement device to obtain a first measurement value. The second measurement through holes are used to insert a measurement head of a measurement device to obtain a second measurement value.

[0085] In some implementations, after step S500 , the calibration method for testing a motherboard with a probe card further includes steps S501 to S503 .

[0086] Step S501: controlling the first fixing member to drive the measuring head of the measuring device to insert into the second measuring through hole.

[0087] The content of step S501 refers to the content of step S100.

[0088] Step S502: Acquire a second measurement value of the measuring device.

[0089] Step S502 refers to the content of step S300.

[0090] Step S503: When the difference between the second measurement value and the calibration measurement value is less than the first preset difference, it is determined that the probe card test motherboard is parallel to the test chuck; otherwise, based on all the first measurement values and the second measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck.

[0091] When executing steps S501 to S503, the test chuck does not move, so the calibration plane is fixed. The content of step S503 refers to the content of step S500.

[0092] In this way, it is possible to ensure that the probe card test motherboard is adjusted to be parallel to the test chuck.

[0093] See also Figure 6 , Figure 6 Schematic diagram of the third embodiment of the calibration device for the probe card testing motherboard provided in the embodiment of the present application. Figure 6 As shown, in some embodiments, the calibration device 1 further includes a second through hole 20. The second through hole 20 is used to insert the test chuck calibration device 6.

[0094] Optionally, the shape of the second through hole may be any shape, for example, the first through hole may be circular, square or irregular in shape.

[0095] like Figure 6 As shown, optionally, the shape of the second through hole 20 can be heart-shaped.

[0096] See also Figure 7 , Figure 7 Schematic diagram of the structure of the test chuck calibration device provided in the embodiment of the present application. Figure 7 As shown, in some embodiments, the test chuck calibration device 6 includes a calibration pin 61 .

[0097] Optionally, the calibration needle 61 includes a needle body and a needle tip. There may be a bending angle between the needle body and the needle tip, and the bending angle may be 80 degrees or 90 degrees, etc.

[0098] Optionally, the needle tip may be located in or approximately in a vertical direction, and the needle body may be located in or approximately in a horizontal direction.

[0099] Optionally, the test chuck calibration device 6 further includes a fixing rod 62 and a bracket 63. The fixing rod 62 is mounted on the bracket 63, and the end of the fixing rod 62 is fixedly connected to the calibration needle 61.

[0100] Alternatively, the material of the fixing rod 62 may be electrically conductive.

[0101] Optionally, the bracket 63 further includes a claw spring 631 , and the claw spring 631 is used to fix the fixing rod 62 .

[0102] Optionally, the test chuck calibration device 6 further includes a support member 64, a first end of the support member 64 is fixedly connected to the end of the fixing rod 62, and a second end of the support member 64 is connected to one end of the needle body of the calibration needle 61, and the support member 64 is used to maintain the stability of the calibration needle 61.

[0103] Optionally, the material of the support 64 may be electrically conductive.

[0104] For example, the support member 64 may be an iron sheet or an iron wire.

[0105] See also Figure 8 , Figure 8 FIG. 1 is a flow chart of the second embodiment of the calibration method for a probe card testing motherboard provided in an embodiment of the present application. Figure 8 As shown, in some embodiments, after step S500 or step S503, the calibration method for testing a motherboard with a probe card further includes steps S600 to S900.

[0106] Step S600: When the test chuck calibration device is inserted into the second through hole, the visual inspection component of the test device is controlled to obtain a needle tip image of the calibration needle.

[0107] Step S700: Control the movement of the test chuck based on the needle tip image so that the probe of the test device contacts the calibration needle.

[0108] In some embodiments, a single needle tip image is first acquired. Based on this image, the test chuck is moved so that the needle tip in the image is located at the center of the image. The standard coordinates of the reference position point on the test chuck at this point are recorded. Subsequently, needle tip images are continuously acquired, and based on multiple needle tip images, the test chuck is moved so that the probe of the testing device contacts the calibration needle.

[0109] In some embodiments, a needle tip image is first acquired and the standard coordinates of the reference position point of the test chuck are determined and recorded based on the needle tip image. Then, needle tip images are continuously acquired and the movement of the test chuck is controlled based on multiple needle tip images so that the probe of the test device contacts the calibration needle.

[0110] Step S800: When a first electrical signal indicating that a probe of a test device has contacted a calibration needle is detected, first movement data of a test chuck is acquired.

[0111] When the probe of the test device contacts the calibration pin, the probe card test system may receive a first electrical signal.

[0112] Optionally, the first movement data of the test chuck includes standard coordinates and coordinates after movement of a reference position point of the test chuck in a preset coordinate system.

