Optical module and forming method thereof, and optical module assembly and forming method thereof

Abstract

The invention provides an optical module and a forming method thereof, and an optical module assembly and a forming method thereof. The optical module comprises a shell, a circuit board, a chip assembly and an electric connector, a containing cavity is formed in the shell, and the length of the shell in the first direction is smaller than that in the second direction; the circuit board is positioned in the accommodating cavity; the chip assembly is positioned in the accommodating cavity and is coupled with the circuit board; the electric connector is located outside the shell and coupled with the circuit board, and the length of the electric connector in the first direction is smaller than the length of the electric connector in the second direction; the first direction and the second direction are parallel to the circuit board, and the first direction and the second direction are different. Based on the above technical scheme, the longer edge of the electric connector and the longer edge of the shell are arranged in parallel, and the shorter edge of the electric connector and the shorter edge of the shell are arranged in parallel, so that the longer edge of the electric connector can be prevented from limiting the size of the shorter edge of the shell, and the size of the optical module is reduced.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic communication technology, and in particular to an optical module and a forming method thereof, an optical module assembly and a forming method thereof. Background Art

[0002] Optical modules are common devices in the field of optoelectronic communications. Optical modules include a shell, a chip assembly, and an electrical connector. The electrical connector is arranged on the surface of the shell, and the chip assembly is arranged inside the shell and coupled to the electrical connector. The electrical connector has a signal transmission pin. The electrical connector receives an electrical signal from a first target device through the signal transmission pin, and the chip assembly converts the electrical signal into an optical signal and transmits it to a second target device. Alternatively, the chip assembly receives an optical signal from a second target device and converts it into an electrical signal, and transmits the electrical signal to the first target device through the signal transmission pin of the electrical connector. The optical module can be used to realize information interaction between the first target device and the second target device.

[0003] In the prior art, the size of the optical module is too large. Summary of the Invention

[0004] The present application proposes an optical module and a method for forming the same, an optical module assembly and a method for forming the same, in order to solve the technical problem of excessively large optical modules in the prior art.

[0005] In a first aspect, an embodiment of the present application provides an optical module, comprising:

[0006] a housing, wherein the housing has a receiving cavity therein, and the length of the housing along the first direction is shorter than the length along the second direction;

[0007] A circuit board is located in the accommodating cavity;

[0008] a chip assembly, located in the accommodating cavity and coupled to the circuit board;

[0009] An electrical connector is located outside the housing and coupled to the circuit board, wherein the length of the electrical connector along the first direction is less than the length along the second direction; the first direction and the second direction are parallel to the circuit board, and the first direction and the second direction are different.

[0010] In some embodiments, the shell includes a matching top cover and a base, and the accommodating cavity is located between the top cover and the base; the base has an accommodating groove that passes through the base along the thickness direction (Z) of the optical module, and the electrical connector is located in the accommodating groove.

[0011] In some embodiments, the length of the housing along the first direction ranges from 18 mm to 20 mm.

[0012] In some embodiments, the length of the housing along the second direction ranges from 30 mm to 33.4 mm.

[0013] In some embodiments, the length of the electrical connector along the first direction is 9 mm.

[0014] In some embodiments, the length of the electrical connector along the second direction is 20.5 mm.

[0015] In some embodiments, the top cover has a first fixing hole, and the base has a second fixing hole corresponding to the first fixing hole, and the first fixing hole and the second fixing hole are respectively plugged into and matched with the connector.

[0016] In some embodiments, the electrical connector has a first surface, the first surface has a connecting portion, the connecting portion is coupled to the chip assembly through the circuit board, the connecting portion includes multiple groups of differential signal pins and multiple power pins, and the distance from the differential signal pins to the power pins is greater than a first distance threshold.

[0017] In some embodiments, the first distance threshold is 1.0 mm.

[0018] In some embodiments, each group of differential signal pins in the plurality of groups of differential signal pins includes a positive phase pin and a negative phase pin of the same channel; and a distance between the positive phase pin and the negative phase pin of the same channel is less than a second distance threshold.

[0019] In some embodiments, the second distance threshold is 0.3 mm.

[0020] In some embodiments, the connecting portion further comprises: a plurality of ground pins, the connecting portion being arranged in an array along the first direction and the second direction;

[0021] Each group of differential signal pins in the plurality of groups of differential signal pins is adjacent to the ground pin on at least one side in the first direction and at least one side in the second direction.

[0022] In some embodiments, the first surface includes a first region and a second region, and a distance between the first region and the second region is greater than a third distance threshold;

[0023] The multiple groups of differential signal pins include multiple groups of first function pins and multiple groups of second function pins. The multiple groups of first function pins are located in the first area, and the multiple groups of second function pins are located in the second area.

[0024] In some embodiments, the signal transmitted through the first function pin has a first power, the signal transmitted through the second function pin has a second power, and the first power is different from the second power.

[0025] In some embodiments, the circuit board comprises:

[0026] A substrate comprising a first functional surface and a second functional surface;

[0027] a first port structure located on the first functional surface, a second port structure located on the second functional surface, and a wiring structure located within the substrate, wherein the wiring structure is electrically connected between the first port structure and the second port structure, the first port structure is coupled to the chip assembly, and the second port structure corresponds to the connecting portion;

[0028] The second port structure includes a first port and a second port, the first port is coupled to the first function pin, and the second port is coupled to the second function pin;

[0029] The wiring structure includes a plurality of wirings, each wiring is coupled between at least one first port and at least one second port, and a minimum distance between the wirings is greater than a fourth distance threshold.

