Probe station and test system

Abstract

The invention relates to the technical field of semiconductor test equipment, and provides a probe station and a test system.The probe station comprises a test frame, a slide holder module, a probe module and an image acquisition module, the probe station comprises a frame body and a mounting table which are integrally formed, the frame body is provided with a through containing cavity in the Z-axis direction, the mounting table is provided with a through groove communicated with the containing cavity, and the through groove is communicated with the mounting table; the mounting table is positioned on the upper side of the frame body and partially covers the accommodating cavity; the slide holder module is located in the accommodating cavity, the slide holder module comprises a first driving assembly and a slide holder, the first driving assembly is connected with the frame body, and the slide holder is connected with the first driving assembly; the probe module comprises a second driving assembly and a probe, the second driving assembly is connected with the mounting table, and the probe is connected with the second driving assembly; the image acquisition module is connected with the mounting table and comprises an acquisition part, and the acquisition part is located above the through groove. The test system comprises at least two probe stations. According to the probe station and the test system, the test precision and reliability can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor testing equipment, and in particular to a probe station and a testing system. Background Art

[0002] In the field of semiconductor testing, probe station probes are typically used to contact the electrodes of wafer die to perform power-on testing of the die. This allows for the identification and elimination of substandard die during the wafer manufacturing phase, thereby improving packaging yield. However, current probe station test fixtures typically utilize a split connection structure, which is susceptible to slight movement or deformation under external stimulation or impact, resulting in misalignment between the probe and electrode contact position, and poor test accuracy and reliability. Summary of the Invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a probe station that can improve test accuracy and reliability.

[0004] The present application also proposes a testing system having the above-mentioned probe station.

[0005] The probe station according to the embodiment of the present application includes a test frame, a slide stage module, a probe module and an image acquisition module; The test frame includes an integrally formed frame body and a mounting platform. Along the Z-axis direction, the frame body is provided with a through accommodating cavity, and the mounting platform is provided with a through slot. The mounting platform is located on the upper side of the frame body and partially covers the accommodating cavity, and the through slot is connected to the accommodating cavity. The slide stage module is located in the accommodating cavity. The slide stage module includes a first drive component and a slide stage. The first drive component is connected to the frame. The slide stage is connected to the output end of the first drive component. The first drive component is used to drive the slide stage to move. The probe module includes a second drive assembly and a probe, wherein the second drive assembly is connected to the mounting platform, and the probe is connected to the output end of the second drive assembly. The second drive assembly is used to drive the probe to move along the Z-axis direction so that the probe can enter or exit the accommodating cavity through the through slot; The image acquisition module is connected to the mounting platform. The image acquisition module includes an acquisition part, which is located above the through slot.

[0006] According to the probe station of the embodiment of the present application, there are at least the following beneficial effects: the wafer stage module can be installed in the accommodating cavity from the bottom of the accommodating cavity, the wafer stage is used to carry the wafer, the first drive component is used to drive the wafer stage to move in the accommodating cavity to transport the wafer to the bottom of the through slot, and the second drive component is used to drive the probe to extend into the accommodating cavity through the through slot, so that the probe can contact the wafer on the wafer stage for testing, and at the same time, the acquisition unit can perform image acquisition on the wafer through the through slot. Based on this, the wafer stage module is installed on the frame, the probe module and the image acquisition module are installed on the mounting table, and the frame and the mounting table are integrally formed, so that the test frame can more effectively resist the slight movement or deformation caused by external excitation, vibration and other factors. Therefore, during the test operation, the relative positions of the wafer stage module, the probe module and the image acquisition module are more determined, and then, it is convenient for stable image acquisition and precise contact between the probe and the electrode, which is beneficial to improving the test accuracy and reliability.

[0007] According to some embodiments of the present application, the first driving component includes an X-axis moving platform and a Y-axis moving platform. The carrier stage is connected to the X-axis moving platform. Along the X-axis direction, the X-axis moving platform is movably connected to the Y-axis moving platform. Along the Y-axis direction, the Y-axis moving platform is movably connected to the frame. Along the Z-axis direction, the X-axis moving platform is located between the Y-axis moving platform and the carrier stage. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

[0008] According to some embodiments of the present application, along the X-axis direction, two opposite sides of the Y-axis movable platform are movably connected to two opposite sides of the frame in a one-to-one correspondence.

[0009] According to some embodiments of the present application, the first driving component includes an X-axis moving platform, and the carrier stage is rotatably connected to the X-axis moving platform around the Z-axis direction.

