Heat dissipation device and communication equipment

Abstract

The invention discloses a heat dissipation device and communication equipment. The heat dissipation device comprises a main heat dissipation device and an independent heat dissipation device, the main heat dissipation device comprises a substrate and first heat dissipation fins, the substrate is provided with a first face and a second face which are opposite to each other, the first heat dissipation fins are arranged on the first face of the substrate, and the second face of the substrate is used for making contact with one or more first heating devices; the substrate is provided with a first notch penetrating from the first surface to the second surface; the independent radiator comprises an evaporation part and a condensation part, and the evaporation part is used for being in contact with one or more second heating devices through the first notch; a gap is formed between the evaporation part and the substrate; the condensation part is arranged on the side, away from the substrate, of the first cooling fin, a gap exists between the condensation part and the first cooling fin, the first end of the condensation part is connected with the first end of the evaporation part, and the second end of the condensation part is connected with the second end of the evaporation part. When the scheme is adopted, the evaporation part can be in contact with a main chip with large heat productivity on the single board, heat of the main chip is transferred to the condensation part from the evaporation part, the substrate can be in contact with other heating devices on the single board, heat of the other heating devices is dissipated through the substrate and the first heat dissipation fins, and heat is insulated between the evaporation part and the substrate through the heat insulation piece; the independent radiator can independently radiate the main chip, heat of the main chip can be rapidly radiated, the temperature of the main chip is effectively reduced, the influence of other heating devices on the main chip can be reduced, and efficient heat radiation of the main chip is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of communications, and in particular to a heat dissipation device and communication equipment. Background Art

[0002] With the continuous development of communication network technology, the application of 5G communication is becoming increasingly popular, bringing numerous conveniences to people's lives and work. As a key device in wireless communications, the remote radio unit (RRU) has evolved into various forms with multiple frequency bands and large bandwidths, providing users with reliable communication guarantees. When transmitting and receiving signals, the RRU chip generates a large amount of heat. Currently, the RRU module mainly uses integrated natural heat dissipation. This heat dissipation method has no mechanical moving parts, a relatively simple structure, and higher operational reliability. However, considering the convenience of installation and maintenance in existing networks, the RRU size should not be too large. At the same time, the performance improvement of the RRU is accompanied by the continuous increase in the overall heat consumption of the whole device, which makes the natural heat dissipation of the RRU within the limited size increasingly challenging. In particular, the heat consumption of the core chip in the future RRU will increase significantly, and the risk of chip overheating is higher when operating in high-temperature areas. To ensure the normal operation of the RRU, more efficient heat dissipation methods are needed to solve the heat dissipation problem of the RRU core chip. Summary of the Invention

[0003] The present application provides a heat dissipation device and a communication device to improve the heat dissipation capability of high-heat-generating components and meet the heat dissipation requirements of high-heat-generating components.

[0004] In a first aspect, the present application provides a heat dissipation device, which may include a main heat sink and an independent heat sink. The main heat sink may include a substrate and first heat dissipation fins. The substrate has a first surface and a second surface opposite to each other. The first heat dissipation fins are arranged on the first surface of the substrate. The second surface of the substrate is used to contact one or more first heating devices. The substrate has a first notch extending from the first surface to the second surface. The independent heat sink may include an evaporation portion and a condensation portion. The evaporation portion is used to contact one or more second heating devices through the first notch. There is a gap between the evaporation portion and the substrate. The condensation portion is arranged on a side of the first heat dissipation fin away from the substrate, and there is a gap between the condensation portion and the first heat dissipation fin. The first end of the condensation portion is connected to the first end of the evaporation portion, and the second end of the condensation portion is connected to the second end of the evaporation portion.

[0005] In the technical solution provided by the present application, the evaporation portion of the independent radiator can be in contact with the second heating device (such as the main chip with larger heat generation on the single board), and the heat of the second heating device is transferred from the evaporation portion to the condensation portion, thereby reducing the temperature of the second heating device. The substrate of the main radiator can be in contact with the first heating device (such as other heating devices on the single board), and the heat of the first heating device is dissipated through the substrate and the first heat dissipation fins. There is a gap between the evaporation portion of the independent radiator and the substrate of the main radiator, so that the independent radiator can independently dissipate heat for the second heating device, and can dissipate the heat of the second heating device relatively quickly, thereby significantly reducing the thermal resistance and temperature difference of the independent radiator, effectively reducing the temperature of the second heating device, and improving the overall performance of the second heating device. In addition, the thermal insulation setting of the independent radiator and the main radiator can reduce the impact of the first heating device on the second heating device, improve the heat dissipation capacity of the second heating device, ensure that the second heating device dissipates heat efficiently, and meets the temperature specifications of the second heating device.

