Display panels and electronic devices

Abstract

The embodiments of the present application provide a display panel and electronic device, relating to the field of display technology. In the display panel, a raised portion, partially located between the isolation structure and the substrate, is provided on a first side of an isolation opening. This can reduce the steepness of the slope of the packaging unit on this side during the manufacturing process relative to the second side, facilitating continuous film formation at this side. When manufacturing the packaging unit, a second packaging portion with a larger average film thickness can be formed at the first side to improve the first side's resistance to concentrated stress. This can improve the packaging effect of the packaging unit on this side, thereby improving the overall packaging effect of the display panel and ensuring that the display panel has a good display effect.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and an electronic device. Background Art

[0002] Organic light emitting diodes (OLEDs) are considered the next generation display technology after liquid crystal displays (LCDs). Due to their exceptional color and image quality, they are widely used in a variety of consumer electronics products, including smartphones, TVs, laptops, desktop computers, in-car displays, and wearable devices, and have become a mainstream technology in display panels. Traditionally, in the production of display panels, the patterning of luminous pixels is typically achieved using a fine metal mask (FMM). FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limited precision, high development costs, and long development cycles. The use of a fine metal mask eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe the non-fine metal mask technology for reference.

[0003] However, the process performance of current OLED display products needs to be further improved. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel and an electronic device.

[0005] In a first aspect of the present application, a display panel is provided, comprising:

[0006] substrate;

[0007] an isolation structure, located on one side of the substrate and enclosing a plurality of isolation openings;

[0008] a light emitting device, at least partially located within the isolation opening;

[0009] an encapsulation unit extending from a side of the light-emitting device away from the substrate along a sidewall of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate;

[0010] The packaging unit includes a first packaging portion, a second packaging portion, and a third packaging portion that are connected to each other, wherein the first packaging portion is located on a side of the light-emitting device away from the substrate, the second packaging portion is attached to a side wall of the isolation structure facing the isolation opening, and the third packaging portion is attached to a side of the isolation structure facing the substrate;

[0011] The isolation opening includes a first side and a second side relative to each other. On the first side, the display panel also includes a raised portion partially located between the isolation structure and the substrate, and the average film thickness of the second packaging portion on the first side is greater than the average film thickness of the second packaging portion on the second side.

[0012] In one possible implementation of the present application, the display panel further includes a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate;

[0013] The pixel defining layer includes a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, and at least part of the light emitting device is located within the pixel opening;

[0014] The raised portion is located between the pixel defining layer and the isolation structure. On the first side, the raised portion extends out from one end of the isolation structure close to the substrate, and the positive projection area of ​​the raised portion on the substrate is smaller than the projection area of ​​the pixel defining layer on the substrate.

[0015] In a possible implementation of the present application, on the first side, an angle between a sidewall of the raised portion facing the pixel opening and a bottom of the raised portion facing the substrate is a first angle, and the first angle is an acute angle;

[0016] An angle between a sidewall of the pixel defining layer facing the pixel opening and a bottom of the pixel defining layer facing the substrate is a second angle, and the second angle is an acute angle;

[0017] The first angle is greater than or equal to the second angle;

[0018] On the first side, a thickness of the first encapsulation portion contacting the pixel definition layer is equal to a thickness of the first encapsulation portion contacting the corresponding raised portion.

[0019] In a possible implementation of the present application, an orthographic projection of the raised portion on the substrate is located within an orthographic projection of the pixel defining layer on the substrate;

[0020] The orthographic projection outline of one side of the elevated portion on the substrate is located outside the orthographic projection of the isolation structure on the substrate, and the orthographic projection outline of the other side of the elevated portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

[0021] In a possible implementation of the present application, the material of the raised portion includes an inorganic material;

[0022] In a direction perpendicular to the plane of the substrate, the thickness of the raised portion is smaller than the thickness of the pixel defining layer;

[0023] On the first side, the packaging unit contacts a portion of the raised portion.

[0024] In a possible implementation of the present application, the first packaging portion has a first slope change on the first side, and the first packaging portion has a second slope change on the second side, wherein the first slope change is smaller than the second slope change.

[0025] In one possible implementation manner of the present application, the first encapsulation portion forms a first protrusion and a second protrusion at a position close to the first side, wherein the orthographic projection of the first protrusion on the substrate covers an end of the pixel defining layer close to the first side, and the orthographic projection of the second protrusion on the substrate covers an end of the raised portion corresponding to the isolation opening;

[0026] The first encapsulation portion forms a third protrusion at a position close to the second side, and an orthographic projection of the third protrusion on the substrate covers an end of the pixel defining layer close to the second side.

[0027] In a possible embodiment of the present application, the first packaging part and the third packaging part form a first packaging opening on the first side, and the first packaging part and the third packaging part form a second packaging opening on the second side. In a direction perpendicular to the plane of the substrate, the first packaging opening has a first opening size, and the second packaging opening has a second opening size, wherein the first opening size is smaller than the second opening size.

[0028] In a possible implementation of the present application, the first opening size is zero, and the second opening size is greater than zero.

[0029] In one possible implementation of the present application, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode, wherein the second electrode is insulated from the isolation structure on the first side and electrically connected to the isolation structure on the second side;

[0030] The light emitting material layer is insulated from both the isolation structure on the first side and the isolation structure on the second side.

[0031] In one possible implementation of the present application, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode, wherein the second electrode is electrically connected to the isolation structure on the first side and the isolation structure on the second side, respectively;

[0032] The light emitting material layer is insulated from both the isolation structure on the first side and the isolation structure on the second side.

[0033] In a possible implementation of the present application, on the first side, an edge of the light-emitting material layer is located on a side of the elevated portion away from the substrate;

[0034] On the second side, an edge of the light-emitting material layer is located on a side of the pixel defining layer away from the substrate.

