End effector and substrate processing apparatus using same

By designing an end effector including blades, blade portions and multiple pads, the combination of absorbing units and support units is used to solve the problems of substrate adhesion and wear, and the stable conveying and accurate positioning of the substrate are achieved, and the service life of the pad is extended.

CN120565486APending Publication Date: 2025-08-29ASM IP HLDG BV
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Patent Information

Application Number
CN202510207181.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-02-29
Filing Date
2025-02-25
Publication Date
2025-08-29

AI Technical Summary

Technical Problem

Existing backside contact type end effectors have substrate adhesion and wear problems in substrate processing systems, and the substrate may bounce or misalign during prolonged use.

Method used

An end effector is designed, including a blade, a blade portion and a plurality of pads, which are combined by an absorbing unit and a support unit, which is made of an elastic material, which can absorb impact and automatically correct the inclination of the pad, and the support unit is made of ceramic to prevent substrate wear.

Benefits of technology

Effectively prevent the substrate from bounced, improve the contact area state of the substrate, extend the service life of the pad, and improve the stability and accuracy of substrate transportation.

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Abstract

An end effector for transporting a substrate in a substrate processing system is presented. The end effector includes a blade configured to support a substrate, and the blade is flat; a blade portion connected to the blade at a first end of the blade, where a distal end of the blade portion is provided with a front protrusion for positioning the substrate; and a plurality of pads disposed in each of the plurality of holes, where the plurality of pads contact the substrate when the substrate is transferred, and where the plurality of holes are disposed in the paddle and the blade portion. The end effector may allow tilting of the pad such that the substrate does not adhere.
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Description

Technical Field

[0001] The present disclosure generally relates to end effectors, and more particularly, exemplary embodiments of the present disclosure relate to an end effector for conveying a substrate and a substrate processing apparatus including the end effector. Background Art

[0002] The pads in back-contact end effectors currently used in robots (attached to robot arms) in substrate handling systems can suffer from a) substrate sticking and b) wear over extended use. Pad life is relatively short (i.e., typically around six months), so if maintenance is not performed promptly, the substrate contact area at the top of the pad will wear out.

[0003] Furthermore, when a silicon substrate is handled by a robot, the substrate may bounce on the pads of the end effector, or the substrate may be misaligned due to contact imbalance.

[0004] Therefore, the present disclosure proposes a new end effector structure that has the ability to absorb shock and automatically correct the tilt of the pad to prevent substrate bouncing and improve the contact area state of the substrate. Summary of the Invention

[0005] This summary is provided to introduce a selection of concepts in a simplified form. These concepts are further described in detail in the detailed description of example embodiments of the present disclosure below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0006] According to one embodiment, an end effector for conveying a substrate may be provided, comprising: a paddle configured to support a substrate, the paddle being flat; a blade portion connected to the paddle at a first end thereof, wherein a distal end of the blade portion is provided with a front protrusion for positioning the substrate; and a plurality of pads provided in each of a plurality of holes, wherein the plurality of pads contact the substrate when conveying the substrate, and wherein the plurality of holes are provided in the paddle and the blade portion.

[0007] In one aspect, the end effector further includes an articulated segment connected to the paddle at the second end of the paddle and configured to be attached to the robotic arm.

[0008] In one aspect, the number of apertures is equal to or greater than three.

[0009] In one aspect, the blade portion includes at least one blade.

[0010] In one aspect, each of the plurality of pads includes: a support unit configured to support a substrate on its top side when the substrate is conveyed; and an absorption unit configured to surround the underside of the support unit and fit into the hole, wherein the absorption unit is elastic and flexible so as to be able to absorb impact and seal the support unit and the hole.

[0011] In one aspect, the absorption unit is an O-ring; and the inside of the hole has a concave shape, wherein the O-ring is configured to fit into the concave shape of the inside of the hole.

[0012] In one aspect, the absorption unit has a concave shape around a side thereof, and an inner side of the hole has a protrusion; and the protrusion on the inner side of the hole is configured to fit into the concave shape of the absorption unit.

[0013] In one aspect, the support unit is configured to tilt to a certain extent in the same direction as a direction in which the substrate moves when the substrate slides.

[0014] In one aspect, the support unit is configured to have a rounded top shape.

[0015] In one aspect, the supporting unit is made of ceramic and the absorbing unit is made of elastomer.

[0016] According to another embodiment, a back-end robot for conveying a substrate may be provided, comprising: a robot arm including at least two arm portions, the robot arm being configured to move a substrate from one place to another; and an end effector connected to the robot arm and configured to move a substrate placed on the end effector, wherein the end effector is the end effector described above.