[0030] In some embodiments, the chip assembly includes multiple sets of optical chip assemblies and multiple sets of electrical chip assemblies.

[0031] In a second aspect, an embodiment of the present application provides an optical module assembly, comprising:

[0032] The optical module according to any one of the above embodiments;

[0033] An optical connector is coupled to the optical module.

[0034] In some embodiments, the optical module assembly further includes: a protective pipe; the optical module further includes an optical fiber array, the optical module is coupled to the optical connector through the optical fiber array, and the protective pipe is sleeved on the outside of the optical fiber array.

[0035] In some embodiments, the diameter of the protective tube is 3.8 mm.

[0036] In a third aspect, an embodiment of the present application provides a method for forming an optical module as described in any of the above embodiments, comprising:

[0037] forming a circuit board;

[0038] Fixing a chip assembly on the surface of the circuit board, wherein the chip assembly is coupled to the circuit board;

[0039] Placing the circuit board and the chip assembly in the accommodating cavity of the housing;

[0040] An electrical connector is coupled to the circuit board.

[0041] In a fourth aspect, an embodiment of the present application provides a method for forming an optical module assembly, comprising:

[0042] forming an optical module as described in any one of the above embodiments;

[0043] An optical connector is coupled to the optical module.

[0044] This application can achieve the following beneficial effects:

[0045] Based on the optical module provided in the embodiment of the present application, the longer edge of the electrical connector is set parallel to the longer edge of the shell (both are set along the second direction), and the shorter edge of the electrical connector is set parallel to the shorter edge of the shell (both are set along the first direction). This can avoid the longer edge of the electrical connector limiting the size of the shorter edge of the shell, thereby reducing the volume of the optical module.

[0046] Furthermore, by providing a receiving groove in the base and placing the electrical connector in the receiving groove, the electrical connector can be prevented from occupying the space of the receiving cavity, and the volume of the optical module can also be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0048] Figure 1 An exploded schematic diagram of an optical module provided in an embodiment of the present application;

[0049] Figure 2 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0050] Figure 3 A schematic structural diagram of a connector and a base in a separated state provided in an embodiment of the present application;

[0051] Figure 4 A schematic diagram of a structure in which a top cover and a base are separated is provided in an embodiment of the present application;

[0052] Figure 5 A schematic structural diagram of an electrical connector provided in an embodiment of the present application;

[0053] Figure 6 A schematic structural diagram of an electrical connector provided in an embodiment of the present application;

[0054] Figure 7A schematic structural diagram of a circuit board provided in an embodiment of the present application;

[0055] Figure 8 A schematic diagram of a partial structure of an optical module provided in an embodiment of the present application;

[0056] Figure 9 A schematic diagram of the structure of a top cover and a base in a connected state provided in an embodiment of the present application;

[0057] Figure 10 A front view of an optical module assembly provided in an embodiment of the present application;

[0058] Figure 11 A schematic structural diagram of an optical connector provided in an embodiment of the present application;

[0059] Figure 12 A schematic structural diagram of an optical connector provided in an embodiment of the present application;

[0060] Figure 13 A side view of an optical module assembly provided in an embodiment of the present application;

[0061] Figure 14 A rear view of an optical module assembly provided in an embodiment of the present application;

[0062] Figure 15 A schematic diagram of a connection method for an optical module assembly provided in an embodiment of the present application;

[0063] Figure 16 A schematic flow chart of a method for forming an optical module provided in an embodiment of the present application;

[0064] Figure 17 A schematic flow chart of a method for forming an optical module assembly provided in an embodiment of the present application;

[0065] Figure 18 The figure is a schematic diagram of the structure of an optical module in the prior art.

[0066] Reference numerals:

[0067] 100 - optical module; 1 - housing; 11 - receiving cavity; 12 - top cover; 121 - first fixing hole; 13 - base; 131 - receiving groove; 132 - second fixing hole; 2 - circuit board; 21 - substrate; 211 - first functional surface; 212 - second functional surface; 22 - first port structure; 23 - second port structure; 231 - first port; 232 - second port; 24 - wiring structure; 241 - wiring; 3 - chip assembly; 31 - optical chip assembly; 32 - electrical chip assembly; 4 -heat sink; 5-electrical connector; 51-first surface; 52-connecting portion; 53-first area; 54-second area; 55-first function pin; 56-second function pin; 6-fiber array; GND-ground pin; VCC-power pin; CML-differential signal pin; 200-optical connector; 7-second surface; 71-glue dispensing window; 8-third surface; 9-fourth surface; 91-optical transmitting port; 92-optical receiving port; 300-protective pipe; 400-optical module assembly;

[0068] X-first direction; Y-second direction; Z-thickness direction of the optical module. DETAILED DESCRIPTION

[0069] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of this application.

[0070] In the description of this application, it should be noted that, unless otherwise specified or limited, the term "and / or" herein is merely a description of an association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. Furthermore, the character " / " herein, unless otherwise specified, generally indicates that the associated objects are in an "or" relationship.

