Chip packaging and arranging machine

Abstract

The application belongs to the field of chip packaging, and particularly relates to a chip packaging chip arranging machine. Fixed laser is emitted by a positioning laser table, and the distance of a wafer table is determined through the reflection of the laser, so that whether to move to a specified position is determined. If there is deviation, the wafer table is adjusted to ensure that the wafer table moves to the predetermined position. Positioning laser is emitted by a laser emitter to determine that the substrate fixing seat has moved to the predetermined position. Then the grabbing suction cup is translated to the top of the substrate fixing seat, the positioning laser is emitted again to determine that the grabbing suction cup has moved to the predetermined position, the grabbing suction cup is controlled to sink, and in the sinking process, the laser emitter adjusts the emission angle to make the positioning laser act on the top of the grabbing suction cup and adjust the angle following the movement of the grabbing suction cup. The sinking process of the grabbing suction cup is monitored in real time to ensure the stable sinking process of the grabbing suction cup. Through the three determination modes, the chip can be accurately pressed to the surface of the substrate.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of chip packaging, and particularly relates to a chip packaging and arranging machine. BACKGROUND

[0002] Chip packaging is an important link of semiconductor manufacturing, and main purposes are to protect chips, provide mechanical support, realize electrical connection and heat dissipation and the like.

[0003] A plurality of devices are used in the chip packaging process, mainly including a dicing machine for cutting a wafer into single chips, a plastic packaging machine for wrapping and protecting chips by introducing and solidifying packaging materials, and a chip arranging machine for realizing frame grabbing, chip arranging, preheating and bonding of chips to a substrate.

[0004] The traditional chip packaging and arranging machine needs to transfer a wafer, grab a chip, align and press the chip and a substrate and the like, and each operation step is prone to cause packaging process failure and affect final product quality if there is a slight deviation, and the traditional positioning method generally uses mechanical positioning, which is prone to cause large deviation accumulation after multiple positioning operations, and greatly affects final product placement.

[0005] Therefore, the application provides a chip packaging and arranging machine. SUMMARY

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem in the background art.

[0007] The technical scheme adopted by the application to solve the technical problem is that the chip packaging and arranging machine comprises a base box, a conveying belt is arranged on the top of the base box, the conveying belt is arranged in a ring shape, a plurality of substrate fixing seats for placing chip substrates are arranged above the conveying belt, a grabbing suction cup capable of moving horizontally and vertically is arranged above the conveying belt, a wafer table capable of moving horizontally is further arranged above the conveying belt, a fixed groove capable of rotating and used for placing a wafer is arranged in the middle of the top surface of the wafer table, a positioning laser table used for positioning the wafer table and the grabbing suction cup is arranged above the grabbing suction cup, the positioning laser table can emit positioning laser, and an electric heating module is arranged in the conveying belt.

