Control method and device for wine cabinet, wine cabinet and computer readable storage medium

Abstract

The invention relates to the technical field of intelligent household appliances, and discloses a control method for a wine cabinet, which comprises the following steps: obtaining the working state of a semiconductor chilling plate in each temperature zone, and taking the temperature zone corresponding to the semiconductor chilling plate in a refrigeration state as a refrigeration temperature zone; determining communication information of a heat dissipation air channel of the refrigeration temperature area and the electric control box; determining a target heat dissipation temperature area in all the temperature areas according to the communication information; and the heat dissipation air channel for controlling the target heat dissipation temperature area is communicated with the electric control box. And the air flow in the heat dissipation air duct of the target heat dissipation temperature area is used for dissipating heat of the electric control box, so that the temperature of the electric control board is reduced, and excessive energy consumption caused by independently arranging a fan for the electric control box is reduced. The invention further discloses a control device for the wine cabinet, the wine cabinet and a computer readable storage medium.

Description

Technical Field

[0001] The present application relates to the technical field of smart home appliances, for example, to a control method and device for a wine cabinet, a wine cabinet, and a computer-readable storage medium. Background Art

[0002] At present, when the semiconductor refrigeration plate in the semiconductor refrigeration wine cabinet is working, the computer board of the wine cabinet is in working state, and the temperature in the electrical control box where the computer board is located continues to rise, affecting the electrical performance of the computer board, and thus causing the working efficiency of the computer board to become lower.

[0003] In order to reduce the temperature of the computer board, the relevant technology adopts the method of using a fan to supply air to the electronic control box of the wine cabinet to drive the air flow through the space inside the electronic control box, thereby reducing the temperature inside the electronic control box, improving the heat dissipation efficiency of the computer board, improving the electrical performance of the computer board, and improving the working efficiency of the computer board.

[0004] During the implementation of the embodiments of the present disclosure, it was found that at least the following problems exist in the related art:

[0005] Although the related technology can reduce the temperature inside the electric control box, setting up a fan alone will cause unnecessary energy consumption.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The embodiments of the present disclosure provide a control method and device for a wine cabinet, a wine cabinet, and a computer-readable storage medium to reduce the excess energy consumption caused by separately providing a fan for an electric control box.

[0009] In some embodiments, a control method for a wine cabinet is provided, which includes multiple temperature zones. The control method includes: obtaining the working status of the semiconductor refrigeration plate in each temperature zone, and using the temperature zone corresponding to the semiconductor refrigeration plate in the cooling state as the cooling temperature zone; determining the connectivity information between the heat dissipation air duct and the electronic control box in the cooling temperature zone; determining the target heat dissipation temperature zone among all temperature zones based on the connectivity information; and controlling the heat dissipation air duct of the target heat dissipation temperature zone to be connected to the electronic control box.

[0010] Optionally, obtaining the working state of the semiconductor refrigeration plate in each temperature zone includes: obtaining the outlet temperature of the heat dissipation air duct of each semiconductor refrigeration plate; when the outlet temperature is greater than the ambient temperature, determining that the working state of the semiconductor refrigeration plate is a cooling state.

[0011] Optionally, the connectivity information includes connectable and unconnectable; based on the connectivity information, the target heat dissipation temperature zone among all temperature zones is determined, including: when the connectivity information only includes unconnectable, the non-cooling temperature zone except the cooling temperature zone among all temperature zones is used as the target heat dissipation temperature zone; and / or, when the connectivity information includes connectable, the temperature zone among the cooling temperature zones whose connectivity information is connectable is used as the target heat dissipation temperature zone.

[0012] Optionally, based on the connectivity information, the target heat dissipation temperature zone among all temperature zones is determined, including: when the connectivity information only includes that the connectivity is not available, obtaining the temperature inside the electrical control box; when the temperature inside the electrical control box is less than a first temperature threshold, taking any non-refrigeration temperature zone as the target heat dissipation temperature zone; and / or, when the temperature inside the electrical control box is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, taking multiple non-refrigeration temperature zones as target heat dissipation temperature zones; wherein the first temperature threshold is less than the second temperature threshold.

[0013] Optionally, a damper is provided in the heat dissipation duct of the target heat dissipation temperature zone, and the damper can be controlled to open or close to connect or close the heat dissipation duct and the electrical control box; controlling the heat dissipation duct of the target heat dissipation temperature zone to be connected to the electrical control box includes: when the working state of the semiconductor refrigeration plate in the target heat dissipation temperature zone is a cooling mode, controlling the damper in the heat dissipation duct of the target heat dissipation temperature zone to open; and / or, when the working state of the semiconductor refrigeration plate in the target heat dissipation temperature zone is a non-cooling mode, turning on the heat dissipation fan of the semiconductor refrigeration plate in the target heat dissipation temperature zone, and controlling the damper in the heat dissipation duct of the target heat dissipation temperature zone to open.

[0014] Optionally, after the heat dissipation duct in the target heat dissipation temperature zone is connected to the electrical control box, the method further includes: obtaining the temperature of the electrical control box; when the temperature of the electrical control box is greater than or equal to a second temperature threshold, controlling the semiconductor refrigeration plate to operate in a cooling mode facing the first end of the heat dissipation duct; when the temperature of the electrical control box is less than the second temperature threshold and the positive and negative poles of the semiconductor refrigeration plate are reversed for a preset period of time, controlling the semiconductor refrigeration plate to operate in a heating mode facing the first end of the heat dissipation duct.

