Industrial computer mainboard testing device

Through the design of fixture components and buffer components, the problems of single fixture specifications and unstable tests in the prior art are solved, and flexible fixation and testing accuracy of motherboards of different specifications are achieved to ensure motherboard integrity and test data accuracy.

CN120540911AInactive Publication Date: 2025-08-26SHENZHEN XINCHEN IND CONTROL CO LTD
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Patent Information

Application Number
CN202510398076.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-01
Publication Date
2025-08-26
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing computer motherboard test fixtures are mostly targeted at one specification, and the fixture needs to be replaced to test motherboards of different specifications. The fixture is strongly rigid and easily damaged the motherboard, and the lack of a buffer mechanism leads to unstable testing, the probe impact force is large, and the test frame is easily offset.

Method used

The fixture assembly can be adjusted by adjusting the fixture specifications. The buffer assembly provides flexible fixation and cushioning, the positioning mechanism and the height adjustment mechanism ensure accurate testing, and the alarm reminds and maintains.

Benefits of technology

It realizes flexible fixation of motherboards of different specifications to avoid damage, accurately test, accurate data, reduce equipment damage, and improve testing efficiency.

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Abstract

The invention relates to the technical field of mainboard testing equipment, and particularly discloses an industrial computer mainboard testing device which comprises a testing machine body, an air cylinder is arranged in an inner cavity of the testing machine body, a piston rod is arranged in an inner cavity of the air cylinder, a connecting frame is fixedly connected to the bottom end of the piston rod, and limiting rods are fixedly connected to the outer surfaces of the two ends of the connecting frame. The specification of the clamp can be adjusted according to the specification of the computer mainboard through the clamp assembly, the mainboard of different sizes can be conveniently limited, meanwhile, the mainboard can be flexibly fixed, the mainboard is prevented from being damaged in the clamping process, buffering can be conducted through the buffering assembly when the mainboard is detected, and the detection efficiency is improved. And meanwhile, when the downward moving distance of the probe is too large, an alarm can be given out, and a worker is reminded that maintenance needs to be carried out in time.
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Description

Technical Field

[0001] The present application relates to the technical field of motherboard testing equipment, and in particular to an industrial computer motherboard testing device. Background Art

[0002] With the rapid development of industrial automation and intelligent manufacturing, the stability and reliability of industrial computer motherboards, as core hardware components, are crucial to the operation of the entire industrial system. Compared to consumer-grade motherboards, industrial computer motherboards offer significant advantages in extreme environmental adaptability, long-term stability, and customization capabilities. Computer motherboards widely used in industrial scenarios require testing before they are put into actual use. Tested motherboards significantly reduce their failure rates, thereby reducing repair and replacement costs caused by hardware failures. Consequently, the requirements for industrial computer motherboard testing technology are becoming increasingly stringent.

[0003] The existing technology still has the following problems: 1. When testing computer motherboards, a suitable fixture should be used. However, existing fixtures are mostly designed for computer motherboards of one specification, so the fixture needs to be replaced when testing motherboards of different specifications. In addition, the existing fixture is too rigid and can easily damage the computer motherboard during the clamping process. In addition, the existing fixture can only limit the motherboard in a single position. When the side of the motherboard is damaged, it is difficult to detect it in time, which affects the subsequent use of the motherboard.

[0004] 2. The existing computer motherboard testing device lacks a corresponding buffer mechanism during testing, resulting in unstable contact between the test probe and the test point on the motherboard. The test probe may generate a large impact force when contacting the test point, causing damage to the probe or the motherboard. In addition, the test frame is prone to offset during long-term use, resulting in inaccurate probe position, which directly leads to unreliable contact between the test point and the probe, causing deviations or errors in the test data. Summary of the Invention

[0005] In order to overcome the shortcomings that the existing fixtures are mostly for computer motherboards of one specification, and thus the fixture needs to be replaced when testing motherboards of different specifications, and the existing fixtures are too rigid, which can easily damage the computer motherboard during the clamping process, in addition, the existing fixtures can only limit the motherboard in a single way, and when the side of the motherboard is damaged, it is difficult to detect it in time, which affects the subsequent use of the motherboard. There is a lack of corresponding buffering mechanism during testing, resulting in unstable contact between the test probe and the test point on the motherboard. The test probe may generate a large impact force when contacting the test point, thereby causing damage to the probe or the motherboard, etc., the purpose of the present invention is to provide an industrial computer motherboard testing device to solve the above-mentioned shortcomings.

[0006] The present application provides an industrial computer motherboard testing device, including a testing machine main body, an inner cavity of the testing machine main body is provided with a cylinder, an inner cavity of the cylinder is provided with a piston rod, the bottom end of the piston rod is fixedly connected to a connecting frame, the outer surfaces of both ends of the connecting frame are fixedly connected to a limit rod, the limit rod and the testing machine main body are slidably connected, a testing frame is provided on the lower surface of the connecting frame, a probe is provided on the lower surface of the test frame, a fixture assembly is provided on the outer surface of the testing machine main body, buffer assemblies are provided on both sides of the fixture assembly, the buffer assembly includes a first buffer mechanism, the first buffer mechanism is fixedly connected to the lower surface of the connecting frame, a second buffer mechanism is provided directly below the first buffer mechanism, an insertion rod is fixedly installed on the lower surface of both ends of the connecting frame, a positioning mechanism is provided on the outer surface of the second buffer mechanism, and the bottom end of the second buffer mechanism is fixedly connected to a height adjustment mechanism.

