Method for manufacturing electronic device

Abstract

The invention discloses a method for manufacturing an electronic device. The method comprises the following steps: providing a substrate; a plurality of electronic units are provided. Each of the plurality of electronic units has a chip and at least one bonding terminal. And bonding each of the plurality of electronic units on the substrate through at least one bonding terminal. An adhesive material is applied to a space between the chip and the substrate and a gap between two adjacent electronic units. And then the adhesive material is removed in a regional manner.

Description

[0001] This application is a divisional application of the invention patent application with the application date of September 22, 2021, application number 202111108666.5, and invention name “Method of manufacturing an electronic device”. Technical Field

[0002] The present invention relates to a method for manufacturing an electronic device, and in particular to a method for manufacturing an electronic device by applying an adhesive material in a space between a chip and a substrate. Background Art

[0003] With technological advancements and increasing user demands, electronic devices made with microelectronic units are becoming increasingly commonplace. To increase the yield rate of these devices, developing devices with a robust bond between the microelectronic unit and the substrate is a key issue for manufacturers. Summary of the Invention

[0004] In view of this, it is desirable to increase the yield rate of electronic devices to facilitate innovation in electronic devices. For example, improved reinforcement methods can be provided between microelectronic units and substrates.

[0005] Some embodiments of the present invention provide a method for manufacturing an electronic device. First, a substrate is provided, followed by a plurality of electronic units. Each of the plurality of electronic units comprises a chip and at least one bonding terminal. Each of the plurality of electronic units is bonded to the substrate via the at least one bonding terminal. Adhesive material is applied to the space between the chip and the substrate, and to the gaps between two adjacent electronic units. The adhesive material is then removed regionally.

[0006] Some embodiments of the present invention provide a method for manufacturing an electronic device. First, a substrate including a pixel definition layer is provided. An electronic unit having a chip and at least one bonding terminal is provided. The electronic unit is bonded to the substrate via the at least one bonding terminal, such that the electronic unit is positioned adjacent to the pixel definition layer. An adhesive material is applied to the space between the chip and the substrate and to a gap between the electronic unit and the pixel definition layer. The adhesive material is then removed regionally.

[0007] According to an embodiment of the present invention, a method for manufacturing an electronic device improves the strength between a microelectronic unit and a substrate by applying an adhesive material to the space between the chip and the substrate. This improves the quality of the microelectronic unit in the electronic device, thereby facilitating technological advancement and innovation in electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figures 1 to 4 FIG. 1 is a flow chart of a first embodiment of a method for manufacturing an electronic device according to the present invention, which shows a cross-sectional view of the electronic device.

[0009] Figure 3A The method for manufacturing an electronic device according to the present invention corresponds to Figure 3 , which is a schematic diagram of a cross-sectional view of an electronic device.

[0010] Figures 5 to 8 FIG. 1 is a flow chart of a second embodiment of a method for manufacturing an electronic device according to the present invention, which shows a cross-sectional view of the electronic device.

[0011] Figures 9 and 10 FIG. 1 is a flow chart of a third embodiment of a method for manufacturing an electronic device according to the present invention, which shows a cross-sectional view of the electronic device.

[0012] Figures 11 to 12 FIG. 4 is a flow chart of a fourth embodiment of a method for manufacturing an electronic device according to the present invention, which shows a cross-sectional view of the electronic device.

[0013] Figure 13 FIG. 1 is a flow chart of a fifth embodiment of a method for manufacturing an electronic device according to the present invention, which shows a cross-sectional view of the electronic device.

[0014] Explanation of the reference numerals: 100A-electronic device; 100B-electronic device; 100C-electronic device; 101A-electronic device; 101B-electronic device; 101C-electronic device; 110-substrate; 111-bonding pad; 112-bonding pad; 113-bonding pad; 114-bonding pad; 115-bonding pad; 116-bonding pad; 121-electronic unit; 121A-bonding terminal; 121B-bonding terminal; 121C-chip; 121S-space; 121T-top surface; 122-electronic unit; 122A-bonding terminal; 122B-bonding terminal; 122C-chip; 122S-space; 122T-top surface; 123-electronic unit; 123A-bonding terminal; 123B-bonding terminal; 123C-chip; 123S-space; 123T-top Surface; 130-adhesive material; 130A-adhesive material; 130S-top surface; 131-sheet; 135A-part; 135B-part; 135C-part; 135D-part; 135E-part; 135F-part; 135G-part; 135H-part; 135I-part; 140-inkjet machine; 141-nozzle; 151-pixel definition layer; 151S- Top surface; 152-pixel defining layer; 152S-top surface; 153-pixel defining layer; 153S-top surface; 154-pixel defining layer; 154S-top surface; 160-optical substrate; 161A-light conversion layer; 161B-light conversion layer; 161C-light conversion layer; 162A-color filter layer; 162B-color filter layer; 162C-color filter layer; 163-blocking layer. DETAILED DESCRIPTION

[0015] The present invention will be described in detail below with reference to specific embodiments and accompanying drawings. To make the present invention more clear and understandable, the following drawings may be simplified schematic diagrams, and the elements shown may not be drawn to scale. Furthermore, the numbers and sizes of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0016] Throughout this specification and the appended claims, certain terms are used to refer to specific components. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names, and this document does not intend to distinguish between components that have the same function but are named differently. When the terms "comprise," "include," and / or "have" are used in this specification, they specify the presence of the stated features, regions, steps, operations, and / or elements, but do not preclude the presence or addition of one or more other features, regions, steps, operations, elements, and / or combinations thereof.

