Ultrasonic cooling device

Abstract

The invention discloses an ultrasonic cooling device. The ultrasonic cooling device comprises a vibrating reed with one or more acoustic black hole structures and a vibration excitation unit for vibration excitation. The piezoelectric element is bonded to the vibrating piece. When the device works, the acoustic black hole structure generates an ultrasonic field with a space gradient, and then an acoustic vortex is generated. These acoustic vortices cool a heat source located near the device. The cooling device has the advantages of being compact in structure, flexible in arrangement mode, high in energy utilization rate, low in working noise and the like, and is suitable for heat dissipation of chips in various AI products and other consumer electronic products.

Description

Technical Field

[0001] The present invention relates to the field of chip heat dissipation, and in particular to an ultrasonic cooling device. Background Art

[0002] With the continuous advancement of AI technology, electronic devices are gradually moving towards high integration, high performance, and miniaturization. However, this trend has brought with it serious heat generation issues, which not only reduces the computing performance of electronic devices but also damages electronic components. Therefore, small active heat dissipation and cooling devices have become crucial. Traditional electronic devices use large rotating motors to drive fans for active heat dissipation and cooling. These rotating motors have a simple installation layout and are large in size, making them difficult to adapt to the current trend of high integration and miniaturization of electronic devices. At the same time, the noise generated during the operation of traditional fans is also one of the factors hindering their development. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an ultrasonic cooling device in view of the defects involved in the background technology.

[0004] The present invention adopts the following technical solutions to solve the above technical problems: An ultrasonic cooling device, which utilizes a radial acoustic black hole structure that gradually thickens from the inside to the outside to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration plate is in the shape of a disk, comprising a first end surface and a second end surface, and a concave surface is provided at the center of the second end surface to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component includes a plurality of annular piezoelectric ceramic sheets or circular piezoelectric ceramic sheets; the annular piezoelectric ceramic sheets are arranged outside the acoustic black hole structure and are coaxial with the corresponding acoustic black hole structure; The piezoelectric component is used to excite the vibration plate to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the acoustic black hole structure.

[0005] As a further optimization solution of the ultrasonic cooling device of the present invention, the vibration plate is provided with a through hole at the center of the acoustic black hole structure or a plurality of radial through grooves are provided on the acoustic black hole structure.

[0006] The present invention also discloses another ultrasonic cooling device, which utilizes a radial acoustic black hole structure that gradually thickens from the inside to the outside to generate an acoustic flow for cooling, and includes a vibrating plate, an excitation auxiliary plate, and a piezoelectric component; The vibrating plate is disc-shaped and includes a first end surface and a second end surface, and a concave surface is provided at the center of the second end surface to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The second end surface of the vibration plate is fixedly connected to one side of the excitation auxiliary plate; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the side of the excitation auxiliary plate away from the vibration plate and is coaxial with the acoustic black hole structure, and is used to excite the vibration plate to vibrate, thereby causing the acoustic black hole structure to generate acoustic flow vortices for cooling on the side away from the excitation auxiliary plate.

[0007] The present invention also discloses a third ultrasonic cooling device, which utilizes a radial acoustic black hole structure that gradually thickens from the outside to the inside to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibrating plate includes a gradient portion and a central portion, the central portion is disc-shaped; the gradient portion is annular and includes a first end face and a second end face, the thickness between the second end face and the first end face gradually increases from the outside to the inside, the innermost portion has the same thickness as the central portion, and the innermost portion and the central portion are coaxially fixed to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component uses a circular piezoelectric ceramic piece or an annular piezoelectric ceramic piece, and is set at the center of the vibration piece, coaxial with the center of the vibration piece, for exciting the vibration piece to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the acoustic black hole structure.

[0008] As a further optimization solution of the third ultrasonic cooling device of the present invention, the vibration plate is provided with a plurality of radial through grooves on the acoustic black hole structure.

[0009] The present invention also discloses a fourth ultrasonic cooling device, which utilizes an acoustic black hole structure that gradually becomes thinner along the length direction to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibrating plate includes a fixed portion and a vibrating portion; the fixed portion is a rectangular plate; the vibrating portion is rectangular, and its thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; the thicker end of the vibrating portion has the same thickness as the fixed portion, and the thicker end of the vibrating portion is fixedly connected to the fixed portion; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along the length of the vibration part be x1, the distance between the thickest point of the acoustic black hole structure and point p along the length of the vibration part be x, and the thickness of the vibration part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

[0010] As a further optimization solution of the fourth ultrasonic cooling device of the present invention, the vibration part is provided with a plurality of through grooves along its length direction.

