Micro-nano etching process and equipment for solar cell silicon wafer

Abstract

The present application relates to the technical field of etching, in particular to a micro-nano etching process and equipment for a solar cell silicon wafer, which has the beneficial effect that the micro-nano etching process and equipment for a solar cell silicon wafer comprises a machine body and an etching assembly arranged in the machine body, the machine body is provided with a clamping assembly for fixing the silicon wafer and a bearing assembly for bearing the silicon wafer, and further comprises a separation assembly arranged in the machine body, which comprises a separation plate and torsion spring columns arranged on both sides of the separation plate; the bearing mechanism is driven by a driving mechanism to move downward, so that the separation assembly can prevent etching liquid from splashing onto the roller set during etching, thereby prolonging the service life of the roller set and avoiding the recontamination of the silicon wafer caused by the reset of the roller set during the transportation of the silicon wafer, which affects the etching precision; when the bearing mechanism moves downward, the scraper moves on the surface of the separation plate, thereby scraping off the etching deposits on the surface of the separation plate, which facilitates the regeneration and recovery of the deposits during the regeneration of the etching liquid.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of etching technology, in particular to a micro-nano etching process and equipment for solar cell silicon wafer. BACKGROUND

[0002] Solar photovoltaic power generation will become one of the important sources of future energy, and with the increasing global energy demand, the importance of solar photovoltaic power generation will become greater and greater. In the manufacturing process of solar cells, especially for the current TBC cell process, the electrode pattern is concentrated on the back of the cell, and a specific pattern needs to be manufactured on the electrode surface through micro-nano processing technology. Common micro-nano processing technologies include micro-nano spraying etching and laser slotting ablation technology.

[0003] Patent document CN116043225B discloses a curved surface metal surface microstructure etching processing device and method, which comprises a machine body, a support table, a mold and an etching mechanism. The support table is arranged on the machine body, and the mold is installed on the support table. The top of the mold is provided with an arc-shaped positioning surface for supporting the curved surface metal. The etching mechanism is used to spray etching liquid onto the upper surface of the curved surface metal. The application can realize different etching forming depths and shapes at different positions.

[0004] In the actual processing process, the silicon wafer is sent into the roller bearing mechanism inside the etching machine through the conveying belt. After micro-nano spraying etching, deionized water cleaning and high-purity nitrogen blowing and drying, the silicon wafer is finally sent out by the roller bearing mechanism. However, during the spraying etching process, the etching liquid has the problem of sputtering and escaping, which can easily wet the roller and cause corrosion, reducing the service life. Moreover, when the roller transports the silicon wafer out of the machine body, the etching liquid on the roller will adhere to the silicon wafer and be taken out. The etching liquid is usually an acid or alkali liquid such as hydrofluoric acid, which can easily corrode the machinery and affect the subsequent processing. If it is contaminated at the etching position, it will also cause continuous etching, resulting in uneven etching and reducing the processing precision. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a micro-nano etching process and equipment for solar cell silicon wafer, which solves the problems raised in the background art.

[0006] To achieve the above purpose, the present application realizes the following technical scheme: a micro-nano etching equipment for solar cell silicon wafer, comprising a machine body and an etching assembly arranged in the machine body. The machine body is provided with a clamping assembly for fixing the silicon wafer and a bearing assembly for bearing the silicon wafer, and further comprising:

[0007] The separating assembly is arranged in the machine body and comprises a separating plate and torsion spring columns arranged on both sides of the separating plate, which is passively opened when the clamping assembly fixes the silicon wafer and drives the bearing assembly to descend, and is automatically reset to separate the etching assembly and the bearing assembly when the bearing assembly is below.

[0008] Preferably, the clamping assembly comprises a bidirectional electric push rod arranged in the machine body and a driving member fixedly connected with the output shaft of the bidirectional electric push rod, and a power rod is arranged on the driving member, and a plate sleeve is arranged at the other end of the power rod.

[0009] Preferably, the bearing assembly comprises a bearing mechanism and a driving mechanism, the bearing mechanism comprises a mounting plate in the machine body and a servo motor fixedly mounted on the mounting plate, and a roller set is fixedly mounted on the output shaft of the servo motor.

