Immersed server and heat dissipation system of immersed server

Abstract

The invention relates to an immersed server and a heat dissipation system of the immersed server. The immersion type server comprises a first shell, a second shell, a third shell and a fourth shell, and the first shell is internally provided with a containing space; a first punching plate is arranged at one end of the first shell, a second punching plate is arranged at the other end of the first shell, and the first punching plate is opposite to the second punching plate; the main plate is arranged in the containing space in the arrangement direction of the first perforated plate and the second perforated plate, the containing space is divided into a first subspace and a second subspace by the main plate, and the arrangement direction of the first subspace and the arrangement direction of the second subspace intersect with the arrangement direction of the first perforated plate and the arrangement direction of the second perforated plate; the mainboard is provided with a first surface and a second surface which are opposite to each other, the first surface is provided with a first heating element which is located in the first subspace, and the second surface is provided with a second heating element which is located in the second subspace; the heating amount of the first heating element is greater than that of the second heating element. The heat dissipation upper limit of the immersed server can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to an immersion server and a heat dissipation system for the immersion server. Background Art

[0002] As the power consumption of electronic components in servers continues to increase, air cooling has gradually reached the heat dissipation bottleneck of servers.

[0003] In order to improve the heat dissipation efficiency of electronic components in the server, related technologies immerse the entire server in a liquid cooling medium, drive the liquid cooling medium through a circulating pump, take away the heat of the electronic components in the server, and then cool it in an external heat exchanger.

[0004] However, as the power consumption of electronic components continues to increase, the upper limit of heat dissipation of immersion liquid cooling is limited. Summary of the Invention

[0005] The embodiments of the present application provide an immersion server and a heat dissipation system for the immersion server, which can increase the heat dissipation upper limit of the immersion server and expand the scope of application of the immersion liquid cooling method.

[0006] In one aspect, an embodiment of the present application provides an immersive server, comprising:

[0007] A first shell having a receiving space therein; a first perforated plate provided at one end of the first shell and a second perforated plate provided at the other end of the first shell, the first perforated plate being opposite to the second perforated plate;

[0008] The mainboard is arranged in the accommodating space along the arrangement direction of the first punched plate and the second punched plate. The mainboard divides the accommodating space into a first subspace and a second subspace. The arrangement direction of the first subspace and the second subspace intersects with the arrangement direction of the first punched plate and the second punched plate. The mainboard has a first surface and a second surface relative to each other. The first surface is provided with a first heating element, and the first heating element is located in the first subspace. The second surface is provided with a second heating element, and the second heating element is located in the second subspace. The heat generated by the first heating element is greater than the heat generated by the second heating element.

[0009] In one embodiment, a first heat sink is provided in the first subspace, and the first heat sink is in thermal contact with the first heating element; the first heat sink comprises:

[0010] a temperature averaging plate, covering and extending within the first subspace on a cross section of the accommodation space, the temperature averaging plate covering the mainboard, and in thermal contact with the first heating element;

[0011] A plurality of first heat dissipation fins are arranged on a side of the temperature homogenizing plate facing away from the mainboard; and gaps are provided between adjacent heat dissipation fins for cooling medium to flow.

[0012] In one embodiment, a motherboard tray is provided in the first subspace, the motherboard is provided on the motherboard tray; the motherboard tray is provided with a through hole, and the first heating element is located in the through hole;

[0013] The first radiator is located on the side of the mainboard tray facing away from the mainboard, and a protrusion is provided on the side of the temperature homogenizing plate facing the mainboard, and the protrusion is in thermal contact with the first heating element.

[0014] In one embodiment, a first thermally conductive interface layer is provided on the protrusion, and the first thermally conductive interface layer is in thermal contact with the protrusion and the first heating element.

[0015] In one embodiment, the first heating element includes a first sub-heating element and a second sub-heating element, and the through hole includes a first sub-through hole and a second sub-through hole; the first sub-heating element is located in the first sub-through hole, and the second sub-heating element is located in the second sub-through hole.

[0016] In one embodiment, the second heating element includes a plurality of third sub-heating elements, and the plurality of third sub-heating elements are arranged at intervals; a second heat sink is provided in the second sub-space; and the second heat sink includes:

[0017] a heat conducting portion, the heat conducting portion being inserted between adjacent third sub-heating elements and being in thermal contact with the third sub-heating elements;

[0018] The heat dissipation part is connected to the heat conduction part by thermal conduction. The heat dissipation part is located outside the arrangement area of ​​the plurality of third sub-heating elements and has a plurality of gaps for the circulation of cooling medium.

[0019] In one embodiment, a second thermally conductive interface layer is provided between the thermally conductive portion and the third sub-heating element, and the second thermally conductive interface layer is in thermal contact with the third sub-heating element and the thermally conductive portion.

[0020] In one embodiment, the gaps between the plurality of first heat dissipation fins for the cooling medium to flow form a first flow cross-section; the gaps in the heat dissipation portion for the cooling medium to flow form a second flow cross-section; the area of ​​the first flow cross-section is greater than the area of ​​the second flow cross-section.

[0021] In one embodiment, a third perforated plate is provided in the accommodating space, and the third perforated plate blocks the cooling medium inlet of the second subspace.

[0022] On the other hand, an embodiment of the present application provides a heat dissipation system for an immersion server, comprising:

[0023] a second housing having a cooling medium inlet and a cooling medium outlet, the cooling medium inlet and the cooling medium outlet being disposed on opposite sides of the second housing;

[0024] A first flow equalizing plate is provided in the second housing, and the first flow equalizing plate is located at one end of the second housing close to the cooling medium inlet;

[0025] A second flow equalizing plate is disposed in the second housing, and the second flow equalizing plate is disposed opposite to the first flow equalizing plate at one end of the second housing close to the cooling medium outlet;

[0026] At least one of the aforementioned embodiments provides an immersion server, wherein the immersion server is disposed between a first current balancing plate and a second current balancing plate, and the first perforated plate of the immersion server faces the first current balancing plate.