[0008] The cut wafer is placed above the wafer table, and the wafer table drives the wafer to move above the conveying belt. The bottom of the cut wafer is already attached with a DAF film. The DAF film (Die Attach Film) is a high-performance film used for semiconductor packaging and is a hot melt adhesive commonly used for semiconductor materials. When the wafer table moves into position, a fixed laser is emitted by the positioning laser table, and the distance of the wafer table is determined by the reflection of the laser, so as to determine whether it has moved to the specified position. If there is an error, the wafer table is adjusted for fine tuning to ensure that it moves to the predetermined position. Then the grabbing suction cup is controlled to move above the substrate fixing seat, and the grabbing suction cup is controlled to sink. The cut chips on the wafer are sucked and grabbed by negative pressure adsorption. Then the grabbing suction cup moves up and translates. The conveying belt operates continuously to bring new substrate fixing seats. The substrate fixing seat is used to fix the substrate. The positioning laser is emitted by the positioning laser table to determine that the substrate fixing seat has moved to the predetermined position. Then the grabbing suction cup is translated above the substrate fixing seat, and the positioning laser is emitted again to determine that the grabbing suction cup has moved to the predetermined position. The grabbing suction cup is controlled to sink, and the positioning laser table adjusts the emission angle during the sinking process. The positioning laser acts on the top of the grabbing suction cup and adjusts the angle following the movement of the grabbing suction cup. The sinking process of the grabbing suction cup is monitored in real time to ensure a stable sinking process of the grabbing suction cup. Through the three determination methods, the chip can be accurately pressed onto the surface of the substrate. After pressing, the bottom of the chip is already attached with the DAF film, and the conveying belt inside the position is provided with an electric heating module. The electric heating module can heat the substrate fixing seat at this position to heat the DAF film and bond the chip and the substrate. At the same time, the suction and fixation of the grabbing suction cup are released. Then the whole substrate fixing seat, the substrate and the chip are conveyed away by the conveying belt, and a new substrate fixing seat is moved. During the movement of the substrate fixing seat driven by the conveying belt, the positioning laser table is used for positioning. When the new substrate fixing seat moves directly below the positioning laser table, the conveying belt stops, and the grabbing suction cup moves above the wafer table for new chip grabbing work. Since the wafer table has been positioned, in order to ensure accurate grabbing of the subsequent chips, the wafer table can be controlled to translate, and the grabbing suction cup still moves to the original position for sinking and grabbing work. In this way, only the accurate translation of the wafer table needs to be adjusted to ensure that the grabbing suction cup can successfully suck and grab the middle part of the chip each time. Since the wafer is disc-shaped, when the chips within a radius range are grabbed, the wafer is rotated by the wafer table. Then the translation work is repeated after each grabbing to move each chip on the disc-shaped wafer below the grabbing suction cup, so that each chip can be successfully grabbed.

[0009] Preferably, the positioning laser platform comprises four vertically arranged laser emitters, the emitting ends of the laser emitters face downward, the outer sides of the laser emitters are provided with servo motors for driving the laser emitters to rotate in the vertical plane, a series disc is arranged between the four laser emitters and the four servo motors, the laser emitters can emit laser downward, the surfaces of the laser emitters are provided with receiving modules for receiving the emitted laser, thereby completing the laser ranging work, since there are four laser emitters, the four corners of the substrate fixing seat and the wafer table can be positioned by laser, thereby the laser ranging and positioning work of the two can be more accurate; and during the lifting of the grabbing suction cup, the four laser emitters are first controlled by the servo motors to rotate towards the center, so that the laser of the four laser emitters converges at the top of the grabbing suction cup at the bottom, and the angle of the laser emitter changes with the lifting of the grabbing suction cup, so that the grabbing suction cup can be positioned in real time, and the grabbing suction cup can accurately fix the chip on the substrate.

[0010] Preferably, the top of the series disc is provided with an electric sliding rail one for driving the series disc to translate, the two ends of the series disc are located above the wafer table and above the grabbing suction cup respectively, the series disc is driven by the electric sliding rail one to move horizontally, the electric sliding rail one only has two reachable positions, one is the pressing position of the chip and the substrate, and the other is directly above the wafer table, when the wafer table moves above the conveying belt for the first time, the positioning laser platform is informed to move above the wafer table to position the wafer table, then the positioning laser platform moves to the pressing position of the chip and the substrate to perform long-term positioning work on the substrate fixing seat and the grabbing suction cup; the positioning laser platform can also be arranged at both positions, so that the positioning laser platform is fixedly arranged and will not cause positioning error due to movement, the positioning accuracy is further improved by increasing the cost.

[0011] Preferably, the top of the grabbing suction cup is fixedly connected with a moving table, the two ends of the moving table are provided with lifting tables, the outer sides of the lifting tables are provided with electric sliding rails two for driving the lifting tables to translate, the lifting tables are controlled by the electric sliding rails two to move horizontally, and the moving table is controlled by the lifting tables to lift, thereby achieving the functions of driving the grabbing suction cup to translate and lift.

