Temperature correction method and device for thermal imaging temperature measurement equipment, equipment and storage medium

Abstract

The invention discloses a temperature correction method, device and equipment for thermal imaging temperature measurement equipment and a storage medium, and the method comprises the steps: obtaining a cold machine degree index of the temperature measurement equipment in response to the condition that the current operation time of the temperature measurement equipment is smaller than or equal to a preset time threshold value; determining a temperature correction value according to the cold machine degree index, the current operation time and a preset time threshold value; and correcting the reference temperature measured by the temperature measuring equipment according to the temperature correction value to obtain a target temperature. According to the scheme, the temperature measurement precision of the thermal imaging temperature measurement equipment can be improved.

Description

Technical Field

[0001] The present application relates to the field of thermal imaging technology, and in particular to a temperature correction method, device, equipment and storage medium for a thermal imaging temperature measuring device. Background Art

[0002] With the development of science and technology, infrared thermal imaging temperature measurement equipment has been widely used in substation temperature monitoring, drone fusion applications, and real-time scene measurement due to its unique convenience.

[0003] The deep integration of thermal imaging technology with the power industry has been a growing trend in recent years. Due to the dispersed distribution and complex terrain of substations, mobile thermal imaging temperature measurement equipment is often used for temperature monitoring.

[0004] However, infrared thermal imaging temperature measurement equipment often needs to be preheated before formal temperature measurement. Normal temperature measurement can only be carried out after the equipment reaches a thermal equilibrium state in the current environment. This not only greatly affects the temperature measurement efficiency and ease of use, but also makes it difficult to ensure the temperature measurement accuracy requirements. Summary of the Invention

[0005] The present application at least provides a temperature correction method, apparatus, device and computer-readable storage medium for a thermal imaging temperature measurement device.

[0006] In a first aspect, the present application provides a temperature correction method for a thermal imaging temperature measuring device, comprising: obtaining a cooling degree index of the temperature measuring device in response to the current operating time of the temperature measuring device being less than or equal to a preset time threshold; determining a temperature correction value based on the cooling degree index and the current operating time; and correcting a reference temperature measured by the temperature measuring device based on the temperature correction value to obtain a target temperature.

[0007] In one embodiment, obtaining the cooling degree index of the temperature measuring device includes: obtaining the thermal balance time and the downtime interval time of the temperature measuring device, the downtime interval time being the difference between the start time of the current operation process of the temperature measuring device and the downtime time of the previous operation process; determining the cooling degree index based on the thermal balance time and the downtime interval time.

[0008] In one embodiment, determining the cooling degree index based on the thermal balance time and the downtime interval time includes: comparing the thermal balance time and the downtime interval time to obtain a comparison result; in response to the comparison result indicating that the thermal balance time is greater than or equal to the downtime interval time, determining the ratio of the thermal balance time to the downtime interval time as the cooling degree index; in response to the comparison result indicating that the thermal balance time is less than the downtime interval time, determining a preset value as the cooling degree index.

[0009] In one embodiment, determining the temperature correction value based on the cooling degree index and the current operating time includes: obtaining a startup correction model; inputting the cooling degree index and the current operating time into the startup correction model to obtain the temperature correction value output by the startup correction model.

[0010] In one embodiment, the method further includes: in response to the current operating time of the temperature measuring device being greater than the preset time threshold, determining the temperature correction value based on the acquired cavity temperature change, cavity temperature change rate and cavity temperature sensitivity of the temperature measuring device; and correcting the reference temperature measured by the temperature measuring device based on the temperature correction value to obtain the target temperature.

[0011] In one embodiment, determining the temperature correction value based on the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device includes: obtaining a temperature sensitivity correction model; inputting the cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device into the temperature sensitivity correction model to obtain the temperature correction value output by the temperature sensitivity correction model.

[0012] In one embodiment, before determining the temperature correction value based on the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device, the method further includes: acquiring a current cavity temperature and a historical cavity temperature of the temperature measuring device, the historical cavity temperature being earlier than the current cavity temperature; determining the cavity temperature change based on the current cavity temperature and the historical cavity temperature; and determining the cavity temperature change rate based on a time difference between the current cavity temperature and the historical cavity temperature and the cavity temperature change.

