Wafer mapping and inspection camera assembly

Abstract

The application discloses a wafer mapping and detection camera assembly, which comprises an assembly support, a supporting frame and a supporting seat are installed on the assembly support, a wafer camera is installed on the outer side of the supporting frame, a first lens is installed on the inner side of the supporting frame, a second lens is installed on the inner side of the supporting seat, the second lens is connected with the first lens, an upper mirror chamber is installed at the rear end of the assembly support, and a zoom adjuster is connected between the upper mirror chamber and the second lens. The camera light path is refracted to the wafer mapping through the prism, the installation position of the camera at the photographing position is saved, more working positions are adapted, the position of the wafer mapping is illuminated by the light source, and the wafer mapping is finely moved through the suction assembly; firstly, the edge imaging of the wafer mapping is extracted and a contour is synthesized; multiple photographing is carried out; and the pictures are synthesized and detected.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer mapping detection, in particular to a wafer mapping and detection camera assembly. BACKGROUND

[0002] The wafer mapping and detection camera assembly is a supporting device for wafer mapping detection. The wafer mapping diagram is used to verify the accurate position mapping of chip elements on a silicon wafer. By scanning and analyzing the deviation between the elements and the expected target, the chip problem can be quickly found out to meet the manufacturing requirements. With the continuous development of science and technology, people's requirements for the wafer mapping and detection camera assembly are also getting higher and higher.

[0003] The existing wafer mapping detection has certain disadvantages in use. First, the existing wafer mapping detection has a small camera installation position, which occupies a large area when directly installing the camera, and is not convenient for better installation, which is not conducive to the use of people. In addition, during the detection process of the camera, a group of pictures are directly taken, and the detection result error may be large, which cannot well meet the manufacturing requirements, and brings certain adverse effects to the use process of people. Therefore, we propose a wafer mapping and detection camera assembly. SUMMARY

[0004] The technical problem solved by the present application is that the present application provides a wafer mapping and detection camera assembly. The camera light path is refracted to the wafer mapping through the prism, which saves the installation position of the camera at the shooting position, adapts to more working conditions, the light source illuminates the position of the wafer mapping, and the wafer mapping is moved by the suction assembly. First, the edge of the wafer mapping is imaged to extract the contour, multiple pictures are taken, and the pictures are synthesized for detection, which can effectively solve the problems in the background art.

[0005] Technical scheme: In order to achieve the above purpose, the technical scheme adopted by the present application is as follows: a wafer mapping and detection camera assembly, comprising a component support, a support frame and a support seat are installed on the component support, a wafer camera is installed on the outer side of the support frame, a first lens is installed on the inner side of the support frame, a second lens is installed on the inner side of the support seat, the second lens is connected with the first lens, an upper mirror chamber is installed at the rear end of the component support, a zoom adjuster is connected between the upper mirror chamber and the second lens, a lower mirror chamber is positioned at the bottom of the upper mirror chamber, a lens frame is installed on the outer side of the lower mirror chamber, a mirror frame is positioned on the outer side of the lower mirror chamber, an upper mounting plate is positioned on the upper end of the mirror frame, a prism is positioned on the outer side of the mirror frame, a lower mounting plate is installed at the bottom of the mirror frame, and a light source ring is positioned at the bottom of the lower mounting plate.

[0006] As a preferred technical solution of the present application, the bottom of the component support is positioned and installed with a mounting support, the outer side of the component support is positioned and installed with a protective cover, a positioning pin is positioned between the component support and the protective cover, the outer side of the lens holder is positioned with a lock holder, a pin hole is formed on the mounting support, and a lens connecting plate is positioned between the lens frame and the mounting support.

[0007] As a preferred technical solution of the present application, the wafer camera, the first lens, and the second lens are fixed in parallel on the upper end of the component support through the support frame and the support seat, the upper mirror chamber is fixed on the component support through bolts, and the second lens penetrates through the zoom adjuster between the second lens and the upper mirror chamber.

[0008] As a preferred technical solution of the present application, the upper mirror chamber penetrates between the upper mirror chamber and the lower mirror chamber, the lower mirror chamber is fixed with the lens holder through bolts, the lens frame at the front end of the lower mirror chamber is parallel to the prism at the side edge of the lens holder, and the lens frame is opposite to the inner side mirror surface position of the prism.

[0009] As a preferred technical solution of the present application, the component support and the protective cover are fixed through the positioning pin, and the protective cover covers the positions of the wafer camera, the first lens, the second lens, and the support seat for protection.

[0010] As a preferred technical solution of the present application, the bottom of the component support is installed through the mounting support, and the lens connecting plate is fixed on the mounting support and positions the lens frame through the pin hole.

[0011] As a preferred technical solution of the present application, the light path of the wafer camera sequentially passes through the first lens, the second lens, the upper mirror chamber, the lower mirror chamber, and the lens frame, and is refracted to the wafer mapping through the prism.