[0007] Furthermore, the first buffer mechanism includes a first buffer frame, the first buffer frame and the lower surface of the connecting frame are fixedly connected, the inner walls at both ends of the first buffer frame are fixedly connected to the third spring, the end of the third spring away from the inner wall of the first buffer frame is fixedly connected to the first slider, the first slider and the first buffer frame are slidably connected, the side of the first slider away from the third spring is rotatably connected to the connecting bar, the end of the connecting bar away from the first slider is rotatably connected to the connecting rod, and one connecting rod is connected to two connecting bars, the connecting bars are symmetrically distributed about the connecting rod, and the connecting rod is located in the middle of the first buffer frame, the bottom end of the connecting rod is fixedly connected to the second connecting plate, and the two ends of the second connecting plate are rotatably connected to the rotating drum.

[0008] Furthermore, the second buffer mechanism includes a second buffer frame, two ends of the second buffer frame are slidably connected to the first sliding rod, and one end of the second buffer frame has two first sliding rods, one end of the first sliding rod is fixedly installed with a buffer block, and the buffer block has an inclined surface below and toward the middle direction of the second buffer frame, the outer surface of the first sliding rod is sleeved with a fourth spring, the fourth spring is located between the buffer block and the inner wall of the second buffer frame, the outer surface of the second buffer frame is fixedly installed with the first fixed block, the inner wall of the first fixed block is provided with a first button, and the outer surface of the first fixed block is fixedly installed with a first alarm, the first button and the first alarm are electrically connected, and pressing the first button controls the first alarm to sound an alarm, the first button is aligned with a first sliding rod at the upper end, the second connecting plate is located between the buffer blocks at both ends of the second buffer frame, and the rotating drum and the buffer block fit together when the second connecting plate is pressed down.

[0009] Furthermore, the positioning mechanism includes a positioning frame, the middle part of the positioning frame is hollowed out, the outer surface of the positioning frame is provided with a second slide groove, the outer surface of the positioning frame is slidably connected to a floating block, the outer surface of the floating block is fixedly installed with a second slide rod, the outer surface of the second slide rod is sleeved with a gasket, the outer surface of the second slide rod is sleeved with a fifth spring, the fifth spring is located between the floating block and the gasket, the gasket and the inner wall of the positioning frame are slidably connected, the outer surface of the positioning frame is provided with a second button, the outer surface of the positioning frame is fixedly installed with a second alarm, the second button and the second alarm are electrically connected, and pressing the second button controls the second alarm to sound an alarm, when the rod moves downward, it passes through the inner cavity of the floating block, the inner wall of the floating block is recessed downward, and the positioning frame is fixedly connected to the second buffer frame.

[0010] Furthermore, the height adjustment mechanism includes a second fixed block, the inner cavity of the second fixed block is rotatably connected to the third threaded rod, the outer surface of the second fixed block is slidably connected to the second slider, the outer surface of the second slider is fixedly installed with a driving rod, the four corners of the upper surface of the second fixed block are fixedly installed with a storage rod, the inner cavity of the storage rod is slidably connected to the lifting rod, the upper surface of the lifting rod is fixedly connected to the lifting block, and the lower surface of the second fixed block is fixedly installed with a driving block.

[0011] Furthermore, an oblique groove is provided on the outer surface of the driving block, the driving rod and the oblique groove are slidably connected, the third threaded rod and the second slider are connected by threads, the upper surface of the lifting block and the lower surface of the second buffer frame are fixedly connected, and the second fixed block and the outer surface of the testing machine body are fixedly connected.

[0012] Furthermore, the fixture assembly includes a loading plate, and fixed rods are fixedly installed at the four corners of the lower surface of the loading plate, and the fixed rods are fixedly connected to the upper surface of the testing machine body. An adjustment mechanism is provided at the bottom end of the loading plate, and a first sliding groove is provided on the outer surface of the loading plate. There are four first sliding grooves, and the first sliding grooves are evenly distributed vertically. The inner cavity of the first sliding groove is slidably connected to the clamping mechanism.

[0013] Furthermore, the adjustment mechanism includes a first threaded rod, which is rotatably connected to the loading plate, and the two ends of the first threaded rod are threadedly connected to the first adjustment block, and the thread directions at the two ends of the first threaded rod are opposite, the first adjustment block is slidably connected to the first slide groove, and a fixing frame is fixedly installed on the lower surface of the loading plate, the first threaded rod and the fixing frame are vertically distributed, and the inner cavity of the fixing frame is rotatably connected to the second threaded rod, and the two ends of the second threaded rod are threadedly connected to the second adjustment block, and the thread directions at the two ends of the second threaded rod are opposite, and the second adjustment block is slidably connected to the first slide groove.

