Vertical continuous copper-plated wire for PCB (Printed Circuit Board)

Abstract

The invention relates to a vertical continuous copper-plated wire for a PCB, and belongs to the field of PCB electroplating equipment, the vertical continuous copper-plated wire comprises a pretreatment section and an electroplating section, the pretreatment section is provided with an output device with a first conveying surface, and the electroplating section is provided with an input device with a second conveying surface; the transfer device comprises a base provided with a mounting rack and a storage rack arranged on the mounting rack in a liftable manner, the storage rack comprises a mounting frame and a plurality of placement interlayers which are arranged up and down at equal intervals, each placement interlayer comprises a plurality of supporting rollers which are rotatably arranged on the mounting frame, and a third conveying surface is formed on each placement interlayer; the input device further comprises at least one first transverse rod, the first transverse rod is arranged in the conveying direction of the second conveying face, a vertical rod is vertically arranged at the lower end of the first transverse rod, a mounting section capable of being adjusted up and down is arranged at the lower end of the vertical rod, and a driving wheel is arranged on the mounting section and located on the upstream side of the second conveying belt. According to the invention, the speed of transferring the substrate from the pretreatment section to the electroplating section can be increased.

Description

Technical Field

[0001] The present invention relates to the field of PCB electroplating equipment, and in particular to a vertical continuous copper plating line for PCB. Background Art

[0002] The vertical continuous copper plating line is an efficient and automated electroplating production line used for the copper layer deposition process in the printed circuit board (PCB) manufacturing process. It includes a pre-treatment section and an electroplating section. The pre-treatment section is used to pre-treat the substrate, such as chemical degreasing / cleaning, micro-etching, water washing, etc. The electroplating section is used to deposit a copper layer on the surface and in the holes of the pre-treated substrate through electrochemical reactions, thereby realizing its conductive and interconnection functions.

[0003] For small-batch, multi-variety production scenarios, due to the large differences in substrate material, thickness, hole density, etc. of different varieties, the pre-treatment parameters (such as micro-etching time, cleaning agent concentration) and electroplating parameters (current density, liquid flow) need to be frequently adjusted when changing production. Therefore, in order to be able to flexibly adjust the process and avoid equipment idling waste, the pre-treatment section and electroplating section of the vertical continuous electroplating line suitable for small-batch, multi-variety production scenarios are usually set separately. They do not use a conveying structure to connect with each other, but instead transfer the substrates manually or by AGV carts. Among them, when the substrates are transferred manually or by AGV carts, the substrates are usually stored on storage racks for transfer. However, the current storage racks are mostly fixed structures, and the substrates need to be placed in layers in the storage racks. Therefore, in the process of placing the substrates on the storage racks in the pre-processing section and taking the substrates out of the storage racks in the electroplating section, operations need to be performed layer by layer. The picking and placing process is more troublesome and requires multiple positioning and clamping actions, which takes significantly longer than continuous feeding by conveyor belts. This will undoubtedly reduce the speed of transferring the substrates to the electroplating section. The transfer speed of the substrates may not meet the production speed of the electroplating section, resulting in the electroplating section being idle waiting for the substrates, reducing the overall production efficiency.

[0004] Based on this, the present invention provides a vertical continuous copper plating line for PCBs. By setting a transfer device that can receive and output substrates at the same horizontal height, the placement and removal of substrates do not need to be carried out layer by layer, thereby achieving the purpose of improving the placement and removal speed of substrates, thereby improving the speed of transferring substrates to the electroplating section, and avoiding the problem that the transfer speed of the substrates cannot meet the production speed of the electroplating section. Summary of the Invention

[0005] The present invention provides a vertical continuous copper plating line for PCBs, comprising a pre-treatment section and an electroplating section, wherein the pre-treatment section has an output device, the output device including a first conveyor belt formed with a first conveying surface; the electroplating section has an input device, the input device including a second conveyor belt formed with a second conveying surface; and a transfer device, the transfer device including a base provided with a mounting frame, and a storage rack movably arranged on the mounting frame, the storage rack including a mounting frame and a plurality of placement partitions arranged vertically and equidistantly, the placement partitions including a plurality of support rollers rotatably arranged on the mounting frame, the support rollers being arranged in a left-right direction and having their top ends located in the same horizontal plane to form a third conveying surface; the input device also includes at least one first cross bar arranged above the second conveying surface, the first cross bar being arranged along the conveying direction of the second conveying surface, a vertical bar being vertically provided at the lower end of the first cross bar, a mounting section being adjustable up and down at the lower end of the vertical bar, a drive wheel being provided on the mounting section, the drive wheel being located on the upstream side of the second conveying belt, and the horizontal height of the bottom end of the drive wheel being not lower than the horizontal height of the second conveying surface.