[0013] The second aspect of the present application provides a temperature correction device for a thermal imaging temperature measuring device, comprising: an index acquisition module for acquiring a cooling degree index of the temperature measuring device in response to the current operating time of the temperature measuring device being less than or equal to a preset time threshold; a correction value determination module for determining a temperature correction value based on the cooling degree index and the current operating time; and a correction module for correcting the reference temperature measured by the temperature measuring device based on the temperature correction value to obtain a target temperature.

[0014] A third aspect of the present application provides an electronic device, including a memory and a processor, wherein the processor is configured to execute program instructions stored in the memory to implement the temperature correction method of the above-mentioned thermal imaging temperature measurement device.

[0015] In a fourth aspect, the present application provides a computer-readable storage medium having program instructions stored thereon. When the program instructions are executed by a processor, the temperature correction method of the above-mentioned thermal imaging temperature measurement device is implemented.

[0016] The above solution analyzes the current operating time and a preset time threshold. In response to the current operating time of the temperature measuring device being less than or equal to the preset time threshold, it obtains a cooling degree index for the temperature measuring device, which reflects the temperature state of the temperature measuring device. A temperature correction value is determined based on the cooling degree index and the current operating time. This allows the temperature measuring device to determine corresponding temperature correction values ​​when it is powered on and measuring temperatures under different temperature conditions, to address situations such as cold startup, hot restart, and semi-hot startup. The reference temperature measured by the temperature measuring device can then be corrected based on the temperature correction value to obtain the target temperature. This solves the problem of low temperature measurement accuracy of thermal imaging temperature measuring devices before thermal equilibrium, thereby improving the temperature measurement accuracy and efficiency of thermal imaging temperature measuring devices.

[0017] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application.

[0019] Figure 1 It is a flow chart of an exemplary embodiment of a temperature correction method of a thermal imaging temperature measurement device of the present application;

[0020] Figure 2 This is a schematic diagram of the downtime interval in the temperature correction method of the thermal imaging temperature measurement device of the present application;

[0021] Figure 3 is a block diagram of a temperature correction device for a thermal imaging temperature measurement device shown in an exemplary embodiment of the present application;

[0022] Figure 4 This is a structural diagram of an embodiment of an electronic device of the present application;

[0023] Figure 5 It is a structural diagram of an embodiment of a computer-readable storage medium of the present application. DETAILED DESCRIPTION

[0024] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0025] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0026] The term "and / or" in this article is simply a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects are in an "or" relationship. In addition, "many" in this article means two or more than two. In addition, the term "at least one" in this article means any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0027] For ease of understanding, one of the applicable scenarios of the present application is now illustrated with an example. At present, when using thermal imaging temperature measuring equipment, in order to ensure the temperature measurement accuracy and avoid temperature measurement interference caused by heat changes of the temperature measuring equipment itself, changes in ambient temperature, etc., it is generally necessary to perform preheating before using the temperature measuring equipment. The preheating time can be up to 60 minutes (or even longer). Only after the temperature measuring equipment reaches a thermal equilibrium state in the current environment can normal temperature measurement work be carried out. Such a process greatly affects the temperature measurement accuracy and efficiency. The temperature correction method provided by the present application can adaptively correct the reference temperature detected before and after thermal equilibrium, and no human participation or change of any structure is required during the entire correction process. The measurement requirements of starting measurement and measuring accuracy can be met without increasing the measurement cost, thereby improving the temperature measurement accuracy and efficiency of the thermal imaging temperature measuring equipment.

[0028] See also Figure 1 , Figure 1 This is a flow chart of an exemplary embodiment of a temperature correction method for a thermal imaging temperature measurement device of the present application. Specifically, the method may include the following steps:

[0029] Step S110 : In response to the current operating time of the temperature measuring device being less than or equal to a preset time threshold, obtaining a cooling degree index of the temperature measuring device.

[0030] Among them, the current running time refers to the cumulative running time recorded by the temperature measuring device during the current running process, which is equivalent to the continuous working time of the temperature measuring device recorded with the startup moment of the current running process of the temperature measuring device as the time zero. Since the temperature measuring device can be turned on and off as needed, there can be multiple running processes of the temperature measuring device within a period of time, and different running processes can have the same or different running times, which is not limited here. For example, the temperature measuring device records the running time of the first running process after the first startup, until the temperature measuring device shuts down to end the first running process. Subsequently, if the temperature measuring device is powered on for the second time, the running time of the second running process is recorded until the temperature measuring device shuts down to end the second running process. The running time corresponding to different running processes is recorded independently. After each running process ends, the recorded running time can be stored or cleared, which is not limited here.