[0014] Furthermore, the clamping mechanism includes a connecting seat, the inner cavity of the connecting seat is slidably connected to the sliding seat, one end of the sliding seat is provided with a first spring, the end of the first spring away from the sliding seat is fixedly connected to the inner wall of the connecting seat, the inner cavity of the sliding seat is rotatably connected to the pressure wheel, the inner wall of the connecting seat is rotatably connected to the balancing block, the pressure wheel and the balancing block are fitted, the balancing blocks are symmetrically distributed about the pressure wheel, the outer surface of the balancing block is fixedly installed with a splint, the outer surface of the balancing block is fixedly installed with a pointer, the outer surface of the connecting seat is sleeved with the first connecting plate, the outer surface of the connecting seat is fixedly installed with an elastic rod, and the outer surface of the elastic rod is sleeved with the second spring.

[0015] Furthermore, the first connecting plate is fixedly connected to the first adjusting block and the second adjusting block, the pointer is located in the middle part of the outer surface of the connecting seat, the connecting seat and the first connecting plate are slidingly connected, the second spring is located between the connecting seat and the first connecting plate, and the elastic rod and the first connecting plate are slidingly connected.

[0016] The technical solution provided by this application has at least the following technical effects or advantages: 1. The use of the clamp assembly effectively solves the problem of using a suitable clamp when testing a computer motherboard. The existing clamps are mostly for computer motherboards of one specification, so the clamps need to be replaced when testing motherboards of different specifications. In addition, the existing clamps are too rigid and can easily damage the computer motherboard during the clamping process. In addition, the existing clamps can only limit the motherboard in a single way. When the side of the motherboard is damaged, it is difficult to detect it in time, which affects the subsequent use of the motherboard. The present invention can adjust the specifications of the clamp according to the size of the computer motherboard through the clamp assembly, which is convenient for limiting motherboards of different sizes. At the same time, the motherboard can be flexibly fixed to prevent damage to the motherboard during the clamping process. In addition, the integrity of the side of the motherboard can be detected during the detection process to avoid damage to the side of the motherboard, thereby ensuring the integrity of the motherboard during subsequent use.

[0017] 2. The use of the buffer component effectively solves the problem that the existing computer motherboard test device lacks a corresponding buffer mechanism during testing, resulting in unstable contact between the test probe and the test point on the motherboard. The test probe may generate a large impact force when contacting the test point, which may cause damage to the probe or the motherboard. In addition, the test frame is prone to deviation during long-term use, resulting in inaccurate probe position drop, which directly leads to unreliable contact between the test point and the probe, resulting in deviation or error in the test data. The present invention can buffer the motherboard through the buffer component during testing to avoid collision between the motherboard and the test probe. At the same time, when the probe moves down a large distance, an alarm will be issued to remind the staff that timely maintenance is needed. In addition, the test frame can always ensure stable downward movement during the test process, prevent the test frame position from deviating, ensure the test probe position falls accurately, and improve the accuracy of the test data. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of the embodiment of the present application; Figure 2 Schematic diagram of the structure of the clamp assembly in an embodiment of the present application; Figure 3 Schematic diagram of the structure of the adjustment mechanism in the embodiment of the present application; Figure 4 Schematic diagram of the clamping mechanism structure in an embodiment of the present application; Figure 5 This is a schematic cross-sectional view of the connecting seat structure in an embodiment of the present application; Figure 6 Schematic diagram of the structure of the buffer assembly in the embodiment of the present application; Figure 7 Schematic diagram of the rod structure in the embodiment of the present application; Figure 8 This is a schematic structural diagram of the first buffer mechanism in an embodiment of the present application; Figure 9 This is a schematic cross-sectional view of the second buffer frame structure in an embodiment of the present application; Figure 10 Schematic diagram of the positioning mechanism structure in an embodiment of the present application; Figure 11 Schematic diagram of the height adjustment mechanism structure in an embodiment of the present application.

[0019] In the figure: 1. test machine body; 2. connecting frame; 3. limiting rod; 4. test frame; 5. clamp assembly; 51. loading plate; 52. fixing rod; 53. adjusting mechanism; 531. first threaded rod; 532. first adjusting block; 533. fixing frame; 534. second threaded rod; 535. second adjusting block; 54. first slide; 55. clamping mechanism; 551. connecting seat; 552. slide seat; 553. first spring; 554. pressure wheel; 555. balancing block; 556. clamping plate; 557. pointer; 558. first connecting plate; 559. elastic rod; 5510. second spring; 6. buffer assembly; 61. first buffer mechanism; 611. first buffer frame; 612. third spring; 613. first slider; 614. connecting strip; 6 15. Connecting rod; 616. Second connecting plate; 617. Rotating drum; 62. Second buffer mechanism; 621. Second buffer rack; 622. First slide bar; 623. Buffer block; 624. Fourth spring; 625. First fixed block; 626. First button; 627. First alarm; 63. Insert rod; 64. Positioning mechanism; 641. Positioning rack; 642. Second slide groove; 643. Floating block; 644. Second slide bar; 645. Gasket; 646. Fifth spring; 647. Second button; 648. Second alarm; 65. Height adjustment mechanism; 651. Second fixed block; 652. Third threaded rod; 653. Second slider; 654. Driving rod; 655. Storage rod; 656. Lifting rod; 657. Lifting block; 658. Driving block. DETAILED DESCRIPTION

[0020] While existing fixtures are mostly designed for computer motherboards of one specification, the present invention can adjust the specifications of the fixture according to the size of the computer motherboard through the fixture assembly, making it easy to limit motherboards of different sizes. At the same time, the motherboard can be flexibly fixed to prevent damage to the motherboard during the clamping process. For the lack of corresponding buffering mechanism during testing, the present invention can buffer the motherboard during testing through the buffering assembly to avoid collision between the motherboard and the test probe. At the same time, when the probe moves down too far, an alarm will be issued to remind the staff that timely maintenance is required.

