Apparatus and method for heating tunability in processing chamber

Abstract

Embodiments herein relate generally to electronics fabrication, and more particularly, to systems and methods for lamp heating in thermal processing chambers. In one embodiment, an adjustable reflector includes a plurality of reflector elements. Each of the plurality of elements has a first surface, a second surface, and a plurality of sidewalls. The first surface is a reflective surface and is configured to face a lamp. The adjustable reflector includes one or more actuation mechanisms, the one or more actuation mechanisms being coupled to the plurality of elements. A method of thermally treating a substrate includes measuring a thermal intensity of a thermal profile of a substrate in a region below or above a lamp and the adjustable reflector, and adjusting the reflector profile of the reflector assembly along a centerline path in response to the thermal intensity being outside of a desired parameter.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to systems and methods for use in thermal processing chambers, such as semiconductor processing chambers. Specifically, embodiments include apparatus and methods for lamp heating in thermal processing chambers. Background Art

[0002] Processing chambers, such as epitaxial deposition (EPI) and rapid thermal processing (RTP) chambers, are used in semiconductor chip manufacturing to create or chemically alter semiconductor substrates. These chambers typically rely on an array of high-intensity incandescent lamps mounted in lamp heads and directed toward the substrate. The lamps are electrically powered and can be turned on and off very quickly, with a significant portion of their radiation directed toward the substrate. Consequently, the substrate can be heated very quickly without substantially heating the chamber, and can be cooled almost as quickly once the lamps are de-energized. However, controlling the heating of the substrate in current thermal processing chambers is limited by the kilowatt power available to regulate the lamps.

[0003] Therefore, there is a need for an improved thermal processing chamber in semiconductor processing. Summary of the Invention

[0004] Embodiments of the present disclosure generally relate to systems and methods for use in process chambers, such as semiconductor processing chambers. More specifically, embodiments include apparatus and methods for lamp heating in thermal processing chambers.

[0005] In one embodiment, an adjustable reflector is provided. The adjustable reflector includes a plurality of reflector elements. Each of the plurality of elements serves as a first surface, a second surface, and a plurality of sidewalls. The first surface is a reflective surface and is configured to face a lamp. The adjustable reflector includes one or more actuating mechanisms coupled to the plurality of elements.

[0006] In another embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body, the chamber body including a lid, a base plate, and a processing volume between the lid and the base plate. The substrate processing chamber also has an upper window between the lid and the processing volume and a lower window disposed between the base plate and the processing volume. A substrate support is disposed in the processing volume, and a lamp head is positioned below the lower window or above the upper window, wherein at least one lamp is disposed within the lamp head. Additionally, a reflector assembly is disposed on one side of the at least one lamp. The reflector assembly includes a plurality of elements and one or more actuator mechanisms coupled to the plurality of elements, wherein a first surface of each of the plurality of elements is a reflective surface.

[0007] In yet another embodiment, a method of thermally processing a substrate is provided. The method includes measuring a thermal intensity of a thermal profile of the substrate in an area below or above a lamp and a reflector assembly having a plurality of elements, determining whether the thermal intensity is outside of desired parameters, and adjusting a reflector profile of the reflector assembly along a centerline path using an actuation mechanism coupled to the reflector assembly in response to the thermal intensity being outside of the desired parameters.

[0008] In one embodiment, an adjustable reflector assembly is provided. The adjustable reflector assembly includes a plurality of elements including at least one fixed element and at least one rotating element, wherein a first surface of each of the plurality of elements is a reflective surface, and at least one actuation mechanism is configured to actuate the at least one rotating element relative to the fixed element.

[0009] In another embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body, the chamber body including a lid, a base plate, and a processing volume between the lid and the base plate. An upper window is disposed between the lid and the processing volume, and a lower window is disposed between the base plate and the processing volume. A substrate support assembly is disposed in the processing volume along with a lamp head, the lamp head being positioned below the lower window or above the upper window. At least one lamp is disposed in the lamp head, and a reflector assembly is disposed on one side of the at least one lamp. The reflector assembly includes a plurality of elements, wherein at least one of the plurality of elements is a fixed element, and wherein at least one of the plurality of elements is a rotating element.

[0010] In yet another embodiment, a method of processing a substrate is provided that includes measuring a heat intensity of a heat profile of an area of ​​the substrate beneath a lamp and a reflector assembly having a stationary element and a plurality of rotating elements, wherein a first surface of the stationary element and the plurality of rotating elements generates the reflector profile, determining whether the heat intensity is outside of desired parameters, and adjusting the reflector profile of the reflector assembly using an actuation mechanism coupled to the reflector assembly in response to the heat intensity being outside of the desired parameters.

[0011] In one embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body comprising a lid, a base plate, and a processing volume disposed between the lid and the base plate. An upper window is disposed between the lid and the processing volume, and a lower window is disposed between the base plate and the processing volume. A substrate support assembly is disposed in the processing volume along with a lamp head, the lamp head being disposed between the upper window and the lid or between the lower window and the base plate. At least one lamp is disposed within the lamp head, and a lens is disposed between the lamp head and the processing volume.

[0012] In another embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body, the chamber body including a lid, a base plate, and a processing volume between the lid and the base plate. An upper window is disposed between the lid and the processing volume, and a lower window is disposed between the base plate and the processing volume, and a substrate support assembly is disposed in the processing volume. A lamp head is disposed between the lower window and the base plate or between the upper window and the lid. A plurality of lamps are disposed in the lamp head, wherein the plurality of lamps include at least one first lamp operating at a first wavelength and at least one second lamp operating at a second wavelength different from the first wavelength.

