Sand feeding device and method for prolonging service cycle of sand feeding plating solution

Abstract

The invention belongs to the technical field of electroplating diamond wire production equipment, and particularly relates to a sand feeding device and method for prolonging the service cycle of a sand feeding plating solution, the sand feeding device comprises a primary tank and a secondary tank, the secondary tank comprises an upper secondary tank and a lower secondary tank which are distributed up and down, a liquid supply pipe and a plurality of liquid return pipes are arranged between the primary tank and the secondary tank, and an additive storage box and a metering pump are arranged on the primary tank; the additive storage box is communicated with the mother tank through a first pipeline, and a metering pump is arranged on the first pipeline and used for quantitatively adding an additive in the additive storage box into the mother tank; an outlet pipeline is arranged at the lower end of the mother tank and connected with a liquid supply pipe and a second pipeline through a three-way valve, the second pipeline is connected with a positive pressure filter, and a liquid outlet of the positive pressure filter is connected with the mother tank through a third pipeline. The method can ensure that the content of the additive in the sanding plating solution is in a dynamic balance state, so that a produced diamond wire plating layer is small in stress fluctuation and normal in fracture, the replacement period of the plating solution is prolonged, and the plating solution treatment times and the wastewater treatment capacity are reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating gold steel wire production equipment, and particularly relates to a sanding device and method for extending the service life of a sanding plating solution. Background Art

[0002] Electroplated diamond wire is a cutting tool made of electroplated metal as a binder. Through the electrocrystallization effect of the electroplated metal, the high hardness and high wear resistance diamond abrasive is firmly fixed on the steel wire matrix, so that the steel wire has diamond micro-teeth. It is used for precision cutting of various artificial crystals, ceramics, quartz glass, single crystal silicon, polycrystalline silicon, sapphire and special metals.

[0003] The existing sanding equipment for diamond wire production includes a mother trough and a sub-trough, and a titanium basket is set in the sub-trough to connect to the positive pole of the power supply, and cathode rollers are set at both ends of the sub-trough to connect to the negative pole of the power supply. The key to the electroplating of diamond grains on the busbar is to ensure that the diamond grains are in contact with the busbar. At present, diamond grains are mostly mixed with additives and added to the mother trough, and circulated between the mother trough and the sub-trough to ensure effective contact between the diamond grains and the busbar. Considering the use effect and time, the content of the added additives is relatively high compared to the theoretical content. In addition, due to the mixing of the additives with the diamond grains, the continuous consumption of the additives in the actual production process leads to increased stress in the coating and reduced breakage of the diamond wire. Moreover, after the plating solution has been circulated for electroplating for a period of time, part of the corundum becomes inactivated due to the corrosion of the corundum, which affects the content of corundum added subsequently, thereby reducing the efficiency of sanding, affecting the electroplating effect, and causing problems such as uneven distribution of sand and frequent agglomeration. Therefore, the current use cycle of the plating solution after adding corundum does not exceed one month, and the plating solution needs to be replaced as a whole for regeneration treatment. The number of plating solution treatments increases, energy consumption and anode material loss are large, the amount of wastewater to be treated is large, and the daily management and maintenance costs of the production line are high. Summary of the Invention

[0004] The present invention aims to solve the problems that the existing sand-feeding device uses a method in which corundum and additives are mixed and added to a mother tank to participate in the circulation of the plating solution, which leads to increased stress and reduced breakage of the coating, and the corundum is inactivated due to corrosion in the plating solution. The inactivated corundum leads to a large amount of corundum used, and as the plating solution is used for a longer time, uneven distribution of the sand and frequent agglomeration phenomena occur. The present invention provides a sand-feeding device and method for extending the service life of the plating solution, effectively ensuring that the content of additives in the plating solution is in dynamic balance, extending the replacement cycle of the plating solution, and reducing the number of plating solution treatments and the amount of wastewater treated.

[0005] In order to achieve the above object, the technical solution of the present invention is: A sand loading device for extending the service life of a sand loading plating solution comprises a mother tank and a sub-tank, wherein the sub-tank comprises an upper sub-tank and a lower sub-tank distributed up and down, a liquid supply pipe and a plurality of liquid return pipes are arranged between the mother tank and the sub-tank, an additive storage box and a metering pump are arranged on the mother tank, the additive storage box and the mother tank are connected by a first pipe, a metering pump is arranged on the first pipe, the metering pump is used to quantitatively add the additive in the additive storage box to the mother tank, the metering pump is used to quantitatively deliver the additive to the mother tank alone, and the added amount is adjusted according to the additive content in the plating solution, thereby effectively ensuring the dynamic balance of the additive content.