[0006] In one specific embodiment, a thermal insulator is disposed between the evaporation portion and the substrate. The thermal insulator has a second notch extending through the thermal insulator, and the projected area of ​​the second notch on the substrate is greater than or equal to the projected area of ​​the first notch on the substrate. The thermal insulator insulates the evaporation portion of the independent heat sink from the substrate of the main heat sink, enabling the independent heat sink to independently dissipate heat for the main chip.

[0007] In a specific embodiment, the substrate may be provided with a first mounting hole, the first mounting hole extending through the substrate; the evaporation portion may include a bottom plate, a portion of the bottom plate projected onto the substrate coincides with a portion of the first notch projected onto the substrate; the bottom plate is provided with a second mounting hole, the second mounting hole extending through the bottom plate, and the second mounting hole is provided corresponding to the first mounting hole; the bottom plate and the substrate are fixedly connected by fasteners, the fasteners being provided in one of the first mounting holes and the second mounting hole; and a thermal insulator may be provided between the bottom plate and the substrate. While the thermal insulator provides thermal insulation between the bottom plate and the substrate, it does not prevent a portion of the bottom plate from being exposed through the first notch, thereby ensuring that the bottom plate can contact the heating device.

[0008] In one specific embodiment, a positioning groove can be provided on the side of the bottom plate facing the substrate, with the projection of the positioning groove on the substrate being larger than the projection of the first notch on the substrate. A thermal insulator is positioned within the positioning groove, with the dimensions of the thermal insulator being larger than the dimensions of the positioning groove along the thickness of the substrate. This provides for more stable positioning of the thermal insulator and prevents direct contact between the bottom plate and the substrate.

[0009] In a specific embodiment, the evaporation section may further include a cover plate, the bottom plate is provided with a receiving groove, the cover plate and the bottom plate are buckled together to form a sealed receiving space for receiving the working medium; the evaporation section includes a steam exhaust port and a liquid return port, the steam exhaust port is provided at a first end of the evaporation section, and the liquid return port is provided at a second end of the evaporation section; the steam exhaust port and the liquid return port are respectively connected to the receiving space; the first end of the condensation section is connected to the first end of the evaporation section via the steam exhaust port, and the second end of the condensation section is connected to the second end of the evaporation section via the liquid return port, thereby achieving the connection between the condensation section and the evaporation section.

[0010] In one specific embodiment, the internal storage space of the evaporation section may include a first portion and a second portion, the first portion and the second portion being connected; the liquid working fluid may fill part or all of the first portion, and the evaporation phase change of the liquid working fluid may fully absorb the heat from the chip, while the second portion provides space for the evaporation phase change. The first notch may include a third portion and a fourth portion, the third portion and the fourth portion being connected; the projection of the third portion on the substrate is identical to the projection of the first portion on the substrate, and the projection of the fourth portion on the substrate is identical to the projection of the second portion on the substrate. This ensures that the area of ​​the base plate corresponding to the storage space within the evaporation section is exposed by the first notch, allowing the evaporation section to fully absorb the heat from the chip.

[0011] In one specific embodiment, the distance between the first end of the condensation portion and the bottom edge of the substrate is L1, and the distance between the first end of the evaporation portion and the bottom edge of the substrate is L2, where L1>L2. This ensures that the liquid working medium in the condensation portion can flow back smoothly under the action of gravity.

[0012] In a specific embodiment, the condensing section may include a steam collecting pipe, a condensing pipe, and a liquid collecting pipe, wherein the distance between the steam collecting pipe and the bottom edge of the base plate is greater than the distance between the liquid collecting pipe and the bottom edge of the base plate; the condensing pipe is disposed between the steam collecting pipe and the liquid collecting pipe, with both ends of the condensing pipe connected to the steam collecting pipe and the liquid collecting pipe, respectively; the steam collecting pipe is connected to a first end of the evaporating section via a first connecting pipe, and the liquid collecting pipe is connected to a second end of the evaporating section via a second connecting pipe, thereby achieving connection between the condensing section and the evaporating section.

[0013] In a specific embodiment, the steam collecting pipe may include a steam inlet and multiple steam outlets. The steam inlet is connected to the first end of the evaporation section via a first connecting pipe, and each steam outlet is connected to the liquid collecting pipe via a condenser pipe. This achieves the connection between the steam collecting pipe, the condenser pipe, and the liquid collecting pipe, as well as the connection between the condenser section and the evaporation section.