[0015] Optionally, the semiconductor refrigeration chip includes a semiconductor refrigeration chip body, a semiconductor refrigeration chip power supply and a semiconductor refrigeration chip reversing device, the semiconductor refrigeration chip body includes a first power connection end and a second power connection end; the semiconductor refrigeration chip body is connected to the semiconductor refrigeration chip power supply through the semiconductor refrigeration chip reversing device, and the semiconductor refrigeration chip reversing device is configured to control the semiconductor refrigeration chip to operate in a cooling mode facing the first end of the heat dissipation duct, or to control the semiconductor refrigeration chip to operate in a heating mode facing the first end of the heat dissipation duct; controlling the semiconductor refrigeration chip to operate in a cooling mode facing the first end of the heat dissipation duct includes: controlling the semiconductor refrigeration chip reversing device to switch the power polarity of the semiconductor refrigeration chip power supply connected to the two ends of the semiconductor refrigeration chip body to the first A preset polarity; wherein the first preset polarity is that the first power connection end of the semiconductor refrigeration plate body is connected to the positive power supply of the semiconductor refrigeration plate power supply, and the second power connection end of the semiconductor refrigeration plate body is connected to the negative power supply of the semiconductor refrigeration plate power supply; and / or, controlling the semiconductor refrigeration plate to operate in a heating mode facing the first end of the heat dissipation air duct, including: controlling the semiconductor refrigeration plate reversing device to switch the power supply polarity of the semiconductor refrigeration plate power supply connected to the two ends of the semiconductor refrigeration plate body to a second preset polarity; wherein the second preset polarity is that the first power connection end of the semiconductor refrigeration plate body is connected to the negative power supply of the semiconductor refrigeration plate power supply, and the second power connection end of the semiconductor refrigeration plate body is connected to the positive power supply of the semiconductor refrigeration plate power supply.

[0016] Optionally, the semiconductor refrigeration plate inversion device includes a first MOS tube, a second MOS tube, a third MOS tube and a fourth MOS tube; the positive pole of the first MOS tube is connected to the positive pole of the power supply, and the negative pole of the first MOS tube is connected to the first power terminal; the positive pole of the fourth MOS tube is connected to the second power terminal, and the negative pole of the fourth MOS tube is connected to the negative pole of the power supply; the positive pole of the third MOS tube is connected to the positive pole of the power supply, and the negative pole of the third MOS tube is connected to the second power terminal; the positive pole of the second MOS tube is connected to the first power terminal, and the negative pole of the second MOS tube is connected to the negative pole of the power supply; the semiconductor refrigeration plate is controlled to operate in a cooling mode facing the first end of the heat dissipation duct in the following manner, including: controlling the second MOS tube and the third MOS tube to be turned on; and / or, the semiconductor refrigeration plate is controlled to operate in a heating mode facing the first end of the heat dissipation duct in the following manner, including: controlling the first MOS tube and the fourth MOS tube to be turned on.

[0017] In some embodiments, a control device for a wine cabinet is provided, comprising a processor and a memory storing program instructions, wherein the processor is configured to execute any one of the control methods for a wine cabinet described above when running the program instructions.

[0018] In some embodiments, a wine cabinet is provided, comprising: a wine cabinet body; and a control device for a wine cabinet as described in the above embodiment, installed on the wine cabinet body.

[0019] In some embodiments, a computer-readable storage medium is provided, storing program instructions, which, when executed, enable a computer to execute the control method for a wine cabinet as described in any one of the above embodiments.

[0020] The control method and device for a wine cabinet, the wine cabinet, and the computer-readable storage medium provided in the embodiments of the present disclosure can achieve the following technical effects:

[0021] The control method for a wine cooler provided in the disclosed embodiments uses connectivity information between the cooling zone's cooling duct and the electronic control box to determine whether the cooling zone's cooling duct is connected to the electronic control box. This determines whether the cooling zone can be used to dissipate heat from the electronic control box, thereby determining a target cooling temperature zone. The airflow within the cooling duct in the target cooling temperature zone is then used to dissipate heat from the electronic control box, thereby reducing the temperature of the electronic control board and minimizing the excess energy consumption associated with a separate fan for the electronic control box.

[0022] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0024] Figure 1 is a rear view of the wine cabinet provided by an embodiment of the present disclosure;

[0025] Figure 2 is a front view of a back panel of a wine cabinet provided by an embodiment of the present disclosure;

[0026] Figure 3 yes Figure 1 A cross-sectional view of the back panel of the wine cabinet along the direction of airflow in the main air duct in the embodiment shown;

[0027] Figure 4 yes Figure 3 An enlarged schematic diagram of position N in the embodiment shown;

[0028] Figure 5 is a schematic diagram of a control method for a wine cabinet provided by an embodiment of the present disclosure;

[0029] Figure 6 is a schematic diagram of another control method for a wine cabinet provided by an embodiment of the present disclosure;

[0030] Figure 7 is a schematic diagram of a control device for a wine cabinet provided by an embodiment of the present disclosure;

[0031] Figure 8 is a schematic diagram of a wine cabinet provided by an embodiment of the present disclosure;

[0032] Figure 9 It is a structural schematic diagram of a semiconductor refrigeration plate inversion device provided by an embodiment of the present disclosure;

[0033] Figure 10 This is a schematic diagram of the current flow direction in the reversing device when the semiconductor refrigeration plate provided by the embodiment of the present disclosure is facing the first end of the heat dissipation air duct and operating in the heating mode;

[0034] Figure 11 This is a schematic diagram of the direction of current flow in the reversing device when the semiconductor refrigeration plate provided by the embodiment of the present disclosure is facing the first end of the heat dissipation duct and operating in the cooling mode.

[0035] Reference numerals:

[0036] 10. Wine cabinet body;

[0037] 20, cooling air duct; 201, main air duct; 2011, second air inlet; 2012, first air outlet; 2013, branch air outlet; 202, secondary air duct; 2021, first air inlet; 2022, second air outlet; 2023, third air outlet;

[0038] 30. Electric control box;

[0039] 50. First air gate;

[0040] 60. Semiconductor refrigeration assembly; 601. Semiconductor refrigeration chip body;

[0041] 70. Control device for wine cabinet; 700. Processor; 701. Memory; 702. Communication interface; 703. Bus;

[0042] 80. Wine cabinet;

[0043] 901, a first MOS transistor; 902, a second MOS transistor; 903, a third MOS transistor; 904, a fourth MOS transistor. DETAILED DESCRIPTION

[0044] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0045] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0046] Unless otherwise stated, the term "plurality" means two or more.