[0011] The present invention also discloses a fifth ultrasonic cooling device, which utilizes an acoustic black hole structure that gradually becomes thinner along the length direction to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration piece includes a fixed portion, a first vibration portion and a second vibration portion; The fixing portion is a rectangular plate; The first vibrating part and the second vibrating part have the same structure, are both rectangular, and their thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; and the thicker ends of the first vibrating part and the second vibrating part have the same thickness as the fixed part; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along its length be x1, the distance between the thickest point of the acoustic black hole structure and point p along its length be x, and the thickness of the vibrating part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The thicker ends of the first vibrating part and the second vibrating part are both fixedly connected to the fixed part, so that the first vibrating part and the second vibrating part are symmetrically arranged at both ends of the fixed part; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

[0012] As a further optimization solution of the fifth ultrasonic cooling device of the present invention, the first vibrating part and the second vibrating part are both provided with a plurality of through grooves along their length directions.

[0013] The present invention also discloses a sixth ultrasonic cooling device, which utilizes an acoustic black hole structure that gradually becomes thinner along the length direction to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration plate includes a fixed portion and first to fourth vibration portions; The vibration piece includes a fixed portion and N vibration portions, where N is a natural number greater than or equal to 3; The fixing portion is a regular N-sided plate, comprising two end faces and N side faces; The vibrating portion is rectangular, and its thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; and the thicker end of the vibrating portion has the same thickness as the fixed portion; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along its length be x1, the distance between the thickest point of the acoustic black hole structure and point p along its length be x, and the thickness of the vibrating part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The thicker ends of the N vibrating parts are fixedly connected to the N side surfaces of the fixed part in a one-to-one correspondence, so that the N vibrating parts are evenly arranged in the circumferential direction of the fixed part; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

[0014] Compared with the prior art, the present invention adopts the above technical solution and has the following technical effects: 1. This invention uses a piezoelectric element to drive the vibrating plate to vibrate within the ultrasonic frequency band, forming acoustic vortexes on the surface of the heating element to improve the heat exchange coefficient, thereby achieving efficient heat dissipation. 2. Excluding mechanical components such as bearings, it has a longer lifespan than traditional rotary heat sinks; 3. The present invention does not directly contact the heating element, thus avoiding the impact of vibration on the performance of the heating element during the heat dissipation process; 4. The present invention operates in the ultrasonic frequency band, achieving low or no noise heat dissipation; 5. The present invention has a small volume and mass, and has various layout forms, and is particularly suitable for use in small electronic products with small installation space for heat dissipation devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic cross-sectional view of a first embodiment of the present invention; Figure 2 is a schematic top view of a first embodiment of the present invention; Figure 3 is a schematic cross-sectional view of a second embodiment of the present invention; Figure 4 is a schematic cross-sectional view of a third embodiment of the present invention; Figure 5 is a schematic top view of a third embodiment of the present invention; Figure 6 is a schematic cross-sectional view of a fourth embodiment of the present invention; Figure 7 It is a finite element software simulation diagram of the cooling experiment performed by the present invention.

[0016] In the figure, 1-vibration plate, 2-piezoelectric component, 3-radial slot, 4-excitation auxiliary plate. DETAILED DESCRIPTION

[0017] The technical solution of the present invention is further described in detail below with reference to the accompanying drawings: The present invention can be implemented in many different forms and should not be considered to be limited to the embodiments described herein. On the contrary, these embodiments are provided to make this disclosure thorough and complete and will fully convey the scope of the invention to those skilled in the art. In the accompanying drawings, components are enlarged for clarity.

[0018] like Figure 1 As shown, the present invention discloses an ultrasonic cooling device, which utilizes a radial acoustic black hole structure that gradually becomes thicker from the inside to the outside to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration plate is in the shape of a disk, comprising a first end surface and a second end surface, and a concave surface is provided at the center of the second end surface to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component includes a plurality of annular piezoelectric ceramic sheets or circular piezoelectric ceramic sheets; the annular piezoelectric ceramic sheets are arranged outside the acoustic black hole structure and are coaxial with the corresponding acoustic black hole structure; The piezoelectric component is used to excite the vibration plate to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the acoustic black hole structure.

[0019] In this ultrasonic cooling device, the vibrating plate can be provided with a through hole at the center of the acoustic black hole structure or with a plurality of radial through slots on the acoustic black hole structure, such as Figure 2 shown.

