Glue filling device and glue filling method

Abstract

The invention provides a glue filling device and a glue filling method. The glue filling device comprises a tank body, a feeding pipe and a glue injection mold. And colloid is stored in the tank body. One end of the feeding pipe is connected with the tank body, and the other end of the feeding pipe is connected with the glue injection mold. The glue injection mold is provided with a glue injection cavity used for storing glue, and a glue outlet is formed in the top of the glue injection cavity. The glue is discharged from the top glue outlet of the glue injection cavity, and equivalently, the glue is injected from the bottom. When the colloid rises from the bottom, bubbles can be discharged from the top in the colloid filling and sealing process, the time and the dosage can be stably controlled, and the colloid filling efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment, and in particular to a glue filling device and a glue filling method. Background Art

[0002] In the electronics industry, high-frequency components have high losses. To extend the life of the components and increase their stability, thermally conductive silicone is often used as a heat transfer medium to reduce heat accumulation inside the components.

[0003] Thermally conductive potting compounds are the primary choice for filling components. However, higher thermal conductivity compounds tend to have poorer fluidity, creating air bubbles and cavities that isolate the potting compound from direct contact with the component. This is primarily due to the fact that existing potting processes and methods rely on a top-down pouring process. During pouring, the potting compound displaces air. However, pouring from different locations within the same component, at different speeds, or with varying winding arrangements can all affect the smooth discharge path for air from the bottom of the product, resulting in low potting efficiency.

[0004] Therefore, it is necessary to design a glue filling device and glue filling method to solve the above technical problems Summary of the Invention

[0005] The present application provides a glue filling device and a glue filling method with high glue filling efficiency.

[0006] According to the first aspect of the embodiments of this specification, a glue filling device is provided, which includes a tank body, a feeding pipe and a glue injection mold; the tank body stores a glue; the feeding pipe is used to transport the glue, one end of the feeding pipe is connected to the tank body, and the other end is connected to the glue injection mold; the glue injection mold has a glue injection cavity for storing the glue, and the top of the glue injection cavity forms a glue outlet.

[0007] Furthermore, one end of the feeding pipe is connected to the bottom of the tank body, and the other end is connected to the bottom of the injection mold;

[0008] Wherein, the inner diameter of the bottom of the glue injection cavity is smaller than the inner diameter of the glue outlet.

[0009] Furthermore, it also includes a plurality of constant temperature control components; the constant temperature control components are respectively wrapped around the outer wall of the tank body, the feeding pipe and the injection mold.

[0010] Furthermore, it also includes a feeding assembly; the feeding assembly includes a feeding mechanism, a feeding piston, a pressure relief valve and a sealing ring; the feeding mechanism is connected to the feeding piston, and pushes the feeding piston to reciprocate between a first position and a second position; the feeding piston forms a closed chamber with the tank body at the lower part of the feeding piston through the sealing ring; the colloid is placed in the closed chamber; the pressure relief valve connects the closed chamber and the atmospheric environment, and is in a closed state.

[0011] Furthermore, it also includes a glue feeding component, which includes multiple glue inlets, multiple delivery pipelines and glue feeding valves; the composition of the colloid passing through each of the glue inlets is different; each of the glue inlets is connected to the tank body through one of the delivery pipelines and the glue feeding valve; the glue feeding amount of the glue inlet can be adjusted by switching the glue feeding valve.

[0012] Furthermore, it also includes a constant pressure component; the constant pressure component includes an air inlet, an air pipe and a vent valve, the air inlet is connected to the tank body through the air pipe and the vent valve; the air intake of the air inlet can be adjusted by switching the vent valve.

[0013] Furthermore, the tank body includes a system tank and a transfer tank arranged vertically, the system tank and the transfer tank are rigidly connected; and the colloid is stored in the transfer tank.

[0014] Furthermore, it also includes a stirring assembly; the stirring assembly includes a stirrer and a stirring rod, one end of the stirring rod is rotatably connected to the stirrer placed in the system tank, and the other end is deeply inserted into the colloid;

[0015] It also includes a liquid level sensor; the liquid level sensor is arranged at the connection between the system tank and the transfer tank.

[0016] According to a second aspect of the embodiments of this specification, a glue pouring method is provided, the glue pouring method comprising:

[0017] The colloid is loaded in the tank, and the product to be dispensed is placed at the outlet of the injection mold; the colloid acts on the product to be dispensed;

[0018] delivering the colloid from the tank to the injection mold through a feeding pipe;

[0019] The colloid is controlled to enter the product to be dispensed from the bottom to the top of the injection mold.