[0014] In a specific embodiment, the liquid collecting pipe may include a liquid outlet and multiple liquid inlets, the liquid outlet being connected to the second end of the evaporation section via a second connecting pipe, and each liquid inlet being connected to the steam collecting pipe via a condenser pipe, thereby achieving connections between the steam collecting pipe, the condenser pipe, and the liquid collecting pipe, as well as between the condenser section and the evaporation section.

[0015] In one specific embodiment, there may be multiple condenser tubes arranged at intervals; a second heat sink fin may be provided between two adjacent condenser tubes, with one end of the second heat sink fin connected to one of the two adjacent condenser tubes, and the other end of the second heat sink fin connected to the other of the two adjacent condenser tubes. This can increase the heat dissipation area of ​​the condenser unit, improve the heat exchange efficiency between the condenser unit and the natural environment, and thus enhance the heat dissipation capacity of the independent radiator.

[0016] In one specific embodiment, a positioning post can be provided on the side of the base plate facing the condenser portion, the positioning post being provided with a first positioning hole; a mounting plate can be provided on the steam collecting pipe, the mounting plate being provided with a second positioning hole, and the second positioning hole extending through the mounting plate; the steam collecting pipe and the base plate are fixedly connected by a first connector, the first connector being disposed in one of the second positioning holes and one of the first positioning holes; a gasket is disposed between the mounting plate and the positioning post, and a gasket is disposed between the side of the first connector facing the mounting plate and the mounting plate. This allows for fixed installation of the steam collecting pipe and the base plate, thereby achieving fixed installation of the condenser portion and the base plate, further improving the installation strength of the independent radiator and enhancing the structural integrity of the heat dissipation device.

[0017] In one specific embodiment, the manifold can also be provided with a mounting plate. The manifold and the base plate are fixedly connected via a second connector. The second connector is disposed within a second positioning hole and a first positioning hole. A gasket is disposed between the mounting plate and the second connector, facing the mounting plate. This allows for secure mounting of the manifold and the base plate.

[0018] In one specific embodiment, the main radiator can be provided with a first protective cover plate. The first protective cover plate and the first heat sink fins are located on the same side of the base plate, with the projection of the first protective cover plate on the base plate covering the first heat sink fins. The first protective cover plate is provided with a first air inlet, which extends through the first protective cover plate. The first protective cover plate can prevent foreign objects from impacting the main radiator, thereby ensuring the main radiator's impact resistance and preventing damage to the main radiator caused by foreign objects.

[0019] In one specific embodiment, the main radiator can be provided with a second protective cover plate, located on the same side of the base plate as the first heat sink, with the projection of the second protective cover plate on the base plate covering the condenser portion. The second protective cover plate is provided with a second air inlet, which extends through the second protective cover plate. The second protective cover plate can prevent foreign objects from impacting the independent radiator, thereby ensuring the independent radiator's impact resistance and preventing damage to the independent radiator caused by foreign objects.

[0020] In a specific embodiment, a portion of the first heat sink fins may be provided with a positioning protrusion on a side away from the base plate, the positioning protrusion extending through the condenser portion, and the second protective cover plate is fixedly connected to the positioning protrusion, thereby achieving a fixed connection between the second protective cover plate and the main radiator, thereby achieving installation and fixation of the second protective cover plate.

[0021] In one specific embodiment, the condenser unit may be provided with a bracket structure, which may include a bracket base and bracket fins. The bracket base is fixedly connected to the side of the condenser unit facing the base plate, the bracket fins are fixedly connected to the bracket base, the bracket fins extend through the condenser unit, and the second protective cover is fixedly connected to the bracket fins. While the bracket structure securely mounts the second protective cover, it also provides effective thermal insulation between the independent radiator and the main radiator, thereby improving the heat dissipation performance of the independent radiator and enhancing the overall heat dissipation capacity of the heat dissipation device.

[0022] In a second aspect, the present application further provides a communication device, which may include a signal processing module and a heat dissipation device as described in any of the possible implementations of the first aspect above, wherein the independent heat sink may contact the core chip of the signal processing module, and the main heat sink may contact at least a portion of the other components of the signal processing module other than the core chip. The heat dissipation device can take into account the heat dissipation of the core chip and other heat-generating components on the signal processing module board, thereby improving the overall performance of the communication device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of the heat dissipation device provided in this application;

[0024] Figure 2 A schematic structural diagram of the main radiator of the heat dissipation device provided in this application;

[0025] Figure 3 A side view of an independent radiator of the heat dissipation device provided by the present application;

[0026] Figure 4 A schematic diagram of a portion of the structure of the substrate of the heat dissipation device provided in this application;

[0027] Figure 5 A schematic structural diagram of the evaporation portion of the heat dissipation device provided in this application;