[0017] When an element, such as a layer or region, is referred to as being "on" or extending "onto" another element (or variations thereof), it can be directly on or directly extend onto the other element, or intervening elements may be present. On the other hand, when an element is referred to as being "directly on" or extending "directly" onto another element (or variations thereof), there are no intervening elements. Also, when an element is referred to as being "coupled" to another element (or variations thereof), it can be directly connected to the other element or indirectly connected (e.g., electrically connected) to the other element through one or more elements.

[0018] The terms "about," "equal to," "equal," or "same," "substantially," or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0019] The use of ordinal numbers such as "first" and "second" in the specification and claims to modify an element does not, by itself, imply or indicate any prior ordinal number for the element (or elements), nor does it indicate the order of one element relative to another or the order of manufacturing methods. The use of ordinal numbers is solely to distinguish one element from another with the same name. The claims and the specification may not use the same terminology; thus, the first element in the specification may be the second element in the claims.

[0020] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present invention.

[0021] Figures 1 to 4 1 is a flow chart of a first embodiment of a method for manufacturing an electronic device according to the present invention, which depicts a schematic cross-sectional view of the electronic device. The electronic device of the present invention may include, but is not limited to, a display device, a backlight device, an antenna device, a sensing device, or a splicing device. The electronic device may be a bendable or flexible electronic device. The display device may be a non-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device. The sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound, but is not limited to these. The electronic unit may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light-emitting diode or a photodiode. The light-emitting diode may include, but is not limited to, an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot light-emitting diode (quantum dot LED). The splicing device may be, but is not limited to, a display splicing device or an antenna splicing device. It should be noted that the electronic device can be any of the aforementioned arrangements and combinations, but is not limited thereto. The following text will use a display device as an electronic device to illustrate the present invention, but the present invention is not limited thereto.

[0022] First, if Figure 1 As shown, a substrate 110 is provided. The substrate 110 can be a transparent or opaque organic material or an inorganic material, or a hard material or a flexible material. For example, the substrate may include polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other known suitable materials, or a combination thereof, but the present invention is not limited thereto. The substrate 110 may also be a hard material, such as glass, sapphire, ceramic, or plastic, or any suitable material. As needed, the substrate 110 may include various components for electronic devices, such as conductive lines (not shown), polysilicon (not shown), bonding pads 111, bonding pads 112, bonding pads 113, bonding pads 114, bonding pads 115, bonding pads 116, a source (not shown), a drain (not shown), a common electrode (not shown), a pixel definition layer (not shown), or a limitation layer (not shown), but the present invention is not limited thereto.

[0023] Next, a plurality of electronic units are provided, such as electronic unit 121 , electronic unit 122 , and electronic unit 123 . Figure 1The illustrated substrate 110 has three electronic units, but the present invention is not limited thereto. Each electronic unit may have a chip and at least one bonding terminal. For example, the electronic unit 121 may have a chip 121C and at least one bonding terminal. Figure 1 The electronic unit 121 is shown as having two bonding terminals (bonding terminal 121A and bonding terminal 121B) as an example, but the present invention is not limited thereto. Similarly, the electronic unit 122 may include a chip 122C and two bonding terminals 122A / bonding terminals 122B, and the electronic unit 123 may include a chip 123C and two bonding terminals 123A / bonding terminals 123B, but the present invention is not limited thereto.

[0024] Each of the multiple electronic units can be bonded to the substrate 110 via the bonding terminals it has. For example, the electronic unit 121 can be bonded to the corresponding bonding pad 111 / bonding pad 112 of the substrate 110 via the bonding terminals 121A / bonding terminals 121B, respectively; the electronic unit 122 can be bonded to the bonding pad 113 / bonding pad 114 of the substrate 110 via the bonding terminals 122A / bonding terminals 122B, respectively; the electronic unit 123 can be bonded to the bonding pad 115 / bonding pad 116 of the substrate 110 via the bonding terminals 123A / bonding terminals 123B, respectively, but the present invention is not limited thereto. The electronic units can be physically and electrically connected to the bonding pads of the substrate 110 via the bonding terminals. In some embodiments, the bonding terminals of each electronic unit can be bonded to the bonding pads of the substrate 110 by solder, but the present invention is not limited thereto. Alternatively, in some embodiments, the bonding terminals of each electronic unit and the bonding pads of the substrate 110 may be directly bonded together by metal diffusion (eg, Cu-Cu bonding), but the present invention is not limited thereto.