[0047] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0048] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0049] The term "correspondence" may refer to an association relationship or a binding relationship. The correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

[0050] Combine Figures 1 to 4 As shown, an embodiment of the present disclosure provides a wine cabinet, which includes a wine cabinet body 10, and the wine cabinet body 10 includes a refrigeration space and a semiconductor refrigeration component 60. The semiconductor refrigeration component 60 is used to cool the refrigeration space. The semiconductor refrigeration component 60 includes a semiconductor refrigeration plate and a heat dissipation fan. The heat dissipation fan is used to dissipate heat from the heat exchange end of the semiconductor refrigeration plate. The wine cabinet also includes: a heat dissipation duct 20 and an electronic control box 30. The heat dissipation duct 20 is opened in the side wall of the wine cabinet body 10. The heat dissipation duct 20 includes a first air inlet 2021 and a first air outlet 2012. The first air inlet 2021 is opened in the side wall of the wine cabinet body 10. The air outlet of the heat dissipation fan is connected to the heat dissipation duct 20. The electronic control box 30 is arranged on the top wall of the wine cabinet body 10. The first air outlet 2012 of the heat dissipation duct 20 is connected to the electronic control box 30.

[0051] In the wine cabinet provided by the embodiment of the present disclosure, the temperature of the heat dissipation airflow in the heat dissipation duct 20 is lower than the temperature in the electric control box 30, so that the first air outlet 2012 of the heat dissipation duct 20 is connected to the electric control box 30, and the airflow of the heat dissipation duct 20 is used to dissipate heat from the electric control box 30, so that the heat dissipation of the electric control box 30 is achieved by the heat dissipation fan provided by the semiconductor refrigeration component 60, thereby reducing the unnecessary energy consumption and cost caused by setting up a separate fan for the electric control box 30. Specifically, by setting the air outlet of the heat dissipation fan to be connected to the heat dissipation duct 20, so that the airflow generated by the heat dissipation fan can enter the heat dissipation duct 20, and then enter the electric control box 30 through the first air outlet 2012 of the heat dissipation duct 20, and then use the airflow to dissipate heat from the electric control box 30, thereby reducing the unnecessary energy consumption and cost caused by setting up a separate fan for the electric control box 30.

[0052] For example, during the operation of the wine cabinet, the air flow temperature generated by the heat dissipation fan to the heat exchange end of the semiconductor refrigeration plate is 40°C to 50°C, while the temperature inside the electronic control box 30 is 90°C to 100°C. Therefore, the air flow in the heat dissipation duct 20 can be used to cool and dissipate heat inside the electronic control box 30.

[0053] Specifically, when the semiconductor cooling element is powered on, the first and second heat exchange ends generate heat or cold, respectively. When the wine cooler is in the cooling state, the heat exchange end located closer to the refrigerated space generates cold air, while the heat exchange end located farther from the refrigerated space generates heat, thereby cooling the refrigerated space. Simultaneously, the fan operates, driving air flow at the heat exchange end farther from the refrigerated space. This air, after exchanging heat with the heat exchange end, is then transported along the heat dissipation duct 20 to other locations, thereby dissipating heat from the semiconductor cooling element.

[0054] When the wine cooler is defrosting, the electrodes of the semiconductor refrigeration plate reverse, generating heat at the heat exchange end closest to the refrigerated space and cooling at the heat exchange end further away, thereby defrosting the refrigerated space. Simultaneously, the fan operates, driving air flow at the heat exchange end further away from the refrigerated space. Because this heat exchange end is generating cooling, the airflow within the heat dissipation duct 20 remains cooler. Once this airflow reaches the interior of the electrical control box 30, it further lowers the temperature within the box, accelerating the cooling rate within the box.

[0055] Exemplarily, the semiconductor refrigeration plate includes a first heat exchange end and a second heat exchange end. The first heat exchange end is a heat exchange end away from the refrigeration space (i.e., the first end facing the heat dissipation duct), and the second heat dissipation end is a heat exchange end close to the refrigeration space (i.e., the second end facing away from the heat dissipation duct). When the wine cabinet is in the refrigeration state, the second heat exchange end generates heat, and the fan drives the airflow in the heat dissipation duct 20 to exchange heat with the first heat exchange end, and then flows through the first air outlet 2012 of the heat dissipation duct 20, and then enters the electric control box 30, and then uses the airflow to dissipate heat from the electric control box 30, reducing the excess energy consumption and cost caused by setting up a separate fan for the electric control box 30. When the wine cabinet is in the defrosting state, the fan drives the airflow to exchange heat with the cold energy generated by the first heat exchange end, and then flows through the first air outlet 2012 of the heat dissipation duct 20, and then enters the electric control box 30, further reducing the temperature inside the electric control box 30 and increasing the cooling rate of the space inside the electric control box 30.

[0056] It is understandable that the heat dissipation duct 20 provided in the embodiment of the present disclosure can be set in the side wall of the wine cabinet body 10, without limiting the specific side wall (for example: the rear side wall, the left side wall or the right side wall) where the heat dissipation duct 20 is located.

[0057] Specifically, when the wine cabinet is an embedded wine cabinet, that is, when the wine cabinet needs to be embedded in the installation space, the electronic control box 30 is arranged on the top wall of the wine cabinet body, so that the installation cavity of the electronic control box 30 can exchange heat with the upper space and the front space of the wine cabinet, thereby improving the heat dissipation efficiency of the electronic control box 30.

[0058] Optionally, combined Figure 3 As shown, the heat dissipation duct 20 further includes a primary duct 201 and a secondary duct 202. The primary duct 201 includes a second air inlet 2011 and a first air outlet 2012. The secondary duct 202 includes a first air inlet 2021, a second air outlet 2022, and a third air outlet 2023. The first air inlet 2021 and the second air outlet 2022 are located on the sidewall of the wine cabinet body 10, and the third air outlet 2023 is connected to the second air inlet 2011. If the refrigerated space includes multiple temperature zones, the heat dissipation duct 20 includes multiple secondary ducts 202, each corresponding to the multiple temperature zones.

