Auxiliary positioning device for manual chip burning

Abstract

The invention provides a chip manual burning auxiliary positioning device which comprises a chip positioning tray, a device bottom plate, a needle seat module and a chip pressing plate, a plurality of chip positioning grooves are formed in the top face of the chip positioning tray, and a plurality of pin through holes for pins of chips to penetrate through are formed in the groove bottom wall of each chip positioning groove. The pin seat module comprises a pin seat positioning plate and probe modules, the number of the probe modules is equal to that of the chip positioning grooves, each probe module is provided with a plurality of spring probes, and the positions of the spring probes are in one-to-one correspondence with the positions of the pin through holes. The pin seat module, the chip positioning tray and the chip pressing plate have an assembly positioning state in which the pin seat module, the chip positioning tray and the chip pressing plate are sequentially stacked from bottom to top in the height direction, and in the assembly positioning state, the spring probes are inserted into the pin through holes and are electrically connected with burning pins of chips placed in the chip positioning grooves; the chip pressing plate can apply force to the top surface of each chip. According to the invention, the burning failure rate caused by dislocation of the chip and the burning seat is effectively reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of chip burning auxiliary equipment design, and in particular relates to a chip manual burning auxiliary positioning device. Background Art

[0002] In terms of chip burning, automatic lines are currently mostly used to batch burn chips. However, due to certain reasons, such as the chip pins being too long making the burning equipment unsuitable, or the corresponding information marked or etched on the chip surface hindering the reliable grasping of the automated equipment, such chips cannot be burned using existing automatic lines. Instead, manual burning or semi-automatic burning is required. The operator needs to place the chips one by one on the burning socket for subsequent operations. The operation efficiency is low and the chip and the burning socket are prone to misalignment, resulting in a high burning failure rate. Summary of the Invention

[0003] Therefore, the present invention provides a chip manual burning auxiliary positioning device, which can overcome the technical problems in the related art that the chip manual burning auxiliary positioning device can only position and burn one chip at a time, and the chip and the burning seat are prone to misalignment, resulting in a high burning failure rate.

[0004] In order to solve the above problems, the present invention provides a chip manual burning auxiliary positioning device, including a chip positioning tray, a device base plate, a needle seat module, and a chip pressing plate, wherein a plurality of chip positioning grooves are formed on the top surface of the chip positioning tray, and a plurality of pin through-holes for the pins of the chip to pass through are formed on the bottom wall of each chip positioning groove. The needle seat module includes a needle seat positioning plate and probe modules with the same number as the chip positioning grooves, each probe module has a plurality of spring probes, and the position of each spring probe corresponds one-to-one to the position of each pin through-hole. The needle seat module, the chip positioning tray and the chip pressing plate have an assembled positioning state stacked in sequence from bottom to top along the height direction. In the assembled positioning state, each spring probe is inserted into each pin through-hole and is electrically connected to each burning pin of the chip placed in each chip positioning groove, and the chip pressing plate can apply force to the top surface of each chip.

[0005] In some embodiments, two locking components are further provided on the top surface of the device base plate, and the two locking components are respectively located at the two ends of the length of the needle seat module. When in the assembly positioning state, each locking component is buckled and locked with the two ends of the length of the chip pressure plate so that the chip pressure plate maintains pressure on the top surface of each chip.

[0006] In some embodiments, each of the probe modules is detachably connected to the needle seat positioning plate, and each of the pin through holes on the bottom wall of the chip positioning groove has multiple rows to accommodate the passage of pins of chips of different sizes and models.

[0007] In some embodiments, an adjustable limit assembly is further provided on the top surface of the chip positioning tray, and the adjustable limit assembly includes a fixed plate having a plurality of first right-angle limit portions and a movable plate having a plurality of second right-angle limit portions. The movable plate can be translated along the length direction of the chip positioning tray to reduce the area of ​​each rectangular limit area formed by the first right-angle limit portion and the second right-angle limit portion. The chip positioning groove is a rectangular groove, and the fixed plate is fixedly connected to the top surface of the chip positioning tray and the first right-angle limit portion coincides with the right-angle area of ​​each chip positioning groove up and down.

