A CSP packaged LED chip device and method

Abstract

The present invention relates to the field of LED patch technology, and discloses a patch device and method for CSP packaged LEDs. The patch device includes a frame, on which a patch roller, a processing platform, and a feeding mechanism are respectively provided. A drive box is fixedly installed on the upper side of the frame, and a central shaft is fixedly installed on the front of the drive box. The patch roller is rotatably mounted on the surface of the central shaft, and the drive box drives the patch roller to rotate. A plurality of mounting seats are embedded on the surface of the patch roller, and each mounting seat is arranged in a ring array on the surface of the patch roller. A plurality of patch heads are slidably installed inside the mounting seat. In the patch device proposed by the present invention, the patch heads on different mounting seats are arranged in an interlaced manner. When the patch head picks up a chip for patching, the patch head can be used to patch the chip, meeting the use requirements of dense patching, solving the disadvantage of the prior art that it is inconvenient to perform small-pitch patching, reducing the spacing between chips, and providing conditions for reducing the size of the LED package by using CSP packaging in the subsequent process.

Description

Technical Field

[0001] The present invention relates to the technical field of LED patch technology, and in particular to a patch device and method for CSP packaged LEDs. Background Art

[0002] CSP packaging is a packaging technology designed for chip size, which can improve packaging density, reduce size and cost. In CSP packaging, LED flip-chip soldering layer is widely used, which mainly solders the LED chip directly upside down on the PCB, thereby achieving tighter integration and more efficient heat dissipation, thereby reducing the size and cost of the LED package.

[0003] In the prior art, the patent document with announcement number CN111511185B discloses a mounting device and mounting method for colored patches of LED lamps, including a support table, a loading plate, a support frame, a cylinder and a suction nozzle. A limiting groove is provided on the top of the support table, and an operating table is rotatably connected in the limiting groove. Placement grooves are equidistantly provided on the top of the operating table. The top of the support table is located outside the limiting groove and is symmetrically rotatably connected to the support frame, and a cylinder is fixedly installed on the top of the support frame. The end of the piston rod of the cylinder passes through the support frame and is fixedly installed with a suction nozzle, and the suction nozzle is located directly above the placement groove. A reduction motor is symmetrically installed inside the support table, and the output shaft end of the reduction motor passes through the support table and is fixedly connected to the support frame. This colored patch device for LED lamps can simultaneously mount patches on the two opposite placement slots on the operating table at one time.

[0004] CSP packaging is to reduce the size of LED packaging, but when mounting, if the distance between chips is large (referring to Figure 10 L1 in the middle) restricts the realization of CSP packaging. Specifically, due to the existing chip placement device, the chip is placed by moving and picking up and placing multiple chip placement heads arranged in a row. The chip placement head is a high-speed moving component that needs to perform multiple actions. To reduce the spacing between chips, the spacing between each chip placement head must be reduced. However, after the compact arrangement of each chip placement head and its transmission mechanism, the volume is still large, or the spacing between adjacent chip placement heads is too large, which is inconvenient for placing densely arranged chips. The chip placement heads are often required to repeat the placement action multiple times with dislocation and pick up and place adjacent chips, resulting in low placement efficiency. Based on this, the existing chip placement device is inconvenient for small-pitch placement, which needs to be solved urgently. Summary of the Invention

[0005] The purpose of the present invention is to solve the disadvantage of the existing chip mounting device in the prior art that it is inconvenient to perform fine-pitch chip mounting, and to propose a chip mounting device and method for CSP packaged LEDs.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a patch device for CSP packaged LEDs, comprising a frame, on which a patch roller, a processing platform and a feeding mechanism are respectively provided, a drive box is fixedly installed on the upper side of the frame, a central shaft is fixedly installed on the front side of the drive box, the patch roller is rotatably installed on the surface of the central shaft, and the drive box drives the patch roller to rotate.

[0007] A plurality of mounting seats are embedded in the surface of the patch roller, and each mounting seat is arranged in a ring array on the surface of the patch roller. A plurality of patch heads are slidably installed inside the mounting seat, and the nozzle end of the patch head faces the outside of the patch roller. A return spring is provided on the surface of the mounting seat to press the patch head inward, and a first electromagnetic telescopic rod and a second electromagnetic telescopic rod are fixedly installed on the surface of the central axis respectively, and the first electromagnetic telescopic rod and the second electromagnetic telescopic rod can both drive the patch head to telescope.