[0020] Furthermore, in the process of flowing the colloid from the tank to the glue injection mold through the feeding pipe, the glue pouring method further includes:

[0021] Obtaining the volume of the colloid in the tank and determining whether there is colloid in the tank;

[0022] If there is no glue, open the glue inlet and constant pressure component; if there is glue, continue to pour glue;

[0023] During the process of flowing the colloid from the tank to the glue injection mold through the feeding pipe, the glue pouring method further comprises:

[0024] Obtaining the position of the feeding assembly and determining whether the feeding assembly has moved to the second position;

[0025] If the feeding assembly moves to the second position, the constant pressure assembly is opened to move the feeding assembly to the first position; if the feeding assembly does not move to the first position, the feeding assembly is continued to be driven to move from the first position to the second position.

[0026] The present invention has the following beneficial effects: the colloid is discharged from the top outlet of the injection cavity, which is equivalent to filling from the bottom. When the colloid rises from the bottom, not only can the bubbles be discharged from the top during the filling process, but the time and amount of the colloid can also be stably controlled, thereby improving the efficiency of the filling process.

[0027] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0029] Figure 1 This is a schematic diagram of a glue filling device in an embodiment of the present application;

[0030] Figure 2 It is a flow chart of the glue filling method in the embodiment of the present application.

[0031] Description of reference numerals:

[0032] 10-tank body; 11-system tank; 12-transfer tank;

[0033] 20-Feeding tube;

[0034] 30- injection mold; 31- injection cavity; 32- outlet;

[0035] 40a, 40b, 40c - constant temperature control components;

[0036] 50-feeding assembly; 51-feeding mechanism; 52-feeding piston; 53-pressure relief valve; 54-sealing ring;

[0037] 60-glue delivery assembly; 61-glue inlet; 62-delivery pipeline; 63-glue inlet valve;

[0038] 70-constant pressure assembly; 71-air inlet; 72-trachea; 73-vent valve;

[0039] 80-stirring assembly; 81-stirring machine; 82-stirring rod. DETAILED DESCRIPTION

[0040] Here, the technical solutions in the embodiments (or "implementations") of the present application will be clearly and completely described in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0041] If there are terms related to directional indications or positional relationships in the embodiments of this application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first" and "second" in the embodiments of this application are only used for the purpose of convenience of description and should not be understood as indicating or implying relative importance.

[0042] Next, the embodiments of this specification are described in detail.

[0043] Reference Figure 1 As shown, the present application discloses a glue filling device, which includes a tank body 10, a feeding pipe 20, a glue injection mold 30, constant temperature control components 40a, 40b, 40c, a feeding component 50, a glue feeding component 60, a constant pressure component 70, and a stirring component 80. The tank body 10 stores glue. One end of the feeding pipe 20 is connected to the tank body 10, and the other end is connected to the glue injection mold 30. The constant temperature control components 40a, 40b, 40c act on the tank body 10, the feeding pipe 20, and the glue injection mold 30. The feeding component 50, the glue feeding component 60, the constant pressure component 70, and the stirring component 80 act on the tank body 10.

[0044] The tank body 10 comprises a system tank 11 and a transfer tank 12 arranged vertically. These two tanks are rigidly connected to form a closed space. This rigid connection can be achieved by bolts, flanges, or other methods. The colloid is stored in the transfer tank 12. When the colloid filling process is complete and cleaning is required, only the transfer tank 12 needs to be maintained, reducing maintenance on other components. The vertical dimension here refers to the height of the tank body 10.

[0045] A liquid level sensor (not shown) is installed at the connection between the system tank 11 and the transfer tank 12. When the colloid enters the bottom of the transfer tank 12 through the glue feeding assembly 60, the colloid level begins to gradually rise. After the glue reaches the highest level detected by the liquid level sensor, the glue feeding assembly 60 is closed.

[0046] The feed tube 20 is a retractable hose, allowing its length to be flexibly adjusted according to the position of the tank body 10 and the injection mold 30 to meet the needs of different usage environments. The feed tube 20 is detachably connected to the tank body 10 and the injection mold 30. This allows for flexible adjustment of the injection mold 30 connected to one end of the feed tube 20 based on the product being dispensed. Furthermore, it allows for easy removal and cleaning of the feed tube 20 from the tank body 10 after dispensing is complete.

[0047] In this embodiment, one end of the feed tube 20 is connected to the bottom of the system tank 11, and the other end is connected to the bottom of the injection mold 30. Extracting material from the bottom of the system tank 11 maximizes gravity discharge of the colloid, reducing colloid residue in the system tank 11. Injecting from the top of the injection mold 30 improves filling efficiency.

