Target material bearing body structure of vacuum coating equipment

Abstract

The invention relates to the technical field of coating equipment, and discloses a target material bearing body structure of vacuum coating equipment, which comprises a shell, a cooling copper sleeve, a water channel baffle plate, a water channel column and a cooling flow channel. The water channel column is arranged between the water channel baffle and the contact plate of the cooling copper sleeve, the contact plate is supported in the negative pressure return stage of the cooling copper sleeve, and the situation that the cooling copper sleeve is concavely deformed after being repeatedly used is effectively avoided; furthermore, insufficient target material cooling effect and flatness reduction caused by concave deformation of the cooling copper sleeve and instability of arc discharge caused by poor contact are avoided, the target material sputtering stability when the circular plane cathode arc source of the coating equipment works is greatly improved, the quality stability in the coating process can be finally ensured, and the service life of the coating equipment is prolonged. The quality problems of target overheating evaporation, target missing, target cracking, unstable film forming process and film coating quality and the like in the prior art are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of coating equipment, and in particular to a target material support structure of vacuum coating equipment. Background Art

[0002] Vacuum deposition is a process that involves vaporizing or ionizing a material in a vacuum environment through physical or chemical methods, then depositing it onto a substrate to form a thin film. The resulting film, typically at nanometer to micrometer thickness, is used to modify the substrate's surface properties (e.g., optical properties, electrical conductivity, wear resistance, corrosion resistance, etc.).

[0003] In vacuum coating equipment (especially PVD technologies like magnetron sputtering and arc ion plating), the target assembly is a core component, securing the target and ensuring stable operation during the coating process. The structural design of the target assembly directly impacts coating uniformity, target utilization, and equipment life.

[0004] A typical target carrier mainly includes the following parts: target material, backing plate, cooling system, magnet system, sealing structure and mounting flange. Among them, the target material is used as a coating material (such as metal, alloy, ceramic, etc.), which is peeled off and deposited on the substrate under the action of sputtering or arcing. The backing plate is used to support the target material and usually uses high thermal conductivity materials (such as copper and molybdenum) to help dissipate heat. The cooling system uses water-cooling or air-cooling channels to prevent the target material from overheating. The magnet system is used to generate a magnetic field to confine the plasma in magnetron sputtering and improve the sputtering efficiency. The sealing structure is used to prevent cooling water leakage and maintain a vacuum environment. The mounting flange is used to fix the target carrier to the coating chamber to ensure a stable connection.

[0005] In order to meet the functional requirements of vacuum coating equipment, many vacuum coating equipment are designed with a circular plane cathode arc source, which is a vacuum coating technology that uses vacuum arc discharge for the cathode arc source. The circular plane cathode arc source directly generates plasma from the cathode target source, and the wear resistance of the coated substrate surface is better than the existing nitriding treatment, and it has good anti-sintering performance. Therefore, the vacuum coating technology using a circular plane cathode arc source is widely used due to its many advantages. However, in the actual production process, the applicant found that after a period of use, during the vacuum heating coating process, overheating of the target material, evaporation, off-target, target cracking, and instability of the film forming process and coating quality often occurred, which led to the vacuum coating equipment causing product defects and scrapping.

[0006] SUMMARY OF THE INVENTION

[0007] The technical problem solved by the present invention is how to avoid quality problems such as target overheating, target de-deposition, target cracking, and instability in the film forming process and coating quality during the vacuum heating coating process.

[0008] The purpose of the present invention can be achieved through the following technical solutions:

[0009] A target material support structure of a vacuum coating device, comprising:

[0010] a housing, the housing being fixedly arranged and having a movable chamber defined therein;

[0011] A cooling copper sleeve is slidably disposed in the movable chamber, one end of the cooling copper sleeve includes a contact plate for cooperating with the target material, and the other end of the cooling copper sleeve is enclosed with the shell to form a driving chamber, and a cooling chamber is defined in the cooling copper sleeve;

[0012] a water channel baffle, the water channel baffle being fixedly disposed in the cooling copper sleeve and dividing the cooling chamber into a first chamber and a second chamber, the water channel baffle being provided with a first through hole connecting the first chamber and the second chamber, the second chamber being located on a side close to the contact plate and communicating with the drive chamber;

[0013] a waterway column, the waterway column being disposed in the second chamber, and having two ends thereof fixedly connected to the waterway baffle and the contact plate, respectively;

[0014] an input channel, the input channel being in communication with the first chamber;

[0015] An output channel is communicated with the driving chamber.

