High-temperature-resistant resin glue

Abstract

The invention relates to high-temperature-resistant resin glue and aims to solve the technical problems of poor high-temperature resistance and low thermal stability of traditional resin glue. The epoxy resin, the polyamide resin, the ethyl acetate, the methyl acrylate, the styrene and the polyvinyl acetate emulsion which serve as main components can ensure the viscosity of the high-temperature-resistant resin glue. Melamine can improve the flame-retardant and high-temperature-resistant performance of the high-temperature-resistant resin glue. And the flame-retardant filler ensures the flame-retardant and high-temperature-resistant properties of the high-temperature And the toluenesulfonic acid can improve the curing performance of the high-temperature-resistant resin glue. And the xylene can increase the adhesion performance of the high-temperature-resistant resin glue. The graphene oxide can further improve the flame-retardant and high-temperature-resistant properties of the high-temperature-resistant resin glue. And the fumed silica further improves the flame-retardant and high-temperature-resistant properties of the high-temperature-resistant resin glue. The high-temperature-resistant resin glue is good in high-temperature resistance and high in thermal stability.

Description

Technical Field

[0001] The invention relates to the field of resin glue, in particular to high-temperature resistant resin glue. Background Art

[0002] Resin glue refers to several types of resinous gums obtained from various shrubs and trees. Resin glue is made from resin and is environmentally friendly. Resin generally refers to an organic polymer that softens or melts when heated and tends to flow under external forces. At room temperature, it is solid, semi-solid, or sometimes liquid. Broadly speaking, any polymer compound that can be used as a raw material for plastic products is called a resin. Resin glue utilizes the inherent viscosity of the resin to enhance its viscosity through physical or chemical means, creating various types of glue to meet various industrial requirements.

[0003] However, traditional resin glue, such as the technical solution to be protected in the patent with application number CN202111043800.8 and invention name "A high-temperature resistant, high-elongation polyurethane acrylic resin and its application in the preparation of UV-curable peelable glue", has poor high-temperature resistance and low thermal stability. Summary of the Invention

[0004] Based on this, it is necessary to provide a high-temperature resistant resin glue to address the technical problems of poor high-temperature resistance and low thermal stability of traditional resin glue.

[0005] A high-temperature resistant resin glue comprises the following components in parts by mass: 30 to 50 parts of epoxy resin, 10 to 20 parts of polyamide resin, 6 to 15 parts of ethyl acetate, 8 to 15 parts of methyl acrylate, 4 to 10 parts of styrene, 6 to 12 parts of polyvinyl acetate emulsion, 2 to 5 parts of melamine, 6 to 12 parts of flame retardant filler, 2 to 5 parts of toluenesulfonic acid, 6 to 8 parts of xylene, 4 to 8 parts of graphene oxide, 0.5 to 1 part of fumed silica, 0.5 to 1.5 parts of a curing agent, 0.05 to 0.2 parts of an accelerator, 0.1 to 0.4 parts of an anti-ultraviolet agent, 0.5 to 1 parts of a coupling agent, 0.05 to 0.1 parts of a defoaming agent, and 2 to 4 parts of a toughening agent, with the balance being a diluent.

[0006] In one embodiment, the flame retardant filler includes the following components in parts by mass: 10 to 20 parts of magnesium oxide powder, 15 to 25 parts of nano-alumina powder, 12 to 24 parts of silicon micropowder, 8 to 26 parts of kaolin, 11 to 30 parts of mica powder, 6 to 12 parts of titanium dioxide and 14 to 20 parts of zinc borate powder.

[0007] In one embodiment, the curing agent includes the following components in parts by weight: 12 to 26 parts of m-xylylenediamine, 14 to 28 parts of maleic anhydride, 15 to 25 parts of phthalic anhydride, 13 to 24 parts of polyamide, and 8 to 16 parts of phthalic anhydride.

[0008] In one embodiment, the coupling agent includes the following components in parts by weight: 10 to 20 parts of methyltrimethoxysilane, 25 to 35 parts of dimethyldimethoxysilane, 5 to 15 parts of vinyltrimethoxysilane, 10 to 25 parts of ethyl orthosilicate, and 15 to 30 parts of vinyltriethoxysilane.

[0009] In one embodiment, the diluent includes the following components in parts by weight: 15 to 35 parts of trimethylolpropane triglycidyl ether, 25 to 45 parts of n-butyl glycidyl ether, 10 to 20 parts of phenyl glycidyl ether, and 20 to 30 parts of allyl glycidyl ether.

[0010] In one embodiment, the epoxy resin comprises 20 to 40 parts of a phosphorus-containing epoxy resin, 10 to 30 parts of a novolac epoxy resin, and 25 to 45 parts of a bisphenol A epoxy resin.

[0011] In one embodiment, the anti-ultraviolet agent is UV-531.

[0012] In one embodiment, the accelerator is a mixture of triethylamine and triethanolamine.

[0013] In one embodiment, the defoaming agent comprises the following components in parts by weight: 20 to 40 parts of dimethyl silicone oil, 25 to 45 parts of polyoxypropylene glycerol ether, and 15 to 25 parts of hydroxypolydimethylsiloxane.