[0059] In this embodiment, a secondary air duct 202 is provided, comprising a first air inlet 2021 (i.e., the first air inlet of the heat dissipation duct) and a second air outlet 2022. This allows the secondary air duct 202 to be used to dissipate heat from the hot end of the semiconductor refrigeration assembly 60 when heat dissipation within the electrical control box 30 is not required. Furthermore, a third air outlet 2023 is provided within the secondary air duct 202 to establish communication between the secondary air duct 202 and the primary air duct 201. When heat dissipation within the electrical control box 30 is required, the third air outlet 2023 is opened to deliver airflow into the primary air duct 201. The air then enters the electrical control box 30 through the first air outlet 2012 of the primary air duct 201 (i.e., the first air outlet of the heat dissipation duct), dissipating heat within the electrical control box 30 and reducing the unnecessary energy consumption and cost associated with providing a separate fan for the electrical control box 30.

[0060] Specifically, the first air outlet 2012 of the main air duct 201 is the first air outlet of the heat dissipation air duct, and the first air inlet 2021 of the secondary air duct 202 is the first air inlet of the heat dissipation air duct.

[0061] Specifically, when the refrigeration space includes multiple temperature zones, the wine cabinet includes multiple semiconductor refrigeration components 60, one or more semiconductor refrigeration components 60 are set in each temperature zone, and each semiconductor refrigeration component 60 is correspondingly provided with a secondary air duct 202.

[0062] It is understandable that the number of semiconductor refrigeration components 60 provided in each temperature zone depends on the cooling requirements of the temperature zone, and the embodiments of the present disclosure do not impose any limitation on this.

[0063] Optionally, combined Figure 3 and Figure 4 As shown, the wine cabinet further includes a first damper 50. The first damper 50 is disposed at the third air outlet 2023. The first damper 50 can be controlled to open or close the third air outlet 2023.

[0064] In this embodiment, the first damper 50 is provided so that when heat dissipation is required within the electric control box 30, the first damper 50 is controlled to open, thereby opening the third air outlet 2023. This allows the airflow within the secondary air duct 202 to be transported to the primary air duct 201, and then enters the electric control box 30 through the first air outlet 2012 of the primary air duct 201, thereby dissipating heat within the electric control box 30 and reducing the unnecessary energy consumption and cost of providing a separate fan for the electric control box 30.

[0065] Specifically, when heat dissipation is required within the electrical control box 30, the first damper 50 is controlled to open, thereby opening the third air outlet 2023. This allows the airflow within the secondary air duct 202 to be transported to the primary air duct 201 and enter the electrical control box 30 through the first air outlet 2012 of the primary air duct 201, thereby dissipating heat within the electrical control box 30. When heat dissipation is not required within the electrical control box 30, the first damper 50 is controlled to close, thereby closing the third air outlet 2023. At this point, driven by the fan, air enters the secondary air duct 202 through the first air inlet 2021 of the secondary air duct 202, exchanges heat with the heat exchange end of the semiconductor cooling fin, and then exits the secondary air duct 202 through the second air outlet 2022 of the secondary air duct 202, thereby dissipating heat from the semiconductor cooling fin.

[0066] In some embodiments, a control device for a wine cabinet is provided, comprising a processor and a memory storing program instructions, wherein the processor is configured to execute a control method for a wine cabinet as described in any one of the following embodiments when running the program instructions.

[0067] Combine Figures 1 to 4 The wine cabinet shown in the embodiment of the present disclosure provides a control method for the wine cabinet, and the execution subject of the method can be a processor, such as Figure 5 As shown, the control method includes:

[0068] S501: The processor obtains the working status of the semiconductor refrigeration plate in each temperature zone, and uses the temperature zone corresponding to the semiconductor refrigeration plate in the cooling state as the cooling temperature zone.

[0069] In this step, the working state of the semiconductor refrigeration chip is used to determine whether the semiconductor refrigeration chip is currently in working state. When the semiconductor refrigeration chip is in working state, the heat dissipation fan of the semiconductor refrigeration component is also in working state, that is, it can generate airflow, thereby facilitating heat dissipation of the electronic control box through the airflow.

[0070] S502: The processor determines the connectivity information between the heat dissipation duct in the cooling temperature zone and the electric control box.

[0071] In this step, the connectivity information is determined to determine whether the heat dissipation duct in the operating temperature zone of the semiconductor refrigeration chip is connected to the electronic control box. This facilitates determining whether the airflow generated by the heat dissipation fan of the operating semiconductor refrigeration chip can flow into the electronic control box to cool and dissipate heat for the electronic control box.

[0072] S503: The processor determines a target heat dissipation temperature zone among all the temperature zones according to the connectivity information.

[0073] In this step, the connectivity information is used to determine whether the cooling air duct in the cooling temperature zone is connected to the electronic control box. If so, the airflow generated by the cooling fan of the semiconductor cooling plate corresponding to the cooling temperature zone is used to cool and dissipate heat to the electronic control box. If not, the airflow generated by the cooling fan of the semiconductor cooling plate corresponding to other temperature zones is used to cool and dissipate heat to the electronic control box.

[0074] S504: The processor controls the heat dissipation air duct in the target heat dissipation temperature zone to be connected to the electric control box.

[0075] The control method for a wine cabinet provided by the embodiment of the present disclosure uses the connectivity information between the heat dissipation duct in the cooling temperature zone and the electronic control box to determine whether the heat dissipation duct in the cooling temperature zone can be connected to the electronic control box. That is, it is determined whether the cooling temperature zone can be used to dissipate heat from the electronic control box, thereby obtaining a target heat dissipation temperature zone. The airflow in the heat dissipation duct in the target heat dissipation temperature zone is used to dissipate heat from the electronic control box, thereby reducing the temperature of the electronic control board and the excess energy consumption caused by providing a separate fan for the electronic control box. Specifically, the airflow in the heat dissipation duct is generated by the heat dissipation fan in the target heat dissipation temperature zone driving the air flow.