[0010] Preferably, driving wheels are further fixedly mounted at both ends of the roller set, and the diameter of the driving wheels is greater than that of the rollers on the roller set.

[0011] Preferably, the cleaning assembly further comprises telescopic spring columns arranged on both sides of the separating plate and scrapers arranged on the telescopic spring columns, the scrapers are provided with clamping columns, and clamping grooves are arranged on the driving wheels.

[0012] Preferably, the sealing assembly further comprises mounting grooves arranged on both sides of the machine body and sealing plates movably mounted in the mounting grooves, the sealing plates are provided with first thin ropes, and the other ends of the first thin ropes are fixedly connected with the driving member.

[0013] Preferably, the condensing assembly further comprises elastic belts arranged in the machine body and fixed plates fixedly connected with the elastic belts, the bottom of the fixed plate is provided with a condensing pipe, a second thin rope is fixedly connected with one side of the first thin rope, and the other end of the second thin rope is fixedly connected with the fixed plate.

[0014] Preferably, the condensing assembly further comprises connecting members fixedly mounted at the bottom of the fixed plate, and the other ends of the connecting members are provided with wiping cotton.

[0015] Preferably, the condensing assembly further comprises elastic sheets fixedly connected with the inner side of the elastic belts, and the other ends of the elastic sheets are fixedly mounted with elastic balls.

[0016] A micro-nano etching process of a solar cell silicon wafer, using the micro-nano etching device of the solar cell silicon wafer, comprises the following steps:

[0017] S1: when in use, the silicon wafer is conveyed to the bearing mechanism, then the clamping assembly is started to fix the silicon wafer, and then the etching assembly is used for etching;

[0018] S2: when the clamping assembly is started, the driving mechanism drives the bearing mechanism to move downward and pass through the separation assembly, and the separation assembly separates the etching assembly and the bearing mechanism, at this time the cleaning assembly passively cleans the separation plate;

[0019] S3: when the clamping assembly is started, the first thin rope is pulled to make the sealing plate rise to seal the machine body, preventing the etching liquid from volatilizing to the outside;

[0020] S4: the condensing pipe can condense the volatilized etching liquid, and after the first thin rope is pulled, the condensing pipe is in an inclined state to prevent the condensate from falling in a large area and affecting the etching operation.

[0021] In the above technical solution, the beneficial effects of the present application are: by driving the bearing mechanism to move downward, the separation assembly can prevent etching liquid from splashing to the roller group during etching, improving the service life of the roller group, avoiding the recontamination of the silicon wafer during the reset of the roller group, and affecting the etching precision, and when the bearing mechanism moves downward, the scraper moves on the surface of the separation plate, thereby scraping off the etching deposits on the surface of the separation plate, facilitating the regeneration and recovery of the deposits during the regeneration of the etching liquid.

[0022] It should be understood that the foregoing general description and the following detailed description are only exemplary and illustrative, but not for limiting the present disclosure.

[0023] The present application file provides an overview of various implementations or examples of the technology described in the present disclosure, and is not a comprehensive disclosure of the full scope or all features of the disclosed technology. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 Structure diagram of the present application Figure One ;

[0025] Figure 2 Structure diagram of the present application Figure Two ;

[0026] Figure 3 Structure diagram of the present application Figure Three ;

[0027] Figure 4 Structure diagram of the present application

[0028] Figure 5 Structure diagram of the present application

[0029] Figure 6 Structure diagram of the present application

[0030] Figure 7Structure diagram of the cleaning assembly of the present application

[0031] Figure 8 Structure diagram of the process of driving the separating plate by the driving wheel of the present application Figure One

[0032] Figure 9 Structure diagram of the process of driving the separating plate by the driving wheel of the present application Figure Two

[0033] Figure 10 Structure diagram of the condensing assembly, sealing assembly and etching assembly of the present application.