[0008] In some embodiments, the fixed plate has a first side plate, and the movable plate has a second side plate. Both the first side plate and the second side plate extend parallel to the length direction of the chip positioning tray. The first side plate has a plurality of first support plates spaced apart and parallel to each other on a side close to the second side plate. The second side plate has a plurality of second support plates spaced apart and parallel to each other on a side close to the first side plate. The free end of the first support plate is a first inclined plane, and the free end of the second support plate is a second inclined plane. The first inclined plane matches the second inclined plane, and the first inclined plane and the second inclined plane can guide the second right-angle limit portion of the movable plate to approach the first right-angle limit portion corresponding to the rectangular limit area.

[0009] In some embodiments, the movable plate and the chip positioning tray can be positioned magnetically.

[0010] In some embodiments, two first positioning holes are further provided on the bottom plate of the device, a second positioning hole is respectively provided at both ends of the length of the needle seat positioning plate, and a first positioning column is provided at both ends of the length of the chip positioning tray facing the needle seat module. In the assembled positioning state, the first positioning column can be inserted into each of the second positioning holes and the first positioning hole one by one.

[0011] In some embodiments, the first positioning column is provided with a push spring; and / or, second positioning columns are provided on both width side areas of the chip pressure plate facing the chip positioning tray, and two third positioning holes are provided on the bottom plate of the device. In the assembled positioning state, the free ends of the two second positioning columns are respectively inserted into each of the third positioning holes.

[0012] In some embodiments, a side of the chip pressing plate facing the chip positioning tray has a plurality of elastic pressing members, and each of the elastic pressing members is located in an area corresponding to the chip positioning groove.

[0013] In some embodiments, each of the elastic holding members is detachably connected to the chip pressing plate.

[0014] The chip manual burning auxiliary positioning device provided by the present invention has the following beneficial effects: On the one hand, by forming multiple chip positioning grooves on the top surface of the chip positioning tray, at least two chips can be positioned and burned at the same time, which can significantly improve the chip burning efficiency; on the other hand, through at least part of the groove side walls of each chip positioning groove and each pin through-hole on the groove bottom wall, the spring probes on each probe module that can be inserted into the corresponding pin through-holes, and the chip pressure plate at the top that can apply force to the top surface of the chip, the pins of each chip and the spring probes of each probe module in each pin through-hole are reliably contacted, effectively preventing the occurrence of misalignment between the chip pins and the burning seat in the prior art, and effectively reducing the burning failure rate caused by misalignment between the chip and the burning seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. The drawings described below are merely exemplary. Those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.

[0016] Figure 1 2 is a schematic diagram of the three-dimensional structure of the chip manual burning auxiliary positioning device in an embodiment of the present invention (in a disassembled state, that is, an unassembled state); Figure 2 yes Figure 1 Front view of the chip manual burning auxiliary positioning device; Figure 3 yes Figure 2 Left view of the chip manual burning auxiliary positioning device; Figure 4 yes Figure 2 A top view of the chip manual burning auxiliary positioning device; Figure 5 is a schematic diagram of the three-dimensional structure of a chip positioning tray in another embodiment of the present invention; Figure 6 yes Figure 5 A front view of the chip positioning tray in FIG. 2 shows the state in which the movable plate accommodates a chip of smaller size; Figure 7 yes Figure 5 A front view of the chip positioning tray in FIG. 1 shows the state when the movable plate can accommodate the largest chip size.