[0010] According to some embodiments of the present application, the probe station includes two probe modules, which are spaced apart at both ends of the through slot along the X-axis direction, where the X-axis direction is perpendicular to the Z-axis direction.

[0011] According to some embodiments of the present application, the image acquisition module also includes an image acquisition seat and a collector. The image acquisition seat is connected to the mounting platform, and the collector is connected to the image acquisition seat. The collector includes an acquisition part, and the collector is extended along the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction.

[0012] According to some embodiments of the present application, the probe station further includes a test module, the test module is connected to the frame, the first drive assembly is provided with a test channel along the Z-axis direction, and the slide stage covers a side of the test channel away from the test module; Among them, the slide stage is a transparent structure.

[0013] According to some embodiments of the present application, the test stand also includes a support structure, the support structure includes a first link, a second link, a third link, a fourth link and a connecting rod, one end of the connecting rod is connected to the first link and the second link, and the other end of the connecting rod is connected to the third link and the fourth link, the first link, the second link, the third link and the fourth link are all connected to the mounting platform at one end away from the connecting rod, and the first link and the third link are arranged at an angle relative to the upper side of the mounting platform, and the second link and the third link are perpendicular to the upper side of the mounting platform.

[0014] According to some embodiments of the present application, the test stand also includes a docking portion, which is connected to the upper side of the frame and / or the mounting platform, and the docking portion extends toward the side away from the mounting platform. A docking hole is provided on the lower side of the frame, and the projection area of the docking portion along the Z-axis direction is arranged one-to-one corresponding to the docking hole.

[0015] A test system according to an embodiment of the present application includes at least two probe stations according to any one of the above embodiments; Among them, along the Z-axis direction, the probe stations are stacked; And / or, the probe stations are arranged adjacent to each other vertically along the Z-axis direction.

[0016] The test system according to the embodiment of the present application has at least the following beneficial effects: the probe stations can be flexibly stacked or arranged adjacent to each other to better adapt to different test environments, and the test system is more compact, which is beneficial to saving test space.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present application is further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the structure of the probe station according to an embodiment of the present application; Figure 2 A side view of the probe station according to an embodiment of the present application; Figure 3 This is a schematic diagram of the structure of the test stand according to the embodiment of the present application; Figure 4 This is a structural diagram of the wafer stage module according to an embodiment of the present application; Figure 5 This is a schematic structural diagram of the probe module according to an embodiment of the present application; Figure 6 This is a front view of the probe station according to an embodiment of the present application; Figure 7 This is a schematic structural diagram of the probe station from another perspective of an embodiment of the present application; Figure 8This is a schematic diagram of the structure of the test system of the embodiment of the present application.

[0019] Reference numerals: test stand 100 , frame 110 , accommodating cavity 111 , docking hole 112 , cavity opening 113 , mounting platform 120 , through slot 121 , mounting slot 122 , supporting structure 130 , first connecting rod 131 , second connecting rod 132 , third connecting rod 133 , fourth connecting rod 134 , connecting rod 135 , docking portion 140 ; The wafer stage module 200, the first driving assembly 210, the X-axis moving platform 211, the Y-axis moving platform 212, the test channel 213, and the wafer stage 220; Probe module 300, second driving assembly 310, probe 320; Image acquisition module 400, image acquisition seat 410, collector 420, acquisition unit 421; Test module 500. DETAILED DESCRIPTION

[0020] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0021] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0022] In the description of this application, "several" means more than one, "plurality" means two or more, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.

[0023] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0024] In the description of this application, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0025] The following describes the embodiments of the present application in conjunction with the accompanying drawings: refer to Figures 1 to 5 According to an embodiment of the present application, the probe station includes a test frame 100, a wafer stage module 200, a probe module 300, and an image acquisition module 400. The test frame 100 includes an integrally formed frame body 110 and a mounting platform 120. Along the Z-axis direction, the frame body 110 is provided with a through accommodating cavity 111, and the mounting platform 120 is provided with a through slot 121. The mounting platform 120 is located on the upper side of the frame body 110 and covers a portion of the accommodating cavity 111. The through slot 121 is connected to the accommodating cavity 111. The wafer stage module 200 is located in the accommodating cavity. The wafer stage module 200 includes a first drive assembly 210 and a wafer stage 220. The first drive assembly 210 is connected to the frame body 110. The wafer stage 220 is connected to the output end of the first drive assembly 210. The wafer stage 220 is used to carry a workpiece to be tested (e.g., a wafer). The first drive assembly 210 is used to drive the wafer stage 220 to move to adjust the position of the wafer stage 220. The probe module 300 includes a second drive component 310 and a probe 320. The second drive component 310 is connected to the mounting table 120. The probe 320 is connected to the output end of the second drive component 310. The second drive component 310 is used to drive the probe 320 to move along the Z-axis direction so that the probe 320 can enter or exit the accommodating cavity 111 through the through slot 121. The image acquisition module 400 is connected to the mounting table 120. The image acquisition module 400 includes an acquisition part 421, which is located above the through slot 121.