[0016] In one embodiment of the present invention, the waterway column has a cylindrical structure.

[0017] In one embodiment of the present invention, a diversion hole is provided on the waterway column.

[0018] In one embodiment of the present invention, a cooling hole is provided in the water channel column, and the cooling hole is communicated with the guide hole.

[0019] In one embodiment of the present invention, a second through hole is formed on the water channel baffle, and the second through hole is connected to the cooling hole.

[0020] In one embodiment of the present invention, the input channel is connected to the middle of the first chamber, and the first through hole is arranged at an edge of the first chamber.

[0021] In one embodiment of the present invention, a third chamber is further provided in the cooling copper sleeve, the third chamber is connected to the second chamber through a third through hole, and the third through hole is located on the outside of the water channel baffle; the third chamber is connected to the drive chamber through a fourth through hole, and the output channel is connected to the third chamber.

[0022] In one embodiment of the present invention, the input channel is a rigid water inlet pipe, and the output channel is a rigid water outlet pipe.

[0023] In one embodiment of the present invention, the water inlet pipe and the water outlet pipe are coaxially arranged, and the water outlet pipe is located outside the water outlet pipe.

[0024] In one solution of the present invention, a fitting portion is protruding outwardly from the water outlet pipe, a fitting hole is provided on the shell, and the fitting portion is slidably fitted in the fitting hole.

[0025] A target material support structure of a vacuum coating device according to the present invention has at least one of the following technical effects:

[0026] The present invention provides a water channel column between the water channel baffle and the contact plate of the cooling copper sleeve, which supports the contact plate during the negative compression return stage of the cooling copper sleeve, effectively avoiding the concave deformation of the cooling copper sleeve after repeated use, and thus avoiding insufficient cooling effect on the target material due to the concave deformation of the cooling copper sleeve, as well as unstable arc discharge caused by decreased flatness and poor contact, greatly increasing the stability of target sputtering when the circular plane cathode arc source of the coating equipment is working, and ultimately ensuring the stability of the quality of the coating process, and solving quality problems in the prior art such as overheating of the target material, off-target, target cracking, and instability in the film forming process and coating quality.

[0027] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood in conjunction with the following description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can derive other drawings based on these drawings without inventive effort. Among them:

[0029] Figure 1 This is a schematic diagram of the structure of the concave deformation of the cooling copper sleeve;

[0030] Figure 2 It is a structural schematic diagram of the overall target material support structure of a vacuum coating device of the present invention; the arrows in the figure indicate the flow trend of the cooling medium.

[0031] The reference numerals in the figure are: 1. Shell; 2. Cooling copper sleeve; 3. Contact plate; 4. Drive chamber; 5. Water channel baffle; 6. First chamber; 7. Second chamber; 8. Water channel column; 9. Target material; 10. Third chamber; 11. Cooling channel. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] To meet the functional requirements of vacuum coating equipment, many designs utilize circular planar cathode arc sources. This is a vacuum coating technology that utilizes vacuum arc discharge as the cathode arc source. This technology generates plasma directly from the cathode target. The surface wear resistance of the coated substrate is superior to that of existing nitriding treatments, and it also exhibits excellent sintering resistance. Therefore, vacuum coating technology using circular planar cathode arc sources is widely used due to its many advantages.

[0034] The operating principle of the circular planar cathode arc source is as follows: It is a new generation arc ion plating source product, a coating technology that combines vacuum evaporation and vacuum sputtering. Ion plating utilizes gas discharge under vacuum conditions to partially ionize the working gas or evaporated substance (target material 9 or film material). Under the bombardment of the working gas ions or evaporated substance ions, the evaporated substance or its reactants from the circular planar cathode arc source are deposited on the surface of the substrate being plated. During this process, gas ions are accelerated and collide with the target material 9, transferring their momentum to the target material atoms, thereby providing sufficient energy for them to escape from the crystal lattice. This exothermic momentum transfer causes the target material 9 to heat up, potentially reaching extremely high temperatures at the atomic level. Therefore, to prevent the target material 9 from overheating, the circular planar cathode arc source must be cooled during operation. Cooling water is commonly used. In this case, a cooling copper sleeve 2 made of highly thermally conductive copper is used in the circular planar cathode arc source of vacuum coating equipment. As the primary contact element with the target material 9, it is required to be flat and in good contact with the target material 9, thereby providing good cooling effect on the target material 9.