[0035] In a possible implementation of the present application, the isolation structure includes a first isolation portion and a second isolation portion that are stacked, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0036] A portion of the second packaging portion is aligned with the first isolation portion toward a sidewall of the corresponding isolation opening, and the third packaging portion is aligned with a side of the second isolation portion toward the substrate.

[0037] In one possible implementation of the present application, the isolation structure further includes a third isolation portion, wherein in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0038] On the first side, at least a portion of the raised portion is located between the pixel defining layer and the third isolation portion;

[0039] On the first side, the raised portion extends relative to the third isolation portion toward the pixel opening;

[0040] An edge of one side of the raised portion close to the isolation opening is flush with an edge of one side of the second isolation portion close to the isolation opening.

[0041] In a possible implementation of the present application, the display panel further includes: a first encapsulation layer, the first encapsulation layer being located on a side of the encapsulation unit away from the substrate, the first encapsulation layer at least covering the encapsulation unit;

[0042] The first encapsulation layer fills the isolation opening;

[0043] The display panel further includes a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate;

[0044] The encapsulation unit and the second encapsulation layer are inorganic encapsulation layers, and the first encapsulation layer is an organic encapsulation layer.

[0045] A second aspect of the present application further provides a display panel, comprising:

[0046] substrate;

[0047] an isolation structure, located on one side of the substrate and enclosing a plurality of isolation openings;

[0048] a light emitting device, at least partially located within the isolation opening;

[0049] an encapsulation unit extending from a side of the light-emitting device away from the substrate along a sidewall of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate;

[0050] The packaging unit includes a first packaging portion, a second packaging portion, and a third packaging portion that are connected to each other, wherein the first packaging portion is located on a side of the light-emitting device away from the substrate, the second packaging portion is attached to a side wall of the isolation structure facing the isolation opening, and the third packaging portion is attached to a side of the isolation structure facing the substrate;

[0051] The isolation opening includes a first side and a second side relative to each other. On the first side, the display panel also includes a raised portion partially located between the isolation structure and the substrate. The first packaging portion and the third packaging portion form a first packaging opening on the first side, and the first packaging portion and the third packaging portion form a second packaging opening on the second side. In a direction perpendicular to the plane of the substrate, the first packaging opening has a first opening size, and the second packaging opening has a second opening size, wherein the first opening size is smaller than the second opening size.

[0052] According to a third aspect of the present application, an electronic device is provided, comprising a display panel according to any one of the possible implementations of the first and second aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0054] Figure 1 A schematic structural diagram illustrating the display panel of this embodiment;

[0055] Figure 2 A schematic diagram illustrating the positional relationship between the isolation structure and the isolation opening provided in this embodiment;

[0056] Figure 3 Example Figure 2 One of the cross-sectional diagrams at the AA position;

[0057] Figure 4 The schematic diagram of the substrate provided by this embodiment is illustrated;

[0058] Figure 5 The pixel circuit schematic diagram provided by this embodiment is illustrated;

[0059] Figure 6 Example Figure 2 The second cross-sectional diagram at the AA position;

[0060] Figure 7 Example Figure 2 The third cross-sectional diagram at the AA position;

[0061] Figure 8 Example Figure 2 The fourth cross-sectional diagram at the AA position;

[0062] Figure 9 Example Figure 2 The fifth cross-sectional diagram at the AA position;

[0063] Figure 10 Example Figure 2 The sixth cross-sectional diagram at the AA position.

[0064] Icons: 1-display panel; 11-substrate; 12-isolation structure; 1201-isolation opening; 1201a-first side; 1201b-second side; 121-first isolation portion; 122-second isolation portion; 123-third isolation portion; 13-light-emitting device; 131-first electrode; 132-light-emitting material layer; 133-second electrode; 14-raised portion; 15-pixel defining layer; 1501-pixel opening; 161-packaging unit; 1611-first packaging portion; 1611a-first protrusion; 1611b-second protrusion; 1611c-third protrusion; 1612-second packaging portion; 1613-third packaging portion; 162-first packaging layer; 163-second packaging layer. DETAILED DESCRIPTION

[0065] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0066] In the description of this application, it should be noted that the terms "upper" and "lower" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. These are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0067] Increasing the density of light-emitting devices (i.e., pixel density) in display panels is an important way to improve display quality. However, current display panels manufactured using fine metal deposition mask (FMM) technology are currently unable to further increase the density of light-emitting devices due to technical limitations. After extensive research, the inventors discovered that, to address this technical issue, isolation structures can be incorporated into some display panels. During the full-layer vapor deposition of the light-emitting material layer and electrodes, the light-emitting material layer and electrodes can be disconnected at the isolation structure. Through multiple vapor deposition and etching processes, light-emitting devices of different colors can be formed in different isolation openings. This process is also known as light-emitting device patterning.

[0068] In the above-mentioned display panel, there is a problem that some light-emitting devices display dark spots, which will affect the overall display effect of the display panel, seriously affect the consumer's experience of use, and reduce the market competitiveness of electronic products equipped with the display panel. In order to solve the above-mentioned problems, the inventors innovatively designed the following technical solutions, and the specific implementation scheme of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the above-mentioned solutions in the prior art are the results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in this embodiment below for the above-mentioned problems should all be the contributions made by the inventors to this application in the process of invention and creation, and should not be understood as technical contents known to those skilled in the art.

[0069] Figure 1This is a schematic diagram of the structure of a display panel 1 according to one embodiment of the present application. The display panel 1 can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel 1 includes a display area AA with display functionality and a non-display area NA.

[0070] The display area AA of the display panel 1 may be in a rectangular shape, or in other shapes such as a square, a circle, or an ellipse.