[0026] Compared with the split test frame structure, the frame 110 and the mounting platform 120 of the test frame 100 of the present application are integrally formed, which can effectively resist the slight movement or deformation caused by external excitation, vibration and other factors, so that the relative positions of the wafer stage module 200, the probe module 300 and the image acquisition module 400 are more stable and determined during the working process. During the test process, the wafer stage module 200, the probe module 300 and the image acquisition module 400 cooperate with the integrally formed frame 110 and the mounting platform 120. On the one hand, the stable frame 110 structure provides a guarantee for the contact accuracy of the probe 320 and the wafer electrode and the positioning accuracy of the image acquisition. On the other hand, the modules work together based on a stable relative position relationship, which is beneficial to improving the stability of the electrical signal transmission and the accuracy of the image auxiliary data during the probe station test, and is beneficial to improving the test accuracy and reliability of the probe station.

[0027] refer to Figures 1 to 5 Specifically, along the Z-axis direction, the mounting table 120 covers a portion of the upper side of the accommodating cavity 111, and the wafer can be conveniently taken and placed in the area of the accommodating cavity 111 not covered by the mounting table 120. The wafer carrier module 200 can be installed in the accommodating cavity 111 at the lower side of the accommodating cavity 111, ensuring the assembly between the wafer carrier module 200 and the integrated molded test frame 100. When the wafer core is powered on for testing, the stage 220 carries the wafer, and the first drive component 210 drives the stage 220 to move along the X-axis direction and / or the Y-axis direction, moves the stage 220 to the bottom of the mounting table 120, and aligns the part of the wafer to be tested with the through slot 121, so that the second drive component 310 drives the probe 320 to move along the Z-axis, and the probe 320 enters the accommodating cavity 111 through the through slot 121 and contacts the electrode of the wafer core, wherein the stage module 200 can be a structure composed of a slide block mechanism and a wafer carrier plate, and the slide block mechanism can provide a stable moving guide for the wafer carrier plate, and the power source of the first drive component 210 and the second drive component 310 can be a combination structure of a motor and a screw nut pair, or a drive structure composed of a cylinder or an electric push rod.

[0028] The acquisition unit 421 can be an acquisition structure composed of an industrial camera and a lens. When the position of the above-mentioned stage 220 and the position of the probe 320 are adjusted, the image information collected by the acquisition unit 421 can provide real-time position feedback for the position adjustment of the stage 220 and the probe 320, which is beneficial for the operator or the control system to calibrate the position of the stage 220 and the probe 320, so that the contact position of the probe 320 and the wafer electrode is more in line with the test requirements, and the movement positioning of the stage 220 is also more accurate.

[0029] It should be noted that the Z-axis direction can be a vertical direction. Along the Z-axis direction, each structure can include relative upper and lower sides, top and bottom. The X-axis direction and the Y-axis direction are both horizontal directions. The X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

[0030] refer to Figure 3 and Figure 4 In some embodiments, the first drive assembly 210 includes an X-axis movable platform 211 and a Y-axis movable platform 212, which are used to adjust the position of the carrier stage 220 in a planar direction. The carrier stage 220 is connected to the X-axis movable platform 211. Along the X-axis direction, the X-axis movable platform 211 is movably connected to the Y-axis movable platform 212. Along the Y-axis direction, the Y-axis movable platform 212 is movably connected to the frame 110. Along the Z-axis direction, the X-axis movable platform 211 is located between the Y-axis movable platform 212 and the carrier stage 220. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

[0031] Specifically, one of the Y-axis movable platform 212 and the frame 110 is provided with a guide groove, and the other corresponding position is provided with a guide rail. The guide rail is slidably arranged in the guide groove of the Y-axis movable platform 212 to form a sliding guide fit. At the same time, a motor and a screw-nut transmission mechanism are connected to the frame 110, and the nut pair of the screw-nut transmission mechanism is fixedly connected to the Y-axis movable platform 212. When the motor is started and drives the screw to rotate, the screw-nut pair generates a linear movement along the Y-axis direction, thereby driving the Y-axis movable platform 212 to move along the Y-axis direction relative to the frame 110. Similarly, the screw-nut mechanism is also used to achieve relative movement between the X-axis movable platform 211 and the Y-axis movable platform 212. Specifically, the X-axis movable platform 211 cooperates with the guide groove on the Y-axis movable platform 212 through the guide rail, or the Y-axis movable platform 212 cooperates with the guide groove on the X-axis movable platform 211 through the guide rail, and relative displacement in the X-axis direction is achieved through the screw-nut transmission.