[0013] In yet another embodiment, a method of heating a substrate is provided. The method includes measuring a heat intensity of a heat profile of a substrate on a substrate support in an area proximate a lamp and a lens between the lamp and the substrate support, determining whether the heat intensity is outside of desired parameters, and adjusting a focus of a lens assembly using an actuation mechanism coupled to the lens assembly in response to the heat intensity being outside of the desired parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order that the manner in which the features described above of the present disclosure may be understood in detail, a more particular description of the disclosure, briefly summarized above, may be made with reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the present disclosure, and that other equally effective embodiments may be admitted.

[0015] Figure 1 is a schematic cross-sectional side view of a processing device according to one implementation.

[0016] Figure 2A A schematic isometric view of a reflector assembly according to one embodiment is illustrated.

[0017] Figures 2B to 2D Illustrated according to some embodiments Figure 2A A schematic front view of a reflector assembly is shown.

[0018] Figure 3A A schematic isometric view of a reflector assembly according to one embodiment is illustrated.

[0019] Figure 3B Illustrated according to one embodiment Figure 3A A schematic front view of a reflector assembly is shown.

[0020] Figure 3C Illustrated according to one embodiment Figure 3A A schematic side view of a reflector assembly is shown.

[0021] Figure 4 A schematic front view of a reflector assembly according to one embodiment is illustrated.

[0022] Figure 5A A schematic front view of a reflector assembly according to one embodiment is illustrated.

[0023] Figure 5B Illustrated according to one embodiment Figure 5A A top view of the reflector assembly is shown.

[0024] Figure 5C Illustrated according to one embodiment Figure 5A A schematic front view of a reflector assembly is shown.

[0025] 6A to 6D A schematic front view of a reflector assembly according to one embodiment is illustrated.

[0026] Figure 7A An axonometric view of a lamp head according to one embodiment is illustrated.

[0027] Figure 7B Illustrated is a front view of a reflector assembly according to one embodiment.

[0028] Figure 8A A schematic cross-sectional view of a processing chamber according to one embodiment is illustrated.

[0029] Figure 8B Illustrated according to one embodiment Figure 9A An axonometric view of an edge reflector assembly of a processing chamber is shown.

[0030] Figure 8C A simplified schematic cross-sectional view of a processing chamber is illustrated according to one embodiment.

[0031] Figure 9A A schematic cross-sectional view of a processing chamber according to one embodiment is illustrated.

[0032] Figure 9B Illustrated according to one embodiment Figure 9A Schematic cross-sectional view of a lens assembly.

[0033] Figure 9C Illustrated according to one embodiment Figure 9A Schematic cross-sectional view of a lens assembly.

[0034] Figure 9D Illustrated according to one embodiment Figure 9A Schematic cross-sectional view of a lens assembly.

[0035] Figures 9E to 9F Illustrated according to one embodiment Figure 9A Schematic cross-sectional view of a lens assembly.

[0036] FIG. 10A to FIG. 10B A simplified cross-sectional view of a processing chamber is illustrated according to one embodiment.

[0037] Figure 10C A method for closed-loop operation of a reflector assembly according to one embodiment is illustrated.

[0038] Figure 10D is a method for open-loop operation of a reflector assembly according to one embodiment.

[0039] Figure 11A A top view of a lamp head assembly according to one embodiment is illustrated.

[0040] Figure 11B A top view of a lamp head assembly according to one embodiment is illustrated.

[0041] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0042]

[0011] Embodiments herein relate generally to processing chambers, and more particularly to systems and methods for controlling or tuning radiant heat directed toward a substrate from lamps in a thermal processing chamber.

[0043] In the present disclosure, a thermal processing chamber for epitaxial processing is provided to control radiation emitted from lamps in a lamp head. In some embodiments, a reflector assembly is used to control the focal length of radiation reflected from the lamp head toward a substrate in the thermal processing chamber. In other embodiments, a lens is used to control the focal length of radiation directed from the lamp head toward the substrate. Additionally, the lamps within the lamp head operate at different peak wavelengths to control the radiation emitted toward the substrate.

[0044] Figure 1 FIG2 is a schematic cross-sectional side view of a process chamber 100 according to one embodiment. The process chamber 100 is a process chamber used to perform thermal processes (e.g., epitaxial deposition processes). The process chamber 100 includes a chamber lid 104, a chamber body 102, a chamber floor 106, a cover 134, a processing volume 112, an array of radiant heating lamps 108 and 110 for heating, and a susceptor 114 disposed within the process chamber 100. The arrays of radiant heating lamps 108 and 110 are disposed above and below the susceptor 114, but either the array of upper radiant heating lamps 108 or the array of lower radiant heating lamps 110 may be omitted.

[0045] The array of radiant heating lamps 108, 110 can be independently controlled within a zone to control the temperature of various regions of the substrate 118 as process gases pass therethrough, thereby promoting deposition of material onto the upper surface of the substrate 118. The upper and lower lamps 108, 110 may include bulbs configured to heat the substrate 118 to a temperature within a range of approximately 200 degrees Celsius to approximately 1600 degrees Celsius. Each of the upper and lower lamps 108, 110 is coupled to a power distribution board (not shown), through which power is supplied to each of the upper and lower lamps 108, 110. The upper and lower lamps 108, 110 are positioned within a lamp head 145, which can be cooled during or after processing by, for example, introducing a cooling fluid into channels (not shown) between the upper and / or lower lamps 108, 110. Due in part to the close proximity of the lamp head 116 to the lower window 130, the lamp head 116 cools the lower window 130 both conductively and radiatively. The lamp head 116 may also cool the lamp walls and the walls of the reflector 140 surrounding the lamp. Alternatively, the lower window 130 may be cooled by convection methods.