[0027] The immersion server and the heat dissipation system of the immersion server provided in the embodiments of the present application are configured by arranging a first perforated plate at one end of the first shell of the immersion server and a second perforated plate at the other end, and the first perforated plate and the second perforated plate are arranged opposite to each other; in this way, the cooling medium for cooling the electronic components inside the server can flow from the holes on the first perforated plate into the accommodating space of the first shell, and flow out from the holes on the second perforated plate, thereby completely immersing the electronic components in the accommodating space through the cooling medium, and can quickly take away the heat emitted by the electronic components through the cooling medium, thereby facilitating cooling and heat dissipation of the server.

[0028] In addition, by arranging a mainboard in the accommodating space, the mainboard is arranged in the accommodating space along the arrangement direction of the first perforated plate and the second perforated plate, so that the mainboard can divide the accommodating space into a first sub-space and a second sub-space, and the arrangement direction of the first sub-space and the second sub-space intersects with the arrangement direction of the first perforated plate and the second perforated plate; and a first heating element is arranged on the first surface of the mainboard, and a second heating element is arranged on the second surface of the mainboard; in this way, the first heating element can be located in the first sub-space, and the second heating element can be located in the second sub-space, and the heat generated by the first heating element is greater than the heat generated by the second heating element. In this way, the first heating element and the second heating element with different heat generation can be distributed in the first sub-space and the second sub-space on both sides of the mainboard. After the cooling medium enters the accommodating space, it can flow to the first sub-space and the second sub-space respectively. At this time, the flow rate of the cooling medium flowing to the first sub-space can be increased, so that the cooling medium concentrates on cooling and dissipating the first heating element with larger heat generation, which can fully utilize the cooling medium, improve the heat dissipation upper limit of the immersion server, and improve the scope of application of the immersion liquid cooling method. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic structural diagram of a heat dissipation system for an immersion server provided in some embodiments of the present application.

[0030] Figure 2 This is a schematic diagram of the overall structure of the immersion server provided in some embodiments of the present application.

[0031] Figure 3 It is along Figure 2 Sectional view along line AA.

[0032] Figure 4 This is a schematic diagram of the exploded structure of the immersion server provided in some embodiments of the present application.

[0033] Figure 5 This is a schematic diagram of the exploded structure of the cooperation between the mainboard and the first and second radiators in the immersion server provided in some embodiments of the present application.

[0034] Figure 6 This is a cross-sectional view of the cooperation between the mainboard and the first and second radiators in the immersion server provided in some embodiments of the present application.

[0035] Figure 7 yes Figure 6 A magnified partial view of point B in the middle.

[0036] Figure 8 This is another cross-sectional view of the cooperation between the mainboard and the first and second radiators in the immersion server provided in some embodiments of the present application.

[0037] Figure 9 yes Figure 8 A magnified partial view of point C in the middle.

[0038] Figure 10 yes Figure 6 A magnified partial view of point D in the middle.

[0039] Figure 11 yes Figure 8 A magnified partial view of point E in the middle.

[0040] Description of reference numerals:

[0041] 10-immersed server; 20-second housing;

[0042] 110 - first housing; 120 - mainboard; 130 - first radiator; 140 - mainboard tray; 150 - second radiator; 201 - cooling medium inlet; 202 - cooling medium outlet; 210 - first flow equalizing plate; 220 - second flow equalizing plate;

[0043] 111 - Accommodation space; 112 - First perforated plate; 113 - Second perforated plate; 114 - Third perforated plate; 121 - First surface; 122 - Second surface; 123 - First heating element; 124 - Second heating element; 131 - Temperature equalizing plate; 132 - First heat sink; 141 - Through hole; 151 - Heat conduction portion; 152 - Heat dissipation portion;

[0044] 1111-first sub-space; 1112-second sub-space; 1231-first sub-heating element; 1232-second sub-heating element; 1241-third sub-heating element; 1301-first flow section; 1311-protrusion; 1312-first thermal interface layer; 1411-first sub-through hole; 1412-second sub-through hole; 1501-second flow section; 1511-second thermal interface layer; 1521-second heat sink fin. DETAILED DESCRIPTION

[0045] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0046] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0047] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0048] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0049] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0050] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0051] The embodiments of the present application are described in detail below in conjunction with the drawings in the specification of the embodiments of the present application.

[0052] Reference Figure 1 As shown, Figure 1 Schematic diagram of the heat dissipation system of an immersion server provided in some embodiments of the present application. The heat dissipation system of the immersion server provided in the embodiments of the present application includes a second housing 20. The second housing 20 can be a sealed housing that can serve as a container for the immersion server 10.

[0053] For some examples, refer to Figure 1 As shown, the second housing 20 may have a cooling medium inlet 201. The cooling medium inlet 201 may be connected to a medium flow pipe of the cooling system.

[0054] In some examples, the cooling medium may include a liquid cooling medium.

[0055] In some examples, the liquid cooling medium may include an insulating liquid cooling medium.

[0056] In some examples, the liquid cooling medium may include any one of natural insulating oil, synthetic insulating oil, and electronic fluorinated liquid. It should be understood that the specific types of liquid cooling media in the embodiments of the present application are only shown as some specific examples and are not intended to limit the specific types of liquid cooling media.

