Chip packaging and arranging machine

Abstract

The invention belongs to the field of chip packaging, and particularly relates to a chip arranging machine for chip packaging, which is characterized in that fixed laser is emitted by a positioning laser table, the distance of a wafer table is determined through the reflection of the laser, so that whether the wafer table moves to a specified position is determined, and if deviation exists, the wafer table is regulated and controlled for fine adjustment to ensure that the wafer table moves to a preset position; positioning laser is emitted through a laser emitter, and it is determined that the substrate fixing base is moved to the preset position; then the grabbing suction cup is made to horizontally move to the position above the base plate fixing base, the positioning laser is emitted again, after it is determined that the grabbing suction cup moves to the preset position, the grabbing suction cup is controlled to sink, in the sinking process, the laser emitter adjusts the emitting angle, the positioning laser acts on the top of the grabbing suction cup, and then the grabbing suction cup is driven to move. And the angle is adjusted along with the movement of the grabbing suction cup, the sinking process of the grabbing suction cup is monitored in real time, the stable sinking process of the grabbing suction cup is guaranteed, and the chip can be accurately pressed to the surface of the substrate through the triple determination mode.

Description

Technical Field

[0001] The invention belongs to the field of chip packaging, in particular to a chip packaging arrangement machine. Background Art

[0002] Chip packaging is an important part of semiconductor manufacturing. Its main purpose is to protect the chip, provide mechanical support, realize electrical connection and heat dissipation. A variety of equipment is used in the chip packaging process, mainly including: a dicing machine, which is used to cut the wafer into individual chips; a laminator: which wraps and protects the chip by introducing and curing the packaging material; and a chip arrangement machine: which realizes the frame grabbing, arrangement, preheating and bonding of the chip to the substrate.

[0003] Traditional chip packaging and arranging machines need to perform operations such as wafer transfer, chip grabbing, and chip and substrate alignment and pressing. If there is a slight deviation in each step, it is easy to cause errors in the packaging process and affect the quality of the final product. Traditional positioning methods generally rely on mechanical positioning, which is prone to excessive accumulated deviations after multiple positioning, greatly affecting the final placement of the finished product.

[0004] To this end, the present invention provides a chip packaging and arranging machine. Summary of the Invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a chip packaging and arranging machine described in the present invention includes a base box, a conveyor belt is installed on the top of the base box, the conveyor belt is arranged in a ring shape, and a plurality of substrate fixing seats for placing chip substrates are arranged above the conveyor belt, a grabbing suction cup that can be translated and raised is arranged above the conveyor belt, and a wafer table that can be translated is also arranged above the conveyor belt, and a rotatable fixing groove for placing wafers is opened in the middle of the top surface of the wafer table, and a positioning laser table for positioning the wafer table and the grabbing suction cup is arranged above the grabbing suction cup, the positioning laser table can emit positioning laser, and an electric heating module is arranged inside the conveyor belt.