[0076] Optionally, obtaining the working state of the semiconductor refrigeration plate in each temperature zone includes: obtaining the outlet temperature of the heat dissipation air duct of each semiconductor refrigeration plate; when the outlet temperature is greater than the ambient temperature, determining that the working state of the semiconductor refrigeration plate is a cooling state.

[0077] In this embodiment, the outlet temperature of the heat dissipation duct of the semiconductor refrigeration plate is detected. When the outlet temperature of the heat dissipation duct is higher than the ambient temperature, that is, the temperature of the heat exchange end of the semiconductor refrigeration plate is higher than the ambient temperature, it indicates that the heat exchange end of the semiconductor refrigeration plate has exchanged heat with the air, that is, the semiconductor refrigeration plate is in working condition.

[0078] Specifically, when the semiconductor refrigeration chip is in working state, the first end of the semiconductor refrigeration chip facing the heat dissipation duct is the heating end, and then when the outlet temperature of the heat dissipation duct is higher than the ambient temperature, the semiconductor refrigeration chip is in working state.

[0079] Optionally, the ambient temperature ranges from 28° C. to 35° C. Specific values ​​of the ambient temperature include 28° C., 31° C., or 35° C.

[0080] Exemplarily, the operating status of the semiconductor refrigeration chip is determined by detecting the temperature of the second air outlet of the secondary air duct. Optionally, the connectivity information includes connectivity and non-connectivity; and determining the target heat dissipation temperature zone among all temperature zones based on the connectivity information includes: if the connectivity information only includes non-connectivity, selecting the non-cooling temperature zones excluding the cooling temperature zones among all temperature zones as the target heat dissipation temperature zones; and / or if the connectivity information includes connectivity, selecting the temperature zones among the cooling temperature zones whose connectivity information indicates connectivity as the target heat dissipation temperature zones.

[0081] In this embodiment, when the connectivity information only indicates that connectivity is unavailable, the cooling air ducts in the cooling temperature zone are not connected to the electronic control box, meaning that the airflow in the cooling temperature zone's cooling air ducts cannot be used to dissipate heat from the electronic control box. Airflow is then generated in temperature zones other than the cooling temperature zone, and the airflow generated by the cooling fan in the target cooling temperature zone is used to dissipate heat from the electronic control box. This reduces the temperature of the electronic control board and minimizes the excess energy consumption associated with providing a separate fan for the electronic control box.

[0082] By using the connectivity information in the cooling temperature zone to generate the airflow for the cooling fan in the connectable temperature zone to dissipate heat for the electrical control box when the connectivity information includes connectivity, the temperature of the electrical control board is reduced, and the excess energy consumption caused by setting up a separate fan for the electrical control box is reduced.

[0083] Optionally, based on the connectivity information, the target heat dissipation temperature zone among all temperature zones is determined, including: when the connectivity information only includes that the connectivity is not available, obtaining the temperature inside the electrical control box; when the temperature inside the electrical control box is less than a first temperature threshold, taking any non-refrigeration temperature zone as the target heat dissipation temperature zone; and / or, when the temperature inside the electrical control box is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, taking multiple non-refrigeration temperature zones as target heat dissipation temperature zones.

[0084] In this embodiment, if the connectivity information only indicates that connectivity is unavailable, meaning that the cooling air ducts in the cooling zone are not connected to the electrical control box, the airflow generated by the cooling zone's cooling fan cannot be used to dissipate heat from the electrical control box. A target cooling zone must be selected from temperature zones other than the cooling zone to use the cooling fan in the target zone to generate airflow for cooling the electrical control box. Furthermore, the number of target cooling zones required is determined based on the temperature of the electrical control box to meet the electrical control box's cooling requirements.

[0085] Specifically, when the temperature inside the electrical control box is below a first temperature threshold, the temperature is slightly elevated, and the airflow generated by only one cooling fan in a non-cooling temperature zone is sufficient to meet the electrical control box's heat dissipation needs. When the temperature inside the electrical control box is greater than or equal to the first temperature threshold but less than or equal to a second temperature threshold, the temperature is relatively high, and the electrical control box's heat dissipation needs to be greater. Multiple cooling fans in non-cooling temperature zones are required to generate a large amount of airflow to dissipate heat from the electrical control box and meet its heat dissipation needs.

[0086] Optionally, the value range of the first temperature threshold includes: 45° C. to 60° C. The specific value of the first temperature threshold includes: 45° C., 53° C. or 60° C.

[0087] Optionally, the second temperature threshold value ranges from 90° C. to 110° C. The specific value of the second temperature threshold value includes 90° C., 100° C., or 110° C.

[0088] Optionally, a damper is provided in the heat dissipation duct of the target heat dissipation temperature zone, and the damper can be controlled to open or close to connect or close the heat dissipation duct and the electrical control box; controlling the heat dissipation duct of the target heat dissipation temperature zone to be connected to the electrical control box includes: when the working state of the semiconductor refrigeration plate in the target heat dissipation temperature zone is a cooling mode, controlling the damper in the heat dissipation duct of the target heat dissipation temperature zone to open; and / or, when the working state of the semiconductor refrigeration plate in the target heat dissipation temperature zone is a non-cooling mode, turning on the heat dissipation fan of the semiconductor refrigeration plate in the target heat dissipation temperature zone, and controlling the damper in the heat dissipation duct of the target heat dissipation temperature zone to open.

[0089] In this embodiment, when the working state of the semiconductor refrigeration plate in the target heat dissipation temperature zone is in cooling mode, the heat dissipation fan in the target heat dissipation temperature zone is in operation to generate airflow. After the damper in the heat dissipation duct in the target heat dissipation temperature zone is controlled to be open, the airflow flows into the electric control box through the heat dissipation duct to achieve cooling and heat dissipation of the electric control box. When the working state of the semiconductor refrigeration plate in the target heat dissipation temperature zone is in non-cooling mode, the heat dissipation fan in the target heat dissipation temperature zone is not in operation, and the heat dissipation fan needs to be controlled to generate airflow. At the same time, the damper in the heat dissipation duct in the target heat dissipation temperature zone is controlled to be open, and the airflow generated by the heat dissipation fan flows into the electric control box through the heat dissipation duct to achieve cooling and heat dissipation of the electric control box. This reduces the temperature of the electric control board and reduces the excess energy consumption caused by setting up a separate fan for the electric control box.