[0006] Furthermore, a conveying station is formed on the transfer device, and the conveying station and the first conveying surface and the second conveying surface are located at the same horizontal height.

[0007] Furthermore, both ends of the support roller are formed with a limiting segment that is cylindrical and coaxial with the support roller, and the limiting segments located in the same vertical plane in different storage compartments are combined to form a limiting segment group; a brake assembly is provided on the base corresponding to the limiting segment group, and the brake assembly includes two plywoods vertically provided on the base, and the two plywoods are respectively located on the front and rear sides of the corresponding limiting segment group and abut against the limiting segments in the limiting segment group; when the third conveying surface of the storage compartment in the storage rack is located at the conveying station, its limiting segment is located above the brake assembly, and the limiting segments of the storage compartment below the storage compartment all abut against the plywood. Preferably, the inner side wall of the plywood is provided with a rubber layer to increase the friction between the inner side wall of the plywood and the limiting segment, so as to achieve a better braking effect.

[0008] Furthermore, a baffle is vertically provided on the base corresponding to the storage rack, the baffle is located at the rear side of the placement compartment, and the horizontal height of the top end of the baffle is higher than the horizontal height of the conveying station.

[0009] Furthermore, the vertical rod is arranged in the middle of the lower end of the first cross bar; the transfer device also includes a locking mechanism for connecting to the input device, the locking mechanism includes a sleeve arranged corresponding to the first cross bar, the sleeve is fixedly arranged on the mounting frame and arranged along the front-to-back direction, and a socket is formed in the sleeve and passes through it along the front-to-back direction, the socket is used for inserting the first cross bar and the inner diameter of the socket is the same as the diameter of the first cross bar; a first slot is provided on the sleeve and passes through it up and down, and a second slot is provided on the first cross bar corresponding to the first slot and passes through the first cross bar up and down and has the same cross-section as the first slot; when the first slot and the second slot are aligned in the up and down direction, the vertical rod is located above the storage rack, and the vertical rod is located between any two adjacent support rollers.

[0010] Furthermore, when the first slot and the second slot are aligned in the up-down direction, the end of the sleeve abuts against the vertical rod.

[0011] Furthermore, the output device also includes a second cross bar arranged above the first conveying surface, the diameter of the second cross bar is the same as the diameter of the first cross bar, and the second cross bar is arranged along the conveying direction of the first conveying surface, and one end of the second cross bar extends to the downstream side of the second conveyor belt.

[0012] Furthermore, a third slot is provided on the second crossbar corresponding to the first slot, passing through the second crossbar from top to bottom and having the same cross section as the first slot.

[0013] Furthermore, the mounting frame includes four circular columns vertically arranged on the base, the circular columns are respectively located at the four corners of the rectangle, the top ends of the circular columns are fixedly connected to each other via a connecting frame, and the sleeve is fixedly arranged on the connecting frame; the mounting frame includes four sleeves arranged in a one-to-one correspondence with the circular columns, and the sleeves can be slidably mounted on the corresponding circular columns; the placement layer also includes two connecting arms arranged left and right and arranged along the front-to-back direction, the two ends of the connecting arms are fixedly mounted on the sleeves, and the limiting sections at both ends of the support roller are rotatably connected to the connecting arms via a bearing structure. The sleeves can be slidably mounted on the circular columns via linear bearings, and the horizontal height of the top end of the support roller needs to be higher than the horizontal height of the top end of the connecting arm on which it is located.

[0014] Furthermore, a square hole-shaped adjustment hole is provided at the bottom end of the vertical rod along its length direction, the mounting section is in the shape of a square rod and is inserted into the adjustment hole, and the outer side wall of the mounting section is arranged to fit the inner side wall of the adjustment hole, and a threaded hole connected to the adjustment hole is also provided on the outer side wall of the vertical rod corresponding to the adjustment hole, a fastening screw is provided in the threaded hole, and the fastening screw abuts against the surface of the mounting section.