[0057] For some examples, refer to Figure 1 As shown, the second housing 20 may have a cooling medium outlet 202. The cooling medium outlet 202 may be disposed on an opposite side of the second housing 20 from the cooling medium inlet 201. In other words, the cooling medium inlet 201 may be disposed on one side of the second housing 20, and the cooling medium outlet 202 may be disposed on the other side of the second housing 20 opposite the cooling medium inlet 201.

[0058] In some examples, the cooling medium can enter the second shell 20 from the cooling medium inlet 201 to cool the immersion server 10 in the second shell 20, and then the heated cooling medium can leave the second shell 20 from the cooling medium outlet 202 and be cooled in an external heat exchanger.

[0059] For some examples, refer to Figure 1 As shown, the heat dissipation system of the immersion server 10 may include a first current equalizing plate 210 . The first current equalizing plate 210 may be disposed in the second housing 20 .

[0060] In some examples, the first flow equalizer 210 can be located at one end of the second housing 20 near the cooling medium inlet 201. That is, after the cooling medium enters the second housing 20 through the cooling medium cold port, it can be evenly distributed to various parts of the second housing 20 under the action of the first flow equalizer 210, thereby facilitating uniform heat dissipation for the immersion server 10 disposed in the second housing 20.

[0061] For some examples, refer to Figure 1 As shown, the heat dissipation system of the immersion server 10 may include a second current equalizing plate 220 . The second current equalizing plate 220 may be disposed in the second housing 20 .

[0062] In some examples, the second equalizing plate 220 can be located at one end of the second housing 20 near the cooling medium outlet 202. The second equalizing plate 220 can be positioned opposite the first equalizing plate 210. That is, after the cooling medium cools the immersion server 10, it must pass through the second equalizing plate 220 before flowing to the cooling medium outlet 202. In this way, the second equalizing plate 220 can provide a flow barrier for the cooling medium, facilitating sufficient contact between the cooling medium and the immersion server 10.

[0063] For some examples, refer to Figure 1 As shown, the heat dissipation system of the immersion server 10 may include at least one immersion server 10. The immersion server 10 may be disposed between a first current balancing plate 210 and a second current balancing plate 220.

[0064] For some examples, refer to Figure 2 and Figure 3 As shown, Figure 2 This is a schematic diagram of the overall structure of the immersion server provided in some embodiments of the present application. Figure 3 It is along Figure 2 The immersion server may include a first shell. Figure 3 As shown, the first housing 110 may have an accommodation space 111 therein. Electronic components of the server may be disposed in the accommodation space 111.

[0065] In some examples, in order to facilitate the cooling medium to immerse the electronic components inside the immersion server 10 for heat dissipation, refer to Figure 2 and Figure 3 As shown, a first perforated plate 112 may be provided at one end of the first housing 110. The first perforated plate 112 may be a porous plate.

[0066] In some examples, the first perforated plate 112 may face the first current equalizing plate 210 , so that the cooling medium can enter the accommodating space 111 in the first housing 110 through the holes on the first current equalizing plate 210 and the first perforated plate 112 .

[0067] In some examples, the holes on the first perforated plate 112 may be arranged in an array, so that the cooling medium can enter the accommodating space 111 evenly.

[0068] In some examples, after the cooling medium cools and dissipates the heat of the electronic components, in order to facilitate the cooling medium to be removed from the accommodation space 111, refer to Figure 3 As shown, a second punch plate 113 may be provided at the other end of the first housing 110. The second punch plate 113 may be disposed opposite to the second punch plate 113.

[0069] In some examples, the second perforated plate 113 faces the second current equalizing plate 220. The second perforated plate 113 can be arranged in the same, similar or similar manner as the first perforated plate 112. For details, please refer to the detailed description of the previous embodiment of the present application, which will not be repeated in this embodiment.

[0070] In some examples, the immersion server 10 may include a mainboard 120 . The mainboard 120 may be disposed in the accommodation space 111 .

[0071] In some examples, mainboard 120 may include an integrated circuit board.

[0072] In some examples, the mainboard 120 may include a printed circuit board (PCB), and electronic components may be disposed on the mainboard 120 .

[0073] In some examples, the main board 120 can be arranged in the receiving space 111 along the arrangement direction of the first punch plate 112 and the second punch plate 113 (for example Figure 3 In this way, the mainboard 120 can divide the accommodating space 111 into a first subspace 1111 and a second subspace 1112.

[0074] For some examples, refer to Figure 3 As shown, the arrangement direction of the first subspace 1111 and the second subspace 1112 (for example Figure 3 The direction indicated by the z-axis in FIG. 1 may intersect with the arrangement direction of the first punching plate 112 and the second punching plate 113.

[0075] In some examples, the arrangement direction of the first subspaces 1111 and the second subspaces 1112 may be orthogonal to the arrangement direction of the first punched plates 112 and the second punched plates 113 .

[0076] For some examples, refer to Figure 4 and Figure 5 As shown, Figure 4 This is a schematic diagram of the exploded structure of the immersion server provided in some embodiments of the present application. Figure 5 This is an exploded view of the structure of the motherboard, first heat sink, and second heat sink in an immersion server provided in some embodiments of the present application. The motherboard 120 may have a first surface 121 and a second surface 122. The first surface 121 and the second surface 122 may be two opposing surfaces of the motherboard 120.

[0077] For some examples, refer to Figure 5 As shown, the first surface 121 may be provided with a first heating element 123. The first heating element 123 may be located in the first subspace 1111.

[0078] For some examples, refer to Figure 4 As shown, the second surface 122 may be provided with a second heating element 124 . The second heating element 124 may be located in the second subspace 1112 .

[0079] In some examples, the heat generated by the first heating element 123 may be greater than the heat generated by the second heating element 124 .

[0080] In some examples, the first heating element 123 may include a central processing unit (CPU).