[0025] like Figure 1In the substrate structure shown, each chip (e.g., chip 121C of electronic unit 121, chip 122C of electronic unit 122, or chip 123C of electronic unit 123) may have a space between it and substrate 110. For example, space 121S between chip 121C and substrate 110, space 122S between chip 122C and substrate 110, or space 123S between chip 123C and substrate 110, but the present invention is not limited thereto. In some embodiments, the space between the chip of the electronic unit and the substrate may not be large. For example, the spacing between the chip of the electronic unit and the substrate may be approximately the sum of the height (thickness) of the bonding pad and the bonding terminal. This spacing may be less than or equal to 3 microns (≤3μm), but the present invention is not limited thereto. In existing technologies, if the space between the chip of the electronic unit and the substrate is relatively small, it may affect the caulking property of the adhesive material. If the gap-filling property of the adhesive material is poor, it may be detrimental to the strength between the electronic unit and the substrate. The present invention provides a method for improving the robustness between an electronic unit and a substrate, which will be further described below.

[0026] According to the present invention, each electronic unit may include, for example, (but not limited to), a micro-LED. Each micro-LED may be used to define a sub-pixel, or may be considered a sub-pixel, and generate light of a predetermined wavelength. For example, each electronic unit may correspond to a red pixel, a green pixel, a blue pixel, a white pixel, or other colors, wavelengths, or combinations thereof, but the present invention is not limited thereto. Figure 1 The electronic unit 121 may be one of red pixels, green pixels, blue pixels, and white pixels; the electronic unit 122 may be one of red pixels, green pixels, blue pixels, and white pixels; and the electronic unit 123 may be one of red pixels, green pixels, blue pixels, and white pixels, but the present invention is not limited thereto.

[0027] After the electronic units are bonded to the substrate 110 , an adhesive material may be applied to each space between each chip and the substrate 110 . Figure 1The liquid adhesive material 130 is shown to be applied by an inkjet printing method, but the present invention is not limited thereto. In a variant embodiment, the method of applying the liquid adhesive material 130 may also include coating, screen printing or other suitable known processes, and the above processes can be applied to other embodiments of the present invention for applying the adhesive material 130, which will not be described in detail later. The method proposed in the present invention is beneficial to increasing the gap-filling ability of the adhesive material 130, thereby facilitating the strong bond between each electronic unit and the substrate 110. The adhesive material 130 can be a resin with high light transmittance. For example, the light transmittance of the adhesive material 130 can be greater than or equal to 95% (light transmittance ≥ 95%), but the present invention is not limited thereto. In other words, the transmittance of the adhesive material 130 for light with a wavelength of 380nm to 780nm is greater than or equal to 95%. Alternatively, the transmittance of the adhesive material 130 for light with a wavelength of 550nm is greater than or equal to 95%. The material of the adhesive material 130 can be acrylic, silicone, silicon or epoxy resin, but the present invention is not limited thereto. The adhesive material 130 can have a suitable viscosity at room temperature, for example, in the range of 1cP to 500cP, in the range of 1cP to 100cP, or in the range of 1cP to 50cP, but the present invention is not limited thereto. The adhesive material 130 can change its viscosity after being heated. For example, the viscosity of the adhesive material 130 can be adjusted by heating, for example, between 8cP and 12cP. The viscosity of the adhesive material 130 can be adjusted to match the size of the nozzle 141 of the inkjet machine 140, so that the adhesive material 130 can be appropriately applied to each space between each chip and the substrate 110. The droplet size of the droplet-shaped adhesive material 130 can be less than or equal to 30 microns (≤30μm).

[0028] Since the adhesive material 130 can be a liquid with appropriate viscosity, after the adhesive material 130 is applied by the inkjet printing method, the droplet-shaped adhesive material 130 can slowly fill the space 121S, the space 122S and the space 123S through natural capillary phenomena or gravity. For example, the adhesive material 130 can fill the space 121S, the space 122S and the space 123S. In addition, the adhesive material 130 can also be filled in the gaps between the electronic units 121, the electronic units 122 and the electronic units 123, or the adhesive material 130 may also be retained on the top surface of the electronic unit, for example, the adhesive material 130 may be retained on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122 or the top surface 123T of the electronic unit 123. When the adhesive material 130 fills the gaps between adjacent electronic units, the top surface of the electronic unit may be higher than the top surface 130S of the adhesive material 130 (shown in FIG. 1 ). Figure 2 ). Figure 2After the adhesive material is applied by inkjet printing, the adhesive material 130 fills the space between the chip and the substrate 110 and fills the gaps between the electronic units. It may also remain on the top surface of the electronic units, for example, on the Figure 2 The adhesive material 130 in the form of a droplet can be deposited on the top surface 121T of the electronic unit 121. Optionally, the adhesive material 130 can be assisted by external vacuum or pressure to facilitate the adhesive material 130 to fill the space and gap.