[0020] like Figure 3 As shown, the present invention also discloses a second ultrasonic cooling device, which uses a radial acoustic black hole structure that gradually becomes thicker from the inside to the outside to generate an acoustic flow for cooling, and includes a vibrating plate, an excitation auxiliary plate, and a piezoelectric component; The vibrating plate is disc-shaped and includes a first end surface and a second end surface, and a concave surface is provided at the center of the second end surface to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The second end surface of the vibration plate is fixedly connected to one side of the excitation auxiliary plate; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the side of the excitation auxiliary plate away from the vibration plate and is coaxial with the acoustic black hole structure, and is used to excite the vibration plate to vibrate, thereby causing the acoustic black hole structure to generate acoustic flow vortices for cooling on the side away from the excitation auxiliary plate.

[0021] In the second ultrasonic cooling device, the vibration plate may be provided with a through hole at the center of the acoustic black hole structure or a plurality of radial through grooves may be provided on the acoustic black hole structure.

[0022] like Figure 4 、 Figure 5 As shown, the present invention also discloses a third ultrasonic cooling device, which utilizes a radial acoustic black hole structure that gradually thickens from the outside to the inside to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibrating plate includes a gradient portion and a central portion, the central portion is disc-shaped; the gradient portion is annular and includes a first end face and a second end face, the thickness between the second end face and the first end face gradually increases from the outside to the inside, the innermost portion has the same thickness as the central portion, and the innermost portion and the central portion are coaxially fixed to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component uses a circular piezoelectric ceramic piece or an annular piezoelectric ceramic piece, and is set at the center of the vibration piece, coaxial with the center of the vibration piece, for exciting the vibration piece to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the acoustic black hole structure.

[0023] In the third ultrasonic cooling device, the vibrating plate may be provided with a plurality of radial through grooves on the acoustic black hole structure.

[0024] like Figure 6 As shown, the present invention also discloses a fourth ultrasonic cooling device, which utilizes an acoustic black hole structure that gradually becomes thinner along the length direction to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibrating plate includes a fixed portion and a vibrating portion; the fixed portion is a rectangular plate; the vibrating portion is rectangular, and its thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; the thicker end of the vibrating portion has the same thickness as the fixed portion, and the thicker end of the vibrating portion is fixedly connected to the fixed portion; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along the length of the vibration part be x1, the distance between the thickest point of the acoustic black hole structure and point p along the length of the vibration part be x, and the thickness of the vibration part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

[0025] In the fourth ultrasonic cooling device, a plurality of through grooves along the length direction of the vibrating portion may be provided on the vibrating portion.

[0026] The present invention also discloses a fifth ultrasonic cooling device, which utilizes an acoustic black hole structure that gradually becomes thinner along the length direction to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration piece includes a fixed portion, a first vibration portion and a second vibration portion; The fixing portion is a rectangular plate; The first vibrating part and the second vibrating part have the same structure, are both rectangular, and their thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; and the thicker ends of the first vibrating part and the second vibrating part have the same thickness as the fixed part; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along its length be x1, the distance between the thickest point of the acoustic black hole structure and point p along its length be x, and the thickness of the vibrating part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The thicker ends of the first vibrating part and the second vibrating part are both fixedly connected to the fixed part, so that the first vibrating part and the second vibrating part are symmetrically arranged at both ends of the fixed part; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

[0027] In the fifth ultrasonic cooling device, the first vibrating part and the second vibrating part may both be provided with a plurality of through grooves along their length directions.

[0028] The present invention also discloses a sixth ultrasonic cooling device, which utilizes an acoustic black hole structure that gradually becomes thinner along the length direction to generate an acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration piece includes a fixed portion and N vibration portions, where N is a natural number greater than or equal to 3; The fixing portion is a regular N-sided plate, comprising two end faces and N side faces; The vibrating portion is rectangular, and its thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; and the thicker end of the vibrating portion has the same thickness as the fixed portion; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along its length be x1, the distance between the thickest point of the acoustic black hole structure and point p along its length be x, and the thickness of the vibrating part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The thicker ends of the N vibrating parts are fixedly connected to the N side surfaces of the fixed part in a one-to-one correspondence, so that the N vibrating parts are evenly arranged in the circumferential direction of the fixed part; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

[0029] In the sixth ultrasonic cooling device, the vibrating portion may be provided with a plurality of through grooves along its length direction.

[0030] The effects of the present invention are described below with the aid of experimental results and finite element simulation software.