[0071] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0072] Optical modules are common devices in the field of optoelectronic communications. They include a chip assembly and an electrical connector. The chip assembly and the electrical connector are coupled together. The electrical connector has signal transmission pins. The electrical connector receives electrical signals from a first target device through the signal transmission pins. The chip assembly converts the electrical signals into optical signals and transmits them to a second target device. Alternatively, the chip assembly receives optical signals from a second target device, converts them into electrical signals, and transmits the electrical signals to the first target device through the signal transmission pins of the electrical connector. Optical modules can be used to enable information exchange between the first and second target devices. The electrical connector also has power pins for connecting to an external power source.

[0073] In the prior art, see Figure 18 As shown, the optical module is defined in a first direction X and a second direction Y. The length of the housing along the first direction X is less than the length along the second direction Y. The length of the electrical connector along the first direction X is greater than the length along the second direction Y. This will cause the optical module to be too large, which is not conducive to the installation and use of the optical module.

[0074] Furthermore, pins with different functions can affect each other. The current flowing through power pins is often large, especially in scenarios like switching power supplies, where the current changes frequently and rapidly. In the prior art, if the power pins and signal transmission pins are set too close together, the electromagnetic field generated by the power pins can interfere with the signals transmitted by adjacent signal transmission pins. For example, in digital circuits, this can compromise signal integrity, causing signal distortion and glitches, making it difficult to accurately determine the logic level of the digital signal and affecting the normal logic function of the circuit. For analog signals, this can alter signal characteristics such as amplitude and frequency, increase signal noise, and reduce signal quality, thereby affecting the accuracy and reliability of subsequent signal processing, amplification, and filtering. Furthermore, if the power pins and signal transmission pins are set too close together, or in high-speed signal transmission scenarios, the spacing between the power pins and signal pins is too close, crosstalk can occur. Crosstalk can cause signals to couple with each other, resulting in additional, undesirable signal components in the signal transmission path. This can cause data transmission errors and affect data accuracy and reliability.

[0075] In response to the technical problems in the prior art such as the optical module being too large and the signals being easily interfered with each other, the embodiments of the present application propose an optical module and a method for forming the same, an optical module assembly and a method for forming the same, to overcome the above problems.

[0076] An optical module and a method for forming the same, an optical module assembly and a method for forming the same provided by the present application are introduced below with reference to the accompanying drawings.

[0077] See Figure 1 As shown, the embodiment of the present application provides an optical module 100, including:

[0078] A housing 1 having a receiving cavity 11 therein, wherein the length of the housing 1 along a first direction X is shorter than the length along a second direction Y;

[0079] The circuit board 2 is located in the accommodating cavity 11;

[0080] The chip assembly 3 is located in the accommodating cavity 11 and coupled to the circuit board 2;

[0081] An electrical connector 5 is coupled to the circuit board 2 , wherein the length of the electrical connector 5 along the first direction X is less than the length along the second direction Y; the first direction X and the second direction Y are parallel to the circuit board 2 , and the first direction X and the second direction Y are different.

[0082] The optical module 100 is defined by a first direction X, a second direction Y, and a thickness direction Z of the optical module 100 . The first direction X, the second direction Y, and the thickness direction Z of the optical module 100 are perpendicular to each other. The thickness direction Z of the optical module 100 is perpendicular to the circuit board 2 .

[0083] Based on the above embodiment, the length of the housing 1 along the first direction X can be effectively reduced, thereby reducing the volume of the optical module 100. In the prior art, the length of the housing 1 along the first direction X is at least 24 mm. In the embodiment of the present application, the length of the housing 1 along the first direction X can be reduced to 18 mm to 20 mm, while the length of the housing 1 along the second direction Y and the thickness of the optical module remain unchanged.

[0084] In some embodiments, see Figure 1 、 Figure 2 and Figure 3 As shown, the housing 1 includes a top cover 12 and a base 13 that match each other. The accommodating cavity 11 is located between the top cover 12 and the base 13. The base 13 has an accommodating groove 131 that penetrates the base 13 along the thickness direction Z of the optical module. The electrical connector 5 is located in the accommodating groove 131. The accommodating groove 131 connects the accommodating cavity 11 with the external space.

[0085] By providing the receiving groove 131 in the base 13 and placing the electrical connector 5 in the receiving groove 131 , the electrical connector 5 can be prevented from occupying the space of the receiving cavity 11 , thereby reducing the volume of the optical module 100 .

[0086] In some embodiments, the length of the housing 1 along the first direction X ranges from 18 mm to 20 mm.

[0087] In some embodiments, the length of the housing 1 along the second direction Y ranges from 30 mm to 33.4 mm.

[0088] In some embodiments, the length of the electrical connector 5 along the first direction X is 9 mm.

[0089] In some embodiments, the length of the electrical connector 5 along the second direction Y is 20.5 mm.

[0090] In some embodiments, see Figure 4 As shown, the top cover 12 has a first fixing hole 121, and the base 13 has a second fixing hole 132 corresponding to the first fixing hole 121. The first fixing hole 121 and the second fixing hole 132 are respectively plugged into and matched with connectors (not shown) to connect the base 13 and the top cover 12. The connectors include screws.

[0091] In some embodiments, see Figure 1 As shown, the electrical connector 5 has a first surface 51 having a connecting portion 52. The connecting portion 52 is coupled to the chip assembly 3 through the circuit board 2. The surface of the electrical connector 5 close to the circuit board 2 is the first surface 51.