[0028] Figure 6 A schematic diagram of the internal structure of the evaporation portion of the heat dissipation device provided in this application;

[0029] Figure 7 A schematic diagram of the structure of the condensation part of the heat dissipation device provided in this application;

[0030] Figure 8 A schematic structural diagram of the main radiator of the heat dissipation device provided in this application;

[0031] Figure 9 A partial connection diagram of the heat dissipation device provided in this application;

[0032] Figure 10 Schematic diagram of the assembly of the independent radiator and the main radiator of the heat dissipation device provided by this application;

[0033] Figure 11 A schematic diagram of the structure of the heat dissipation device provided in this application;

[0034] Figure 12 A schematic diagram of a portion of the structure of the heat dissipation device provided in this application;

[0035] Figure 13 A partial structural cross-sectional view of the heat dissipation device provided in this application;

[0036] Figure 14 A schematic diagram of the structure of the bracket structure of the heat dissipation device provided in this application;

[0037] Figure 15 This is an assembly diagram of the second protective cover and bracket structure of the heat dissipation device provided in this application.

[0038] Reference numerals:

[0039] 100-main radiator; 200-independent radiator; 300-thermal insulation; 110-base plate;

[0040] 120 - first heat dissipation fin; 130 - first protective cover; 140 - second protective cover; 111 - first notch;

[0041] 112 - first mounting hole; 113 - positioning column; 121 - positioning protrusion; 1111 - third portion;

[0042] 1112 - fourth part; 210 - evaporation part; 220 - condensation part; 230 - first connecting pipe;

[0043] 240 - second connecting pipe; 250 - bracket base; 260 - bracket teeth; 211 - bottom plate;

[0044] 212-reinforcement column; 221-steam collecting pipe; 222-condenser pipe; 223-liquid collecting pipe;

[0045] 224 - mounting plate; 225 - first connecting member; 226 - gasket; 2111 - second mounting hole;

[0046] 2112-positioning groove; 310-second notch. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all explained with reference to the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings in the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0048] The following description sets forth specific details to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways than those described herein, and those skilled in the art can make similar generalizations without departing from the scope of the embodiments of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0049] For ease of understanding, the application scenarios of the heat dissipation device involved in the present application are first explained. The heat dissipation device provided in the embodiment of the present application can be applied to the natural heat dissipation scenarios of various electronic devices. For example, it can be applied to the communication field to naturally dissipate heat for the functional modules of wireless communication equipment. In one possible application scenario, the communication equipment may include a signal processing module and a heat dissipation device. The signal processing module is used to process electrical signals or radio frequency signals. The processing here is not limited to conversion, filtering, combining, phase shifting, transmitting and receiving, etc. For example, the signal processing module can be a remote radio unit (RRU), a multiple-input multiple-output (MIMO) transmission module, etc.; the heat dissipation device contacts the signal processing module, including the case of contacting the core chip of the signal processing module, and also including the case of contacting the core chip of the signal processing module and at least a part of other devices of the signal processing module other than the core chip, to achieve heat dissipation for the signal processing module; other devices of the signal processing module other than the core chip may include devices such as power amplifiers, drivers and power supplies, and these devices can be arranged on the same circuit board as the core chip.

[0050] Taking the heat dissipation of RRU as an example, in related technologies, RRU mainly adopts overall natural heat dissipation. This heat dissipation method has no mechanical moving parts, a relatively simple structure, and higher working reliability. However, considering the convenience of installation and maintenance in the existing network, the size of RRU should not be too large. At the same time, the performance improvement of RRU is accompanied by the continuous increase in the heat consumption of the whole machine, resulting in an increasing challenge of natural heat dissipation of RRU within a limited size. In particular, the heat consumption of the core chip in the RRU will increase significantly in the future. When working in high-temperature areas, the risk of chip overheating is high, and the performance stability of wireless communication equipment is difficult to guarantee. Based on this, the embodiment of the present application provides a heat dissipation device to improve the heat dissipation capacity of high-heat-generating components such as the core chip in the RRU to meet its heat dissipation needs.