[0012] Preferably, the top of the mobile station is fixed with a vertically arranged receiver, the four corners of the base plate fixing seat are fixed with reflecting disc two, the top surface of the wafer table is installed with reflecting disc one at the four corners, the receiver can receive part of the laser emitted by the laser emitter, when the center position of the receiver receives four collected laser points, it indicates that the receiver and the grabbing suction cup are in the correct position, when the position deviates, the position of the mobile station is fine-tuned through the electric sliding rail two, to ensure the accurate position of the grabbing suction cup, thereby ensuring the accurate docking process of the chip and the base plate; the reflecting effect of reflecting disc one and reflecting disc two is much greater than that of the wafer table and the base plate fixing seat, so the laser of the vertically arranged laser emitter will emit much more laser than other parts when it irradiates reflecting disc one and reflecting disc two, and the position of the wafer table and the base plate fixing seat can be determined through the four-point determination method to complete the positioning effect.

[0013] Preferably, the top of the base box is installed with a slice arranging box and a wafer box for protecting the conveying belt, the front end of the slice arranging box is installed with an observation window, the top of the base box is fixed with a vertically arranged partition plate, the rear end of the partition plate is fixed with a horizontally arranged electric sliding rail four, the moving end of the electric sliding rail four is fixed with a vertically arranged electric telescopic rod one, and the bottom of the electric telescopic rod one is fixed with a mechanical claw. The conveying belt, the positioning laser table and the wafer table are protected by the slice arranging box and the wafer box, the influence of the external environment is reduced, and the internal working state can be observed from the outside through the observation window; after the base plate on the base plate fixing seat is cooled and fixed with the chip, since the plurality of base plate fixing seats are arranged at equal intervals, when the conveying belt stops to wait for the chip to be fixed with the base plate, the mechanical claw below will also move to the base plate fixing seat, the mechanical claw can be controlled to sink by the electric telescopic rod, the base plate can be taken out outward, the mechanical claw can be controlled to move outward by the electric sliding rail four, and a new base plate can be filled on the base plate fixing seat, or all the base plate fixing seats can be taken out outward at the same time and a new base plate fixing seat can be placed.

[0014] Preferably, the front end of the wafer box is installed with an inlet window capable of being opened by rotation, the bottom of the wafer table is installed with a translation rail, the bottom of the translation rail is installed with an electric sliding rail three for driving the translation rail to move, and the end of the electric sliding rail three is flush with the inlet window. The wafer table can be translated along the direction of the conveying belt through the translation rail, the bottom surface of the fixed groove is installed with an electric turntable, and the two can cooperate to rotate the wafer and move all the chip positions to the lower side of the grabbing suction cup; the wafer table can be controlled to slide outwards through the electric sliding rail three, and the inlet window is opened at the same time for filling a new wafer.

[0015] Preferably, the top surface of the substrate fixing seat is provided with a groove for fixing the substrate, and a plurality of substrate fixing seats are arranged in a ring shape at equal intervals on the surface of the conveying belt, the surface of the conveying belt is provided with a clamping groove for placing the substrate fixing seat, the clamping groove allows the substrate fixing seat to be stably placed on the conveying belt, and the driving of the conveying belt is located at both ends, and the sunken clamping groove does not affect the operation of the conveying belt.

[0016] Preferably, the two sides of the substrate fixing seat are fixedly connected with grabbing tables, the thickness of the grabbing table is greater than that of the substrate fixing seat, and a negative pressure suction cup is installed in the ground middle part of the mechanical claw, the grabbing table is convenient for the grabbing of the mechanical claw, and when the substrate is difficult to grab, the substrate can be adsorbed and grabbed through the negative pressure suction cup at the bottom of the mechanical claw, and the adsorption position needs to avoid the chip.