[0017] The accompanying drawings are: 1. Chip positioning tray; 11. Chip positioning groove; 111. Pin through hole; 12. First positioning column; 13. Push spring; 2. Device base plate; 21. Locking assembly; 22. First positioning hole; 23. Third positioning hole; 3. Needle seat module; 31. Probe module; 311. Spring probe; 32. Needle seat positioning plate; 321. Second positioning hole; 4. Chip pressing plate; 41. Second positioning column; 42. Elastic pressing member; 43. Card slot; 51. Fixed plate; 511. First side plate; 512. First support plate; 513. First right-angle limiter; 52. Movable plate; 521. Second side plate; 522. Second support plate; 523. Second right-angle limiter; 524. Assembly hole. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0020] For ease of description, spatially relative terms such as "above," "above," "on the upper surface of," and "upper" may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "on top of" other devices or structures would then be positioned as "below" or "below" the other devices or structures. Thus, the exemplary term "above" can include both the "above" and "below" orientations. The device may also be positioned in other different ways (rotated 90° or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0021] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0022] See also Figures 1 to 7As shown, according to an embodiment of the present invention, a chip manual burning auxiliary positioning device is provided, comprising a chip positioning tray 1, a device base plate 2, a needle seat module 3, and a chip pressing plate 4, wherein a plurality of (at least two) chip positioning grooves 11 are formed on the top surface of the chip positioning tray 1, and a plurality of pin through holes 111 for the pins of the chip to pass through are formed on the bottom wall of the groove of each chip positioning groove 11. In a specific application process, the ends of the pins of the chip will be located in the pin through holes 111 corresponding to the positions. The needle seat module 3 includes a needle seat positioning plate 32 and probe modules 31 whose number is equal to that of the chip positioning grooves 11, and each probe module 31 has a plurality of springs. The spring probes 311 (the spring probes 311 are specifically any commercially available probes that are conductive and retractable under the action of a spring) correspond one-to-one to the positions of the pin holes 111. The needle holder module 3, the chip positioning tray 1, and the chip pressure plate 4 are in an assembled and positioned state stacked sequentially from bottom to top along the height direction. In the assembled and positioned state, each spring probe 311 is inserted into each pin hole 111 and electrically connected to each programming pin of the chip placed in each chip positioning groove 11. The chip pressure plate 4 can apply force to the top surface of each chip to ensure that the position of each chip is reliable and stable. It can be understood that each of the aforementioned probe modules 31 is specifically and simultaneously electrically connected to the data port of the programming device. Specifically, the bottom of each probe module 31 has a connection line, which is a USB to TTL CH340 adapter module, thereby realizing a communication connection with the programming device to realize program programming of each chip via the aforementioned programming device.

[0023] In this technical solution, on the one hand, by forming multiple chip positioning grooves 11 on the top surface of the chip positioning tray 1, at least two chips can be positioned and burned at the same time, which can significantly improve the chip burning efficiency; on the other hand, through at least part of the groove side walls of each chip positioning groove 11 and each pin through-hole 111 on its groove bottom wall, the spring probe 311 on each probe module 31 that can be inserted into the corresponding pin through-hole 111, and the chip pressure plate 4 at the top that can apply force to the top surface of the chip, the pins of each chip and the spring probe 311 of each probe module 31 in each pin through-hole 111 are reliably contacted, effectively preventing the occurrence of misalignment between the chip pins and the burning seat in the prior art, and effectively reducing the burning failure rate caused by misalignment between the chip and the burning seat.

[0024] In some embodiments, two locking components 21 are further provided on the top surface of the device base plate 2. The two locking components 21 are respectively located at the two ends of the length of the needle seat module 3. When in the assembly positioning state, each locking component 21 is buckled and locked with the two ends of the length of the chip pressure plate 4 so that the chip pressure plate 4 maintains pressure on the top surface of each chip. In principle, the aforementioned locking component 21 can realize the relevant structure of quick locking of the chip pressure plate 4 and the device base plate 2. In a specific embodiment, the locking component 21 adopts the prior art An elastic self-resetting snap-on assembly can be used. When no external force is applied to this type of snap-on, its locking plate extends a certain length under the action of the spring contained therein, so that the locking plate can form an insertion fit with the slots 43 at both ends of the length of the chip pressure plate 4, thereby achieving its locking purpose. When the operator applies force to the tail end of the locking plate to overcome the elastic force of the spring to make the locking plate retract, the locking plate disengages from the aforementioned slot 43, and the chip pressure plate 4 is now unlocked. The structure is simple, and since it is a mature structural component, the overall manufacturing cost of the device of the present invention can be reduced.

[0025] In this technical solution, the chip pressure plate 4 is locked by two locking components 21 on the device base plate 2, so that each chip can be stably in a state where the pins are in conductive contact with the spring probes 311 of the aforementioned probe modules 31. For chips with a long burning time (a large number of program bytes), maintaining a stable conductive contact state for a long time can significantly reduce the burning failure rate.

[0026] In some embodiments, each of the probe modules 31 is detachably connected to the needle seat positioning plate 32, and each of the pin through holes 111 on the bottom wall of the chip positioning groove 11 has multiple rows to accommodate the pins of chips of different sizes. Figure 7 As shown, on the bottom wall of each chip positioning groove 11, a total of four rows of pin through holes 111 are formed along the length direction of the chip positioning tray 1, one row of pin through holes 111 is arranged on the left side of the groove wall of each chip positioning groove 11, and the other three rows of pin through holes 111 are arranged in parallel on the right side of the groove wall of each chip positioning groove 11. In this way, the chip positioning groove 11 in the present invention can at least be suitable for burning chips with three different pin spacings.