[0048] In some embodiments, one end of the feed tube 20 may be connected to the lower end of the tank body 10, where the lower end refers to the area from the bottom of the tank body 10 to 1 / 3 of the total height of the tank body 10. Furthermore, the other end of the feed tube 20 may be connected to the lower end of the injection mold 30, where the lower end refers to the area from the bottom of the injection mold 30 to 1 / 3 of the total height of the injection mold 30.

[0049] The injection mold 30 has an injection cavity 31 for storing the colloid, with a discharge port 32 formed at the top of the cavity 31. The colloid is discharged from the top discharge port 32 of the cavity 31, effectively filling the mold from the bottom. As the colloid rises from the bottom, it enters the product to be dispensed through the discharge port 32, continuously pushing the colloid inside the product toward the top. This not only allows bubbles to be expelled from the top during the potting process, but also allows for stable control of the time and amount of colloid used, improving potting efficiency.

[0050] The inner diameter of the bottom of the injection cavity 31 is smaller than the inner diameter of the glue outlet 32, so the speed at which the glue level rises in the injection mold 30 is slowed down, and the glue smoothly transitions to the glue outlet 32, avoiding flow defects caused by sudden changes in flow rate and improving glue filling efficiency.

[0051] The constant temperature control components 40a, 40b, 40c are used to adjust the temperature, lowering or raising the temperature according to the application scenario to ensure the fluidity of the colloid. In some cases, the constant temperature control components 40a, 40b, 40c are resistance heating devices, air cooling devices, etc., which are not specifically limited here.

[0052] In this embodiment, the thermostatic control components 40a, 40b, and 40c are respectively wrapped around the outer walls of the tank body 10, the feeding tube 20, and the injection mold 30, and control the temperature of the glue in the tank body 10, the feeding tube 20, and the injection mold 30 to be between 5°C and 10°C. The temperature of the glue filling environment is generally between 25°C and 45°C.

[0053] The feeding assembly 50 is used to increase the pressure in the tank body 10. As the pressure in the tank body 10 increases, the colloid can flow out of the transfer tank 12 along the feeding pipe 20, ensuring the continuous operation of the glue filling device.

[0054] The feed assembly 50 includes a feed mechanism 51, a feed piston 52, a pressure relief valve 53, and a sealing ring 54. The feed mechanism 51 is connected to the feed piston 52 and propels the feed piston 52 back and forth between a first position and a second position. The first position refers to the top of the tank 10, at which point the feed assembly 50 is not acting on the tank 10. The second position is below the first position and above the glue feed assembly 60.

[0055] The feed piston 52 forms a sealed chamber with the tank body 10 below it, via a sealing ring 54. The glue is contained within this sealed chamber. A pressure relief valve 53 connects the sealed chamber to the atmosphere and remains closed. In some cases, if the pressure in the sealed chamber increases beyond a threshold due to a blockage in the feed pipe 20 during the filling process, the pressure relief valve 53 opens, allowing the sealed chamber to connect to the atmosphere and improving the safety of the glue dispensing device.

[0056] The glue delivery assembly 60 is used to deliver glue to the transfer tank 12. It includes multiple glue inlets 61, multiple delivery pipelines 62, and a glue inlet valve 63. Each glue inlet 61 is connected to the system tank 11 via a delivery pipeline 62 and a glue inlet valve 63. The amount of glue delivered to the glue inlet 61 can be adjusted by switching the opening and closing time of the glue inlet valve 63.

[0057] The composition of the colloid passing through each glue inlet 61 is different to avoid premature mixing and clogging of the pipeline. Alternatively, the colloid can be directly mixed by controlling the opening and closing of multiple conveying pipelines 62, simplifying the early colloid mixing work and improving the glue filling efficiency.

[0058] The constant pressure assembly 70 includes an air inlet 71, an air pipe 72, and a vent valve 73. The air inlet 71 communicates with the tank 10 via the air pipe 72 and the vent valve 73. By switching the vent valve 73, the air intake of the air inlet 71 can be adjusted, thereby aligning the air pressure within the tank 10 with atmospheric pressure, allowing the glue delivery assembly 60 to inject glue into the tank 10.

[0059] The stirring assembly 80 includes a stirrer 81 and a stirring rod 82. One end of the stirring rod 82 is rotatably connected to the stirrer 81 placed in the system tank 11, and the other end of the stirring rod 82 extends deep into the colloid to continuously stir the single component or unstirred multi-component colloid, mixing it evenly while maintaining the fluidity of the colloid.