[0014] In one embodiment, the toughening agent includes the following components in parts by weight: 30 to 60 parts of nitrile rubber, 15 to 30 parts of natural rubber latex, and 10 to 35 parts of latex powder.

[0015] The above-mentioned high-temperature resistant resin glue, which has epoxy resin, polyamide resin, ethyl acetate, methyl acrylate, styrene and polyvinyl acetate emulsion as main components, can ensure the viscosity of the high-temperature resistant resin glue. Melamine can increase the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. The flame retardant filler ensures the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. Toluenesulfonic acid can increase the curing performance of the high-temperature resistant resin glue. Xylene can increase the viscosity of the high-temperature resistant resin glue. Graphene oxide can further improve the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. Fumed silica further improves the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. The above-mentioned high-temperature resistant resin glue has good high-temperature resistance and high thermal stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 1 is a component diagram of the high temperature resistant resin glue in one embodiment. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" etc. is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0019] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0020] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0021] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0022] See also Figure 1 The present invention provides a high-temperature resistant resin glue, which includes the following components in parts by mass: 30 to 50 parts of epoxy resin, 10 to 20 parts of polyamide resin, 6 to 15 parts of ethyl acetate, 8 to 15 parts of methyl acrylate, 4 to 10 parts of styrene, 6 to 12 parts of polyvinyl acetate emulsion, 2 to 5 parts of melamine, 6 to 12 parts of flame retardant filler, 2 to 5 parts of toluenesulfonic acid, 6 to 8 parts of xylene, 4 to 8 parts of graphene oxide, 0.5 to 1 part of fumed silica, 0.5 to 1.5 parts of curing agent, 0.05 to 0.2 parts of accelerator, 0.1 to 0.4 parts of UV inhibitor, 0.5 to 1 part of coupling agent, 0.05 to 0.1 parts of defoaming agent and 2 to 4 parts of toughening agent, with the balance being diluent. In this embodiment, the anti-ultraviolet agent is UV-531, thereby increasing the anti-ultraviolet performance of the high-temperature resistant resin glue. In one embodiment, the accelerator is a mixture of triethylamine and triethanolamine to improve the curing performance of the curing agent. Furthermore, the epoxy resin is composed of 20 to 40 parts of a phosphorus-containing epoxy resin, 10 to 30 parts of a novolac epoxy resin, and 25 to 45 parts of a bisphenol A epoxy resin. The epoxy resin composed of the above components can increase the adhesive properties of the high-temperature resistant resin glue.

[0023] The above-mentioned high-temperature resistant resin glue, which has epoxy resin, polyamide resin, ethyl acetate, methyl acrylate, styrene and polyvinyl acetate emulsion as main components, can ensure the viscosity of the high-temperature resistant resin glue. Melamine can increase the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. The flame retardant filler ensures the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. Toluenesulfonic acid can increase the curing performance of the high-temperature resistant resin glue. Xylene can increase the viscosity of the high-temperature resistant resin glue. Graphene oxide can further improve the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. Fumed silica further improves the flame retardant and high-temperature resistance of the high-temperature resistant resin glue. The above-mentioned high-temperature resistant resin glue has good high-temperature resistance and high thermal stability.

[0024] To ensure the flame retardant and high temperature resistance of the high temperature resistant resin glue, in one embodiment, the flame retardant filler includes the following components in parts by weight: 10 to 20 parts of magnesium oxide powder, 15 to 25 parts of nano-alumina powder, 12 to 24 parts of silicon powder, 8 to 26 parts of kaolin, 11 to 30 parts of mica powder, 6 to 12 parts of titanium dioxide, and 14 to 20 parts of zinc borate powder. The flame retardant filler composed of the above components can ensure the flame retardant and high temperature resistance of the high temperature resistant resin glue.

[0025] To reduce the curing time of high-temperature resistant resin glue and thereby improve its adhesive properties, in one embodiment, the curing agent includes the following components in parts by weight: 12 to 26 parts m-xylylenediamine, 14 to 28 parts maleic anhydride, 15 to 25 parts phthalic anhydride, 13 to 24 parts polyamide, and 8 to 16 parts phthalic anhydride. This curing agent can reduce the curing time of the high-temperature resistant resin glue and thereby improve its adhesive properties.

[0026] In order to increase the bonding stability between the components in the high-temperature resistant resin glue, thereby increasing the stability of the high-temperature resistant resin glue. In one embodiment, the coupling agent includes the following components in parts by weight: 10 to 20 parts of methyltrimethoxysilane, 25 to 35 parts of dimethyldimethoxysilane, 5 to 15 parts of vinyltrimethoxysilane, 10 to 25 parts of ethyl orthosilicate, and 15 to 30 parts of vinyltriethoxysilane. The coupling agent composed of the above components can increase the bonding stability between the components in the high-temperature resistant resin glue, thereby increasing the stability of the high-temperature resistant resin glue.