[0092] In some embodiments, see Figure 5As shown, the connecting portion 52 includes multiple groups of differential signal pins CML and multiple power pins VCC, and the distance between the differential signal pins CML and the power pins VCC is greater than a first distance threshold.

[0093] In some embodiments, the first distance threshold is 1.0 mm.

[0094] Based on the above embodiment, setting the distance from the differential signal pin CML to the power pin VCC to be greater than the first distance threshold can prevent the electromagnetic field generated by the power pin VCC from interfering with the transmission of the differential signal, avoid electromagnetic interference and signal crosstalk, improve the transmission quality of the differential signal, and further improve the working stability of the optical module 100.

[0095] In some embodiments, see Figure 5 and Figure 6 As shown, the differential signal pins CML can be divided into positive phase and negative phase groups. Each group of differential signal pins CML in the multiple groups of differential signal pins CML includes a positive phase pin and a negative phase pin of the same channel. The distance between the positive phase pin and the negative phase pin of the same channel is less than a second distance threshold. Specifically, the second distance threshold is 0.3 mm.

[0096] Based on the above embodiment, the positive and negative phase pins of the same channel form a tight differential pair. During differential signal transmission, the positive signal transmitted by the positive pin and the negative signal transmitted by the negative pin have opposite current directions. Because the positive and negative phase pins of the same channel are close together, this tight differential pair cancels out the electromagnetic fields around the two pins, thereby reducing the radiation of external electromagnetic interference and thus reducing electromagnetic interference and crosstalk.

[0097] In some embodiments, see Figure 5 and Figure 6 As shown, the differential signal pins CML can also be divided into first function pins 55 and second function pins 56 according to their functions. Multiple groups of differential signal pins CML include multiple groups of first function pins 55 and multiple groups of second function pins 56. In the embodiment of the present application, the first function is output and the second function is input.

[0098] The positive-phase pins are denoted by DoutnumP and DinnumP, where "out" represents the first function and "in" represents the second function. "num" represents the channel number of the optical module. In the embodiment of the present application, the optical module 100 has 12 receive channels and 12 transmit channels. The receive channels correspond to the first-function pins 55 and the transmit channels correspond to the second-function pins 56. "num" is an integer between 1 and 12. "P" represents the positive phase. The negative-phase pins are denoted by DoutnumN and DinnumN, where "out" represents the first function and "in" represents the second function. "num" represents the channel number of the optical module, and "N" represents the negative phase.

[0099] For example, see Figure 6 As shown, Dout12P and Dout12N form a group of first functional pins 55 and also constitute a group of differential signal pins CML. Dout12P represents the non-inverting pin in the first functional pins 55 of the 12th channel (receiving channel), and Dout12N represents the inverting pin in the first functional pins 55 of the 12th channel (receiving channel). Din2P and Din2N form a group of second functional pins 56 and also constitute a group of differential signal pins CML. Din2P represents the non-inverting pin in the second functional pins 56 of the second channel (transmitting channel), and Din2N represents the inverting pin in the second functional pins 56 of the second channel (transmitting channel).

[0100] In some embodiments, see Figure 6 As shown, the power pin VCC specifically includes: VCCT and VCCR, wherein VCCT is used to connect the second function pin 56 to a 3.3V power supply, and VCCR is used to connect the first function pin 55 to a 3.3V power supply.

[0101] In some embodiments, see Figure 5 and Figure 6 As shown, the connection part 52 also includes a floating pin DNC, a signal detection pin SD, a first I2C (I2C, Inter-Integrated Circuit, a synchronous serial bus) clock interface pin SDA, a second I2C clock interface pin SCL, a CDR Bypass (CDR refers to Clock Data Recovery, clock data recovery; Bypass refers to bypass) enable pin CDR_EN, and an I2C selection control pin Modsel.

[0102] Dangling pin DNC: It is an internal pin. External connection will affect the function of the optical module 100. It must be left floating and is prohibited from being connected.

[0103] Signal detection pin SD: has an output function. Outputting a high-level signal indicates that the optical power of all first function pins 55 is higher than the threshold; outputting a low-level signal indicates that the optical power of at least one first function pin 55 is lower than the threshold;

[0104] The first I2C clock interface pin SDA has input / output function. The optical module 100 has been pulled up to 10K, and can also be left floating.

[0105] The second I2C clock interface pin SCL has an input function. The optical module 100 has been pulled up to 10K, and can also be left floating.

[0106] CDR Bypass enable pin CDR_EN: has input function and is pulled up by the optical module 100. A high-level output signal indicates that the CDR is on and the optical module 100 operates at 25.78125 Gbps. A low-level output signal indicates that the CDR is off and the optical module 100 can be used at a reduced speed.

[0107] I2C selection control pin Modsel: has input function, the optical module 100 has been pulled up; outputting a high-level signal indicates that I2C communication is disabled; outputting a low-level signal indicates that I2C communication is enabled.

[0108] In some embodiments, see Figure 5 As shown, the connecting portion 52 further includes: a plurality of ground pins GND, and the connecting portion 52 is arranged in an array along a first direction X and a second direction Y, and the first direction X and the second direction Y are parallel to the first surface 51; each group of differential signal pins CML in the plurality of groups of differential signal pins CML is adjacent to the ground pin GND on at least one side in the first direction X and at least one side in the second direction Y.

[0109] Based on the above embodiment, since the ground pin GND does not interfere with the differential signal pin CML, disposing the ground pin GND near the differential signal pin CML can effectively utilize the space of the connecting portion 52 .

