Quartz boat for semiconductor process

Abstract

The application relates to the technical field of quartz boats, and discloses a quartz boat for semiconductor processing, which comprises a back plate, a rod group, a pressing rod, a transmission assembly, a jacking assembly and an unlocking assembly. Through ingenious mechanical structure design, the quartz boat realizes efficient cooperation of unlocking and jacking operations. When a silicon wafer needs to be taken out, the transmission assembly drives the rotating disc to rotate, and the gap drives the pressing rod to move along the sliding groove, so that the silicon wafer is precisely unlocked. The automatic unlocking mechanism avoids direct contact of the silicon wafer with hands, reduces the risk of damage to the silicon wafer, and significantly improves the product yield. At the same time, after unlocking is completed, the synchronous shaft continues to drive the jacking block to rotate, the helical surface jacks up the silicon wafer in a specific order, the operator can pause the equipment at any time, accurately takes the specified silicon wafer, and greatly improves the operation flexibility and convenience. After jacking is completed, the inclined surface makes the silicon wafers present a ladder-shaped distribution, which not only facilitates the operator to distinguish and take the silicon wafers, improves the taking efficiency and reduces the probability of misoperation.

Description

Technical Field

[0001] This invention belongs to the field of quartz boat technology, and more specifically, relates to a quartz boat for semiconductor manufacturing processes. Background Technology

[0002] In the semiconductor manufacturing industry, quartz boats are essential support tools for high-temperature silicon wafer processing. With the continuous upgrading of semiconductor manufacturing processes, higher demands are placed on the processing precision and production efficiency of silicon wafers. However, in actual production, existing quartz boats have revealed numerous problems in the silicon wafer handling process, severely restricting the improvement of production efficiency.

[0003] After semiconductor manufacturing is complete, silicon wafers need to be removed from the quartz boat. Existing quartz boat unlocking mechanisms are cumbersome. Operators not only need to use various tools to sequentially adjust multiple locking components, but some unlocking components are hidden inside the equipment, making positioning and operation extremely difficult. Furthermore, in pursuit of high wafer capacity, the wafer spacing is excessively compressed, making it difficult for operators to reach tools into the gaps to retrieve wafers. This not only limits their field of vision but also greatly increases the risk of wafer collisions and damage, significantly extending wafer retrieval time, severely impacting production efficiency, and increasing production costs.

[0004] In view of this, the present invention is proposed. Summary of the Invention

[0005] To address the challenge of removing silicon wafers from quartz boats after semiconductor production, the existing unlocking mechanism is cumbersome. Operators must use various tools to sequentially adjust multiple locking components, and the positioning and operation of some unlocking components, some hidden inside the equipment, are extremely difficult. Furthermore, in pursuit of high wafer capacity, the wafer spacing is excessively compressed, making it difficult for operators to insert tools into the gaps to retrieve wafers. This not only limits visibility but also greatly increases the risk of wafer collision damage, significantly prolonging wafer removal time, severely impacting production efficiency, and increasing production costs. The basic concept of the technical solution adopted in this invention is:

[0006] A quartz boat for semiconductor manufacturing includes a pair of backplates and a set of rods mounted inside them.

[0007] A pressure bar is installed on a pair of back plates, and the pressure bar slides in a groove opened in the side wall of the back plate, and the groove is in an inclined state;

[0008] The back plate contains a transmission assembly including a synchronous shaft.

[0009] The synchronous shaft is equipped with several pairs of lifting components. Each lifting component includes a lifting block. A silicon wafer is overlapped on the side wall of the lifting block, and the side wall of the lifting block is provided with a spiral surface. When the synchronous shaft drives the lifting block to rotate, its spiral surface lifts the silicon wafers at different positions upward in sequence. The outer side wall of the lifting block is provided with an inclined surface, which is used to make the lifted silicon wafers distributed in a stepped manner.