[0008] The carrier to be mounted is placed on the upper surface of the processing platform. The nozzle end of the mounting head picks up the chip delivered by the feeding mechanism. Then, the rotation of the mounting roller is used to change the direction of the nozzle end of the mounting head, and the chip is attached to the surface of the carrier. The mounting roller can rotate at a fixed angle, and the chip picking operation is completed at the same time as the mounting action.

[0009] Preferably, the several mounting seats are divided into multiple groups, and each group of mounting seats includes a first seat body, a second seat body, and a third seat body. The first seat body, the second seat body, and the third seat body in each group are arranged adjacent to each other, and the patch heads on the first seat body, the patch heads on the second seat body, and the patch heads on the third seat body are staggered with each other. When the patch heads pick up chips for patching, they can be used to patch chips to meet the use requirements of dense patching.

[0010] Preferably, a sliding cavity for installing a patch head is provided inside the mounting seat, a first slot and a second slot are provided inside the sliding cavity, a negative pressure hole and a positive pressure hole are provided inside the mounting seat respectively, the negative pressure hole is connected to the first slot, and the positive pressure hole is connected to the second slot, a drainage channel connected to the nozzle end of the patch head is provided on the surface of the patch head, and when the patch head is extended and retracted, the mouth of the drainage channel is connected to the first slot alone, or the mouth of the drainage channel is connected to the second slot alone.

[0011] There are two annular grooves on the surface of the central shaft, and multiple internal air channels are set inside the patch roller. The negative pressure hole of each mounting seat is connected to an annular groove through the internal air channel, and the positive pressure hole in each mounting seat is connected to another annular groove through the internal air channel. An exhaust pipe and an air inlet pipe are installed inside the central shaft. The exhaust pipe is connected to the negative pressure hole through the annular groove, and the air inlet pipe is connected to the positive pressure hole through another annular groove. Air is sucked through the exhaust pipe to form a negative pressure at the nozzle of the patch head, thereby realizing the function of picking up the chip.

[0012] Preferably, a slide rail is fixedly installed on the upper surface of the frame, and the processing platform is slidably installed on the upper side of the slide rail. A transmission screw is rotatably installed inside the frame, and the transmission screw is threadedly connected to the bottom of the processing platform. A first servo motor is fixedly installed inside the frame, and the first servo motor drives the transmission screw to rotate. When the first servo motor rotates forward or reverse, the processing platform can be translated back and forth left and right along the surface of the slide rail.

[0013] Preferably, the feeding mechanism includes a transmission wheel rotatably mounted on the front side of the drive box, the surface of the transmission wheel is covered with a transmission tape, and the chip is adhered to the surface of the transmission tape to facilitate the patch head to pick up the chip.

[0014] Preferably, a second servo motor and a third servo motor are fixedly installed inside the drive box, the second servo motor drives the patch roller to rotate through gear transmission, the rotating end of the third servo motor is fixedly connected to the transmission wheel, the transmission wheel is arranged on the side of the patch roller, the telescopic end of the first electromagnetic telescopic rod is facing the transmission wheel, and the telescopic end of the second electromagnetic telescopic rod is facing the upper surface of the processing platform. The pushing action of the first electromagnetic telescopic rod and the second electromagnetic telescopic rod is utilized to realize not only the telescopic action of the patch head, but also the automatic switching of the airflow direction at the nozzle end of the patch head.

[0015] The present invention also proposes a method for mounting CSP packaged LEDs, comprising the following steps:

[0016] S1, Picking: The third servo motor drives the transmission wheel to rotate, so that the chip on the transmission tape moves to the side facing the patch roller. The first electromagnetic telescopic rod pushes the patch head out. At this time, the mouth of the drainage channel is connected to the first slot, and the nozzle end of the patch head uses negative pressure to absorb the chip;

[0017] S2, patch, the second servo motor rotates, turning the patch head with the chip adsorbed to face downward, and the second electromagnetic telescopic rod pushes the patch head out. At this time, the mouth of the drainage channel is connected to the second slot, and the internal pressure of the nozzle end of the patch head is positive. The chip is attached to the carrier, and the second electromagnetic telescopic rod contracts. The patch roller rotates at a fixed angle, switching different patch heads to place chips on the carrier;

[0018] S3, patching. During S2, the processing platform remains in the same position. After the patch head on the first seat completes the patching, the patch head on the second seat and the patch head on the third seat are used to patch the carrier in sequence, so that the chips are arranged vertically on the carrier.