[0007] The cut wafer is placed on the wafer table, and the wafer is driven by the wafer table to move to the top of the conveyor belt. The bottom of the cut wafer is already adhered with DAF film; DAF film (Die Attach Film) is a high-performance film used for semiconductor packaging and a hot melt adhesive commonly used for semiconductor materials; when the wafer table is moved into position, a fixed laser is emitted by the positioning laser table, and the distance of the wafer table is determined by the reflection of the laser, so as to determine whether it has moved to the specified position. If there is a deviation, the wafer table is adjusted to make fine adjustments to ensure that the wafer table moves to the predetermined position; then the grabbing suction cup is controlled to move to the top of the substrate fixing seat, and the grabbing suction cup is controlled to sink, and the chip formed on the wafer after cutting is adsorbed and grabbed by negative pressure adsorption, and then the grabbing suction cup is moved up and translated; the conveyor belt is operated to continuously transport the wafer. The new substrate holder is used to fix the substrate. The positioning laser is emitted by the positioning laser platform to determine that the substrate holder has moved to the predetermined position; then the grabbing suction cup is moved horizontally to the top of the substrate holder, and the positioning laser is emitted again to determine that the grabbing suction cup has moved to the predetermined position. The grabbing suction cup is controlled to sink, and during the sinking process, the positioning laser platform adjusts the emission angle to allow the positioning laser to act on the top of the grabbing suction cup and adjusts the angle according to the movement of the grabbing suction cup. The sinking process of the grabbing suction cup is monitored in real time to ensure the stable sinking process of the grabbing suction cup. Through this triple determination method, the chip can be accurately pressed onto the substrate. After lamination, since the bottom of the chip has been adhered to the DAF film, and the conveyor belt at this position is equipped with an electric heating module, the electric heating module can heat the substrate holder here, thereby melting the DAF film, allowing the chip and substrate to be bonded and fixed, and at the same time releasing the adsorption and fixation of the grabbing suction cup. After that, the entire substrate holder, substrate and chip are conveyed away by the conveyor belt, and a new substrate holder is moved. In the process of the substrate holder being moved by the conveyor belt, it is positioned by the positioning laser table. When the new substrate holder moves to the bottom of the positioning laser table, the conveyor belt is stopped, and the grabbing suction cup is moved to the top of the wafer table for the new chip. Grabbing work; since the wafer stage has been positioned at this time, in order to ensure the accurate grasping of subsequent chips, the wafer stage can be controlled to translate, and the grasping suction cup still moves to its original position to perform sinking grasping work, so that only the precise translation of the wafer stage needs to be adjusted to ensure that the grasping suction cup can successfully adsorb and grasp the middle of the chip every time; since the wafer is disc-shaped, after the chips within a radius are grasped, the wafer is driven to rotate by the wafer stage, and then the translation work is repeated after each grasping, which can achieve the effect of moving each chip on the disc-shaped wafer to the bottom of the grasping suction cup, thereby ensuring that each chip can be successfully grasped.

[0008] Preferably, the positioning laser table includes four vertically arranged laser emitters, the emitting end of the laser emitter faces downward, and a servo motor for driving the laser emitter to rotate on a vertical plane is installed on the outside of the laser emitter. A series disk is installed between the four laser emitters and the four servo motors. The laser emitter can emit laser downward, and at the same time, a receiving module is provided on the surface of the laser emitter for receiving the emitted laser, thereby completing the laser ranging work. Due to the presence of four laser emitters, the four corners of the substrate fixing seat and the wafer table can be laser positioned, so that more accurate laser ranging positioning work can be performed on both. During the lifting process of the grabbing suction cup, the four laser emitters are first controlled by the servo motor to rotate toward the center, so that the lasers of the four laser emitters are gathered at the bottom to the top of the grabbing suction cup, and the angle of the laser emitter is changed as the grabbing suction cup is lifted and lowered, so that the grabbing suction cup can be positioned in real time to ensure that the grabbing suction cup can accurately fix the chip on the substrate.

[0009] Preferably, an electric slide rail is installed on the top of the tandem disk for driving the tandem disk to move horizontally. The two ends of the tandem disk are respectively located above the wafer table and above the grabbing suction cup. The tandem disk is driven to move horizontally by the electric slide rail. The electric slide rail has two positions that can be reached, one is the pressing position of the chip and the substrate, and the other is directly above the wafer table. When the wafer table moves to the top of the conveyor belt with the wafer for the first time, the positioning laser table is notified to move to the top of the wafer table to position the wafer table. After that, the positioning laser table moves to the pressing position of the chip and the substrate, and performs long-term positioning work on the substrate fixing seat and the grabbing suction cup. The positioning laser table can also be set at both positions. In this way, the positioning laser table is fixed and will not cause errors in its own positioning due to movement. The positioning accuracy can be further improved by increasing the cost.