[0071] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. The pixels PX include a plurality of sub-pixels SPX that display different colors. In some embodiments, the pixels PX include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to the sub-pixels SPX1, SPX2, and SPX3, the pixels PX also include sub-pixels SPX that emit white light or other colors.

[0072] Subpixels SPX include pixel circuits and light-emitting devices driven by the pixel circuits to emit light of corresponding colors. The first subpixel SPX1 includes a first light-emitting device, the second subpixel SPX2 includes a second light-emitting device, and the third subpixel SPX3 includes a third light-emitting device. Each pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is the display area corresponding to the sensor and has light-transmitting properties, while the normal display area is the display area not corresponding to the sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, while in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light.

[0073] In one embodiment, Figure 2 Shown Figure 1 Schematic diagram of a local area isolation structure of the display panel 1 enclosing an isolation opening. Figure 3 , showing Figure 2 Schematic diagram of the cross-sectional structure of part of the film layer along the AA direction, the display panel 1 includes a substrate 11, an isolation structure 12 and a plurality of light-emitting devices 13.

[0074] Among them, reference Figure 4 The substrate 11 includes a pixel circuit layer and a planarization layer 19. The pixel circuit layer includes a pixel circuit for driving the light-emitting device 13 to emit light. Figure 5The transistor 18 in the pixel circuit is shown. A via is provided in the planarization layer 19, and the first electrode 131 is electrically connected to the transistor 18 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Furthermore, the substrate 11 also includes a scan line that provides a scan signal Scan and a data line that provides a data signal Data to the pixel circuit.

[0075] refer to Figure 5 The pixel circuit includes a driving transistor T1 and a data transistor T2, the source of the data transistor T2 is connected to a data line providing a data signal Data, the gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, the drain of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device 13. Figure 4 This is an embodiment of the pixel circuit. The pixel circuit of this application is not limited to Figure 4 The 2T1C pixel circuit shown may also be other pixel circuits, such as a 7T1C, 8T1C pixel circuit, etc.

[0076] Please refer to Figure 2 and Figure 3 The isolation structure 12 is located on one side of the substrate 11 and encloses a plurality of isolation openings 1201. The isolation structure 12 forms an undercut structure, through which the entire surface-deposited light-emitting device layer (such as the light-emitting material layer and the electrode layer) can be disconnected at this position, so as to facilitate the independent formation of the light-emitting device film layer in different isolation openings 1201.

[0077] The light-emitting devices 13 are at least partially located within the corresponding isolation openings 1201. The light-emitting devices 13 correspond one-to-one to the isolation openings 1201, with one light-emitting device 13 corresponding to one isolation opening 1201. The display panel 1 includes light-emitting devices 13 of multiple different luminous colors. For example, the display panel 1 includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device. Adjacent red light-emitting devices, blue light-emitting devices, and green light-emitting devices can form a pixel unit. By controlling the luminance of the red light-emitting device, blue light-emitting device, and green light-emitting device in each pixel unit, the display brightness and color of each pixel unit can be controlled, thereby realizing the display of an image on the display panel 1.

[0078] The packaging unit 161 extends from a side of the light-emitting device 13 away from the substrate 11 along a sidewall of the isolation structure 12 toward the isolation opening 1201 to a side of the isolation structure 12 away from the substrate 11 .

[0079] In this embodiment, packaging unit 161 includes a first packaging portion 1611, a second packaging portion 1612, and a third packaging portion 1613 that are interconnected. First packaging portion 1611 is located on a side of light-emitting device 13 away from substrate 11. Second packaging portion 1612 is bonded to the sidewall of isolation structure 12 facing the corresponding isolation opening 1201. Third packaging portion 1613 is bonded to the side of isolation structure 12 facing substrate 11. First packaging portion 1611, second packaging portion 1612, and third packaging portion 1613 are integrally formed, made of the same material, and manufactured using the same process.

[0080] like Figure 3 As shown, on a first cross-section perpendicular to the plane where the substrate 11 is located and passing through the center of the adjacent isolation opening 1201, the isolation opening 1201 includes a first side 1201a (left side in the figure) and a second side 1201b (right side in the figure) relative to each other. On the first side 1201a, the display panel 11 also includes a raised portion 14 partially located between the isolation structure 12 and the substrate 11. A portion of the raised portion 14 is located between the isolation structure 12 and the substrate 11, and another portion of the raised portion 14 can extend relative to the isolation structure 12.

[0081] In this embodiment, the number of first sides 1201a in the isolation opening 1201 can be one or more. Taking the shape of the isolation opening 1201 as a rectangle as an example, when the light-emitting device 13 is overlapped with the isolation structure 12 in a single-sided overlap manner, the second side 1201b can be the overlapping side of the light-emitting device 13 and the isolation structure 12, and the first side 1201a can be only the side opposite to the overlapping side, or the other three sides except the overlapping side; when the light-emitting device 13 is overlapped with the isolation structure 12 in a double-sided overlap manner, the first side 1201a can be the other two sides except the two overlapping sides.

[0082] In this embodiment, the average film thickness of the second encapsulation portion 1612 on the first side 1201 a is greater than the average film thickness of the second encapsulation portion 1612 on the second side 1201 b .

[0083] The inventors have found that one possible factor causing the light-emitting device to display dark spots is the failure of the packaging unit 161 to package. In this embodiment, a raised portion 14 is provided on the first side 1201a of the isolation opening 1201, which is partially located between the isolation structure 12 and the substrate 11. This can reduce the steepness of the slope of the packaging unit 161 on this side during the manufacturing process relative to the second side 1201b, thereby facilitating continuous film formation at this side. When manufacturing the packaging unit 161, a second packaging portion 1612 with a larger average film thickness can be formed at the first side 1201a to improve the resistance of the first side 1201a to concentrated stress. This can improve the packaging effect of the packaging unit 161 on this side, thereby improving the overall packaging effect of the display panel, and ensuring that the display panel 1 has a good display effect.