[0110] In some embodiments, see Figure 5 and Figure 6 As shown, the first surface 51 includes a first area 53 and a second area 54. The distance between the first area 53 and the second area 54 is greater than a third distance threshold. Multiple groups of first functional pins 55 are located in the first area 53, and multiple groups of second functional pins 56 are located in the second area 54. The first area 53 and the second area 54 can be located on either side of the central axis of the first surface 51.

[0111] Specifically, the third distance threshold may be set to 0.3 mm.

[0112] In some embodiments, the signal transmitted through the first function pin 55 has a first power, and the signal transmitted through the second function pin 56 has a second power, and the first power is different from the second power.

[0113] Based on the above embodiments, crosstalk between signals of different transmission rates can be avoided, signal transmission quality can be improved, and the working stability of the optical module 100 can be improved.

[0114] In some embodiments, see Figure 7 As shown, the circuit board 2 includes:

[0115] The substrate 21 includes a first functional surface 211 and a second functional surface 212;

[0116] A first port structure 22 located on the first functional surface 211, a second port structure 23 located on the second functional surface 212, and a wiring structure 24 located within the substrate 21, wherein the wiring structure 24 is electrically connected between the first port structure 22 and the second port structure 23, the first port structure 22 is coupled to the chip assembly 3, and the second port structure 23 corresponds to the connecting portion 52;

[0117] The second port structure 23 includes a first port 231 and a second port 232 , wherein the first port 231 is coupled to the first function pin 55 , and the second port 232 is coupled to the second function pin 56 ;

[0118] The wiring structure 24 includes a plurality of wirings 241 . Each wiring 241 is coupled between at least one first port 231 and at least one second port 232 . The minimum distance between the wirings 241 is greater than a fourth distance threshold.

[0119] In some embodiments, the fourth distance threshold may be set to 0.3 mm.

[0120] Based on the above embodiment, setting the minimum distance between the wirings 241 to be greater than the fourth distance threshold can avoid crosstalk between the signal transmitted through the first function pin 55 and the signal transmitted through the second function pin 56 .

[0121] In some embodiments, see Figure 8 As shown, the chip assembly 3 includes multiple groups of optical chip assemblies 31 and multiple groups of electrical chip assemblies 32. The number of optical chip assemblies 31 in each chip assembly 3 ranges from two to three; the number of electrical chip assemblies 32 in each chip assembly 3 ranges from two to three. Each group of optical chip assemblies 31 includes at least one optical receiver chip and at least one optical transmitter chip. Each group of electrical chip assemblies 32 includes at least one driver chip and at least one limiting amplifier.

[0122] Specifically, there are three groups of optical chip assemblies 31 and three groups of electrical chip assemblies 32. Each group of optical chip assemblies 31 includes a four-channel optical receiving chip and a four-channel optical transmitting chip, and each group of electrical chip assemblies 32 includes a four-channel driver chip and a four-channel limiting amplifier.

[0123] Specifically, three four-channel optical receiver chips and three four-channel limiting amplifiers are arranged on the first end of the circuit board 2; three four-channel optical transmitter chips and three four-channel driver chips are arranged on the second end of the circuit board 2. The first end and the second end are arranged opposite each other.

[0124] The limiting amplifier and optical receiver chip form the receiver module of optical module 100, while the driver chip and optical transmitter chip form the transmitter module of optical module 100. The receiver module is coupled to the first function pin 55 via circuit board 2, while the transmitter module is coupled to the second function pin 56 via circuit board 2. VCCT in the power supply pin VCC is used to power the transmitter module via the second function pin 56, while VCCR in the power supply pin VCC is used to power the receiver module via the first function pin 55.

[0125] See Figure 1 As shown, the optical receiving chip is used to receive optical signals from the optical fiber array 6, convert the optical signals into electrical signals, amplify them through a limiting amplifier, and output electrical signals of the corresponding bit rate to the electrical connector 5. The driver chip receives the electrical signals from the electrical connector 5, and the driver chip drives the optical transmitting chip to emit optical signals of the corresponding rate. After the optical signals are coupled into the optical fiber array 6, they are transmitted to the external optical fiber and can be transmitted to other optical modules (or other devices) through the external optical fiber.

[0126] Optical module 100 has a total of 24 channels. Twelve of these channels form receive channels, corresponding to the receive modules. The receive channels receive optical signals from the outside and transmit them to electrical connector 5 after optical-to-electrical conversion. Twelve of these channels form transmit channels, corresponding to the transmit modules. The transmit channels receive electrical signals from electrical connector 5 and transmit them to the outside after electrical-to-optical conversion. Each channel has a data transmission capacity of 12G, resulting in a total data transmission capacity of 12 × 25G = 300Gbps for optical module 100.

[0127] Based on the above embodiment, a chip assembly 3 with 24 channels can be integrated and designed in a very small space, which greatly reduces the volume of the optical module 100.

[0128] In some embodiments, see Figure 1 and Figure 8 As shown, the optical module 100 further includes: a plurality of heat sinks 4, which are located between the chip assembly 3 and the circuit board 2. The heat sinks 4 are also connected to the housing 1. The heat sinks 4 are used to conduct heat generated by the chip assembly 3 to the housing 1, and the housing 1 then conducts the heat to the air, thereby facilitating heat dissipation of the optical module 100.