[0031] The preset time threshold is used to analyze the operating period of the temperature measuring device in order to select different correction strategies accordingly. According to the above example description, the body temperature and ambient temperature of the temperature measuring device before and after thermal equilibrium are not stable, so this application needs to use different temperature correction strategies in different operating periods of the temperature measuring device. The preset time threshold can be set based on empirical values, or it can be set with reference to the thermal equilibrium time of the temperature measuring device, the enabling time of the temperature correction module, etc., which is not limited here.

[0032] The cooling level indicator can be used to determine the cooling level of the temperature measuring device when it is started. For example, it can determine whether the temperature measuring device is in a cold start, a hot restart, or a semi-hot start. The cold state generally refers to the state when the overall temperature of the electronic device has cooled down sufficiently after being shut down for a long time and is now much lower than its normal operating temperature. The hot state refers to the state when the electronic device has been shut down for a very short time and its current temperature is still close to its normal operating temperature. The semi-hot state refers to the state when the electronic device has been shut down for a short time and its current temperature has dropped compared to its normal operating temperature, but has not yet cooled down sufficiently.

[0033] For example, if the current operating time of the temperature measuring device is less than or equal to a preset time threshold, it indicates that the temperature measuring device may not have reached thermal equilibrium, or its temperature fluctuation is unstable. Therefore, in this application, it is necessary to obtain a cooling degree index of the temperature measuring device and perform temperature compensation correction accordingly.

[0034] Step S120: determining a temperature correction value according to the cooling degree index and the current operating time.

[0035] In conjunction with the above embodiment, the temperature of the temperature measuring device may vary within a period of time after it is turned on. Therefore, if the temperature of the temperature measuring device varies with the current operating time, the present application can dynamically determine the corresponding temperature correction value based on the current operating time.

[0036] For example, a time coefficient mapping table can be preset. After the temperature measuring device is turned on, the time coefficient corresponding to the current operating time of the temperature measuring device can be found in the time coefficient mapping table, and then the product operation can be performed based on the cooling degree index and the time coefficient corresponding to the current operating time to obtain the temperature correction value corresponding to the current operating time.

[0037] As another example, the time difference between the current operating time and a preset time threshold can be calculated, and then the time ratio between the time difference and the preset time threshold can be calculated. The time ratio calculated in real time can then be used as a time coefficient for the cooling degree indicator to perform a product operation to obtain a temperature correction value corresponding to the current operating time, until the current operating time exceeds the preset time threshold.

[0038] Step S130 , correcting the reference temperature measured by the temperature measuring device according to the temperature correction value to obtain a target temperature.

[0039] In conjunction with the aforementioned steps, in the method of the present application, the temperature measuring device can measure the temperature after powering on to obtain a reference temperature. For example, existing infrared temperature measurement algorithms can be referenced for calculating the reference temperature, which is not limited herein. For example, the temperature measuring device can measure the temperature of a target object according to a preset infrared temperature measurement algorithm to obtain the reference temperature of the target object.

[0040] Furthermore, whether it is a change in the internal or external temperature of the temperature measuring device, the main reason for affecting the temperature measurement accuracy of the temperature measuring device is to affect the reference temperature detected by the temperature measuring device. Therefore, in this application, the reference temperature can be corrected in real time using the temperature correction value determined in the above steps to obtain an accurate target temperature.

[0041] As can be seen, this application analyzes the current operating time and a preset time threshold. In response to the current operating time of the temperature measuring device being less than or equal to the preset time threshold, it obtains a cooling degree index for the temperature measuring device, which reflects the temperature state of the temperature measuring device. A temperature correction value is determined based on the cooling degree index and the current operating time. This enables the temperature measuring device to determine corresponding temperature correction values ​​when it is turned on and measures temperature under different temperature conditions, to cope with cold start-ups, hot restarts, and semi-hot start-ups. The reference temperature measured by the temperature measuring device can then be corrected based on the temperature correction value to obtain the target temperature. This solves the problem of low temperature measurement accuracy of thermal imaging temperature measuring devices before thermal equilibrium, and improves the temperature measurement accuracy and efficiency of thermal imaging temperature measuring devices.