[0046] The pedestal 114 is a disk-shaped substrate support as shown, but may alternatively include an annular substrate support that supports the substrate 118 from its edges, thereby exposing the back side of the substrate 118 to heat from the lower radiant heating lamps 110. The pedestal 114 is formed of silicon carbide or graphite coated with silicon carbide to absorb radiant energy from the radiant heating lamps 108, 110 and conduct the radiant energy to the substrate 118 to facilitate heating the substrate 118.

[0047] The pedestal 114 is positioned within the process chamber 100 between an upper window 120 and a lower window 130. Each of the upper and lower windows 120, 130 is shaped as a dome. However, it is contemplated that the upper and lower windows 120, 130 may have other shapes, including flat surfaces. A base ring 170 is positioned between the upper and lower windows 120, 130. Each of the upper and lower windows 120, 130 is optically transparent to the radiant energy provided by the array of radiant heat lamps 108, 110. The upper window 120 is positioned between the chamber lid 104 and the pedestal 114. The upper radiant heat lamps 108 are positioned above the first window 120. One or more reflectors 140 facilitate directing heat energy from the upper radiant heat lamps 108 toward the upper surface of the substrate 118. Similarly, the lower radiant heat lamps 110 are positioned below the second window 130 and may also include one or more reflectors 140 positioned to direct heat energy from the lower radiant heat lamps 110 toward the lower surface of the substrate 118.

[0048] The pedestal 114 includes a shaft or rod 114a coupled to a motion assembly 190. The motion assembly 190 includes one or more actuators or adjustment devices that provide for movement, adjustment, or rotation of the rod 114a or the pedestal 114. The pedestal 114 can rotate at between about 5 RPM and about 100 RPM (e.g., between about 10 RPM and about 50 RPM). A process gas inlet 162, a purge gas inlet 164, and a gas outlet 166 are disposed in the base ring 170 to facilitate exposure of the substrate 118 to process gases during processing. A process gas source 152 provides process gas to the process gas inlet 162, and a purge gas source 154 provides purge gas to the purge gas inlet 164. The process gas and purge gas flow through the gas outlet 166 to an exhaust assembly (not shown).

[0049] A reflector 140 can be placed outside the upper window 120, the lower window 130, or both to reflect light radiating away from the substrate 118 back onto the substrate 118. One or more clamping rings 142 can be used to secure the reflector 140 above the upper window 120. One or more additional clamping rings 142 can be used to secure another reflector 140 below the lower window 130. The reflector 140 can be made of a metal such as aluminum, brass, or stainless steel. The efficiency of the reflection can be improved by coating the reflector area with a highly reflective coating (e.g., gold). Alternatively, a mirror finish can be used to improve the reflectivity of the reflector. The reflector 140 can have one or more channels 144 connected to a cooling source (not shown). The channels 144 are connected to a passageway (not shown) formed on one side of the reflector 140 for cooling the reflector 140. The passages are configured to carry a flow of cooling fluid (eg, deionized water) or a forced gas flow (eg, air) and may run horizontally along a side of the reflector 140 in any desired pattern covering a portion or the entire surface of the reflector 140 .

[0050] The present disclosure contemplates the use of other lamps in addition to or in place of the various lamps described herein. For example, resistive heaters, light emitting diodes (LEDs), or lasers (e.g., solid-state vertical cavity surface emitting lasers (VCSELs)) may be used in the various lamps described herein.

[0051] The upper window 120 and the lower window 130 may be transparent to infrared radiation (eg, transmit at least 95% of infrared radiation). The upper window 120 and the lower window 130 may be made of quartz material (eg, clear quartz). Alternatively, the upper window and the lower window may be made of sapphire.

[0052] A circular shield 146 is disposed around the susceptor 114 and coupled to the base ring 170 or the gasket 172 to prevent or minimize heat leakage from the radiant heating lamps 108 and 110. The substrate temperature can be indirectly measured by a sensor configured to measure the temperature at the bottom of the susceptor 114. The sensor can be a pyrometer disposed in a port formed in the lamp head 116. Additionally, one or more temperature sensors 174 (such as pyrometers) are configured to measure the device-side temperature of the substrate 118. The one or more temperature sensors 174 are disposed through the chamber lid 104 and configured to sense the substrate 118.

[0053] The process chamber 100 described above is controlled by a processor-based system controller (e.g., controller 180), which may be coupled to a user interface 188. For example, the controller 180 is configured to control pressure, temperature, and flow rates within the process chamber 100. As another example, the controller 180 is configured to operate the upper and lower lamps and the reflector actuator (as further described below). The controller 180 includes a programmable central processing unit (CPU) 182 coupled to various components of the process chamber 100. The CPU may operate in conjunction with a memory 184, support circuits 186, mass storage devices, an input control unit, and a display unit (not shown), such as a power supply, clocks, cache memory, input / output (I / O) circuits, and the like, to facilitate control of substrate processing. The controller 180 also includes hardware for monitoring substrate processing via sensors within the process chamber 100, including sensors for monitoring precursor, process gas, and purge gas flows. Other sensors that measure system parameters, such as substrate temperature, chamber atmospheric pressure, and the like, may also provide information to the controller 180.