[0017] Preferably, the middle part of the substrate fixing seat is made of metal material, the bottom of the substrate fixing seat is provided in a downward protruding shape, the inside of the conveying belt is provided with an electromagnetic induction coil capable of lifting, and the electromagnetic induction coil is located below the grabbing suction cup. The electromagnetic induction coil is used for inductive heating of the metal material of the substrate fixing seat, so as to transfer heat to the substrate and the DAF adhesive film, and the heat fusion bonding can be realized. The lifting setting is used to ensure that the operation of the conveying belt is not affected.

[0018] The beneficial effects of the present application are as follows:

[0019] 1. The chip packaging and arranging machine provided by the present application emits fixed laser through the positioning laser table, determines the distance of the wafer table through the reflection of the laser, and determines whether to move to the specified position. If there is deviation, the wafer table is adjusted to ensure that the wafer table moves to the predetermined position. Then the grabbing suction cup is controlled to move above the substrate fixing seat, and the grabbing suction cup is controlled to sink, so that the chips formed after cutting on the wafer are adsorbed and grabbed by the negative pressure adsorption. Then the grabbing suction cup moves up and translates. New substrate fixing seats are continuously transported by the conveying belt. The substrate fixing seat is used for fixing the substrate. The positioning laser is emitted by the laser emitter to determine that the substrate fixing seat has moved to the predetermined position. Then the grabbing suction cup is translated above the substrate fixing seat, the positioning laser is emitted again, and after the grabbing suction cup moves to the predetermined position, the grabbing suction cup is controlled to sink. During the sinking process, the laser emitter adjusts the emission angle, so that the positioning laser acts on the top of the grabbing suction cup and adjusts the angle following the movement of the grabbing suction cup. The sinking process of the grabbing suction cup is monitored in real time to ensure the stable sinking process of the grabbing suction cup. Through the three determination methods, the chips can be accurately pressed onto the surface of the substrate to ensure the quality of the finished product.

[0020] 2. The chip packaging row machine of the application, the laser emitter can emit laser downward, and the surface of the laser emitter is provided with a receiving module for receiving the emitted laser, thereby completing the laser ranging work, since there are four laser emitters, the four corners of the substrate fixing seat and the wafer table can be positioned by laser, thereby the laser ranging and positioning work of the two can be more accurate; and during the lifting process of the grabbing suction cup, the four laser emitters are first rotated to the center by the servo motor control, the laser of the four laser emitters is collected at the top of the grabbing suction cup at the bottom, and the angle of the laser emitter is changed with the lifting of the grabbing suction cup, so that the grabbing suction cup can be positioned in real time, and the grabbing suction cup can accurately fix the chip on the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0021] The application will be further described below in combination with the drawings.

[0022] Figure 1 is a perspective view of the application;

[0023] Figure 2 is a perspective view of the base box and the conveying belt of the application;

[0024] Figure 3 is a perspective view of the conveying belt and the wafer table of the application;

[0025] Figure 4 is a perspective view of the partition plate and the conveying belt of the application;

[0026] Figure 5 is a perspective view of the conveying belt and the mechanical claw of the application;

[0027] Figure 6 is a perspective view of the positioning laser table and the grabbing suction cup of the application;

[0028] Figure 7 is a perspective view of the laser emitter of the application;

[0029] Figure 8 is a perspective view of the wafer table of the application;

[0030] Figure 9 is a perspective view of the substrate fixing seat of the application.