[0021] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0022] See also Figure 1As shown, an industrial computer motherboard testing device includes a testing machine body 1, an inner cavity of the testing machine body 1 is provided with a cylinder, the inner cavity of the cylinder is provided with a piston rod, the bottom end of the piston rod is fixedly connected to a connecting frame 2, the outer surfaces of both ends of the connecting frame 2 are fixedly connected to a limiting rod 3, the limiting rod 3 and the testing machine body 1 are slidably connected, the lower surface of the connecting frame 2 is provided with a testing frame 4, the lower surface of the testing frame 4 is provided with a probe, the outer surface of the testing machine body 1 is provided with a clamp assembly 5, and buffer assemblies 6 are provided on both sides of the clamp assembly 5. The motherboard to be tested is placed on the clamp assembly 5 for limiting, and the operation of the cylinder drives the limiting rod 3 to slide in the inner cavity of the testing machine body 1, and the sliding of the limiting rod 3 drives the connecting frame 2 to move downward, and the downward movement of the connecting frame 2 drives the test frame 4 to fit the motherboard on the clamp assembly 5, and the buffer assembly 6 is used to buffer the connecting frame 2 to prevent the test frame 4 from colliding with the motherboard on the clamp assembly 5 when it is pressed down, thereby avoiding damage to the motherboard and the probes on the test frame 4.

[0023] See also Figure 2 and Figure 3 As shown, the clamp assembly 5 includes a loading plate 51, and fixing rods 52 are fixedly installed at the four corners of the lower surface of the loading plate 51. The fixing rods 52 are fixedly connected to the upper surface of the test machine body 1, and an adjustment mechanism 53 is provided at the bottom end of the loading plate 51. A first slide groove 54 is opened on the outer surface of the loading plate 51. There are four first slide grooves 54, and the first slide grooves 54 are evenly vertically distributed. The inner cavity of the first slide groove 54 is slidably connected with a clamping mechanism 55. When the specifications of the motherboard change, the clamping mechanism 55 can be adjusted by adjusting the adjustment mechanism 53 to slide on the first slide groove 54, which is convenient for limiting the motherboard. The clamping mechanism 55 can flexibly limit the motherboard. The industrial computer motherboard is usually square. When the side of the motherboard is damaged, it can be discovered in time, which is convenient for subsequent maintenance. The adjustment mechanism 53 includes a first threaded rod 531, which is rotatably connected to the loading plate 51, and the two ends of the first threaded rod 531 are connected to the first adjustment block 53 by threading. The first adjusting block 532 and the first sliding groove 54 are slidably connected to each other by rotating the first threaded rod 531 and the second threaded rod 534. The first adjusting block 532 and the first sliding groove 54 are slidably connected to each other, and the first adjusting block 532 and the second sliding groove 54 are slidably connected to each other. The movement of the first adjusting block 532 and the second adjusting block 535 drives the clamping mechanism 55 to move, so that the clamping mechanism 55 can be adjusted according to the size of the main board, so as to stabilize the main board between the clamping mechanism 55 and facilitate subsequent detection.

[0024] See also Figure 4 and Figure 5 As shown, the clamping mechanism 55 includes a connecting seat 551, the inner cavity of the connecting seat 551 is slidably connected to a slide 552, one end of the slide 552 is provided with a first spring 553, the end of the first spring 553 away from the slide 552 is fixedly connected to the inner wall of the connecting seat 551, the inner cavity of the slide 552 is rotatably connected to a pressure wheel 554, the inner wall of the connecting seat 551 is rotatably connected to a balance block 555, the pressure wheel 554 and the balance block 555 are fitted together, the balance blocks 555 are symmetrically distributed about the pressure wheel 554, the outer surface of the balance block 555 is fixedly mounted with a splint 556, the outer surface of the balance block 555 A pointer 557 is fixedly installed, a first connecting plate 558 is sleeved on the outer surface of the connecting seat 551, an elastic rod 559 is fixedly installed on the outer surface of the connecting seat 551, a second spring 5510 is sleeved on the outer surface of the elastic rod 559, the first connecting plate 558 is distributed and fixedly connected with the first adjustment block 532 and the second adjustment block 535, the pointer 557 is located in the middle of the outer surface of the connecting seat 551, the connecting seat 551 and the first connecting plate 558 are slidably connected, the second spring 5510 is located between the connecting seat 551 and the first connecting plate 558, the elastic rod 559 and the first connecting plate 558 are slidably connected. Dynamic connection, when the main board is clamped by the clamping mechanism 55, the clamping plate 556 contacts the side of the main board, and the main board is square. When the side of the main board is damaged, the clamping process drives the clamping plate 556 to tilt, and the tilt of the clamping plate 556 drives the balancing block 555 to rotate in the inner cavity of the connecting seat 551. The rotation of the balancing block 555 drives the balancing block 555 to squeeze the pressure wheel 554. At this time, the pressure wheel 554 squeezes the slide 552 so that the slide 552 slides in the inner cavity of the connecting seat 551 to compress the first spring 553. At the same time, the rotation of the balancing block 555 drives the pointer 557 to deviate from the connecting seat 551. The middle part of the motherboard can be judged by the rotation of the pointer 557 to determine the damage to the side of the motherboard, which is convenient for subsequent maintenance. In addition, the clamping mechanism 55 clamps the motherboard with flexibility. When the clamping plate 556 is in vertical contact with the motherboard, the connecting seat 551 slides in the inner cavity of the first connecting plate 558 during the extrusion process. At the same time, the elastic rod 559 slides in the inner cavity of the first connecting plate 558 to drive the second spring 5510 to compress, thereby realizing flexible limitation of the computer motherboard, cooperating with the adjustment of the adjustment mechanism 53, avoiding damage to the motherboard due to excessive rigidity during the clamping process, and preventing unstable clamping due to insufficient clamping force.