[0051] First refer to Figure 1 , Figure 1 The schematic diagram of the heat dissipation device provided by the present application is shown. In the coordinate directions of the following figures, the direction shown on the x-axis represents the first direction, the direction shown on the y-axis represents the second direction, and the direction shown on the z-axis represents the third direction; the second direction may be at an angle to the first direction, for example, the second direction may be perpendicular to the first direction; the third direction may be at an angle to the first direction and the second direction, for example, the third direction may be perpendicular to the first direction and the second direction, respectively. Figure 1 As shown, the heat dissipation device provided in the embodiment of the present application may include a main heat sink 100 and an independent heat sink 200 . Figure 2 The schematic diagram of the structure of the main radiator of the heat dissipation device provided by the present application is shown. Figure 1 and Figure 2 As shown, the main heat sink 100 may include a substrate 110 and first heat dissipating fins 120. The substrate 110 has a first surface and a second surface opposite to each other. The first heat dissipating fins 120 may be disposed on the first surface of the substrate 110. In actual use, the second surface of the substrate 110 may contact one or more first heat-generating devices. Specifically, the first direction may be perpendicular to the first surface of the substrate 110, and the first direction may be the thickness direction of the substrate 110. The second direction may be at an angle to the first surface of the substrate 110, for example, the second direction may be the height direction of the substrate 110. The third direction may be at an angle to the first surface of the substrate 110 or parallel to the first surface of the substrate 110, for example, the third direction may be the length direction of the substrate 110. The substrate 110 has a first notch 111 extending from the first surface to the second surface, i.e., the first notch 111 extends through the substrate 110 in the first direction, i.e., the first notch 111 extends through the substrate 110 in the thickness direction of the substrate 110. Illustratively, in the second direction, the first notch 111 can be located between the first end and the second end of the substrate 110, and the first notch 111 can be set close to the second end of the substrate 110, that is, the first notch 111 can be set close to the bottom end of the substrate 110; of course, the first notch 111 can also be located at other positions on the substrate 110.

[0052] Figure 3 The side view of the independent radiator of the heat dissipation device provided by the present application is shown, combined with Figure 2 and Figure 3 As shown, the independent heat sink 200 may include an evaporation portion 210 and a condensation portion 220. The evaporation portion 210 may contact one or more second heating devices through the first notch 111. Specifically, at least a portion of the projection of the evaporation portion 210 on the first surface of the substrate 110 falls within the first notch 111. In other words, in the first direction, at least a portion of the projection of the evaporation portion 210 coincides with the projection of the first notch 111. The evaporation portion 210 may be located on the same side of the substrate 110 as the first heat dissipating fins 120 in the first direction. At least a portion of the evaporation portion 210 may be disposed within the first notch 111 and extend toward the other side of the substrate 110 to contact the heating device.

[0053] In a specific implementation, there is a gap between the evaporation portion 210 and the substrate 110 to prevent the heat of the substrate 110 from being transferred to the evaporation portion 210, that is, to prevent the heat of the main radiator 100 from being conducted to the independent radiator 200, which can improve the heat dissipation performance of the independent radiator 200. In a specific implementation, the gap between the evaporation portion 210 and the substrate 110 can be provided with a heat insulating member. The heat insulating member can be provided at the installation interface of the evaporation portion 210 and the substrate 110. The heat insulating member is made of a low thermal conductivity material different from the material of the main radiator 100 and the independent radiator 200. For example, the heat insulating member can be made of rubber, plastic, etc., and the heat insulating member can have a certain degree of flexibility. The condensation portion 220 is provided on the side of the first heat dissipation fin 120 away from the substrate 110, that is, the condensation portion 220 and the first heat dissipation fin 120 can be located on the same side of the substrate 110. There is a gap between the condensation portion 220 and the first heat dissipation fin 120 in the first direction to prevent the heat of the first heat dissipation fin 120 from being transferred to the condensation portion 220. The condensation section 220 can be arranged perpendicular to the first direction, or the condensation section 220 can be arranged at other angles to the first direction, that is, the condensation section 220 can be arranged at an angle relative to the vertical direction of the first direction. The first heat dissipation fins 120 located in the projection area of ​​the condensation section 220 in the first direction can have a size smaller in the first direction than the first heat dissipation fins 120 in other areas, which can play a role of avoidance, so that the independent radiator 200 and the main radiator 100 can achieve the effect of embedded installation, which can improve the structural integrity of the heat dissipation device and reduce the size of the heat dissipation device as a whole in the first direction, that is, reduce the volume of the heat dissipation device as a whole; at this time, there is also a gap between the condensation section 220 and the first heat dissipation fins 120 in the vertical direction of the first direction.

[0054] In the second direction, the first end of the condenser 220 is connected to the first end of the evaporator 210 via the first connecting tube 230, and the second end of the condenser 220 is connected to the second end of the evaporator 210 via the second connecting tube 240. This means that the top and bottom ends of the condenser 220 are connected to the top and bottom ends of the evaporator 210 via the connecting tubes, respectively. The evaporator 210 and the condenser 220 of the independent radiator 200 are connected via the first connecting tube 230 and the second connecting tube 240 to form a circulating heat dissipation loop, and the circulating loop is filled with a phase-change working medium. For example, the evaporator 210 is filled with a phase-change working medium, specifically, the evaporator 210 is filled with a liquid phase-change working medium.