[0029] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. Figure 3 The adhesive material is applied by inkjet printing to fill the space between the chip and the substrate 110, fill the gaps between the electronic units, and cover the top surface of the electronic units, which can be regarded as a packaging structure. Figure 1 The nozzle 141 of the inkjet machine 140 shown applies an amount of adhesive material 130 so that the adhesive material 130 can fill the space 121S, the space 122S and the space 123S, can fill the gaps between the electronic units 121, the electronic units 122 and the electronic units 123, and further cover the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122 or the top surface 123T of the electronic unit 123. In some embodiments, the top surface 130S of the adhesive material 130 can be higher than the top surface of the electronic unit. Since the top surface of the electronic unit can generally be regarded as the light-emitting surface, in order to reduce the light loss caused by the adhesive material 130 covering the top surface, it is preferred to select an adhesive material with a transmittance greater than or equal to 95% in this embodiment, but this is not a limitation. If the inkjet printing method applies a smaller amount of adhesive material, that corresponds to Figure 2 The illustrated embodiment.

[0030] In some embodiments, if the adhesive material 130 covers the top surface of the electronic unit, a post-process step may be performed as needed. Figure 4The structure after post-processing steps is shown. The top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, forming a coplanar structure. Optionally, the post-processing step may be a surface leveling method. Optionally, post-processing steps, such as chemical etching, mechanical polishing, or plasma treatment, may be performed to lower the top surface 130S of the adhesive material 130 so that the top surface 130S of the adhesive material 130 is substantially (or almost) close to the top surface of the electronic unit, or so that the top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, forming a coplanar structure, thereby exposing the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123.

[0031] In some embodiments, a curing step may be performed on the adhesive material 130. The curing step may be performed appropriately, such as by irradiation with light, heating, or a combination of both, based on the curing conditions of various adhesive materials 130. The cured adhesive material 130 can secure the electronic unit to the substrate, thereby strengthening the bonding strength between the electronic unit and the substrate. Figure 2 The electronic device 100A is shown to include a cured adhesive material 130 , and the top surface 130S may be lower than the top surface of the electronic unit. Figure 3 The electronic device 100B is shown to include a cured adhesive material 130 , and the top surface 130S may be higher than the top surface of the electronic unit. Figure 4 The electronic device 100C is shown to include the cured adhesive material 130 , and the top surface 130S and the top surface of the electronic unit can form a coplanar structure.

[0032] Figure 3A The method for manufacturing an electronic device according to the present invention corresponds to Figure 3 , which illustrates a cross-sectional view of an electronic device. Furthermore, after the adhesive material 130 undergoes a curing step, another adhesive material 130A, such as an optically clear resin (OCR), can be optionally used to bond the electronic device 100B to another optical substrate 160. This optical substrate 160 may include a color conversion layer, a color filter layer, and a barrier layer 163, but the present invention is not limited thereto. Figure 3AThe illustrated light conversion layer may include light conversion layer 161A, light conversion layer 161B, and light conversion layer 161C, and the color filter layer may include color filter layer 162A, color filter layer 162B, and color filter layer 162C, but the present invention is not limited thereto. Light conversion layer 161A and color filter layer 162A may correspond to electronic unit 121, light conversion layer 161B and color filter layer 162B may correspond to electronic unit 122, and light conversion layer 161C and color filter layer 162C may correspond to electronic unit 123. When electronic units 121, 122, and 123 are all blue pixels that emit blue light, the light conversion layer may convert the blue light into green light or red light using light conversion particles, such as quantum dots (QD particles), located therein, but the present invention is not limited thereto.

[0033] Figures 5 to 8 FIG2 is a flow chart of a second embodiment of a method for manufacturing an electronic device according to the present invention, which illustrates a cross-sectional view of the electronic device. In the second embodiment of the method for manufacturing an electronic device according to the present invention, a pixel definition layer (PDL) may be further included between adjacent electronic units.

[0034] First, if Figure 5As shown, a substrate 110 is provided. The substrate 110 may include a bonding pad 111, a bonding pad 112, a bonding pad 113, a bonding pad 114, a bonding pad 115, and a bonding pad 116. The substrate 110 may be a transparent or opaque organic material or an inorganic material, or the substrate 110 may be a hard material or a flexible material. The details of the substrate 110 can refer to the relevant content of the first embodiment, so they are not repeated here. Secondly, a plurality of electronic units are provided, such as an electronic unit 121, an electronic unit 122, and an electronic unit 123. Each electronic unit may have a chip and at least one bonding terminal. For example, the electronic unit 121 may have a chip 121C and two bonding terminals 121A / bonding terminals 121B, the electronic unit 122 may have a chip 122C and two bonding terminals 122A / bonding terminals 122B, and the electronic unit 123 may have a chip 123C and two bonding terminals 123A / bonding terminals 123B, but the present invention is not limited thereto. Each of the plurality of electronic units can be bonded to the substrate 110 via its bonding terminals. For example, electronic unit 121 can be bonded to bonding pads 111 and 112 of substrate 110 via bonding terminals 121A and 121B, respectively; electronic unit 122 can be bonded to bonding pads 113 and 114 of substrate 110 via bonding terminals 122A and 122B, respectively; and electronic unit 123 can be bonded to bonding pads 115 and 116 of substrate 110 via bonding terminals 123A and 123B, respectively. A space can be defined between each chip and substrate 110, such as space 121S between chip 121C and substrate 110, space 122S between chip 122C and substrate 110, or space 123S between chip 123C and substrate 110, but the present invention is not limited thereto. Details of the electronic units can be found in the first embodiment and are not further described here.