[0060] Reference Figure 2 As shown, the present application also discloses a glue pouring method, which includes:

[0061] S100: Colloid is loaded into the tank 10, and the product to be dispensed is placed at the outlet 32 ​​of the injection mold 30. The colloid acts on the product to be dispensed.

[0062] When the glue dispensing device is in a static state, the glue inlet valve 63 is closed, the vent valve 73 is closed, the mixer 81 is not operating, the feed assembly 50 is in the first position, the thermostatic control components 40a, 40b, and 40c are not operating, the transfer tank 12 and the system tank 11 are sealed at the end face, and the air pressure in the tank body 10 is not connected to the ambient atmosphere. The bottom of the glue injection mold 30 is connected to the bottom of the transfer tank 12 via the feed pipe 20.

[0063] To prepare for glue filling, thermostats 40a, 40b, and 40c begin operating, maintaining the temperature at a designed level where the glue is difficult to solidify. Glue inlet valve 63 and vent valve 73 are opened, and glue is introduced from inlet port 61. After passing through valve 63, the glue enters the bottom of transfer tank 12. The glue level gradually rises. Once the glue reaches the highest level detected by the level sensor, valve 63 closes. Agitator 81 starts operating, continuously stirring the unstirred glue to maintain fluidity.

[0064] At the same time, the product to be glued is placed above the glue injection mold 30, and the glue outlet 32 ​​is corresponding to the bottom opening of the product to be glued.

[0065] S200: The colloid is transported from the tank body 10 to the injection mold 30 through the feeding pipe 20.

[0066] When glue filling begins, the vent valve 73 and the glue inlet valve 63 are closed, enclosing the transfer tank 12 and the system tank 11 body 10. The feed assembly 50 is activated, causing the connected feed piston 52 to push the feed piston downward, moving it from the first position to the second position. The mixer 81 continues to operate. As the pressure in the enclosed chamber containing the glue within the tank body 10 increases, the glue flows through the feed pipe 20 from the bottom of the transfer tank 12 into the glue injection mold 30.

[0067] S300: Control the colloid to enter the product to be dispensed from the bottom to the top of the injection mold 30.

[0068] The inner diameter of the bottom of the glue injection cavity 31 is smaller than the inner diameter of the glue outlet 32, and the rate at which the colloid rises in the glue injection mold 30 slows down. At the same time, as the feeding assembly 50 continues to press down, the liquid level of the colloid will exceed the top of the glue injection mold 30, and the colloid will begin to enter the product to be glued from the bottom opening. As the feeding assembly 50 continues to work, the colloid is added from the bottom to the top of the product to be glued until the colloid overflows from the top surface to the maximum requirement of the component of the product to be glued, and the feeding assembly 50 stops. Finally, the glued product is removed from the glue injection mold 30, and a new product to be glued is placed in and the glue dispensing operation is repeated.

[0069] During step S200, the glue filling method further includes:

[0070] The capacity of the colloid in the tank body 10 is obtained to determine whether the colloid exists in the tank body 10 .

[0071] Here, the capacity of the colloid in the tank body 10 can be determined by a sensor, such as a liquid level sensor or a weight sensor, etc. In some cases, the capacity of the colloid in the tank body 10 can also be manually determined by setting a visual window. If it exists, the filling of the colloid continues.

[0072] If no colloid is present, the glue feed assembly 60 and constant pressure assembly 70 are opened to replenish glue into the tank body 10. Specifically, after opening the vent valve 73 to allow the sealed chamber of the transfer tank 12 to vent to the atmosphere, the feed assembly 50 is driven to raise the feed piston 52 from the second position to the first position, and the glue feed valve 63 is opened to inject new glue into the tank body 10. After the glue filling operation is completed, the glue feed valve 63 and vent valve 73 are closed, and the transfer tank 12 is once again converted into a sealed tank. The feed assembly 50 is then driven downward to squeeze the glue from the feed pipe 20 through the glue outlet 32 ​​of the injection mold 30 and into the bottom opening of the product to be dispensed.

[0073] During step S200, the glue filling method further includes:

[0074] The position of the feeding assembly 50 is obtained, and it is determined whether the feeding assembly 50 has moved to the second position.

[0075] Here, whether the feeding assembly 50 has reached the second position can be determined by a sensor. In some cases, a limit rod can be provided on the outside of the tank body 10 of the feeding mechanism. When the feeding piston 52 moves to the second position, the corresponding limit rod abuts against the top of the tank body 10, thereby limiting the feeding piston 52 from moving further downward.