[0113] Optionally, the reference position point of the test chuck is the center point of the visual window of the test chuck.

[0114] Step S900: determining the relative position of the probe and the reference position point of the test chuck based on the first movement data.

[0115] In some embodiments, the motion vector of the test chuck can be determined based on the standard coordinates of the reference position point of the test chuck in the first movement data in a preset coordinate system and the coordinates after movement, and the coordinates of the probe can be determined based on the motion vector and the standard coordinates of the reference position point of the test chuck, and then the relative position of the probe and the reference position point of the test chuck can be determined.

[0116] In some embodiments, when the test device has multiple probes, steps S600 to S900 are performed for each probe to determine the relative position of each probe and a reference point of the test chuck.

[0117] In this way, when the test chuck is moved during the test process to test the probes to be tested on the probe card using the probes, the probes of the test device can be accurately aligned with the probes to be tested on the probe card, thereby improving the accuracy of the test.

[0118] See also Figure 9 and Figure 10 , Figure 9 is a schematic diagram of a fourth embodiment of a calibration device for a probe card testing a motherboard provided in an embodiment of the present application, Figure 10 yes Figure 9 The enlarged view of P in the figure. Figure 9 and Figure 10 As shown, in some embodiments, the calibration device 1 further includes a third through hole 30. The third through hole 30 is used to insert a conductive member.

[0119] Optionally, the shape of the third through hole may be any shape, for example, the third through hole may be circular, square or irregular in shape.

[0120] In some implementations, before step S600 , the calibration method for testing a motherboard with a probe card further includes steps S901 to S903 .

[0121] Step S901 : When the conductive member is inserted into the third through hole, the test chuck is controlled to move so that a probe of the test device contacts the conductive member.

[0122] The length of the conductive member extending beyond the surface of the probe card test motherboard facing the test chuck is a preset standard length.

[0123] Optionally, the conductive member is a column, for example, the conductive member is a prism or a cylinder.

[0124] Optionally, the conductive member is made of iron or copper.

[0125] In some implementations, in step S901 , the test chuck is only controlled to move in the vertical direction.

[0126] Step S902 : When a second electrical signal indicating that the surface of the test chuck has contacted the conductive member is detected, second movement data of the test chuck is acquired.

[0127] Optionally, the second movement data of the test chuck includes coordinates of a preset reference point on the surface of the test chuck when it is at an initial position and coordinates when the surface of the test chuck has contacted the conductive member.

[0128] Step S903: determining the relative distance between the surface of the test chuck and the surface of the probe card test mother board facing the test chuck based on the second movement data and a preset standard length.

[0129] When the surface of the test chuck has contacted the conductive member, the current relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the test chuck is a preset standard length.

[0130] In some embodiments, the motion vector of the test chuck can be determined based on the coordinates of a preset reference point on the surface of the test chuck at the initial position and the coordinates when the surface of the test chuck has contacted the conductive member. The relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the test chuck when the test chuck is in the initial position can be calculated based on the preset standard length and the motion vector of the test chuck.

[0131] In some embodiments, the relative distance between the surface of the current test chuck and the surface of the probe card test motherboard facing the test chuck can be directly determined based on a preset standard length, and the current coordinates of the test chuck in the second movement data can be determined as the origin of the coordinate system.

[0132] In some embodiments, in the calibration method for testing a motherboard using a probe card, steps S901 to S903 are located after step S500 or step S503 and before step S600 .

[0133] Optionally, after executing steps S901 to S903, steps S600 to S900 are executed. After determining the relative position of the probe and the reference position point of the test chuck, the relative distance between the probe and the surface of the probe card test motherboard facing the test chuck can be further determined based on the relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the test chuck in step S903. The distance between the reference position point of the test chuck and the surface of the test chuck is known.

[0134] In this way, when the test chuck is moved during the test process to test the probes to be tested on the probe card using the probes, the probes of the test device can be further accurately aligned with the probes to be tested on the probe card, thereby further improving the accuracy of the test.

[0135] like Figure 1 、 Figure 5 、 Figure 6 and Figure 9 As shown, the present application provides a calibration device 1 for a probe card test motherboard, which is applied to the calibration method of the probe card test motherboard as described above. The calibration device 1 includes a main body R and at least three first through holes 10 arranged on the main body, and the first through holes 10 are used to insert a measuring head of a measuring device.

[0136] like Figure 1 As shown, in some embodiments, the at least three first through holes include at least three first measurement through holes and second measurement through holes, the first measurement through holes are used to insert the measurement head of the measuring device to obtain the first measurement value, and the second measurement through holes are used to insert the measurement head of the measuring device to obtain the second measurement value.