[0019] S4, continuous patching, after S3 is completed, the first servo motor is started, driving the processing platform to move intermittently according to a fixed step distance, so that the chips are arranged horizontally on the carrier.

[0020] The present invention has the following beneficial effects:

[0021] 1. The patch device proposed in the present invention has multiple mounting seats on the surface of the patch roller, and the patch heads on different mounting seats are arranged in an interlaced manner. When the patch head picks up the chip for patching, the patch head can be used to patch the chip, meeting the use requirements of dense patching, solving the shortcoming of the existing technology that it is inconvenient to perform small-pitch patching, and reducing the distance between chips, providing conditions for the subsequent use of CSP packaging to reduce the size of LED packaging.

[0022] 2. The patch device proposed in the present invention sets a second servo motor to drive the patch roller so that the patch roller can rotate at a fixed angle, and completes the operation of picking up the chip while the patch is in progress. Compared with using reciprocating motion to pick up and patch the chip, each working action is simpler, thereby improving the patch efficiency.

[0023] 3. The patch device proposed in the present invention places a carrier on a processing platform. The first servo motor drives the processing platform to move intermittently with a fixed step distance through the transmission of the transmission screw, so that the chips can be arranged horizontally on the carrier. The spacing of the chips in the horizontal direction can be adjusted by changing the moving step size of the processing platform. A certain number of patch heads on a certain group of mounting seats are removed to form a blank area. The blank area can be used to avoid obstacles or holes on the carrier to meet the patch needs at different positions.

[0024] 4. In the patch device proposed in the present invention, when the patch head is extended and retracted, the mouth of the drainage channel is connected to the first slot alone, or the mouth of the drainage channel is connected to the second slot alone. By utilizing the pushing action of the first electromagnetic telescopic rod and the second electromagnetic telescopic rod, not only the extension and retraction action of the patch head is realized, but also the automatic switching of the airflow direction at the nozzle end of the patch head is realized, thereby promoting a more coordinated chip picking or releasing action and ensuring the stability and reliability of the patch action. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the three-dimensional structure of the patch device proposed in the present invention Figure 1 ;

[0026] Figure 2 Schematic diagram of the three-dimensional structure of the patch device proposed in the present invention Figure 2 ;

[0027] Figure 3 This is a schematic diagram of the three-dimensional structure of the patch roller proposed in the present invention;

[0028] Figure 4 This is a schematic diagram of the front cross-section structure of the patch roller proposed in the present invention;

[0029] Figure 5 for Figure 4 A magnified schematic diagram of the local structure;

[0030] Figure 6 This is a schematic diagram of the top view of the patch roller proposed in the present invention;

[0031] Figure 7 This is a schematic diagram of the top cross-sectional structure of the patch roller proposed in the present invention;

[0032] Figure 8 This is a schematic diagram of the front cross-section structure of the mounting seat proposed by the present invention Figure 1 ;

[0033] Figure 9 This is a schematic diagram of the front cross-section structure of the mounting seat proposed by the present invention Figure 2 ;

[0034] Figure 10 This is a schematic diagram of the top view of the carrier structure proposed by the present invention.

[0035] In the figure: 1 frame, 2 patch roller, 3 processing platform, 4 drive box, 5 center axis, 6 mounting seat, 7 patch head, 8 return spring, 9 first electromagnetic telescopic rod, 10 second electromagnetic telescopic rod, 11 carrier, 12 chip, 13 first seat body, 14 second seat body, 15 third seat body, 16 first notch, 17 second notch, 18 negative pressure hole, 19 positive pressure hole, 20 drainage channel, 21 annular groove, 22 internal airway, 23 exhaust pipe, 24 intake pipe, 25 slide rail, 26 transmission screw, 27 first servo motor, 28 transmission belt, 29 second servo motor, 30 third servo motor, 31 transmission wheel. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0037] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0038] Reference Figures 1-10A CSP packaged LED chip placement device includes a frame 1, on which a chip placement roller 2, a processing platform 3 and a feeding mechanism are respectively provided. A slide rail 25 is fixedly installed on the upper surface of the frame 1, and the processing platform 3 is slidably installed on the upper side of the slide rail 25. A transmission screw 26 is rotatably installed inside the frame 1, and the transmission screw 26 is threadedly connected to the bottom of the processing platform 3. A first servo motor 27 is fixedly installed inside the frame 1, and the first servo motor 27 drives the transmission screw 26 to rotate. Figure 1 As shown, when the first servo motor 27 rotates forward or reverse, the processing platform 3 can be translated back and forth left and right along the surface of the slide rail 25 .