[0010] The synchronous shaft is also equipped with an unlocking component, which includes a turntable that is synchronously connected to the synchronous shaft. The turntable has a notch corresponding to the lifting block. When the synchronous shaft drives the turntable to rotate, the notch lifts the pressure rod along the slide groove to unlock the silicon wafer.

[0011] In a preferred embodiment of the present invention, the rod assembly includes a pair of bottom rods and a pair of side rods. Both ends of the pair of bottom rods and the pair of side rods are connected to both ends of the back plate. The pair of bottom rods and the pair of side rods are symmetrically distributed, and guide grooves are provided on the pair of bottom rods and the pair of side rods. The guide grooves are in contact with the sidewalls of the silicon wafer. The distance between the pair of side rods is greater than the distance between the pair of bottom rods, and the side rods are located above the bottom rods.

[0012] In a preferred embodiment of the present invention, the height of the end of the groove near the center of the silicon wafer is lower than the height of the other end. A through groove is formed on the surface of the pressure rod, the through groove is adapted to the thickness of the silicon wafer, and a sliding rod is installed at the rotation center of the pressure rod. The sliding rod is slidably disposed in the groove, and the diameter of the sliding rod is adapted to the width of the groove.

[0013] In a preferred embodiment of the present invention, the two ends of the synchronous shaft are movably connected through the back plate, a knob is installed at one end of the synchronous shaft, a protrusion is installed at the center of the knob, and a plurality of anti-slip grooves are formed on the surface of the protrusion.

[0014] In a preferred embodiment of the present invention, the synchronous shaft is connected to the rotation center of the lifting block, and the surface of the lifting block is provided with a plurality of pairs of inner grooves, the depth of the plurality of pairs of inner grooves is the same, and the thickness of the inner grooves is adapted to the thickness of the silicon wafer, and the end face of the inner grooves is chamfered.

[0015] In a preferred embodiment of the present invention, a positioning seat is installed on the back plate, a positioning sleeve is installed on the side wall of the positioning seat, a positioning rod is movably installed inside the positioning sleeve, the sliding trajectory of the positioning rod is vertical, a retaining sleeve is installed at the bottom of the positioning rod, a ball is embedded inside the retaining sleeve, and the bottom of the ball is in contact with the surface of the turntable.

[0016] In a preferred embodiment of the present invention, a baffle is slidably disposed inside the positioning sleeve. The bottom of the baffle is connected to the positioning rod, and a synchronizing rod is installed on the top of the baffle. The synchronizing rod movably passes through the positioning sleeve. A compression spring is sleeved on the side wall of the synchronizing rod inside the positioning sleeve. One end of the compression spring is engaged with the baffle, and the other end of the compression spring is engaged with the inner side wall of the positioning sleeve.

[0017] In a preferred embodiment of the present invention, a synchronization frame is installed on the top of the synchronization rod, the synchronization frame is vertically slidably disposed on the side wall of the back plate, and top rods are installed at both ends of the synchronization frame. A limiting seat is movably installed through the top rod, and the limiting seat is welded to the back plate.

[0018] In a preferred embodiment of the present invention, a connecting plate is installed on the top of the top rod, and a strip groove is formed inside the connecting plate. The strip groove is horizontal and is slidably connected to the rotation center of the pressure rod.

[0019] In a preferred embodiment of the present invention, a slider is installed at the rotation center of the pressure rod. The slider is slidably disposed in the strip groove, and the width of the strip groove is adapted to the width of the slider. A limit rod is movably disposed inside the slider, and the two ends of the limit rod are installed on the side wall of the strip groove.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] This invention, through its ingenious mechanical structure design, achieves highly efficient coordination between unlocking and lifting operations, bringing several significant advantages. When a silicon wafer needs to be removed, the transmission component drives the turntable to rotate, and the notch pushes the pressure rod along the slide, precisely unlocking the silicon wafer. This automated unlocking mechanism avoids direct manual contact with the silicon wafer, reducing the risk of wafer damage and significantly improving product yield. Simultaneously, after unlocking, the synchronous shaft continues to drive the lifting block to rotate, and the spiral surface lifts the silicon wafer in a specific sequence. Operators can pause the equipment at any time to precisely retrieve the designated silicon wafer, greatly improving operational flexibility and convenience. After lifting, the inclined surface arranges the silicon wafers in a stepped distribution, which not only facilitates operator differentiation and retrieval of the wafers, improving retrieval efficiency, but also optimizes the operating space and reduces the probability of misoperation.