[0035] A pixel defining layer may be further included between adjacent electronic units. For example, pixel defining layer 151 may be located on one side of electronic unit 121; pixel defining layer 152 may be located between electronic unit 121 and electronic unit 122; pixel defining layer 153 may be located between electronic unit 122 and electronic unit 123; and pixel defining layer 154 may be located next to electronic unit 123. Each pixel defining layer, such as pixel defining layer 151, pixel defining layer 152, pixel defining layer 153, and pixel defining layer 154, may include various organic or inorganic materials. If no pigment particles are added to the pixel defining layer, it may be a transparent pixel defining layer. Conversely, if pigment particles are added to the pixel defining layer, it may be a colored pixel defining layer, such as a white pixel defining layer or a gray pixel defining layer. Each pixel defining layer may be located on substrate 110 or may be in direct contact with substrate 110, but the present invention is not limited thereto. The top surface of the pixel defining layer may be no lower than the top surface of the electronic unit. For example, the top surface 151S of the pixel defining layer 151, the top surface 152S of the pixel defining layer 152, the top surface 153S of the pixel defining layer 153, and the top surface 154S of the pixel defining layer 154 may be no lower than the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123, but the present invention is not limited to this. The pixel defining layer may have a light-shielding function, reducing the possibility of light mixing between adjacent electronic units affecting the image quality of the electronic device. The pixel defining layer may also have a reflective function, improving the light utilization efficiency of the electronic unit. In some embodiments, the gap between the pixel defining layer and the adjacent electronic unit may be small, for example, less than 10 microns (<10 μm), but the present invention is not limited to this. The relatively small gap between the pixel defining layer and the adjacent electronic unit may affect the gap-filling ability of the adhesive material. If the adhesive material has poor gap-filling ability, it may be detrimental to the strength of the connection between the electronic unit and the substrate.

[0036] Then, an adhesive material 130 may be applied to the spaces and gaps between the chips, the pixel definition layer, and the substrate 110 . Figure 5The liquid adhesive material is shown as being applied via an inkjet printing method, but the present invention is not limited thereto. The method proposed in the present invention facilitates increasing the gap-filling capability of the adhesive material, thereby enhancing the bond strength between the microelectronic unit and the substrate. The adhesive material 130 can be a resin with high light transmittance, for example, the light transmittance of the adhesive material 130 can be greater than or equal to 95% (light transmittance ≥ 95%), but the present invention is not limited thereto. The adhesive material 130 can be made of acrylic, silicone, silicon, or epoxy resin, but the present invention is not limited thereto. The adhesive material 130 can have a suitable viscosity at room temperature, for example, ranging from 1 cP to 500 cP, from 1 cP to 100 cP, or from 1 cP to 50 cP, but the present invention is not limited thereto. The viscosity of the adhesive material 130 can change upon heating. For example, the viscosity of the adhesive material 130 can be adjusted by heating, for example, to between 8 cP and 12 cP. By adjusting the viscosity of the adhesive material 130 to match the size of the inkjet nozzle 141 of the inkjet machine 140, the adhesive material 130 can be appropriately applied to the spaces and gaps between each chip, pixel definition layer, and substrate 110. The size of the adhesive material 130 droplets can be less than or equal to 30 microns (≤30 μm).

[0037] Since the adhesive material 130 can be a liquid with an appropriate viscosity, after being applied by inkjet printing, the adhesive material 130 can slowly fill the spaces 121S, 122S, and 123S through natural capillary action or gravity. For example, the adhesive material 130 can completely fill the spaces 121S, 122S, and 123S. Furthermore, the adhesive material 130 can also fill the gaps between the electronic units and the pixel definition layer, or the adhesive material 130 can remain on the top surfaces of the electronic units, for example, the adhesive material 130 can remain on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. The adhesive material 130 may also reside on the top surface of the pixel defining layer, for example, the adhesive material 130 may reside on the top surface 151S of the pixel defining layer 151, the top surface 152S of the pixel defining layer 152, the top surface 153S of the pixel defining layer 153, or the top surface 154S of the pixel defining layer 154. In some embodiments, the top surface of the electronic unit may be higher than the top surface 130S of the adhesive material 130. Figure 6The adhesive material is shown applied via inkjet printing. Adhesive material 130 fills the spaces and the gaps between the electronic unit and the pixel definition layer. Adhesive material 130 also remains on top surface 121T of electronic unit 121 and on top surface 152S of pixel definition layer 152. However, the present invention is not limited to this embodiment. Optionally, the droplets of adhesive material 130 can be vacuum-assisted or pressurized to facilitate filling of the spaces and gaps.