[0034] In the figure: 1, machine body; 11, conveying groove; 12, double-shaft sliding table; 13, first electric push rod; 14, spraying module; 15, guide pipe; 16, identification camera; 17, conveying belt; 18, bearing plate; 2, bidirectional electric push rod; 21, driving piece; 22, power rod; 23, plate sleeve; 24, second electric push rod; 25, clamping plate; 26, guide column; 3, mounting plate; 31, servo motor; 32, roller set; 33, rack; 34, gear; 35, sling take-up wheel; 36, support frame; 4, separating plate; 41, torsion spring column; 42, first through groove; 5, fixed block; 51, return spring; 52, telescopic spring column; 53, scraper; 54, clamping column; 55, sliding groove; 56, driving wheel; 57, clamping groove; 6, mounting groove; 61, sealing plate; 62, second through groove; 63, elastic column; 64, first thin rope; 65, guide ring; 7, elastic band; 71, fixed plate; 72, condensing pipe; 73, second thin rope; 8, connecting piece; 81, wiping cotton; 9, elastic sheet; 91, elastic ball. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application.

[0036] Embodiment 1: Please refer to Figures 1 to 9 The present application provides a technical solution: a micro-nano etching device for a solar cell silicon wafer, comprising a machine body 1 and an etching assembly arranged in the machine body 1. The machine body 1 is provided with a clamping assembly for fixing the silicon wafer, and a bearing assembly for bearing the silicon wafer. The device further comprises:

[0037] A separating assembly is arranged in the machine body 1, which comprises a separating plate 4 and torsion spring columns 41 arranged on both sides of the separating plate 4. When the clamping assembly fixes the silicon wafer and drives the bearing assembly to descend, the separating plate 4 is passively opened, and when the bearing assembly is below the separating plate 4, the separating plate 4 automatically resets the separating etching assembly and the bearing assembly.

[0038] ​​The clamping assembly comprises a bidirectional electric push rod 2 arranged in the machine body 1 and a driving piece 21 fixedly connected with the output shaft of the bidirectional electric push rod 2, and the driving piece 21 is provided with a power rod 22, and the other end of the power rod 22 is provided with a plate sleeve 23.

[0039] The bearing assembly comprises a bearing mechanism and a driving mechanism, the bearing mechanism comprises a mounting plate 3 in the machine body 1 and a servo motor 31 fixedly mounted on the mounting plate 3, and the output shaft of the servo motor 31 is fixedly provided with a roller set 32.

[0040] Further comprising a driving wheel 56 fixedly mounted at both ends of the roller set 32, and the diameter of the driving wheel 56 is greater than that of the rollers on the roller set 32.

[0041] Further comprising a cleaning assembly, the cleaning assembly comprises a telescopic spring column 52 arranged on both sides of the partition plate 4 and a scraper 53 arranged on the telescopic spring column 52, and the scraper 53 is provided with a clamping column 54, and the driving wheel 56 is provided with a clamping groove 57.

[0042] Specifically, the etching assembly comprises a double-shaft sliding table 12, a first electric push rod 13, a spraying module 14, a guide pipe 15, an identification camera 16 and a conveying belt 17, the double-shaft sliding table 12 and the first electric push rod 13 are used for adjusting the etching stroke, the guide pipe 15 is fixedly mounted on the lower side of the machine body 1 and is used for recycling etching liquid, the identification camera 16 is used for identifying the thickness of the silicon wafer when the silicon wafer is transported into the machine body 1, and data of the etching depth is provided, and the process is completed before the clamping operation, the conveying belt 17 is two in number and is arranged on both sides of the machine body 1, the machine body 1 is further fixedly provided with a bearing plate 18 inside, the bearing plate 18 is between the gaps of the roller set 32 and the upper surface is at the same horizontal plane as the top of the roller set 32, and conveying grooves 11 are arranged on both sides of the machine body 1 and are used for guiding the silicon wafer in and out, in use, the silicon wafer is conveyed to the roller set 32 through the conveying belt 17, then the servo motor 31 is started to drive the roller set 32 to rotate, the silicon wafer is conveyed to the bearing plate 18, the bearing plate 18 is used for bearing the silicon wafer, then the double-shaft electric push rod 2 is started to drive the driving piece 21 to move, the driving piece 21 drives the power rod 22, the power rod 22 drives the plate sleeve 23, the bottom of the plate sleeve 23 is higher than the top of the driving wheel 56, the second electric push rod 24 is fixedly mounted in the plate sleeve 23, the output shaft of the second electric push rod 24 is fixedly provided with a clamping plate 25, when the plate sleeve 23 passes over the driving wheel 56, the second electric push rod 24 is started to drive the clamping plate 25 to descend and make it contact with the top of the roller set 32, then the plate sleeve 23 is continuously moved until the clamping plate 25 clamps the silicon wafer, so that the interference of the driving wheel 56 can be avoided, the guide column 26 is fixedly mounted in the machine body 1, the driving piece 21 is movably mounted on the outer surface of the guide column 26 and is used for bearing and guiding the driving piece 21.