[0031] In the diagram: 1. Wafer tray; 2. Wafer box; 3. Base box; 4. Observation window; 5. Feed window; 6. Electric slide rail one; 7. Partition; 8. Positioning laser stage; 9. Substrate holder; 10. Conveyor belt; 11. Wafer stage; 12. Electric slide rail two; 13. Moving stage; 15. Electric slide rail three; 16. Lifting platform; 17. Electric slide rail four; 18. Electric telescopic rod; 19. Mechanical gripper; 20. Gripping suction cup; 21. Receiver; 22. Servo motor; 23. Laser emitter; 24. Series plate; 25. Reflector plate one; 26. Fixing slot; 27. Gripping stage; 28. Reflector plate two; 29. ​​Translation rail. Detailed Implementation

[0032] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0033] like Figures 1 to 2 As shown in the figure, a chip packaging stacking machine according to an embodiment of the present invention includes a base box 3. A conveyor belt 10 is installed on the top of the base box 3. The conveyor belt 10 is arranged in a ring. A plurality of substrate fixing seats 9 for placing chip substrates are arranged above the conveyor belt 10. A gripping suction cup 20 capable of translation and lifting is arranged above the conveyor belt 10. A wafer stage 11 capable of translation is also arranged above the conveyor belt 10. A rotatable fixing groove 26 for placing wafers is opened in the middle of the top surface of the wafer stage 11. A positioning laser stage 8 for positioning the wafer stage 11 and the gripping suction cup 20 is arranged above the gripping suction cup 20. The positioning laser stage 8 can emit positioning lasers. An electrothermal module is arranged inside the conveyor belt 10.

[0034] The wafer after cutting is placed above the wafer table 11, and the wafer table 11 drives the wafer to move above the conveying belt 10, and the bottom of the wafer after cutting has been attached with the DAF adhesive film; the DAF adhesive film (Die Attach Film, wafer bonding film) is a high-performance adhesive film used for semiconductor packaging, and is a hot melt adhesive commonly used for semiconductor materials; after the wafer table 11 moves to the position, a fixed laser is emitted by the positioning laser table 8, and the distance of the wafer table 11 is determined through the reflection of the laser, so as to determine whether it has moved to the specified position, if there is deviation, the wafer table 11 is adjusted and controlled for fine adjustment, so as to ensure that the wafer table 11 moves to the predetermined position; then the grabbing suction cup 20 is controlled to move above the substrate fixing seat 9, the grabbing suction cup 20 is controlled to sink, the chips formed after cutting on the wafer are sucked and grabbed by the negative pressure adsorption, then the grabbing suction cup 20 moves up and translates; the conveying belt 10 operates to continuously transport new substrate fixing seats 9, the substrate fixing seat 9 is used to fix the substrate, the positioning laser emitted by the positioning laser table 8 determines that the substrate fixing seat 9 has moved to the predetermined position; then the grabbing suction cup 20 is translated above the substrate fixing seat 9, the positioning laser is emitted again, and after the grabbing suction cup 20 moves to the predetermined position, the grabbing suction cup 20 is controlled to sink, and in the sinking process, the positioning laser table 8 adjusts the emission angle, so that the positioning laser acts on the top of the grabbing suction cup 20 and adjusts the angle following the movement of the grabbing suction cup 20, the sinking process of the grabbing suction cup 20 is monitored in real time, so as to ensure the stable sinking process of the grabbing suction cup 20, and through the three determination methods, the chip can be accurately pressed and combined to the surface of the substrate; after pressing, since the bottom of the chip has been attached with the DAF adhesive film, and the conveying belt 10 inside the position is provided with an electric heating module, the electric heating module can heat the substrate fixing seat 9 at the position, so as to heat the DAF adhesive film and bond and fix the chip and the substrate, and at the same time, the suction and fixation of the grabbing suction cup 20 is released, then the whole substrate fixing seat 9, the substrate and the chip are conveyed away by the conveying belt 10, and a new substrate fixing seat 9 is moved, in the movement process of the substrate fixing seat 9 driven by the conveying belt 10, the positioning is performed by the positioning laser table 8, and when the new substrate fixing seat 9 moves to the position directly below the positioning laser table 8, the conveying belt 10 is stopped, and at the same time, the grabbing suction cup 20 moves above the wafer table 11 to perform new chip grabbing work; since the wafer table 11 has been positioned, in order to ensure the accurate grabbing of the subsequent chip, the wafer table 11 can be controlled to translate, and the grabbing suction cup 20 still moves to the original position to perform sinking and grabbing work, so that only the accurate translation of the wafer table 11 can ensure that the grabbing suction cup 20 can successfully suck and grab the middle part of the chip each time.Since the wafer is discoid, when the chips in a radius range are finished being grabbed, the wafer is rotated by the wafer table 11, and then the translation work is repeated after each grabbing, so that the effect that each chip on the discoid wafer is moved to the position below the grabbing suction plate 20 is achieved, thereby ensuring that each chip can be successfully grabbed.