[0017] According to another embodiment, a substrate processing apparatus may be provided, comprising: a reaction chamber for processing a substrate; a substrate handling chamber attached to the reaction chamber; a back-end robot disposed in the substrate processing chamber, the back-end robot comprising a robot arm and an end effector attached to the robot arm; and a load lock chamber attached to the substrate handling chamber and configured to load or unload a substrate, wherein the end effector is the end effector described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the sizes of some elements in the drawings may be exaggerated relative to other elements to help improve understanding of the illustrated embodiments of the present disclosure.

[0019] Figure 1 A diagram illustrating a substrate processing system having a robot equipped with an end effector according to an embodiment of the present disclosure is shown.

[0020] Figure 2Shown are separate isolated views of a robot (having a robot arm and end effector) according to an embodiment of the present disclosure.

[0021] Figure 3 (a) in FIG. 1 shows a mode of an end effector (4 pads) according to an embodiment of the present disclosure.

[0022] Figure 3 (b) shows a different mode of an end effector (3 pads) according to another embodiment of the present disclosure.

[0023] Figure 4 (a) shows an isolated side view of the supporting unit and the absorbing unit of the end effector and the hole in the paddle or blade according to an embodiment of the present disclosure.

[0024] Figure 4 (b) shows a side view of a support unit of an end effector placed in a hole and supporting a substrate according to an embodiment of the present disclosure.

[0025] Figure 4 (c) shows a side view of a support unit of an end effector tilted by movement of a substrate according to an embodiment of the present disclosure.

[0026] Figure 5 (a) shows a perspective view of a supporting unit and an absorbing unit of an end effector according to an embodiment of the present disclosure.

[0027] Figure 5 (b) shows a front view of a support unit of an end effector tilted by movement of a substrate according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] Although certain embodiments and examples are disclosed below, those skilled in the art will appreciate that the invention extends beyond the specifically disclosed embodiments and / or uses of the invention and obvious modifications and equivalents thereof. Accordingly, it is intended that the scope of the disclosed invention should not be limited by the specific disclosed embodiments described below.

[0029] As used herein, the term "substrate" may refer to any underlying material or materials, including any underlying material or materials that can be modified or on which a device, circuit, or film can be formed. A "substrate" can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. A substrate can be in any form, such as a powder, a sheet, or a workpiece. Sheet-form substrates can include wafers of various shapes and sizes. Substrates can be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0030] As an example, a substrate in powder form may have applications in pharmaceutical manufacturing. A porous substrate may comprise a polymer. Examples of workpieces may include medical devices (e.g., stents and syringes), jewelry, tooling, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components for photovoltaic cells.

[0031] The continuous substrate may extend beyond the boundaries of the processing chamber in which the deposition process occurs. In some processes, the continuous substrate may be moved through the processing chamber, such that the process continues until the end of the substrate is reached. The continuous substrate may be supplied from a continuous substrate feed system to allow for the manufacture and output of the continuous substrate in any suitable form.

[0032] Non-limiting examples of continuous substrates may include sheets, nonwoven films, rolls, foils, meshes, flexible materials, bundles of continuous filaments or fibers (e.g., ceramic fibers or polymer fibers).The continuous substrate may also include a carrier or sheet on which the discontinuous substrate is mounted.

[0033] The illustrations presented herein are not intended to be actual views of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of the present disclosure.

[0034] The specific embodiments shown and described are illustrative of the present invention and its best mode and are not intended to limit the scope of the various aspects and embodiments in any way. In fact, for the sake of brevity, the conventional manufacturing, connection, preparation and other functional aspects of the system may not be described in detail. In addition, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or physical connections between the various elements. Many alternative or additional functional relationships or physical connections may exist in actual systems and / or may not exist in some embodiments.

[0035] It should be understood that the configurations and / or approaches described herein are exemplary in nature, and these specific embodiments or examples should not be considered limiting, as many variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Thus, the various actions shown may be performed in the order shown, in other orders, or in some cases omitted.

[0036] The subject matter of the present disclosure includes all novel and nonobvious combinations and subcombinations of the various processes, systems and configurations, and other features, functions, acts, and / or properties disclosed herein, as well as any and all equivalents thereof.

[0037] Figure 2 Shown is an isolated view of a robot typically used in a substrate processing system.