[0054] Figure 2AA schematic isometric view of a reflector assembly 200 (e.g., reflector 140) positioned above a lamp 220 (e.g., one or more of the upper lamps 108) is illustrated. It should be noted that the reflector assembly 200 can also be positioned below a lamp 220 (e.g., one or more of the lower lamps 110). As shown, the reflector assembly 200 includes a reflector 210, which includes a plurality of reflector elements 212. Each reflector element 212 has a first surface 214a facing the lamp 220, a second surface 214b or top surface opposite the first surface 214a, and a sidewall 216 having a sidewall surface 216a. Each reflector element can include a highly polished or mirror-finished metal (e.g., aluminum, brass, or a metal, polymer, or ceramic having a highly reflective coating 218 on the first surface 214a). The reflective coating 218 (e.g., a gold or silver coating) can reflect radiation from the lamp 220. Other surfaces may include a reflective coating 218 (e.g., sidewall surfaces 216a that are exposed to radiation from lamp 220 when the plurality of elements 212 are actuated). The fully reflective surfaces consist of all surfaces of the reflector 210 having a reflective coating 218, including the first surface 214a of each of the plurality of elements 212 and the sidewall surfaces 216a.

[0055] Figure 2B 、 Figure 2C and Figure 2D yes Figure 2A A schematic front view of the reflector assembly 200 is shown. Figure 2B As shown, the plurality of elements 212 can be actuated to create a concave reflective surface by arranging the center point of each of the plurality of elements 212 along a concave centerline path 230a. When the center point of each of the plurality of elements 212 is aligned with the concave centerline path 230a, the first surface 214a of each element is exposed to the lamp 220. In addition, a portion of each inner sidewall 216b of each of the plurality of elements 212 (i.e., the sidewall 216 facing the lamp 220) is exposed to the lamp 220. These exposed inner sidewall 216b portions, together with each first surface 214a, create a reflector having a concave reflective surface.

[0056] like Figure 2C As shown, each of the plurality of elements 212 can be arranged into an asymmetric angle reflector by aligning the center point of each of the plurality of elements 212 along the asymmetric angle centerline path 230b. When the center of each of the plurality of elements 212 is aligned along the asymmetric angle centerline path 230b, different portions of each of the inner sidewalls 216b are exposed to the lamp 220. These portions of the inner sidewalls 216b, together with the first surface 214a of each of the plurality of elements 212, create an asymmetric angle reflector according to desired specifications.

[0057] like Figure 2DAs shown, each of the plurality of elements 212 can be arranged as a convex reflector by aligning the center point of each of the plurality of elements 212 along the convex centerline path 230c. When the center of each of the plurality of elements 212 is aligned along the convex centerline path 230c, different portions of the inner sidewall 216b of each of the plurality of elements 212 are exposed. These portions of the inner sidewall 216b, together with the first surface 214 of each of the plurality of elements 212, create a convex reflector.

[0058] Despite Figure 2B A specific centerline path is described in FIG. 3D , but any desired centerline path may be used depending on the desired specifications (eg, flat reflector, tilted reflector) and may be tailored for a specific recipe.

[0059] Aligning the reflector assembly along a desired centerline path allows the reflector to be tuned according to a recipe or in a closed-loop control system so that the power intensity or irradiance pattern of the heated substrate can be adjusted as needed. This allows for redefining the zones of the substrate, redistributing the irradiance per zone, or a combination thereof.

[0060] Figure 3A A schematic isometric view of the reflector assembly 300 is illustrated. Figure 3B illustrates a schematic front view of a reflector assembly 300, Figure 3C A schematic side view of a reflector assembly 300 is illustrated. Figure 2A Similar to the reflector assembly 200 in FIG. 1 , the reflector assembly 400 includes a reflector 310 having a plurality of reflector elements 312. Each reflector element 312 is stacked on top of the other elements, and each reflector element 312 has a first surface 314a, a second surface 314b opposite the first surface 314a, and a plurality of sidewalls 316. The first surface 314a is configured to face a lamp 320 (e.g., the upper lamp 108 or the lower lamp 110). The first surface 314a has a reflective coating 318 (e.g., a gold coating) for reflecting radiation from the lamp 320. The sidewalls 316 of each of the plurality of reflective elements 312 include an inner sidewall 316b facing the lamp 320. The inner sidewall 316b of each of the plurality of elements 312 also has a reflective coating 318.

[0061] like Figures 3A to 3C As shown, the reflector assembly 310 also includes an actuator assembly 340 configured to actuate each of the plurality of reflective elements 312 along a motion path 350 that is perpendicular or orthogonal to the radiating surface of the lamp 320. The actuator assembly 340 may include a plurality of actuators 342 (e.g., pneumatic actuators) and may be attached to each of the plurality of elements 312 via connectors 344. Figure 3BAs shown, an actuator (e.g., actuators 342a-442e) can be connected to a pair of elements (e.g., a pair of elements 312a-412e) in the plurality of elements 312 and configured to actuate the pair of elements 312a-312e in unison. When actuated, each pair of elements 312a-312e slides relative to the adjacent element (e.g., 312d slides against 312a). The actuator assembly 340 can then be moved along the axis as shown. Figures 2B to 2D The depicted centerline paths (eg, 230 a , 230 b , 230 c , or other desired centerline paths) arrange the plurality of elements 312 .

[0062] Reflector assembly 300 allows the reflector to reflect radiation from lamp 320 (e.g., upper lamp 108 or lower lamp 110) toward a target at a desired focus. The target may be a portion of a substrate (e.g., substrate 118) in a processing chamber (e.g., processing chamber 100). By actuating each of the elements of reflector assembly 310, the focus of the radiation from lamp 320 can be adjusted as needed (e.g., before or during processing). The disclosed adjustability of the target enables additional thermal tunability for multiple process recipes.