[0039] A drive box 4 is fixedly installed on the upper side of the frame 1, and the feeding mechanism includes a transmission wheel 31 rotatably installed on the front side of the drive box 4. The surface of the transmission wheel 31 is covered with a transmission tape 28, and the chip 12 is pasted on the surface of the transmission tape 28. The feeding mechanism is a conventional setting in the prior art and does not fall within the scope of protection claimed by the present invention, and will not be described here.

[0040] A central shaft 5 is fixedly installed on the front of the drive box 4, and the patch roller 2 is rotatably installed on the surface of the central shaft 5. The drive box 4 drives the patch roller 2 to rotate; specifically, a second servo motor 29 and a third servo motor 30 are fixedly installed inside the drive box 4. The second servo motor 29 drives the patch roller 2 to rotate through gear transmission, and the rotating end of the third servo motor 30 is fixedly connected to the transmission wheel 31.

[0041] refer to Figure 4 , a plurality of mounting seats 6 are embedded on the surface of the patch roller 2, and each mounting seat 6 is arranged in a ring array on the surface of the patch roller 2. A plurality of patch heads 7 are slidably installed inside the mounting seat 6, and the nozzle end of the patch head 7 faces the outside of the patch roller 2. A reset spring 8 is provided on the surface of the mounting seat 6 to press the patch head 7 inward. The surface of the central shaft 5 is fixedly mounted with a first electromagnetic telescopic rod 9 and a second electromagnetic telescopic rod 10. The first electromagnetic telescopic rod 9 and the second electromagnetic telescopic rod 10 can both push the patch head 7 to move in a telescopic manner, such as Figure 4 As shown, the transmission wheel 31 is arranged on the side of the patch roller 2 , the telescopic end of the first electromagnetic telescopic rod 9 faces the transmission wheel 31 , and the telescopic end of the second electromagnetic telescopic rod 10 faces the upper surface of the processing platform 3 .

[0042] The carrier 11 to be mounted is placed on the upper surface of the processing platform 3. Depending on the type of LED lamp, a PCB board or a flexible tape can be selected as the carrier 11. The carrier 11 is attached to the surface of the processing platform 3 by a clamp or tape so that the carrier 11 can move synchronously with the processing platform 3. Figure 4 As shown, the nozzle end of the patch head 7 picks up the chip 12 delivered by the feeding mechanism, and then uses the rotation of the patch roller 2 to change the direction of the nozzle end of the patch head 7 to stick the chip 12 to the surface of the carrier 11.

[0043] Specifically, several mounting seats 6 are divided into multiple groups, each group of mounting seats 6 includes a first base body 13, a second base body 14, and a third base body 15. The first base body 13, the second base body 14, and the third base body 15 in each group are arranged adjacent to each other, and the patch head 7 on the first base body 13, the patch head 7 on the second base body 14, and the patch head 7 on the third base body 15 are staggered. Figure 3 In the dotted line positions ①, ②, and ③, the patch head 7 on the first base body 13 is patched according to the dotted line position ①, the patch head 7 on the second base body 14 is patched according to the dotted line position ②, and the patch head 7 on the third base body 15 is patched according to the dotted line position ③. Figure 3 In order to more clearly draw the position relationship of the patch head 7, the attached Figure 3 Only a few placement heads 7 are shown in the figure. In fact, in order to pick up more chips 12 at a time, a relatively large number of placement heads 7 are provided on each mounting seat 6.