[0042] Based on the above embodiment, the present embodiment of the present application describes the steps for obtaining the cooling degree index of the temperature measuring device. Specifically, the method of this embodiment includes the following steps:

[0043] Obtain the thermal balance time and downtime interval of the temperature measuring device. The downtime interval is the difference between the start time of the current operation process of the temperature measuring device and the downtime of the previous operation process; determine the cooling degree index based on the thermal balance time and downtime interval.

[0044] Among them, the thermal equilibrium time refers to the time required for the temperature measuring device to reach a thermal equilibrium state and a stable temperature field when the temperature measuring device is turned on cold and powered on. The thermal equilibrium time can be pre-set in the temperature measuring device, or the temperature measuring device can be determined based on the thermal equilibrium time of the previous one or more operation processes (referred to as historical operation processes), which is not limited here. It is understandable that if the operating environment of the temperature measuring device has not changed significantly, the thermal equilibrium time determined by the temperature measuring device in the historical operation process can be continued to be referenced in the subsequent operation process; if the operating environment of the temperature measuring device has changed significantly, the thermal equilibrium time of the temperature measuring device in the current operating environment can be re-determined, which is not elaborated here.

[0045] The downtime interval refers to the difference between the start time of the current operation process of the temperature measuring device and the downtime of the previous operation process (previous operation process). For details, please refer to Figure 2 As shown, Figure 2 This is a schematic diagram of the downtime interval used in the temperature correction method for a thermal imaging temperature measurement device of the present application. It is understood that, generally, the downtime interval is negatively correlated with the temperature of the temperature measurement device. For example, a longer downtime interval indicates a closer cold state for the temperature measurement device, while a shorter downtime interval indicates a closer hot state for the temperature measurement device.

[0046] Specifically, in the present application, the thermal equilibrium time and the shutdown interval time are compared, and the cooling degree index is correspondingly determined according to the numerical comparison result of the thermal equilibrium time and the shutdown interval time.

[0047] Based on the above embodiment, the present embodiment describes the steps for determining the cooling degree index based on the thermal balance time and the downtime interval. Specifically, the method of this embodiment includes the following steps:

[0048] The thermal balance time and the downtime interval time are compared to obtain a comparison result; in response to the comparison result indicating that the thermal balance time is greater than or equal to the downtime interval time, the ratio of the thermal balance time to the downtime interval time is determined as the cooling degree index; in response to the comparison result indicating that the thermal balance time is less than the downtime interval time, the preset value is determined as the cooling degree index.

[0049] With reference to the above embodiments, in this embodiment, a method for determining the cooling degree index may be selected accordingly based on a comparison result between the thermal equilibrium time and the shutdown interval time.

[0050] Specifically, the mathematical expression of the cooling degree index K_deg can be referred to as follows:

[0051]

[0052] Wherein, Time_hb is the thermal equilibrium time of the temperature measuring device, and ΔTime_cms is the downtime interval between the current operation process and the previous operation process of the temperature measuring device.

[0053] If the downtime interval is longer than the thermal equilibrium time, indicating a long downtime interval, the temperature measuring device's cooling degree index can be set to a preset value (e.g., 1) to provide a larger temperature correction value for compensation when the temperature measuring device is cold. Similarly, if the downtime interval is less than or equal to the thermal equilibrium time, the cooling degree index can be determined based on the ratio of the downtime interval to the thermal equilibrium time.

[0054] Based on the above embodiment, the present embodiment describes the steps of determining the temperature correction value based on the cooling degree index and the current operating time. Specifically, the method of this embodiment includes the following steps:

[0055] Obtain a startup correction model; input the cooling degree index and the current operating time into the startup correction model to obtain a temperature correction value output by the startup correction model.

[0056] The startup correction model is a pre-defined mathematical model used to calculate the temperature correction value required by the temperature measuring device during the initial startup phase (e.g., when the current operating time is less than or equal to a preset time threshold). Therefore, when the temperature measuring device is started, the operating time period less than or equal to the preset time threshold can be determined as the time period in which the startup correction model is enabled.