[0063] like Figure 3A and Figure 3C As shown, the reflector assembly 300 may also include cooling channels 360 through each of the elements. The cooling channels 360 include at least one aperture 362 extending through the sidewall 316 of each of the elements. Each of the apertures 362 may be aligned during actuation of the plurality of elements 312 to create a continuous channel through the reflector assembly 310. The at least one aperture 362 may have any desired cross-sectional shape (e.g., rectangular, circular, triangular, or a combination thereof). In one embodiment, the at least one aperture 362 may have an elliptical cross-sectional shape. The cooling channels 360 may be configured to allow a desired cooling fluid (e.g., water, refrigerant, or air) to flow through the reflector assembly 310. The cooling channels 360 allow the reflector assembly 310 to maintain a desired operating temperature during operation, even if the reflective coating 318 corrodes due to repeated use.

[0064] Figure 4 A schematic front view of a reflector assembly 400 is illustrated. The reflector assembly 400 includes a plurality of reflector elements 412. Each of the reflector elements 412 has a first surface 414 that faces a lamp 420 (e.g., an upper lamp 108 or a lower lamp 110) and one or more sidewalls that do not face the lamp 420. The first surface 414 may have a reflective coating 418 configured to reflect radiation from the lamp 420. The reflective coating 418 may include a gold or silver coating. Alternatively, the reflector elements 412 may include a mirror-polished metal (e.g., aluminum or an aluminum alloy) with an optically clear coating to prevent surface oxidation.

[0065] At least one of the plurality of elements 412 is a stationary element 430 coupled to the remaining plurality of elements 412 (e.g., a rotating element 432). The stationary element 430 may have a plurality of actuators 440 coupled between the stationary element 430 and the two rotating elements 432. The plurality of actuators 440 may be any suitable actuators 440 (e.g., a rotary motor such as a servo motor or a pneumatic motor). Similar to the reflective coating 418 on the first surface 414 of the plurality of elements 412, the outer surface 442 of each of the plurality of actuators 440 may be coated with a reflective coating 418. The first surfaces 414 of the plurality of elements 412 and the outer surfaces 442 of the plurality of actuators 440 form a reflector surface.

[0066] The reflector surface can be adjusted by actuating the rotating element 432 relative to the fixed element 430 using a plurality of actuators 440. The reflector surface can then reflect radiation from the lamp 420 toward a target (e.g., a portion of a substrate (e.g., substrate 118)) at a focal point. The focus of the reflector surface can be adjusted as needed (e.g., before or during processing) by actuating the rotating element 432. The disclosed adjustability of the target reduces the overall cost and complexity of processing multiple types of substrates or recipes in a given processing chamber.

[0067] Optionally, plurality of elements 412 may include at least one aperture extending through each of the plurality of elements to form a cooling channel (not shown) similar to cooling channel 360 .

[0068] Figure 5A A schematic front view of a reflector assembly according to one embodiment is illustrated. Figure 5B Illustrated according to one embodiment Figure 5A A top view of the reflector assembly is shown. Figure 5C Illustrated according to one embodiment Figure 5A A schematic front view of the reflector assembly is shown. Figures 5A to 5C As shown, the reflector assembly 500 can be configured with multiple actuators embedded within multiple elements 512. Figure 5A and Figure 5B As shown, the inner edges 532a of the rotating elements 532 can overlap and be axially coupled along a plurality of parallel axes 534 and along the opposite edge 530a of the fixed element 530. Each of the plurality of elements 512 has a reflective coating 518 on a first surface 514 facing a lamp 520 (e.g., upper lamp 108 or lower lamp 110). The plurality of elements 512 can be actuated to produce a substantially flat and stepped reflector surface. Figure 5CAs shown, the rotating element 532 can be actuated to rotate as needed (e.g., before or during processing) along a plurality of parallel axes 534. Actuating the rotating element 532 can then adjust the focus of the reflected radiation from the lamp 520 toward a target (e.g., a substrate 118 in the processing chamber 100).

[0069] 6A to 6D A reflector assembly 600 is illustrated. Figure 6A As shown, the reflector assembly 600 includes a reflector 610 (e.g., an angled reflector) having a reflective surface to reflect radiation from a lamp 620 (e.g., the upper lamp 108 or the lower lamp 110) toward a target (e.g., the substrate 118) at a focal length and focus. The reflector assembly 600 also includes an actuator 640 coupled to the vertex of the angled reflector 610, the actuator 640 being configured to cause rotational displacement of the angled reflector 610 along motion paths 630a, 630b. Alternatively, the reflector 610 can be a convex reflector or a flat reflector, and the actuator 640 can be coupled to a center point on the reflector. The actuator 640 can be a pneumatic actuator 640, a motor, or a combination thereof. Figure 6B and Figure 6C As shown, actuator 640 may rotate angled reflector 610 along motion path 630a, thereby changing the focus of radiation from lamp 620.

[0070] In addition, if Figure 6D As shown, the actuator 640 can cause a linear displacement of the reflector 610 relative to the lamp 620 (e.g., increase or decrease the linear distance between the reflector 610 and the lamp 620) by moving the reflector 610 along the linear motion path 630b. The lamp 620 can be fixed, or can include a separate actuator 640 and cooperate with the actuator 640 to linearly actuate the lamp 620 to linearly displace the reflector 610 relative to the lamp 620.

[0071] Figure 7A The diagram can be configured as a lamp head assembly 700 for use in either the upper lamp 108 position or the lower lamp 110 position in the processing chamber 100. The lamp head assembly 700 includes a lamp head body 710 and a plurality of lamps 720 disposed therein. The lamps can be arranged in a pattern around the outer surface of the lamp head body 710 and can be any desired lamp (e.g., polygonal lamps, linear lamps, or small horizontal or vertical lamps).