[0084] Further, please refer to Figure 6 In this embodiment, the display panel 1 further includes a pixel defining layer 15. The pixel defining layer 15 is located on one side of the substrate 11, and the isolation structure 12 is located on the side of the pixel defining layer 15 away from the substrate 11. The pixel defining layer 15 includes a plurality of pixel openings 1501. In this embodiment, the pixel defining layer 15 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 15 is an inorganic pixel defining layer. When the pixel defining layer 15 is an inorganic pixel defining layer, the pixel defining layer 15 can be a single layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed by alternating silicon oxide and silicon nitride.

[0085] In this embodiment, the pixel opening 1501 is connected to the corresponding isolation opening 1201 . Exemplarily, the orthographic projection of the pixel opening 1501 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11 . At least part of the light emitting device 13 is located within the corresponding pixel opening 1501 .

[0086] In this embodiment, the raised portion 14 is located between the pixel defining layer 15 and the isolation structure 12. On the first side 1201a, the raised portion 14 extends relative to one end of the isolation structure 12 close to the substrate 11. Specifically, the raised portion 14 extends relative to the isolation structure 12 toward the pixel opening 1501.

[0087] In this embodiment, the orthographic projection area of ​​the elevated portion 14 on the substrate 11 is smaller than the projection area of ​​the pixel defining layer 15 on the substrate 11, that is, the orthographic projection of the elevated portion 14 on the substrate 11 is located within the orthographic projection of the pixel defining layer 15 on the substrate 11. On the first side 1201a, the pixel defining layer 15 protrudes relative to the elevated portion 14. Specifically, on a first cross-section perpendicular to the plane of the substrate 11 and passing through the center of an adjacent isolation opening 1201, the orthographic projection of one side of the elevated portion 14 on the substrate 11 is located outside the orthographic projection of the isolation structure 12 on the substrate 11, while the orthographic projection of the other side of the elevated portion 14 on the substrate 11 is located within the orthographic projection of the isolation structure 12 on the substrate 11.

[0088] On the first side 1201a, as Figure 3 As shown, the angle between the side wall of the raised portion 14 facing the pixel opening 1501 and the bottom of the raised portion 14 facing the substrate 11 is a first angle α1, and the first angle α1 is an acute angle. The angle between the side wall of the pixel defining layer 15 facing the pixel opening 1501 and the bottom of the pixel defining layer 15 facing the substrate 11 is a second angle α2, and the second angle α2 is an acute angle. The first angle α1 is greater than or equal to the second angle α2. The angle α2 is 30 degrees to 45 degrees. For example, the angle α2 is 30 degrees, 35 degrees, 40 degrees, 45 degrees, etc., and the angle α1 is 40 degrees to 60 degrees. In the process of preparing the first packaging part 1611 by chemical vapor deposition, the airflow can evenly adhere to the protruding side formed by the padding part 14 and the pixel definition layer 15. On the first side 1201a, the film thickness of the first packaging part 1611 in contact with the pixel definition layer 15 is equal to the film thickness of the first packaging part 1611 in contact with the corresponding padding part 14.

[0089] Please refer again Figure 6 The first packaging portion 1611 forms a first protrusion 1611a and a second protrusion 1611b at a position close to the first side 1201a. The orthographic projection of the first protrusion 1611a on the substrate 11 covers one end of the pixel defining layer 15 close to the first side 1201a. The orthographic projection of the second protrusion 1611b on the substrate 11 covers the raised portion 14 located at one end corresponding to the isolation opening 1201.

[0090] The first encapsulation portion 1611 forms a third protrusion 1611c near the second side 1201b. The orthographic projection of the third protrusion 1611c on the substrate 11 covers the end of the pixel defining layer 15 near the second side 1201b. This arrangement forms two continuous steps on the first side 1201a formed by the pixel defining layer 15 and the elevated portion 14. Compared to a method where only a single step is formed by the pixel defining layer 15 on the second side 1201b, this facilitates continuous film formation on the first side 1201a when fabricating the encapsulation unit 161 using chemical vapor deposition (CVD). Specifically, the film thickness of the encapsulation unit 161 on the first side 1201a is greater than the film thickness of the encapsulation unit 161 on the second side 1201b.

[0091] In this embodiment, the material of the raised portion 14 includes an inorganic material. Exemplarily, the material of the raised portion 14 includes silicon oxide (SiOx) or silicon nitride (SiNx).

[0092] In the direction perpendicular to the plane of the substrate 11, the thickness d1 of the raised portion 14 is less than the thickness of the pixel defining layer 15. Exemplarily, the thickness d1 of the raised portion 14 is 2500 angstroms-3000 angstroms. Specifically, the thickness d1 of the raised portion 14 includes 2500 angstroms, 2550 angstroms, 2620 angstroms, 2680 angstroms, 2750 angstroms, 2800 angstroms, 2850 angstroms, 2880 angstroms, 2920 angstroms, 2980 angstroms or 3000 angstroms, etc.

[0093] In this embodiment, on the first side 1201a, the packaging unit 161 is in contact with a portion of the raised portion 14. Specifically, the packaging unit 161 is in contact with a portion of the raised portion 141 close to the isolation structure 12. Since the packaging unit 161 is made of inorganic material, such a design can improve the adhesion to the packaging unit 161 through the contact between the two, thereby preventing the packaging unit 161 from separating from the film layer in contact with it and forming a gap for water vapor to invade, thereby improving the packaging performance of the packaging unit 161.