[0057] It is understandable that in traditional methods, since the cavity temperature change model of the temperature measuring device requires accumulated data before compensation calculations can be performed, temperature correction compensation cannot be performed during periods without accumulated data, that is, during periods when the cavity temperature change rate does not exist. The startup correction model of this application can calculate the temperature correction value required by the temperature measuring device at the initial startup based on the cooling degree index and the current operating time. The mathematical expression of the startup correction model can be as follows:

[0058]

[0059] Among them, Tbase_corr1 is the temperature correction value determined according to the startup correction model, k1 is the preset model parameter of the startup correction model, K_deg is the cooling degree index of the current operation process, Time_limit is the preset time threshold (that is, the time limit for the startup correction model to be enabled), and t is the current operation time of the temperature measuring device. This is equivalent to the time coefficient described in the examples in the aforementioned embodiments. It should be noted that the preset time threshold can be pre-set in the startup correction model (i.e., the cooling degree index and the current operating time are substituted into the startup correction model to calculate the corresponding temperature correction value), or can be retrieved and re-entered into the startup correction model after each startup (i.e., the cooling degree index, the current operating time, and the preset time threshold are substituted into the startup correction model to calculate the corresponding temperature correction value). This is not limited here.

[0060] On the basis of the above embodiments, it should be further explained in the embodiments of the present application that the temperature correction method of the present application may further include the following steps:

[0061] In response to the current operating time of the temperature measuring device being greater than a preset time threshold, a temperature correction value is determined based on the acquired cavity temperature change, cavity temperature change rate and cavity temperature sensitivity of the temperature measuring device; the reference temperature measured by the temperature measuring device is corrected according to the temperature correction value to obtain the target temperature.

[0062] The above-mentioned embodiments are used for explanation. The above-mentioned embodiments provide a temperature correction strategy for the temperature measuring device at the initial stage of startup. This embodiment mainly describes a temperature correction strategy based on temperature sensing after the temperature measuring device has been started for a period of time (i.e., the current operating time of the temperature measuring device is greater than the preset time threshold).

[0063] It is understandable that infrared thermal imaging temperature measurement equipment usually includes a cavity. This design helps to reduce the impact of the external environment on the temperature measurement accuracy and provide a more stable temperature measurement environment. For details, please refer to the relevant design of existing infrared thermal imaging temperature measurement equipment, which will not be elaborated here.

[0064] For example, the temperature sensor of a temperature measurement device can be located in the cavity between the temperature measurement device's lens and the infrared thermal imaging detector. This allows the device's cavity temperature to be measured, allowing the temperature measurement device's cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity to be calculated. A temperature correction value can then be determined based on the cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity. This correction value can then be used to correct the reference temperature measured by the temperature measurement device to obtain the target temperature.

[0065] Based on the above embodiment, the present embodiment describes the steps of determining a temperature correction value based on the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device. Specifically, the method of this embodiment includes the following steps:

[0066] A temperature correction model is obtained; the cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device are input into the temperature correction model to obtain a temperature correction value output by the temperature correction model.

[0067] In conjunction with the above embodiment, after the temperature measuring device is powered on for a period of time (i.e., the current operating time of the temperature measuring device is greater than the preset time threshold), the accumulated temperature sensing data can be obtained, so the temperature correction model is selected to determine the temperature correction value. The temperature correction model refers to the method of determining the corresponding temperature correction value through temperature sensing.

[0068] For example, the cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device are input into the temperature correction model. Through the calculation of the temperature correction model, the temperature correction value output by the temperature correction model can be obtained. The abstract model expression of the temperature correction model can be:

[0069]

[0070] Among them, Tbase_corr2 is the temperature correction value determined by the temperature correction model, ΔT_cav is the cavity temperature change, and Δt is the time difference corresponding to the cavity temperature change. is the cavity temperature change rate, Cavity temperature sensitivity refers to the grayscale value corresponding to each 1°C change in the real-time cavity temperature of the temperature measuring device. It is a key indicator of the temperature measuring device's ability to adapt to different external environments.

[0071] Specifically, the mathematical expression of the temperature correction model can be:

[0072]

[0073] Among them, k2 and k3 are the preset model parameters of the temperature correction model, and e is the base of the natural logarithm function.

[0074] In summary, in the overall solution of the present application, the mathematical expression of the correction strategy of the temperature correction method of the present application can be summarized as follows:

[0075]

[0076] Where Tbase is the base temperature detected by the temperature measuring device, Tbase_corr1 is the temperature correction value determined by the startup correction model when the current running time is less than or equal to the preset time threshold, Tbase_corr2 is the temperature correction value determined by the temperature sense correction model when the current running time is greater than the preset time threshold, and Tbase_up is the target temperature obtained after temperature correction.