[0076] If the feed assembly 50 reaches the second position, the constant pressure assembly 70 is opened, and the feed assembly 50 is moved to the first position, after which the constant pressure assembly 70 is closed. The feed piston 52 then continues to move from the first position to the second position. If the feed assembly 50 has not reached the first position, the feed assembly 50 continues to be driven from the first position to the second position.

[0077] After the glue filling work is completed and the glue filling device is completely shut down, the feeding pipe 20 is replaced and the glue injection mold 30, the transfer tank 12 and the stirring rod 82 are cleaned. The remaining components do not require maintenance, which is simple and convenient.

[0078] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application shall be included in the scope of protection of this application.

Claims

1. A glue filling device, characterized in that: It includes a tank body, a feeding pipe and a glue injection mold; the tank body stores the colloid; the feeding pipe is used to transport the colloid, one end of the feeding pipe is connected to the tank body, and the other end is connected to the glue injection mold; the glue injection mold has a glue injection cavity for storing the colloid, and the top of the glue injection cavity forms a glue outlet.

2. The glue pouring device according to claim 1, characterized in that: One end of the feeding pipe is connected to the bottom of the tank body, and the other end is connected to the bottom of the injection mold; Wherein, the inner diameter of the bottom of the glue injection cavity is smaller than the inner diameter of the glue outlet.

3. The glue pouring device according to claim 1, characterized in that: It also includes multiple constant temperature control components; the constant temperature control components are respectively wrapped around the outer wall of the tank body, the feeding pipe and the injection mold.

4. The glue pouring device according to claim 1, characterized in that: It also includes a feeding assembly; the feeding assembly includes a feeding mechanism, a feeding piston, a pressure relief valve and a sealing ring; the feeding mechanism is connected to the feeding piston and pushes the feeding piston to reciprocate between a first position and a second position; the feeding piston forms a closed chamber with the tank body below the feeding piston through the sealing ring; the colloid is placed in the closed chamber; the pressure relief valve connects the closed chamber and the atmospheric environment and is in a closed state.

5. The glue pouring device according to claim 1, characterized in that: It also includes a glue feeding component, which includes multiple glue inlets, multiple delivery pipelines and glue feeding valves; the components of the colloid passing through each of the glue inlets are different; each of the glue inlets is connected to the tank body through one of the delivery pipelines and the glue feeding valve; the glue feeding amount of the glue inlet can be adjusted by switching the glue feeding valve.

6. The glue pouring device according to claim 5, characterized in that: It also includes a constant pressure component; the constant pressure component includes an air inlet, an air pipe and a vent valve, the air inlet is connected to the tank body through the air pipe and the vent valve; the air intake volume of the air inlet can be adjusted by switching the vent valve.

7. The glue pouring device according to claim 1, characterized in that: The tank body includes a system tank and a transfer tank arranged vertically, wherein the system tank and the transfer tank are rigidly connected; the colloid is stored in the transfer tank.

8. The glue pouring device according to claim 7, characterized in that: It also includes a stirring assembly; the stirring assembly includes a stirrer and a stirring rod, one end of the stirring rod is rotatably connected to the stirrer placed in the system tank, and the other end is deeply inserted into the colloid; It also includes a liquid level sensor; the liquid level sensor is arranged at the connection between the system tank and the transfer tank.

9. A glue filling method, characterized in that: The glue pouring method comprises: The colloid is loaded in the tank, and the product to be dispensed is placed at the outlet of the injection mold; the colloid acts on the product to be dispensed; delivering the colloid from the tank to the injection mold through a feeding pipe; The colloid is controlled to enter the product to be dispensed from the bottom to the top of the injection mold.

10. The glue pouring method according to claim 9, characterized in that: During the process of flowing the colloid from the tank to the glue injection mold through the feeding pipe, the glue pouring method further comprises: Obtaining the volume of the colloid in the tank and determining whether there is colloid in the tank; If there is no glue, open the glue inlet and constant pressure component; if there is glue, continue to pour glue; During the process of flowing the colloid from the tank to the glue injection mold through the feeding pipe, the glue pouring method further comprises: Obtaining the position of the feeding assembly and determining whether the feeding assembly has moved to the second position; If the feeding assembly moves to the second position, the constant pressure assembly is opened to move the feeding assembly to the first position; if the feeding assembly does not move to the first position, the feeding assembly is continued to be driven to move from the first position to the second position.

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