[0094] In this embodiment, the first encapsulation portion 1611 has a first slope variation on the first side 1201a, and a second slope variation on the second side 1201b. As described above, on the first side 1201a, the pixel defining layer 15 and the elevated portion 14 form two continuous climbing steps, while on the second side 1201b, only the pixel defining layer 15 forms a single climbing step. The slope of the first side 1201a is more gradual than that of the second side 1201b, meaning that the slope variation of the first encapsulation portion 1611 on the first side 1201a is less than the slope variation of the first encapsulation portion 1611 on the second side 1201b. The slope variation is used to measure the undulation of the film surface; the smaller the slope variation, the flatter the film surface.

[0095] In this embodiment, please refer to Figure 3 On the first side 1201a, the first packaging portion 1611, the second packaging portion 1612, and the third packaging portion 1613 form a first packaging opening. On the second side 1201b, the first packaging portion 1611, the second packaging portion 1612, and the third packaging portion 1613 form a second packaging opening. In a direction perpendicular to the plane of the substrate 11 (the Z direction in the figure), the opening size of the first packaging opening is h1, and the opening size of the second packaging opening is h2. Because the first side 1201a has two continuous steps, it is easier to form a film layer at the first side 1201a when manufacturing the packaging unit 161. That is, the film thickness of the packaging unit 161 on the first side 1201a is greater than the film thickness of the packaging unit 161 on the second side 1201b. As a result, the opening size of the first packaging opening is smaller than the opening size of the second packaging opening, that is, the first distance h1 is smaller than the second distance h2.

[0096] Further, please refer to Figure 7 In one possible embodiment, the packaging opening formed by the first packaging part 1611, the second packaging part 1612 and the third packaging part 1613 on the first side 1201a can be closed, that is, the opening size h1 of the first packaging opening in the above embodiment is equal to zero; and the packaging opening formed by the first packaging part 1611, the second packaging part 1612 and the third packaging part 1613 on the second side 1201b is not closed, that is, the opening size h2 of the second packaging opening in the above embodiment is greater than zero.

[0097] Further, please refer again to Figure 3 and Figure 4 In a direction away from substrate 11 (direction Z in the figure), light-emitting device 13 includes a first electrode 131, a light-emitting material layer 132, and a second electrode 133, which are stacked in sequence. First electrode 131 is located on the side of pixel-defining layer 15 close to substrate 11. First electrode 131 is electrically connected to the pixel circuit formed in substrate 11. Pixel opening 1501 exposes at least a portion of first electrode 131. Second electrode 133 is electrically connected to isolation structure 12. In this embodiment, first electrode 131 may be the anode of light-emitting device 13, and second electrode 133 may be the cathode of light-emitting device 13.

[0098] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The provision of the isolation structure 12 enables the formation of film layers of light-emitting devices 13 of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel 1. The isolation structure 12 can isolate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, thereby making different light-emitting devices 13 independent of each other, thereby reducing crosstalk between adjacent light-emitting devices 13 and improving the display effect. Furthermore, the independence of adjacent light-emitting devices 13 allows for independent packaging, thereby improving the packaging yield. Furthermore, due to the presence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in each color of the light-emitting device 13 in the display panel 1 can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine metal mask and reducing the manufacturing cost of the display panel 1.

[0099] Please refer to Figure 6 In one possible implementation of this embodiment, on a first cross-section perpendicular to the plane of the substrate 11 and passing through the center of the adjacent isolation opening 1201, the second electrode 133 is insulated from the isolation structure 12 on the first side 1201a, and the second electrode 133 is electrically connected to the isolation structure 12 on the second side 1201b, that is, the light-emitting device 13 is overlapped on one side of the isolation structure 12.

[0100] In this embodiment, the light-emitting material layer 132 is insulated from the isolation structure 12 on the first side 1201a and the isolation structure 12 on the second side 1201b. This design can avoid the high conductive film layer (for example, the hole transport layer or the hole generation layer) in the light-emitting material layer 132 being electrically connected to the isolation structure 12, causing leakage of the light-emitting device 13, making the light-emitting device 13 insufficient in brightness under low grayscale images, and affecting the display effect of the display panel 1.

[0101] Please refer to Figure 8 In another possible implementation of this embodiment, on a first cross-section perpendicular to the plane of the substrate 11 and passing through the center of the adjacent isolation opening 1201, the second electrode 133 is electrically connected to the isolation structure 12 on the first side 1201a, and the second electrode 133 is electrically connected to the isolation structure 12 on the second side 1201b, that is, the light-emitting device 13 is overlapped with the isolation structure 12 on both sides.

[0102] In this embodiment, the light-emitting material layer 132 is insulated from the isolation structure 12 on the first side 1201a and the isolation structure 12 on the second side 1201b. This design can avoid the high conductive film layer (for example, the hole transport layer or the hole generation layer) in the light-emitting material layer 132 being electrically connected to the isolation structure 12, causing leakage of the light-emitting device 13, making the light-emitting device 13 insufficient in brightness under low grayscale images, and affecting the display effect of the display panel 1.

[0103] Please refer to Figure 6 and Figure 8 In this embodiment, on the first side 1201a, the edge of the light-emitting material layer 132 is located on the side of the elevated portion 14 away from the substrate 11, that is, on this side, the orthographic projection outline of the edge of the light-emitting material layer 132 on the substrate 11 is located within the orthographic projection of the elevated portion 14 on the substrate 11, and the light-emitting material layer 132 is at most evaporated onto the elevated portion 14 and will not overlap with the isolation structure 12.

[0104] On the second side 1201b, the edge of the light-emitting material layer 132 is located on the side of the pixel defining layer 15 away from the substrate 11, that is, on this side, the positive projection outline of the edge of the light-emitting material layer 132 on the substrate 11 is located within the positive projection of the pixel defining layer 15 on the substrate 11, and the light-emitting material layer 132 will at most be evaporated onto the pixel defining layer 15 without overlapping with the isolation structure 12.