[0038] The robot 200 may include a robot arm 210 and an end effector 220 attached thereto. The robot arm 210 may include an upper arm portion 211 connected to the end effector 220 and a lower arm portion 212 attached to a shaft 230. The robot 200 has a robot arm including Figure 1 2 pieces of arms (outer arm 211 and inner arm 212), however there are other applications using 3 or more pieces of arms, and Figure 1 This is just one example, and the outer arm 211 may be connected to the end effector 220. The shape of each arm may vary depending on the requirements of the processing system and the characteristics of the environment.

[0039] For a backside contact type end effector, the end effector 220 may have several pads. Figure 3 (a) and (b) in FIG. 5 respectively show two different modes of the end effector according to an embodiment of the present disclosure, for example, 4 pads and 3 pads.

[0040] exist Figure 3 In (a), the end effector 300A may include a blade 310, a blade portion 320, and a plurality of pads 340. Each of the pads 340 may be provided in a hole ( Figure 3 The paddle 310 may be flat and used to support the substrate, and the paddle 310 may also be used to position the substrate in its correct position.

[0041] The blade portion 320 may be connected to the paddle 310 at one end. At the opposite (distal) end of the blade portion 320, front protrusions (321a, 321b) may be provided for positioning a substrate on the end effector 300A. The protrusions (321a, 321b) allow a substrate placed on the end effector 300A to find the correct position to rest while being transported by the end effector 300A. The joint segment 330 may be connected to the paddle 310 at its second end and configured to be attached to a robot arm (shown later).

[0042] The pads 340 can be placed anywhere in the paddle 310 and blade portion 320 for placing a substrate on the end effector 300A. There can be holes (to be shown below) for placing the pads 340, so there can be an equal number of holes and pads in the end effector. The pads 340 can be positioned symmetrically so that a substrate placed on the end effector can contact the pads 340 and the substrate can be held in a stable state. Figure 3 In (a), four pads 340 may form a rectangular shape for, eg, symmetry and substrate stability.

[0043] The blade portion 320 may have at least one blade. Figure 3In (a), for example, the blade portion 320 may include two blades 320a, 320b. If there is more than one blade, each blade (320a, 320b) may have its own front protrusion (321a, 321b).

[0044] Holes (ie, pads) may be placed in the paddle 310 and the blade portion 320 , and the number of the holes (ie, pads) may be more than three, for stably supporting a substrate placed on the pads 340 .

[0045] exist Figure 3 In (b), the end effector 300B may include a blade 315, a blade portion 325, and a plurality of pads 345. Each of the pads 345 may be disposed in a hole ( Figure 3 The paddle 315 may be flat and used to support the substrate, and the paddle 315 may also be used to position the substrate in its correct position.

[0046] The blade portion 325 may be connected to the paddle 315 at one end. At the opposite (distal) end of the blade portion 325, front protrusions (326a, 326b) may be provided for positioning a substrate on the end effector 300B. The protrusions (326a, 326b) allow a substrate placed on the end effector 300B to find the correct position to rest while being transported by the end effector 300B. The joint segment 335 may be connected to the paddle 315 at its second end and configured to be attached to a robot arm (shown later).

[0047] The pads 345 can be placed anywhere in the paddle 315 and blade portion 325 for placing a substrate on the end effector 300B. There can be holes (as will be shown below) for placing the pads 345, so there can be an equal number of holes and pads in the end effector. The pads 345 can be positioned symmetrically so that a substrate placed on the end effector can contact the pads 345 and the substrate can be held in a stable state. Figure 3 In (b), three pads 345 may form, for example, a triangular shape for symmetry and substrate stability.

[0048] The blade portion 325 may have at least one blade. Figure 3 In (b), for example, the blade portion 325 may include two blades 325a, 325b. If there is more than one blade, each blade (325a, 325b) may have its own front protrusion (326a, 326b).

[0049] Holes (ie, pads) may be placed in the paddle 315 and the blade portion 325 , and the number of the holes (ie, pads) may be more than three to stably support a substrate placed on the pads 345 .

[0050] Figure 4 (a) to (c) in FIG. 5 show one mode of a pad used in an end effector according to an embodiment of the present disclosure.

[0051] like Figure 4 As shown in (a) of FIG. 4 , the pad 400A may include a support unit 430A and an absorption unit 420A. When a substrate may be placed on the pad 400A and transported to another area, the support unit 430A may support the substrate on its top side 430A-1. In order to prevent any damage (e.g., scratches) to the substrate placed on the pad 400A, and also to prevent particle problems caused by a large contact (substrate-pad contact) area, the top side 430A-1 of the pad 400A may be shaped into a round shape, as shown in FIG. Figure 4 For the reasons described above, the support unit 430A or at least the top side 430A-1 may be made of ceramic.