[0022] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0023] In the attached diagram:

[0024] Figure 1 A schematic diagram of the overall structure of a quartz boat used in semiconductor manufacturing;

[0025] Figure 2A three-dimensional structural diagram of a quartz boat used in semiconductor manufacturing;

[0026] Figure 3 A lateral view of a quartz boat used in semiconductor manufacturing Figure 1 ;

[0027] Figure 4 A lateral view of a quartz boat used in semiconductor manufacturing Figure 2 ;

[0028] Figure 5 For a quartz boat used in semiconductor manufacturing Figure 4 Enlarged view of point A in the middle;

[0029] Figure 6 For a quartz boat used in semiconductor manufacturing Figure 4 Enlarged view at point B in the middle;

[0030] Figure 7 This is a partial structural diagram of a quartz boat used in semiconductor manufacturing.

[0031] Figure 8 This is a side view of a quartz boat used in semiconductor manufacturing.

[0032] Figure 9 This is a 3D diagram of the lifting block of a quartz boat used in semiconductor manufacturing.

[0033] In the picture:

[0034] 1. Back plate; 11. Bottom rod; 12. Side rod; 121. Guide groove; 13. Pressure rod; 131. Through groove; 132. Slide rod; 133. Slide groove;

[0035] 2. Synchronous shaft; 21. Knob; 211. Raised surface;

[0036] 3. Lifting block; 31. Spiral surface; 32. Inclined surface; 33. Inner groove;

[0037] 4. Turntable; 41. Notch; 42. Positioning sleeve; 421. Positioning seat; 422. Positioning rod; 423. Sleeve; 424. Ball bearing; 425. Compression spring; 426. Baffle; 43. Synchronizing frame; 431. Synchronizing rod; 432. Top rod; 433. Limiting seat; 44. Connecting plate; 441. Strip groove; 442. Limiting rod; 443. Slider;

[0038] 5. Silicon wafers. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention.

[0040] Example 1:

[0041] like Figures 1 to 9 As shown, a quartz boat for semiconductor manufacturing includes a pair of backplates 1 and a rod assembly installed inside them.

[0042] A pair of back plates 1 are equipped with pressure rods 13, which slide in a groove 133 opened in the side wall of the back plate 1, and the groove 133 is in an inclined state; when the pressure rod 13 slides along the inclined groove 133, the unlocking operation can be completed.

[0043] The back plate 1 contains a transmission assembly including a synchronous shaft 2.

[0044] Several pairs of lifting components are installed on the synchronous shaft 2. Each lifting component includes a lifting block 3. A silicon wafer 5 is overlapped on the side wall of the lifting block 3. The side wall of the lifting block 3 is provided with a spiral surface 31. When the synchronous shaft drives the lifting block 3 to rotate, its spiral surface 31 lifts the silicon wafers 5 at different positions upward in sequence. The outer side wall of the lifting block 3 is provided with an inclined surface 32. The inclined surface 32 is used to make the lifted silicon wafers 5 arranged in a stepped distribution.

[0045] The synchronous shaft 2 is also equipped with an unlocking component, which includes a turntable 4 that is synchronously connected to the synchronous shaft 2. The turntable 4 has a notch 41 that corresponds to the lifting block 3. When the synchronous shaft drives the turntable 4 to rotate, the notch 41 lifts the pressure rod 13 to slide along the slide groove 133, thus unlocking the silicon wafer 5.