[0027] In this technical solution, by forming multiple rows of pin through holes 111 on the bottom wall of each chip positioning groove 11, the same chip positioning groove 11 can be suitable for chips with a variety of different pin spacings (chips of different specifications and sizes). At the same time, each probe module 31 can be detachably assembled on the needle seat positioning plate 32, and the corresponding matching probe module 31 can be replaced according to the chips of different specifications and sizes. This can improve the versatility of the device of the present invention and make it suitable for burning operations of chips of more different specifications and models.

[0028] In some embodiments, an adjustable limit assembly (not marked in the figure) is further provided on the top surface of the chip positioning tray 1, and the adjustable limit assembly includes a fixed plate 51 having a plurality of first right-angle limit portions 513 and a movable plate 52 having a plurality of second right-angle limit portions 523. The movable plate 52 can be translated along the length direction of the chip positioning tray 1 to reduce the area of ​​each rectangular limit area (not shown in the figure) surrounded by the first right-angle limit portion 513 and the second right-angle limit portion 523. The chip positioning groove 11 is a rectangular groove, and the fixed plate 51 is fixedly connected to the top surface of the chip positioning tray 1 and the first right-angle limit portion 513 coincides with the right-angle area of ​​each chip positioning groove 11 up and down.

[0029] In this technical solution, by adjusting the relative position relationship between the fixed plate 51 and the movable plate 52, the size of the rectangular limiting area formed between the first right-angle limiting portion 513 and the second right-angle limiting portion 523 of the fixed plate 51 can be realized, so that the first right-angle limiting portion 513 and the second right-angle limiting portion 523 can respectively reliably limit the two diagonal positions of the smaller rectangular chip, further ensuring the stable and accurate position of each chip during the burning process. The relative position of the fixed plate 51 and the movable plate 52 is adjusted to achieve precise limiting of chips of different specifications and sizes, and the structure is particularly simple.

[0030] In a Figures 5 to 7In the specific embodiment shown, the fixed plate 51 has a first side plate 511, and the movable plate 52 has a second side plate 521. The first side plate 511 and the second side plate 521 both extend parallel to the length direction of the chip positioning tray 1. The first side plate 511 has a plurality of first support plates 512 spaced apart and parallel on the side close to the second side plate 521. The second side plate 521 has a plurality of second support plates 522 spaced apart and parallel on the side close to the first side plate 511. The free end of the first support plate 512 is a first inclined plane, and the free end of the second support plate 522 is a second inclined plane. The first inclined plane matches the second inclined plane, and the first inclined plane and the second inclined plane can guide the second right-angle limit portion 523 of the movable plate 52 to approach the first right-angle limit portion 513 corresponding to the rectangular limit area.

[0031] In this technical solution, the first inclined surface cooperates with the second inclined surface to provide guidance and reliable support for the adjustment of the left and right positions of the movable plate 52, ensuring that the movable plate 52 can be adjusted smoothly.

[0032] It is understandable that the aforementioned movable plate 52 should be locked in its adjusted position by a corresponding positioning structure after the position adjustment is completed. For example, this can be achieved by setting a positioning pin. However, this method requires setting a corresponding number of pin holes on the top surface of the chip positioning tray 1 according to the position adjustment requirements of the movable plate 52. Since the positioning chips in the same chip positioning groove 11 do not differ too much in terms of specifications and sizes, it is very difficult to set multiple pin holes simultaneously in the same small area. For example, the pin holes overlap and intersect in structure, which makes the physical structure of the pin holes relatively small and extremely easy to damage. Based on the above-mentioned practical deficiencies, in a preferred embodiment, the movable plate 52 and the chip positioning tray 1 can be magnetically positioned. Specifically, a corresponding assembly hole 524 is set on the movable plate 52, and a first permanent magnet is embedded in the assembly hole 524. At the same time, a second permanent magnet is embedded on the top surface of the chip positioning tray 1 corresponding to the movement track area of ​​the assembly hole 524 during the position adjustment of the movable plate 52. In this way, the magnetic attraction between the first permanent magnet and the second permanent magnet is used to achieve reliable fixation of the position of the movable plate 52 after adjustment, which is very flexible and convenient. As a more preferred embodiment, due to the introduction and application of the aforementioned first permanent magnet and the second permanent magnet, the magnetic field generated by them may cause magnetic interference to the chips in each chip positioning groove 11 on the chip positioning tray 1. At this time, it is best to set a circle of magnetic isolation cylinder (such as an aluminum cylinder, a copper cylinder) around the radial outer periphery of the aforementioned first permanent magnet and the second permanent magnet. It can be understood that the aforementioned chip positioning tray 1, fixed plate 51, movable plate 52, chip pressing plate 4, needle seat positioning plate 32, and device base plate 2 are preferably made of insulating materials, such as plastic parts.