[0012] As a preferred technical solution of the present application, the light source ring illuminates the position of the wafer mapping, and the wafer mapping is finely moved through the suction assembly, and the edge of the wafer mapping is imaged to extract a composite contour.

[0013] Beneficial effects: Compared with the prior art, the present application provides a wafer mapping and detection camera assembly, which has the following beneficial effects: the camera light path is refracted to the wafer mapping through the prism, the installation position of the camera for shooting is saved, more working environments are adapted, the light source illuminates the position of the wafer mapping, and the wafer mapping is finely moved through the suction assembly, the edge of the wafer mapping is imaged to extract a composite contour, multiple photographs are taken, and the pictures are synthesized for detection, the whole wafer mapping and detection camera assembly structure is simple, easy to operate, and the use effect is better than the traditional way. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a wafer mapping and inspection camera assembly according to the present invention.

[0015] Figure 2 This is a schematic diagram of the overall decomposed structure of a wafer mapping and inspection camera assembly according to the present invention.

[0016] Figure 3 This is a schematic diagram of the structure of a prism in a wafer mapping and inspection camera assembly according to the present invention.

[0017] Figure 4 This is a schematic diagram of the structure of a prism lens in a wafer mapping and inspection camera assembly according to the present invention.

[0018] Figure 5 This is a schematic diagram of the structure of a magnified view of point A in a wafer mapping and inspection camera assembly according to the present invention.

[0019] Figure 6 This is a schematic diagram of the optical path structure in a wafer mapping and inspection camera assembly according to the present invention.

[0020] In the diagram: 1. Component support; 2. Protective cover; 3. Support base; 4. Zoom adjuster; 5. Prism; 6. Lens frame; 7. Upper lens chamber; 8. Mounting support; 9. Second lens; 10. Positioning pin; 11. Upper mounting plate; 12. Locking bracket; 13. Light source ring; 14. Lower lens chamber; 15. Pin hole; 16. Lens connecting plate; 17. First lens; 18. Support frame; 19. Wafer camera; 20. Lower mounting plate; 21. Lens frame. Detailed Implementation

[0021] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0022] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0023] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0024] As shown in Figures 1-6 A wafer mapping and detection camera assembly, comprising an assembly support 1, a support frame 18 and a support seat 3 are installed on the assembly support 1, a wafer camera 19 is installed on the outer side of the support frame 18, a first lens 17 is installed on the inner side of the support frame 18, a second lens 9 is installed on the inner side of the support seat 3, the second lens 9 is connected with the first lens 17, an upper lens chamber 7 is installed at the rear end of the assembly support 1, a zoom adjuster 4 is connected between the upper lens chamber 7 and the second lens 9, a lower lens chamber 14 is positioned at the bottom of the upper lens chamber 7, a lens frame 21 is installed on the outer side of the lower lens chamber 14, a lens holder 6 is positioned on the outer side of the lower lens chamber 14, an upper mounting plate 11 is positioned at the upper end of the lens holder 6, a prism 5 is positioned on the outer side of the lens holder 6, a lower mounting plate 20 is installed at the bottom of the lens holder 6, a light source ring 13 is positioned at the bottom of the lower mounting plate 20, the camera light path is refracted to the wafer mapping through the prism, the installation position of the camera at the shooting position is saved, more working positions are adapted, the position of the wafer mapping is illuminated by the light source, and the wafer mapping is moved by the suction assembly. First, the edge of the wafer mapping is imaged to extract the contour, multiple photographs are taken, and the pictures are synthesized for detection.

[0025] Further, an installation support 8 is positioned and installed at the bottom of the assembly support 1, a protective cover 2 is positioned and installed on the outer side of the assembly support 1, a positioning pin 10 is positioned between the assembly support 1 and the protective cover 2, a lock holder 12 is positioned on the outer side of the lens holder 6, a pin hole 15 is formed on the installation support 8, and a lens connecting plate 16 is positioned between the lens frame 21 and the installation support 8.

[0026] Further, the wafer camera 19, the first lens 17 and the second lens 9 are fixed in parallel on the upper end of the assembly support 1 through the support frame 18 and the support base 3, the upper mirror chamber 7 is fixed on the assembly support 1 through bolts, and the second lens 9 penetrates the upper mirror chamber 7 through the zoom adjuster 4.

[0027] Further, the upper mirror chamber 7 penetrates the lower mirror chamber 14, the lower mirror chamber 14 is fixed with the mirror frame 6 through bolts, the lens frame 21 at the front end of the lower mirror chamber 14 is parallel to the prism 5 at the side edge of the mirror frame 6, and the lens frame 21 is opposite to the inner mirror surface position of the prism 5.

[0028] Further, the assembly support 1 is fixed with the protective cover 2 through the positioning pin 10, and the protective cover 2 covers the positions of the wafer camera 19, the first lens 17, the second lens 9 and the support base 3 for protection.

[0029] Further, the bottom of the assembly support 1 is installed through the installation support 8, and the lens connecting plate 16 is fixed on the installation support 8 and positions the lens frame 21 through the pin hole 15.