[0010] Preferably, a moving platform is fixedly connected to the top of the grabbing suction cup, and a lifting platform is installed at both ends of the moving platform. An electric slide rail 2 is installed on the outer side of the lifting platform for driving the lifting platform to move horizontally. The lifting platform is controlled by the electric slide rail 2 to move horizontally, and the moving platform is controlled by the lifting platform to move up and down, thereby realizing the function of driving the grabbing suction cup to move horizontally and up and down.

[0011] Preferably, a vertically arranged receiver is fixed to the top of the movable table, a second reflective disk is fixed to the four corners of the substrate fixing seat, and a first reflective disk is installed on the top surface of the wafer table near the four corners. The receiver can receive part of the laser emitted by the laser transmitter. When the center position of the receiver receives four concentrated laser points, it indicates that the receiver and the grabbing suction cup are in the center position. When the position deviates, the position of the movable table is fine-tuned by the electric slide rail 2 to ensure the accurate position of the grabbing suction cup, thereby ensuring the accurate docking process of the chip and the substrate; and the reflection effect of the first and second reflective disks is much greater than that of the wafer table and the substrate fixing seat, so when the laser of the vertical laser transmitter is irradiated on the first and second reflective disks, it will emit lasers far exceeding other parts. The position of the wafer table and the substrate fixing seat can be determined by the four-point determination method to achieve the positioning effect.

[0012] Preferably, a film row box and a wafer box for protecting the conveyor belt are installed on the top of the base box, and an observation window is installed at the front end of the film row box, and a vertical partition is fixedly connected to the top of the base box, and a horizontal electric slide rail four is fixedly connected to the rear end of the partition, and a vertical electric telescopic rod one is fixedly connected to the movable end of the electric slide rail four, and a mechanical claw is fixedly connected to the bottom of the electric telescopic rod one, so that the conveyor belt, the positioning laser table and the wafer table are covered and protected by the film row box and the wafer box to reduce the influence of the external environment, and the internal working status can be observed from the outside through the observation window; when the substrate and the chip on the substrate fixing seat are cooled and fixed, since the multiple substrate fixing seats are arranged at equal distances, when the conveyor belt stops to wait for the chip and the substrate to be fixed, the bottom of the mechanical claw will also move to the substrate fixing seat, and the mechanical claw can be controlled to sink by the electric telescopic rod to take out only the substrate, and the mechanical claw can be controlled to move outward by the electric slide rail four to fill the new substrate onto the substrate fixing seat, or all the substrate fixing seats can be directly taken out and new substrate fixing seats can be placed at the same time.

[0013] Preferably, a feed window that can be rotated and opened is installed at the front end of the wafer box, a translation rail is installed at the bottom of the wafer table, and an electric slide rail three is installed at the bottom of the translation rail for driving the translation rail to move. The end of the electric slide rail three is flush with the feed window, and the wafer table can be driven to translate along the direction of the conveyor belt through the translation rail. An electric turntable is installed on the bottom surface of the fixed groove. The two cooperate to rotate the wafer and transfer all the chip positions to the bottom of the grabbing suction cup; the wafer table can be controlled to slide out through the electric slide rail three, and at the same time the feed window is opened for loading new wafers.

[0014] Preferably, a groove for fixing the substrate is provided on the top surface of the substrate fixing seat, and a plurality of the substrate fixing seats are arranged in a circular shape and equidistantly on the surface of the conveyor belt. The surface of the conveyor belt is provided with a snap-fit ​​groove for placing the substrate fixing seat. The snap-fit ​​groove allows the substrate fixing seat to be stably placed on the conveyor belt. The drive of the conveyor belt is located at both ends, and the sunken snap-fit ​​groove will not affect the operation of the conveyor belt.