[0031] In the experiment, the object being cooled was a copper sheet with an electric heating film bonded to its surface. The copper sheet measured ∅30 mm by 0.3 mm. The ultrasonic cooling device consisted of a disc-shaped vibrating plate with a black hole structure and a circular flat plate bonded with a piezoelectric disc. The vibrating plate was made of aluminum alloy 6063, with an outer diameter of 50 mm and a thickness of 5 mm. The diameter of the black hole structure was 34 mm, and the cross-sectional thickness of the black hole structure varied along its length in a power function, as follows: h(x) = 0.005(17-x). 2 [mm], 2mm≤x≤17mm, the size of the piezoelectric disc is ∅10mm*2mm, the material of the piezoelectric disc is C213, the material of the circular plate is aluminum alloy 6063, and the size is ∅50mm*1.5mm.

[0032] During the experiment, the object being cooled had an input power of 4.25W and an initial temperature of 203°C. The ultrasonic cooling device was loaded with alternating current at a frequency of 133.42kHz. The distance between the apex of the black hole structure and the heat sources on either side was 2.7 wavelengths.

[0033] When the input power of the ultrasonic cooling device was 0.86 W, the temperature of the heat source was cooled from 203 °C to 148 °C.

[0034] When the input power of the ultrasonic cooling device is 0.86 W and the initial temperature of the heat source is 203°C, the heat dissipated by the ultrasonic cooling device is 3.72 W. The energy coefficient (COP) of the ultrasonic cooling device is 4.33.

[0035] When the input power of the ultrasonic cooling device is 0.22W and the initial temperature of the heat source is 203℃, the heat dissipated by the ultrasonic cooling device on the convex side of the heat source is 2.1W, and the energy coefficient (COP) of the ultrasonic cooling device is 26.3.

[0036] Reference Figure 7 As shown in the figure, a two-dimensional axisymmetric model is used in the modeling, and the object to be cooled is simplified as a flat plate parallel to the heat sink. The object to be cooled is cooled by the ultrasonic cooling device. The distance between the upper surface of the ultrasonic cooling device and the upper heating element is 2.7 times the wavelength at the current working frequency. First, the standing wave sound field around the heating element is calculated, and then the sound field can be used to calculate Figure 5 Acoustic flow vortex shown.

[0037] When using an ultrasonic cooling device to dissipate heat from a heating element, an acoustic vortex is generated on the surface of the heating element, with an average flow velocity of approximately 0.8 m / s. These acoustic vortices can be used to dissipate heat from the object being cooled.

[0038] The ultrasonic cooling device of the present invention uses an excitation unit bonded to a vibrating plate to excite the plate. During operation, an ultrasonic field with a spatial gradient is generated near the black hole structure, generating acoustic eddy currents. These eddy currents cool the heat source. This ultrasonic cooling device boasts a compact structure, flexible layout, high energy efficiency, and low operating noise, making it suitable for cooling chips in various AI products and other consumer electronics.

[0039] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art in the art to which this invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with their meanings in the context of the prior art and, unless defined as such, will not be interpreted in an idealized or overly formal sense.

[0040] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An ultrasonic cooling device, characterized in that: A radial acoustic black hole structure that gradually thickens from the inside to the outside is used to generate acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibration plate is in the shape of a disk, comprising a first end surface and a second end surface, and a concave surface is provided at the center of the second end surface to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component includes a plurality of annular piezoelectric ceramic sheets or circular piezoelectric ceramic sheets; the annular piezoelectric ceramic sheets are arranged outside the acoustic black hole structure and are coaxial with the corresponding acoustic black hole structure; The piezoelectric component is used to excite the vibration plate to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the acoustic black hole structure.

2. The ultrasonic cooling device according to claim 1, characterized in that The vibration plate is provided with a through hole at the center of the acoustic black hole structure or a plurality of radial through grooves are provided on the acoustic black hole structure.

3. An ultrasonic cooling device, characterized in that: The invention utilizes a radial acoustic black hole structure that gradually becomes thicker from the inside to the outside to generate an acoustic flow for cooling, and comprises a vibration plate, an excitation auxiliary plate and a piezoelectric component; The vibrating plate is disc-shaped and includes a first end surface and a second end surface, and a concave surface is provided at the center of the second end surface to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The second end surface of the vibration plate is fixedly connected to one side of the excitation auxiliary plate; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the side of the excitation auxiliary plate away from the vibration plate and is coaxial with the acoustic black hole structure, and is used to excite the vibration plate to vibrate, thereby causing the acoustic black hole structure to generate acoustic flow vortices for cooling on the side away from the excitation auxiliary plate.