[0015] The principle and effect of the present invention are further explained below in conjunction with the above technical solutions and the accompanying drawings: During the transfer process of the substrate according to the present invention, the third conveying surface for receiving / conveying the substrate can be always flush with the first conveying surface / the second conveying surface by lifting and lowering the storage rack on the transfer device, so that the third conveying surface can continuously receive / convey the substrate on the horizontal plane, that is, there is no need to grab the substrate layer by layer, so there is no process of performing multiple positioning and clamping actions, which can effectively improve the transfer efficiency of the substrate between the pre-treatment section and the transfer device, and the substrate between the electroplating section and the transfer device, thereby achieving the effect of increasing the speed of transferring the substrate from the pre-treatment section to the electroplating section, and avoiding the situation where the transfer speed of the substrate cannot meet the production speed of the electroplating section. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the connection structure between the pre-processing section and the transfer device according to an embodiment of the present invention; Figure 2 Schematic diagram of the connection structure between the electroplating section and the transfer device according to an embodiment of the present invention; Figure 3 This is a schematic top view of the transfer device according to an embodiment of the present invention. Reference numerals

[0017] 1-pretreatment section, 111-first conveyor belt, 112-first conveying surface, 12-second cross bar, 21-base, 211-roller structure, 22-mounting frame, 221-circular column, 222-connecting frame, 223-air avoidance structure, 231-mounting frame, 2311-sleeve, 232-support roller, 2321-limiting section, 233-connecting arm, 241-clamping plate, 25-sleeve, 26-electric screw, 27-baffle, 3-electroplating section, 311-second conveyor belt, 312-second conveying surface, 32-first cross bar, 33-vertical bar, 331-mounting section, 332-driving wheel, 333-fastening screw. DETAILED DESCRIPTION

[0018] To facilitate understanding by those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments: like Figure 1-3A vertical continuous copper plating line for PCBs, comprising a pre-treatment section 1 and an electroplating section 3, wherein the pre-treatment section 1 has an output device, the output device comprising a first conveyor belt 111 having a first conveying surface 112; the electroplating section 3 has an input device, the input device comprising a second conveyor belt 311 having a second conveying surface 312; and a transfer device, the transfer device comprising a base 21 having a mounting frame 22, and a storage rack movably mounted on the mounting frame 22, the storage rack comprising a mounting frame 231 and a plurality of placement partitions arranged vertically and equidistantly, the placement partitions comprising a plurality of support rollers 23 rotatably mounted on the mounting frame 231. 2. The support rollers 232 are arranged along the left-right direction and their top ends are located in the same horizontal plane, forming a third conveying surface; the input device also includes at least one first cross bar 32 arranged above the second conveying surface 312, the first cross bar 32 is arranged along the conveying direction of the second conveying surface 312, a vertical rod 33 is vertically provided at the lower end of the first cross bar 32, the lower end of the vertical rod 33 is provided with a mounting section 331 which can be adjusted up and down, a driving wheel 332 is provided on the mounting section 331, the driving wheel 332 is located on the upstream side of the second conveyor belt 311, and the horizontal height of the bottom end of the driving wheel 332 is not lower than the horizontal height of the second conveying surface 312.

[0019] In the present invention, during the copper plating process of the PCB, the pre-treatment section 1 is used to pre-treat the substrate, including chemical degreasing / cleaning, micro-etching, water washing, etc., and its output device is used to transport the pre-treated substrate out of the pre-treatment section 1, specifically using the first conveyor belt 111 to transport the substrate on the first conveying surface 112; the electroplating section 3 is used to deposit a copper layer on the surface and in the hole of the pre-treated substrate, and its input device is used to transport the substrate into the electroplating section 3, specifically using the second conveyor belt 311 to transport the substrate on the second conveying surface 312.