[0025] See also Figure 1 and Figure 6As shown, the buffer assembly 6 includes a first buffer mechanism 61, which is fixedly connected to the lower surface of the connecting frame 2, and a second buffer mechanism 62 is arranged directly below the first buffer mechanism 61. Insert rods 63 are fixedly installed on the lower surfaces of both ends of the connecting frame 2, and a positioning mechanism 64 is provided on the outer surface of the second buffer mechanism 62. The bottom end of the second buffer mechanism 62 is fixedly connected with a height adjustment mechanism 65. The first buffer mechanism 61 and the second buffer mechanism 62 are used for buffering when the test frame 4 moves downward, and the insert rod 63 and the positioning mechanism 64 are used for positioning the test frame 4 during the downward movement to prevent the position of the test frame 4 from being inaccurate due to long-term use. The height adjustment mechanism 65 is used to adjust the height of the second buffer mechanism 62 so that the buffering force of the first buffer mechanism 61 and the second buffer mechanism 62 is appropriate to protect the mainboard.

[0026] See also Figure 7 、 Figure 8 and Figure 9As shown, the first buffer mechanism 61 includes a first buffer frame 611, the first buffer frame 611 is fixedly connected to the lower surface of the connecting frame 2, the inner walls of both ends of the first buffer frame 611 are fixedly connected to the third spring 612, the end of the third spring 612 away from the inner wall of the first buffer frame 611 is fixedly connected to the first slider 613, the first slider 613 and the first buffer frame 611 are slidably connected, the side of the first slider 613 away from the third spring 612 is rotatably connected to the connecting bar 614, the end of the connecting bar 614 away from the first slider 613 is rotatably connected to the connecting rod 615, and one connecting rod 615 is connected to two connecting bars 614, the connecting bars 614 are symmetrically distributed about the connecting rod 615, and the connecting rod 615 is located in the middle of the first buffer frame 611, connecting The bottom end of the rod 615 is fixedly connected to the second connecting plate 616, and the two ends of the second connecting plate 616 are rotatably connected to the rotating drum 617. The second buffer mechanism 62 includes a second buffer frame 621, and the two ends of the second buffer frame 621 are slidably connected to the first slide bar 622, and one end of the second buffer frame 621 has two first slide bars 622, and one end of the first slide bar 622 is fixedly installed with a buffer block 623, and the buffer block 623 is inclined on the bottom toward the middle of the second buffer frame 621. The outer surface of the first slide bar 622 is sleeved with a fourth spring 624, and the fourth spring 624 is located between the buffer block 623 and the inner wall of the second buffer frame 621. The outer surface of the second buffer frame 621 is fixedly installed with a first fixed block 625, and the inner wall of the first fixed block 625 is set There is a first button 626, and a first alarm 627 is fixedly installed on the outer surface of the first fixed block 625. The first button 626 and the first alarm 627 are electrically connected. Pressing the first button 626 controls the first alarm 627 to sound an alarm. The first button 626 is aligned with a first slide bar 622 at the upper end. The second connecting plate 616 is located between the buffer blocks 623 at both ends of the second buffer frame 621, and when the second connecting plate 616 is pressed down, the rotating cylinder 617 and the buffer block 623 fit together. When the test frame 4 is pressed down to detect the mainboard, the connecting frame 2 drives the first buffer frame 611 to move downward, that is, drives the first buffer mechanism 61 to move downward as a whole. When reaching a certain position, the rotating cylinder 617 at both ends of the second connecting plate 616 and the inclined surface of the buffer block 623 contact. At this time The second connecting plate 616 and the buffer block 623 are both squeezed. At this time, the second connecting plate 616 squeezes the connecting rod 615 to drive the connecting bar 614 to rotate. The rotation of the connecting bar 614 drives the first slider 613 to slide on the first buffer frame 611. The sliding of the first slider 613 drives the third spring 612 to compress, and at the same time squeezes the buffer block 623 to drive the first slide bar 622 to move in the inner cavity of the second buffer frame 621. The buffer block 623 squeezes the fourth spring 624. At this time, the elastic force of the fourth spring 624 and the elastic force of the third spring 612 play a buffering effect during the contact process between the test frame 4 and the main board. That is, when the object is impacted or moves by external force, the spring will change its shape, thereby absorbing and storing part of the energy, preventing the object from changing too much in an instant.A slow rebound effect is formed. When the pressure is too great, the buffer block 623 drives the first slide bar 622 to squeeze the first button 626 on the first fixed block 625. At this time, the first alarm 627 sounds an alarm, reminding the staff that the downward pressure between the first buffer mechanism 61 and the second buffer mechanism 62 is too great and the height of the second buffer mechanism 62 needs to be adjusted to better protect the mainboard. At the same time, two pairs of buffer blocks 623 are used on a second buffer frame 621. When the first alarm 627 sounds an alarm, the rotating drum 617 passes through the upper buffer block 623 in time, and the lower buffer block 623 blocks the rotating drum 617 and can continue to buffer, thereby improving the actual buffering tolerance of the first buffer mechanism 61 and the second buffer mechanism 62, achieving the effect of buffering first, then alarming, and then buffering, avoiding greater damage to the mainboard and improving the protection effect of the mainboard.