[0090] Specifically, the damper is the first damper 50 .

[0091] Combine Figure 6 As shown, the embodiment of the present disclosure provides another control method for a wine cabinet, which includes multiple temperature zones. The control method includes:

[0092] S601: The processor obtains the working status of the semiconductor refrigeration plate in each temperature zone, and uses the temperature zone corresponding to the semiconductor refrigeration plate in the cooling state as the cooling temperature zone.

[0093] S602: The processor determines the connectivity information between the heat dissipation duct in the cooling temperature zone and the electric control box.

[0094] S603: The processor determines a target heat dissipation temperature zone among all the temperature zones according to the connectivity information.

[0095] S604: The processor controls the heat dissipation air duct in the target heat dissipation temperature zone to be connected to the electric control box.

[0096] S605: The processor obtains the temperature of the electric control box.

[0097] S606: When the temperature of the electric control box is greater than or equal to the second temperature threshold, the processor controls the semiconductor refrigeration plate to operate in a cooling mode facing the first end of the heat dissipation air duct.

[0098] S607, when the temperature of the electric control box is lower than the second temperature threshold and the positive and negative poles of the semiconductor refrigeration plate are reversed for a preset time, the processor controls the semiconductor refrigeration plate to operate in a heating mode facing the first end of the heat dissipation duct.

[0099] In this embodiment, after the heat dissipation duct in the target heat dissipation temperature zone is connected to the electrical control box, the temperature of the electrical control box is detected to determine whether the airflow generated in the current target heat dissipation temperature zone meets the heat dissipation requirements of the electrical control box. If the temperature of the electrical control box is greater than or equal to a second temperature threshold, the heat dissipation requirements of the electrical control box are not met, and the temperature inside the electrical control box continues to rise. In this case, it is necessary to increase the heat dissipation efficiency of the electrical control box. By controlling the semiconductor cooling fins to face the first end of the heat dissipation duct and operating in a cooling mode, the semiconductor cooling fins are directed toward the first end of the heat dissipation duct to generate cooling energy, and the heat dissipation fan is used to generate a cold airflow, thereby facilitating the use of the cold airflow to accelerate the heat dissipation efficiency of the electrical control box.

[0100] When the temperature of the electrical control box is lower than the second temperature threshold and the positive and negative poles of the semiconductor refrigeration plate are reversed for a preset period of time, the semiconductor refrigeration plate faces the first end of the heat dissipation duct and runs in a cooling mode for a preset period of time. At this time, the semiconductor refrigeration plate is detected again and controlled to run in a heating mode facing the first end of the heat dissipation duct.

[0101] Optionally, the preset duration ranges from 8 minutes to 12 minutes, and specific values ​​of the preset duration include 8 minutes, 10 minutes, or 12 minutes.

[0102] Specifically, when the semiconductor refrigeration plate is facing the first end of the heat dissipation air duct and operating in cooling mode, the semiconductor refrigeration plate is facing away from the second end of the heat dissipation air duct and operating in heating mode, that is, the second end can generate heat, and the generated heat can defrost the temperature zone, thereby improving the practicality of the wine cabinet.

[0103] Optionally, the semiconductor refrigeration chip includes a semiconductor refrigeration chip body, a semiconductor refrigeration chip power supply and a semiconductor refrigeration chip reversing device, the semiconductor refrigeration chip body includes a first power connection end and a second power connection end; the semiconductor refrigeration chip body is connected to the semiconductor refrigeration chip power supply through the semiconductor refrigeration chip reversing device, and the semiconductor refrigeration chip reversing device is configured to control the semiconductor refrigeration chip to operate in a cooling mode facing the first end of the heat dissipation duct, or to control the semiconductor refrigeration chip to operate in a heating mode facing the first end of the heat dissipation duct; controlling the semiconductor refrigeration chip to operate in a cooling mode facing the first end of the heat dissipation duct includes: controlling the semiconductor refrigeration chip reversing device to switch the power polarity of the semiconductor refrigeration chip power supply connected to the two ends of the semiconductor refrigeration chip body to the first A preset polarity; wherein the first preset polarity is that the first power connection end of the semiconductor refrigeration plate body is connected to the positive power supply of the semiconductor refrigeration plate power supply, and the second power connection end of the semiconductor refrigeration plate body is connected to the negative power supply of the semiconductor refrigeration plate power supply; and / or, controlling the semiconductor refrigeration plate to operate in a heating mode facing the first end of the heat dissipation air duct, including: controlling the semiconductor refrigeration plate reversing device to switch the power supply polarity of the semiconductor refrigeration plate power supply connected to the two ends of the semiconductor refrigeration plate body to a second preset polarity; wherein the second preset polarity is that the first power connection end of the semiconductor refrigeration plate body is connected to the negative power supply of the semiconductor refrigeration plate power supply, and the second power connection end of the semiconductor refrigeration plate body is connected to the positive power supply of the semiconductor refrigeration plate power supply.

[0104] In this embodiment, a semiconductor refrigeration chip reversing device is provided to switch the polarity of the power supply at both ends of the semiconductor refrigeration chip body. Furthermore, by controlling the semiconductor refrigeration chip reversing device, the polarity of the power supply at both ends of the semiconductor refrigeration chip body is reversed. If the temperature inside the electronic control box is too high, the polarity of the electrodes at both ends of the semiconductor refrigeration chip body is switched, causing the semiconductor refrigeration chip to face the first end of the heat dissipation duct and operate in a cooling mode to generate cooling. The airflow within the heat dissipation duct in the target heat dissipation temperature zone is used to cool the electronic control box, further improving the heat dissipation efficiency of the electronic control box.