[0046] like Figures 1 to 9 As shown, in a specific embodiment, the rod assembly includes a pair of bottom rods 11 and a pair of side rods 12. Both ends of the pair of bottom rods 11 and the pair of side rods 12 are connected to both ends of the back plate 1. The pair of bottom rods 11 and the pair of side rods 12 are symmetrically distributed. The pair of bottom rods 11 and the pair of side rods 12 mainly support the silicon wafer 5. Guide grooves 121 are provided on the pair of bottom rods 11 and the pair of side rods 12. The guide grooves 121 fit against the side wall of the silicon wafer 5. The above structure makes the silicon wafer 5 more stable to be installed. The distance between the pair of side rods 12 is greater than the distance between the pair of bottom rods 11, and the side rods 12 are located above the bottom rods 11.

[0047] like Figures 1 to 9 As shown, further, the height of the end of the groove 133 near the center of the silicon wafer 5 is lower than the height of the other end. The above structure ensures that when the pressure rod 13 moves upward, it can have a sliding force to both sides, so that it can be separated from the silicon wafer 5. A through groove 131 is opened on the surface of the pressure rod 13. The through groove 131 is adapted to the thickness of the silicon wafer 5. A sliding rod 132 is installed at the rotation center of the pressure rod 13. The sliding rod 132 is slidably disposed in the groove 133, and the diameter of the sliding rod 132 is adapted to the width of the groove 133. The sliding rod 132 can reduce the friction during the sliding process.

[0048] In this embodiment, the quartz boat, with its ingenious design of the rod assembly and pressure rod 13, ensures that the silicon wafers 5 do not stick together when placed, providing a stable support foundation for subsequent semiconductor manufacturing processes. Simultaneously, the cooperation between the tilting groove 133 and the pressure rod 13 facilitates unlocking later.

[0049] Example 2:

[0050] The difference between Embodiment 1 and this embodiment is that: Figures 1 to 9 As shown, the synchronous shaft 2 has two ends that can move through the back plate 1. A knob 21 is installed at one end of the synchronous shaft 2. A protrusion 211 is installed at the center of the knob 21. Several anti-slip grooves are opened on the surface of the protrusion 211. The above structure makes it convenient for the operator to rotate and accurately control the rotation of the synchronous shaft 2, thereby improving the convenience and accuracy of operation.

[0051] like Figures 1 to 9 As shown, in a specific embodiment, the synchronous shaft 2 is connected to the rotation center of the lifting block 3. The surface of the lifting block 3 has several pairs of inner grooves 33, all with the same depth. The thickness of the inner grooves 33 is adapted to the thickness of the silicon wafer 5, and the end faces of the inner grooves 33 are chamfered. This not only further stabilizes the placement of the silicon wafer 5 but also reduces damage to the edges of the silicon wafer during subsequent lifting operations, thereby improving the yield rate of the silicon wafer.

[0052] Example 3:

[0053] The difference between Embodiment 2 and this embodiment is that: Figures 1 to 9 As shown, a positioning seat 421 is installed on the back plate 1, and a positioning sleeve 42 is installed on the side wall of the positioning seat 421. A positioning rod 422 is installed through the positioning sleeve 42. The sliding trajectory of the positioning rod 422 is vertical. A retaining sleeve 423 is installed at the bottom of the positioning rod 422. A ball bearing 424 is embedded inside the retaining sleeve 423, and the bottom of the ball bearing 424 is in contact with the surface of the turntable 4. The rotation of the synchronous shaft 2 causes the turntable 4 of the unlocking component to rotate synchronously, and the notch 41 on the turntable 4 can rotate synchronously. As the position of the notch 41 changes continuously, and the ball bearing 424 rolls on its surface, the friction is reduced. Finally, the ball bearing 424 can move along the edge of the notch 41 to the outer edge of the turntable 4. At this time, the ball bearing 424, the retaining sleeve 423 and the positioning rod 422 move upward as a whole.