[0129] In some embodiments, the heat sink 4 is made of at least one of aluminum nitride and beryllium oxide. Aluminum nitride has a thermal conductivity of 170 W / (m·K) to 230 W / (m·K), while beryllium oxide has a thermal conductivity of 220 W / (m·K) to 250 W / (m·K). Beryllium oxide has better thermal conductivity than aluminum nitride, but aluminum nitride is less expensive than beryllium oxide. Therefore, an aluminum nitride heat sink 4 is more suitable for use in the optical module 100.

[0130] In some embodiments, see Figure 1 and Figure 9 As shown, optical module 100 further includes an optical fiber array 6 coupled to chip assembly 3. A portion of optical fiber array 6 is located in housing cavity 11 and coupled to optical chip assembly 31. Another portion of optical fiber array 6 extends through housing 1 and couples to optical connector 200 (not shown). Specifically, optical fiber array 6 is coupled to optical chip assembly 31.

[0131] The present application also provides an optical module assembly 400, see Figure 10 As shown, Figure 10 4 shows a front view of the optical module assembly 400, which includes:

[0132] The optical module 100 according to any of the above embodiments;

[0133] The optical connector 200 is coupled to the optical module 100 .

[0134] In some embodiments, see Figure 11 and Figure 12 As shown, optical connector 200 has a second surface 7, a third surface 8, and a fourth surface 9. Second surface 7 is parallel to third surface 8 and connected to fourth surface 9, which in turn is connected to third surface 8. Fourth surface 9 has a light emitting port 91 and a light receiving port 92. Light emitting port 91 is located on the side closest to second surface 7, and light receiving port 92 is located on the side closest to third surface 8. The angle formed by second surface 7 and fourth surface 9 ranges from 81 to 83 degrees. A glue dispensing window 71 is provided on second surface 7 for securing the position of optical fiber array 6 within optical connector 200. Light emitting port 91 is coupled to optical module 100 via optical fiber array 6, and light receiving port 92 is coupled to optical module 100 via optical fiber array 6.

[0135] Preferably, the angle formed by the second surface 7 and the fourth surface 9 is equal to 82°.

[0136] Based on the above embodiment, the angle formed by the second surface 7 and the fourth surface 9 is in the range of 81 degrees to 83 degrees, in order to prevent the optical signal from being reflected back to the optical receiving chip or the optical transmitting chip and causing signal transmission errors.

[0137] In some embodiments, the optical transmission port 91 has 12 channels, and the optical transmission port 91 is coupled to the optical transmission chip in the optical chip assembly 31 through the optical fiber array 6. The optical reception port 92 has 12 channels, and the optical reception port 92 is coupled to the optical reception chip in the optical chip assembly 31 through the optical fiber array 6. The optical fiber array 6 has a total of 24 optical fibers, of which 12 optical fibers are connected to the optical reception port 92, and 12 optical fibers are connected to the optical transmission port 91.

[0138] In some embodiments, see Figure 10 As shown, the optical module assembly 400 further includes: a protective tube 300 ; the optical module 100 is coupled to the optical connector 200 via the optical fiber array 6 (not shown), and the protective tube 300 is sleeved on the outside of the optical fiber array 6 .

[0139] In some embodiments, the diameter of the protection tube 300 is 3.8 mm.

[0140] In some embodiments, see Figure 13 and Figure 14 As shown, Figure 13 4 shows a side view of the optical module assembly 400. Figure 14 This figure shows a rear view of the optical module assembly 400. The length of the optical module 100 along the first direction X is preferably 20 mm, the length of the optical module 100 along the second direction Y is preferably 33.4 mm, the length of the optical module 100 along the thickness direction Z is 4.5 mm, and the diameter of the protective tube 300 is 3.8 mm. The optical module 100 weighs 15 g.

[0141] In some embodiments, see Figure 15 As shown, the two optical module assemblies 400 are connected via a ribbon fiber. The length of the ribbon fiber ranges from 1 meter to 100 meters, which is suitable for short-distance transmission. The optical module 100 can receive external control signals and 24 electrical signals through the electrical connector 5, and can also transmit control signals and 24 electrical signals to the outside.

[0142] See Figure 16 As shown, the embodiment of the present application provides a method for forming the optical module 100 as in any of the above embodiments, comprising:

[0143] S101: forming a circuit board;

[0144] S102: Fixing the chip assembly on the surface of the circuit board, coupling the chip assembly to the circuit board;

[0145] S103: placing the circuit board and the chip assembly in the accommodating cavity of the housing;

[0146] S104: coupling the electrical connector to the circuit board.

[0147] The following will describe a method for forming the optical module 100 according to any of the above embodiments with reference to the accompanying drawings.

[0148] Please refer to Figure 1 and Figure 16 , execute step S101 to form a circuit board 2.

[0149] Please refer to Figure 7, circuit board 2 includes:

[0150] The substrate 21 includes a first functional surface 211 and a second functional surface 212;

[0151] A first port structure 22 located on the first functional surface 211, a second port structure 23 located on the second functional surface 212, and a wiring structure 24 located within the substrate 21, wherein the wiring structure 24 is electrically connected between the first port structure 22 and the second port structure 23, the first port structure 22 is coupled to the chip assembly 3, and the second port structure 23 corresponds to the connecting portion 52;

[0152] The second port structure 23 includes a first port 231 and a second port 232 , wherein the first port 231 is coupled to the first function pin 55 , and the second port 232 is coupled to the second function pin 56 ;

[0153] The wiring structure 24 includes a plurality of wirings 241 . Each wiring 241 is coupled between at least one first port 231 and at least one second port 232 . The minimum distance between the wirings 241 is greater than a fourth distance threshold.