[0105] Optionally, combined Figures 9 to 11As shown in the circuit diagram, the semiconductor refrigeration plate inversion device includes a first MOS tube, a second MOS tube, a third MOS tube and a fourth MOS tube; the positive electrode of the first MOS tube is connected to the positive electrode of the power supply, and the negative electrode of the first MOS tube is connected to the first power terminal; the positive electrode of the fourth MOS tube is connected to the second power terminal, and the negative electrode of the fourth MOS tube is connected to the negative electrode of the power supply; the positive electrode of the third MOS tube is connected to the positive electrode of the power supply, and the negative electrode of the third MOS tube is connected to the second power terminal; the positive electrode of the second MOS tube is connected to the first power terminal, and the negative electrode of the second MOS tube is connected to the negative electrode of the power supply; the semiconductor refrigeration plate is controlled to operate in a cooling mode facing the first end of the heat dissipation duct in the following manner, including: controlling the second MOS tube and the third MOS tube to be turned on; and / or, the semiconductor refrigeration plate is controlled to operate in a heating mode facing the first end of the heat dissipation duct in the following manner, including: controlling the first MOS tube and the fourth MOS tube to be turned on.

[0106] In this embodiment, combined Figure 10 As shown, by controlling the conduction of the first MOS tube and the fourth MOS tube, the first power terminal of the semiconductor refrigeration plate is electrically connected to the positive pole of the power supply, and the second power terminal of the semiconductor refrigeration plate is electrically connected to the negative pole of the power supply. That is, the current enters the semiconductor refrigeration plate from the first power terminal and then flows out from the second power terminal, so that the semiconductor refrigeration plate faces the first end of the heat dissipation duct and operates in the heating mode. Figure 11 As shown, by controlling the conduction of the second and third MOS transistors, the second power terminal of the semiconductor refrigeration plate is electrically connected to the positive electrode of the power supply, and the first power terminal of the semiconductor refrigeration plate is electrically connected to the negative electrode of the power supply, thereby achieving the positive and negative polarity reversal of the semiconductor refrigeration plate. That is, the current enters the semiconductor refrigeration plate from the second power terminal and then flows out from the first power terminal, so that the semiconductor refrigeration plate faces the first end of the heat dissipation duct and operates in the cooling mode.

[0107] Optionally, after controlling the end of the semiconductor refrigeration element facing the heat dissipation duct to operate in cooling mode, the method further includes: obtaining the temperature within the temperature zone; and if the temperature is greater than a preset temperature, controlling the end of the semiconductor refrigeration element facing the heat dissipation duct to operate in heating mode. The preset temperature is equal to the sum of the semiconductor refrigeration element's power-on point temperature and a temperature compensation value. This reduces the risk of excessive temperature rise within the temperature zone caused by polarity reversal of the semiconductor refrigeration element, thereby reducing the impact of temperature changes within the temperature zone on the wine.

[0108] Optionally, the semiconductor refrigeration chip power-on point temperature range includes: 5° C. to 20° C. The specific values ​​of the semiconductor refrigeration chip power-on point temperature include: 5° C., 13° C. or 20° C.

[0109] Optionally, the temperature compensation value ranges from 1° C. to 3° C. Specific values ​​of the temperature compensation value include 1° C., 2° C., or 3° C.

[0110] Optionally, the control method further includes: obtaining frost thickness information within the temperature zone; and, if the frost thickness information is greater than or equal to a frost thickness threshold, controlling the semiconductor refrigeration element to operate in a cooling mode at one end facing the heat dissipation duct, thereby achieving defrosting within the temperature zone and reducing the impact of frost on the wine stored in the wine cabinet.

[0111] Optionally, the frost thickness threshold value ranges from 5 mm (millimeter) to 10 mm, and specific values ​​of the frost thickness threshold value include 5 mm, 7 mm, or 10 mm.

[0112] Combine Figure 7 As shown, an embodiment of the present disclosure provides a control device 70 for a wine cabinet, comprising a processor 700 and a memory 701. Optionally, the device 70 may further comprise a communication interface 702 and a bus 703. The processor 700, the communication interface 702, and the memory 701 may communicate with each other via the bus 703. The communication interface 702 may be used for information transmission. The processor 700 may call the logic instructions in the memory 701 to execute the control method for the wine cabinet of the above embodiment.

[0113] In addition, the logic instructions in the memory 701 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0114] Memory 701, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as the program instructions / modules corresponding to the methods in the embodiments of the present disclosure. Processor 700 executes the program instructions / modules stored in memory 701 to execute functional applications and data processing, thereby implementing the control method for the wine cabinet in the above-mentioned embodiments.

[0115] The memory 701 may include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal device. Furthermore, the memory 701 may include high-speed random access memory and non-volatile memory.

[0116] Combine Figure 8As shown, the wine cabinet 80 provided in the embodiment of the present disclosure also includes: the control device 70 for the wine cabinet described in the above embodiment. The control device 70 for the wine cabinet is installed on the wine cabinet body 10. The installation relationship described here is not limited to being placed inside the wine cabinet body 10, but also includes the installation connection with other components of the wine cabinet 80, including but not limited to physical connection, electrical connection or signal transmission connection, etc. It can be understood by those skilled in the art that the control device 70 for the wine cabinet can be adapted to a feasible wine cabinet body, thereby realizing other feasible embodiments.

[0117] An embodiment of the present disclosure provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured to execute the above-mentioned control method for a wine cabinet.

[0118] The technical solutions of the embodiments of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium may be a non-transitory storage medium, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, among other media capable of storing program code.

[0119] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include plural forms. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of one or more associated listings. In addition, when used in this application, the term "comprise" and its variations "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups of these. In the absence of further restrictions, an element defined by the sentence "comprising a..." does not exclude the presence of other identical elements in the process, method or device that includes the element. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments can be referenced to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can be found in the description of the method part.