[0027] See also Figure 7 and Figure 10As shown, the positioning mechanism 64 includes a positioning frame 641, the middle part of the positioning frame 641 is hollowed out, so that the insertion rod 63 can pass through the positioning frame 641 when it is squeezed by the floating block 643, the outer surface of the positioning frame 641 is provided with a second sliding groove 642, the outer surface of the positioning frame 641 is slidably connected to the floating block 643, the outer surface of the floating block 643 is fixedly installed with a second sliding rod 644, the outer surface of the second sliding rod 644 is sleeved with a gasket 645, the outer surface of the second sliding rod 644 is sleeved with a fifth spring 646, and the fifth spring The spring 646 is located between the floating block 643 and the gasket 645. The gasket 645 is slidably connected to the inner wall of the positioning frame 641. The outer surface of the positioning frame 641 is provided with a second button 647. The outer surface of the positioning frame 641 is fixedly installed with a second alarm 648. The second button 647 and the second alarm 648 are electrically connected. Pressing the second button 647 controls the second alarm 648 to sound an alarm. When the rod 63 moves downward, it passes through the inner cavity of the floating block 643. The inner wall of the floating block 643 is concave downward. The positioning frame 641 and the second buffer frame 648 are fixedly installed with a second button 647. 21 is fixedly connected. When the connecting frame 2 is pressed down, the insertion rod 63 moves downward, and the insertion rod 63 moves downward and inserts into the inner cavity of the floating block 643. When the position of the test frame 4 is offset, that is, the position of the connecting frame 2 is offset, the position of the insertion rod 63 is offset at this time. When the insertion rod 63 moves downward, it contacts the recessed part of the floating block 643, driving the floating block 643 to slide on the positioning frame 641. At this time, the floating block 643 drives the second slide bar 644 to slide in the inner cavity of the second slide groove 642. The sliding of the floating block 643 drives part of the fifth spring 646 to be squeezed. The gasket 645 is used to protect the fifth spring 646 to prevent the fifth spring 646 from contacting the inner wall of the positioning frame 641 and causing scratches. At this time, the second slide bar 644 squeezes the second button 647 to drive the second alarm 648 to sound an alarm. The positioning mechanism 64 is relatively stable without external force, thereby reminding the staff that the insertion rod 63 is offset relative to the positioning mechanism 64, that is, the test frame 4 is offset, which is convenient for reminding the staff to perform maintenance, ensure the accurate position of the probe on the test frame 4, and improve the accuracy of equipment testing.

[0028] See also Figure 7 and Figure 11As shown, the height adjustment mechanism 65 includes a second fixed block 651, the inner cavity of the second fixed block 651 is rotatably connected to the third threaded rod 652, the outer surface of the second fixed block 651 is slidably connected to the second slider 653, the outer surface of the second slider 653 is fixedly installed with a driving rod 654, the four corners of the upper surface of the second fixed block 651 are fixedly installed with a storage rod 655, the inner cavity of the storage rod 655 is slidably connected to the lifting rod 656, the upper surface of the lifting rod 656 is fixedly connected to the lifting block 657, the lower surface of the second fixed block 651 is fixedly installed with a driving block 658, the outer surface of the driving block 658 is provided with an oblique groove, the driving rod 654 is slidably connected to the oblique groove, the third threaded rod 652 and the second slider 653 are threadedly connected, the upper surface of the lifting block 657 and the second buffer frame 62 1 is fixedly connected to the lower surface of the testing machine body 1, and the second fixed block 651 is fixedly connected to the outer surface of the testing machine body 1. When the height of the second buffer mechanism 62 needs to be adjusted, the second slider 653 is driven to slide on the second fixed block 651 by rotating the third threaded rod 652. The sliding of the second fixed block 651 drives the driving rod 654 to move. The movement of the driving rod 654 drives the driving rod 654 to slide in the inclined groove on the driving block 658. At this time, the height of the driving block 658 changes, that is, the lifting rod 656 slides in the inner cavity of the storage rod 655, thereby driving the height of the lifting block 657 to change. The lifting block 657 drives the height of the second buffer mechanism 62 to change, so that the buffering distance between the first buffer mechanism 61 and the second buffer mechanism 62 changes, thereby improving the protection effect of the mainboard.