[0038] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. Figure 7 The figure shows a sufficient amount of adhesive material applied by inkjet printing. The adhesive material fills the spaces, fills the gaps between the electronic units and the pixel definition layer, and covers the top surface of the electronic units, which can be considered a packaging structure. For example, the amount of adhesive material 130 applied by the nozzle 141 of the inkjet machine 140 can be controlled so that the adhesive material 130 fills the spaces 121S, 122S, and 123S, fills the gaps between the electronic units and the pixel definition layer, and further covers the top surfaces 121T of the electronic units 121, 122T of the electronic units 122, and 123T of the electronic units 123. The adhesive material 130 can also cover the top surface 151S of the pixel definition layer 151, the top surface 152S of the pixel definition layer 152, the top surface 153S of the pixel definition layer 153, or the top surface 154S of the pixel definition layer 154. After the adhesive material 130 fills the gap, the top surface 130S of the adhesive material 130 can be higher than the top surface of the electronic unit, or higher than the top surface of the pixel definition layer 153. Since the top surface of the electronic unit can generally be regarded as the light-emitting surface, in order to reduce the light loss caused by the adhesive material 130 covering the top surface, it is preferred to select an adhesive material with a transmittance greater than or equal to 95% in this embodiment, but this is not a limitation. If the inkjet printing method applies a smaller amount of adhesive material, that is, corresponding to Figure 6 As needed, the droplet-shaped adhesive material 130 can also be assisted by external vacuum or pressure to facilitate the adhesive material 130 to fill the space and gap.

[0039] In some embodiments, if the adhesive material 130 covers the top surface of the electronic unit, post-processing steps may be performed as needed. Figure 8The structure after post-processing steps is shown. The top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, forming a coplanar structure. Optionally, the post-processing step may be a surface leveling method. Optionally, post-processing steps, such as chemical etching, mechanical polishing, or plasma treatment, may be performed to lower the top surface 130S of the adhesive material 130, such that the top surface 130S of the adhesive material 130 is substantially (or essentially) close to the top surface of the electronic unit, or flush with the top surface of the adhesive material 130, forming a coplanar structure, thereby exposing the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. In some embodiments, the top surface 151S of the pixel defining layer 151 , the top surface 152S of the pixel defining layer 152 , the top surface 153S of the pixel defining layer 153 , or the top surface 154S of the pixel defining layer 154 may also be exposed.

[0040] In some embodiments, a curing step may be performed on the adhesive material 130. The curing step may be performed appropriately, such as by irradiation, heating, or a combination of both, with reference to curing conditions for various adhesive materials 130. The cured adhesive material 130 can secure the electronic unit to the substrate, thereby enhancing the bonding strength between the electronic unit and the substrate. Figure 6 The electronic device 101A is shown to include a cured adhesive material 130 , and the top surface 130S may be lower than the top surface of the electronic unit. Figure 7 The electronic device 101B is shown to include a cured adhesive material 130 , and the top surface 130S may be higher than the top surface of the electronic unit. Figure 8 The electronic device 101C is shown to include a cured adhesive material 130 , and the top surface 130S and the top surface of the electronic unit can form a coplanar structure.

[0041] Figures 9 and 10 FIG2 is a flow chart of a third embodiment of a method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device. In the third embodiment of the method for manufacturing an electronic device according to the present invention, the adhesive material may be applied using a sheet of solid adhesive material.

[0042] Figure 9The adhesive material can be applied by using a sheet of solid adhesive material, but the present invention is not limited to this. The method proposed by the present invention is conducive to increasing the ability of the adhesive material to fill the gap, thereby improving the strength between the electronic unit and the substrate. For example, a solid adhesive material is provided, and a sheet of the solid adhesive material is attached to a plurality of electronic units. The sheet 131 can be an optically transparent adhesive, such as an optical adhesive OCA (Optically Clear Adhesive), but is not limited to this. The transmittance of the sheet 131 can be greater than or equal to 95% (transmittance ≥ 95%), but the present invention is not limited to this. In some embodiments, the thickness of the sheet 131 can be less than or equal to 10 microns (≤10μm). The sheet 131 can be a solid sheet at room temperature, but the present invention is not limited to this. The sheet 131 can soften and produce appropriate viscosity after being heated, thereby converting the sheet 131 from solid to liquid. For example, the solid sheet 131 is softened into the liquid adhesive material 130 through the heating step, and the viscosity of the adhesive material 130 is adjusted, for example, between 8 cP and 12 cP.

[0043] Since the adhesive material 130 can be a liquid with appropriate viscosity, after the softened sheet 131 becomes the liquid adhesive material 130, the adhesive material 130 can flow into the space between the chip and the substrate. For example, the adhesive material 130 can slowly fill the space 121S, the space 122S and the space 123S through natural capillary phenomena or gravity and fill the above-mentioned spaces. In addition, the adhesive material 130 can also be filled in the gaps between the electronic units 121, 122 and 123, or the adhesive material 130 may also be retained on the top surface of the electronic unit, for example, the adhesive material 130 may be retained on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122 or the top surface 123T of the electronic unit 123. The top surface of the electronic unit may be higher than the top surface 130S of the adhesive material 130, that is, Figure 2 drawn.