[0105] Please refer to Figure 6 In this embodiment, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 stacked sequentially. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. The second isolation portion 122 extends relative to the first isolation portion 121 toward the corresponding isolation opening 1201. In a cross section perpendicular to the plane of the substrate 11 and passing through the center of the isolation opening 1201, the cross section of the isolation structure 12 may be T-shaped. The first isolation portion 121 is a conductive isolation portion, and the second electrode 133 can be electrically connected to the first isolation portion 121. For example, on the second side 1201b, the second electrode 133 is electrically connected to the first isolation portion 121 by overlapping.

[0106] Further, please refer again to Figure 9 In this embodiment, the isolation structure 12 further includes a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121 and the second isolation portion 122 are stacked in sequence. The orthographic projection of the first isolation portion 121 on the substrate 11 may be located within the orthographic projection of the third isolation portion 123 on the substrate 11. In a cross section perpendicular to the plane of the substrate 11 and passing through the center of the isolation opening 1201, the cross section of the isolation structure 12 may be I-shaped. The third isolation portion 123 is a conductive isolation portion, and the second electrode 133 may also be electrically connected to the third isolation portion 123. For example, on the second side 1201b, the second electrode 133 is electrically connected by overlapping with the third isolation portion 123.

[0107] Furthermore, in this embodiment, on the first side 1201a, the luminescent material layer 132 covers the side of the elevated portion 14 facing the isolation opening 1201, extends to the side of the elevated portion 14 facing away from the substrate 11, and is spaced apart from the third isolation portion 123. On the second side 1201b, the luminescent material layer 132 is spaced apart from the third isolation portion 123. Due to the conductivity of the third isolation portion 123, the luminescent material layer 132 is spaced apart from the third isolation portion 123, thereby preventing the luminescent material layer 132 from transferring carriers to the third isolation portion 123, which could cause leakage in the luminescent material layer 132 and result in poor display quality.

[0108] To ensure the overlap between the second electrode 133 and the second side 1201b, during the preparation of the light-emitting material layer 132 and the second electrode 133, the evaporation source of the light-emitting material layer 132 is rotated toward the first side 1201a. Due to the obstruction of the second isolation portion 122, the light-emitting material layer 132 does not contact the third isolation portion 123 on the second side 1201b, but is more likely to overlap with the isolation structure 12 on the first side 1201a. However, the provision of the raised portion 14 raises the height of the third isolation portion 123 on the first side 1201a, preventing the light-emitting material layer 132 from overlapping the third isolation portion 123. The evaporation source of the second electrode 133 is further rotated toward the second side 1201b, achieving overlap between the second electrode 133 and the third isolation portion 123 on the second side 1201b.

[0109] Furthermore, in this embodiment, due to the intersecting deposition directions of the luminescent material layer 132 and the second electrode 133, the second electrode 133 can easily fail to fully cover the luminescent material layer 132 on the first side 1201a. This makes the exposed luminescent material layer 132 more susceptible to moisture and failure, leading to dark spots. By configuring the protruding length, angles α1, and angles α2 of the raised portion 14, the encapsulation material can be more smoothly deposited on the first side 1201a, ensuring that the thicker first encapsulation portion 1611 covers the luminescent material layer 132 on the first side 1201a, thereby improving the encapsulation effect of the first encapsulation portion 1611.

[0110] In this embodiment, when the second electrode 133 of the light-emitting device 13 overlaps with the isolation structure 12 on the second side 1201b but does not overlap with the isolation structure 12 on the first side 1201a, the third isolation portion 123 has a first extension length relative to the first isolation portion 121 on the first side 1201a, and the third isolation portion 123 has a second extension length relative to the first isolation portion 121 on the second side 1201b, wherein the first extension length is smaller than the second extension length.

[0111] Optionally, the material of the first isolation portion 121 includes aluminum, silver, or copper, the material of the second isolation portion 122 includes titanium or molybdenum, and the material of the third isolation portion 123 includes molybdenum or titanium.

[0112] On the first side 1201 a , at least a portion of the raised portion 14 is located between the pixel defining layer 15 and the third isolation portion 123 . The raised portion 14 extends relative to the third isolation portion 123 toward the pixel opening 1501 .

[0113] To enable the first packaging portion 1611 and the third packaging portion 1613 to form a closed first packaging opening on the first side 1201 a , in this embodiment, an edge of the raised portion 14 close to the isolation opening 1201 is flush with an edge of the second isolation portion 122 close to the isolation opening 1201 .

[0114] Further, please refer to Figure 10 The display panel 1 also includes a first encapsulation layer 162 and a second encapsulation layer 163. The first encapsulation layer 162 covers the isolation structure 12 and the light-emitting device 13. The first encapsulation layer 162 also fills the isolation opening 1201. The side of the first encapsulation layer 162 away from the substrate 11 includes a flat surface. The second encapsulation layer 163 is located on the side of the first encapsulation layer 162 away from the substrate 11. The encapsulation unit 161 and the second encapsulation layer 163 are inorganic encapsulation layers, and the first encapsulation layer 162 is an organic encapsulation layer. For example, the encapsulation unit 161 and the second encapsulation layer 163 can be formed by chemical vapor deposition (CVD), and the first encapsulation layer 162 can be formed by inkjet printing (IJP). The encapsulation unit 161, the first encapsulation layer 162, and the second encapsulation layer 163 form the thin film encapsulation structure of the display panel 1.

[0115] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the second packaging layer 163 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0116] Based on the same inventive concept, this embodiment also provides a display panel. Please refer to Figure 2 and Figure 3 The display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13 and a packaging unit 161. The substrate 11 is a multi-layer structure. The substrate 11 includes at least multiple conductive layers and an interlayer insulating layer located between adjacent conductive layers. A pixel circuit that provides a driving signal for the light-emitting device 13 is formed in the substrate 11, wherein the conductive layer can be a metal conductive layer.