[0055] In practical applications, taking the application in the field of communications as an example, the second heating device can be the main chip (or core chip) of the signal processing module, and the first heating device can be other heating devices of the signal processing module (such as power amplifiers, drivers or power supplies, etc.). The main chip generates a large amount of heat when working, and the heat is high. The evaporation part 210 of the independent radiator 200 can be in contact with the main chip, and the heat of the main chip is transferred from the evaporation part 210 to the condensation part 220 through the phase change working medium in the circulating heat dissipation loop, thereby reducing the temperature of the main chip. The substrate 110 of the main radiator 100 can be in contact with other heating devices, and the heat of other heating devices is dissipated through the substrate 110 and the first heat dissipation fins 120. There is a gap between the evaporation portion 210 of the independent radiator 200 and the substrate 110 of the main radiator 100 for thermal insulation, so that the independent radiator 200 can independently dissipate heat from the main chip, which can dissipate the heat of the main chip relatively quickly, thereby significantly reducing the thermal resistance and temperature difference of the independent radiator 200, effectively reducing the temperature of the main chip, and improving the overall performance of the main chip. In addition, the thermal insulation setting of the independent radiator 200 and the main radiator 100 can reduce the impact of other heating devices on the main chip, improve the heat dissipation capacity of the main chip, ensure efficient heat dissipation of the main chip, and meet the temperature specifications of the main chip. The heat dissipation device provided by the present application can take into account the heat dissipation of the main chip and other heating devices on the signal processing module board, and can improve the overall performance of the signal processing module.

[0056] The heat dissipation device provided herein, by providing an independent two-phase heat sink (independent heat sink 200), can effectively improve the heat dissipation of the core chip of the signal processing module in natural heat dissipation scenarios. It is understood that the heat dissipation device can also be used in air-cooled scenarios, such as improving the heat dissipation performance of chips in indoor baseband processing units (BBUs) and servers.

[0057] In a specific implementation, the loop thermosyphon (LTS) principle can be utilized to enable the independent heat sink 200 to quickly dissipate chip heat. Specifically, the liquid working medium in the evaporation section 210 absorbs the chip heat and undergoes a vaporization phase change. Utilizing the working medium's latent heat of vaporization, the chip heat is rapidly transferred to the relatively low-temperature condensation section 220 via the first connecting pipe 230 by the steam discharged from the evaporation section 210. The gaseous working medium condenses into liquid working medium in the condensation section 220, and under the action of gravity, siphoning, or a pump, it flows back to the evaporation section 210 through the second connecting pipe 240, thereby achieving cyclic heat dissipation and effectively reducing the chip temperature.

[0058] When actually cooling the chip, the evaporation portion 210 can contact the chip through a vapor chamber (VC). The vapor chamber can even out the temperature, reducing local high heat flux density, facilitating rapid heat dissipation from the chip, and effectively lowering the chip temperature. Specifically, the evaporation portion 210 and the vapor chamber can contact each other through a thermal interface material (TIM), and the vapor chamber and the chip can also contact each other through the TIM.

[0059] In a specific implementation, the substrate 110 and / or first heat sink fins 120 of the main heat sink 100 may also be provided with a cavity to be filled with a phase-change medium. By circulating the medium within the cavity, the natural heat dissipation capacity of the main heat sink 100 is enhanced, and the heat dissipation of other heat-generating components besides the main chip can be improved. When both the substrate 110 and the first heat sink fins 120 are filled with a phase-change medium, the cavities within the substrate 110 and the first heat sink fins 120 can be connected, and the phase-change medium can circulate between the substrate 110 and the first heat sink fins 120.

[0060] Figure 4 FIG. 1 shows a schematic diagram of a partial structure of a substrate of a heat dissipation device provided by the present application. Figure 4 As shown, the substrate 110 is provided with a first mounting hole 112 , which penetrates the substrate 110 in a first direction, and the axis of the first mounting hole 112 may be parallel to the first direction. The first mounting hole 112 is used to fix and install the evaporation portion 210 .