[0020] In the present invention, the transfer device is used to receive and store substrates from the output device, and to transport the substrates stored thereon to the input device, thereby realizing the transfer of substrates between the pre-processing section 1 and the electroplating section 3. When the transfer device performs the substrate pickup and delivery operation, it needs to move to the corresponding pre-processing section 1 and electroplating section 3, so that the third conveying surface is connected with the corresponding first conveying surface 112 and second conveying surface 312. Specifically: when the transfer device is used to receive the substrate from the pre-processing section 1, after the transfer device is close to the output device, it is necessary to make the third conveying surface on the lowest placement layer of the transfer device close to the first conveying surface 112 and flush with the first conveying surface 112, and make the support roller 232 perpendicular to the conveying direction of the first conveying surface 112. At this time, the third conveying surface The first conveying surface 112 is connected with the first conveying surface 112, and the third conveying surface can receive the substrate from the first conveying surface 112, so that the substrate is transferred to the third conveying surface by the first conveying surface 112. Then, by moving the storage rack downward on the mounting rack 22 multiple times, and keeping the distance of each downward movement the same as the spacing between the placement layers, the first conveying surface 112 that is continuously conveying can convey the substrate to each placement layer in turn, thereby completing the transfer device's reception of the substrate; when the transfer device is used to convey the substrate on it to the electroplating section 3, when the transfer device is close to the input device After that, it is necessary to make the third conveying surface of the transfer device where the interlayer is placed at the top close to the second conveying surface 312 and flush with the second conveying surface 312, and make the support roller 232 perpendicular to the conveying direction of the second conveying surface 312. At the same time, it is also necessary to make the driving wheel 332 on the vertical rod 33 be located above the storage rack and staggered with the support roller 232 where the interlayer is placed. The height of the first cross bar 32 needs to be higher than the height of the transfer device to ensure that the first cross bar 32 can be smoothly moved to the top of the transfer device and will not affect the up and down movement of the storage rack. At this time, by moving down The mounting section 331 on the vertical rod 33 allows the drive wheel 332 to abut against the substrate on the uppermost placement layer. The rotation of the drive wheel 332 can realize the conveyance of the substrate on the placement layer, thereby conveying the substrate on the placement layer to the second conveying surface 312. Then, by repeatedly moving the storage rack upward, and making sure that the distance of each upward movement is the spacing between each placement layer, the drive wheel 332 can continuously convey the substrate on each placement layer to the second conveying surface 312, thereby completing the transfer of the substrate between the transfer device and the electroplating section 3. The drive wheel 332 is driven by a servo motor provided on the mounting section 331, and its drive connection structure can be a belt drive structure, a gear drive structure, etc.

[0021] As can be seen, in the present invention, when the transfer device receives substrates from the pre-processing section 1, the height of the third conveying surface for receiving the substrates can be changed by raising and lowering the storage rack, so that the height of the third conveying surface for receiving the substrates is always the same as the height of the first conveying surface 112. In this way, the transfer device can continuously receive substrates from the first conveying surface 112 on a horizontal plane. Similarly, when the transfer device transports substrates outward, the height of the third conveying surface for transporting substrates can be changed by raising and lowering the storage rack, so that the height of the third conveying surface for transporting substrates is always the same as the height of the second conveying surface 312. In this way, the transfer device can continuously transport substrates on a horizontal plane to the second conveying surface 312. In other words, during the transfer process of the substrates, the present invention does not require the substrates to be grasped layer by layer, and therefore does not require the process of performing multiple positioning and clamping actions. This can effectively improve the transfer efficiency of substrates between the pre-processing section 1 and the transfer device, and between the electroplating section 3 and the transfer device, thereby achieving the effect of increasing the speed of substrate transfer from the pre-processing section 1 to the electroplating section 3, and avoiding the situation where the substrate transfer speed cannot meet the production speed of the electroplating section 3.

[0022] In the present invention, the lifting and lowering of the storage rack on the mounting frame 22 is achieved by an electric screw 26 installed on the base 21, and the power output part of the electric screw 26 is fixedly connected to the storage rack. The power supply of the electric screw 26 can be a battery installed on the base 21 or an external power supply.

[0023] In one embodiment, a conveying station is formed on the transfer device, and the conveying station and the first conveying surface 112 and the second conveying surface 312 are located at the same horizontal height.

[0024] In this embodiment, the conveying station is a working station of the third conveying surface, which receives and conveys substrates at the conveying station. The conveying station is located at the same level as the first conveying surface 112 and the second conveying surface 312. Therefore, when the transfer device receives and conveys substrates, the storage rack can complete the substrate receiving and conveying process by descending and ascending along a fixed spacing (the spacing between adjacent partitions), eliminating the need to reposition the storage rack, effectively simplifying its operation and improving its convenience.