[0043] When the bidirectional electric push rod 2 is started to perform clamping operation, a hydraulic cylinder can be arranged inside the machine body 1 to drive the mounting plate 3 to move downward, and preferably, the driving mechanism comprises a rack 33 fixedly arranged at the bottom of the driving member 21 and a gear 34 engaged with the rack 33, and a cable winding and unwinding wheel 35 is further fixedly arranged at the middle of the gear 34, when the driving member 21 moves, the rack 33 is driven to move, so that the rack 33 drives the gear 34 to rotate, the gear 34 drives the cable winding and unwinding wheel 35 to rotate, thereby releasing the steel cable, so that the mounting plate 3 descends, and a support frame 36 is further movably arranged between the gear 34 and the cable winding and unwinding wheel 35, one end of the support frame 36 is fixedly connected with the inner wall of the machine body 1, and the other end of the support frame 36 supports the cable winding and unwinding wheel 35; a first through groove 42 matched with the torsion spring column 41 is arranged on the mounting plate 3, so as to prevent the mounting plate 3 from interfering with the torsion spring column 41, when the mounting plate 3 descends, the servo motor 31 needs to be started to adjust the driving wheel 56, and the clamping groove 57 is located above the clamping column 54, when the clamping groove 57 descends along with the mounting plate 3, since the diameter of the driving wheel 56 is greater than the diameter of the roller set 32, the driving wheel 56 will be in contact with the clamping column 54, so as to avoid the etching liquid remaining on the clamping column 54 in the last etching process from contacting the roller set 32, and at the same time, the driving wheel 56 can also limit the silicon wafer, so as to prevent the silicon wafer from falling off the roller set 32, it should be noted that when this situation occurs, the silicon wafer will be in contact with the driving wheel 56, when clamping, the plate sleeve 23 needs to be moved above the silicon wafer first, and the clamping plate 25 needs to be lowered to be in contact with the silicon wafer, then the plate sleeve 23 is continuously moved, at this time, the clamping plate 25 drives the silicon wafer to move forward, so that there is a gap between the silicon wafer and the driving wheel 56, then the clamping plate 25 is arranged between the silicon wafer and the driving wheel 56, and the clamping operation is completed;

[0044] Further, when the driving wheel 56 descends and is in contact with the clamping column 54, the driving wheel 56 will extrude the clamping column 54, so that the extension end of the telescopic spring column 52 descends, at this time, the scraper 53 is in contact with the surface of the partition plate 4, and as the driving wheel 56 continues to descend, the partition plate 4 arranged in the machine body 1 through the torsion spring column 41 will be flipped, and the position of the clamping column 54 changes when it is flipped, the servo motor 31 needs to be started to adjust the driving wheel 56, as shown in FIG. 4, when the partition plate 4 is flipped to a nearly vertical state, the servo motor 31 needs to be started again to drive the driving wheel 56 to rotate, so that the clamping groove 57 is separated from the clamping column 54, that is, the driving wheel 56 can smoothly move to the lower side of the partition plate 4, correspondingly, the roller set 32 will also be below the partition plate 4, and the partition plate 4 is arranged in the machine body 1 through the torsion spring column 41, when the driving wheel 56 is separated from the clamping column 54, the partition plate 4 gradually resets under the action of the torsion spring, until it is in the horizontal state again, in this way, the etching liquid can be prevented from splashing on the roller set 32 during etching, the service life of the roller set 32 is improved, and the reset of the roller set 32 can also avoid recontamination of the silicon wafer during transportation of the silicon wafer; Figure 8 ​