[0033] In some embodiments, two first positioning holes 22 are further provided on the device base plate 2, a second positioning hole 321 is respectively provided at both ends of the length of the needle seat positioning plate 32, and a first positioning column 12 is provided at both ends of the length of the side of the chip positioning tray 1 facing the needle seat module 3. In the assembled positioning state, the first positioning column 12 can be inserted into each of the second positioning holes 321 and the first positioning hole 22 one by one.

[0034] In this technical solution, the first positioning column 12 can be inserted into the first positioning hole 22 and the second positioning hole 321, so that when the chip positioning tray 1 is placed on the needle seat module 3 and stacked up and down, it ensures that the position of the pin through hole 111 to be burned and the spring probe 311 corresponding to the position are accurately corresponding, and effectively prevents relative displacement between the chip positioning tray 1 and the needle seat module 3 during the burning process.

[0035] In some embodiments, a push spring 13 is mounted on the first positioning column 12. After the chip burning is completed, when the chip pressure plate 4 is released from the pressure on the top surface of each chip, the push spring 13 can push the chip positioning tray 1 placed thereon upward, so that the chip's burning pins and the spring probes 311 of each probe module 31 are efficiently separated, thereby improving the chip burning operation efficiency.

[0036] The chip pressing plate 4 is provided with second positioning columns 41 on both sides of the width of one side facing the chip positioning tray 1, and two third positioning holes 23 are provided on the device base plate 2. In the assembled positioning state, the free ends of the two second positioning columns 41 are respectively inserted into each of the third positioning holes 23.

[0037] In this technical solution, through the corresponding insertion of the third positioning hole 23 and the second positioning column 41, it can ensure that the chip pressure plate 4 accurately corresponds to the position of the chip in each chip positioning groove 11, thereby ensuring reliable pressure on the top surface of each chip, and further ensuring stable conductive contact between each pin of the chip and each spring probe 311.

[0038] In some embodiments, the side of the chip pressing plate 4 facing the chip positioning tray 1 may have multiple pressing planes (raised platforms) corresponding to the positions of the chip positioning grooves 11 respectively. This pressing structure requires the pressing plane to have a high degree of flatness and cleanliness, which will obviously put forward higher requirements for the processing and use of the components. As a preferred embodiment, the side of the chip pressing plate 4 facing the chip positioning tray 1 has multiple elastic pressing members 42 (specifically, springs), and each of the elastic pressing members 42 is located in the area corresponding to the chip positioning groove 11. By setting multiple elastic pressing members 42, multi-point flexible pressing is formed on the top surface of the chip, which can meet the requirements of stable pressing of the chip while greatly reducing the processing difficulty of the chip pressing plate 4.

[0039] In some embodiments, each of the elastic holding members 42 is detachably connected to the chip pressing plate 4, so that the arrangement position of each elastic holding member 42 on the chip pressing plate 4 can be flexibly adjusted according to the actual position of the programming pin and the specifications of the chip, ensuring that each elastic holding member 42 is as close as possible to the position of the programming pin, ensuring reliable contact between the programming pin and the aforementioned spring probe 311. It should be noted that, as mentioned above, when the aforementioned adjustable limit assembly is adopted, the adjustment of the position of the movable plate 52 reduces the limit area of ​​the chip. At this time, since the aforementioned elastic holding members 42 are detachably connected, the elastic holding members 42 that interfere with the position of the movable plate 52 can be removed or shifted to prevent structural interference.

[0040] It is easy for those skilled in the art to understand that, under the premise of no conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0041] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention. The above description is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and variations without departing from the technical principles of the present invention, and such improvements and variations shall also be considered within the scope of protection of the present invention.