[0025] In one embodiment, both ends of the support roller 232 are formed with a limiting section 2321 that is cylindrical and coaxial with the support roller 232, and the limiting sections 2321 located in the same vertical plane in different placement compartments are combined to form a limiting section 2321 group; a braking assembly is provided on the base 21 corresponding to the limiting section 2321 group, and the braking assembly includes two clamping plates 241 vertically arranged on the base 21, and the two clamping plates 241 are respectively located at the front and rear sides of the corresponding limiting section 2321 group and abut against the limiting sections 2321 in the limiting section 2321 group; when the third conveying surface of the placement compartment in the storage rack is located at the conveying station, its limiting section 2321 is located above the brake assembly, and the limiting sections 2321 of the placement compartment below the placement compartment all abut against the clamping plates 241. Preferably, the inner wall of the clamping plate 241 is provided with a rubber layer to increase the friction between the inner wall of the clamping plate 241 and the limiting section 2321, thereby achieving a better braking effect.

[0026] In this embodiment, the brake assembly on the base 21 brakes the limiting segment 2321 through the contact between the clamping plate 241 and the limiting segment 2321, thereby achieving braking of the support roller 232 to prevent the support roller 232 from rotating. When the third conveying surface where the interlayer is placed moves to the conveying station, the brake segment where the interlayer is placed will move to the top of the brake assembly and be disengaged from the brake of the brake assembly.

[0027] In this embodiment, during the process of receiving substrates by the transfer device, the storage rack moves downward. Therefore, after the third conveying surface of the storage layer receives the substrate at the conveying station, as the storage rack moves downward, the support roller 232 of the storage layer moves between the corresponding clamping plates 241 when the storage layer above it receives the substrate, and is fixed by the brake assembly. At this time, the support roller 232 on the storage layer is fixed, preventing the substrate from sliding off the freely rotating support roller 232. It can be seen that the present invention can automatically fix the support roller 232 and the substrate thereon during the process of transferring substrates by the transfer device, effectively preventing the clamping plates 241 of the transfer device from sliding off the storage layer during the operation and movement of the transfer device. In the process of unloading substrates by the transfer device, the storage rack moves upward. The third conveying surface of the storage layer to be transported by the substrate moves up to the conveying station. At this time, the limiting section 2321 of the storage layer will leave the brake assembly, and the driving wheel 332 can smoothly drive the substrate on the storage layer to move.

[0028] In addition, in this embodiment, the clamps 241 are located on the left and right sides of the placement partition. Therefore, after each placement partition is stored with substrates, the clamps 241 located on the left and right sides of the placement partition can also block and limit the substrates on the placement partition in the left and right directions, thereby preventing the substrates from sliding off the placement partition in the left and right directions during the movement of the transfer device.

[0029] In one embodiment, a baffle 27 is vertically provided on the base 21 corresponding to the storage rack, the baffle 27 is located at the rear side of the placement partition, and the horizontal height of the top end of the baffle 27 is higher than the horizontal height of the conveying station.

[0030] In this embodiment, the baffle 27 is fixedly arranged on the base 21 and is located on the rear side of the placement partition. Therefore, the baffle 27 can block the substrate on the placement partition at the rear side of the placement partition. Therefore, when the transfer device receives the substrate, the front side of the placement partition is connected to the first conveying surface 112 to prevent the substrate from sliding off the placement partition under the action of inertia. In addition, due to the existence of the baffle 27, when the transfer device is used to output the substrate, the substrate also needs to be output from the front side of the placement partition.

[0031] In addition, in this embodiment, in order to detect whether the substrate enters the placement partition and whether it leaves the placement partition, a sensor can be set on the mounting frame 22 and located on the front side of the placement partition, such as a photoelectric sensor, an infrared sensor, an ultrasonic sensor, etc., to detect the position status of the substrate.