[0052] The absorption unit 420A may surround the lower side 430A-2 of the support unit 430A. For a sealing effect, the absorption unit 420A may be elastic to tightly surround the support unit 430A.

[0053] For example, the absorption unit 420A may be an O-ring. In this case, for the hole 411A in the end effector 410A, the shape of the inner side of the hole is a concave shape. In this way, the O-ring (absorption unit 420A) can be fitted into the inner side of the hole 411A. This embodiment can be Figure 4 It is shown in (b) in FIG.

[0054] exist Figure 4 In (b), pad 400B can be fitted into hole 411B on end effector 410B (in the blade or vane portion), and substrate 440B can be placed on pad 400B. Support unit 430B can support substrate 440B with its circular top side, and its absorption unit 420B can tightly surround the underside of support unit 430B, and absorption unit 420B can also be fitted into hole 411B. The cross-sectional shape of absorption unit 420B can be any shape, but a circular shape (like an O-ring) is shown for efficiency.

[0055] When substrate 440C moves on end effector 410C in direction (D1) and force (F1), pad 400C (more specifically, support unit 430C) can move along with substrate 440C in direction (D11) and force (F11). The force direction (D11) is slightly similar to the direction (D1) of substrate 440C, but the force of movement (D11) can be much smaller than the substrate movement force (F1) because absorption unit 420C can tightly grip support unit 430C. Support unit 430C can be slightly tilted up to a certain extent.

[0056] Such substrate movement (D1, F1) may mean a misalignment of the substrate 440C. Thus, the original position may be the correct position (or at least closer to the correct or aligned position), so that when the substrate 440C is transported, it will be better to restore the substrate 440C to its original position. By the elasticity of the absorption unit 420C, the tilted support unit 430C can reverse its movement in direction (D12) and force (F12). The direction (D12) will be opposite to the direction (D1), but the force (F12) can be much smaller than the force (F1). And such tilted (D11, F11) and non-tilted (D12, F12) movement may be beneficial so that the contact area of ​​the substrate 440C and the support unit 430C can be changed during the tilted and non-tilted movement, so that the substrate adhesion problem (the problem of the substrate adhering to the pad so that the substrate does not move when needed) can also be solved.

[0057] To illustrate a good example, the absorption unit 420A may be an O-ring (having a circular cross-sectional shape), and the shape of the lower side 430A-2 of the support unit 430A surrounded by the absorption unit 420A may be concave so as to fit into the absorption unit 420A (i.e., the O-ring). In addition, the shape of the hole 411A of the end effector may be concave so as to fit into the absorption units 420B, 420C, just like Figure 4 (b) and Figure 4 Same as (c) in .

[0058] For the purpose of tight sealing effect and elastic movement effect (tilting and non-tilting of the support unit), the absorbing unit 420C may be made of an elastomer or any material having elasticity and high temperature resistance.

[0059] Figure 5 (a) and Figure 5 (b) in FIG. 1 shows another mode of an embodiment according to the present disclosure.

[0060] exist Figure 5In (a), the pad 500A can be fitted into the hole 511A on the end effector 510A (in the paddle or blade portion), and the substrate 540A can be placed on the pad 500A. The support unit 530A can support the substrate 540A with its circular top side, and its absorption unit 520A can tightly surround the underside of the support unit 530A, and the absorption unit 520A can also be fitted into the hole 511A. The cross-sectional shape of the absorption unit 520A can be any shape, however a rectangular shape is shown as another example. In this mode, the absorption unit 520A can have a concave shape around its side and a protrusion 512A on the inside of the hole. The protrusion 512A on the inside of the hole 511A can fit into the concave shape of the absorption unit 520A.

[0061] When substrate 540B can move on end effector 510B in direction (D2) and force (F2), pad 500B (more specifically, support unit 530B) can move in direction and force (D21, F21). The force direction (D21) is slightly opposite to the direction (D2) of substrate 540B. However, the force of movement (D21) can be much smaller than the substrate movement force (F2) because absorption unit 520B can tightly grip support unit 530B. Support unit 530B can be slightly tilted up to a certain extent.

[0062] This substrate movement (D2, F2) may mean that substrate 540B is misaligned. Therefore, the original position can be the correct position (or at least closer to the correct or well-aligned position), which will improve the ability to restore substrate 540B to its original position when transporting substrate 540B. Through the elasticity of absorption unit 520B, the tilted support unit 530B can reverse its movement in direction and force (D22, F22). The direction (D22) will be almost the same as the direction (D2), but the force (F22) can be much smaller than the force (F2). This reverse, non-tilted movement of support unit 530B can be generated by the combined structure of support unit 530B and absorption unit 520B. Furthermore, the tilted (D21, F21) and non-tilted (D22, F22) movements can be beneficial, allowing the contact area between substrate 540B and support unit 530B to change during tilted and non-tilted movements, thereby also solving substrate adhesion issues (problems where the substrate adheres to the pad so that the substrate does not move when needed).