[0045] More specifically, when the driving wheel 56 drives the partition plate 4 to overturn, the clamping column 54 will also descend while overturning, thereby driving the scraper 53 to move on the surface of the partition plate 4, so as to scrape the etching deposits on the surface of the partition plate 4, facilitating the regeneration and recovery of the deposits during the regeneration of the etching liquid. The cleaning assembly further comprises a fixed block 5 fixed on both sides of the partition plate 4, and a return spring 51 fixedly connected with the fixed block 5, and the other end of the return spring 51 is fixedly connected with the sleeve end of the telescopic spring column 52, which is used for resetting the scraper 53. The sleeve end of the telescopic spring column 52 is further fixed with a T-shaped protrusion, and the both sides of the partition plate 4 are provided with sliding grooves 55 matched with the protrusion, which are used for limiting the telescopic spring column 52 and providing a moving stroke for the scraper 53.

[0046] It should be noted that when the mounting plate 3 is installed by the form of a sling, it is necessary to ensure that the overall weight of the bearing mechanism can smoothly drive the partition plate 4 to overturn, and at the same time, it is necessary to ensure that the distance between the driving wheel 56 and the partition plate 4 can make the partition plate 4 reset smoothly, and when the roller set 32 is reset, the mounting plate 3 is abutted with the sling take-up wheel 35 to prevent it from shaking;

[0047] On the other hand, when the partition plate 4 is laid out, a distance is needed to exist between the two partition plates 4 in the middle, so as to facilitate the etching liquid to fall to the bottom of the inner cavity of the machine body 1. The position of this distance needs to be between the gaps of the adjacent roller sets 32, so as to avoid the etching liquid from contacting the roller set 32. This layout will make the adjacent partition plates 4 have opposite overturning directions, so during the descending process of the driving wheel 56, when it is about to separate from the clamping column 54, the two partition plates 4 are in a nearly vertical state. At this time, it should be noted that it is necessary to ensure that the direction of the clamping groove 57 corresponding to each partition plate 4 can be adapted, and the distance between the driving wheel 56 and the partition plate 4 needs to be greater than the distance between the partition plate 4 and the clamping column 54, so as to prevent the two partition plates 4 from interfering with each other during overturning. For example, as shown in Figure 9 In addition, a sealing rubber pad can be arranged on one side of the partition plate 4. When the partition plate 4 is reset, the sealing rubber pad deformed can seal the gap between the partition plate 4 and the partition plate 4, so as to avoid the etching liquid from dripping from the gap. For example, as shown in Figure 9 In addition, a sealing rubber pad can be arranged on one side of the partition plate 4. When the partition plate 4 is reset, the sealing rubber pad deformed can seal the gap between the partition plate 4 and the partition plate 4, so as to avoid the etching liquid from dripping from the gap. For example, as shown in

[0048] Example 2: Please refer to Figure 1 、 Figure 2 and Figure 10 Further comprising a sealing assembly, the sealing assembly comprises a mounting groove 6 arranged on both sides of the machine body 1 and a sealing plate 61 movably mounted in the mounting groove 6. The sealing plate 61 is provided with a first thin rope 64, and the other end of the first thin rope 64 is fixedly connected with the driving part 21.