[0077] The target temperature is the corrected reference temperature. After obtaining the target temperature, the target temperature can be optionally processed (such as numerical conversion processing, data optimization processing, etc. in this field, which will not be described here) to obtain the final measured temperature value Tmear_corr, which can be mathematically expressed as follows:

[0078] Tmear_corr=f(Tbase_up,...)

[0079] Based on the above embodiment, the present embodiment of the application describes the steps before determining the temperature correction value based on the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device. Specifically, the method of this embodiment includes the following steps:

[0080] Obtain the current cavity temperature and historical cavity temperature of the temperature measuring device, where the historical cavity temperature is earlier than the current cavity temperature; determine the cavity temperature change amount based on the current cavity temperature and the historical cavity temperature; and determine the cavity temperature change rate based on the time difference between the current cavity temperature and the historical cavity temperature and the cavity temperature change amount.

[0081] To illustrate this with reference to the preceding embodiment, the current cavity temperature refers to the cavity temperature of the temperature measuring device obtained at the current moment, and the historical cavity temperature refers to the cavity temperature of the temperature measuring device obtained at historical moments. The historical moment is earlier than the current moment, meaning that the historical cavity temperature is earlier than the current cavity temperature. Therefore, the cavity temperature change ΔT_cav can be determined based on the difference between the current and historical cavity temperatures, and the time difference Δt can be determined based on the current and historical moments.

[0082] For example, the cavity temperature change ΔT_cav between the current cavity temperature value and the cavity temperature value 90s ago and the time difference Δt of the timestamps corresponding to the two cavity temperature values ​​can be obtained. From this, the cavity temperature change rate between 90s ago and the current moment can be calculated. In addition, in addition to obtaining the cavity temperature value 90 seconds before the current moment as the historical cavity temperature, other time nodes (such as 60-120 seconds) may also be used as references, which is not limited here.

[0083] In summary, the temperature correction method of the present application provides a cold machine state index K_deg, which enables the temperature measuring equipment to meet the industry's temperature measurement accuracy requirements when it is turned on and measured in different states, including cold machine start-up, hot machine restart, semi-hot machine start-up and other situations. By establishing a startup correction model, the temperature measurement value of the temperature measuring equipment can be corrected before the data required by the temperature sense correction model is accumulated (equivalent to before the running time reaches the enabling time boundary of the temperature sense correction model). Subsequently, the temperature can also be measured after the preset time threshold of the cold machine start-up, hot machine restart, and semi-hot machine start-up through the temperature sense correction model, which can meet the temperature measurement accuracy requirements. At the same time, the temperature sense correction model of the present application can realize the above method with a single temperature sensor under extremely simple conditions, and will not cause measurement errors due to the joint measurement of multiple temperature sensors. In addition, the temperature correction method of the present application can also be applied to various types of equipment, various types of detectors, and various types of lenses, and does not require factory data collection, which improves the convenience of method deployment and use.

[0084] It should be further explained that the temperature correction method for a thermal imaging temperature measuring device may be executed by a temperature correction device of the thermal imaging temperature measuring device. For example, the temperature correction method for a thermal imaging temperature measuring device may be executed by a terminal device, a server, or other processing device, wherein the terminal device may be a user equipment (UE), a computer, a mobile device, a user terminal, a terminal, a cellular phone, a cordless phone, a personal digital assistant (PDA), a handheld device, a computing device, an in-vehicle device, a wearable device, etc. In some possible implementations, the temperature correction method for a thermal imaging temperature measuring device may be implemented by a processor calling computer-readable instructions stored in a memory.

[0085] Figure 3 FIG. 1 is a block diagram of a temperature correction device for a thermal imaging temperature measurement device according to an exemplary embodiment of the present application. Figure 3 As shown, the temperature correction device 300 of the exemplary thermal imaging temperature measurement device includes: an index acquisition module 310, a correction value determination module 320 and a correction module 330. Specifically:

[0086] The indicator acquisition module 310 is configured to acquire a cooling degree indicator of the temperature measuring device in response to the current operating time of the temperature measuring device being less than or equal to a preset time threshold.

[0087] The correction value determination module 320 is configured to determine a temperature correction value according to the cooling degree index and the current operating time.

[0088] The correction module 330 is used to correct the reference temperature measured by the temperature measuring device according to the temperature correction value to obtain the target temperature.