[0035] However, the applicant found in the actual production process that during the vacuum heating coating process, the target material 9 often overheated, evaporated, de-targeted, cracked, and the film forming process and coating quality were unstable, which led to the vacuum coating equipment causing product defects and scrapping. After research, the applicant found that the existing target material 9 support structure often uses a cooling copper sleeve 2 to cool the target material 9. The forward and backward movement of the cooling copper sleeve 2 is achieved by filling and discharging cooling water in the cooling chamber inside the cooling copper sleeve 2 to form positive pressure / negative pressure. During the positive pressure process, the cooling copper sleeve 2 abuts the target material 9 to form a "fixed" state for the target material 9. At this time, the cooling copper sleeve 2 is not easy to deform. During the negative pressure process, the cooling copper sleeve 2 is subjected to pressure away from the target material 9, that is, the cooling water is discharged from the cooling chamber to form a negative pressure, which causes the cooling copper sleeve 2 to separate from the target material 9, forming a "released" state of the target material 9.

[0036] Due to the limitation of vacuum pressure rise rate of vacuum coating equipment, as the “fixing” and “releasing” actions increase, when positive pressure is generated in the water channel chamber (cooling chamber) between the water channel baffle 5 and the cooling copper sleeve 2, the chamber space tends to become larger, and when negative pressure is generated, the chamber space tends to become smaller. Due to the different pressures on the inside and outside of the cooling copper sleeve 2, concave deformation of the surface of the cooling copper sleeve 2 is inevitable during the negative pressure process (such as Figure 1 ), and this concave deformation will become more and more serious under the influence of high temperature. And because it is necessary to use a metal material with good thermal conductivity and to ensure the cooling effect, the strength of the contact part between the cooling copper sleeve 2 and the target material 9 is insufficient, which makes the concave deformation problem of the cooling copper sleeve 2 more prominent. That is, after repeated use, the cooling copper sleeve 2 located between the target material 9 and the circular plane cathode arc source waterway baffle 5 is prone to the problem of concave deformation of the cooling copper sleeve 2, which in turn causes the cooling copper sleeve 2 to be in loose contact with the target material 9, and the cooling effect is seriously affected. In this way, the surface temperature of the target material 9 is prone to being too high, which may cause evaporation and make the quality of the metal film unstable. The target material 9 is overheated and the heat cannot be effectively dissipated, which may cause the target material 9 to crack or deviate from the target. The poor contact between the cooling copper sleeve 2 and the target material 9 will cause the instability of the arc discharge, which will have a negative impact on the coating process and the film quality.

[0037] In order to solve the above problems, the present application provides a target material 9 support structure of a vacuum coating device, comprising a shell 1, a cooling copper sleeve 2, a water channel baffle 5, a water channel column 8, and a cooling channel 11. During the retraction process of the cooling copper sleeve 2, the pressure on both sides of the water channel baffle 5 is balanced and not easily deformed, while the pressure inside and outside the contact plate 3 is unbalanced, and the strength of the contact plate 3 itself is not high, which makes it easy to deform, that is, concave deformation. The water channel column 8 abuts against the water channel baffle 5 to provide support for the contact plate 3, effectively avoiding the concave deformation of the contact plate 3 during repeated use, that is, avoiding the concave deformation of the cooling copper sleeve 2 after repeated use, ensuring its fit with the target material 9, and then ensuring the cooling effect on the target material 9.

[0038] See also Figure 1-2 The present invention is a target material 9 support structure of a vacuum coating device, comprising a housing 1, a cooling copper sleeve 2, a water channel baffle 5, a water channel column 8, and a cooling channel 11. The housing 1 is fixedly arranged, and the location where the housing 1 is fixed is selected according to actual conditions. For example, it is fixedly arranged on the main structure of the vacuum coating device, and the fixing method can be welding, bolting, or other fixing methods. A movable chamber is provided in the housing 1 for accommodating the cooling copper sleeve 2 and the corresponding cooling structure to form a cooling system for cooling the target material 9.