[0081] In some examples, the first heating element 123 may include a graphics processing unit (GPU).

[0082] In some examples, the first heating element 123 may include a metal-oxide-semiconductor field-effect transistor (MOSFET) of virtual reality (VR) technology.

[0083] It can be understood that in some examples of the embodiments of the present application, the specific types of the first heating element 123 are only shown as some specific examples, and are not intended to limit the specific type of the first heating element 123 .

[0084] In some examples, the second heating element 124 may include a high-speed data flow interface (Mini Cool Edge IO; MCIO for short).

[0085] In some examples, the second heat generating component 124 may include a Dual-Inline-Memory-Module (DIMM).

[0086] It can be understood that in some examples of the embodiments of the present application, the specific types of the second heating element 124 are only shown as some specific examples, and are not intended to limit the specific types of the second heating element 124 .

[0087] In the embodiment of the present application, a first perforated plate 112 is provided at one end of the first shell 110 of the immersion server 10, and a second perforated plate 113 is provided at the other end, and the first perforated plate 112 and the second perforated plate 113 are arranged opposite to each other; in this way, the cooling medium for cooling the electronic components inside the server can flow from the holes on the first perforated plate 112 into the accommodating space 111 of the first shell 110, and flow out from the holes on the second perforated plate 113, so that the electronic components in the accommodating space 111 are completely immersed by the cooling medium, and the heat generated by the electronic components can be quickly taken away by the cooling medium, which is convenient for cooling and dissipating the heat of the server.

[0088] In addition, by arranging the main board 120 in the accommodating space 111, the main board 120 is arranged in the accommodating space 111 along the arrangement direction of the first punched plate 112 and the second punched plate 113. In this way, the main board 120 can divide the accommodating space 111 into a first subspace 1111 and a second subspace 1112. The arrangement direction of the first subspace 1111 and the second subspace 1112 intersects with the arrangement direction of the first punched plate 112 and the second punched plate 113; and a first heating element 123 is arranged on the first surface 121 of the main board 120, and a second heating element 124 is arranged on the second surface 122 of the main board 120; in this way, the first heating element 123 can be located in the first subspace 1111, and the second heating element 124 can be located in In the second subspace 1112, the heat generated by the first heating element 123 is greater than the heat generated by the second heating element 124. In this way, the first heating element 123 and the second heating element 124 with different heat values ​​can be distributed in the first subspace 1111 and the second subspace 1112 on both sides of the mainboard 120. After the cooling medium enters the accommodating space 111, it can flow to the first subspace 1111 and the second subspace 1112 respectively. At this time, the flow rate of the cooling medium flowing to the first subspace 1111 can be increased, so that the cooling medium concentrates on cooling and dissipating the first heating element 123 with a larger heat value, which can fully utilize the cooling medium, improve the heat dissipation upper limit of the immersion server 10, and improve the applicability of the immersion liquid cooling method.

[0089] In some examples, in order to improve the upper limit of heat dissipation of the first heating element 123, refer to Figure 3 As mentioned above, a first heat sink 130 may be provided in the first subspace 1111 .

[0090] For some examples, refer to Figure 6 As shown, Figure 6 This is a cross-sectional view of the motherboard, first heat sink, and second heat sink in an immersion server provided in some embodiments of the present application. The first heat sink 130 can be in thermal contact with the first heating element 123. In other words, the heat generated by the first heating element 123 during operation can be transferred to the first heat sink 130. The cooling medium contacts the first heat sink 130, thereby removing the heat from the first heat sink 130.

[0091] For some examples, refer to Figure 4-Figure 6 As shown, the first heat sink 130 may include a temperature vapor chamber 131 . The temperature vapor chamber 131 may cover the first surface 121 of the mainboard 120 .

[0092] For some examples, refer to Figure 4 As shown, the temperature homogenizing plate 131 can be covered and expanded in the first subspace 1111 on the cross section of the accommodating space 111 .

[0093] In some examples, the temperature evaporating plate 131 can be made of a thermally conductive material. For example, the temperature evaporating plate 131 can include a copper plate, an aluminum plate, a silver plate, or any one of a copper foil plate, an aluminum foil plate, and a silver corrugated plate. It should be understood that in the embodiments of the present application, the materials of the temperature evaporating plate 131 are shown as some specific examples only and are not intended to limit the specific material of the temperature evaporating plate 131.

[0094] In some examples, the temperature vapor chamber 131 may include a vacuum chamber (VC) temperature vapor chamber 131 .

[0095] In some examples, the vapor chamber 131 can be in thermal contact with the first heating element 123 .

[0096] In some examples of the embodiments of the present application, since the first heating element 123 and the second heating element 124 are respectively arranged on both sides of the mainboard 120; when the temperature equalizing plate 131 is in thermal contact with the first heating element 123, there is no need to avoid the second heating element 124 with a higher height. The temperature equalizing plate 131 can be laid to the maximum area of ​​the first subspace 1111 in the first subspace 1111, for example, the temperature equalizing plate 131 covers the entire first surface 121 of the mainboard 120. In this way, the contact area between the first radiator 130 and the cooling medium can be increased, thereby increasing the heat dissipation upper limit of the radiator system of the immersion server 10 for the immersion server 10, and can improve the applicability of the heat dissipation system.

[0097] For some examples, refer to Figure 5 and Figure 6 As shown, the first heat sink 130 may include a plurality of first heat dissipating fins 132. The plurality of first heat dissipating fins 132 may be arranged on a side of the temperature vapor chamber 131 facing away from the mainboard 120.

[0098] In some examples, the first heat sink 132 can be made of a thermally conductive material. The material of the first heat sink 132 can be the same, similar, or similar to that of the vapor chamber 131. For details, please refer to the detailed description of the vapor chamber 131 in the previous embodiment of this application, which will not be repeated in this embodiment.