[0015] Preferably, a grabbing platform is fixed on both sides of the substrate fixing seat, the thickness of the grabbing platform is greater than the thickness of the substrate fixing seat, and a negative pressure suction cup is installed in the middle of the ground of the mechanical claw. In order to facilitate the grabbing of the mechanical claw, when the substrate is difficult to grab, the substrate can be adsorbed and grabbed by the negative pressure suction cup at the bottom of the mechanical claw, and the adsorption area needs to avoid the chip.

[0016] Preferably, the middle part of the substrate fixing seat is made of metal, and the bottom of the substrate fixing seat is set in a downward convex shape. An electromagnetic induction coil that can be raised and lowered is installed inside the conveyor belt. The electromagnetic induction coil is located below the grabbing suction cup. The metal substrate fixing seat is induction heated by the electromagnetic induction coil, thereby transferring heat to the substrate and DAF film to make them hot-melt bonded. The liftable setting is designed to ensure that the operation of the conveyor belt is not affected.

[0017] The beneficial effects of the present invention are as follows: 1. The chip packaging arrangement machine described in the present invention emits a fixed laser through a positioning laser table, and determines the distance of the wafer table by the reflection of the laser, so as to determine whether it has moved to the specified position. If there is a deviation, the wafer table is regulated to make fine adjustments to ensure that the wafer table moves to the predetermined position; then the grabbing suction cup is controlled to move to the top of the substrate fixing seat, and the grabbing suction cup is controlled to sink, and the chip formed after cutting on the wafer is adsorbed and grabbed by negative pressure adsorption, and then the grabbing suction cup is moved up and translated; the conveyor belt is operated to continuously transport new substrate fixing seats, which are used to fix the substrate, and the laser is used to emit a laser. The transmitter emits a positioning laser to confirm that the substrate holder has moved to the predetermined position; then the grabbing suction cup is moved horizontally to the top of the substrate holder, and the positioning laser is emitted again to confirm that the grabbing suction cup has moved to the predetermined position. The grabbing suction cup is then controlled to sink, and during the sinking process, the laser transmitter adjusts the emission angle to allow the positioning laser to act on the top of the grabbing suction cup, and adjusts the angle according to the movement of the grabbing suction cup. The sinking process of the grabbing suction cup is monitored in real time to ensure a stable sinking process of the grabbing suction cup. Through this triple determination method, the chip can be accurately pressed onto the surface of the substrate to ensure the quality of the final product.

[0018] 2. In the chip packaging and arranging machine described in the present invention, a laser emitter can emit laser downward, and a receiving module is provided on the surface of the laser emitter for receiving the emitted laser, thereby completing the laser ranging work. Since there are four laser emitters, the four corners of the substrate fixing seat and the wafer table can be laser positioned, so that the laser ranging positioning work of the two can be performed more accurately; and during the lifting process of the grabbing suction cup, the four laser emitters are first controlled by the servo motor to rotate toward the center, so that the lasers of the four laser emitters are converged at the top of the grabbing suction cup at the bottom, and the angle of the laser emitter is changed as the grabbing suction cup is lifted and lowered, so that the grabbing suction cup can be positioned in real time to ensure that the grabbing suction cup can accurately fix the chip on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 It is a perspective view of the present invention; Figure 2 is a perspective view of the base box and conveyor belt of the present invention; Figure 3 is a perspective view of the conveyor belt and wafer table of the present invention; Figure 4 is a perspective view of the partition and conveyor belt of the present invention; Figure 5 is a perspective view of the conveyor belt and mechanical claw of the present invention; Figure 6 It is a three-dimensional diagram of the positioning laser table and the grabbing suction cup of the present invention; Figure 7 is a perspective view of a laser transmitter of the present invention; Figure 8 is a three-dimensional diagram of the wafer stage of the present invention; Figure 9 It is a three-dimensional diagram of the substrate fixing seat of the present invention.