[0044] refer to Figure 8 A sliding cavity for mounting the patch head 7 is provided inside the mounting seat 6, and a first slot 16 and a second slot 17 are provided inside the sliding cavity. A negative pressure hole 18 and a positive pressure hole 19 are respectively provided inside the mounting seat 6. The negative pressure hole 18 is connected to the first slot 16, and the positive pressure hole 19 is connected to the second slot 17. A drainage channel 20 connected to the nozzle end of the patch head 7 is provided on the surface of the patch head 7. When the patch head 7 is telescopic, the mouth of the drainage channel 20 is connected to the first slot 16 alone, or the mouth of the drainage channel 20 is connected to the second slot 17 alone.

[0045] refer to Figure 7 Two annular grooves 21 are provided on the surface of the central shaft 5, and a plurality of internal air channels 22 are provided inside the patch roller 2. The negative pressure hole 18 of each mounting seat 6 is connected with an annular groove 21 through the internal air channel 22, and the positive pressure hole 19 in each mounting seat 6 is connected with another annular groove 21 through the internal air channel 22. An exhaust pipe 23 and an air inlet pipe 24 are installed inside the central shaft 5. The exhaust pipe 23 is connected with the negative pressure hole 18 through the annular groove 21, and the air inlet pipe 24 is connected with the positive pressure hole 19 through another annular groove 21. Since the patch roller 2 needs to rotate on the surface of the central shaft 5, by setting two annular grooves 21, the patch roller 2 can rotate. During the process of the patch roller 2 rotating, the exhaust pipe 23 is connected with the negative pressure hole 18 in each mounting seat 6 in real time, and the air inlet pipe 24 is connected with the positive pressure hole 19 in each mounting seat 6 in real time.

[0046] During installation, connect the air pump to the air extraction pipe 23. The air pump sucks the air in the air extraction pipe 23 to form a negative pressure at the nozzle of the patch head 7. Figure 8 , so that the nozzle end of the patch head 7 can absorb the chip 12, and the air inlet pipe 24 can be directly connected to the outside air, refer to Figure 9 When the mouth of the drainage channel 20 is connected to the second notch 17 , the negative pressure of the nozzle of the patch head 7 disappears, and the chip 12 can fall from the nozzle end of the patch head 7 .

[0047] When the patch head 7 is extended and retracted, the mouth of the drainage channel 20 is connected to the first slot 16 alone, or the mouth of the drainage channel 20 is connected to the second slot 17 alone. The driving action of the first electromagnetic telescopic rod 9 and the second electromagnetic telescopic rod 10 is utilized to not only realize the extension and retraction of the patch head 7, but also realize the automatic switching of the airflow direction at the nozzle end of the patch head 7, so as to make the picking or releasing action of the chip 12 more coordinated, and ensure the stability and reliability of the patch action.

[0048] The process of use includes the following steps:

[0049] S1, Pickup, Reference Figure 4 The third servo motor 30 drives the transmission wheel 31 to rotate, so that the chip 12 on the transmission tape 28 moves to the side facing the patch roller 2. The first electromagnetic telescopic rod 9 pushes the patch head 7 to extend. At this time, the mouth of the drainage channel 20 is connected to the first notch 16, and the nozzle end of the patch head 7 uses negative pressure to absorb the chip 12.

[0050] S2, patch, the second servo motor 29 rotates, the patch head 7 with the chip 12 adsorbed is turned to face downward, the second electromagnetic telescopic rod 10 pushes the patch head 7 out, refer to Figure 9 At this time, the mouth of the drainage channel 20 is connected to the second notch 17, the internal pressure of the nozzle end of the patch head 7 is positive, the chip 12 is attached to the carrier 11, and the second electromagnetic telescopic rod 10 is contracted. Figure 8 As shown, because the distance between the nozzle end of the patch head 7 and the chip 12 increases, the chip 12 will not be sucked again, and the patch roller 2 rotates according to a fixed angle, switching different patch heads 7 to perform patching on the carrier 11;

[0051] S3, patching. During S2, the processing platform 3 remains in the same position. After the patch head 7 on the first base 13 completes the patching, the patch head 7 on the second base 14 and the patch head 7 on the third base 15 are used to patch the carrier 11 in sequence, so that the chips 12 are arranged longitudinally on the carrier 11, and the longitudinal arrangement spacing is as follows: Figure 10 As shown in L1, reference Figure 3 At the dotted line positions ①, ②, and ③, the patch head 7 on the first base body 13 is patched according to the dotted line position ①, the patch head 7 on the second base body 14 is patched according to the dotted line position ②, and the patch head 7 on the third base body 15 is patched according to the dotted line position ③. The longitudinal arrangement spacing L1 can be optimized to be smaller and is not limited by the size of the patch head 7 itself.