[0137] like Figure 1As shown, in some embodiments, there are three first measurement through holes, and the at least three first measurement through holes include a first through hole 10A, a second through hole 10B, and a first through hole 10C. The three first measurement through holes are the three vertices of an equilateral triangle T.

[0138] In some embodiments, there is one second measurement through hole, and the second measurement through hole is the center of the equilateral triangle T.

[0139] like Figure 5 As shown, in some embodiments, there are three first measurement through holes, including at least three first measurement through holes including a first through hole 10A, a second through hole 10B, and a first through hole 10C. The three first measurement through holes are the three vertices of an equilateral triangle T. There is one second measurement through hole 10D, which is the incenter of the equilateral triangle T. In this way, the measurement through holes can be evenly distributed, thereby reducing measurement errors.

[0140] like Figure 6 As shown, in some embodiments, the calibration device 1 further includes a second through hole 20 , and the second through hole 20 is used to insert the test chuck calibration device 6 .

[0141] In some embodiments, the calibration device further includes a third through hole, and the third through hole is used to insert the conductive member.

[0142] like Figure 9 As shown, in some embodiments, the calibration device 1 further includes a second through hole 20 and a third through hole 30 .

[0143] See also Figure 11 , Figure 11 Schematic diagram of the fifth embodiment of the calibration device for the probe card testing motherboard provided in the embodiment of the present application. Figure 11 As shown, in some embodiments, the calibration device 1 further includes a groove 40 for accommodating a second fixing member for fixing the test chuck calibration device 6 when the test chuck calibration device 6 is inserted into the second through hole 20 .

[0144] In some embodiments, the second fixing member is magnetic, and the bracket 63 of the test chuck calibration device 6 is made of a magnetic material. When the test chuck calibration device 6 is inserted into the second through hole 20 and the second fixing member is placed in the groove 40, the bracket 63 is attracted by the second fixing member, thereby securing the test chuck calibration device 6.

[0145] Optionally, the second fixing member is a magnet, and the bracket 63 is made of iron.

[0146] Optionally, the shape of the groove may be any shape, for example, the groove may be circular, square or irregular in shape.

[0147] See also Figure 12 , Figure 12 Schematic diagram of the structure of the calibration system of the probe card test motherboard provided in the embodiment of the present application. Figure 12 As shown, the present application provides a probe card test motherboard calibration system 7, comprising the probe card test motherboard calibration device 1 as described above, a measuring device 4, a first fixture 5, a test chuck calibration device 6, and a second fixture 8. The first fixture 5 is used to fix the measuring device 4 and position the main body of the measuring device 4 on a plane parallel to the calibration device 1.

[0148] In summary, the calibration method for a probe card testing motherboard provided in the embodiment of the present application has the following advantages: 1. By controlling the first fixing member to drive the measuring head of the measuring device to insert into at least three first through holes of the calibration device and obtain the first measurement value, the leveling mechanism is controlled based on all the first measurement values to adjust the probe card test motherboard to be parallel to the test chuck, which can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the distortion of test results or damage to the probe card when the test chuck is used to test the probe card in the future.

[0149] 2. When the difference between the second measurement value and the calibration measurement value is less than the first preset difference, it is determined that the probe card test motherboard is parallel to the test chuck. Otherwise, based on all the first measurement values and the second measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck, thereby ensuring that the probe card test motherboard is adjusted to be parallel to the test chuck.

[0150] 3. By determining the relative position of the probe and the reference position point of the test chuck, when the test chuck is moved during the test process and the probe is used to test the probe to be tested on the probe card, the probe of the test device can be accurately aligned with the probe to be tested on the probe card, thereby improving the accuracy of the test.

[0151] 4. By determining the relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the test chuck based on the second movement data and the preset standard length, when the test chuck is moved during the test process and the probe is used to test the probe to be tested of the probe card, the probe of the test device can be further accurately aligned with the probe to be tested of the probe card, thereby further improving the accuracy of the test.

[0152] See also Figure 13 , Figure 13 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 13 As shown, the electronic device 400 includes: one or more processors 410 and a memory 420, Figure 13 A processor 410 is taken as an example.

[0153] In some embodiments, the processor 410 and the memory 420 may be connected via a bus or other means. Figure 13 The bus connection is taken as an example.