[0032] In one embodiment, the vertical rod 33 is arranged in the middle of the lower end of the first cross bar 32; the transfer device also includes a locking mechanism for connecting to the input device, and the locking mechanism includes a sleeve 25 arranged corresponding to the first cross bar 32, the sleeve 25 is fixedly arranged on the mounting frame 22 and arranged along the front-to-back direction, and a socket is formed in the sleeve 25 and passes through it along the front-to-back direction, the socket is used for inserting the first cross bar 32 and the inner diameter of the socket is the same as the diameter of the first cross bar 32; a first slot is provided on the sleeve 25 and passes through it up and down, and a second slot is provided on the first cross bar 32 corresponding to the first slot and passes through the first cross bar 32 up and down, and the cross-section is the same as the first slot; when the first slot and the second slot are aligned in the up and down direction, the vertical rod 33 is located above the storage rack, and the vertical rod 33 is located between any two adjacent support rollers 232.

[0033] In this embodiment, the transfer device and the electroplating section 3 can be fixed by inserting the first crossbar 32 into the insertion hole of the sleeve 25, and using an insertion rod that matches the shape of the first slot to be inserted into the first slot and the second slot at the same time, thereby ensuring that the driving wheel 332 can smoothly drive the substrate on the placement partition, ensuring the smooth transfer process of the substrate between the transfer device and the electroplating section 3. Among them, since the vertical rod 33 is located between the two adjacent support rollers 232, the presence of the vertical rod 33 will not affect the upward movement of the storage rack. At the same time, the mounting rack 22 needs to be provided with a clearance structure 223 corresponding to the vertical rod 33 to prevent the presence of the mounting rack 22 from blocking the vertical rod 33 from moving above the placement partition.

[0034] In one embodiment, when the first slot and the second slot are aligned in the vertical direction, the end of the sleeve 25 abuts against the vertical rod 33 .

[0035] In this embodiment, the abutment between the sleeve 25 and the vertical rod 33 indicates that the transfer device is moved into position relative to the electroplating section 3, that is, the existence of the vertical rod 33 can position the transfer device when the locking device fixes the transfer device and the electroplating section 3, thereby quickly completing the fixation of the transfer device and the electroplating section 3.

[0036] In one embodiment, the output device also includes a second cross bar 12 arranged above the first conveying surface 112, the diameter of the second cross bar 12 is the same as the diameter of the first cross bar 32, and the second cross bar 12 is arranged along the conveying direction of the first conveying surface 112, and one end of the second cross bar 12 extends to the downstream side of the second conveyor belt 311.

[0037] In this embodiment, by inserting the second cross bar 12 into the socket of the sleeve 25, the positioning between the transfer device and the pre-processing section 1 can be achieved, and the first conveying surface 112 and the third conveying surface can be avoided from being misaligned when transferring the substrate, thereby ensuring the stability of the connection between the first conveying surface 112 and the third conveying surface.

[0038] In one embodiment, a third slot is formed on the second crossbar 12 corresponding to the first slot, passing through the second crossbar 12 vertically and having the same cross-section as the first slot.

[0039] In this embodiment, by using an insertion rod that matches the shape of the first slot and inserting it into the first slot and the third slot at the same time, the sleeve 25 and the second insertion rod can also be fixed, thereby avoiding the first conveying surface 112 and the third conveying surface from contacting and colliding with each other, and further ensuring the stability of the connection between the first conveying surface 112 and the third conveying surface.

[0040] In addition, in this embodiment, in order to facilitate the movement of the transfer device, a roller structure 211 may be provided on the base 21 .

[0041] In one embodiment, the mounting frame 22 includes four circular columns 221 vertically mounted on the base 21. The circular columns 221 are located at the four corners of a rectangle. The top ends of the circular columns 221 are fixedly connected to each other via a connecting frame 222. The sleeve 25 is fixedly mounted on the connecting frame 222. The mounting frame 231 includes four sleeves 2311 corresponding to the circular columns 221. The sleeves 2311 are slidably mounted on the corresponding circular columns 221. The placement compartment also includes two connecting arms 233 arranged left and right and arranged along the front-to-back direction. The ends of the connecting arms 233 are fixedly mounted on the sleeves 2311. The limiting sections 2321 at both ends of the support roller 232 are rotatably connected to the connecting arms 233 via a bearing structure. The sleeves 2311 can be slidably mounted on the circular columns 221 via linear bearings. The top of the support roller 232 needs to be higher than the top of the connecting arm 233.