[0021] In the figure: 1. Film arrangement box; 2. Wafer box; 3. Base box; 4. Observation window; 5. Feed window; 6. Electric slide rail 1; 7. Partition; 8. Positioning laser table; 9. Substrate fixing seat; 10. Conveyor belt; 11. Wafer table; 12. Electric slide rail 2; 13. Moving table; 15. Electric slide rail 3; 16. Lifting table; 17. Electric slide rail 4; 18. Electric telescopic rod; 19. Mechanical claw; 20. Grasping suction cup; 21. Receiver; 22. Servo motor; 23. Laser transmitter; 24. Tandem disk; 25. Reflection disk 1; 26. Fixing slot; 27. Grasping table; 28. Reflection disk 2; 29. ​​Translation rail. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] like Figures 1 to 2 As shown, a chip packaging and arranging machine described in an embodiment of the present invention includes a base box 3, a conveyor belt 10 is installed on the top of the base box 3, the conveyor belt 10 is arranged in a ring shape, and a plurality of substrate fixing seats 9 for placing chip substrates are arranged above the conveyor belt 10, and a grabbing suction cup 20 that can be translated and lifted is arranged above the conveyor belt 10, and a wafer table 11 that can be translated is also arranged above the conveyor belt 10, and a rotatable fixing groove 26 for placing wafers is opened in the middle of the top surface of the wafer table 11, and a positioning laser table 8 for positioning the wafer table 11 and the grabbing suction cup 20 is arranged above the grabbing suction cup 20, and the positioning laser table 8 can emit positioning laser, and an electric heating module is arranged inside the conveyor belt 10.

[0024] The cut wafer is placed on the wafer table 11, and the wafer is driven by the wafer table 11 to move to the top of the conveyor belt 10. The bottom of the cut wafer is already adhered with DAF film; DAF film (Die Attach Film) is a high-performance film used for semiconductor packaging and a hot melt adhesive commonly used for semiconductor materials; when the wafer table 11 is moved into position, a fixed laser is emitted by the positioning laser table 8, and the distance of the wafer table 11 is determined by the reflection of the laser, so as to determine whether it has moved to the specified position. If there is a deviation, the wafer table 11 is adjusted to make fine adjustments to ensure that the wafer table 11 moves to the predetermined position; then the grabbing suction cup 20 is controlled to move to the top of the substrate fixing seat 9, and the grabbing suction cup 20 is controlled to sink, and the chip formed after cutting on the wafer is adsorbed and grabbed by negative pressure adsorption, and then grabbed. The suction cup 20 moves up and translates; a new substrate holder 9 is continuously brought in by the operation of the conveyor belt 10. The substrate holder 9 is used to fix the substrate, and the positioning laser platform 8 emits a positioning laser to determine that the substrate holder 9 has moved to the predetermined position; then the grabbing suction cup 20 is translated to the top of the substrate holder 9, and the positioning laser is emitted again to determine that the grabbing suction cup 20 has moved to the predetermined position, and then the grabbing suction cup 20 is controlled to sink. During the sinking process, the positioning laser platform 8 adjusts the emission angle, allowing the positioning laser to act on the top of the grabbing suction cup 20 and adjusts the angle as the grabbing suction cup 20 moves, in real time. The sinking process of the grabbing suction cup 20 is monitored to ensure the stable sinking process of the grabbing suction cup 20. Through this triple determination method, the chip can be accurately pressed onto the surface of the substrate. After pressing, since the bottom of the chip has been adhered to the DAF film, and the conveyor belt 10 at this position is provided with an electric heating module, the electric heating module can heat the substrate fixing seat 9 here, thereby melting the DAF film, allowing the chip and the substrate to be bonded and fixed, and at the same time releasing the adsorption and fixation of the grabbing suction cup 20, and then the entire substrate fixing seat 9, substrate and chip are conveyed away by the conveyor belt 10, and a new substrate fixing seat 9 is moved to the conveyor belt. During the movement of the substrate holder 9 driven by the conveyor 10, the positioning is performed by the positioning laser table 8. When the new substrate holder 9 moves to the bottom of the positioning laser table 8, the conveyor 10 stops, and the grabbing suction cup 20 moves to the top of the wafer table 11 to grab a new chip. Since the wafer table 11 has been positioned at this time, in order to ensure the accurate grabbing of the subsequent chips, the wafer table 11 can be controlled to move horizontally, while the grabbing suction cup 20 still moves to the original position to perform the sinking grabbing work. In this way, it is only necessary to adjust the precise translation of the wafer table 11 to ensure that the grabbing suction cup 20 can successfully adsorb and grab the middle of the chip every time.Since the wafer is disc-shaped, once all chips within a radius have been captured, the wafer stage 11 rotates the wafer, and the translation operation is repeated after each capture. This allows each chip on the disc-shaped wafer to be moved under the capture suction cup 20, ensuring that each chip can be captured successfully.