[0154] In some embodiments, the processor 410, a calibration device for a probe card test motherboard includes a main body and at least three first through holes arranged on the main body, the first through holes being used to insert a measuring head of a measuring device; a calibration method for the probe card test motherboard includes: when the probe card test motherboard on which the probe card and the calibration device are installed is fixed on a leveling mechanism of a probe test system, and the measuring device is fixed to a first fixing member, controlling the first fixing member to drive the measuring head of the measuring device to be inserted into a first through hole, wherein the first fixing member is used to make the main body of the measuring device located on a plane parallel to the calibration device; controlling the movement of a test chuck of a test device of the probe test system so that the test chuck contacts the measuring head and causes the measuring head to be displaced; obtaining a first measurement value of the measuring device; controlling the first fixing member to drive the measuring head of the measuring device to be inserted into at least two other first through holes in sequence, and obtaining multiple first measurement values of the measuring device in sequence; and controlling the leveling mechanism based on all the first measurement values to adjust the probe card test motherboard to be parallel to the test chuck.

[0155] In some embodiments, memory 420, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules for the probe card motherboard calibration method in the embodiments of the present application. Processor 410 executes the non-volatile software programs, instructions, and modules stored in memory 420 to execute various functional applications and data processing of electronic device 400, thereby implementing the probe card motherboard calibration method in the above-described method embodiment.

[0156] In some embodiments, the memory 420 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device 400, etc. In addition, the memory 420 may include a high-speed random access memory and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 420 may optionally include a memory remotely located relative to the processor 410, and these remote memories may be connected to the controller via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0157] In some embodiments, one or more modules are stored in the memory 420, and when executed by one or more processors 410, the calibration method of the probe card testing motherboard in any of the above method embodiments is executed, for example, the calibration method described above is executed. Figure 1 Method steps S100 to S500.

[0158] Please refer to Figure 14 , Figure 14 The computer-readable storage medium 500 stores program code 510, which can be called by a processor to execute the calibration method for testing a motherboard with a probe card as described in the above method embodiment.

[0159] The computer-readable storage medium 500 can be an electronic memory such as flash memory, electrically erasable programmable read-only memory (EEPROM), a hard disk, or read-only memory (ROM). Alternatively, the computer-readable storage medium includes non-volatile computer-readable media. The computer-readable storage medium 500 has storage space for program code that executes any of the steps in the above-described method for calibrating a motherboard using a probe card. This program code can be read from or written to one or more computer program products. The program code can be compressed, for example, in a suitable format.

[0160] The present application also provides a computer program product, including a computer program, which implements the above-mentioned calibration method for testing a motherboard with a probe card when executed by a processor.

[0161] In summary, the present application provides a calibration method, device and system for a probe card test motherboard, the calibration method of the probe card test motherboard comprising: the calibration device of the probe card test motherboard comprises a main body and at least three first through holes arranged on the main body, the first through holes being used to insert a measuring head of a measuring device; the calibration method of the probe card test motherboard comprises: when the probe card test motherboard on which the probe card and the calibration device are installed is fixed on the leveling mechanism of the probe test system, and the measuring device is fixed on the first fixing member, controlling the first fixing member to drive the measuring head of the measuring device to be inserted into a first through hole, wherein the first fixing member is used to make the main body of the measuring device located on a plane parallel to the calibration device; controlling the movement of the test chuck of the test device of the probe test system so that the test chuck contacts the measuring head and causes the measuring head to be displaced; obtaining a first measurement value of the measuring device; controlling the first fixing member to drive the measuring head of the measuring device to be inserted into the other at least two first through holes in sequence, and obtaining multiple first measurement values of the measuring device in sequence; and controlling the leveling mechanism based on all the first measurement values to adjust the probe card test motherboard to be parallel to the test chuck. The present application controls the first fixing member to drive the measuring head of the measuring device to insert into at least three first through holes of the calibration device and obtain the first measurement value, and controls the leveling mechanism based on all the first measurement values to adjust the probe card test motherboard to be parallel to the test chuck, which can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the distortion of test results or damage to the probe card when the test chuck is used to test the probe card in the future.

[0162] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A calibration method for a probe card testing motherboard, characterized in that: The calibration device for testing a motherboard with a probe card comprises a main body and at least three first through holes provided on the main body, wherein the first through holes are used for inserting a measuring head of a measuring device; The calibration method of the probe card testing motherboard includes: When the probe card test motherboard on which the probe card and the calibration device are mounted is fixed to the leveling mechanism of the probe test system, and the measuring device is fixed to the first fixing member, controlling the first fixing member to drive the measuring head of the measuring device to insert into one of the first through holes, wherein the first fixing member is used to position the main body of the measuring device on a plane parallel to the calibration device; controlling the movement of a test chuck of a test device of the probe test system so that the test chuck contacts the measuring head and causes the measuring head to be displaced; obtaining a first measurement value of the measuring device; controlling the first fixing member to drive the measuring head of the measuring device to sequentially insert into the other at least two first through holes, and sequentially obtaining a plurality of first measurement values of the measuring device; The leveling mechanism is controlled based on all the first measurement values to adjust the probe card test mother board to be parallel to the test chuck.