[0054] like Figures 1 to 9As shown, in a specific embodiment, a baffle 426 is slidably disposed inside the positioning sleeve 42. The bottom of the baffle 426 is connected to the positioning rod 422, and a synchronizing rod 431 is installed on the top of the baffle 426. The synchronizing rod 431 movably passes through the positioning sleeve 42. A compression spring 425 is sleeved on the side wall of the synchronizing rod 431 inside the positioning sleeve 42. One end of the compression spring 425 is engaged with the baffle 426, and the other end is engaged with the inner side wall of the positioning sleeve 42. When the positioning rod 422 moves upward, the baffle 426 on the positioning rod 422 slides inside the positioning sleeve 42. The baffle 426 ensures that the positioning rod 422 always moves vertically. As the baffle 426 slides, the compression spring 425 at the top is simultaneously compressed. The compression spring 425 ensures that the positioning rod 422 always has a downward force, so that the ball bearing 424 under the positioning rod 422 is in contact with the turntable 4.

[0055] like Figures 1 to 9 As shown, further, a synchronization frame 43 is installed on the top of the synchronization rod 431. The synchronization frame 43 is vertically slidably mounted on the side wall of the back plate 1, and top rods 432 are installed at both ends of the synchronization frame 43. Limiting seats 433 are movably installed through the top rods 432 and are welded to the back plate 1. A connecting plate 44 is installed on the top of the top rod 432. A strip groove 441 is opened inside the connecting plate 44. The strip groove 441 is horizontal and is slidably connected to the rotation center of the pressure rod 13. A slider 443 is installed at the rotation center of the pressure rod 13. The slider 443 is slidably mounted in the strip groove 441, and the width of the strip groove 441 is adapted to the width of the slider 443. A limiting rod 442 is movably installed through the slider 443, and both ends of the limiting rod 442 are installed on the side wall of the strip groove 441. When the baffle 426 moves upward, the synchronizing rod 431 on the baffle 426 moves upward synchronously, and the synchronizing frame 43 moves upward synchronously. At this time, the top rods 432 at both ends of the synchronizing frame 43 slide in the limiting seat 433, which serves as a limiting seat. Ultimately, the connecting plate 44 at the end of the top rod 432 always has an upward force. When the connecting plate 44 moves upward, the slider 443 on the connecting plate 44 synchronously drives the pressure rod 13 to have an upward force. The sliding rod 132 on the side wall of the pressure rod 13 moves to both ends along the inclined sliding groove 133, which can eventually separate the pressure rod 13 from the upper part of the silicon wafer 5, thereby completing the unlocking operation and making it easy for the silicon wafer 5 to be removed from the rod assembly.

[0056] The implementation principle of the quartz boat for semiconductor manufacturing according to the present invention is as follows:

[0057] In practical use, the quartz boat of this invention requires placing silicon wafers 5 into the rod assembly between the back plates 1, so that the silicon wafers 5 are engaged in the guide groove 121, through groove 131, and inner groove 33, ensuring that the silicon wafers 5 do not stick together. After placement, the pressure rod 13 can slide along the inclined slide groove 133, and finally the pressure rod 13 can slide inclined towards the upper surface of the silicon wafer 5, ultimately ensuring the stable installation of the silicon wafer 5.

[0058] Next, the operator transports the quartz boat containing silicon wafer 5 to the semiconductor manufacturing equipment for preparation. After preparation is completed, the quartz boat is removed as a whole.

[0059] When the operator needs to remove the silicon wafer 5 from a certain location on the quartz boat, the operator can rotate the protrusion 211, which in turn rotates the knob 21, thereby rotating the transmission assembly containing the synchronous shaft 2. Figure 8 Using this as a reference point, rotating clockwise, the device first performs an unlocking action, followed by a lifting operation, as detailed below:

[0060] The rotation of the synchronous shaft 2 causes the turntable 4 of the unlocking component to rotate synchronously, and the notch 41 on the turntable 4 can rotate synchronously. As the position of the notch 41 changes continuously, and the ball 424 rolls on its surface, the friction can be reduced. Finally, the ball 424 can move along the edge of the notch 41 to the outer edge of the turntable 4. At this time, the ball 424, the sleeve 423 and the positioning rod 422 move upward as a whole.