[0049] In the process of micro-nano etching operation, the volume of the sprayed etching liquid is small, so the volatilization reaction is also greater, and the acidic or alkaline volatilized components are easy to flow with the air and escape from the input and output ports of the equipment, affecting the operation environment. The traditional way is to add a negative pressure device on the top of the equipment, but for micro-nano etching, the power of the negative pressure device is too large, which easily affects the etching precision. Specifically, the middle part of the sealing plate 61 is provided with a second through groove 62 matched with the conveying groove 11. When the clamping operation is not performed, the conveying groove 11 coincides with the second through groove 62, which is used for the import and export of the silicon wafer. On the basis of embodiment 1, when the bidirectional electric push rod 2 drives the driving part 21, the driving part 21 will pull the first thin rope 64, so that the first thin rope 64 pulls the sealing plate 61 upwards, so that the second through groove 62 is deviated from the conveying groove 11, and the sealing plate 61 seals the conveying groove 11, so as to prevent the volatilized etching liquid components from escaping. The inner wall of the machine body 1 is also fixedly installed with a guide ring 65, which is movably installed with the first thin rope 64, which is used for guiding and limiting the first thin rope 64. The bottom of the installation groove 6 is also fixedly installed with an elastic column 63, the other end of which is fixedly connected with the bottom of the sealing plate 61, which is used for assisting the reset of the sealing plate 61.

[0050] Embodiment 3: please refer to Figure 1 and Figure 10 It also includes a condensing assembly, which includes an elastic belt 7 arranged in the machine body 1 and a fixed plate 71 fixedly connected with the elastic belt 7. The bottom of the fixed plate 71 is provided with a condensing pipe 72. A second thin rope 73 is fixedly connected with the first thin rope 64 on one side, and the other end of the second thin rope 73 is fixedly connected with the fixed plate 71.

[0051] It also includes a connecting piece 8 fixedly installed at the bottom of the fixed plate 71. The other end of the connecting piece 8 is provided with a wiping cotton 81.

[0052] It also includes an elastic sheet 9 fixedly connected to the inner side of the elastic belt 7. The other end of the elastic sheet 9 is fixedly installed with an elastic ball 91.

[0053] Specifically, the volatilized etching liquid components can be condensed and recovered through the condensing pipe 72, which improves the regeneration amount of the etching liquid and reduces the volatilized components from escaping again after the reset of the sealing plate 61 and the opening of the conveying groove 11. On the basis of embodiment 2, when the first thin rope 64 is pulled by the driving part 21, the second thin rope 73 will also be pulled by the driving part 21, so that the second thin rope 73 pulls one end of the fixed plate 71. At this time, one end of the elastic belt 7 is deformed, so that one side of the condensing pipe 72 is inclined. In this way, the condensate on the condensing pipe 72 can be collected from one side and fall off, avoiding the condensate on the condensing pipe 72 from falling off in a large area and corroding the machine. In addition to the condensing pipe 72, the condensing system also includes a condensing circulating device, which is prior art and will not be described in detail herein.

[0054] Further, when the fixed plate 71 is inclined, the connecting piece 8 will move in an inclined path, so that the wiping cotton 81 can wipe the identification camera 16, so that the identification camera 16 is clean when it is identified next time, and the precision data of the silicon wafer thickness is improved; after one etching is completed, the clamping operation is released at a certain speed, at this time, the fixed plate 71 will reset when the elastic belt 7 restores the deformation, so that the end of the condenser tube 72 gathering the condensate beads vibrates, so that the condensate beads drop, avoiding the existence of the condensate beads gathered but not dropped, which drop on the silicon wafer due to the vibration of the equipment during the transportation of the silicon wafer, affecting the etching precision, on the other hand, when the elastic belt 7 resets, the elastic sheet 9 and the elastic ball 91 also vibrate, so as to reciprocally bounce and touch the fixed plate 71, assisting the condensate beads to drop.

[0055] A micro-nano etching process of a solar cell silicon wafer, using the above-mentioned micro-nano etching device of a solar cell silicon wafer, comprising the following steps:

[0056] S1: when in use, the silicon wafer is conveyed to the bearing mechanism by the conveying belt 17, then the clamping assembly is started to fix the silicon wafer, and then the etching assembly is used for etching;

[0057] S2: when the clamping assembly is started, the bearing mechanism is driven by the driving mechanism to move downward, and passes through the separation assembly, and the separation assembly separates the etching assembly and the bearing mechanism, at this time, the cleaning assembly passively cleans the separation plate 4;

[0058] S3: when the clamping assembly is started, the first thin rope 64 is pulled, so that the sealing plate 61 rises to seal the body 1, preventing the etching liquid from volatilizing to the outside;

[0059] S4: the condensate pipe 72 can condense the volatilized etching liquid, and after the first thin rope 64 is pulled, the condensate pipe 72 will be in an inclined state, preventing the condensate beads from falling in a large area and affecting the etching operation.