[0027] In order to dilute the high-temperature resistant resin glue while ensuring its viscosity, in one embodiment, the diluent includes the following components in parts by weight: 15 to 35 parts of trimethylolpropane triglycidyl ether, 25 to 45 parts of n-butyl glycidyl ether, 10 to 20 parts of phenyl glycidyl ether, and 20 to 30 parts of allyl glycidyl ether. The diluent composed of the above components can dilute the high-temperature resistant resin glue while ensuring its viscosity.

[0028] To reduce bubbles in the heat-resistant resin glue, in one embodiment, the defoamer includes the following components by weight: 20 to 40 parts dimethyl silicone oil, 25 to 45 parts polyoxypropylene glycerol ether, and 15 to 25 parts hydroxy polydimethylsiloxane. This defoamer can reduce bubbles in the heat-resistant resin glue, thereby increasing its stability.

[0029] To increase the toughness and viscosity of the heat-resistant resin adhesive, in one embodiment, the toughening agent includes the following components in parts by weight: 30 to 60 parts nitrile rubber, 15 to 30 parts natural rubber latex, and 10 to 35 parts latex powder. This toughening agent can increase the toughness and viscosity of the heat-resistant resin adhesive.

[0030] 1000 portions of the above high temperature resistant resin glue were cured and cut into test blocks (100mm×10mm×4mm) for performance testing. The average test results are as follows: The above test results show that the above high temperature resistant resin glue has excellent high temperature resistance, strong anti-aging performance, high structural strength after curing, excellent adhesion and strong flame retardant performance.

[0031] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A high temperature resistant resin glue, characterized in that, The invention comprises the following components in parts by mass: 30 to 50 parts of epoxy resin, 10 to 20 parts of polyamide resin, 6 to 15 parts of ethyl acetate, 8 to 15 parts of methyl acrylate, 4 to 10 parts of styrene, 6 to 12 parts of polyvinyl acetate emulsion, 2 to 5 parts of melamine, 6 to 12 parts of flame retardant filler, 2 to 5 parts of toluenesulfonic acid, 6 to 8 parts of xylene, 4 to 8 parts of graphene oxide, 0.5 to 1 part of fumed silica, 0.5 to 1.5 parts of curing agent, 0.05 to 0.2 parts of accelerator, 0.1 to 0.4 parts of UV inhibitor, 0.5 to 1 part of coupling agent, 0.05 to 0.1 parts of defoaming agent and 2 to 4 parts of toughening agent, and the balance is diluent.

2. The high temperature resistant resin glue according to claim 1, characterized in that: The flame retardant filler includes the following components in parts by mass: 10 to 20 parts of magnesium oxide powder, 15 to 25 parts of nano-alumina powder, 12 to 24 parts of silicon micropowder, 8 to 26 parts of kaolin, 11 to 30 parts of mica powder, 6 to 12 parts of titanium dioxide and 14 to 20 parts of zinc borate powder.

3. The high temperature resistant resin glue according to claim 1, characterized in that The curing agent includes the following components in parts by mass: 12 to 26 parts of m-xylylenediamine, 14 to 28 parts of maleic anhydride, 15 to 25 parts of phthalic anhydride, 13 to 24 parts of polyamide, and 8 to 16 parts of phthalic anhydride.

4. The high temperature resistant resin glue according to claim 1, characterized in that The coupling agent includes the following components in parts by mass: 10 to 20 parts of methyltrimethoxysilane, 25 to 35 parts of dimethyldimethoxysilane, 5 to 15 parts of vinyltrimethoxysilane, 10 to 25 parts of ethyl orthosilicate, and 15 to 30 parts of vinyltriethoxysilane.

5. The high temperature resistant resin glue according to claim 1, characterized in that: The diluent includes the following components in parts by mass: 15 to 35 parts of trimethylolpropane triglycidyl ether, 25 to 45 parts of n-butyl glycidyl ether, 10 to 20 parts of phenyl glycidyl ether, and 20 to 30 parts of allyl glycidyl ether.

6. The high temperature resistant resin glue according to claim 1, characterized in that: The epoxy resin comprises 20 to 40 parts of phosphorus-containing epoxy resin, 10 to 30 parts of novolac epoxy resin and 25 to 45 parts of bisphenol A epoxy resin.

7. The high temperature resistant resin glue according to claim 1, characterized in that: The anti-ultraviolet agent is UV-531.

8. The high temperature resistant resin glue according to claim 1, characterized in that: The accelerator is a mixture of triethylamine and triethanolamine.

9. The high temperature resistant resin glue according to claim 1, characterized in that: The defoaming agent comprises the following components in parts by mass: 20 to 40 parts of dimethyl silicone oil, 25 to 45 parts of polyoxypropylene glycerol ether, and 15 to 25 parts of hydroxy polydimethylsiloxane.

10. The high temperature resistant resin glue according to claim 1, characterized in that: The toughening agent includes the following components in parts by mass: 30 to 60 parts of nitrile rubber, 15 to 30 parts of natural rubber latex, and 10 to 35 parts of latex powder.

Images