[0035] The positioning laser table 8 comprises four vertically arranged laser emitters 23, the emitting ends of the laser emitters 23 are downward, the outer sides of the laser emitters 23 are provided with servo motors 22 for driving the laser emitters 23 to rotate in the vertical plane, a series disc 24 is arranged between the four laser emitters 23 and the four servo motors 22, in work, the laser emitters 23 can emit laser downward, and the surfaces of the laser emitters 23 are provided with receiving modules for receiving the emitted laser, thereby completing the laser ranging work, since there are four laser emitters 23, the four corners of the substrate fixing seat 9 and the wafer table 11 can be positioned by laser, thereby the laser ranging and positioning work of the two can be more accurate; and in the lifting process of the grabbing suction plate 20, the four laser emitters 23 are first controlled by the servo motors 22 to rotate to the center, so that the laser of the four laser emitters 23 is collected at the top of the grabbing suction plate 20 at the bottom, and the angle of the laser emitter 23 is changed with the lifting of the grabbing suction plate 20, so that the grabbing suction plate 20 can be positioned in real time, and it is ensured that the grabbing suction plate 20 can accurately fix the chip on the substrate.

[0036] The top of the series disc 24 is provided with an electric sliding rail one 6 for driving the series disc 24 to translate, the two ends of the series disc 24 are located above the wafer table 11 and above the grabbing suction plate 20 respectively, in work, the series disc 24 is driven by the electric sliding rail one 6 to move horizontally, the electric sliding rail one 6 only has two reachable positions, one is the pressing position of the chip and the substrate, and the other is directly above the wafer table 11, when the wafer table 11 moves to above the conveying belt 10 for the first time with the wafer, the positioning laser table 8 is informed to move to above the wafer table 11 to position the wafer table 11, then the positioning laser table 8 moves to the pressing position of the chip and the substrate to perform long-term positioning work on the substrate fixing seat 9 and the grabbing suction plate 20; or the positioning laser table 8 can be arranged at both positions, so that the positioning laser table 8 is fixedly arranged and will not cause positioning error due to movement, the positioning accuracy is further improved by increasing the cost.

[0037] The top of the grabbing suction cup 20 is fixedly connected with a moving table 13, both ends of the moving table 13 are installed with lifting tables 16, the outer side of the lifting table 16 is installed with electric sliding rails two 12 for driving the lifting table 16 to translate, in operation, the lifting table 16 is controlled to move horizontally by the electric sliding rails two 12, the moving table 13 is controlled to lift by the lifting table 16, so as to realize the functions of driving the grabbing suction cup 20 to translate and lift.

[0038] The top of the moving table 13 is fixedly connected with a vertically arranged receiver 21, the four corners of the substrate fixing seat 9 are fixedly connected with reflecting discs two 28, the top surface of the wafer table 11 is installed with reflecting discs one 25 at four corners, in operation, the receiver 21 can receive the laser emitted by part of the laser emitter 23, when the center position of the receiver 21 receives four collected laser points, it indicates that the receiver 21 and the grabbing suction cup 20 are in the central position, when the position deviates, the position of the moving table 13 is fine-tuned by the electric sliding rails two 12, so as to ensure the position of the grabbing suction cup 20 is accurate, thereby ensuring the accurate butt joint process of the chip and the substrate; the reflecting effect of the reflecting disc one 25 and the reflecting disc two 28 is much larger than that of the wafer table 11 and the substrate fixing seat 9, so the laser of the vertically arranged laser emitter 23 will emit much more laser than other parts when it irradiates the reflecting disc one 25 and the reflecting disc two 28, through the four-point determination method, the positions of the wafer table 11 and the substrate fixing seat 9 can be determined, thereby completing the positioning effect.

