Integrated color cover plate based on magnetron sputtering, manufacturing process and display module

Abstract

The invention provides an integrated color cover plate based on magnetron sputtering, a manufacturing process and a display module, and the integrated color cover plate comprises a glass substrate which is provided with a window area and a frame area; the integrated color film layer is arranged on the lower side face of the glass substrate and corresponds to the window area; the integrated color film layer is made of a colored metal oxynitride material, and the resistivity of the integrated color film layer is greater than or equal to 106 omega.cm; and the insulating layer is arranged on the lower side surface of the integrated color film layer. According to the integrated color film layer, the type of the colored metal oxynitride is determined according to the color of the frame area, and color integration of the window area and the frame area in the screen-off state is achieved; the resistivity of the integrated color film layer is larger than or equal to 106 omega.cm, it can be ensured that the integrated color film layer has high impedance insulativity, and interference to touch sensitivity is avoided; and the arrangement of the insulating layer can improve the environmental stability and the mechanical reliability.

Description

Technical Field

[0001] This invention relates to the technical field of display modules, and in particular to an integrated color cover plate based on magnetron sputtering, its manufacturing process, and a display module. Background Art

[0002] With the increasingly widespread application of capacitive touchscreens, consumers have higher requirements not only for their operation but also for their appearance. Touchscreens typically use a fully transparent design in the viewing area, while the area outside (the bezel) is designed with screen-printed ink. In actual use, the viewing area displays a grayish-black color, while the area outside displays different colors depending on the screen-printed ink, with black or white being the most common. Touchscreens using black screen-printed ink result in a difference in color between the viewing area and the bezel when the screen is off, leading to a poor aesthetic appearance.

[0003] To meet consumers' aesthetic requirements for product appearance, existing technologies generally place an anti-reflective coating in the viewing area of ​​the LCD module. The anti-reflective coating reduces the reflectivity of the viewing area, making the color of the viewing area darker or blacker when the screen is off, and making it as consistent as possible with the color of the black ink layer in the bezel area.

[0004] However, the traditional integrated black cover plate technology has the following drawbacks:

[0005] 1) Conflict between light transmittance and appearance: Traditional glass covers are difficult to achieve a uniform black effect when the screen is off, and the light transmittance is fixed, which cannot adapt to different display needs.

[0006] 2) Conductivity interferes with touch control: Some black film materials have high conductivity (such as ITO film) which can shield capacitive signals and reduce touch sensitivity.

[0007] 3) Insufficient stability: Conventional coating processes (such as sputtering and chemical deposition) are prone to problems such as film peeling and poor weather resistance. Summary of the Invention

[0008] To overcome the above-mentioned technical defects, the present invention provides an integrated color cover plate based on magnetron sputtering, its manufacturing process, and a display module, which can solve the problems in the background art.

[0009] This invention is implemented according to the following technical solution:

[0010] This invention provides a one-piece color cover plate based on magnetron sputtering, comprising:

[0011] A glass substrate having a viewing area and a border area;

[0012] An integral color film layer is disposed on the lower side of the glass substrate and corresponding to the viewing window area; the integral color film layer is made of a colored metallic nitride compound material, and the resistivity of the integral color film layer is ≥10. 6 Ω·cm;

[0013] An insulating layer is disposed on the lower side of the integral color film layer.

[0014] Compared with existing technologies, the integrated color film layer of this application determines the type of colored metallic oxynitride compound based on the color of the border area, thereby achieving color integration between the viewing area and the border area in the screen-off state; the resistivity of the integrated color film layer is ≥10. 6 The Ω·cm ensures that the integrated color film layer has high impedance insulation, avoiding interference with touch sensitivity; moreover, the insulation layer can improve environmental stability and mechanical reliability.

[0015] In one embodiment, the integral color film layer is made of one of molybdenum oxynitride, titanium oxynitride, chromium oxynitride, aluminum oxynitride, and vanadium oxynitride.

[0016] In one embodiment, the thickness of the integral color film layer is 30nm to 300nm.

[0017] In one embodiment, the insulating layer is made of either silicon dioxide or titanium dioxide.

[0018] In one embodiment, the thickness of the insulating layer is 2nm to 5nm.

[0019] The present invention also provides a display module comprising a monolithic color cover plate based on magnetron sputtering as described above.

[0020] This invention also provides a manufacturing process for a monolithic color cover plate based on magnetron sputtering, comprising:

[0021] S100: Clean the glass substrate and dry it with nitrogen gas;

[0022] S200: The metal target is bombarded by magnetron sputtering, and oxygen and nitrogen are introduced into the target site as sputtering gases; metal ions, oxygen ions and nitrogen ions are deposited on the lower side of the glass substrate under the action of an electric field to form an integral color film layer on the glass substrate.