[0032] Thus, when the Y-axis movable platform 212 moves relative to the frame 110, since the wafer carrier 220 is connected to the X-axis movable platform 211, and the X-axis movable platform 211 is connected to the Y-axis movable platform 212, the wafer carrier 220 can be driven to adjust its position along the Y-axis direction. When the X-axis movable platform 211 moves relative to the Y-axis movable platform 212, the position of the wafer carrier 220 can be adjusted along the X-axis direction. Through the coordinated action of the X-axis movable platform 211 and the Y-axis movable platform 212, the planar position of the wafer carrier 220 can be adjusted, so that the position to be tested of the wafer carried by the wafer carrier 220 is aligned with the through slot 121 on the mounting platform 120, thereby realizing the detection of wafer core particles at different positions on the wafer.

[0033] refer to Figure 3 and Figure 4In other embodiments, the frame 110 is provided with a left side wall and a right side wall opposite to each other along the X-axis or Y-axis direction. At least one side wall (e.g., the left side wall or the right side wall) of the frame 110 is provided with a cavity 113 communicating with the accommodating cavity 111. The size of the cavity 113 is adapted to the outer shape of the stage module 200, allowing the stage module 200 to enter and exit the accommodating cavity 111 through the cavity 113. Specifically, the stage module 200 includes a stage 220, an X-axis movable platform 211, and a Y-axis movable platform 212. During assembly, the stage 220 can be first connected to the X-axis movable platform 211, and the X-axis movable platform 211 can be connected to the Y-axis movable platform 212 to form a complete stage module 200. The stage module 200 can then be moved as a whole into the accommodating cavity 111 through the cavity 113. During the insertion process, the guide rails of the Y-axis movable platform 212 engage with the guide grooves on the frame 110 (or vice versa), thereby firmly securing the stage module 200 within the accommodating cavity 111. When the stage module 200 needs to be maintained or replaced, the entire stage module 200 can be removed from the accommodating cavity 111 through the cavity opening 113.

[0034] In addition, the X-axis moving platform 211 and the Y-axis moving platform 212 work together to drive the wafer carrier 220 to move along the X-axis and / or Y-axis direction, so that the wafer carrier 220 is partially moved out of the accommodating cavity 111 through the cavity opening 113, which facilitates the loading and unloading of wafers.

[0035] refer to Figure 6 In some embodiments, along the X-axis direction, opposite sides of the Y-axis movable platform 212 are movably connected to opposite sides of the frame 110 in a one-to-one correspondence. Specifically, the connection between the Y-axis movable platform 212 and the frame 110 can be achieved via guide grooves and guide rails. Along the X-axis direction, guide rails or guide grooves are provided on the left and right sides of the Y-axis movable platform 212, respectively. Guide grooves or guide rails are correspondingly provided on the left and right walls of the frame 110, so that the guide rails of the Y-axis movable platform 212 slideably engage with the guide grooves connected to the frame 110, or the guide grooves of the Y-axis movable platform 212 slideably engage with the guide rails connected to the frame 110. Consequently, along the Z-axis direction, the guide rail and guide groove matching structure overlaps with the thickness of the Y-axis movable platform 212. That is, the guide rails or guide grooves connected to the frame 110 are directly integrated into the left and right side walls of the Y-axis movable platform 212 within the thickness range of the Z-axis direction, without occupying additional external space along the Z-axis direction. Compared with the Y-axis movable platform 212 being movably connected to the frame 110 along the upper side or the lower side of the Z-axis direction, thickness overlap is avoided, which is beneficial to reducing the overall height of the probe station in the Z-axis direction.

[0036] As a result, the overall height of the probe station is reduced, causing the center of gravity of the entire test system to move downward accordingly, so that the test system can maintain a more stable posture when subjected to external excitation or vibration, reducing the shaking or displacement caused by the high center of gravity, which is beneficial to improving the stability of the position of the wafer stage 220 and the accuracy of the coordination of each module during the test. In addition, when multiple probe stations need to be stacked up and down on the production line, the reduction in the height of a single probe station can significantly reduce the vertical space occupied during stacking, allowing the production line to deploy more equipment within a limited height, which is beneficial to saving production line space.