[0030] Further, the light path of the wafer camera 19 sequentially passes through the first lens 17, the second lens 9, the upper mirror chamber 7, the lower mirror chamber 14, the lens frame 21, and is refracted to the wafer mapping through the prism 5.

[0031] Further, the light source ring 13 illuminates the position of the wafer mapping, and the wafer mapping is finely moved through the suction assembly, and the edge imaging of the wafer mapping is extracted and synthesized.

[0032] Working principle: the present application comprises the assembly support 1, the protective cover 2, the support base 3, the zoom adjuster 4, the prism 5, the mirror frame 6, the upper mirror chamber 7, the installation support 8, the second lens 9, the positioning pin 10, the upper installation plate 11, the lock frame 12, the light source ring 13, the lower mirror chamber 14, the pin hole 15, the lens connecting plate 16, the first lens 17, the support frame 18, the wafer camera 19, the lower installation plate 20, the lens frame 21, the upper mirror chamber 7 penetrates the lower mirror chamber 14, the lower mirror chamber 14 is fixed with the mirror frame 6 through bolts, the lens frame 21 at the front end of the lower mirror chamber 14 is parallel to the prism 5 at the side edge of the mirror frame 6, and the lens frame 21 is opposite to the inner mirror surface position of the prism 5, the camera light path is refracted to the wafer mapping through the prism, the installation position of the camera for shooting is saved, more working occasions are adapted, the light source illuminates the position of the wafer mapping, and the wafer mapping is finely moved through the suction assembly, the edge imaging of the wafer mapping is extracted and synthesized, multiple shooting is performed, and the pictures are synthesized for detection.

[0033] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other present or future devices possess. That is, although specific embodiments have been disclosed herein, one of ordinary skill in the art will appreciate that other embodiments can be practiced under the scope of the disclosure. For example, some well-known structures have not been described in detail or at all in order to avoid obscuring the concepts of the present application. Like reference numerals can be used to denote like elements throughout the description and the drawings.

[0034] The foregoing is considered as illustrative only of the principles of the application. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the application to the exact construction and practice described. Accordingly, all such variations are intended to be included within the scope of the present application as defined in the following claims.

Claims

1. A wafer mapping and inspection camera assembly comprising an assembly support (1), characterized in that: The component support (1) is provided with a support frame (18) and a support seat (3), the outer side of the support frame (18) is provided with a wafer camera (19), the inner side of the support frame (18) is provided with a first lens (17), the inner side of the support seat (3) is provided with a second lens (9), the second lens (9) is connected with the first lens (17), the rear end of the component support (1) is provided with an upper lens chamber (7), the upper lens chamber (7) is connected with the second lens (9) through a zoom adjuster (4), the bottom of the upper lens chamber (7) is positioned with a lower lens chamber (14), the outer side of the lower lens chamber (14) is provided with a lens frame (21), the outer side of the lower lens chamber (14) is positioned with a lens holder (6), the upper end of the lens holder (6) is positioned with an upper mounting plate (11), the outer side of the lens holder (6) is positioned with a prism (5), the bottom of the lens holder (6) is provided with a lower mounting plate (20), the bottom of the lower mounting plate (20) is positioned with a light source ring (13); The bottom of the component support (1) is positioned and mounted with a mounting support (8), the outer side of the component support (1) is positioned and mounted with a protective cover (2), the component support (1) and the protective cover (2) are positioned with a positioning pin (10), the outer side of the lens holder (6) is positioned with a lock frame (12), the mounting support (8) is provided with a pin hole (15), the lens frame (21) and the mounting support (8) are positioned with a lens connecting plate (16); The wafer camera (19), the first lens (17) and the second lens (9) are fixed in parallel on the upper end of the component support (1) through the support frame (18) and the support seat (3), the upper lens chamber (7) is fixed on the component support (1) through a bolt, the second lens (9) and the upper lens chamber (7) are penetrated through the zoom adjuster (4); The upper lens chamber (7) and the lower lens chamber (14) are penetrated, the lower lens chamber (14) and the lens holder (6) are fixed through a bolt, the lens frame (21) at the front end of the lower lens chamber (14) is parallel to the prism (5) at the side edge of the lens holder (6), and the lens frame (21) is opposite to the inner side mirror surface position of the prism (5); The component support (1) and the protective cover (2) are fixed through the positioning pin (10), and the protective cover (2) covers the positions of the wafer camera (19), the first lens (17), the second lens (9) and the support seat (3) for protection; The bottom of the component support (1) is mounted through the mounting support (8), the lens connecting plate (16) is fixed on the mounting support (8) and positions the lens frame (21) through the pin hole (15); The light path of the wafer camera (19) passes through the first lens (17), the second lens (9), the upper lens chamber (7), the lower lens chamber (14) and the lens frame (21) in sequence, and is refracted to the wafer maping through the prism (5); The light source ring (13) illuminates the position of the wafer maping, and the wafer maping is moved for fine adjustment through a suction assembly, and the edge imaging of the wafer maping is extracted and synthesized.

Images