[0052] S4, continuous patching. After S3 is completed, the first servo motor 27 is started, driving the processing platform 3 to move intermittently according to a fixed step distance, and the patch roller 2 rotates according to a fixed angle, switching different patch heads 7 to patch the carrier 11, so that the chips 12 are arranged horizontally on the carrier 11, and the horizontal arrangement spacing is as follows: Figure 10 As shown by L2 in the figure, the horizontal arrangement spacing L2 is determined by the rotation angle or number of revolutions of the first servo motor 27.

[0053] To sum up, the horizontal arrangement spacing L2 of the chips 12 can be adjusted by adjusting the rotation angle or number of turns of the first servo motor 27, but when the vertical arrangement spacing L1 of the chips 12 needs to be changed, it is necessary to replace each mounting seat 6, that is, by replacing the mounting seats 6 with different spacings of the patch heads 7, the vertical arrangement spacing L1 of the chips 12 can be changed. In addition, a certain number of patch heads 7 on a certain group of mounting seats 6 are removed to form a blank area, which can be used to avoid obstacles or holes on the carrier 11 to meet the patch requirements at different positions.

[0054] The patch device proposed in the present invention has multiple mounting seats 6 on the surface of the patch roller 2, and the patch heads 7 on different mounting seats 6 are arranged in an interlaced manner. When the patch head 7 picks up the chip 12 for patching, the patch head 7 can be used to perform patching, which meets the use requirements of dense patching and solves the shortcomings of the prior art that it is inconvenient to perform small-pitch patching. The distance between the chips 12 is reduced, which provides conditions for the subsequent use of CSP packaging to reduce the size of the LED package. By setting a second servo motor 29 to drive the patch roller 2 to move, the patch roller 2 can be rotated at a fixed angle, and the operation of picking up the chip 12 is completed at the same time as the patch action. Compared with using reciprocating motion to pick up and patch the chip 12, each working action is simpler, thereby improving the patch efficiency.

[0055] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A chip placement device for CSP packaged LEDs, comprising a frame (1), on which a chip placement roller (2), a processing platform (3) and a feeding mechanism are respectively provided, characterized in that: A drive box (4) is fixedly mounted on the upper side of the frame (1), a central shaft (5) is fixedly mounted on the front side of the drive box (4), and the patch roller (2) is rotatably mounted on the surface of the central shaft (5), and the drive box (4) drives the patch roller (2) to rotate; The surface of the patch roller (2) is embedded with a plurality of mounting seats (6), each mounting seat (6) is arranged in a ring array on the surface of the patch roller (2), a plurality of patch heads (7) are slidably mounted inside the mounting seat (6), the nozzle end of the patch head (7) faces the outside of the patch roller (2), and the surface of the mounting seat (6) is provided with a return spring (8) that presses inward against the patch head (7), and the surface of the central shaft (5) is fixedly mounted with a first electromagnetic telescopic rod (9) and a second electromagnetic telescopic rod (10), respectively, and both the first electromagnetic telescopic rod (9) and the second electromagnetic telescopic rod (10) can push the patch head (7) to telescope; A plurality of mounting seats (6) are divided into a plurality of groups, each group of mounting seats (6) comprises a first seat body (13), a second seat body (14), and a third seat body (15), the first seat body (13), the second seat body (14), and the third seat body (15) in each group are arranged adjacent to each other, and the patch heads (7) on the first seat body (13), the patch heads (7) on the second seat body (14), and the patch heads (7) on the third seat body (15) are arranged staggered with each other; The carrier (11) to be mounted is placed on the upper surface of the processing platform (3), and the nozzle end of the mounting head (7) picks up the chip (12) delivered by the feeding mechanism. Then, the mounting roller (2) is rotated to change the direction of the nozzle end of the mounting head (7) to mount the chip (12) on the surface of the carrier (11).