[0072] like Figure 7B As shown, the reflector assembly 730 can be used with Figures 6A to 6B7. The reflector assembly 730 is arranged in a similar manner to the reflector assembly 600 described above. The system of reflector assemblies 730 can face a subset of lamps 722 of the plurality of lamps 720, such that the entire plurality of lamps 720 faces the system of reflector assemblies 730. Each of the reflector assemblies 730 can include a rotating element 742 coupled to a fixed element 740 and driven by a plurality of actuators 750, and can be actuated independently of the other reflector assemblies 730 or simultaneously with the other reflector assemblies 730. The system of reflector assemblies 730 reflects radiation from each of the subset of lamps 722 toward a substrate (e.g., substrate 118) at a focal length and focus. The reflector system can be actuated to adjust the focal length and focus of each of the subset of lamps 722 as needed (e.g., before and during processing).

[0073] Figure 8A A schematic cross-sectional view of a processing chamber 800 is illustrated. The processing chamber 800 is similar to Figure 1 The processing chamber 100 is shown, and thus similar features are labeled with the same reference numerals for clarity.

[0074] As shown, a top reflector 840 may optionally be placed outside the upper window 120 to reflect light radiated away from the substrate 118 back onto the substrate 118. An edge reflector 854 may be placed outside the upper window 820 and above the outermost upper lamp 108. Although not shown, the edge reflector 854 may also be configured to surround the outermost lower lamp 110.

[0075] Figure 8B Illustrated Figure 8A The edge reflector 854 of the processing chamber 800 is shown. The edge reflector 854 can be connected to Figure 3A The reflector assembly in FIG. 854 is similarly configured. The edge reflector 854 may include a plurality of elements 862 having a first surface 864 including a reflective coating 868, thereby producing a reflector having a reflector profile 872 that faces the upper lamp 108. The plurality of elements 862 may be actuated by at least one actuator 870 such that the reflector profile 872 is adjusted as needed (e.g., before and during processing).

[0076] Figure 8C Examples include Figure 8A and Figure 8BSchematic cross-sectional view of a portion of a processing chamber 800 with an edge reflector 854. The reflector profile 872 of the edge reflector 854 reflects radiation from the upper lamps 108 toward a portion of the substrate 118 on the pedestal 114. The reflected radiation produces a thermal profile 880 having a thermal intensity over the portion of the substrate 818. More specifically, the thermal profile 880 is concentrated at the outer edges of the substrate 818. Although a top reflector 804 with a top lamp (e.g., a centrally located upper lamp 108) can provide a thermal profile 880 over a central region of the substrate 118, the edges of the substrate 118 are generally difficult to thermally treat in a satisfactory manner. An edge reflector 854 with upper lamps 108 along the periphery allows for controlled and focused thermal treatment of the edges of the substrate 118.

[0077] Figure 9A A schematic diagram of a processing chamber 900 is illustrated. The processing chamber 900 is similar to Figure 1 1. The process chamber 900 is shown in FIG. 1 , and thus, similar features are designated with the same reference numerals for clarity. The process chamber 900 also includes one or more lower lamps 110 disposed below a lower window 130 below a substrate 118. At least one lens assembly 960 may be positioned between one or more of the upper lamps 108 and the upper window 120. Additionally, at least one lens assembly 960 may be positioned between the substrate 118 and any of the lamps in the process chamber 900 (e.g., the lower lamps 110 or the upper lamps 108).

[0078] Figure 9B Illustrated according to one embodiment Figure 9A Schematic cross-sectional view of lens assembly 960. Figure 9B As shown, lens assembly 960a may include at least one convex lens 962a disposed between a lamp (e.g., lower lamp 108) and substrate 118. The lamp (e.g., upper lamp 110) radiates toward the at least one convex lens 962a at a focal length to create a focal point on substrate 118. Lens assembly 960a redirects radiation 964 from the lamp (e.g., upper lamp 108) and focuses the radiation 964 at the focal point to create a desired heat profile on substrate 118.

[0079] Figure 9C According to another embodiment, Figure 9A Schematic cross-sectional view of lens assembly 960. Figure 9CAs shown, lens assembly 960b may include at least one Fresnel lens 962b having multiple segments, wherein radiation 964 from a lamp (e.g., upper lamp 108) is directed toward a focal point through Fresnel lens 962b. Fresnel lens 962b can capture more oblique radiation 964 from the lamp (e.g., upper lamp 108) and provide a wider focal length range than a simple convex lens. Fresnel lens 962b requires less material to produce and provides a thinner lens profile. Alternatively, lens assembly 960B may also include a Luneburg lens instead of a Fresnel lens. A Luneburg lens includes a lens having a circular cross-sectional area with a refractive index that decreases radially from its center point to its outer surface.

[0080] Figure 9D According to another embodiment, Figure 9A Schematic cross-sectional view of lens assembly 960. Figure 9D As shown, lens assembly 960c may alternatively include an adjustment lens 962c, which includes a lens 966 coupled to an actuator 968. Actuator 968 may be a linear actuator (e.g., a pneumatic actuator), a rotary actuator 968, or a combination thereof. Adjustment lens 962c may be actuated to shorten or lengthen the distance between a lamp (e.g., upper lamp 108) and lens 966, thereby adjusting the focal point on substrate 118.