[0023] S300: After forming an integral color film layer, a silicon target or a titanium target is bombarded by magnetron sputtering, and oxygen is introduced into the target site as a sputtering gas; silicon ions and oxygen ions, or titanium ions and oxygen ions, are deposited on the lower side of the integral color film layer under the action of an electric field to form an insulating layer on the integral color film layer.

[0024] In one embodiment, the operating parameters for step S200 are:

[0025] During magnetron sputtering, the sputtering power is set to 2.0KW~4.0KW, the sputtering temperature is 80℃~130℃, the sputtering time is 40s~80s, and the glass substrate temperature is ≤80℃.

[0026] In one embodiment, in step S200, the thickness of the integral color film layer is negatively correlated with the transmittance; for every 10% increase in the thickness of the integral color film layer, the transmittance of the integral color film layer decreases by 1% to 10%.

[0027] In one embodiment, in step S200, the resistivity of the integral color film layer is negatively correlated with oxygen vacancies, the oxygen content of the sputtering gas is 40% to 60%, the nitrogen content of the sputtering gas is 40% to 60%, and the sum of the oxygen content and nitrogen content in the sputtering gas is 1; the flow rate of the nitrogen gas is 20 sccm to 40 sccm, and the flow rate of the oxygen gas is 30 sccm to 50 sccm. Attached Figure Description

[0028] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, wherein:

[0029] Figure 1 This is a schematic diagram of the integral color cover plate based on magnetron sputtering of the present invention;

[0030] Figure 2 This is a schematic diagram of the manufacturing process of the integral color cover plate based on magnetron sputtering according to the present invention. Detailed Implementation

[0031] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0032] To better illustrate the present invention, the invention will now be described in further detail with reference to the accompanying drawings.

[0033] It should be understood that the described embodiments are merely some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of the embodiments of this application.

[0034] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0035] In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims. In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0037] Combination Figure 1 and Figure 2 As shown, the present invention provides a monolithic color cover plate (hereinafter referred to as monolithic color cover plate) based on magnetron sputtering, comprising: a glass substrate 10 having a viewing area and a frame area; a monolithic color film layer 20 disposed on the lower side of the glass substrate and corresponding to the viewing area; the monolithic color film layer is made of a colored metallic oxynitride material, and the resistivity of the monolithic color film layer is ≥10. 6 Ω·cm; Insulating layer 30, which is disposed on the lower side of the integral color film layer.

[0038] Compared with existing technologies, the integrated color film layer of this application determines the type of colored metallic oxynitride compound based on the color of the border area, thereby achieving color integration between the viewing area and the border area in the screen-off state; the resistivity of the integrated color film layer is ≥10. 6 The Ω·cm ensures that the integrated color film layer has high impedance insulation, avoiding interference with touch sensitivity; moreover, the insulation layer can improve the environmental stability and mechanical reliability of the integrated color film layer.

[0039] In this embodiment, the monolithic color film layer is made of a metal oxynitride material, which generates high impedance characteristics. Its working principle is that oxygen vacancies in the monolithic color film layer contribute charge carriers, and oxygen vacancies (V... o 3+ Oxygen vacancies can be considered as positively charged defects. By releasing free electrons, they increase the carrier concentration, thereby reducing the resistivity of the monolithic color film. They also increase the oxidation effect of the monolithic color film, reducing the oxygen vacancy content. This reduction in oxygen vacancies leads to carrier depletion, further increasing the resistivity of the monolithic color film. Therefore, according to the formula ρ = 1 / (nqμ), when the oxygen partial pressure is too high, the oxygen vacancy concentration decreases, the carrier concentration (n) decreases, and the resistivity (ρ) increases significantly, typically exhibiting characteristics of low conductivity and high resistivity.

[0040] It should be noted that the touchscreen industry requires the resistivity of the material covering the touch function area to meet a requirement of 5*10. 5 Ω·cm ~ 5*10 9 Only a resistance range of Ω·cm is considered to avoid affecting touch sensitivity. A low-resistance layer can shield the touch functionality, reducing touch sensitivity and impacting touchscreen performance and the application scenarios of the integrated color film. The integrated color film layer formed by the metal nitride compound in this application has high resistance, minimally affecting the touch function of the touchscreen, making it more suitable for the touchscreen field.

[0041] In one embodiment, the integral color film layer is made of one of molybdenum oxynitride, titanium oxynitride, chromium oxynitride, aluminum oxynitride, and vanadium oxynitride. The color of the border area may be light gray-black or white; specifically, when the border area is light gray-black, one of molybdenum oxynitride, titanium oxynitride, and chromium oxynitride can be selected as the material of the integral color film layer; while when the border area is white, one of aluminum oxynitride and vanadium oxynitride can be selected as the material of the integral color film layer.

