Embedded PCB structure

Abstract

The invention relates to the technical field of PCBs, and discloses an embedded PCB structure, which comprises a mainboard PCB, an embedded part is arranged on the mainboard PCB, a plurality of layers of PCBs are embedded in the embedded part, the plurality of layers of PCBs are conducted with the outside through a metallization conduction process, the plurality of layers of PCBs are high-density PCBs manufactured by pressing, the plurality of layers of PCBs comprise a plurality of single-grid conduction lines, and the plurality of single-grid conduction lines are arranged on the PCB. The multi-layer PCB comprises a multi-layer PCB, the multi-layer PCB is provided with a plurality of single-grid conducting lines, the minimum distance between the adjacent single-grid conducting lines is 0.03 mm after pressing, the side face of the multi-layer PCB is provided with a base material, the side, away from the multi-layer PCB, of the base material is provided with a surface conducting layer, and the base material and the surface conducting layer are provided with communicating parts. According to the invention, a solution is provided for high-density and complex logic connection of conducting groove holes of different grids of the high-end PCB; according to the utility model, the minimum distance between the groove hole walls of different grids is reduced to 0.03 mm from the existing 0.2 mm, so that the density of the groove holes of the different grids is greatly improved, the complex logic connection of the groove holes of the different grids is realized, and the complex high-density circuit connection is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to an embedded PCB structure. Background Art

[0002] PCB (Printed Circuit Board), also known as printed circuit board in Chinese, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Almost every electronic device, from small electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as it has electronic components such as integrated circuits, must use PCBs to make electrical interconnections between various components. PCBs are generally composed of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components. They have the dual functions of conductive lines and insulating base plates. They can replace complex wiring and realize electrical connections between various components in the circuit.

[0003] With the rise of more integrated technologies such as AI and robotics, the use of high-density modules to reduce energy consumption and size has become a general trend. In the existing technology, due to factors such as the PCB drilling position tolerance, aperture, and copper wicking effect, the minimum spacing between hole walls of different grids and between slot walls of different grids in the industry is 0.2mm. The existing PCB drilling solution cannot be improved to change the spacing capability below 0.2mm. As a result, the density of via holes and via slots of different grids in high-density module PCBs such as high-end servers, AI, robots, and inductive devices is relatively low and cannot be improved to meet usage requirements. At the same time, it is difficult to achieve complex logical connections between via holes and via slots of different grids. Therefore, the present invention proposes an embedded PCB structure. Summary of the Invention

[0004] The object of the present invention is to provide an embedded PCB structure to solve the problem in the above background art that the existing PCB has low density and cannot be upgraded, making it difficult to achieve complex logic connections.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solution: an embedded PCB structure, comprising a mainboard PCB board, an embedded portion being provided on the mainboard PCB board, a multi-layer PCB board being embedded in the embedded portion, and the multi-layer PCB board being connected to the outside through a metallization conduction process.

[0006] As a preferred solution, the multi-layer PCB board is a high-density PCB board made by pressing, including multiple single-grid conductive circuits, and the minimum spacing between adjacent single-grid conductive circuits after pressing is 0.03 mm.

[0007] As a preferred solution, the single-grid conductive circuit is a solid conductive circuit.

[0008] As a preferred embodiment, a substrate is provided on the side of the multi-layer PCB board, a surface conductive layer is provided on the side of the substrate away from the multi-layer PCB board, and a connecting portion is provided on the substrate and the surface conductive layer for connecting the multi-layer PCB board to the surface conductive layer through a metallization conduction process.

[0009] As a preferred solution, the communicating portion is a communicating groove or a communicating hole.

[0010] As a preferred solution, the embedded portion is an embedded groove or an embedded hole.

[0011] As a preferred solution, the embedded portion is opened in a direction perpendicular to the main board PCB.

[0012] Technical effects and advantages of the present invention:

[0013] The present invention provides an embedded PCB board with a completely new structure, offering a solution for the high-density and complex logical connections of conductive slots of different grids on high-end PCB boards. The minimum spacing between the walls of conductive slots of different grids is reduced from the existing 0.2mm to 0.03mm, greatly improving the density of conductive slots of different grids. At the same time, complex logical connections of conductive slots of different grids are achieved, realizing complex high-density circuit connections. This significantly improves the performance of the PCB board while maintaining its size, and reduces its size while maintaining its performance. This lays a technical foundation for the development of new-quality productive forces such as high-end servers, AI, robots, and inductive devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the improved structure of the present invention.

[0015] Figure 2 This is a schematic diagram of the structure before improvement of the present invention.