[0029] In summary, the motherboard to be tested is placed on the fixture assembly 5 for limiting. The operation of the cylinder drives the limiting rod 3 to slide in the inner cavity of the test machine body 1. The sliding of the limiting rod 3 drives the connecting frame 2 to move downward. The downward movement of the connecting frame 2 drives the test frame 4 to fit the motherboard on the fixture assembly 5. The buffer assembly 6 is used to buffer the connecting frame 2 to prevent the test frame 4 from colliding with the motherboard on the fixture assembly 5 when it is pressed down, thereby avoiding damage to the motherboard and the probes on the test frame 4. When the specifications of the motherboard change, the clamping mechanism 55 can be made to slide on the first slide groove 54 by adjusting the adjustment mechanism 53, which is convenient for adjusting the motherboard. The clamping mechanism 55 can flexibly limit the mainboard. The mainboard of an industrial computer is usually square. When the side of the mainboard is damaged, it can be discovered in time to facilitate subsequent maintenance. The first buffer mechanism 61 and the second buffer mechanism 62 are used to buffer when the test frame 4 moves downward. The insertion rod 63 and the positioning mechanism 64 are used to position the test frame 4 during the downward movement to prevent the position of the test frame 4 from being inaccurate after long-term use. The height adjustment mechanism 65 is used to adjust the height of the second buffer mechanism 62 so that the buffering force of the first buffer mechanism 61 and the second buffer mechanism 62 is appropriate to protect the mainboard.

[0030] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

[0031] The above is only a preferred specific implementation method of the embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and concept of the present application within the technical scope disclosed in the present application, and they should be covered by the scope of protection of the present application.

Claims

1. An industrial computer motherboard testing device, comprising a testing machine body (1), characterized in that: The inner cavity of the test machine body (1) is provided with a cylinder, the inner cavity of the cylinder is provided with a piston rod, the bottom end of the piston rod is fixedly connected to a connecting frame (2), the outer surfaces of both ends of the connecting frame (2) are fixedly connected to limit rods (3), the limit rods (3) and the test machine body (1) are slidably connected, the lower surface of the connecting frame (2) is provided with a test frame (4), the lower surface of the test frame (4) is provided with a probe, the outer surface of the test machine body (1) is provided with a fixture assembly (5), and buffer assemblies (6) are provided on both sides of the fixture assembly (5); The buffer assembly (6) includes a first buffer mechanism (61), the first buffer mechanism (61) is fixedly connected to the lower surface of the connecting frame (2), a second buffer mechanism (62) is provided directly below the first buffer mechanism (61), an insertion rod (63) is fixedly installed on the lower surface of both ends of the connecting frame (2), a positioning mechanism (64) is provided on the outer surface of the second buffer mechanism (62), and a height adjustment mechanism (65) is fixedly connected to the bottom end of the second buffer mechanism (62).

2. An industrial computer motherboard testing device as claimed in claim 1, characterized in that: The first buffer mechanism (61) includes a first buffer frame (611), the first buffer frame (611) is fixedly connected to the lower surface of the connecting frame (2), the inner walls of both ends of the first buffer frame (611) are fixedly connected to third springs (612), the end of the third spring (612) away from the inner wall of the first buffer frame (611) is fixedly connected to a first slider (613), the first slider (613) is slidably connected to the first buffer frame (611), and the side of the first slider (613) away from the third spring (612) is rotationally connected to the first buffer frame (611). A connecting bar (614) is connected, and one end of the connecting bar (614) away from the first slider (613) is rotatably connected to a connecting rod (615), and one connecting rod (615) is connected to two connecting bars (614), and the connecting bars (614) are symmetrically distributed about the connecting rod (615), and the connecting rod (615) is located in the middle of the first buffer frame (611), and the bottom end of the connecting rod (615) is fixedly connected to a second connecting plate (616), and the two ends of the second connecting plate (616) are rotatably connected to a rotating drum (617).

3. An industrial computer motherboard testing device as claimed in claim 2, characterized in that: The second buffer mechanism (62) includes a second buffer frame (621), both ends of the second buffer frame (621) are slidably connected to the first slide bar (622), and one end of the second buffer frame (621) has two first slide bars (622), one end of the first slide bar (622) is fixedly installed with a buffer block (623), the buffer block (623) is inclined on the lower side toward the middle of the second buffer frame (621), the outer surface of the first slide bar (622) is sleeved with a fourth spring (624), the fourth spring (624) is located between the buffer block (623) and the inner wall of the second buffer frame (621), and the outer surface of the second buffer frame (621) is fixedly installed. There is a first fixed block (625), the inner wall of the first fixed block (625) is provided with a first button (626), the outer surface of the first fixed block (625) is fixedly installed with a first alarm (627), the first button (626) and the first alarm (627) are electrically connected, pressing the first button (626) controls the first alarm (627) to sound an alarm, the first button (626) is aligned with a first sliding rod (622) at the upper end, the second connecting plate (616) is located between the buffer blocks (623) at both ends of the second buffer frame (621), and when the second connecting plate (616) is pressed down, the rotating drum (617) and the buffer block (623) are in contact with each other.