[0081] Figure 9E to Figure 1 0F illustrates a method according to yet another embodiment Figure 9A Schematic cross-sectional view of lens assembly 960. Figure 9E to Figure 1 As shown in FIG. 8 , lens assembly 960 d may include a fluid-filled lens 962 d. Fluid-filled lens 962 d includes a fluid-filled cavity 970 partially defined by a deformable polymer membrane 972. Adjusting the volume of the fluid within cavity 970 deforms membrane 972 and changes the curvature of lens 962 d. Cavity 970 may be mechanically or electrically deformed, for example, by actuators 974 on two opposing sides of cavity 970 or by applying an electrical current.

[0082] like Figure 9E As shown, when the actuator 974 compresses the polymer membrane 972, the fluid in the fluid-filled cavity 970 compresses axially with the compression applied by the actuator 974. Simultaneously, the fluid in the fluid-filled cavity 970 expands in a motion path 976 that is perpendicular to the compression axis of the actuator 974. Figure 9F , actuator 974 decompresses fluid-filled cavity 970 , thereby causing the fluid-filled cavity 970 to contract along motion path 976 .

[0083] FIG. 10A to FIG. 10B A simplified cross-sectional view of a processing chamber according to one embodiment is illustrated. Figure 10A and Figure 10B As shown, substrate heating system 1000 may include a system of pyrometers 1002 for monitoring a thermal profile 1010 of a region of interest on substrate 118 beneath (or above) a reflector assembly 140 (e.g., any of reflector assemblies 300, 400, 500, 600, 700, or 850) and an upper lamp 108 (or lower lamp 110). Reflector assembly 140 has a reflector profile 1042 and is configured to reflect radiation from lamp 108 at a focal length and focus. The system of pyrometers 1002 may be adjusted as needed to measure different regions of interest on substrate 118 by rotating or displacing pyrometer 1002 along path 1004. The system of pyrometers 1002 emits a beam 1006 to measure a thermal intensity 1012 of the thermal profile 1010 of the region of interest. Figure 10C and Figure 10D As described, after receiving input regarding desired thermal parameters through user input or through feedback instructions from a controller (e.g., controller 160), the reflector assembly 140 can be actuated to change the reflector profile 1042, thereby changing the focus of the radiation from the lamp 108. For example, the reflector profile 1042 can be widened to widen the thermal profile 1010 of the area of ​​interest on the substrate 118.

[0084] Figure 10C Illustrated for Figure 10C and Figure 10D A method 1050A for closed-loop operation of the reflector assembly 140 is further illustrated. The method 1050A begins at block 1052 by measuring a thermal profile 1010 of a region of interest of the substrate 118 using the system of pyrometers 1002. The system of pyrometers 1002 may include multiple pyrometers 1002 measuring different portions of the substrate 118. One or more of the pyrometers 1002 may be slaved to a master pyrometer that monitors a primary region of interest. The system of pyrometers 1002 monitors the thermal profile 1010 of the substrate 118.

[0085] The system of the pyrometer 1002 may be coupled to a controller (e.g., controller 160) and a reflector assembly 140 (e.g., reflector assembly 300, reflector assembly 400, reflector assembly 500, reflector assembly 600, reflector assembly 700, or reflector assembly 850) or a lens assembly (e.g., lens assemblies 1060a through 1060d). At block 1054, based on input from the system of the pyrometer 1002, the controller determines whether the thermal intensity 1012 of the thermal profile 1010 is outside of desired parameters (e.g., too low or too high). At block 1056, the reflector profile 1042 is adjusted. The controller, coupled to the system of the pyrometer 1002 and the reflector assembly 1040, may actuate the reflector assembly 1040 to adjust the reflector profile 1042. In a lens assembly (eg, lens assemblies 1060a to 1060d), a controller may actuate the lens (eg, linearly displacing a convex lens or Fresnel lens or changing the volume of a fluid-filled lens cavity) to adjust the focal length and focus of the lens to a predetermined focal length.

[0086] At block 1058, the system of pyrometers 1002 may then continue to monitor the thermal profile 1010 of the region of interest of the substrate 118. If the thermal intensity 1012 again falls outside of the desired parameters as determined at block 1060, the controller may return to block 1056 and readjust the reflector profile 1042 by actuating the reflector assembly 140 as needed.

[0087] Figure 10D Method 1050B for open-loop operation of the reflector assembly 140 is illustrated. Similar to method 1050A, method 1050B may begin at block 1062 by measuring different portions of the substrate 118 using the system of pyrometers 1002. The pyrometer 1002 may provide real-time measurements to a user interface (e.g., user interface 188) coupled to a controller (e.g., controller 180). The controller (e.g., controller 180) may receive input to actuate the reflector elements 140 to match a predetermined reflector profile 1042 stored in a memory (e.g., memory 184). The predetermined reflector profile 1042 may be based on a recipe or substrate type for the thermal process and may be one of several predetermined reflector profiles 1042, wherein the position of each of the multiple elements is actuated to a desired position to achieve a desired focal length and direction. Optionally, the system of pyrometers 1002 may provide measurements of the heat intensity 1012 of the region of interest of the substrate 118. The user interface can then receive input to adjust the reflector assembly 140 to a different predetermined reflector profile 1042. Alternatively, the user interface can receive input to adjust the reflector profile 1042 to parameters that are different from the predetermined reflector profile 1042.

[0088] Figure 11A A plurality of lamps 1110 (e.g., Figure 1 A top view of lamp head 1100A in which upper lamps 108 or lower lamps 110 are disposed. Multiple lamps 1110 are comprised of at least two lamps operating in two different frequency bands (e.g., at least one infrared (IR) lamp and at least one ultraviolet (UV) lamp). At least one IR lamp 1112 can operate in the IR wavelength band (i.e., between approximately 750 nm and approximately 1300 nm). At least one UV lamp 1114 can operate in the UV wavelength range (i.e., between approximately 100 nm and approximately 400 nm).