[0037] refer to Figure 4 In some embodiments, the first driving component 210 includes an X-axis moving platform 211, and the carrier stage 220 is rotatably connected to the X-axis moving platform 211 around the Z-axis direction to realize the rotational movement of the carrier stage 220 around the Z-axis direction, further improving the position adjustment flexibility of the carrier stage 220.

[0038] refer to Figure 4 and Figure 5 Specifically, along the Z-axis, the top surface of the X-axis mobile platform 211 is provided with a circular groove that matches the outer periphery of the stage 220. The bottom area of the stage 220 fits into this circular groove, enabling the stage 220 to rotate about the Z-axis relative to the X-axis mobile platform 211. The outer periphery of the stage 220 is provided with an annular tooth structure. A drive motor is fixedly mounted on the X-axis mobile platform 211, and the motor's output shaft is connected to the outer periphery of the stage 220 via a synchronous belt. The tension of the synchronous belt is adjusted by a tensioning bearing mounted on the X-axis mobile platform to ensure that the belt maintains effective tension during transmission.

[0039] When the motor starts, the driving wheel drives the synchronous belt, which, through meshing, drives the wafer stage 220 to rotate about the Z axis, thereby adjusting the angular position of the wafer on the wafer stage 220. Thus, the position adjustment of the wafer stage 220 includes translational adjustment along the X and Y axes, as well as rotational adjustment about the Z axis. This provides both position and angle adjustment capabilities within a two-dimensional plane, further enhancing the flexibility of the wafer stage 220's position adjustment. This allows the die to be rotated to the optimal angle on the wafer to achieve more accurate alignment with the probes 320 of the probe module 300.

[0040] When the wafer core is powered on for testing, after the stage 220 is adjusted to the target position through the X-axis moving platform 211 and the Y-axis moving platform 212, the angle of the wafer can be further fine-tuned by rotating the stage 220 around the Z-axis so that the electrode of the wafer core is completely aligned with the axis of the probe 320. This is beneficial to improving the stability of electrical signal transmission and the reliability of test results. It can also compensate for slight installation deviations of the wafer through active adjustment, thereby improving the adaptability of the probe station to complex test scenarios.

[0041] refer to Figure 4 In other embodiments, in order to detect the movement and rotational strokes of the stage 220, a photoelectric sensor is provided at the end of the guide rail or around the stage 220. Specifically, the photoelectric sensor includes a transmitter and a receiver, and can adopt a beam-type or reflective structure design: for the detection of linear motion, a photoelectric sensor is installed at the end of the guide rail of the X-axis moving platform 211 or the Y-axis moving platform 212 (i.e., the travel limit position), and the transmitter and the receiver are respectively arranged on both sides of the guide rail or on the same side. When the stage 220 moves to the end of the guide rail along with the moving platform, the edge of the stage 220 or the moving platform triggers the sensor, causing it to generate an electrical signal change. For the detection of rotational stroke, an annular sensing area is provided on the circumferential edge of the stage 220, and a photoelectric sensor is installed on the corresponding X-axis moving platform 211. By detecting the scale or mark in the annular area, real-time monitoring of the rotation angle of the stage 220 is achieved.

[0042] refer to Figure 5 and Figure 6 In some embodiments, the probe station includes two probe modules 300. Along the X-axis direction, the probe modules 300 are spaced apart at both ends of the through slot 121. The X-axis direction is perpendicular to the Z-axis direction. The probes 320 are independently driven and coordinated to facilitate more precise alignment of the probes 320 with the electrodes of the wafer core particles.

[0043] refer to Figures 1 to 5 Specifically, the through slot 121 passes through the mounting table 120 and is connected to the accommodating cavity 111, and is used to expose the wafer on the wafer stage 220. Along the X-axis direction, mounting slots 122 are respectively provided at the left and right ends of the through slot 121. The second driving components 310 of the two probe modules 300 are installed in the above-mentioned mounting slots 122 in a one-to-one correspondence, and each second driving component 310 independently drives a probe 320 to move along the Z-axis direction, so that the position adjustments of the two probes 320 in the Z-axis direction are decoupled from each other (that is, the two probes 320 can have different Z-axis positions) to adapt to the differences in height or spatial position of the wafer core electrode.