4. An industrial computer motherboard testing device as claimed in claim 3, characterized in that: The positioning mechanism (64) includes a positioning frame (641), the middle portion of the positioning frame (641) is hollowed out, the outer surface of the positioning frame (641) is provided with a second sliding groove (642), the outer surface of the positioning frame (641) is slidably connected to a floating block (643), the outer surface of the floating block (643) is fixedly mounted with a second sliding rod (644), the outer surface of the second sliding rod (644) is sleeved with a gasket (645), the outer surface of the second sliding rod (644) is sleeved with a fifth spring (646), and the fifth spring (646) is located between the floating block (643) and the gasket (645). The gasket (645) is slidably connected to the inner wall of the positioning frame (641), the outer surface of the positioning frame (641) is provided with a second button (647), the outer surface of the positioning frame (641) is fixedly mounted with a second alarm (648), the second button (647) and the second alarm (648) are electrically connected, and pressing the second button (647) controls the second alarm (648) to sound an alarm, the insertion rod (63) passes through the inner cavity of the floating block (643) when moving downward, the inner wall of the floating block (643) is recessed downward, and the positioning frame (641) and the second buffer frame (621) are fixedly connected.

5. An industrial computer motherboard testing device as claimed in claim 4, characterized in that: The height adjustment mechanism (65) includes a second fixed block (651), the inner cavity of the second fixed block (651) is rotatably connected to a third threaded rod (652), the outer surface of the second fixed block (651) is slidably connected to a second slider (653), the outer surface of the second slider (653) is fixedly mounted with a driving rod (654), the four corners of the upper surface of the second fixed block (651) are fixedly mounted with a storage rod (655), the inner cavity of the storage rod (655) is slidably connected to a lifting rod (656), the upper surface of the lifting rod (656) is fixedly connected to a lifting block (657), and the lower surface of the second fixed block (651) is fixedly mounted with a driving block (658).

6. An industrial computer motherboard testing device as claimed in claim 5, characterized in that: An outer surface of the driving block (658) is provided with an oblique groove, the driving rod (654) is slidably connected to the oblique groove, the third threaded rod (652) and the second slider (653) are connected by threads, the upper surface of the lifting block (657) and the lower surface of the second buffer frame (621) are fixedly connected, and the second fixed block (651) is fixedly connected to the outer surface of the testing machine body (1).

7. An industrial computer motherboard testing device as claimed in claim 1, characterized in that: The clamp assembly (5) includes a carrier plate (51), and fixed rods (52) are fixedly installed at the four corners of the lower surface of the carrier plate (51). The fixed rods (52) are fixedly connected to the upper surface of the test machine body (1). An adjustment mechanism (53) is provided at the bottom end of the carrier plate (51). The outer surface of the carrier plate (51) is provided with a first slide groove (54), and there are four first slide grooves (54). The first slide grooves (54) are evenly distributed vertically, and the inner cavity of the first slide groove (54) is slidably connected to a clamping mechanism (55).

8. An industrial computer motherboard testing device as claimed in claim 7, characterized in that: The adjusting mechanism (53) includes a first threaded rod (531), the first threaded rod (531) and the loading plate (51) are rotatably connected, the two ends of the first threaded rod (531) are connected to the first adjusting block (532) by threading, and the thread directions of the two ends of the first threaded rod (531) are opposite, the first adjusting block (532) and the first slide groove (54) are slidably connected, a fixing frame (533) is fixedly installed on the lower surface of the loading plate (51), the first threaded rod (531) and the fixing frame (533) are vertically distributed, the inner cavity of the fixing frame (533) is rotatably connected to the second threaded rod (534), the two ends of the second threaded rod (534) are connected to the second adjusting block (535) by threading, and the thread directions of the two ends of the second threaded rod (534) are opposite, and the second adjusting block (535) and the first slide groove (54) are slidably connected.

9. An industrial computer motherboard testing device as claimed in claim 8, characterized in that: The clamping mechanism (55) includes a connecting seat (551), the inner cavity of the connecting seat (551) is slidably connected to a slide seat (552), one end of the slide seat (552) is provided with a first spring (553), the end of the first spring (553) away from the slide seat (552) is fixedly connected to the inner wall of the connecting seat (551), the inner cavity of the slide seat (552) is rotatably connected to a pressure wheel (554), the inner wall of the connecting seat (551) is rotatably connected to a balance block (555), the pressure wheel (554) The balancing block (555) is fitted with the balancing block (555), and the balancing block (555) is symmetrically distributed with respect to the pressure wheel (554). A splint (556) is fixedly mounted on the outer surface of the balancing block (555), a pointer (557) is fixedly mounted on the outer surface of the balancing block (555), a first connecting plate (558) is sleeved on the outer surface of the connecting seat (551), an elastic rod (559) is fixedly mounted on the outer surface of the connecting seat (551), and a second spring (5510) is sleeved on the outer surface of the elastic rod (559).

10. An industrial computer motherboard testing device as claimed in claim 9, characterized in that: The first connecting plate (558) is fixedly connected to the first adjusting block (532) and the second adjusting block (535), the pointer (557) is located in the middle of the outer surface of the connecting seat (551), the connecting seat (551) and the first connecting plate (558) are slidably connected, the second spring (5510) is located between the connecting seat (551) and the first connecting plate (558), and the elastic rod (559) and the first connecting plate (558) are slidably connected.

Citation Information

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