[0117] The isolation structure 12 is located on one side of the substrate 11 and encloses a plurality of isolation openings 1201. The isolation structure 12 forms an undercut structure, through which the entire surface-deposited light-emitting device layer (such as the light-emitting material layer, the electrode layer) can be disconnected at this position, so as to facilitate the independent formation of the light-emitting device film layer in different isolation openings 1201.

[0118] The light-emitting devices 13 are at least partially located within the corresponding isolation openings 1201. The light-emitting devices 13 correspond one-to-one to the isolation openings 1201, with one light-emitting device 13 corresponding to one isolation opening 1201. The display panel 1 includes light-emitting devices 13 of multiple different luminous colors. For example, the display panel 1 includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device. Adjacent red light-emitting devices, blue light-emitting devices, and green light-emitting devices can form a pixel unit. By controlling the luminance of the red light-emitting device, blue light-emitting device, and green light-emitting device in each pixel unit, the display brightness and color of each pixel unit can be controlled, thereby realizing the display of an image on the display panel 1.

[0119] The packaging unit 161 extends from a side of the light-emitting device 13 away from the substrate 11 along a sidewall of the isolation structure 12 toward the isolation opening 1201 to a side of the isolation structure 12 away from the substrate 11 .

[0120] In this embodiment, packaging unit 161 includes a first packaging portion 1611, a second packaging portion 1612, and a third packaging portion 1613 that are interconnected. First packaging portion 1611 is located on a side of light-emitting device 13 away from substrate 11. Second packaging portion 1612 is bonded to the sidewall of isolation structure 12 facing the corresponding isolation opening 1201. Third packaging portion 1613 is bonded to the side of isolation structure 12 facing substrate 11. First packaging portion 1611, second packaging portion 1612, and third packaging portion 1613 are integrally formed, made of the same material, and manufactured using the same process.

[0121] like Figure 3 As shown, the isolation opening 1201 includes a first side 1201a (the left side in the figure) and a second side 1201b (the right side in the figure) relative to each other. On the first side 1201a, the display panel 11 also includes a raised portion 14 partially located between the isolation structure 12 and the substrate 11. A portion of the raised portion 14 is located between the isolation structure 12 and the substrate 11, and another portion of the raised portion 14 can extend relative to the isolation structure 12.

[0122] In this embodiment, the number of first sides 1201a in the isolation opening 1201 can be one or more. Taking the shape of the isolation opening 1201 as a rectangle as an example, when the light-emitting device 13 is overlapped with the isolation structure 12 in a single-sided overlap manner, the second side 1201b can be the overlapping side of the light-emitting device 13 and the isolation structure 12, and the first side 1201a can be only the side opposite to the overlapping side, or the other three sides except the overlapping side; when the light-emitting device 13 is overlapped with the isolation structure 12 in a double-sided overlap manner, the first side 1201a can be the other two sides except the two overlapping sides.

[0123] Please refer again Figure 3 On the first side 1201a, the first packaging portion 1611, the second packaging portion 1612, and the third packaging portion 1613 form a first packaging opening. On the second side 1201b, the first packaging portion 1611, the second packaging portion 1612, and the third packaging portion 1613 form a second packaging opening. In a direction perpendicular to the plane of the substrate 11 (the Z direction in the figure), the opening size of the first packaging opening is h1, and the opening size of the second packaging opening is h2. Because the first side 1201a has two continuous steps, it is easier to form a film layer at the first side 1201a when manufacturing the packaging unit 161. That is, the film thickness of the packaging unit 161 on the first side 1201a is greater than the film thickness of the packaging unit 161 on the second side 1201b. As a result, the opening size of the first packaging opening is smaller than the opening size of the second packaging opening, that is, the first distance h1 is smaller than the second distance h2.

[0124] Please refer again Figure 7 In one possible embodiment, the packaging opening formed by the first packaging part 1611, the second packaging part 1612 and the third packaging part 1613 on the first side 1201a can be closed, that is, the opening size h1 of the first packaging opening in the above embodiment is equal to zero; and the packaging opening formed by the first packaging part 1611, the second packaging part 1612 and the third packaging part 1613 on the second side 1201b is not closed, that is, the opening size h2 of the second packaging opening in the above embodiment is greater than zero.

[0125] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the embodiment of the present application. The electronic device may include a smart phone, a tablet computer, a car display device, a smart wearable device, a television, a laptop computer, and other devices with display functions.

[0126] An embodiment of the present application provides a display panel and an electronic device. In the display panel, a raised portion located partially between the isolation structure and the substrate is provided on the first side of the isolation opening. This can reduce the steepness of the slope of the packaging unit on this side during the manufacturing process relative to the second side, thereby facilitating continuous film formation at this side. When manufacturing the packaging unit, a second packaging portion with a larger average film thickness can be formed at the first side to improve the first side's resistance to concentrated stress. This can improve the packaging effect of the packaging unit on this side, thereby improving the overall packaging effect of the display panel and ensuring that the display panel has a good display effect.

[0127] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; an isolation structure, located on one side of the substrate and enclosing a plurality of isolation openings; a light emitting device, at least partially located within the isolation opening; an encapsulation unit extending from a side of the light-emitting device away from the substrate along a sidewall of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate; The packaging unit includes a first packaging portion, a second packaging portion, and a third packaging portion that are connected to each other, wherein the first packaging portion is located on a side of the light-emitting device away from the substrate, the second packaging portion is attached to a side wall of the isolation structure facing the isolation opening, and the third packaging portion is attached to a side of the isolation structure facing the substrate; The isolation opening includes a first side and a second side relative to each other. On the first side, the display panel also includes a raised portion partially located between the isolation structure and the substrate, and the average film thickness of the second packaging portion on the first side is greater than the average film thickness of the second packaging portion on the second side.