[0044] Among them, each second drive assembly 310 includes a drive motor, a conveyor belt, a screw nut mechanism and a probe holder. The drive motor is fixed to the probe holder, the motor output shaft is connected to the driving wheel, and the conveyor belt surrounds the driving wheel and the driven wheel at the end of the screw to form a transmission connection. When the drive motor rotates, the conveyor belt drives the screw to rotate, and the screw nut pair converts the rotational motion into linear motion along the Z axis, thereby driving the probe 320 connected to the nut pair to move up and down independently, realizing the precise adjustment of each Z axis position, which can effectively adapt to the electrode height difference caused by factors such as warping and uneven thickness on the wafer surface.

[0045] The probe holder can adopt a precision slide structure, and its fine-tuning function is realized by a screw micrometer mechanism. The fixed base plate of the precision slide is connected to the bottom of the mounting groove 122, and the sliding table body slides with the fixed base plate through a linear guide rail. The screw micrometer is installed on one side of the fixed base plate, and the end of the screw of the micrometer is fixed to the sliding table body, thereby realizing fine-tuning of the position of the probe 320 along the X-axis direction or the Y-axis direction to compensate for the wafer placement deviation or mechanical assembly error.

[0046] refer to Figures 1 to 4 In some embodiments, the image acquisition module 400 also includes an image acquisition seat 410 and a collector 420. The image acquisition seat 410 is connected to the mounting platform 120, and the collector 420 is connected to the image acquisition seat 410. The collector 420 includes a collection part 421. The collector 420 extends along the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction to reduce the height occupancy of the collector 420 in the Z-axis direction, thereby reducing the overall Z-axis height of the probe station.

[0047] Specifically, the image acquisition seat 410 can adopt a precision slide structure to achieve fine adjustment of the position of the collector 420 along the X-axis and / or Y-axis, so that the collection portion 421 of the collector 420 can be aligned with the through slot 121 along the Z-axis, thereby clearly capturing the wafer image. The collector 420 can be a horizontal CCD (Charge-Coupled Device). When the probe modules 300 are arranged in two intervals along the X-axis, the collector 420 extends along the Y-axis to between the two probe modules 300, so that the collection portion 421 is located in the area between the two probe modules 300, and the probes 320 of the two probe modules 300 are both within the image acquisition range of the collection portion 421.

[0048] During the test, the acquisition unit 421 captures images of the wafer on the stage 220 through the through slot 121, providing visual feedback for the position adjustment of the stage 220 and the probe 320. Since the collector 420 extends along the Y-axis, its own height in the Z-axis direction is significantly reduced, making the center of gravity of the image acquisition module 400 closer to the mounting platform 120, thereby helping to lower the center of gravity position of the probe station as a whole. This design can enhance the stability of the probe station during the test process, reduce the shaking caused by the high center of gravity, and provide a more stable mechanical environment for the contact test between the probe 320 and the wafer.

[0049] refer to Figure 6 and Figure 7 In some embodiments, the probe station further includes a test module 500, which is connected to the frame 110. Along the Z-axis direction, the first drive component 210 is provided with a test channel 213, and the carrier stage 220 covers the side of the test channel 213 away from the test module 500, wherein the carrier stage 220 is configured as a transparent structure. Specifically, along the Z-axis direction, the interior of the first drive component 210 is provided with a through test channel 213, which is perpendicular to the bearing plane of the carrier stage 220, and the carrier stage 220 covers the side of the test channel 213 away from the test module 500, and the carrier stage 220 is configured as a transparent structure, for example, it is made of transparent materials such as glass and quartz to ensure that the detection signal can penetrate the carrier stage 220.

[0050] The test module 500 can be a device with optical or radiographic detection capabilities, such as a spectrometer or radiation testing system. When the wafer stage module 200, driven by the first drive assembly 210, moves directly below the mounting platform 120, the detection signal (such as light or radiation) emitted by the test module 500 travels upward along the Z-axis through the test channel 213 and shines through the transparent wafer stage 220 onto the wafer surface, thereby enabling non-contact testing of the wafer's optical properties, material properties, and other parameters.

[0051] Thus, the probe station of the present application can realize diversified detection of wafers through the cooperation of the test module 500 and the transparent stage 220 without removing the stage 220. Since the stage 220 is made of transparent material and covers the test channel 213, the detection signal does not need to undergo complex optical path adjustment or stage 220 avoidance action, and can directly penetrate the stage 220 to act on the wafer, reducing signal attenuation and position deviation during the detection process, which is beneficial to improving detection efficiency and data accuracy. The setting of the test channel 213 provides a dedicated transmission path for the detection signal, avoids interference with other components, and ensures the stability of the detection process.