[0039] See also Figure 2 In one embodiment of the present invention, the cooling copper sleeve 2 is slidably arranged in the movable chamber, and the cooling copper sleeve 2 can be a columnar structure, such as a cylindrical structure. A sealing ring structure is provided between the cooling copper sleeve 2 and the inner wall of the shell 1 to increase the sealing performance. A notch can be provided at the end of the shell 1 for the cooling copper sleeve 2 to extend so as to contact the target material 9. The end of the shell 1 can also be provided with an open structure so that the cooling copper sleeve 2 can be directly removed. At this time, a limiting portion can be provided at the end of the outer ring of the cooling copper sleeve 2 to limit the maximum depth of the cooling copper sleeve 2 entering the outer shell. The degree of freedom of the cooling copper sleeve 2 to escape outward is limited by the target material 9 or other structures during use, such as a positioning structure can be provided on the outside or a tooling block can be fixedly provided to limit it.

[0040] See also Figure 2 In one embodiment of the present invention, one end of the cooling copper sleeve 2 includes a contact plate 3 for engaging with the target 9. The outer wall of the contact plate 3 has a high flatness requirement and needs to be in good contact with the target 9, thereby providing a good cooling effect for the target 9. The other end of the cooling copper sleeve 2 and the shell 1 enclose a drive chamber 4. Specifically, the space enclosed between the other end of the cooling copper sleeve 2 and the inner wall of the shell 1 can be used as the drive chamber 4, or a gap can be opened at the other end of the cooling copper sleeve 2 to enclose the drive chamber 4 with the shell 1. The drive chamber 4 is filled with a cooling medium so that the drive chamber 4 is at a positive pressure. The cooling copper sleeve 2 can then be driven to extend and abut the target 9 by a pressure difference. When needed, the cooling medium is discharged / extracted, so that the drive chamber 4 is at a negative pressure state. Then, under the action of the pressure difference between the inside and outside of the cooling copper sleeve 2, the cooling copper sleeve 2 retracts, releasing the "fixation" of the target 9, and putting the target 9 in a "released" state, which is convenient for its removal. In the process of maintaining positive pressure in the driving chamber 4, it can also be achieved by adopting a method in which the amount of cooling medium entering is greater than the amount of cooling medium output. In this way, the cooling medium in the cooling copper sleeve 2 is in a circulating flow state, which can better ensure the cooling effect.

[0041] See also Figure 2 In one embodiment of the present invention, a cooling chamber is provided in the cooling copper sleeve 2; the cooling chamber is connected to the drive chamber 4 and the cooling channel 11 respectively, and is used to accommodate a cooling medium to ensure the cooling effect on the cooling copper sleeve 2. The cooling medium enters the cooling chamber through the cooling channel, and then enters the drive chamber 4. Specifically, the cooling medium is a fluid, which can be gas, water or other fluids. Preferably, the cooling medium is water. The cooling channel 11 includes an input channel and an output channel, which are used for the input and output of the cooling medium respectively. Control switches, such as valves, can be provided in the paths of the input channel and the output channel respectively for controlling the on and off. A pumping structure can also be provided to provide conveying power.

[0042] See also Figure 2 In one embodiment of the present invention, a waterway baffle 5 can be installed in the cooling chamber. The waterway baffle 5 is fixedly installed in the cooling copper sleeve 2 and divides the cooling chamber into a first chamber 6 and a second chamber 7. The input channel is connected to the first chamber 6. The waterway baffle 5 has a first through hole connecting the first chamber 6 and the second chamber 7. The second chamber 7 is located on the side near the contact plate 3. The waterway baffle 5 ensures that the cooling water enters the first chamber 6 first and then the second chamber 7, ensuring a stable flow rate and a long residence time in the cooling copper sleeve 2. The second chamber 7 can be connected to the drive chamber 4; the cooling water enters the drive chamber 4 through the second chamber 7. The output channel is connected to the drive chamber 4, and the cooling medium can be discharged directly through the drive chamber 4 or simultaneously connected to the cooling chamber for simultaneous discharge.

[0043] See also Figure 2 In one embodiment of the present invention, the input channel can be connected to the middle of the first chamber 6, that is, the connection point between the two is located in the middle of the first chamber 6, and the first through-hole is set at the edge of the first chamber 6. The first through-holes can be provided in multiple numbers and evenly distributed around the center. In this way, when water enters, it enters through the middle of the first chamber 6 and then enters the second chamber 7 through the first through-holes at the edge, ensuring the stability of the water flow and sufficient filling of the cooling water.