[0099] In some examples, the first heat dissipating fins 132 may extend along the arrangement direction of the first perforated plate 112 and the second perforated plate 113. Figure 3 As shown, the first heat dissipation fins 132 can be along Figure 3 The x-axis extends in the direction shown.

[0100] In some examples, the arrangement direction of the plurality of first heat dissipating fins 132 may intersect with the arrangement direction of the first perforated plate 112 and the second perforated plate 113. Figure 3 As shown, the plurality of first heat dissipating fins 132 may be arranged along Figure 3The direction shown on the y-axis.

[0101] In some examples, gaps for cooling medium to flow may be provided between adjacent first heat dissipation fins 132 .

[0102] In some examples, by providing multiple first heat dissipation fins 132, the contact area between the cooling medium and the first radiator 130 can be increased, so that the cooling medium can promptly take away the heat generated by the first heating element 123, thereby improving the heat dissipation efficiency of the first heating element 123, improving the heat dissipation upper limit of the immersion server 10, and improving the scope of application of the immersion server 10.

[0103] In some examples, a phase change material can be provided within the first heat sink 130. Heat generated by the first heating element 123 during operation can be transferred to the temperature-dispersing plate 131 through thermal contact. The temperature-dispersing plate 131 can evenly disperse the heat within the first subspace 1111, causing the phase change material within the first heat sink 130 to vaporize due to the heat. When the cooling medium flows through the flow gaps between adjacent first heat sink fins 132, the cooling medium removes heat from the first heat sink 130, and the phase change material within the first heat sink 130 liquefies, rapidly removing heat from the first heating element 123. This improves the heat dissipation efficiency of the first heating element 123 and raises the upper limit of the heat dissipation of the immersion server 10.

[0104] Furthermore, in the embodiment of the present application, by contacting the vapor chamber 131 of the first heat sink 130 with the first heating element 123, the temperature of the first heating element 123, which is concentrated due to its uneven distribution, can be transferred laterally, thereby ensuring the temperature consistency of the first heating element 123. Furthermore, the phase change process within the vapor chamber 131 can be used to transfer the temperature of the first heating element 123 to the lower temperature portion of the first heat sink 130, thereby increasing the upper limit of heat dissipation for the immersion server 10.

[0105] For some examples, refer to Figure 3 and Figure 4 As shown, a motherboard tray 140 may be provided in the first subspace 1111 . The motherboard 120 may be provided on the motherboard tray 140 .

[0106] In some examples, the motherboard tray 140 can be made of thermally conductive material.

[0107] In some examples, the motherboard tray 140 can support the motherboard 120. That is, the motherboard tray 140 can lift the motherboard 120 and place it in the middle of the accommodating space 111, so that the motherboard 120 divides the accommodating space 111 into a first subspace 1111 and a second subspace 1112.

[0108] For some examples, refer to Figure 4 and Figure 5 As shown, the motherboard tray 140 may be provided with a through hole 141. The through hole 141 may penetrate two opposite surfaces of the motherboard tray 140.

[0109] In some examples, the first heating element 123 can be located within the through-hole 141. That is, the first heating element 123 can pass through the through-hole 141 and thermally contact the vapor chamber 131 located on the other side of the motherboard tray 140. This facilitates direct transfer of heat generated by the first heating element 123 to the vapor chamber 131, improving the heat transfer efficiency between the first heating element 123 and the vapor chamber 131 and the heat dissipation efficiency of the first heating element 123.

[0110] In some examples, the first heat sink 130 may be located on a side of the motherboard tray 140 facing away from the motherboard 120 .

[0111] For some examples, refer to Figure 3 、 Figure 7-Figure 9 As shown, Figure 7 yes Figure 6 A magnified partial view of point B in the middle. Figure 8 This is another cross-sectional view of the cooperation between the mainboard and the first and second radiators in the immersion server provided in some embodiments of the present application. Figure 9 yes Figure 8 A partial enlarged view of point C in the middle. To facilitate thermal contact between the temperature vaporizer 131 and the first heating element 123 , a protrusion 1311 may be provided on the side of the temperature vaporizer 131 facing the main board 120 . The protrusion 1311 may be in thermal contact with the first heating element 123 .

[0112] In some examples, the protrusion 1311 may extend into the through hole 141 and contact the first heating element 123 .

[0113] In some examples, the protrusion 1311 may be made of a thermally conductive material.

[0114] In some examples, the protrusion 1311 can be integral with the temperature vapor chamber 131 .

[0115] In some examples of the embodiments of the present application, a motherboard tray 140 is provided within the first subspace 1111, and the motherboard 120 is placed on the motherboard tray 140. This facilitates supporting the motherboard 120 in the center of the accommodating space 111, thereby enabling the motherboard 120 to divide the accommodating space 111 into the first subspace 1111 and the second subspace 1112. A through hole 141 is provided on the motherboard 120, and the first heating element 123 is located within the through hole 141. A protrusion 1311 is provided on the side of the heat spreader 131 facing the motherboard 120, and the protrusion 1311 is in thermal contact with the first heating element 123. This facilitates heat transfer from the first heating element 123 to the heat spreader 131 through the first through hole 141 and the protrusion 1311, thereby improving the heat transfer efficiency of the first heating element 123 to the heat spreader 131 and raising the upper limit of heat dissipation for the immersion server 10.

[0116] For some examples, refer to Figure 7 As shown, a first thermal interface layer 1312 may be provided on the protrusion 1311 . The first thermal interface layer 1312 may be in thermal contact with the protrusion 1311 and the first heating element 123 .