[0052] refer to Figure 2 and Figure 3In some embodiments, the test stand 100 further includes a support structure 130, which includes a first link 131, a second link 132, a third link 133, a fourth link 134, and a connecting rod 135. One end of the connecting rod 135 connects the first link 131 and the second link 132, and the other end of the connecting rod 135 connects the third link 133 and the fourth link 134. The first link 131, the second link 132, the third link 133, and the fourth link 134 are separated from the connecting rod 135. One end of the connecting rod 135 is connected to the mounting platform 120, and the first connecting rod 131 and the fourth connecting rod 134 are arranged at an angle relative to the upper side of the mounting platform 120, and the second connecting rod 132 and the third connecting rod 133 are perpendicular to the upper side of the mounting platform 120. The support structure 130 is used to reinforce the mounting platform 120, which is beneficial to increase the deformation resistance of the mounting platform 120. When different probe stations are stacked along the Z-axis direction, the support structure 130 can also support the upper probe station to ensure the stability of the stacking.

[0053] Specifically, the second link 132 and the third link 133 are spaced apart along the X-axis and are both perpendicular to the upper side of the mounting platform 120. Together with the connecting rod 135 and the upper side of the mounting platform 120, they form a rectangular structure. The projection of this rectangular structure along the Y-axis is a rectangle. The first link 131 and the fourth link 134 are arranged obliquely relative to the upper side of the mounting platform 120. That is, the first link 131 extends upward from the upper side of the mounting platform 120 to one end of the connecting rod 135, and the fourth link 134 extends upward from the upper side of the mounting platform 120 to the other end of the connecting rod 135. As a result, the first link 131, the second link 132, and the upper side of the mounting platform 120 form a triangular structure. The third link 133 and the fourth link 134 also form a symmetrical triangular structure with the upper side of the mounting platform 120. The projection of the entire support structure 130 along the Y-axis presents a combination of a rectangle and a triangle.

[0054] Therefore, the combination of triangular and rectangular structures is beneficial to further increase the deformation resistance of the mounting platform 120. Moreover, when multiple probe stations are stacked along the Z-axis direction, the support structure 130 of the lower probe station can be docked with the upper probe station. The inclined first connecting rod 131 and the fourth connecting rod 134 can serve as support fulcrums to evenly transfer the weight of the upper equipment to the frame 110 of the lower probe station, forming a stable mechanical conduction path, avoiding structural shaking or load concentration caused by uneven support during stacking, and ensuring that the test operations of the probe stations on each layer do not interfere with each other.

[0055] refer to Figure 6 and Figure 7In some embodiments, the test stand 100 further includes a docking portion 140. Along the Z-axis direction, the docking portion 140 is connected to the upper side of the frame 110 and / or the mounting platform 120, and the docking portion 140 extends toward a side away from the mounting platform 120. A docking hole 112 is provided on the lower side of the frame 110. The projection area of the docking portion 140 along the Z-axis direction is arranged one-to-one corresponding to the docking hole 112. The docking portion 140 is used to realize a stacked arrangement between different probe stations.

[0056] Specifically, the docking portion 140 and the frame 110 and / or the mounting platform 120 can be integrally formed, and the docking portion 140 can adopt a plurality of column structures, and the cross-sectional shape of the column can be a regular geometric shape such as a circle or a square, so as to facilitate cooperation with the docking hole 112. When two probe stations need to be stacked along the Z-axis direction, the docking portion 140 (column structure) of the upper probe station can be aligned with the docking hole 112 of the lower probe station, so that a part of the column is embedded in the docking hole 112 to form a mechanical positioning fit. Ensuring the accuracy of the relative positions of the upper and lower probe stations when stacked can effectively improve the convenience and stability of the stacked arrangement of the probe stations. At the same time, the docking portion 140 also has a supporting function so that the weight of the upper probe station can be transferred to the frame 110 of the lower probe station through the column, reducing the overall shaking or deformation of the equipment after stacking, and ensuring that the probe stations on each layer do not interfere with each other during testing operations.

[0057] refer to Figures 1 to 8 According to the test system of the embodiment of the present application, the probe stations include at least any one of the above-mentioned embodiments, and the probe stations are stacked along the Z-axis direction, and / or the probe stations are arranged adjacent to each other vertically along the Z-axis direction. Thus, in the test system, the probe stations can be flexibly stacked or arranged adjacent to each other, so as to better adapt to different test environments, and the test system is more compact, which is beneficial to saving test space.