[0154] Please refer to Figure 1 and Figure 16 , execute step S102, fix the chip component 3 on the surface of the circuit board 2, and couple the chip component 3 to the circuit board 2.

[0155] In some embodiments, the chip assembly 3 includes multiple sets of optical chip assemblies 31 and multiple sets of electrical chip assemblies 32. The number of optical chip assemblies 31 in each set of chip assembly 3 ranges from two to three; the number of electrical chip assemblies 32 in each set of chip assembly 3 ranges from two to three. Each set of optical chip assemblies 31 includes at least one optical receiver chip and at least one optical transmitter chip. Each set of electrical chip assemblies 32 includes at least one driver chip and at least one limiting amplifier.

[0156] In some embodiments, a chip assembly 3 can be fixed to the surface of the circuit board 2 using a chip-on-board (COB) packaging process. COB is an integrated technology that directly packages a bare chip on the substrate 21. Because the chip assembly 3 used in the embodiment of the present application is a bare chip without a chip housing, its volume is smaller than that of a packaged chip with a chip housing, thus helping to reduce the volume of the optical module 100.

[0157] Please refer to Figure 1 and Figure 16 , execute step S103 to place the circuit board 2 and the chip assembly 3 in the accommodating cavity 11 of the housing 1.

[0158] Please refer to Figure 1The housing 1 includes a top cover 12 and a base 13 that match each other, and the accommodating cavity 11 is located between the top cover 12 and the base 13.

[0159] Please refer to Figure 1 and Figure 16 , executing step S104, coupling the electrical connector to the circuit board.

[0160] Please refer to Figure 1 and Figure 5 The electrical connector 5 has a first surface 51 with a connecting portion 52. The connecting portion 52 is coupled to the chip assembly 3 via the circuit board 2. The surface of the electrical connector 5 closest to the circuit board 2 is the first surface 51. The connecting portion 52 includes multiple groups of differential signal pins CML. The differential signal pins CML can also be divided into first function pins 55 and second function pins 56 according to their functions. The multiple groups of differential signal pins CML include multiple groups of first function pins 55 and multiple groups of second function pins 56. In the embodiment of the present application, the first function is output and the second function is input.

[0161] In some embodiments, the limiting amplifier is coupled to the first function pin 55 via the circuit board 2, and the driver chip is coupled to the second function pin 56 via the circuit board 2. The second function pin 56 is coupled to the second port 232 of the circuit board 2, and the first function pin 55 is coupled to the first port 231 of the circuit board 2.

[0162] In some embodiments, see Figure 3 As shown, the electrical connector 5 is placed in the receiving groove 131 , and then the electrical connector is coupled to the circuit board.

[0163] See Figure 17 As shown, the embodiment of the present application provides a method for forming an optical module assembly 400, including:

[0164] S201: forming an optical module according to any of the above embodiments;

[0165] S202: Couple the optical connector to the optical module.

[0166] A method for forming an optical module assembly 400 will be described below with reference to the accompanying drawings.

[0167] Please refer to Figure 10 and Figure 17 As shown, step S201 is performed to form the optical module 100 as any one of the above embodiments.

[0168] Please refer to Figure 1 , the optical module 100 includes:

[0169] A housing 1 having a receiving cavity 11 therein, wherein the length of the housing 1 along a first direction X is shorter than the length along a second direction Y;

[0170] The circuit board 2 is located in the accommodating cavity 11;

[0171] The chip assembly 3 is located in the accommodating cavity 11 and coupled to the circuit board 2;

[0172] An electrical connector 5 is coupled to the circuit board 2 , wherein the length of the electrical connector 5 along the first direction X is less than the length along the second direction Y; the first direction X and the second direction Y are parallel to the circuit board 2 , and the first direction X and the second direction Y are different.

[0173] The optical module 100 further includes an optical fiber array 6 , which is coupled to the chip assembly 3 and is used to transmit optical signals.

[0174] Please refer to Figure 10 and Figure 17 As shown, step S202 is executed to couple the optical connector 200 to the optical module 100 .

[0175] The optical module assembly 400 further includes a protective tube 300 . The optical module 100 is coupled to the optical connector 200 via an optical fiber array 6 (not shown), and the protective tube 300 is sleeved outside the optical fiber array 6 .

[0176] It should be noted that the above method may also include other implementation methods according to the description of the structural embodiment. The specific implementation methods can refer to the description of the relevant structural embodiment and will not be described in detail here.

[0177] The structural embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network elements. Some or all of the modules may be selected based on actual needs to achieve the objectives of this embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0178] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, or of course, by hardware. Based on this understanding, the essence of the above technical solution or the part that contributes to the existing technology can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or certain parts of the embodiments.

[0179] In summary, although the present application has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

Claims

1. An optical module, characterized in that: include: A housing (1), wherein the housing (1) has a receiving cavity (11) therein, and the length of the housing (1) along a first direction (X) is shorter than the length along a second direction (Y); A circuit board (2) is located in the accommodating cavity (11); A chip assembly (3) is located in the accommodating cavity (11) and coupled to the circuit board (2); An electrical connector (5) is located outside the housing (1) and coupled to the circuit board (2), wherein the length of the electrical connector (5) along the first direction (X) is shorter than the length along the second direction (Y); the first direction (X) and the second direction (Y) are parallel to the circuit board (2), and the first direction (X) and the second direction (Y) are different.