[0044] See also Figure 2In one embodiment of the present invention, to prevent the contact plate 3 of the cooling copper sleeve 2 from deforming concavely due to the internal and external pressure differential during the retraction of the cooling copper sleeve 2 driven by the negative pressure in the cooling chamber, a water channel column 8 is provided within the cooling copper sleeve 2. The water channel column 8 is disposed within the second chamber 7, and its ends are fixedly connected to the water channel baffle 5 and the contact plate 3. The water channel column 8 provides a fixed support for the contact plate 3, preventing it from deforming concavely due to the internal and external pressure differential, and ensuring that the device can maintain close contact with the target 9 after repeated use. The water channel column 8 can be configured as a columnar structure, and in particular, a cylindrical structure. The ends of the cylindrical water channel column 8 are fixedly connected to the water channel baffle 5 and the contact plate 3, or at least one end is fixedly connected and the other end is in contact with each other. The number of the water channel columns 8 can be set to multiple or multiple groups. As an example, the water channel columns 8 are provided in five groups, one of which is located at the center of the water channel baffle 5 or the contact plate 3, and the other four groups are arranged around the center group, thereby maximizing the support effect. And reduce the impact on water flow.

[0045] See also Figure 2 In one embodiment of the present invention, a guide hole may be provided on the waterway column 8. The guide hole is arranged along the radial (transverse) direction of the waterway column 8 and passes through the waterway column 8. By providing the guide hole, the waterway is ensured to be unobstructed and the consistency and stability of the water flow rate are ensured. Furthermore, a cooling hole is provided in the waterway column 8, and the cooling hole is connected to the guide hole. The cooling hole is provided along the axial direction of the waterway column 8, that is, the waterway column 8 can be provided as a cylindrical structure, so as to ensure the contact area between the cooling chamber and the contact plate 3 and the cooling effect on the target material 9. Furthermore, a second through hole may be provided on the waterway baffle 5, and the second through hole is connected to the cooling hole. In this way, while the cooling water enters the second chamber 7 through the first through hole, it can enter the cooling hole through the second through hole and be distributed in the second chamber 7, ensuring the flow direction of the water flow and thus ensuring the consistency of the cooling effect.

[0046] See also Figure 2 In one embodiment of the present invention, a third chamber 10 may be provided within the cooling copper sleeve 2. The third chamber 10 is connected to the second chamber 7 via a third through-hole, and the third through-hole is located outside the waterway baffle 5. The third chamber 10 is connected to the drive chamber 4 via a fourth through-hole, and the output channel is connected to the third chamber 10. The third chamber 10 is provided for water flow transition, increases water capacity, and ensures cooling effect. The fourth through-hole can be larger than the size of the connection hole between the third chamber 10 and the output channel, ensuring that water flows preferentially into and fills the drive chamber 4.

[0047] Both the input and output channels can be rigid pipe structures. As a preferred example, the water inlet and outlet pipes are coaxially arranged, with the outlet pipe located outside the water outlet pipe. The water inlet pipe connects to the first chamber 6, and the outlet pipe connects to the third chamber 10 and the drive chamber 4, respectively. In this way, the inlet and outlet pipes are integrated to ensure device stability. Furthermore, the pipe structure is rigidly fixed to the cooling copper sleeve 2. A sleeve can be provided at the end of the pipe structure away from the cooling channel to slide with the pipe and ensure operational stability of the cooling channel.

[0048] See also Figure 2 In one embodiment of the present invention, a mating portion protrudes from the water outlet pipe and slidably engages with a mating hole formed in the housing 1. Furthermore, a sealing ring structure may be provided on the mating portion to enhance sealing performance. This mating portion ensures the operational stability of the cooling copper sleeve 2 and the sealing of internal cooling system chambers, such as the drive chamber 4 and the cooling chamber.