[0025] The positioning laser platform 8 includes four vertically arranged laser emitters 23, the emission end of the laser emitter 23 is downward, and the outer side of the laser emitter 23 is installed with a servo motor 22 for driving the laser emitter 23 to rotate on a vertical plane. A series disk 24 is installed between the four laser emitters 23 and the four servo motors 22. When working, the laser emitter 23 can emit laser downward. At the same time, a receiving module is provided on the surface of the laser emitter 23 for receiving the emitted laser, thereby completing the work of laser ranging. Due to the presence of four laser emitters The four laser emitters 23 are controlled by the servo motor 22 to rotate toward the center during the lifting of the grabbing sucker 20, so that the lasers of the four laser emitters 23 are collected at the bottom and on the top of the grabbing sucker 20, and the angles of the laser emitters 23 are changed as the grabbing sucker 20 is lifted and lowered, so that the grabbing sucker 20 can be positioned in real time to ensure that the grabbing sucker 20 can accurately fix the chip on the substrate.

[0026] The top of the serial disk 24 is equipped with an electric slide 6 for driving the serial disk 24 to move horizontally. The two ends of the serial disk 24 are respectively located above the wafer table 11 and above the grabbing suction cup 20. When working, the serial disk 24 is driven by the electric slide 6 to move horizontally. The electric slide 6 has only two positions that can be reached, one is the pressing position of the chip and the substrate, and the other is directly above the wafer table 11. When the wafer table 11 moves to the top of the conveyor belt 10 with the wafer for the first time, the positioning laser table 8 is notified to move to the top of the wafer table 11 to position the wafer table 11. After that, the positioning laser table 8 moves to the pressing position of the chip and the substrate, and performs long-term positioning work on the substrate fixing seat 9 and the grabbing suction cup 20. The positioning laser table 8 can also be set at both positions. In this way, the positioning laser table 8 is fixed and will not cause errors in its own positioning due to movement. The positioning accuracy can be further improved by increasing the cost.

[0027] The top of the grabbing suction cup 20 is fixedly connected to a moving platform 13, and lifting platforms 16 are installed at both ends of the moving platform 13. The outer side of the lifting platform 16 is installed with an electric slide rail 2 12 for driving the lifting platform 16 to move horizontally. When working, the lifting platform 16 is controlled by the electric slide rail 2 12 to move horizontally, and the moving platform 13 is controlled by the lifting platform 16 to move up and down, thereby realizing the function of driving the grabbing suction cup 20 to move horizontally and up and down.

[0028] A vertically arranged receiver 21 is fixed to the top of the movable platform 13, and a second reflective disk 28 is fixed to the four corners of the substrate fixing seat 9. A first reflective disk 25 is installed on the top surface of the wafer table 11 near the four corners. When working, the receiver 21 can receive part of the laser emitted by the laser emitter 23. When the center position of the receiver 21 receives four concentrated laser points, it indicates that the receiver 21 and the grabbing suction cup 20 are in the center position. When the position deviates, the position of the movable platform 13 is fine-tuned by the electric slide rail 2 12 to ensure the accurate position of the grabbing suction cup 20, thereby ensuring the accurate docking process between the chip and the substrate; and the reflection effect of the first reflective disk 25 and the second reflective disk 28 is much greater than that of the wafer table 11 and the substrate fixing seat 9. Therefore, when the laser of the vertical laser emitter 23 is irradiated on the first reflective disk 25 and the second reflective disk 28, it will emit laser light far exceeding other parts. Through the four-point determination method, the position of the wafer table 11 and the substrate fixing seat 9 can be determined to achieve the positioning effect.