2. The optical module according to claim 1, wherein The housing (1) comprises a matching top cover (12) and a base (13); the accommodating cavity (11) is located between the top cover (12) and the base (13); the base (13) has an accommodating groove (131) that penetrates the base (13) along the thickness direction (Z) of the optical module, and the electrical connector (5) is located in the accommodating groove (131).

3. The optical module according to claim 1, wherein: The length of the housing (1) along the first direction (X) ranges from 18 mm to 20 mm.

4. The optical module according to claim 1, wherein: The length of the housing (1) along the second direction (Y) ranges from 30 mm to 33.4 mm.

5. The optical module according to claim 1, wherein: The length of the electrical connector (5) along the first direction (X) is 9 mm.

6. The optical module according to claim 1, wherein: The length of the electrical connector (5) along the second direction (Y) is 20.5 mm.

7. The optical module according to claim 2, wherein: The top cover (12) has a first fixing hole (121), and the base (13) has a second fixing hole (132) corresponding to the first fixing hole (121). The first fixing hole (121) and the second fixing hole (132) are respectively plugged into and matched with the connector.

8. The optical module according to claim 1, wherein: The electrical connector (5) has a first surface (51), the first surface (51) has a connecting portion (52), the connecting portion (52) is coupled to the chip assembly (3) through the circuit board (2), the connecting portion (52) includes multiple groups of differential signal pins (CML) and multiple power pins (VCC), and the distance between the differential signal pins (CML) and the power pins (VCC) is greater than a first distance threshold.

9. The optical module according to claim 8, wherein: The first distance threshold is 1.0 mm.

10. The optical module according to claim 8, wherein: Each group of differential signal pins (CML) in the plurality of groups of differential signal pins (CML) includes a positive phase pin and a negative phase pin of the same channel; and a distance between the positive phase pin and the negative phase pin of the same channel is less than a second distance threshold.

11. The optical module according to claim 10, wherein: The second distance threshold is 0.3 mm.

12. The optical module according to claim 8, wherein: The connecting portion (52) further includes: a plurality of ground pins (GND), and the connecting portion (52) is arranged in an array along the first direction (X) and the second direction (Y); Each group of differential signal pins (CML) in the plurality of groups of differential signal pins (CML) is adjacent to the ground pin (GND) on at least one side in the first direction (X) and at least one side in the second direction (Y).

13. The optical module according to claim 8, wherein: The first surface (51) includes a first area (53) and a second area (54), and a distance between the first area (53) and the second area (54) is greater than a third distance threshold; The multiple groups of differential signal pins (CML) include multiple groups of first function pins (55) and multiple groups of second function pins (56), wherein the multiple groups of first function pins (55) are located in the first area (53), and the multiple groups of second function pins (56) are located in the second area (54).

14. The optical module according to claim 13, wherein: The signal transmitted through the first function pin (55) has a first power, and the signal transmitted through the second function pin (56) has a second power, and the first power is different from the second power.

15. The optical module according to claim 13, wherein: The circuit board (2) comprises: A substrate (21) comprising a first functional surface (211) and a second functional surface (212); a first port structure (22) located on the first functional surface (211), a second port structure (23) located on the second functional surface (212), and a wiring structure (24) located in the substrate (21), wherein the wiring structure (24) is electrically connected between the first port structure (22) and the second port structure (23), the first port structure (22) is coupled to the chip assembly (3), and the second port structure (23) corresponds to the connecting portion (52); The second port structure (23) includes a first port (231) and a second port (232), wherein the first port (231) is coupled to the first function pin (55), and the second port (232) is coupled to the second function pin (56); The wiring structure (24) includes a plurality of wirings (241), each wiring (241) is coupled between at least one first port (231) and at least one second port (232), and a minimum distance between the wirings (241) is greater than a fourth distance threshold.

16. The optical module according to claim 1, wherein The chip assembly (3) comprises multiple groups of optical chip assemblies (31) and multiple groups of electrical chip assemblies (32).

17. An optical module assembly, characterized in that: include: The optical module (100) according to any one of claims 1 to 16; An optical connector (200) is coupled to the optical module (100).

18. The optical module assembly according to claim 17, wherein: Also includes: The optical module (100) further comprises an optical fiber array (6), the optical module (100) is coupled to the optical connector (200) via the optical fiber array (6), and the protective pipe (300) is sleeved on the outside of the optical fiber array (6).

19. The optical module assembly according to claim 18, wherein: The diameter of the protection pipe (300) is 3.8 mm.

20. A method for forming an optical module according to any one of claims 1 to 16, characterized in that: include: forming a circuit board (2); A chip component (3) is fixed on the surface of the circuit board (2), and the chip component (3) is coupled to the circuit board (2); Placing the circuit board (2) and the chip assembly (3) in the accommodating cavity (11) of the housing (1); An electrical connector (5) is coupled to the circuit board (2).

21. A method for forming an optical module assembly, characterized in that: include: Forming the optical module (100) according to any one of claims 1 to 16; An optical connector (200) is coupled to the optical module (100).

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