[0042] In one embodiment, the thickness of the integrated color film layer is 30nm to 300nm. In this embodiment, the thickness of the integrated color film layer is adjusted within the above thickness range according to the light transmittance requirements of the integrated color cover, so that the transmittance of the integrated color cover can be continuously adjusted in the range of 5% to 80%.

[0043] In one embodiment, the insulating layer is made of either silicon dioxide or titanium dioxide. The insulating layer material possesses properties such as wear resistance, weather resistance, and high transmittance, which prevents the integral color film layer from peeling off. Further, the thickness of the insulating layer is 2 nm to 5 nm.

[0044] The present invention also provides a display module, which includes an integral color cover plate based on magnetron sputtering as described above, the integral color cover plate being able to be combined with a touch sensor and a liquid crystal cell.

[0045] This invention also provides a manufacturing process for a monolithic color cover plate based on magnetron sputtering, comprising:

[0046] S100: Clean the glass substrate and dry it with nitrogen. Specifically, at a cleaning temperature of 50°C, clean the glass substrate with deionized water and detergent for 15 minutes to ensure that oil and stains on the glass substrate are cleaned. Then, dry the cleaned glass with nitrogen. Through physical blowing and drying, surface particles, moisture and volatile impurities are removed. The inert properties of nitrogen isolate oxygen and moisture, preventing changes in the surface chemical state, and providing a clean, dry and inert ideal glass substrate surface for the S200 coating.

[0047] S200: The metal target is bombarded by magnetron sputtering, and oxygen and nitrogen are introduced into the target site as sputtering gases; metal ions, oxygen ions and nitrogen ions are deposited on the lower side of the glass substrate under the action of an electric field to form an integral color film layer on the glass substrate.

[0048] In this embodiment, the operating parameters for step S200 are as follows: during magnetron sputtering, the sputtering power is set to 2.0 kW to 4.0 kW, the sputtering temperature to 80°C to 130°C, the sputtering time to 40 s to 80 s, and the glass substrate temperature to ≤80°C. This embodiment uses a single-target sputtering method, and magnetron sputtering deposition can be performed at 80°C to 130°C. Compared to the sputtering temperature of 150°C to 250°C in the prior art, the magnetron sputtering in this embodiment is simpler, more energy-efficient, and easier to implement.

[0049] In this embodiment, in step S200, the thickness of the integrated color film layer is negatively correlated with its transmittance. For every 10% increase in the thickness of the integrated color film layer, its transmittance decreases by 1% to 10%. That is, in this embodiment, the thickness is adjusted within the range of 30nm to 300nm according to the transmittance requirements of the integrated color cover plate, so that the transmittance of the integrated color cover plate can be continuously adjusted within the range of 5% to 80%.

[0050] In one embodiment, in step S200, the resistivity of the integral color film layer is negatively correlated with oxygen vacancies, the oxygen content of the sputtering gas is 40% to 60%, the nitrogen content of the sputtering gas is 40% to 60%, and the sum of the oxygen content and nitrogen content in the sputtering gas is 1; the flow rate of the nitrogen gas is 20 sccm to 40 sccm, and the flow rate of the oxygen gas is 30 sccm to 50 sccm.

[0051] S300: After forming an integral color film layer, a silicon target or a titanium target is bombarded by magnetron sputtering, and oxygen is introduced into the target site as a sputtering gas; silicon ions and oxygen ions, or titanium ions and oxygen ions, are deposited on the lower side of the integral color film layer under the action of an electric field to form an insulating layer on the integral color film layer.

[0052] Specifically, based on the color of the border area, for example, when the border area is light black, the staff selects a chromium target for S200 magnetron sputtering with a chromium purity of 99.9%.

[0053] S100: Prepare a 5-inch glass substrate with a thickness of 0.7mm, primarily composed of silicate glass. Place the glass substrate in a cleaning machine and clean it with deionized water and detergent for 15 minutes at a temperature of 50°C. After cleaning, the glass substrate needs to be dried with nitrogen gas.

[0054] S200: The glass substrate is placed in a magnetron sputtering apparatus. The sputtering power is set to 3.2 kW, the sputtering temperature to 80°C, and the sputtering time to 60 seconds. A chromium target with a purity of 99.9% is used during sputtering. During sputtering, chromium ions, oxygen ions, and nitrogen ions are deposited on the glass substrate under the influence of an electric field (45% oxygen content in the sputtering gas), forming a monolithic color film layer made of chromium oxynitride. It should be noted that the thickness of the monolithic color film layer can be precisely controlled by adjusting the operating parameters of the magnetron sputtering apparatus, such as sputtering power and sputtering time. In this embodiment, the thickness of the monolithic color film layer is 80 nm, the transmittance is 45%–50%, and the resistivity is 10⁻⁶. 6 Ω·cm~10 7 Ω·cm.