4. An ultrasonic cooling device, characterized in that: A radial acoustic black hole structure that gradually thickens from the outside to the inside is used to generate acoustic flow for cooling, and includes a vibrating plate and a piezoelectric component; The vibrating plate includes a gradient portion and a central portion, the central portion is disc-shaped; the gradient portion is annular and includes a first end face and a second end face, the thickness between the second end face and the first end face gradually increases from the outside to the inside, the innermost portion has the same thickness as the central portion, and the innermost portion and the central portion are coaxially fixed to form an acoustic black hole structure; For any point p on the acoustic black hole structure, on the cross section along the thickness direction passing through this point and the center of the acoustic black hole structure, let the shortest distance between the thickest and thinnest points of the acoustic black hole structure on the first end surface be x1, the shortest distance between the thickest point of the acoustic black hole structure and point p on the first end surface be x, and the thickness of the acoustic black hole structure at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component uses a circular piezoelectric ceramic piece or an annular piezoelectric ceramic piece, and is set at the center of the vibration piece, coaxial with the center of the vibration piece, for exciting the vibration piece to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the acoustic black hole structure.

5. The ultrasonic cooling device according to claim 4, characterized in that: The vibration plate is provided with a plurality of radial through grooves on the acoustic black hole structure.

6. An ultrasonic cooling device, characterized in that: An acoustic black hole structure that gradually becomes thinner along the length direction is used to generate an acoustic flow for cooling, and the structure includes a vibrating plate and a piezoelectric component; The vibrating plate includes a fixed portion and a vibrating portion; the fixed portion is a rectangular plate; the vibrating portion is rectangular, and its thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; the thicker end of the vibrating portion has the same thickness as the fixed portion, and the thicker end of the vibrating portion is fixedly connected to the fixed portion; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along the length of the vibration part be x1, the distance between the thickest point of the acoustic black hole structure and point p along the length of the vibration part be x, and the thickness of the vibration part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

7. The ultrasonic cooling device according to claim 6, characterized in that The vibrating part is provided with a plurality of through slots along the length direction thereof.

8. An ultrasonic cooling device, characterized in that: An acoustic black hole structure that gradually becomes thinner along the length direction is used to generate an acoustic flow for cooling, and the structure includes a vibrating plate and a piezoelectric component; The vibration piece includes a fixed portion, a first vibration portion and a second vibration portion; The fixing portion is a rectangular plate; The first vibrating part and the second vibrating part have the same structure, are both rectangular, and their thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; and the thicker ends of the first vibrating part and the second vibrating part have the same thickness as the fixed part; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along its length be x1, the distance between the thickest point of the acoustic black hole structure and point p along its length be x, and the thickness of the vibrating part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The thicker ends of the first vibrating part and the second vibrating part are both fixedly connected to the fixed part, so that the first vibrating part and the second vibrating part are symmetrically arranged at both ends of the fixed part; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

9. The ultrasonic cooling device according to claim 8, characterized in that: The first vibrating part and the second vibrating part are both provided with a plurality of through slots along the length direction thereof.

10. An ultrasonic cooling device, characterized in that: An acoustic black hole structure that gradually becomes thinner along the length direction is used to generate an acoustic flow for cooling, and the structure includes a vibrating plate and a piezoelectric component; The vibration piece includes a fixed portion and N vibration portions, where N is a natural number greater than or equal to 3; The fixing portion is a regular N-sided plate, comprising two end faces and N side faces; The vibrating portion is rectangular, and its thickness gradually becomes thinner along the length direction, forming an acoustic black hole structure; and the thicker end of the vibrating portion has the same thickness as the fixed portion; For any point p on the acoustic black hole structure, let the distance between the thickest and thinnest points of the acoustic black hole structure along its length be x1, the distance between the thickest point of the acoustic black hole structure and point p along its length be x, and the thickness of the vibrating part at point p be h(x), then h(x)=ε(x1-x) m , where ε is the preset constant threshold; m is the preset exponential threshold, m≥2; The thicker ends of the N vibrating parts are fixedly connected to the N side surfaces of the fixed part in a one-to-one correspondence, so that the N vibrating parts are evenly arranged in the circumferential direction of the fixed part; The piezoelectric component uses a piezoelectric ceramic sheet, which is arranged on the fixed part and is used to excite the vibration sheet to vibrate, thereby generating acoustic flow vortices for cooling on both sides of the vibration part.

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