[0089] Among them, the startup correction model and the temperature sense correction model in the temperature correction method of the present application can be integrated into the same correction value determination module, or they can be set in different modules respectively, which is not limited here. For example, in addition to being used to determine the temperature correction value based on the cooling degree index and the current operating time, the correction value determination module of the present application can also be used to determine the temperature correction value based on the obtained cavity temperature change, cavity temperature change rate and cavity temperature sensitivity of the temperature measuring device when the current operating time of the temperature measuring device is greater than the preset time threshold. Alternatively, the obtained cavity temperature change, cavity temperature change rate and cavity temperature sensitivity of the temperature measuring device are received through another correction value determination module, and the temperature correction value is determined.

[0090] In this exemplary temperature correction device for a thermal imaging temperature measurement device, by analyzing the current operating time and a preset time threshold, a cooling degree index of the temperature measurement device is obtained in response to the current operating time of the temperature measurement device being less than or equal to the preset time threshold. The cooling degree index reflects the temperature state of the temperature measurement device. A temperature correction value is determined based on the cooling degree index and the current operating time. This enables the temperature measurement device to determine corresponding temperature correction values ​​when starting and measuring temperatures under different temperature conditions, to address situations such as cold startup, hot restart, and semi-hot startup. The reference temperature measured by the temperature measurement device is then corrected based on the temperature correction value to obtain a target temperature. This solves the problem of low temperature measurement accuracy of thermal imaging temperature measurement devices before thermal equilibrium, thereby improving the temperature measurement accuracy and efficiency of the thermal imaging temperature measurement device.

[0091] It should be noted that the apparatus provided in the above embodiments and the methods provided in the above embodiments are based on the same concept. The specific manner in which the various modules and units perform their operations has been described in detail in the method embodiments and will not be repeated here. In actual applications, the apparatus provided in the above embodiments can, as needed, allocate the above functions to different functional modules, i.e., divide the internal structure of the apparatus into different functional modules to perform all or part of the functions described above. This is not a limitation herein.

[0092] The functions of each module can be found in the embodiment of the temperature correction method of the thermal imaging temperature measurement device, which will not be described in detail here.

[0093] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of an embodiment of an electronic device of the present application. Electronic device 100 includes memory 101 and processor 102. Processor 102 is configured to execute program instructions stored in memory 101 to implement the steps described in any of the aforementioned embodiments of the temperature correction method for a thermal imaging temperature measurement device. In a specific implementation scenario, electronic device 100 may include, but is not limited to, a microcomputer and a server. Furthermore, electronic device 100 may also include mobile devices such as laptops and tablet computers, although this is not intended to be limiting.

[0094] Specifically, the processor 102 is used to control itself and the memory 101 to implement the steps in the embodiment of the temperature correction method of any of the above-mentioned thermal imaging temperature measuring devices. The processor 102 can also be called a CPU (Central Processing Unit). The processor 102 may be an integrated circuit chip with signal processing capabilities. The processor 102 can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. In addition, the processor 102 can be implemented by an integrated circuit chip.

[0095] In this exemplary electronic device, by analyzing the current operating time and a preset time threshold, a cooling degree index of the temperature measuring device is obtained in response to the current operating time of the temperature measuring device being less than or equal to the preset time threshold. The cooling degree index reflects the temperature state of the temperature measuring device. A temperature correction value is determined based on the cooling degree index and the current operating time. This enables the temperature measuring device to determine corresponding temperature correction values ​​when starting and measuring temperatures under different temperature conditions, to address situations such as cold startup, hot restart, and semi-hot startup. The reference temperature measured by the temperature measuring device is then corrected based on the temperature correction value to obtain the target temperature. This solves the problem of low temperature measurement accuracy of thermal imaging temperature measuring devices before thermal equilibrium, and improves the temperature measurement accuracy and efficiency of thermal imaging temperature measuring devices.

[0096] See also Figure 5 , Figure 5 The computer-readable storage medium 110 stores program instructions 111 that can be executed by a processor, and the program instructions 111 are used to implement the steps of any of the above-mentioned temperature correction method embodiments of the thermal imaging temperature measurement device.