[0117] In some examples, the first thermal interface layer 1312 can include any one of thermal grease, thermal gel, thermal pad, or thermal adhesive. It should be understood that in the embodiments of the present application, the materials of the first thermal interface layer 1312 are shown only as some specific examples and are not intended to limit the materials of the first thermal interface layer 1312.

[0118] In some examples, the first thermal interface layer 1312 may fill the contact gap between the protrusion 1311 and the first heating element 123 .

[0119] In an embodiment of the present application, a first thermal interface layer 1312 is provided on the protrusion 1311, so that the first thermal interface layer 1312 is in thermal contact with the protrusion 1311 and the first heating element 123; thus, the first thermal interface layer 1312 can fill the contact gap between the protrusion 1311 and the first heating element 123, thereby reducing the contact gap between the protrusion 1311 and the first heating element 123, thereby reducing the thermal resistance between the first heating element 123 and the protrusion 1311, and improving the efficiency of heat transfer from the first heating element 123 to the protrusion 1311, thereby improving the upper limit of heat dissipation of the immersion server 10.

[0120] For some examples, refer to Figure 8 As shown, the first heating element 123 may include a first heating sub-element 1231 and a second heating sub-element 1232 .

[0121] In some examples, the first sub-heating element 1231 may include electronic components such as the CPU and GPU described in detail in the previous embodiments of this application.

[0122] In some examples, the second sub-heating element 1232 may include electronic components such as the VR MOS described in detail in the previous embodiments of this application.

[0123] It can be understood that the first heating sub-element 1231 and the second heating sub-element 1232 may also be other types of electronic components.

[0124] For some examples, refer to Figure 3 and Figure 4 As shown, the through hole 141 may include a first sub-through hole 1411 and a second sub-through hole 1412 . The first sub-heating component 1231 may be located in the first sub-through hole 1411 , and the second sub-heating component 1232 may be located in the second sub-through hole 1412 .

[0125] In some examples, the thickness of the first heating sub-element 1231 and the second self-heating source may differ to a certain extent. For example, the thickness of the first heating sub-element 1231 may be greater than the thickness of the second heating sub-element 1232. In this case, the protrusion 1311 on the vapor chamber 131 may be provided only at the position corresponding to the second heating sub-element 1232. In other words, the thicker first heating sub-element 1231 can directly thermally contact the vapor chamber 131 through the first thermal interface layer 1312.

[0126] It can be understood that in some examples, in order to ensure the strength of the mainboard tray 140, the thickness of the mainboard tray 140 can be increased. At this time, in order to ensure thermal contact between the first sub-heating element 1231 and the temperature plate 131, a protrusion 1311 can be set at the position corresponding to the first sub-heating element 1231.

[0127] In some examples of the embodiments of the present application, a first sub-through hole 1411 and a second sub-through hole 1412 are provided on the mainboard tray 140, and the first sub-heating element 1231 is located in the first sub-through hole 1411, and the second sub-heating element 1232 is located in the second sub-through hole 1412. In this way, the through hole 141 is only provided at the positions corresponding to the first sub-heating element 1231 and the second sub-heating element 1232, thereby reducing the opening area on the mainboard tray 140, ensuring the strength of the mainboard tray 140, and facilitating the support of the mainboard 120 in the middle of the accommodating space 111, thereby dividing the accommodating space 111 into a first sub-space 1111 and a second sub-space 1112, so as to facilitate the diversion of the cooling medium in the first sub-space 1111 and the second sub-space 1112, thereby improving the heat dissipation upper limit of the immersion server 10.

[0128] For some examples, refer to Figure 6 As shown, the second heating element 124 may include a plurality of third heating sub-elements 1241 .

[0129] In some examples, the third sub-heating component 1241 may include a DIMM as described in detail in the previous embodiments of this application.

[0130] For some examples, refer to Figure 4 As shown, the plurality of third sub-heating elements 1241 are arranged at intervals. The arrangement direction of the plurality of third sub-heating elements 1241 may intersect with the arrangement direction of the first perforated plate 112 and the second perforated plate 113 .

[0131] For some examples, refer to Figure 4 As shown, multiple third sub-heating elements 1241 can be arranged along Figure 3 The direction indicated by the y-axis is arranged on the second surface 122 of the mainboard 120 .

[0132] For some examples, refer to Figure 3 As shown, a second radiator 150 may be provided in the second subspace 1112. The second radiator 150 may be in thermal contact with the third sub-heating element 1241, thereby quickly introducing heat generated by the third sub-heating element 1241 into the second subspace 1112 and transferring it to the cooling medium in the second subspace 1112.

[0133] For some examples, refer to Figure 6 As shown, the second heat sink 150 may include a heat conducting portion 151. The heat conducting portion 151 may be interposed between two adjacent third heat generating sub-components 1241. The heat conducting portion 151 may be in thermal contact with the third heat generating sub-components 1241.

[0134] In some examples, the heat conducting portion 151 may be made of a heat conducting material.

[0135] In some examples, the heat conducting portion 151 may be made of the same, similar or similar heat conducting material as the first heat sink 130 . For details, please refer to the detailed description of the first heat sink 130 in the aforementioned embodiment of the present application, which will not be elaborated in the embodiment of the present application.

[0136] For some examples, refer to Figure 6 As shown, the second heat sink 150 may include a heat dissipation portion 152. The heat dissipation portion 152 may be thermally connected to the heat conduction portion 151.

[0137] In some examples, the heat dissipation portion 152 may be directly connected to the heat conduction portion 151 , thereby transferring heat from the heat conduction portion 151 to the heat dissipation portion 152 for heat dissipation.