[0061] Figure 5 The schematic diagram of the structure of the evaporation part of the heat dissipation device provided by the present application is shown in FIG. Figure 5As shown, the evaporation portion 210 may include a base plate 211 and a cover plate. A portion of the projection of the base plate 211 on the substrate 110 overlaps with the projection of the first notch 111 on the substrate 110. Specifically, in the first direction, a portion of the projection of the base plate 211 overlaps with the projection of the first notch 111. A portion of the base plate 211 may be exposed by the first notch 111 to contact the heating device. Specifically, the side of the base plate 211 facing the substrate 110 in the first direction is configured to contact the heating device. The other side of the base plate 211 in the first direction is provided with a receiving groove. The side of the base plate 211 facing the substrate 110 in the first direction may have a raised structure in the area corresponding to the receiving groove. In actual use, the raised structure may be exposed by the first notch 111 to contact the heating device. The projected area of ​​the cover plate in the first direction may be smaller than the projected area of ​​the base plate 211 in the first direction. The cover plate is engaged with the base plate 211 on the other side of the base plate 211 in the first direction to form a sealed receiving space for accommodating the working medium. The cover plate and the bottom plate 211 are connected as one body by connecting pieces, bonding or welding, and the airtightness of the connection is ensured, or the cover plate and the bottom plate 211 can be integrally formed.

[0062] Combine Figure 4 and Figure 5 As shown, the bottom plate 211 is provided with a second mounting hole 2111. The second mounting hole 2111 passes through the bottom plate 211 in the first direction. The axis of the second mounting hole 2111 can be parallel to the first direction. The second mounting hole 2111 is arranged corresponding to the first mounting hole 112 in the first direction. The second mounting hole 2111 avoids the cover plate or corresponds to the side wall of the cover plate in the first direction to maintain the airtightness of the storage space. When specifically connected, the bottom plate 211 and the base plate 110 can be fixedly connected by fasteners. The fasteners are arranged in one of the first mounting holes 112 and the second mounting hole 2111. This achieves the fixed installation of the evaporation portion 210 and the base plate 110, and the relative position of the independent radiator 200 and the main radiator 100 is fixed. The independent radiator 200 is effectively fixed and installed, which can enhance the structural integrity of the heat dissipation device.

[0063] Specifically, the first mounting hole 112 can be a threaded countersunk hole, and the second mounting hole 2111 can be a threaded through hole. The fastener can be a screw or bolt, which is screwed into the second mounting hole 2111 and the first mounting hole 112 to achieve a fixed connection between the bottom plate 211 and the base plate 110. There can be multiple first mounting holes 112, and the multiple first mounting holes 112 are arranged around the first notch 111. The number of second mounting holes 2111 and the first mounting holes 112 are the same, and the positions are corresponding.

[0064] In a specific implementation, the thermal insulation member 300 is disposed between the bottom plate 211 and the base plate 110. The thermal insulation member 300 can be stacked with the bottom plate 211 and the base plate 110 in a first direction. The thermal insulation member 300 can be bonded to the bottom plate 211 and the base plate 110 to secure the position of the thermal insulation member 300. The thermal insulation member 300 is provided with a second notch 310. The second notch 310 passes through the thermal insulation member 300. The projected area of ​​the second notch 310 on the base plate 110 is greater than or equal to the projected area of ​​the first notch 111 on the base plate 110. Specifically, the second notch 310 passes through the thermal insulation member 300 in the first direction. The projected area of ​​the second notch 310 in the first direction is greater than or equal to the projected area of ​​the first notch 111. In this way, the thermal insulation member 300 provides heat insulation between the bottom plate 211 and the base plate 110 without preventing a portion of the bottom plate 211 from being exposed through the first notch 111, thereby ensuring that the bottom plate 211 can contact the heat-generating device. Specifically, a positioning groove 2112 may be provided on the side of the bottom plate 211 facing the substrate 110. The projected area of ​​the positioning groove 2112 on the substrate 110 is larger than the projected area of ​​the first notch 111 on the substrate 110. Specifically, in the first direction, the projected area of ​​the positioning groove 2112 is larger than the projected area of ​​the first notch 111. The thermal insulator 300 may be positioned within the positioning groove 2112, thereby further stabilizing the position of the thermal insulator 300. In the first direction, the size of the thermal insulator 300 is larger than the size of the positioning groove 2112, that is, the thickness of the thermal insulator 300 is greater than the depth of the positioning groove 2112, ensuring that the bottom plate 211 and the substrate 110 do not directly contact each other.

[0065] As a possible embodiment, the evaporation section 210 may include a steam exhaust port and a liquid return port. In the second direction, the steam exhaust port is arranged at the first end of the evaporation section 210, and the liquid return port is arranged at the second end of the evaporation section 210, that is, the steam exhaust port is located above the liquid return port. The steam exhaust port and the liquid return port are respectively connected to the accommodating space. The first end of the condensation section 220 is connected to the first end of the evaporation section 210 through the steam exhaust port. Specifically, the first connecting pipe 230 is connected to the first end of the evaporation section 210 through the steam exhaust port. The second end of the condensation section 220 is connected to the second end of the evaporation section 210 through the liquid return port. Specifically, the second connecting pipe 240 is connected to the second end of the evaporation section 210 through the liquid return port, thereby realizing that the condensation section 220 is connected to the evaporation section 210 through the first connecting pipe 230 and the second connecting pipe 240. Figure 6 The internal structure diagram of the evaporation part of the heat dissipation device provided by the present application is shown in FIG. Figure 6 As shown, the accommodating space inside the evaporation part 210 may be provided with a reinforcing column 212 , and both ends of the reinforcing column 212 are respectively connected to the cover plate and the bottom plate 211 to strengthen the structural strength of the evaporation part 210 and improve its high pressure resistance performance.