[0049] Working principle of the present invention:

[0050] First, the target material 9 is fixed. The target material 9 can be fixed with a fixing clamp, or a limiting frame can be set. After the cooling copper sleeve 2 is extended, it abuts the target material 9. The limiting frame and the cooling copper sleeve 2 cooperate to fix the target material 9. Water is supplied to the cooling copper sleeve 2 through the water inlet pipe. At this time, the water outlet is closed, or the opening / flow rate is smaller than the water inlet. The water flows into the first chamber 6 through the input channel, disperses within the first chamber 6, and enters the second chamber 7 through the first through hole and the second through hole, respectively, to ensure the stable flow rate of the cooling water and sufficient filling, thereby ensuring the cooling effect. The cooling water in the second chamber 7 enters the third chamber 10 through the third through-hole, and after being buffered by the third chamber 10, enters the drive chamber 4 and the output channel, gradually filling the drive chamber 4. After continuous input, it is in a positive pressure state, thereby driving the cooling copper sleeve 2 to extend and abut the target 9, so that the target 9 is in a "fixed" state. At the same time, the cooling water cools the cooling copper sleeve 2, and the target 9 is cooled by the cooling copper sleeve 2 in close contact with the target 9. When necessary, the water supply can be stopped, and then the water outlet can be opened to drain the water, and the cooling medium in the drive chamber 4 and the cooling chamber can be discharged until the drive chamber 4 is in a negative pressure. Then, the cooling copper sleeve 2 is forced to retract under the action of the internal and external pressure difference. At this time, the target 9 is in a "released" state and can be disassembled, detached, and replaced. During the retraction of the cooling copper sleeve 2, the pressure on both sides of the water channel baffle 5 is balanced and it is not easy to deform, while the pressure inside and outside the contact plate 3 is unbalanced, and the strength of the contact plate 3 itself is not high, and it is easy to deform, that is, concave deformation. The water channel column 8 abuts against the water channel baffle 5 to provide support for the contact plate 3, effectively avoiding the concave deformation of the contact plate 3 during repeated use, that is, avoiding the concave deformation of the cooling copper sleeve 2 after repeated use, ensuring its fitting effect with the target material 9, and then ensuring the cooling effect on the target material 9.

[0051] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the claims of the present invention.

[0052] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0053] In the description of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0054] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

Claims

1. A target material support structure of a vacuum coating device, characterized in that: include: a housing, the housing being fixedly arranged and having a movable chamber defined therein; A cooling copper sleeve is slidably disposed in the movable chamber, one end of the cooling copper sleeve includes a contact plate for cooperating with the target material, and the other end of the cooling copper sleeve is enclosed with the shell to form a driving chamber, and a cooling chamber is defined in the cooling copper sleeve; a water channel baffle, the water channel baffle being fixedly disposed in the cooling copper sleeve and dividing the cooling chamber into a first chamber and a second chamber, the water channel baffle being provided with a first through hole connecting the first chamber and the second chamber, the second chamber being located on a side close to the contact plate and communicating with the drive chamber; a waterway column, the waterway column being disposed in the second chamber, and having two ends thereof fixedly connected to the waterway baffle and the contact plate, respectively; an input channel, the input channel being in communication with the first chamber; An output channel is communicated with the driving chamber.

2. The target material support structure of the vacuum coating equipment according to claim 1, characterized in that: The waterway column is in a cylindrical structure.

3. The target material support structure of the vacuum coating equipment according to claim 1, characterized in that: The waterway column is provided with a diversion hole.

4. The target material support structure of the vacuum coating equipment according to claim 3, characterized in that: A cooling hole is provided in the water channel column, and the cooling hole is communicated with the guide hole.

5. The target material support structure of the vacuum coating equipment according to claim 4, characterized in that: A second through hole is formed on the water channel baffle, and the second through hole is communicated with the cooling hole.

6. The target material support structure of the vacuum coating equipment according to claim 1, characterized in that: The input channel is communicated with the middle portion of the first chamber, and the first through hole is arranged at an edge position of the first chamber.

7. The target material support structure of the vacuum coating equipment according to claim 6, characterized in that: A third chamber is further provided in the cooling copper sleeve. The third chamber is connected to the second chamber via a third through hole, and the third through hole is located outside the water channel baffle. The third chamber is connected to the driving chamber via a fourth through hole.

8. The target material support structure of the vacuum coating equipment according to claim 1, characterized in that: The input channel is a rigid water inlet pipe, and the output channel is a rigid water outlet pipe.

9. The target material support structure of the vacuum coating equipment according to claim 8, characterized in that: The water inlet pipe and the water outlet pipe are coaxially arranged, and the water outlet pipe is located outside the water outlet pipe.

10. The target material support structure of the vacuum coating equipment according to claim 9, characterized in that: A matching portion is protruding outwardly from the water outlet pipe, a matching hole is provided on the shell, and the matching portion is slidably matched with the matching hole.

Images