[0060] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A micro / nano etching apparatus for solar cell silicon wafers, comprising a body (1) and etching components disposed within the body (1), wherein the body (1) is provided with a clamping component for fixing the silicon wafer and a supporting component for supporting the silicon wafer, characterized in that: Also include: The separation component is arranged in the body (1), which includes a partition plate (4) and a torsion spring column (41) arranged on both sides of the partition plate (4), which is passively opened when the clamping component fixes the silicon wafer and drives the carrier component to descend, and automatically resets the separation etching component and the carrier component when the carrier component is below it; The carrier component includes a carrier mechanism and a driving mechanism, the carrier mechanism includes a mounting plate (3) in the body (1) and a servo motor (31) fixedly installed on the mounting plate (3), and a roller set (32) is fixedly installed on the output shaft of the servo motor (31); Also includes a drive wheel (56) fixedly installed at both ends of the roller set (32), the diameter of the drive wheel (56) is greater than the diameter of the roller on the roller set (32); Also includes a cleaning component, the cleaning component includes a telescopic spring column (52) arranged on both sides of the partition plate (4) and a scraper (53) arranged on the telescopic spring column (52), the scraper (53) is provided with a clamping column (54), and the drive wheel (56) is provided with a clamping groove (57).

2. The micro / nano etching apparatus for silicon wafers of solar cells according to claim 1, characterized in that: The clamping component includes a bidirectional electric push rod (2) arranged in the body (1) and a driving piece (21) fixedly connected with the output shaft of the bidirectional electric push rod (2), the driving piece (21) is provided with a power rod (22), and the other end of the power rod (22) is provided with a sleeve (23). 3.The micro-nano etching device for solar cell silicon wafer of claim 2, wherein: Also includes a sealing component, the sealing component includes a mounting groove (6) opened on both sides of the body (1) and a sealing plate (61) movably mounted in the mounting groove (6), the sealing plate (61) is provided with a first fine cable (64), and the other end of the first fine cable (64) is fixedly connected with the driving piece (21). 4.The micro-nano etching device for solar cell silicon wafer of claim 3, wherein: Also includes a condensation component, the condensation component includes a elastic band (7) arranged in the body (1) and a fixed plate (71) fixedly connected with the elastic band (7), the bottom of the fixed plate (71) is provided with a condenser pipe (72), one side of the first fine cable (64) is fixedly connected with a second fine cable (73), and the other end of the second fine cable (73) is fixedly connected with the fixed plate (71).

5. The micro-nano etching device for solar cell silicon wafer according to claim 4, characterized in that: Also includes a connecting piece (8) fixedly installed at the bottom of the fixed plate (71), and the other end of the connecting piece (8) is provided with a wiping cotton (81). 6.The micro-nano etching device for solar cell silicon wafer of claim 4, wherein: Also includes a spring piece (9) fixedly connected to the inner side of the elastic band (7), and the other end of the spring piece (9) is fixedly installed with a spring ball (91).

7. A micro-nano etching process of a solar cell silicon wafer, using the micro-nano etching device of any one of claims 1-6, characterized in that: The steps include: S1: when using, the silicon wafer is conveyed to the carrier mechanism, then the clamping component is started to fix the silicon wafer, and then the etching component is used for etching; S2: when the clamping component is started, the driving mechanism drives the carrier mechanism to move downward and pass through the separation component, the separation component separates the etching component and the carrier mechanism, at this time the cleaning component passively cleans the partition plate (4); S3: when the clamping component is started, the first fine cable (64) is pulled, so that the sealing plate (61) rises to seal the body (1), preventing the etching liquid from volatilizing to the outside. S4: The condensed tube (72) can condense the volatile etching liquid, and after the first thin rope (64) is pulled, the condensed tube (72) is in an inclined state, preventing the condensed beads from falling in a large area and affecting the etching operation.

Images