[0016] Figure 3 Schematic diagram of the structural state of step S1 of the present invention.

[0017] Figure 4 Schematic diagram of the structural state of step S2 of the present invention.

[0018] Figure 5 Schematic diagram of the structural state of step S3 of the present invention.

[0019] Figure 6 Schematic diagram of the structural state of step S4 of the present invention.

[0020] Figure 7 Schematic diagram of the structural state of step S5 of the present invention.

[0021] Figure 8 Schematic diagram of the structural state of step S6 of the present invention.

[0022] Figure 9 Schematic diagram of the structural state of step S7 of the present invention.

[0023] Figure 10 Schematic diagram of the structural state of step S8 of the present invention.

[0024] Figure 11 Schematic diagram of the cross-sectional structure of multilayer boards with different networks before embedding according to the present invention.

[0025] Figure 12 Schematic diagram of the cross-sectional structure of a multilayer board with different networks after embedding according to the present invention.

[0026] In the figure: 1. Mainboard PCB board; 2. Single-grid conductive slot; 3. Single-grid conductive line; 4. Multi-layer PCB board; 5. Embedded part; 6. Base material; 7. Surface conductive layer; 8. Connecting part. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] The present invention provides Figure 1-12The embedded PCB structure shown includes a mainboard PCB board 1. The mainboard PCB board 1 is a prior art. An embedded portion 5 is provided on the mainboard PCB board 1. The embedded portion 5 is located at a position on the mainboard PCB board 1 that needs to be high-densified. There is no special limit on the size of the embedded portion 5. It is based on the processing capacity of the equipment. When there is a processing need, higher-capacity equipment can be introduced to process smaller and more precise embedded portions 5. The opening direction of the embedded portion 5 is perpendicular to the mainboard PCB board 1 to facilitate processing and embedding. The embedded portion 5 is an embedded groove or an embedded hole. The embedded groove or embedded hole is selected according to actual needs. A multi-layer PCB board 4 is embedded in the embedded portion 5. The high-density conductive holes of different grids and the conductive grooves of different grids are made into a multi-layer PCB board 4. The multi-layer PCB board 4 can be used as conductive and redirecting circuits of different layers to perform complex logic functions. The multi-layer PCB board 4 is a high-density PCB board made by pressing, including multiple single-grid conductive circuits 3. The spacing between adjacent single-grid conductive circuits 3 is press-fitted. The minimum after closing is 0.03mm, which is determined by the pressing manufacturing process. In the future, with the improvement of the manufacturing process, the spacing between adjacent single-grid conductive lines 3 may be made smaller. The multi-layer PCB board 4 is connected to the outside through the metallization conduction process to form an embedded PCB board. It should be emphasized that the present application is a high-density multi-layer PCB board 4 made by embedding and pressing in the vertical direction of the mainboard PCB board 1 in the prior art. It does not embed a magnetic core or other components, which is currently not available in the industry. The existing technology replaced by this new PCB structure is the PCB board processed by copper electroplating. It completely solves the technical problem that the minimum spacing between different grid hole walls and different grid slot walls in the industry can only be 0.2mm due to factors such as drilling position tolerance, aperture and copper core suction effect of traditional PCB boards, realizing complex high-density circuit connection and laying a technical foundation for the development of new quality productivity such as high-end servers, AI, robots, and inductive devices.

[0029] In this embodiment, the multi-layer PCB board 4 is connected to the outside through a metallization conduction process, specifically to the surface conductive layer 7. The surface conductive layer 7 has the required circuit layer processed thereon, thereby realizing complex high-density circuit connection, which can be applied to the field of manufacturing inductive conductor cavity boards, and lays a technical foundation for the development of new quality productivity such as high-end servers, AI, robots, and inductive devices.

[0030] In this embodiment, if Figure 11 and Figure 12 As shown, different network multilayer boards before embedding can be PCB structures such as multilayer through-holes, HDI, and multilayer blind buried vias.

[0031] In this embodiment, if Figure 2As shown, in the prior art, the minimum spacing between adjacent single-grid conductive slots 2 is 0.2 mm, that is, the minimum spacing between hole walls of different grids and between slot walls of different grids is 0.2 mm. The single-grid conductive slots 2 include conductive slots and conductive holes.

[0032] In this embodiment, if Figure 1 As shown, the single-grid conductive line 3 is a solid conductive line, that is, the minimum spacing between adjacent solid conductive lines is 0.03 mm. The single-grid conductive line 3 is smaller in volume than the single-grid conductive slot 2. At the same time, the solid conductive line is not easy to break and the conductive effect is more stable.