[0006] An outlet pipe is provided at the lower end of the mother tank, and the outlet pipe is respectively connected to the liquid supply pipe and the second pipe through a three-way valve. The second pipe is connected to the positive pressure filter. The liquid outlet of the positive pressure filter is connected to the mother tank through the third pipe. The inactivated corundum in the plating solution is regularly separated through the positive pressure filter, thereby effectively extending the service life of the plating solution.

[0007] Preferably, a plurality of rectifiers are provided outside the sub-trough, cathode rollers are provided at both ends of the sub-trough, a plurality of titanium baskets are provided in the upper sub-trough and the lower sub-trough, the positive pole of each rectifier is connected to the two corresponding titanium baskets in the upper and lower sub-troughs, and the negative poles of the plurality of rectifiers are connected to the two cathode rollers. By setting up a plurality of rectifiers and connecting them to the corresponding plurality of titanium baskets respectively, the electric field distribution in the sub-trough is uniform, and the current is stable, thereby effectively improving the sanding effect.

[0008] Preferably, a sand adding machine is provided on one side of the master tank for adding corundum into the master tank to ensure the corundum content during the electroplating process.

[0009] Preferably, a filter tank is provided on one of the liquid return pipes, and the filter tank is used to filter the decomposition products of the additives in the plating solution. The filter tank works at all times to extend the service life of the plating solution, improve the tolerance of the plating solution, and avoid abnormal breakage of the diamond wire.

[0010] Preferably, a busbar is wound around the cathode roller, and the busbar passes through the sub-slot. There are multiple busbars, and each busbar is wound around two cathode rollers 6-11 times to ensure that the busbar passes through the plating solution and sand is applied.

[0011] Preferably, the multiple titanium baskets in the upper sub-trough or the lower sub-trough are evenly distributed along the length direction of the sub-trough, ensuring uniform distribution of current in the plating solution, ensuring uniform sand loading, and reducing the probability of agglomeration.

[0012] Preferably, a delivery pump is provided on the outlet pipe to ensure that the plating solution circulates between the main tank and the sub-tank.

[0013] Preferably, there are four rectifiers, and four titanium baskets distributed at equal intervals are provided in each sub-slot, and the distance between two adjacent titanium baskets in the same sub-slot is 40-80 mm.

[0014] A method for extending the service life of a plating solution is achieved by using the above-mentioned sanding device for extending the service life of a plating solution, comprising the following steps: a busbar passing through a sub-slot has a diameter of 0.036 mm, a line speed of 25-45 m / min, and a rectifier output current of 15-35 A, 470 L of plating solution is introduced into the mother slot, corundum is added to the plating solution to a content of 1-2 g / L, the additive content in the plating solution in the mother slot is 0.015-0.035 ml / L, and then a quantitative pump is used to quantitatively add the additive every 9-12 minutes. Add additives, the amount of additive added each time is 15-30 ml, and at the same time, add 3-20 g of corundum into the mother tank every 18-22 minutes until the corundum content in the mother tank reaches 15-18 g / L, stop the busbar transportation, disconnect the regulating three-way valve to connect the outlet pipe with the liquid supply pipe, stop the mother tank from supplying liquid to the sub-tank, then adjust the three-way valve to connect the outlet pipe with the second pipe, pump the plating solution in the mother tank into the positive pressure filter, filter the inactivated corundum, and transport the filtered plating solution to the mother tank through the third pipe, and then continue the busbar transportation.

[0015] Through the above technical solution, the beneficial effects of the present invention are: 1. The present invention provides an additive storage tank and a metering pump, and controls the additive content in the sand plating solution by quantitatively adding additives to the mother tank, so that the consumption and addition amount of the additives are in dynamic balance, so that the stress fluctuation of the diamond wire coating is small and the breakage is normal.

[0016] 2. The present invention sets up multiple rectifiers, and then the two corresponding titanium baskets in the upper and lower sub-slots are connected to a corresponding rectifier, so that the power supply electric field lines in the sub-slots are evenly distributed, effectively reducing the amount of corundum used. After the corundum is electroplated on the busbar, it is evenly distributed with less agglomeration.