[0058] Specifically, along the Z-axis direction, multiple probe stations can be stacked by cooperating with the docking portion 140 and the docking hole 112 on the test frame 100. For example, the docking portion 140 of the lower probe station is embedded in the docking hole 112 of the upper probe station to form mechanical positioning and support. Vertically along the Z-axis direction (along the X-axis direction and / or the Y-axis direction), adjacent probe stations can be connected through the connecting structure on the side of the frame 110 (such as bolts, snaps, etc.), so that the probe stations are closely arranged in the horizontal direction.

[0059] refer to Figures 1 to 8 In other embodiments, the test system may further include a material transfer device, which is used to realize automatic loading and unloading operations of the probe station. Specifically, the material transfer device may adopt a structure such as a rail trolley, a trackless trolley, an overhead crane system or a manipulator.

[0060] The embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the present application is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A probe station, characterized in that include: The test stand comprises an integrally formed frame body and a mounting platform, wherein the frame body is provided with a through accommodating cavity along the Z-axis direction, and the mounting platform is provided with a through slot, the mounting platform is located on the upper side of the frame body and partially covers the accommodating cavity, and the through slot is connected to the accommodating cavity; a stage module located in the accommodating cavity, the stage module comprising a first drive assembly and a stage, the first drive assembly being connected to the frame, the stage being connected to an output end of the first drive assembly, and the first drive assembly being used to drive the stage to move; The probe module includes a second drive assembly and a probe, wherein the second drive assembly is connected to the mounting platform, and the probe is connected to the output end of the second drive assembly, and the second drive assembly is used to drive the probe to move along the Z-axis direction so that the probe can enter or exit the accommodating cavity through the through slot; An image acquisition module is connected to the mounting platform. The image acquisition module includes an acquisition portion, and the acquisition portion is located above the through slot.

2. The probe station according to claim 1, characterized in that The first driving component includes an X-axis moving platform and a Y-axis moving platform. The carrier stage is connected to the X-axis moving platform. Along the X-axis direction, the X-axis moving platform is movably connected to the Y-axis moving platform. Along the Y-axis direction, the Y-axis moving platform is movably connected to the frame. Along the Z-axis direction, the X-axis moving platform is located between the Y-axis moving platform and the carrier stage. The X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

3. The probe station according to claim 2, characterized in that Along the X-axis direction, two opposite sides of the Y-axis movable platform are movably connected to two opposite sides of the frame in a one-to-one correspondence.

4. The probe station according to claim 1, characterized in that The first driving component includes an X-axis moving platform, and the carrier stage is rotatably connected to the X-axis moving platform around the Z-axis direction.

5. The probe station according to claim 1, characterized in that The probe station includes two probe modules. The probe modules are spaced apart and arranged at both ends of the through slot along an X-axis direction. The X-axis direction is perpendicular to the Z-axis direction.

6. The probe station according to claim 1, characterized in that The image acquisition module also includes an image acquisition seat and a collector. The image acquisition seat is connected to the mounting platform, and the collector is connected to the image acquisition seat. The collector includes the acquisition part, and the collector is extended along the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction.

7. The probe station according to claim 1, characterized in that The probe station further includes a test module connected to the frame, and the first drive assembly is provided with a test channel along the Z-axis direction, and the slide stage covers a side of the test channel away from the test module; Wherein, the slide stage is a transparent structure.

8. The probe station according to claim 1, characterized in that The test stand also includes a supporting structure, which includes a first link, a second link, a third link, a fourth link and a connecting rod, one end of the connecting rod connects the first link and the second link, and the other end of the connecting rod connects the third link and the fourth link, and the ends of the first link, the second link, the third link and the fourth link facing away from the connecting rod are all connected to the mounting platform, and the first link and the third link are arranged obliquely relative to the upper side of the mounting platform, and the second link and the third link are perpendicular to the upper side of the mounting platform.

9. The probe station according to claim 1, characterized in that The test stand also includes a docking portion, which is connected to the upper side of the frame and / or the mounting platform, and extends toward a side away from the mounting platform. A docking hole is provided on the lower side of the frame, and the projection area of the docking portion along the Z-axis direction is arranged in a one-to-one correspondence with the docking hole.

10. A testing system, characterized in that: comprising at least two probe stations according to any one of claims 1 to 9; Wherein, along the Z-axis direction, the probe stations are stacked; And / or, the probe stations are arranged adjacent to each other vertically along the Z-axis direction.

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