[0033] In this embodiment, if Figure 3-10 As shown, a substrate 6 is provided on the side of the multi-layer PCB board 4, and the substrate 6 is attached to the main board PCB boards 1 on both sides, and is respectively provided on both sides. A surface conductive layer 7 is provided on the side of the substrate 6 away from the multi-layer PCB board 4, and a connecting portion 8 is opened on the substrate 6 and the surface conductive layer 7, that is, a window is opened. The connecting portion 8 is a connecting groove or a connecting hole, which is usually a groove or hole opened by a laser or a machine, and is used to connect the multi-layer PCB board 4 to the surface conductive layer 7 through a metallization conduction process, and then the circuit pattern of the surface conductive layer 7 is made on the outer layer, thereby improving the density of the conductive holes and conductive grooves of different grids, and at the same time realizing complex logical connections between the conductive holes and conductive grooves of different grids, so that the performance of the PCB board is significantly improved.

[0034] In this embodiment, if Figure 5 As shown, the minimum embedding tolerance between the multi-layer PCB board 4 and the embedded part 5 is plus or minus thirty-five microns, which is mainly limited by the current equipment processing capabilities. Introducing equipment with stronger processing capabilities can further reduce the tolerance.

[0035] The conventional method for making different network via holes and different network via slots in HDI in the prior art is as follows: laser drilling the inner layer board; metallizing the holes; making a circuit pattern on the inner layer surface conductor; secondary lamination; laser drilling the laminated board; metallizing the holes in the laminated board; making a circuit pattern on the inner layer surface conductor of the laminated board; repeating the lamination, laser drilling, and hole metallization steps until the required number of layers is reached; and making a circuit pattern on the outer layer surface conductor.

[0036] In the prior art, the conventional method for making different network via holes and different network via slots on a multilayer board is as follows: mechanical drilling of the PCB board; metallization of the holes; and making a circuit pattern of the surface conductive layer on the outer layer.

[0037] This application provides a method for preparing an embedded PCB structure:

[0038] like Figure 3 As shown, step S1: forming an embedded portion 5 on the mainboard PCB board 1;

[0039] like Figure 4 As shown, step S2: cutting the multilayer PCB board 4 into an embedding size matching the embedding portion 5;

[0040] like Figure 5 As shown, step S3: the cut multi-layer PCB board 4 is erected and placed into the embedded part 5;

[0041] like Figure 6 As shown, step S4: the whole is superimposed with the substrate 6 and the surface conductive layer 7 to prepare for lamination;

[0042] like Figure 7 As shown, step S5: pressing from both sides of the main board PCB board 1;

[0043] like Figure 8 As shown, step S6: after lamination, windows are opened on the substrate 6 and the surface conductive layer 7 to expose the conductors of the multi-layer PCB board 4 to be led to the outside;

[0044] like Figure 9 As shown, step S7: the conductor of the embedded multi-layer PCB board 4 is connected to the surface conductive layer 7 through a metallization conduction process, that is, the single grid conductive line 3 is connected to the surface conductive layer 7;

[0045] like Figure 10 As shown, step S8: the circuit pattern of the surface conductive layer 7 is made externally to complete the production of the PCB board.

[0046] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An embedded PCB structure, comprising a main PCB board (1), characterized in that: The mainboard PCB (1) is provided with an embedded portion (5), a multi-layer PCB (4) is embedded in the embedded portion (5), and the multi-layer PCB (4) is connected to the outside through a metallization conduction process.

2. The embedded PCB structure according to claim 1, wherein: The multi-layer PCB board (4) is a high-density PCB board manufactured by pressing, comprising a plurality of single-grid conductive circuits (3), wherein the minimum spacing between adjacent single-grid conductive circuits (3) after pressing is 0.03 mm.

3. The embedded PCB structure according to claim 2, wherein: The single-grid conductive circuit (3) is a solid conductive circuit.

4. The embedded PCB structure according to claim 1, wherein: A substrate (6) is provided on the side of the multi-layer PCB board (4); a surface conductive layer (7) is provided on the side of the substrate (6) away from the multi-layer PCB board (4); and a connecting portion (8) is provided between the substrate (6) and the surface conductive layer (7) for connecting the multi-layer PCB board (4) to the surface conductive layer (7) through a metallization conduction process.

5. The embedded PCB structure according to claim 4, wherein: The communicating portion (8) is a communicating groove or a communicating hole.

6. The embedded PCB structure according to claim 1, wherein: The embedded portion (5) is an embedded groove or an embedded hole.

7. The embedded PCB structure according to claim 1, wherein: The embedded portion (5) is opened in a direction perpendicular to the main board PCB (1).

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