2. The display panel according to claim 1, wherein The display panel further includes a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer includes a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, and at least part of the light emitting device is located within the pixel opening; The raised portion is located between the pixel defining layer and the isolation structure. On the first side, the raised portion extends out from one end of the isolation structure close to the substrate, and the positive projection area of ​​the raised portion on the substrate is smaller than the projection area of ​​the pixel defining layer on the substrate.

3. The display panel according to claim 2, wherein: On the first side, an angle between a sidewall of the raised portion facing the pixel opening and a bottom of the raised portion facing the substrate is a first angle, and the first angle is an acute angle; An angle between a sidewall of the pixel defining layer facing the pixel opening and a bottom of the pixel defining layer facing the substrate is a second angle, and the second angle is an acute angle; The first angle is greater than or equal to the second angle; On the first side, a thickness of the first encapsulation portion contacting the pixel definition layer is equal to a thickness of the first encapsulation portion contacting the corresponding raised portion.

4. The display panel according to claim 2, wherein: The orthographic projection of the raised portion on the substrate is located within the orthographic projection of the pixel defining layer on the substrate; The orthographic projection outline of one side of the elevated portion on the substrate is located outside the orthographic projection of the isolation structure on the substrate, and the orthographic projection outline of the other side of the elevated portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

5. The display panel according to claim 2, wherein: The material of the raised portion includes an inorganic material; In a direction perpendicular to the plane of the substrate, the thickness of the raised portion is smaller than the thickness of the pixel defining layer; On the first side, the packaging unit contacts a portion of the raised portion.

6. The display panel according to any one of claims 1 to 4, wherein: The first packaging portion has a first slope change on the first side, and the first packaging portion has a second slope change on the second side, wherein the first slope change is smaller than the second slope change.

7. The display panel according to any one of claims 2 to 4, wherein: The first encapsulation portion forms a first protrusion and a second protrusion at a position close to the first side, wherein the orthographic projection of the first protrusion on the substrate covers an end of the pixel defining layer close to the first side, and the orthographic projection of the second protrusion on the substrate covers an end of the raised portion corresponding to the isolation opening; The first encapsulation portion forms a third protrusion at a position close to the second side, and an orthographic projection of the third protrusion on the substrate covers an end of the pixel defining layer close to the second side.

8. The display panel according to any one of claims 1 to 4, wherein: The first packaging part and the third packaging part form a first packaging opening on the first side, and the first packaging part and the third packaging part form a second packaging opening on the second side. In the direction perpendicular to the plane of the substrate, the first packaging opening has a first opening size, and the second packaging opening has a second opening size, wherein the first opening size is smaller than the second opening size.

9. The display panel according to claim 8, wherein: The first opening size is zero, and the second opening size is greater than zero.

10. The display panel according to claim 1, wherein In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode, wherein the second electrode is insulated from the isolation structure on the first side and electrically connected to the isolation structure on the second side; The light emitting material layer is insulated from both the isolation structure on the first side and the isolation structure on the second side.

11. The display panel according to claim 1, wherein: In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode, wherein the second electrode is electrically connected to the isolation structure on the first side and the isolation structure on the second side respectively; The light emitting material layer is insulated from both the isolation structure on the first side and the isolation structure on the second side.

12. The display panel according to claim 10 or 11, wherein: On the first side, an edge of the light-emitting material layer is located on a side of the raised portion away from the substrate; On the second side, an edge of the light-emitting material layer is located on a side of the pixel defining layer away from the substrate.

13. The display panel according to claim 1, wherein The isolation structure includes a first isolation portion and a second isolation portion that are stacked, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; A portion of the second packaging portion is aligned with the first isolation portion toward a sidewall of the corresponding isolation opening, and the third packaging portion is aligned with a side of the second isolation portion toward the substrate.

14. The display panel according to claim 13, wherein: The isolation structure further includes a third isolation portion, wherein the third isolation portion, the first isolation portion, and the second isolation portion are sequentially stacked in a direction away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate; On the first side, at least a portion of the raised portion is located between the pixel defining layer and the third isolation portion; On the first side, the raised portion extends toward the pixel opening relative to the third isolation portion; An edge of one side of the raised portion close to the isolation opening is flush with an edge of one side of the second isolation portion close to the isolation opening.

15. The display panel according to claim 1, wherein The display panel further includes: a first encapsulation layer, the first encapsulation layer being located on a side of the encapsulation unit away from the substrate, the first encapsulation layer at least covering the encapsulation unit; The first encapsulation layer fills the isolation opening; The display panel further includes a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate; The encapsulation unit and the second encapsulation layer are inorganic encapsulation layers, and the first encapsulation layer is an organic encapsulation layer.

16. A display panel, characterized in that: The display panel includes: substrate; an isolation structure, located on one side of the substrate and enclosing a plurality of isolation openings; a light emitting device, at least partially located within the isolation opening; an encapsulation unit extending from a side of the light-emitting device away from the substrate along a sidewall of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate; The packaging unit includes a first packaging portion, a second packaging portion, and a third packaging portion that are connected to each other, wherein the first packaging portion is located on a side of the light-emitting device away from the substrate, the second packaging portion is attached to a side wall of the isolation structure facing the isolation opening, and the third packaging portion is attached to a side of the isolation structure facing the substrate; The isolation opening includes a first side and a second side relative to each other. On the first side, the display panel also includes a raised portion partially located between the isolation structure and the substrate. The first packaging portion and the third packaging portion form a first packaging opening on the first side, and the first packaging portion and the third packaging portion form a second packaging opening on the second side. In a direction perpendicular to the plane of the substrate, the first packaging opening has a first opening size, and the second packaging opening has a second opening size, wherein the first opening size is smaller than the second opening size.

17. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 16.

Images