[0120] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. The technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. The technicians will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0121] In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units can be merely a logical functional division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between each other shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, and can be electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected to implement this embodiment according to actual needs. In addition, the functional units in the embodiments of the present disclosure may be integrated into a processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0122] The flowcharts and block diagrams in the accompanying drawings show the possible implementation architectures, functions and operations of the systems, methods and computer program products according to the embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of the code, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical functions. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in an order different from that disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified function or action, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A control method for a wine cabinet, characterized in that: The wine cabinet includes multiple temperature zones, and the control methods include: Obtaining the working state of the semiconductor refrigeration piece in each temperature zone, and taking the temperature zone corresponding to the semiconductor refrigeration piece in the cooling state as the cooling temperature zone; Determine the connectivity between the cooling air duct and the electronic control box in the cooling temperature zone; Determine the target heat dissipation temperature zone among all temperature zones based on the connectivity information; The heat dissipation air duct for controlling the target heat dissipation temperature zone is connected to the electric control box.

2. The control method according to claim 1, characterized in that: Obtain the working status of the semiconductor refrigeration chip in each temperature zone, including: Obtain the air outlet temperature of the heat dissipation air duct of each semiconductor refrigeration chip; When the air outlet temperature is greater than the ambient temperature, it is determined that the working state of the semiconductor refrigeration chip is the cooling state.

3. The control method according to claim 1, wherein: Connectivity information includes connectivity and non-connectivity. Based on the connectivity information, the target heat dissipation temperature zone among all temperature zones is determined, including: When the connectivity information only includes that connectivity is unavailable, the non-cooling temperature zones in all temperature zones except the cooling temperature zones are used as target heat dissipation temperature zones; and / or, In a case where the connectivity information includes connectable, the temperature zone in the cooling temperature zone whose connectivity information indicates connectable is used as the target heat dissipation temperature zone.

4. The control method according to claim 1, wherein: Based on the connectivity information, determine the target heat dissipation temperature zone among all temperature zones, including: When the connectivity information only includes that connectivity is unavailable, obtaining the temperature inside the electric control box; When the temperature in the electric control box is lower than the first temperature threshold, any non-cooling temperature zone is used as the target heat dissipation temperature zone; and / or, When the temperature inside the electric control box is greater than or equal to a first temperature threshold and less than or equal to a second temperature threshold, multiple non-cooling temperature zones are used as target heat dissipation temperature zones; wherein the first temperature threshold is less than the second temperature threshold.

5. The control method according to claim 1, characterized in that: A damper is provided in the heat dissipation duct in the target heat dissipation temperature zone. The damper can be controlled to open or close to connect or close the heat dissipation duct and the electronic control box. The heat dissipation duct that controls the target heat dissipation temperature zone is connected to the electric control box, including: When the working state of the semiconductor refrigeration piece in the target heat dissipation temperature zone is the cooling mode, the damper in the heat dissipation air duct in the target heat dissipation temperature zone is controlled to open; and / or, When the working state of the semiconductor refrigeration piece in the target heat dissipation temperature zone is the non-cooling mode, the heat dissipation fan of the semiconductor refrigeration piece in the target heat dissipation temperature zone is turned on, and the damper in the heat dissipation air duct in the target heat dissipation temperature zone is controlled to open.

6. The control method according to any one of claims 1 to 5, characterized in that: After the heat dissipation duct for controlling the target heat dissipation temperature zone is connected to the electric control box, it also includes: Get the temperature of the electric control box; When the temperature of the electric control box is greater than or equal to the second temperature threshold, controlling the semiconductor refrigeration chip to face the first end of the heat dissipation air duct to operate in a cooling mode; When the temperature of the electric control box is lower than the second temperature threshold and the positive and negative poles of the semiconductor refrigeration plate are reversed for a preset time, the semiconductor refrigeration plate is controlled to face the first end of the heat dissipation duct to run the heating mode.

7. The control method according to claim 6, characterized in that: The semiconductor refrigeration chip includes a semiconductor refrigeration chip body, a semiconductor refrigeration chip power supply, and a semiconductor refrigeration chip reversing device. The semiconductor refrigeration chip body is connected to the semiconductor refrigeration chip power supply through the semiconductor refrigeration chip reversing device. The semiconductor refrigeration chip reversing device is configured to control the semiconductor refrigeration chip to face the first end of the heat dissipation air duct to operate in a cooling mode, or to control the semiconductor refrigeration chip to face the first end of the heat dissipation air duct to operate in a heating mode. Controlling the semiconductor refrigeration piece to face the first end of the heat dissipation air duct to operate in a cooling mode includes: Controlling the semiconductor refrigeration chip reversing device to switch the power polarity of the semiconductor refrigeration chip power supply connected to both ends of the semiconductor refrigeration chip body to a first preset polarity; wherein the first preset polarity is that the first power connection end of the semiconductor refrigeration chip body is connected to the positive power supply of the semiconductor refrigeration chip power supply, and the second power connection end of the semiconductor refrigeration chip body is connected to the negative power supply of the semiconductor refrigeration chip power supply; and / or, Controlling the semiconductor refrigeration plate to face the first end of the heat dissipation air duct to operate in a heating mode includes: The semiconductor refrigeration chip reversing device is controlled to switch the power polarity of the semiconductor refrigeration chip power supply connected to the two ends of the semiconductor refrigeration chip body to a second preset polarity; wherein, the second preset polarity is that the first power connection end of the semiconductor refrigeration chip body is connected to the negative power supply of the semiconductor refrigeration chip power supply, and the second power connection end of the semiconductor refrigeration chip body is connected to the positive power supply of the semiconductor refrigeration chip power supply.

8. A control device for a wine cabinet, comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to execute the control method for the wine cabinet according to any one of claims 1 to 7 when running the program instructions.

9. A wine cabinet, characterized in that: include: Wine cabinet body; The control device for a wine cabinet as described in claim 8 is installed on the wine cabinet body.

10. A computer-readable storage medium storing program instructions, characterized in that: When the program instructions are executed, the computer is configured to execute the control method for a wine cabinet according to any one of claims 1 to 7.

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