[0138] In some examples, the heat dissipation portion 152 may be connected to the heat conducting portion 151 via a heat conducting member, thereby transferring heat from the heat conducting portion 151 to the heat dissipation portion 152 for heat dissipation.

[0139] In some examples, the heat dissipation portion 152 may be located outside the arrangement area of ​​the plurality of third sub-heating elements 1241. In this way, the heat of the third sub-heating elements 1241 can be transferred to the outside of the arrangement area for heat dissipation, thereby making full use of the lateral space of the server within the limited space of the server and improving the space utilization of the server.

[0140] In some examples, the heat dissipation portion 152 may have a plurality of gaps for the cooling medium to flow through.

[0141] For some examples, refer to Figure 6 As shown, the heat dissipation portion 152 may be provided with a plurality of second heat dissipation fins 1521. The plurality of heat dissipation fins may be arranged at intervals.

[0142] In some examples, the arrangement direction of the plurality of heat dissipating fins may be consistent with the arrangement direction of the plurality of third heating sub-elements 1241 .

[0143] In some examples, the gaps between adjacent heat sinks form gaps in the heat sink 152 for the cooling medium to flow through. That is, in the second subspace 1112, the cooling medium can flow through the gaps between adjacent heat sinks, thereby removing heat conducted to the heat sinks through the heat conduction structure.

[0144] For some examples, refer to Figure 4 and Figure 6 As shown, two second heat sinks 150 may be provided, one of the two second heat sinks 150 is in thermal contact with a portion of the third sub-heating element 1241 , and the other second heat sink 150 is in thermal contact with the other portion of the third sub-heating element 1241 .

[0145] In some examples of the embodiments of the present application, a second radiator 150 is arranged in the second sub-space 1112, and the heat conducting portion 151 of the second radiator 150 is inserted between adjacent third sub-heating elements 1241 and is in thermal contact with the third sub-heating element 1241; in this way, the heat conducting portion 151 can conduct the heat generated by the third sub-heating element 1241 to the heat dissipation portion 152 that is thermally connected to the heat conducting portion 151 for heat dissipation, and by providing a plurality of flow gaps for the circulation of the cooling medium in the heat dissipation portion 152, the contact area between the cooling medium and the second radiator 150 is increased, thereby improving the heat dissipation efficiency of the third sub-heating element 1241.

[0146] In addition, the heat conducting portion 151 can be filled in the gap between adjacent third sub-heating elements 1241, which can reduce the flow cross-sectional area of ​​the cooling medium in the second sub-space 1112 and increase the flow resistance of the cooling medium in the second sub-space 1112, so that more cooling medium can flow from the first sub-space 1111 to dissipate heat to the first heating element 123 with a larger heat generation in the first sub-space 1111. The cooling medium can be fully utilized to dissipate heat to the first heating element 123 with a larger heat generation, thereby improving the heat dissipation upper limit of the immersion server 10.

[0147] For some examples, refer to Figure 10 and Figure 11 As shown, a second thermal interface layer 1511 may be provided between the heat conducting portion 151 and the third heat generating sub-element 1241 . The second thermal interface layer 1511 may be in thermal contact with the third heat generating sub-element 1241 and the heat conducting portion 151 .

[0148] In some examples, the material type of the second thermal interface layer 1511 can be the same, similar or similar to that of the first thermal interface layer 1312 in the aforementioned embodiments of the present application. For details, please refer to the detailed description of the aforementioned embodiments of the present application, and the embodiments of the present application will not go into details.

[0149] In some examples, the second thermal interface layer 1511 may fill the contact gap between the heat conducting portion 151 and the third heating sub-element 1241 .

[0150] In some examples of the embodiments of the present application, a second thermal interface layer 1511 is provided between the thermally conductive portion 151 and the third sub-heating element 1241, so that the second thermal interface layer 1511 is in thermal contact with the third sub-heating element 1241 and the thermally conductive portion 151; in this way, the second thermal interface layer 1511 can fill the contact gap between the third sub-heating element 1241 and the thermally conductive portion 151, thereby reducing the thermal resistance of heat transfer between the third sub-heating element 1241 and the thermally conductive portion 151, improving the efficiency of transferring the heat generated by the third sub-heating element 1241 to the thermally conductive portion 151, and improving the heat dissipation efficiency of the third sub-heating element 1241.

[0151] For some examples, refer to Figure 6 As described above, the gaps between the plurality of first heat dissipating fins 132 for the cooling medium to flow through can be constructed to form a first flow cross section 1301 .

[0152] In some examples, as described in relation to FIG6 , a plurality of gaps in the heat dissipation portion 152 through which the cooling medium flows can be constructed to form a second flow cross section 1501 .

[0153] In some examples, the area of ​​the first flow cross section 1301 may be greater than the area of ​​the second flow cross section 1501 .

[0154] In some examples of the embodiments of the present application, by setting the area of ​​the first flow section 1301 to be larger than the area of ​​the second flow section 1501, the flow resistance of the cooling medium in the second subspace 1112 can be made greater than the flow resistance of the cooling medium in the first subspace 1111, so that more cooling medium can flow through the first subspace 1111, thereby allowing more cooling medium to dissipate heat to the first heating element 123 with a larger heat output. The cooling medium can be fully utilized to dissipate heat to the first heating element 123, which can improve the heat dissipation upper limit of the immersion server 10.

[0155] For some examples, refer to Figure 3 As shown, a third perforated plate 114 may be provided in the accommodation space 111. The third perforated plate 114 may block the cooling medium inlet 201 of the second subspace 1112.

[0156] In some examples, the configuration of the third perforated plate 114 may be the same, similar or similar to that of the first perforated plate 112 and the second perforated plate 113 . For details, please refer to the detailed description of the first perforated plate 112 in the aforementioned embodiment of the present application, which will not be elaborated in the embodiment of the present application.