[0044] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. Figure 3As shown, adhesive material 130 fills the spaces, fills the gaps between electronic units, and covers the top surfaces of the electronic units. For example, the amount of adhesive material 130 can be controlled so that adhesive material 130 fills spaces 121S, 122S, and 123S, fills the gaps between electronic units 121, 122, and 123, and further covers top surface 121T of electronic unit 121, top surface 122T of electronic unit 122, or top surface 123T of electronic unit 123. After adhesive material 130 fills the spaces and gaps, top surface 130S of adhesive material 130 can be higher than the top surfaces of the electronic units. Optionally, the liquid adhesive material 130 can be vacuum-assisted or pressurized to facilitate filling of the spaces and gaps.

[0045] In another embodiment of the present invention, if the adhesive material 130 covers the top surface of the electronic unit, a post-process step may be performed as needed. Figure 4 The top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit to form a coplanar structure after the post-processing step. The post-processing step can be a surface flushing method as needed. The details of the post-processing step can be referred to Figure 4 The above content will not be repeated here.

[0046] In some embodiments, the adhesive material 130 may be further cured. Suitable curing steps may be performed by referring to curing conditions of various adhesive materials 130, such as light, heat, or a combination of both, so that the cured adhesive material 130 can fix the electronic unit on the substrate to enhance the bonding strength between the electronic unit and the substrate. Figure 2 、 Figure 3 or Figure 4 The above content will not be repeated here.

[0047] Figures 11 to 12 FIG2 is a flow chart illustrating a fourth embodiment of a method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device. In the fourth embodiment of the method for manufacturing an electronic device according to the present invention, the adhesive material may be applied by applying a solid adhesive sheet to the substrate including the pixel defining layer.

[0048] Figure 11The adhesive material can be applied using a sheet of solid adhesive material, but the present invention is not limited thereto. The method proposed in the present invention can increase the gap-filling ability of the adhesive material, thereby improving the strength between the electronic unit and the substrate. For example, a solid adhesive material can be provided and affixed to multiple electronic units. Sheet 131 can be an optical adhesive, such as optical adhesive (OCA). Details of sheet 131 are described above and will not be repeated here.

[0049] Since the adhesive material 130 can be a liquid with an appropriate viscosity, after the softened sheet 131 becomes a liquid adhesive material 130, the adhesive material 130 can flow into the space between the chip and the substrate. For example, the adhesive material 130 can slowly fill the space 121S, the space 122S, and the space 123S through natural capillary action or gravity, and can even fill the above-mentioned spaces. In addition, the adhesive material 130 can also fill the gap between the electronic unit and the pixel definition layer, or the adhesive material 130 may remain on the top surface of the electronic unit, for example, the adhesive material 130 may remain on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. The adhesive material 130 may also remain on the top surface of the pixel definition layer, for example, the adhesive material 130 may remain on the top surface 151S of the pixel definition layer 151, the top surface 152S of the pixel definition layer 152, the top surface 153S of the pixel definition layer 153, or the top surface 154S of the pixel definition layer 154. When the adhesive material 130 fills the gap between adjacent electronic units, the top surface of the electronic unit may be higher than the top surface 130S of the adhesive material 130, that is, Figure 2 drawn.

[0050] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. Figure 7 As shown, the adhesive fills the space, fills the gaps between the electronic units, and covers the top surface of the electronic units. In some embodiments, if the adhesive material 130 covers the top surface of the electronic units, a post-processing step may be performed as needed. Figure 8 The top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit to form a coplanar structure after the post-processing step. The post-processing step can be a surface flushing method as needed. The details of the post-processing step can be referred to Figure 8 The above content will not be repeated here.

[0051] In some embodiments, the adhesive material 130 may be further cured. Suitable curing steps may be performed by referring to curing conditions of various adhesive materials 130, such as irradiation, heating, or a combination of both, so that the cured adhesive material 130 can fix the electronic unit on the substrate to enhance the bonding strength between the electronic unit and the substrate. Figure 6 、 Figure 7 or Figure 8 The above content will not be repeated here.

[0052] Figure 13 FIG2 is a flow chart illustrating a fifth embodiment of a method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device. In the fifth embodiment of the method for manufacturing an electronic device according to the present invention, the adhesive material may be applied using a solid adhesive sheet or a liquid adhesive.

[0053] After the adhesive material 130 is applied, the adhesive material 130 can slowly fill the spaces 121S, 122S, and 123S. For example, the adhesive material 130 can completely fill the spaces 121S, 122S, and 123S. In addition, the adhesive material 130 can also fill the gaps between the electronic units and the pixel definition layers. For example, the adhesive material 130 may fill the gaps between the pixel definition layer 152 and the electronic units 121, the adhesive material 130 may fill the gaps between the pixel definition layer 152 and the electronic units 122, the adhesive material 130 may fill the gaps between the pixel definition layer 153 and the electronic units 122, the adhesive material 130 may fill the gaps between the pixel definition layer 153 and the electronic units 123, and the adhesive material 130 may fill the gaps between the pixel definition layer 154 and the electronic units 123.