[0097] In this exemplary storage medium, by executing program instructions in the storage medium, the current operating time and a preset time threshold are analyzed. In response to the current operating time of the temperature measuring device being less than or equal to the preset time threshold, a cooling degree index of the temperature measuring device is obtained. The cooling degree index reflects the temperature state of the temperature measuring device. A temperature correction value is determined based on the cooling degree index and the current operating time. This enables the temperature measuring device to determine corresponding temperature correction values ​​when starting and measuring temperatures under different temperature conditions, to cope with cold startup, hot restart, and semi-hot startup. The reference temperature measured by the temperature measuring device can then be corrected based on the temperature correction value to obtain a target temperature. This solves the problem of low temperature measurement accuracy of thermal imaging temperature measuring devices before thermal equilibrium, thereby improving the temperature measurement accuracy and efficiency of thermal imaging temperature measuring devices.

[0098] In some embodiments, the functions or modules included in the device provided by the embodiments of the present disclosure can be used to execute the method described in the above method embodiments. The specific implementation can refer to the description of the above method embodiments. For the sake of brevity, it will not be repeated here.

[0099] The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced with each other and will not be repeated herein for the sake of brevity.

[0100] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation methods described above are only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation. For example, units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0101] In addition, the functional units in the various embodiments of the present application can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) or a processor to execute all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

Claims

1. A temperature correction method for a thermal imaging temperature measuring device, characterized in that: The method comprises: In response to the current operating time of the temperature measuring device being less than or equal to a preset time threshold, obtaining a cooling degree index of the temperature measuring device; determining a temperature correction value according to the cooling degree index and the current operating time; The reference temperature measured by the temperature measuring device is corrected according to the temperature correction value to obtain the target temperature.

2. The method according to claim 1, characterized in that The obtaining of the cooling degree index of the temperature measuring device includes: Obtaining the thermal equilibrium time and downtime interval of the temperature measuring device, where the downtime interval is the difference between the start time of the current operation process of the temperature measuring device and the downtime time of the previous operation process; The cooling degree index is determined according to the thermal balance time and the shutdown interval time.

3. The method according to claim 2, characterized in that Determining the cooling degree index according to the thermal balance time and the shutdown interval time includes: Comparing the thermal equilibrium time with the downtime interval to obtain a comparison result; In response to the comparison result indicating that the thermal balance time is greater than or equal to the shutdown interval time, determining a ratio of the thermal balance time to the shutdown interval time as the cooling degree indicator; In response to the comparison result indicating that the thermal balance time is less than the shutdown interval time, a preset value is determined as the cooling degree indicator.

4. The method according to claim 1, wherein The determining of the temperature correction value according to the cooling degree index and the current operating time includes: Get the startup correction model; The cooling degree index and the current operating time are input into the startup correction model to obtain a temperature correction value output by the startup correction model.

5. The method according to claim 1, wherein The method further comprises: In response to the current operating time of the temperature measuring device being greater than the preset time threshold, determining the temperature correction value according to the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device; The reference temperature measured by the temperature measuring device is corrected according to the temperature correction value to obtain the target temperature.

6. The method according to claim 5, characterized in that The determining the temperature correction value according to the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device includes: Obtain temperature correction model; The cavity temperature change, cavity temperature change rate and cavity temperature sensitivity of the temperature measuring device are input into the temperature sensing correction model to obtain a temperature correction value output by the temperature sensing correction model.

7. The method according to claim 5, characterized in that Before determining the temperature correction value based on the acquired cavity temperature change, cavity temperature change rate, and cavity temperature sensitivity of the temperature measuring device, the method further includes: Acquire a current cavity temperature and a historical cavity temperature of the temperature measuring device, wherein the historical cavity temperature is earlier than the current cavity temperature; Determining the cavity temperature change according to the current cavity temperature and the historical cavity temperature; The cavity temperature change rate is determined according to a time difference between the current cavity temperature and the historical cavity temperature and the cavity temperature change.

8. A temperature correction device for a thermal imaging temperature measuring device, characterized in that: The device comprises: an index acquisition module, configured to acquire a cooling degree index of the temperature measuring device in response to a current operating time of the temperature measuring device being less than or equal to a preset time threshold; a correction value determination module, configured to determine a temperature correction value according to the cooling degree index and the current operating time; The correction module is used to correct the reference temperature measured by the temperature measuring device according to the temperature correction value to obtain the target temperature.

9. An electronic device, characterized in that: The method comprises a memory and a processor, wherein the processor is configured to execute program instructions stored in the memory to implement the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having program instructions stored thereon, characterized in that: When the program instructions are executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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