[0157] In some examples of the embodiments of the present application, a third perforated plate 114 is set at the entrance of the second subspace 1112. In this way, the third perforated plate 114 can form resistance to the cooling medium entering the second subspace 1112, so that more cooling medium can flow from the first subspace 1111, fully dissipating the heat of the first heating element 123, and improving the heat dissipation upper limit of the immersion server 10.

[0158] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0159] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An immersion server, characterized in that: include: A first shell (110), wherein the first shell (110) has an accommodating space (111); a first perforated plate (112) is provided at one end of the first shell (110), and a second perforated plate (113) is provided at the other end of the first shell (110), wherein the first perforated plate (112) and the second perforated plate (113) are opposite to each other; A main board (120) is arranged in the accommodating space (111) along the arrangement direction of the first punched plate (112) and the second punched plate (113), the main board (120) divides the accommodating space (111) into a first subspace (1111) and a second subspace (1112), the arrangement direction of the first subspace (1111) and the second subspace (1112) intersecting with the arrangement direction of the first punched plate (112) and the second punched plate (113); the main board (120) has a first surface (121) and a second surface (122) opposite to each other, the first surface (121) is provided with a first heating element (123), the first heating element (123) is located in the first subspace (1111), the second surface (122) is provided with a second heating element (124), the second heating element (124) is located in the second subspace (1112); the heat generated by the first heating element (123) is greater than the heat generated by the second heating element (124).

2. The immersion server according to claim 1, characterized in that A first radiator (130) is provided in the first subspace (1111), and the first radiator (130) is in thermal contact with the first heating element (123); the first radiator (130) comprises: a temperature averaging plate (131), covering and extending within the first subspace (1111) on a cross section of the accommodating space (111), the temperature averaging plate (131) covering the main board (120), and the temperature averaging plate (131) being in thermal contact with the first heating element (123); A plurality of first heat dissipation fins are arranged on a side of the temperature equalizing plate (131) facing away from the main board (120); and gaps are provided between adjacent heat dissipation fins for cooling medium to flow.

3. The immersion server according to claim 2, characterized in that A mainboard tray (140) is provided in the first subspace (1111), and the mainboard (120) is provided on the mainboard tray (140); the mainboard tray (140) is provided with a through hole (141), and the first heating element (123) is located in the through hole (141); The first heat sink (130) is located on a side of the mainboard tray (140) facing away from the mainboard (120), and a protrusion (1311) is provided on a side of the temperature equalizing plate (131) facing the mainboard (120), wherein the protrusion (1311) is in thermal contact with the first heating element (123).

4. The immersion server according to claim 3, characterized in that A first heat-conducting interface layer (1312) is provided on the protruding portion (1311), and the first heat-conducting interface layer (1312) is in thermal contact with the protruding portion (1311) and the first heating element (123).

5. The immersion server according to claim 3, characterized in that: The first heating element (123) includes a first sub-heating element (1231) and a second sub-heating element (1232), and the through hole (141) includes a first sub-through hole (1411) and a second sub-through hole (1412); the first sub-heating element (1231) is located in the first sub-through hole (1411), and the second sub-heating element (1232) is located in the second sub-through hole (1412).

6. The immersion server according to any one of claims 2 to 5, characterized in that: The second heating element (124) includes a plurality of third sub-heating elements (1241), and the plurality of third sub-heating elements (1241) are arranged at intervals; a second radiator (150) is provided in the second sub-space (1112); the second radiator (150) includes: a heat conducting portion (151), the heat conducting portion (151) being inserted between adjacent third sub-heating elements (1241), the heat conducting portion (151) being in thermal contact with the third sub-heating elements (1241); The heat dissipation portion (152) is thermally connected to the heat conduction portion (151), the heat dissipation portion (152) is located outside the arrangement area of ​​the plurality of third sub-heating elements (1241), and the heat dissipation portion (152) has a plurality of gaps for the circulation of cooling medium.

7. The immersion server according to claim 6, characterized in that A second heat-conducting interface layer (1511) is provided between the heat-conducting portion (151) and the third sub-heating element (1241), and the second heat-conducting interface layer (1511) is in thermal contact with the third sub-heating element (1241) and the heat-conducting portion (151).

8. The immersion server according to claim 6, characterized in that The gaps between the plurality of first heat dissipation fins for the cooling medium to flow form a first flow cross-section (1301); the plurality of gaps in the heat dissipation portion (152) for the cooling medium to flow form a second flow cross-section (1501); the area of ​​the first flow cross-section (1301) is greater than the area of ​​the second flow cross-section (1501).

9. The immersion server according to any one of claims 1 to 5, characterized in that: A third perforated plate (114) is provided in the accommodating space (111), and the third perforated plate (114) blocks the cooling medium inlet (201) of the second subspace (1112).

10. A cooling system for an immersion server, characterized in that: include: a second shell (20), the second shell (20) having a cooling medium inlet (201) and a cooling medium outlet (202), the cooling medium inlet (201) and the cooling medium outlet (202) being arranged on opposite sides of the second shell (20); a first flow balancing plate (210) disposed in the second shell (20), the first flow balancing plate (210) being located at one end of the second shell (20) close to the cooling medium inlet (201); a second flow balancing plate (220) disposed in the second shell (20), the second flow balancing plate (220) being disposed opposite to the first flow balancing plate (210) at one end of the second shell (20) close to the cooling medium outlet (202); At least one immersion server (10) according to any one of claims 1 to 9, wherein the immersion server (10) is arranged between the first equalizing plate (210) and the second equalizing plate (220), and the first perforated plate (112) of the immersion server (10) faces the first equalizing plate (210).

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