[0042] In one embodiment, a square hole-shaped adjustment hole is provided at the bottom end of the vertical rod 33 along its length direction, the mounting section 331 is in the shape of a square rod and is inserted into the adjustment hole, and the outer side wall of the mounting section 331 is arranged to fit the inner side wall of the adjustment hole, and a threaded hole corresponding to the adjustment hole is also provided on the outer side wall of the vertical rod 33 to connect with the adjustment hole, a fastening screw 333 is provided in the threaded hole, and the fastening screw 333 abuts against the surface of the mounting section 331.

[0043] The above embodiments merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A vertical continuous copper plating line for PCB, comprising a pre-treatment section and an electroplating section, characterized in that: The pre-processing section has an output device, which includes a first conveyor belt forming a first conveying surface; the electroplating section has an input device, which includes a second conveyor belt forming a second conveying surface; it also includes a transfer device, which includes a base provided with a mounting frame, and a storage rack which can be lifted and lowered on the mounting frame, the storage rack includes a mounting frame and a plurality of placement partitions arranged up and down and equidistantly arranged, the placement partitions include a plurality of support rollers rotatably arranged on the mounting frame, the support rollers are arranged along the left and right directions and their top ends are located in the same horizontal plane to form a third conveying surface; the input device also includes at least one first cross bar arranged above the second conveying surface, the first cross bar is arranged along the conveying direction of the second conveying surface, the lower end of the first cross bar is vertically provided with a vertical bar, the lower end of the vertical bar is adjustable up and down and provided with a mounting section, the mounting section is provided with a driving wheel, the driving wheel is located on the upstream side of the second conveyor belt, and the horizontal height of the bottom end of the driving wheel is not lower than the horizontal height of the second conveying surface.

2. The vertical continuous copper plating line for PCB according to claim 1, characterized in that: A conveying station is formed on the transfer device, and the conveying station and the first conveying surface and the second conveying surface are located at the same horizontal height. When the third conveying surface for placing the partition is located at the conveying station, the limiting section for currently placing the partition is located above the brake assembly.

3. The vertical continuous copper plating line for PCB according to claim 2, characterized in that: Both ends of the support roller are formed with a limiting segment that is cylindrical and coaxial with the support roller, and the limiting segments located in the same vertical plane in different placement layers are combined to form a limiting segment group; a brake assembly is provided on the base corresponding to the limiting segment group, and the brake assembly includes two plywood vertically arranged on the base, and the two plywood are respectively located on the front and rear sides of the corresponding limiting segment group and abut against the limiting segments in the limiting segment group.

4. The vertical continuous copper plating line for PCB according to claim 3, characterized in that: A baffle is vertically provided on the base corresponding to the storage rack, the baffle is located at the rear side of the placement compartment, and the horizontal height of the top end of the baffle is higher than the horizontal height of the conveying station.

5. The vertical continuous copper plating line for PCB according to claim 1, characterized in that: The vertical rod is arranged in the middle of the lower end of the first cross bar; the transfer device also includes a locking mechanism for connecting to the input device, the locking mechanism includes a sleeve arranged corresponding to the first cross bar, the sleeve is fixedly arranged on the mounting frame and arranged along the front-to-back direction, and a socket is formed in the sleeve and passes through it along the front-to-back direction, the socket is used for inserting the first cross bar and the inner diameter of the socket is the same as the diameter of the first cross bar; a first slot is provided on the sleeve and passes through it up and down, and a second slot is provided on the first cross bar corresponding to the first slot and passes through the first cross bar up and down and has the same cross-section as the first slot; when the first slot and the second slot are aligned in the up and down direction, the vertical rod is located above the storage rack, and the vertical rod is located between any two adjacent support rollers.

6. The vertical continuous copper plating line for PCB according to claim 5, characterized in that: When the first slot and the second slot are aligned in the up-down direction, the end of the sleeve abuts against the vertical rod.

7. The vertical continuous copper plating line for PCB according to claim 6, characterized in that: The output device also includes a second cross bar arranged above the first conveying surface, the diameter of the second cross bar is the same as the diameter of the first cross bar, and the second cross bar is arranged along the conveying direction of the first conveying surface, and one end of the second cross bar extends to the downstream side of the second conveyor belt.

8. The vertical continuous copper plating line for PCB according to claim 8, characterized in that: A third slot is formed on the second crossbar corresponding to the first slot and passes through the second crossbar vertically and has the same cross section as the first slot.

Images