[0029] The top of the base box 1 is equipped with a film row box 1 and a wafer box 2 for protecting the conveyor belt 10. The front end of the film row box 1 is equipped with an observation window 4. The top of the base box 3 is fixed with a vertical partition 7. The rear end of the partition 7 is fixed with a horizontal electric slide rail 4 17. The moving end of the electric slide rail 4 17 is fixed with a vertical electric telescopic rod 18. The bottom of the electric telescopic rod 18 is fixed with a mechanical claw 19. When working, the conveyor belt 10, the positioning laser table 8 and the wafer table 11 are covered and protected by the film row box 1 and the wafer box 2 to reduce the influence of the external environment. The observation window 4 can observe the internal working status from the outside; when the substrate and chip on the substrate fixing seat 9 are cooled and fixed, since multiple substrate fixing seats 9 are arranged at equal distances, when the conveyor belt 10 stops to wait for the chip and substrate to be fixed, the bottom of the mechanical claw 19 will also move to the substrate fixing seat 9. The mechanical claw 19 is controlled to sink by the electric telescopic rod 18, and only the substrate can be taken out, and the mechanical claw 19 is controlled to move outward by the electric slide rail four 17, and a new substrate is filled into the substrate fixing seat 9, or all the substrate fixing seats 9 can be directly taken out and a new substrate fixing seat 9 is placed at the same time.

[0030] The front end of the wafer box 2 is equipped with a feed window 5 that can be rotated and opened, and the bottom of the wafer table 11 is equipped with a translation rail 29. The bottom of the translation rail 29 is equipped with an electric slide rail 3 15 for driving the translation rail 29 to move. The end of the electric slide rail 3 15 is flush with the feed window 5. During operation, the wafer table 11 can be driven to translate along the direction of the conveyor belt 10 through the translation rail 29. The bottom surface of the fixed groove 26 is equipped with an electric turntable. The two cooperate to rotate the wafer and transfer all the chip positions to the bottom of the grab suction cup 20; the electric slide rail 3 15 can control the wafer table 11 to slide outward, and at the same time, the feed window 5 is opened for loading new wafers.

[0031] The top surface of the substrate fixing seat 9 is provided with a groove for fixing the substrate. Multiple substrate fixing seats 9 are arranged in a circular shape and at equal intervals on the surface of the conveyor belt 10. The surface of the conveyor belt 10 is provided with a snap-fitting groove for placing the substrate fixing seat 9. When working, the snap-fitting groove allows the substrate fixing seat 9 to be stably placed on the conveyor belt 10. The drive of the conveyor belt 10 is located at both ends, and the sunken snap-fitting groove will not affect the operation of the conveyor belt 10.

[0032] A grabbing platform 27 is fixedly connected to both sides of the substrate fixing seat 9. The thickness of the grabbing platform 27 is greater than that of the substrate fixing seat 9. A negative pressure suction cup is installed in the middle of the ground of the mechanical claw 19. When working, the grabbing platform 27 is used to facilitate the grabbing of the mechanical claw 19. When the substrate is difficult to grab, the negative pressure suction cup at the bottom of the mechanical claw 19 can be used to adsorb and grab the substrate, and the adsorption area needs to avoid the chip.