[0054] Next, the adhesive material 130 can be cured. Unlike the aforementioned method of curing the adhesive material 130, this embodiment can cure the adhesive material 130 from the other side of the substrate 110 (the side opposite to the electronic unit). Locally curing the adhesive material 130 can be achieved by focusing a laser on certain portions of the adhesive material 130, or by using a local curing device to locally cure certain portions of the adhesive material 130. For example, a laser can be focused on portions 135A, 135B, 135C, 135D, 135E, 135F, 135G, 135H, and 135I of the adhesive material 130, curing these portions of the adhesive material 130 while leaving the remaining portions of the adhesive material 130 uncured or incompletely cured. This results in selectively curing the adhesive material 130, which is different from the aforementioned method of curing the adhesive material 130.

[0055] After selectively curing the adhesive material 130, the uncured or incompletely cured adhesive material 130 can be removed. The uncured adhesive material 130 can be removed by washing the entire sheet of selectively cured adhesive material 130 or soaking the selectively cured adhesive material 130 in a solvent, but the present invention is not limited thereto.

[0056] After removing the uncured adhesive material 130, the electronic device of this embodiment is obtained. The electronic device of this embodiment includes locally cured adhesive material portions. These locally cured adhesive material portions, such as portion 135A, portion 135B, portion 135C, portion 135D, portion 135E, portion 135F, portion 135G, portion 135H, and portion 135I, can be selectively located in space 121S, space 122S, or space 123S, but the present invention is not limited thereto. In addition, this regionally cured adhesive material portion can also be selectively located in the gap between the electronic unit and the pixel definition layer, for example, selectively located in the gap between the pixel definition layer 152 and the electronic unit 121, selectively located in the gap between the pixel definition layer 152 and the electronic unit 122, selectively located in the gap between the pixel definition layer 153 and the electronic unit 122, selectively located in the gap between the pixel definition layer 153 and the electronic unit 123, or selectively located in the gap between the pixel definition layer 154 and the electronic unit 123, but the present invention is not limited thereto. The electronic device of this embodiment, and Figure 2 The electronic device 100A or Figure 6 The electronic device 101A shown differs in that, although the top surface 130S of the cured adhesive material 130 may be lower than the top surface of the electronic unit, no adhesive material 130 may remain on the top surface of the electronic unit or on the top surface of the pixel definition layer.

[0057] According to the method for manufacturing an electronic device according to an embodiment of the present invention, by applying an adhesive material to the space between the chip and the substrate, even if the spacing between the chip and the substrate of the electronic unit may be less than or equal to 3 microns, or the gap between the pixel definition layer and the adjacent electronic unit may be less than 10 microns, an electronic device with enhanced bonding strength between the electronic unit and the substrate can still be obtained. This electronic device can also be directly regarded as a packaging structure. In this way, the quality of the microelectronic units in the electronic device can be improved, thereby facilitating technological advancement and innovation in electronic devices.

[0058] The foregoing description is merely an embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing an electronic device, characterized in that: include: providing a substrate; Providing a plurality of electronic units, each of the plurality of electronic units having a chip and at least one bonding terminal; bonding each of the plurality of electronic units to the substrate via the at least one bonding terminal; applying an adhesive material in a space between the chip and the substrate and in a gap between two adjacent electronic units; as well as The adhesive material is removed regionally.

2. The method for manufacturing an electronic device according to claim 1, wherein: The adhesive material is irradiated with light in a regional manner.

3. The method for manufacturing an electronic device according to claim 1, wherein: After each of the plurality of electronic units is bonded to the substrate, the adhesive material is applied through a coating process.

4. The method for manufacturing an electronic device according to claim 1, wherein: A top surface of the adhesive material is higher than a top surface of the electronic unit.

5. The method for manufacturing an electronic device according to claim 4, wherein: The adhesive material has a transmittance greater than or equal to 95% for light with a wavelength of 380 nm to 780 nm.

6. The method for manufacturing an electronic device according to claim 1, wherein: A top surface of the electronic unit is higher than a top surface of the adhesive material.

7. The method for manufacturing an electronic device according to claim 1, wherein: A top surface of the electronic unit is flush with a top surface of the adhesive material.

8. The method for manufacturing an electronic device according to claim 1, wherein: The distance between the wafer and the substrate is less than or equal to 3 μm.

9. A method for manufacturing an electronic device, characterized in that: include: Providing a substrate, the substrate comprising a pixel definition layer; An electronic unit is provided, the electronic unit having a chip and at least one bonding terminal; bonding the electronic unit to the substrate via the at least one bonding terminal so that the electronic unit is located next to the pixel definition layer; as well as applying an adhesive material in a space between the chip and the substrate and in a gap between the electronic unit and the pixel definition layer; as well as The adhesive material is removed regionally.

10. The method for manufacturing an electronic device according to claim 9, wherein: The adhesive material is irradiated with light in a regional manner.

11. The method for manufacturing an electronic device according to claim 9, wherein: After each of the plurality of electronic units is bonded to the substrate, the adhesive material is applied through a coating process.

12. The method for manufacturing an electronic device according to claim 9, wherein: The distance between the electronic unit and the pixel definition layer is less than 10 μm.

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