[0039] The top of the base box 1 is installed with a chip arranging box 1 and a wafer box 2 for protecting the conveying belt 10, the front end of the chip arranging box 1 is installed with an observation window 4, the top of the base box 3 is fixedly connected with a vertically arranged partition plate 7, the rear end of the partition plate 7 is fixedly connected with a horizontally arranged electric sliding rail four 17, the moving end of the electric sliding rail four 17 is fixedly connected with a vertically arranged electric telescopic rod one 18, the bottom of the electric telescopic rod one 18 is fixedly connected with a mechanical claw 19, in operation, the conveying belt 10, the positioning laser table 8 and the wafer table 11 are protected by the chip arranging box 1 and the wafer box 2, the influence of the external environment is reduced, the internal working state can be observed from the outside through the observation window 4; when the substrate on the substrate fixing seat 9 is cooled and fixed with the chip, since the plurality of substrate fixing seats 9 are equidistantly arranged, when the conveying belt 10 stops to wait for the chip to be fixed with the substrate, the mechanical claw 19 below will also move to the substrate fixing seat 9, the mechanical claw 19 is controlled to sink by the electric telescopic rod 18, only the substrate can be taken out, the mechanical claw 19 is controlled to move outward by the electric sliding rail four 17, and the new substrate can be filled on the substrate fixing seat 9, or all the substrate fixing seats 9 can be taken out at the same time, and the new substrate fixing seat 9 can be placed.

[0040] The front end of the wafer box 2 is provided with an inlet window 5 capable of being opened by rotation, the bottom of the wafer table 11 is provided with a translation rail 29, the bottom of the translation rail 29 is provided with an electric sliding rail three 15 for driving the translation rail 29 to move, the end of the electric sliding rail three 15 is flush with the inlet window 5, and in operation, the wafer table 11 can be translated along the direction of the conveying belt 10 through the translation rail 29, the bottom surface of the fixed groove 26 is provided with an electric turntable, and the two can cooperate to rotate the wafer and move all the chip positions to the lower side of the grabbing suction cup 20; the wafer table 11 can be controlled to slide outwards through the electric sliding rail three 15, and at the same time, the inlet window 5 is opened for filling new wafers.

[0041] The top surface of the substrate fixing seat 9 is provided with a recess for fixing the substrate, a plurality of substrate fixing seats 9 are arranged in a ring shape at equal intervals on the surface of the conveying belt 10, and the surface of the conveying belt 10 is provided with a clamping groove for placing the substrate fixing seat 9, and in operation, the clamping groove allows the substrate fixing seat 9 to be stably placed on the conveying belt 10, and the driving of the conveying belt 10 is located at both ends, and the sunken clamping groove does not affect the operation of the conveying belt 10.

[0042] The two sides of the substrate fixing seat 9 are fixedly connected with grabbing tables 27, the thickness of the grabbing table 27 is greater than that of the substrate fixing seat 9, and the ground middle part of the mechanical claw 19 is provided with a negative pressure suction cup, and in operation, the grabbing table 27 facilitates the grabbing of the mechanical claw 19, and when the substrate is difficult to grab, the substrate can be grabbed by the negative pressure suction cup at the bottom of the mechanical claw 19, and the suction position needs to avoid the chip.