[0063] For example, the absorption unit 520A may be a block of elastic material (having a rectangular cross-sectional shape), and the shape of the lower portion 530A-2 of the support unit 530A surrounded by the absorption unit 520A may be concave so as to fit into the concave portion 521A of the absorption unit 520A. In addition, the shape of the inside of the hole 511A of the end effector may have a protrusion so as to fit into the side of the absorption unit 520A, just like Figure 5 (a) and Figure 5 In this embodiment mode, the sealing ability of the absorption unit 520A (entry hole 511A) can be almost perfect.

[0064] For tight sealing effect, elastic movement effect (tilting and non-tilting of the supporting unit), and solving the substrate adhesion problem, the absorbing unit 520B may be made of an elastomer or any material having elasticity and high temperature resistance.

[0065] Figure 1 1 is a schematic diagram of a substrate processing system using a robot equipped with an end effector according to an embodiment of the present disclosure. System 100 includes reaction chambers 140a-140d, a substrate handling chamber 150, and a backend robot 160 disposed within substrate handling chamber 150. Backend robot 160 includes a robot arm 162 and an end effector 161 attached to robot arm 162. System 100 also includes a load lock chamber 130, which is adjacent to substrate handling chamber 150 and configured to load and unload substrates. End effector 161 in system 100 is one of the modes explained in the present disclosure.

[0066] The above arrangement of the device is merely illustrative of the application of the principles of the present invention, and many other embodiments and modifications may be made without departing from the spirit and scope of the invention as defined in the claims. Therefore, the scope of the invention should be determined not with reference to the above description, but with reference to the appended claims and their full scope of equivalents.

Claims

1. An end effector for conveying a substrate, comprising: a paddle configured to support the substrate, wherein the paddle is flat; a blade portion connected to the paddle at a first end thereof, wherein a distal end of the blade portion is provided with a front protrusion for positioning a substrate; and A plurality of pads are disposed in each of the plurality of holes, wherein the plurality of pads contact the substrate when the substrate is conveyed, and wherein the plurality of holes are disposed in the paddle and the blade portion.

2. The end effector according to claim 1, further comprising: An articulated segment is connected to the paddle at the second end of the paddle and is configured to be attached to a robotic arm.

3. The end effector according to claim 2, wherein: The number of holes is equal to or greater than three (3).

4. The end effector according to claim 2, wherein: The blade portion includes at least one blade.

5. The end effector according to claim 2, wherein: Each of the plurality of pads comprises: a supporting unit configured to support the substrate on a top side thereof while conveying the substrate; and an absorption unit configured to surround the underside of the support unit and fit into the hole, The absorbing unit is elastic and flexible so as to absorb impact and seal the supporting unit and the hole.

6. The end effector according to claim 5, wherein: The absorption unit is an O-ring; and an inner side of the hole has a concave shape, wherein the O-ring is configured to fit into the concave shape of the inner side of the hole.

7. The end effector according to claim 5, wherein: The absorption unit has a concave shape around its side, and the inner side of the hole has a protrusion; and The protrusions on the inside of the hole are configured to fit into the concave shape of the absorption unit.

8. The end effector according to any one of claims 6 to 7, wherein: The supporting unit is configured to be tilted to a certain extent in the same direction as the direction in which the substrate moves when the substrate slides.

9. The end effector according to claim 5, wherein: The support unit is configured to have a round top shape.

10. The end effector according to claim 5, wherein: The supporting unit is made of ceramic, and the absorbing unit is made of elastomer.

11. A back-end robot for conveying a substrate, comprising: a robotic arm comprising at least two arms, the robotic arm configured to move a substrate from one location to another; as well as An end effector connected to the robot arm and configured to move a substrate placed on the end effector, wherein the end effector is the end effector according to any one of claims 1 to 10.

12. A substrate processing device comprising: a reaction chamber for processing a substrate; a substrate handling chamber attached to the reaction chamber; a back-end robot disposed in the substrate processing chamber, the back-end robot including a robot arm and an end effector attached to the robot arm; as well as A load lock chamber attached to a substrate handling chamber and configured to load or unload a substrate, wherein the end effector is the end effector according to any one of claims 1 to 10.