[0055] S300: An insulating layer (made of silicon dioxide) is deposited on the integral color film layer by magnetron sputtering in a magnetron sputtering equipment, which further increases the weather resistance, wear resistance and other properties of the integral color film layer.

[0056] The test data for the cover plate samples are shown in the table below:

[0057] project Test Results standard transmittance adjustment range 12％-68％ Target 10%-70% Surface resistivity <![CDATA[8×10 7 Ohm cm]]> <![CDATA[≥10 7 Ohm cm]]> Touch sensitivity (capacitance change) 15% (vs. 18% for glass substrate) ≤20% attenuation Abrasion resistance (Taber test) Haze variation ≤2% (1000 times) industry standards

[0058] It can pass the IEC 60068 environmental test: it passes a 1000-hour high temperature and high humidity test (85℃ / 85%RH) with resistivity fluctuation ≤5%.

[0059] In practical applications, this technology allows for the modification of the coating material to achieve the desired uniform color effect for different colors, based on specific color requirements. For example, if the border area is white, the chromium target can be replaced with an aluminum target. Correspondingly, the sputtering power is set to 2.5 kW, and the sputtering time to 70 seconds. During sputtering, aluminum ions, oxygen ions, and nitrogen ions are deposited on the glass substrate under the influence of an electric field (the sputtering gas contains 40% oxygen and 60% nitrogen). In this embodiment, the uniform color film layer has a thickness of 70 nm, a transmittance of 55%–60%, and a resistivity of 10⁻⁶. 15 Ω·cm~10 16 Ω·cm.

[0060] Based on the disclosure and teachings of the foregoing specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on the present invention.

Claims

1. A one-piece color cover plate based on magnetron sputtering, characterized in that, include: A glass substrate having a viewing area and a border area; An integral color film layer is disposed on the lower side of the glass substrate and corresponding to the viewing window area; the integral color film layer is made of a colored metallic nitride compound material, and the resistivity of the integral color film layer is ≥10. 6 Ω·cm; An insulating layer is disposed on the lower side of the integral color film layer.

2. The integral color cover plate based on magnetron sputtering according to claim 1, characterized in that: The integral color film layer is made of one of the following: molybdenum oxynitride, titanium oxynitride, chromium oxynitride, aluminum oxynitride, and vanadium oxynitride.

3. The integral color cover plate based on magnetron sputtering according to claim 1, characterized in that: The thickness of the integrated color film layer is 30nm to 300nm.

4. The integral color cover plate based on magnetron sputtering according to claim 1, characterized in that: The insulating layer is made of either silicon dioxide or titanium dioxide.

5. The integral color cover plate based on magnetron sputtering according to claim 1, characterized in that: The thickness of the insulating layer is 2nm to 5nm.

6. A display module, characterized in that, Including the monolithic color cover plate based on magnetron sputtering as described in any one of claims 1-5.

7. A manufacturing process for a monolithic color cover plate based on magnetron sputtering, characterized in that, include: S100: Clean the glass substrate and dry it with nitrogen gas; S200: The metal target is bombarded by magnetron sputtering, and oxygen and nitrogen are introduced into the target site as sputtering gases; metal ions, oxygen ions and nitrogen ions are deposited on the lower side of the glass substrate under the action of an electric field to form an integral color film layer on the glass substrate. S300: After forming an integral color film layer, a silicon target or a titanium target is bombarded by magnetron sputtering, and oxygen is introduced into the target site as a sputtering gas; silicon ions and oxygen ions, or titanium ions and oxygen ions, are deposited on the lower side of the integral color film layer under the action of an electric field to form an insulating layer on the integral color film layer.

8. The manufacturing process of the integral color cover plate based on magnetron sputtering according to claim 7, characterized in that, The operating parameters for step S200 are as follows: During magnetron sputtering, the sputtering power is set to 2.0KW~4.0KW, the sputtering temperature is 80℃~130℃, the sputtering time is 40s~80s, and the glass substrate temperature is ≤80℃.

9. The manufacturing process of the integral color cover plate based on magnetron sputtering according to claim 7, characterized in that: In step S200, the thickness of the integral color film layer is negatively correlated with its transmittance; for every 10% increase in the thickness of the integral color film layer, the transmittance of the integral color film layer decreases by 1% to 10%.

10. The manufacturing process of the integral color cover plate based on magnetron sputtering according to claim 7, characterized in that: In step S200, the resistivity of the integral color film layer is negatively correlated with oxygen vacancies, the oxygen content of the sputtering gas is 40% to 60%, the nitrogen content of the sputtering gas is 40% to 60%, and the sum of the oxygen content and nitrogen content in the sputtering gas is 1. The flow rate of nitrogen is 20 sccm to 40 sccm, and the flow rate of oxygen is 30 sccm to 50 sccm.

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