Claims

1. A chip manual burning auxiliary positioning device, characterized in that: The invention comprises a chip positioning tray (1), a device bottom plate (2), a needle seat module (3), and a chip pressing plate (4), wherein a plurality of chip positioning grooves (11) are formed on the top surface of the chip positioning tray (1), a plurality of pin through holes (111) for the pins of the chip to pass through are formed on the bottom wall of the groove of each chip positioning groove (11), and the needle seat module (3) comprises a needle seat positioning plate (32) and probe modules (31) whose number is equal to that of the chip positioning grooves (11), and each probe module (31) has a plurality of spring probes (311). ), the position of each spring probe (311) corresponds to the position of each pin through hole (111) one by one, the needle seat module (3), the chip positioning tray (1) and the chip pressing plate (4) have an assembly positioning state in which they are stacked in sequence from bottom to top along the height direction, in which each spring probe (311) is inserted into each pin through hole (111) and is electrically connected to each burning pin of the chip placed in each chip positioning groove (11), and the chip pressing plate (4) can apply force to the top surface of each chip.

2. The chip manual burning auxiliary positioning device according to claim 1, characterized in that: Two locking components (21) are also provided on the top surface of the device base plate (2), and the two locking components (21) are respectively located at the two ends of the length of the needle seat module (3). When in the assembly positioning state, each locking component (21) is buckled and locked with the two ends of the length of the chip pressing plate (4) so ​​that the chip pressing plate (4) maintains pressure on the top surface of each chip.

3. The chip manual burning auxiliary positioning device according to claim 1, characterized in that: Each of the probe modules (31) is detachably connected to the needle seat positioning plate (32), and each of the pin through holes (111) on the bottom wall of the chip positioning groove (11) has multiple rows to accommodate the pins of chips of different sizes and models.

4. The chip manual burning auxiliary positioning device according to claim 3, characterized in that: An adjustable limit assembly is also provided on the top surface of the chip positioning tray (1), and the adjustable limit assembly includes a fixed plate (51) having a plurality of first right-angle limit portions (513) and a movable plate (52) having a plurality of second right-angle limit portions (523). The movable plate (52) can be translated along the length direction of the chip positioning tray (1) to reduce the area of ​​each rectangular limit region formed by the first right-angle limit portion (513) and the second right-angle limit portion (523). The chip positioning groove (11) is a rectangular groove. The fixed plate (51) is fixedly connected to the top surface of the chip positioning tray (1) and the first right-angle limit portion (513) and the right-angle region of each chip positioning groove (11) are aligned with each other up and down.

5. The chip manual burning auxiliary positioning device according to claim 4, characterized in that: The fixed plate (51) has a first side plate (511), and the movable plate (52) has a second side plate (521). The first side plate (511) and the second side plate (521) both extend in parallel along the length direction of the chip positioning tray (1). The first side plate (511) has a plurality of first support plates (512) spaced apart and parallel on one side close to the second side plate (521). The second side plate (521) has a plurality of second support plates (522) spaced apart and parallel on one side close to the first side plate (511). The free end of the first support plate (512) is a first inclined plane, and the free end of the second support plate (522) is a second inclined plane. The first inclined plane matches the second inclined plane, and the first inclined plane and the second inclined plane can guide the second right-angle limit portion (523) of the movable plate (52) to approach the first right-angle limit portion (513) corresponding to the rectangular limit area.

6. The chip manual burning auxiliary positioning device according to claim 5, characterized in that: The movable plate (52) and the chip positioning tray (1) can be positioned magnetically.

7. The chip manual burning auxiliary positioning device according to claim 1, characterized in that: Two first positioning holes (22) are further provided on the device base plate (2), a second positioning hole (321) is respectively provided at both ends of the length of the needle seat positioning plate (32), and first positioning columns (12) are provided at both ends of the length of the chip positioning tray (1) facing the needle seat module (3). In the assembled positioning state, the first positioning columns (12) can be inserted into each of the second positioning holes (321) and the first positioning holes (22) in a one-to-one correspondence.

8. The chip manual burning auxiliary positioning device according to claim 7, characterized in that: The first positioning column (12) is provided with a push spring (13); and / or, the chip pressure plate (4) is provided with second positioning columns (41) on both sides of the width of one side facing the chip positioning tray (1), and the device base plate (2) is provided with two third positioning holes (23). In the assembled positioning state, the free ends of the two second positioning columns (41) are respectively inserted into the third positioning holes (23) in a one-to-one correspondence.

9. The chip manual burning auxiliary positioning device according to claim 1, characterized in that: The chip pressing plate (4) has a plurality of elastic pressing members (42) on one side facing the chip positioning tray (1), and each of the elastic pressing members (42) is located in an area corresponding to the chip positioning groove (11).

10. The chip manual burning auxiliary positioning device according to claim 9, characterized in that: Each of the elastic pressing members (42) is detachably connected to the chip pressing plate (4).

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