[0017] 3. The present invention connects a positive pressure filter through a three-way valve. When the corundum content in the plating solution reaches 15-18 g / L, the inactivated corundum is filtered out, and the three-way valve is adjusted to allow the plating solution to flow into the positive pressure filter to filter out the inactivated corundum. New corundum is added to the plating solution, and then the diamond wire sanding work can be continued, so that the sanding plating solution can be directly used without regeneration treatment, the plating solution replacement cycle is extended, the number of plating solution treatments and the amount of wastewater treatment are reduced, and the daily maintenance and management costs are reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention.

[0019] Figure 2 It is a structural schematic diagram of the upper sub-trough and the lower sub-trough of the present invention.

[0020] Figure 3 Schematic diagram of the distribution of diamond abrasive electroplating on the busbar of diamond wire produced by existing sanding device Figure 1 .

[0021] Figure 4 Schematic diagram of the distribution of diamond abrasive electroplating on the busbar of diamond wire produced by existing sanding device Figure 2 .

[0022] Figure 5 Schematic diagram of the distribution of diamond grit electroplated on the busbar of diamond wire produced by the sanding device of the present invention Figure 1 .

[0023] Figure 6 Schematic diagram of the distribution of diamond grit electroplated on the busbar of diamond wire produced by the sanding device of the present invention Figure 2 .

[0024] The numbers in the accompanying drawings are: 1 is the main tank, 2 is the upper sub-tank, 3 is the lower sub-tank, 4 is the liquid supply pipe, 5 is the liquid return pipe, 6 is the storage box, 7 is the metering pump, 8 is the third pipeline, 9 is the first pipeline, 10 is the outlet pipeline, 11 is the three-way valve, 12 is the second pipeline, 13 is the rectifier, 14 is the titanium basket, 15 is the sand adding machine, 16 is the filter tank, 17 is the delivery pump, and 18 is the positive pressure filter. DETAILED DESCRIPTION

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments: like Figure 1-2 As shown, this embodiment provides a sanding device for extending the service life of the sanding plating solution, comprising a mother tank 1 and a sub-tank, wherein the sub-tank comprises an upper sub-tank 2 and a lower sub-tank 3 distributed up and down, and a liquid supply pipe 4 and a plurality of liquid return pipes 5 are provided between the mother tank 1 and the sub-tank. Figure 2 As shown, cathode rollers are provided at both ends of the sub-slot, busbars are wound on the cathode rollers, and the busbars pass through the sub-slots. The busbars are wound on two cathode rollers. There are multiple busbars, that is, multiple busbars can be wound at a time. Each busbar is wound on two cathode rollers multiple times, and then passes through the upper and lower sub-slots multiple times. Specifically, each busbar is wound 6-11 times on the two cathode rollers, and then the busbars pass through the upper sub-slot 2 and the lower sub-slot 3 respectively along the tangent direction of the upper and lower sides of the cathode rollers, and the busbars located in the sub-slots are immersed in the plating solution to ensure full contact between the busbars and the plating solution.

[0026] A plurality of rectifiers 13 are provided outside the sub-slot. Specifically, the rectifier 13 is set to 4. A plurality of titanium baskets 14 are provided in the upper sub-slot 2 and the lower sub-slot 3. Nickel cakes are provided in the titanium baskets 14 as the anode of the diamond wire sand plating system, and the cathode roller is used as the cathode. The plurality of titanium baskets 14 in the upper sub-slot 2 or the lower sub-slot 3 are evenly distributed along the length direction of the sub-slot. Four titanium baskets 14 are evenly distributed in each sub-slot. The spacing between two adjacent titanium baskets 14 in the same sub-slot is 40-80 mm. Each rectifier 1 The positive electrodes of the rectifiers 3 are connected to the two titanium baskets 14 corresponding to the upper and lower sub-slots 2 and 3, that is, four titanium baskets 14 are equidistantly distributed in each sub-slot, and the negative electrodes of the multiple rectifiers 13 are connected to the two cathode rollers. By providing multiple rectifiers 13, and each rectifier 13 is electrically connected to the two titanium baskets 14 corresponding to the upper and lower sub-slots, the current output in the sub-slots is stabilized through the rectifiers 13, the electric field lines are evenly distributed, the corundum is evenly distributed after being electroplated on the busbar, there is less agglomeration, the utilization rate of the corundum is improved, and the amount of corundum used is effectively reduced.

[0027] The mother tank 1 is provided with an additive storage tank 6 and a metering pump 7. The additive storage tank 6 and the mother tank 7 are connected by a first pipe 9. The metering pump 7 is provided on the first pipe 9. The metering pump 7 is used to add the additive in the additive storage tank 6 to the mother tank 1 in a quantitative manner. The metering pump 7 is separately provided to replenish the additive into the mother tank 1. The additive is a corundum dispersant (also known as an upper sand dispersant).