2. The CSP packaged LED chip device according to claim 1, characterized in that: The mounting seat (6) is provided with a sliding cavity for mounting the patch head (7), the sliding cavity is provided with a first notch (16) and a second notch (17), the mounting seat (6) is provided with a negative pressure hole (18) and a positive pressure hole (19), the negative pressure hole (18) is connected to the first notch (16), and the positive pressure hole (19) is connected to the second notch (17), the surface of the patch head (7) is provided with a drainage channel (20) connected to the nozzle end of the patch head (7), and when the patch head (7) is extended and retracted, the mouth of the drainage channel (20) is connected to the first notch (16) alone, or the mouth of the drainage channel (20) is connected to the second notch (17) alone.

3. The CSP packaged LED chip device according to claim 2, characterized in that: Two annular grooves (21) are provided on the surface of the central shaft (5), and a plurality of internal air passages (22) are provided inside the patch roller (2). The negative pressure hole (18) of each mounting seat (6) is connected to one annular groove (21) through the internal air passage (22), and the positive pressure hole (19) in each mounting seat (6) is connected to another annular groove (21) through the internal air passage (22). An exhaust pipe (23) and an air inlet pipe (24) are installed inside the central shaft (5), and the exhaust pipe (23) is connected to the negative pressure hole (18) through the annular groove (21), and the air inlet pipe (24) is connected to the positive pressure hole (19) through another annular groove (21).

4. The CSP packaged LED chip device according to claim 3, characterized in that: A slide rail (25) is fixedly mounted on the upper surface of the frame (1), and the processing platform (3) is slidably mounted on the upper side of the slide rail (25). A transmission screw (26) is rotatably mounted inside the frame (1), and the transmission screw (26) is threadedly connected to the bottom of the processing platform (3). A first servo motor (27) is fixedly mounted inside the frame (1), and the first servo motor (27) drives the transmission screw (26) to rotate.

5. The CSP packaged LED chip device according to claim 4, characterized in that: The feeding mechanism comprises a transmission wheel (31) rotatably mounted on the front side of the driving box (4), a transmission tape (28) being sleeved on the surface of the transmission wheel (31), and the chip (12) being adhered to the surface of the transmission tape (28).

6. The CSP packaged LED chip device according to claim 5, characterized in that: A second servo motor (29) and a third servo motor (30) are fixedly installed inside the driving box (4); the second servo motor (29) drives the patch roller (2) to rotate through gear transmission; and the rotating end of the third servo motor (30) is fixedly connected to the transmission wheel (31).

7. The CSP packaged LED chip device according to claim 6, characterized in that: The transmission wheel (31) is arranged on the side of the patch roller (2), the telescopic end of the first electromagnetic telescopic rod (9) faces the transmission wheel (31), and the telescopic end of the second electromagnetic telescopic rod (10) faces the upper surface of the processing platform (3).

8. A method for mounting a CSP packaged LED, according to the CSP packaged LED mounting device of claim 7, characterized in that: The following steps are involved: S1, picking up, the third servo motor (30) drives the transmission wheel (31) to rotate, so that the chip (12) on the transmission tape (28) moves to the side facing the patch roller (2), and the first electromagnetic telescopic rod (9) pushes the patch head (7) to extend. At this time, the mouth of the drainage channel (20) is connected to the first notch (16), and the nozzle end of the patch head (7) uses negative pressure to absorb the chip (12); S2, patching, the second servo motor (29) rotates, and the patch head (7) with the chip (12) adsorbed thereon is turned downward, and the second electromagnetic telescopic rod (10) pushes the patch head (7) outward. At this time, the mouth of the drainage channel (20) is connected to the second slot (17), and the inside of the nozzle end of the patch head (7) is under positive pressure. The chip (12) is attached to the carrier (11), and the second electromagnetic telescopic rod (10) contracts. The patch roller (2) rotates at a fixed angle, and different patch heads (7) are switched to perform patching on the carrier (11); S3, patching. During the S2 process, the processing platform (3) remains in the same position. After the patch head (7) on the first seat (13) completes the patching, the patch head (7) on the second seat (14) and the patch head (7) on the third seat (15) are used in sequence to patch the carrier (11), so that the chip (12) is arranged longitudinally on the carrier (11); S4, continuous patching. After S3 is completed, the first servo motor (27) is started to drive the processing platform (3) to move intermittently according to a fixed step distance, so that the chip (12) is arranged horizontally on the carrier (11).

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