[0089] The at least one UV lamp 1114 can also have different shapes (e.g., circular UV lamps 1114 around the perimeter of lamp head 1100A). The at least one IR lamp 1112 can be an array of IR lamps 1112 arranged within the circular UV lamp 1114. Using lamps operating at different frequencies allows for pre-activation of gaseous precursors for epitaxial deposition, such as silicon-containing compositions, such as silane (SiH4). Pre-activation allows the silicon-containing composition to react and form a deposit using less thermal energy. Additionally, using UV lamps improves the efficiency of pre-cleaning during the bake step.

[0090] Figure 11B A plurality of lamps 1120 (eg, Figure 1 The plurality of IR lamps 1122 may be an IR lamp array 1154 interspersed between UV lamp arrays 1134. Figure 11B As shown, IR lamp array 1112 can be located between UV lamp array 1134. IR lamp array 1154 can include any desired number of elements (e.g., three) interspersed between any number of elements (e.g., one) of UV lamp array 1134. IR lamp array 1154 and UV lamp array 1134 can form a repeating pattern on radiating surface 1140 of lamp head 1100B.

[0091] When introducing elements or exemplary aspects or embodiments of the present disclosure, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements.

[0092] The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements.

[0093] The term "coupled" is used herein to refer to a direct or indirect coupling between two objects. For example, if object A physically touches object B and object B touches object C, objects A and C can still be considered coupled to each other, even if objects A and C do not directly physically touch each other. For example, a first object can be coupled to a second object even if the first object never directly physically touches the second object.

[0094] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the disclosure is determined by the claims that follow.

Claims

1. An adjustable reflector assembly, comprising: a plurality of reflector elements, each of the plurality of reflector elements having a first surface, a second surface, and a plurality of sidewalls, wherein the first surface is a reflective surface and is configured to face the lamp; as well as One or more actuation mechanisms coupled to the plurality of reflector elements.

2. The adjustable reflector assembly of claim 1, wherein the adjustable reflector assembly is an edge reflector assembly configured to reflect heat to an outer edge of a substrate.

3. The adjustable reflector assembly of claim 1, wherein a portion of an inner sidewall of each of the plurality of sidewalls of each of the plurality of reflector elements and the first surface comprise a reflective coating.

4. The adjustable reflector assembly of claim 1, wherein the one or more actuation mechanisms are configured to align a center point of each of the plurality of reflector elements along a centerline path.

5. The adjustable reflector assembly of claim 4, wherein the centerline path is convex, concave, or asymmetrically configured.

6. The adjustable reflector assembly of claim 1, wherein each of the plurality of reflector elements further comprises at least one aperture extending through each element to form a cooling channel through the adjustable reflector assembly.

7. The adjustable reflector assembly of claim 1, wherein the lamp is a polygonal, linear, or small horizontal or vertical lamp.

8. A substrate processing chamber, comprising: a chamber body comprising a cover, a base plate, and a processing volume disposed between the cover and the base plate; an upper window disposed between the cover and the processing volume; a lower window disposed between the bottom plate and the processing volume; a substrate support disposed in the processing volume; a lamp cap, the lamp cap being positioned below the lower window or above the upper window; at least one lamp, the at least one lamp being disposed in the lamp holder; as well as A reflector assembly is disposed on one side of the at least one lamp, the reflector assembly comprising a plurality of elements and one or more actuation mechanisms coupled to the plurality of elements, wherein a first surface of each of the plurality of elements is a reflective surface.

9. The substrate processing chamber of claim 8, wherein the reflector assembly is an edge reflector assembly configured to reflect heat toward an outer edge of the substrate.

10. The substrate processing chamber of claim 8, wherein each of the plurality of elements comprises an inner sidewall having a reflective coating, and wherein the first surface comprises a reflective coating.

11. The substrate processing chamber of claim 8, wherein the one or more actuation mechanisms are configured to align a center point of each of the plurality of elements along a centerline path.

12. The substrate processing chamber of claim 11, wherein the centerline path is convex, concave, or angled.

13. The substrate processing chamber of claim 8, wherein each of the plurality of elements further comprises at least one aperture extending through each element.

14. The substrate processing chamber of claim 13, wherein the at least one aperture of each of the plurality of elements forms a cooling channel through the reflector assembly.

15. The substrate processing chamber of claim 14, wherein the cooling channel is configured to allow a fluid to flow through the reflector assembly.

16. A method for heat treating a substrate, comprising: a system using a pyrometer to measure a thermal intensity of a thermal profile of an area of ​​the substrate below or above a lamp and a reflector assembly comprising a plurality of elements, wherein a first surface of the plurality of elements provides the reflector profile; determining whether the heat intensity is outside of desired parameters; as well as In response to the heat intensity being outside desired parameters, the reflector profile of the reflector assembly is adjusted along a centerline path using an actuation mechanism coupled to the reflector assembly.

17. The method of claim 16, further comprising: In response to adjusting the reflector profile, the heat intensity is measured and a determination is made as to whether the heat intensity is within desired parameters.

18. The method of claim 16, wherein adjusting the reflector profile comprises receiving input from a user interface.

19. The method of claim 16, wherein adjusting the reflector profile comprises receiving instructions from a controller of the system coupled to the actuation mechanism and pyrometer to adjust to a predetermined reflector profile.

20. The method of claim 16, further comprising: receiving input from a user interface; as well as In response to receiving the input, the reflector profile is adjusted based on the input.

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