[0028] An outlet pipe 10 is provided at the lower end of the mother tank 1, and a delivery pump 17 is provided on the outlet pipe 10. The delivery pump 17 is used to realize the circulation of the plating solution between the mother tank 1 and the sub-tank. The outlet pipe 10 is connected to the liquid supply pipe 4 and the second pipe 12 respectively through the three-way valve 11. The second pipe 12 is connected to the positive pressure filter 18. The liquid outlet of the positive pressure filter 18 is connected to the mother tank 1 through the third pipe 8.

[0029] Specifically, in the production process of diamond wire, a sanding method for extending the service life of the sanding plating solution is realized by the above-mentioned device, comprising the following steps: under the conditions that the diameter of the busbar passing through the sub-slot is 0.036mm, the line speed is 25-45m / min, and the output current of the rectifier is 15-35A, 470L of plating solution is passed into the mother slot 1 (the plating solution is the existing technology, using nickel sulfamate solution, wherein the nickel ion content is 90±3g / L, the chloride ion content is 4±2g / L, and the pH is 4.6±0.2), corundum is added to the plating solution to a content of 1-2g / L, and the added corundum particle size is 5-8μm, the additive content in the plating solution in the mother slot 1 is 0.015-0.035ml / L, and then the additive is quantitatively added through the metering pump 7 every 9-12min, and the additive is sanding Dispersant, sanding dispersant is a prior art. Specifically, sanding dispersant refers to an auxiliary agent used in the diamond wire sanding electroplating process to improve the dispersibility of nickel-plated diamond in the plating solution and promote sanding; the amount of additive added each time is 0.01-0.02 ml, and at the same time, 3-20 g of corundum is added into the mother tank 1 every 18-22 minutes until the corundum content in the mother tank 1 reaches 15-18 g / L, then the busbar transportation is stopped, the regulating three-way valve 11 is disconnected to connect the outlet pipe 10 with the liquid supply pipe 4, and the mother tank 1 is stopped from supplying liquid to the sub-tank. Then, the three-way valve 11 is adjusted to connect the outlet pipe 10 with the second pipe 12, and the plating solution in the mother tank 1 is pumped into the positive pressure filter 18 for inactivated corundum filtration. The filtered plating solution is transported to the mother tank 1 through the third pipe 8, and then the busbar transportation is continued.

[0030] A sand adding machine 15 is provided on one side of the master tank 1 for adding corundum into the master tank 1 to ensure the corundum content in the plating solution and thus ensure the electroplating effect.

[0031] A filter tank 16 is provided on one of the return liquid pipes 5, and the filter tank 16 is used to filter the decomposition products of the additives in the plating solution. The filter tank 16 adopts the filter tank in the sand plating solution online filtration device with patent announcement number CN216457243U. Therefore, in the diamond wire production process, a part of the circulating plating solution between the mother tank 1 and the child tank is always filtered through the filter tank 16 and then participates in the plating solution circulation, thereby effectively reducing the content of the decomposition products of the additives in the plating solution, avoiding its influence on the tolerance of the plating solution and the breakage of the diamond wire.

[0032] The present invention adds or replenishes corundum and additives through the sand adding machine 15 and the metering pump 7 respectively, ensuring that the contents of corundum and additives in the plating solution are in a relative dynamic balance, effectively ensuring the sanding effect during the production process of diamond wire and ensuring the quality of the diamond wire.

[0033] At the same time, the present invention separates the inactivated corundum in the plating solution through the positive pressure filter 18, effectively extending the service life of the plating solution. Compared with the original plating solution that needs to be replaced in less than a month, the plating solution is treated and reused, and the service life of the sand plating solution of the present invention can reach about 3-4 months.

[0034] Furthermore, the present invention adopts multiple rectifiers 13 for current output, which ensures the stability of current output on the one hand, and on the other hand, the electric field in the sub-slot is evenly distributed, thereby ensuring the sanding effect.

[0035] The specific production effect of the present invention is as follows: Figure 3-4 As shown in FIG, the diamond wire produced by the existing technology has uneven distribution of diamond grains on the busbar and obvious agglomeration. like Figure 5-6 As shown, the diamond wire produced by the sanding device and sanding method of the present invention, the plating solution and additives used are the same as those Figure 3-4 The same as when producing diamond wire, the diamond grains are obviously more evenly distributed and the agglomeration phenomenon is significantly reduced.