[0061] When the positioning rod 422 moves upward, the baffle 426 on the positioning rod 422 slides inside the positioning sleeve 42. The baffle 426 ensures that the positioning rod 422 always moves vertically. As the baffle 426 slides, the compression spring 425 at the top is compressed simultaneously. The compression spring 425 ensures that the positioning rod 422 always has a downward force, so that the ball 424 under the positioning rod 422 fits against the turntable 4.

[0062] When the baffle 426 moves upward, the synchronous rod 431 on the baffle 426 moves upward synchronously, and the synchronous frame 43 moves upward synchronously. At this time, the top rods 432 at both ends of the synchronous frame 43 slide in the limiting seat 433, and the limiting seat 433 achieves the purpose of limiting. Finally, the connecting plate 44 at the end of the top rod 432 always has an upward force.

[0063] When the connecting plate 44 moves upward, the slider 443 on the connecting plate 44 simultaneously drives the pressure rod 13 to move upward. The slide rod 132 on the side wall of the pressure rod 13 moves to both ends along the inclined slide groove 133, which can eventually separate the pressure rod 13 from the upper part of the silicon wafer 5, thereby completing the unlocking operation and making it easy for the silicon wafer 5 to be smoothly removed from the rod assembly.

[0064] When the pressure rod 13 moves, the slider 443 on the side wall of the pressure rod 13 slides in the limiting rod 442 of the strip groove 441, which serves the purpose of limiting the movement.

[0065] Once unlocking is complete, the synchronous shaft 2 continues to drive the lifting assembly. The lifting block 3 rotates accordingly, and its helical surface 31 contacts the silicon wafer 5. During the rotation of the lifting block 3, the helical surface 31, with its carefully designed structure, gradually lifts the silicon wafers 5 from different positions upwards in a specific order. This feature provides operators with flexible operating space, allowing them to pause the equipment at designated locations and precisely retrieve specific silicon wafers according to actual needs, greatly reducing the difficulty of the retrieval process and significantly improving operational convenience.

[0066] After the lifting block 3 stops rotating, the entire silicon wafer 5 has moved upwards. At this point, the inclined surface 32 of the outer wall of the lifting block 3 comes into play, causing the lifted silicon wafers 5 to form a stepped distribution, greatly facilitating subsequent handling and processing by operators. This stepped lifting design allows operators to easily distinguish and handle the silicon wafers, significantly improving the efficiency of wafer handling. This layout not only increases the differentiation between silicon wafers but also provides operators with a wider operating space, further optimizing the handling process and significantly improving wafer handling efficiency.