[0033] The middle part of the substrate fixing seat 9 is made of metal, and the bottom of the substrate fixing seat 9 is set in a downward convex shape. An electromagnetic induction coil that can be lifted and lowered is installed inside the conveyor belt 10. The electromagnetic induction coil is located below the grabbing suction cup 20. When working, the electromagnetic induction coil induction heats the metal substrate fixing seat 9, thereby transferring heat to the substrate and the DAF film, causing them to be hot-melt bonded. The liftable setting is to ensure that the operation of the conveyor belt 10 is not affected.

[0034] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging and arranging machine, characterized in that: It includes a base box, a conveyor belt is installed on the top of the base box, the conveyor belt is arranged in a ring shape, a plurality of substrate fixing seats for placing chip substrates are arranged above the conveyor belt, a grabbing suction cup that can be translated and lifted is arranged above the conveyor belt, a wafer table that can be translated is also arranged above the conveyor belt, a rotatable fixing groove for placing wafers is opened in the middle of the top surface of the wafer table, a positioning laser table for positioning the wafer table and the grabbing suction cup is arranged above the grabbing suction cup, the positioning laser table can emit positioning laser, and an electric heating module is arranged inside the conveyor belt.

2. The chip packaging and arranging machine according to claim 1, characterized in that: The positioning laser platform includes four vertically arranged laser emitters, with the emitting ends of the laser emitters facing downward. A servo motor is installed on the outside of the laser emitter to drive the laser emitter to rotate on a vertical plane. A series disk is installed between the four laser emitters and the four servo motors.

3. The chip packaging and arranging machine according to claim 2, characterized in that: An electric slide rail is installed on the top of the tandem tray for driving the tandem tray to move horizontally. The two ends of the tandem tray are respectively located above the wafer table and above the grabbing suction cup.

4. The chip packaging and arranging machine according to claim 3, characterized in that: A moving platform is fixedly connected to the top of the grabbing suction cup, and lifting platforms are installed at both ends of the moving platform. An electric slide rail 2 for driving the lifting platform to move horizontally is installed on the outer side of the lifting platform.

5. The chip packaging and arranging machine according to claim 4, characterized in that: A vertically arranged receiver is fixedly connected to the top of the moving platform, a second reflective disk is fixedly connected to the four corners of the substrate fixing seat, and a first reflective disk is installed on the top surface of the wafer table near the four corners.

6. The chip packaging and arranging machine according to claim 5, characterized in that: The top of the base box is equipped with a film row box and a wafer box for protecting the conveyor belt, the front end of the film row box is equipped with an observation window, the top of the base box is fixed with a vertical partition, the rear end of the partition is fixed with a horizontal electric slide rail four, the moving end of the electric slide rail four is fixed with a vertical electric telescopic rod one, and the bottom of the electric telescopic rod one is fixed with a mechanical claw.

7. The chip packaging and arranging machine according to claim 6, characterized in that: The front end of the wafer box is equipped with a feed window that can be rotated to open, the bottom of the wafer table is equipped with a translation rail, the bottom of the translation rail is equipped with an electric slide rail three for driving the translation rail to move, and the end of the electric slide rail three is flush with the feed window.

8. The chip packaging and arranging machine according to claim 7, characterized in that: The top surface of the substrate fixing seat is provided with a groove for fixing the substrate. A plurality of substrate fixing seats are arranged in a circular shape and at equal intervals on the surface of the conveyor belt. The surface of the conveyor belt is provided with a clamping groove for placing the substrate fixing seats.

9. The chip packaging and arranging machine according to claim 8, characterized in that: Both sides of the substrate fixing seat are fixedly connected with a grabbing platform, the thickness of the grabbing platform is greater than the thickness of the substrate fixing seat, and a negative pressure suction cup is installed in the middle of the ground of the mechanical claw.

10. The chip packaging and arranging machine according to claim 9, characterized in that: The middle part of the substrate fixing seat is made of metal, the bottom of the substrate fixing seat is set in a downward convex shape, and an electromagnetic induction coil capable of lifting and lowering is installed inside the conveyor belt, and the electromagnetic induction coil is located below the grabbing suction cup.

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