[0036] The embodiments described above are only preferred embodiments of the present invention and do not limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made according to the structure, characteristics and principles described in the patent scope of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A sanding device for extending the service life of a sanding plating solution, characterized in that: The invention comprises a mother tank (1) and a sub-tank, wherein the sub-tank comprises an upper sub-tank (2) and a lower sub-tank (3) distributed vertically. A liquid supply pipe (4) and a plurality of liquid return pipes (5) are provided between the mother tank (1) and the sub-tank. The invention is characterized in that an additive storage tank (6) and a metering pump (7) are provided on the mother tank (1). The additive storage tank (6) and the mother tank (7) are connected via a first pipe (9). The metering pump (7) is provided on the first pipe (9). The metering pump (7) is used to quantitatively add the additive in the additive storage tank (6) to the mother tank (1). An outlet pipe (10) is provided at the lower end of the mother tank (1), and the outlet pipe (10) is respectively connected to the liquid supply pipe (4) and the second pipe (12) through a three-way valve (11). The second pipe (12) is connected to a positive pressure filter (18), and the liquid outlet of the positive pressure filter (18) is connected to the mother tank (1) through a third pipe (8).

2. A sand-loading device for extending the service life of a sand-loading plating solution according to claim 1, characterized in that: A plurality of rectifiers (13) are arranged outside the sub-slot, cathode rollers are arranged at both ends of the sub-slot, a plurality of titanium baskets (14) are arranged in the upper sub-slot (2) and the lower sub-slot (3), the positive pole of each rectifier (13) is connected to two corresponding titanium baskets (14) in the upper sub-slot (2) and the lower sub-slot (3), and the negative poles of the plurality of rectifiers (13) are connected to the two cathode rollers.

3. A sand-loading device for extending the service life of a sand-loading plating solution according to claim 1, characterized in that: A sand adding machine (15) is provided on one side of the mother groove (1) for adding corundum into the mother groove (1).

4. A sand-feeding device for extending the service life of a sand-feeding plating solution according to claim 1, characterized in that: A filter tank (16) is provided on one of the liquid return pipes (5), and the filter tank (16) is used to filter decomposition products of additives in the plating solution.

5. A sand-feeding device for extending the service life of a sand-feeding plating solution according to claim 2, characterized in that: A busbar is wound around the cathode roller, and the busbar passes through the sub-slots. There are multiple busbars, and each busbar is wound around two cathode rollers with 6 to 11 turns.

6. A sand-loading device for extending the service life of a sand-loading plating solution according to claim 1, characterized in that: The plurality of titanium baskets (14) in the upper sub-trough (2) or the lower sub-trough (3) are evenly distributed along the length direction of the sub-trough.

7. A sand-loading device for extending the service life of a sand-loading plating solution according to claim 1, characterized in that: A delivery pump (17) is provided on the outlet pipe (10).

8. A sand-loading device for extending the service life of a sand-loading plating solution according to claim 5, characterized in that: There are four rectifiers (13), and four titanium baskets (14) are arranged in each sub-slot and are distributed at equal intervals. The distance between two adjacent titanium baskets (14) in the same sub-slot is 40-80 mm.

9. A method for extending the service life of a plating solution, characterized in that: The method is realized by a sanding device for extending the service life of a sanding plating solution according to any one of claims 5 or 8, comprising the following steps: under the conditions that the diameter of the busbar passing through the sub-slot is 0.036mm, the line speed is 25-45m / min, and the output current of the rectifier is 15-35A, 470L of plating solution is passed into the mother slot (1), corundum is added to the plating solution to a content of 1-2g / L, the additive content in the plating solution in the mother slot (1) is 0.015-0.035ml / L, and then the additive is quantitatively added every 9-12min through the metering pump (7), and the amount of additive added each time is 15-30ml. At the same time, every 18-22 minutes, 3-20g of corundum is added into the mother tank (1) until the corundum content in the mother tank (1) reaches 15-18g / L, then the busbar transportation is stopped, the regulating three-way valve (11) is disconnected to connect the outlet pipe (10) with the liquid supply pipe (4), and the mother tank (1) stops supplying liquid to the sub-tank. Then, the three-way valve (11) is adjusted to connect the outlet pipe (10) with the second pipe (12), and the plating solution in the mother tank (1) is pumped into the positive pressure filter (18) to filter the inactivated corundum. The filtered plating solution is transported to the mother tank (1) through the third pipe (8), and then the busbar transportation is continued.

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