Claims

1. A quartz boat for semiconductor process, comprising a pair of back plates (1) and a rod set installed inside, characterized in that: a pair of said back plates (1) are provided with pressing rods (13) sliding in the sliding grooves (133) formed in the side walls of the back plates (1) and in an inclined state; a transmission assembly comprising a synchronous shaft (2) is installed inside said back plate (1); a plurality of pairs of lifting assemblies are installed on said synchronous shaft (2), each of said lifting assemblies comprises a lifting block (3), the side wall of said lifting block (3) is provided with a silicon wafer (5) in a lap joint manner, and the side wall of said lifting block (3) is provided with a helical surface (31), when the synchronous shaft drives the lifting block (3) to rotate, the helical surface (31) of the lifting block (3) successively lifts the silicon wafers (5) at different positions to move upward, and the outer side wall of the lifting block (3) is provided with an inclined surface (32) for making the lifted silicon wafers (5) in a stepped distribution; an unlocking assembly is further installed on said synchronous shaft (2), said unlocking assembly comprises a rotating disc (4) synchronously connected with the synchronous shaft (2), and the rotating disc (4) is provided with a notch (41) corresponding to the lifting block (3), when the synchronous shaft drives the rotating disc (4) to rotate, the notch (41) of the rotating disc (4) lifts the pressing rod (13) to slide along the sliding groove (133) to unlock the silicon wafer (5); a positioning seat (421) is installed on said back plate (1), a positioning sleeve (42) is installed on the side wall of said positioning seat (421), a positioning rod (422) is movably and penetratively installed inside said positioning sleeve (42), the sliding track of said positioning rod (422) is in a vertical state, a clamping sleeve (423) is installed at the bottom of said positioning rod (422), a ball (424) is embedded inside said clamping sleeve (423), and the bottom of said ball (424) is attached to the surface of the rotating disc (4); a baffle (426) is slidably arranged inside said positioning sleeve (42), and the bottom of said baffle (426) is connected with said positioning rod (422); a synchronous rod (431) is installed at the top of said baffle (426), said synchronous rod (431) penetrates said positioning sleeve (42) movably, a compression spring (425) is sleeved on the side wall of said synchronous rod (431) inside said positioning sleeve (42), one end of said compression spring (425) is clamped on said baffle (426), and the other end of said compression spring (425) is clamped on the inner side wall of said positioning sleeve (42); a synchronous frame (43) is installed at the top of said synchronous rod (431), said synchronous frame (43) is vertically slidably arranged on the side wall of said back plate (1), and top rods (432) are installed at both ends of said synchronous frame (43), limit seats (433) are movably and penetratively installed on said top rods (432), and said limit seats (433) are welded on said back plate (1); a connecting plate (44) is installed at the top of said top rod (432), a strip-shaped groove (441) is formed in said connecting plate (44) in a horizontal state, and said strip-shaped groove (441) is slidably connected with the rotation center of said pressing rod (13). ​ ​ ​ ​ ​ ​ The rotation center of the pressing rod (13) is provided with a sliding block (443), the sliding block (443) is slidingly arranged in a strip-shaped groove (441), and the width of the strip-shaped groove (441) and the width of the sliding block (443) are matched, the sliding block (443) is internally movably and penetratingly provided with a limiting rod (442), and the limiting rod (442) is installed on the side wall of the strip-shaped groove (441) at both ends.

2. The quartz boat for semiconductor process according to claim 1, wherein The rod group comprises a pair of bottom rods (11) and a pair of side rods (12), both ends of the pair of bottom rods (11) and the pair of side rods (12) are connected to both ends of the back plate (1), the pair of bottom rods (11) and the pair of side rods (12) are symmetrically distributed, guide grooves (121) are formed in the pair of bottom rods (11) and the pair of side rods (12), the guide grooves (121) are matched with the side walls of the silicon wafer (5), the distance between the pair of side rods (12) is greater than the distance between the pair of bottom rods (11), and the side rods (12) are located above the bottom rods (11).

3. The quartz boat for semiconductor process according to claim 1, wherein The height of the end of the sliding groove (133) near the center of the silicon wafer (5) is lower than the height of the other end, a through groove (131) is formed in the surface of the pressing rod (13), the through groove (131) is matched with the thickness of the silicon wafer (5), a sliding rod (132) is installed at the rotation center of the pressing rod (13), the sliding rod (132) is slidingly arranged in the sliding groove (133), and the diameter of the sliding rod (132) is matched with the width of the sliding groove (133).

4. The quartz boat for semiconductor processing according to claim 1, wherein Both ends of the synchronous shaft (2) movably penetrate the back plate (1), one end of the synchronous shaft (2) is provided with a knob (21), the center of the knob (21) is provided with a protrusion (211), and a plurality of anti-skid grooves are formed in the surface of the protrusion (211).

5. The quartz boat for semiconductor processing according to claim 1, wherein The rotation center of the synchronous shaft (2) is connected with the jacking block (3), a plurality of pairs of inner grooves (33) are formed in the surface of the jacking block (3), the depths of the plurality of pairs of inner grooves (33) are the same, the thickness of the inner grooves (33) is matched with the thickness of the silicon wafer (5), and the end surface of the inner grooves (33) is chamfered.

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