2. The calibration method for testing a motherboard using a probe card according to claim 1, wherein: The calibration device further comprises a second through hole for inserting a test chuck calibration device, wherein the test chuck calibration device comprises a calibration needle. After controlling the leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, the method further includes: When the test chuck calibration device is inserted into the second through hole, controlling the visual detection component of the test device to obtain a needle tip image of the calibration needle; controlling the movement of the test chuck based on the needle tip image so that the probe of the test device contacts the calibration needle and the probe of the test device penetrates the test chuck; acquiring first movement data of the test chuck when a first electrical signal indicating that the probe of the test device has contacted the calibration pin is detected; The relative position of the probe and a reference position point of the test chuck is determined based on the first movement data.

3. The calibration method for testing a motherboard using a probe card according to claim 2, wherein: The calibration device further includes a third through hole. Before controlling the visual inspection component of the test device to acquire the needle tip image of the calibration needle when the test chuck calibration device is inserted into the second through hole, the method further includes: When the conductive member is inserted into the third through hole, the test chuck is controlled to move so that the probe of the test device contacts the conductive member, and the length of the conductive member extending beyond the surface of the probe card test motherboard facing the test chuck is a preset standard length; acquiring second movement data of the test chuck when a second electrical signal indicating that the surface of the test chuck has contacted the conductive member is detected; A relative distance between a surface of the test chuck and a surface of the probe card test mother board facing the test chuck is determined based on the second movement data and the preset standard length.

4. The calibration method for testing a motherboard using a probe card according to claim 1, wherein: The step of controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values comprises: Calculate a calibration measurement value based on all the first measurement values and a preset calculation method; The leveling mechanism is controlled based on the calibration measurement value to adjust the probe card test mother board to be parallel to the test chuck.

5. The calibration method for testing a motherboard using a probe card according to claim 4, wherein: The at least three first through holes include at least three first measurement through holes and a second measurement through hole. The first measurement through holes are used to insert a measurement head of the measurement device to obtain the first measurement values. After controlling the leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, the method further includes: Controlling the first fixing member to drive the measuring head of the measuring device to insert into the second measuring through hole; obtaining a second measurement value of the measuring device; When the difference between the second measurement value and the calibration measurement value is less than a first preset difference, it is determined that the probe card test motherboard is parallel to the test chuck; otherwise, based on all the first measurement values and the second measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck.

6. A calibration device for a probe card testing motherboard, applied to the calibration method for a probe card testing motherboard according to any one of claims 1 to 5, characterized in that: The calibration device includes a main body and at least three first through holes provided on the main body, wherein the first through holes are used for inserting a measuring head of a measuring device.

7. The calibration device for testing a motherboard using a probe card according to claim 6, wherein: The at least three first through holes include at least three first measurement through holes and second measurement through holes, wherein the first measurement through holes are used to insert a measurement head of the measurement device to obtain a first measurement value, and the second measurement through holes are used to insert a measurement head of the measurement device to obtain a second measurement value; There are three first measurement through holes, and the three first measurement through holes are three vertices of an equilateral triangle; There is one second measuring through hole, and the second measuring through hole is the center of the equilateral triangle.

8. The calibration device for testing a motherboard using a probe card according to claim 7, wherein: The calibration device further comprises a second through hole, wherein the second through hole is used for inserting the test chuck calibration device; and / or The calibration device further includes a third through hole, wherein the third through hole is used for inserting a conductive member.

9. The calibration device for testing a motherboard using a probe card according to claim 8, wherein: The calibration device further includes a groove for accommodating a second fixing member, and the second fixing member is used to fix the test chuck calibration device when the test chuck calibration device is inserted into the second through hole.

10. A calibration system for a probe card test motherboard, comprising a calibration device for a probe card test motherboard as described in any one of claims 6 to 9, a measuring device, a first fixing member, a test chuck calibration device, and a second fixing member, wherein the measuring device comprises a main body and a measuring head, the first fixing member is used to fix the measuring device and make the main body of the measuring device located on a plane parallel to the calibration device, the test chuck calibration device comprises a calibration needle, and the second fixing member is used to fix the test chuck calibration device when the test chuck calibration device is inserted into the second through hole of the calibration device.

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