[0043] The middle part of the substrate fixing seat 9 is made of metal, the bottom of the substrate fixing seat 9 is provided in a downward protruding manner, the inside of the conveying belt 10 is provided with an electromagnetic induction coil capable of lifting, the electromagnetic induction coil is located below the grabbing suction cup 20, and in operation, the metal substrate fixing seat 9 is inductively heated by the electromagnetic induction coil, so as to transfer heat to the substrate and the DAF adhesive film, so as to heat and fuse and bond, and the lifting arrangement is to ensure that the operation of the conveying belt 10 is not affected.

[0044] The above shows and describes the basic principles, main features and advantages of the present application. It should be understood by those skilled in the art that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application, and various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip packaging and stacking machine, characterized in that: The device includes a base box, on the top of which is mounted a conveyor belt arranged in a ring. Above the conveyor belt are multiple substrate holders for placing chip substrates. Above the conveyor belt are gripping suction cups capable of translation and lifting. Above the conveyor belt is also a wafer stage capable of translation. The wafer stage has a rotatable fixing groove in the center of its top surface for placing wafers. Above the gripping suction cups is a positioning laser stage for positioning the wafer stage and gripping suction cups. The positioning laser stage can emit positioning lasers. An electrothermal module is installed inside the conveyor belt.

2. The chip packaging and stacking machine according to claim 1, characterized in that: The positioning laser stage includes four vertically arranged laser emitters with their emitting ends facing downwards. A servo motor is installed on the outside of each laser emitter to drive it to rotate in a vertical plane. A series disk is installed between the four laser emitters and the four servo motors.

3. The chip packaging and stacking machine according to claim 2, characterized in that: The top of the serial disk is equipped with an electric slide rail for moving the serial disk horizontally. The two ends of the serial disk are located above the wafer stage and above the gripping suction cup, respectively.

4. A chip packaging stacking machine according to claim 3, characterized in that: A movable platform is fixed to the top of the gripping suction cup, and lifting platforms are installed at both ends of the movable platform. An electric slide rail is installed on the outer side of the lifting platform to drive the lifting platform to move horizontally.

5. A chip packaging stacking machine according to claim 4, characterized in that: A vertically mounted receiver is fixed to the top of the moving stage, and reflective disks are fixed to the four corners of the substrate fixing base. Reflective disks are mounted on the top surface of the wafer stage near the four corners.

6. A chip packaging stacking machine according to claim 5, characterized in that: The top of the base box is equipped with a wafer rack and a wafer box for protecting the conveyor belt. The front end of the wafer rack is equipped with an observation window. A vertically arranged partition is fixed to the top of the base box. A horizontally arranged electric slide rail is fixed to the rear end of the partition. A vertically arranged electric telescopic rod is fixed to the moving end of the electric slide rail. A mechanical claw is fixed to the bottom of the electric telescopic rod.

7. A chip packaging stacking machine according to claim 6, characterized in that: The front end of the wafer box is equipped with a feed window that can be rotated and opened. The bottom of the wafer stage is equipped with a translation rail. The bottom of the translation rail is equipped with an electric slide rail three for moving the translation rail. The end of the electric slide rail three is flush with the feed window.

8. A chip packaging stacking machine according to claim 7, characterized in that: The top surface of the substrate holder has a groove for fixing the substrate, and multiple substrate holders are arranged in a ring at equal intervals on the surface of the conveyor belt. The surface of the conveyor belt has a locking groove for placing the substrate holders.

9. A chip packaging stacking machine according to claim 8, characterized in that: Both sides of the substrate fixing base are fixed with gripping platforms, the thickness of which is greater than the thickness of the substrate fixing base, and a negative pressure suction cup is installed in the middle of the ground of the mechanical claw.

10. A chip packaging stacking machine according to claim 9, characterized in that: The middle part of the substrate holder is made of metal, and the bottom of the substrate holder is convex downward. An electromagnetic induction coil capable of lifting and lowering is installed inside the conveyor belt, and the electromagnetic induction coil is located below the gripping suction cup.

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