[0066] In a specific embodiment, the internal storage space of the evaporation section 210 may include a first portion and a second portion, arranged along the second direction and connected to each other. In the first direction, the projected shape of the first portion is a square or rectangular. In actual configuration, the projected area of ​​the first portion is larger than the projected area of ​​the chip. Since the chip is typically square in shape, the first portion can cover the chip in the first direction, and the liquid working fluid can fill part or all of the first portion. The evaporation phase transition of the liquid working fluid can fully absorb the heat from the chip. In the first direction, the projected shape of the second portion is a triangle, a semi-ellipse, or a semi-circle. After absorbing the heat from the chip, the liquid working fluid in the evaporation section 210 undergoes an evaporation phase transition, and the second portion provides space for the evaporation phase transition. When the liquid working fluid fills a portion of the first portion, the remaining portion of the first portion can also provide space for the evaporation phase transition. The position of the second portion corresponds to the position of the exhaust port, through which steam can be discharged from the evaporation section 210.

[0067] Refer again Figure 4 As shown, corresponding to the accommodation space within the evaporation portion 210, the first notch 111 includes a third portion 1111 and a fourth portion 1112. The third portion 1111 and the fourth portion 1112 are arranged along the second direction and communicate with each other. The projection of the third portion 1111 on the substrate 110 is the same as the projection of the first portion on the substrate 110, and the projection of the fourth portion 1112 on the substrate 110 is the same as the projection of the second portion on the substrate 110. Specifically, in the first direction, the third portion 1111 corresponds to the position of the first portion, and the projection of the third portion 1111 is the same as the projection of the first portion. The fourth portion 1112 corresponds to the position of the second portion, and the projection of the fourth portion 1112 is the same as the projection of the second portion. This ensures that the area of ​​the base plate 211 corresponding to the accommodation space within the evaporation portion 210 is exposed by the first notch 111, allowing the evaporation portion 210 to fully absorb heat from the chip.

[0068] As a possible embodiment, the distance between the first end of the condensation section 220 and the bottom edge of the substrate 110 is L1, and the distance between the first end of the evaporation section 210 and the bottom edge of the substrate 110 is L2. Specifically, in the second direction, the distance between the first end of the condensation section 220 and the second end of the substrate 110 is L1, and the distance between the first end of the evaporation section 210 and the second end of the substrate 110 is L2, wherein L1>L2. In other words, the top of the condensation section 220 is higher than the top of the evaporation section 210, ensuring that the liquid working medium in the condensation section 220 flows back smoothly under the action of gravity. Of course, the top of the condensation section 220 may not be higher than the top of the evaporation section 210, and the reflux of the liquid working medium may be ensured by a pump or siphon action. In the first direction, the projected area of ​​the condensation section 220 may be larger than the projected area of ​​the evaporation section 210, and the condensation section 220 is farther away from the substrate 110 than the evaporation section 210.

[0069] Figure 7 The schematic diagram of the structure of the condensation part of the heat dissipation device provided by the present application is shown in FIG. Figure 7 As shown, the condenser section 220 may include a steam collecting pipe 221, a condensing pipe 222, and a liquid collecting pipe 223. In the second direction, the distance between the steam collecting pipe 221 and the bottom edge of the base plate 110 is greater than the distance between the liquid collecting pipe 223 and the bottom edge of the base plate 110, i.e., the steam collecting pipe 221 is located above the liquid collecting pipe 223. The condensing pipe 222 is disposed between the steam collecting pipe 221 and the liquid collecting pipe 223. There may be multiple condensing pipes 222, each of which has its ends connected to the steam collecting pipe 221 and the liquid collecting pipe 223, respectively, to form a condensation chamber. The steam collecting pipe 221 is connected to the first end of the evaporator section 210 via a first connecting pipe 230, and the liquid collecting pipe 223 is connected to the second end of the evaporator section 210 via a second connecting pipe 240. Specifically, the steam collecting pipe 221 is connected to the steam exhaust port of the evaporator section 210 via the first connecting pipe 230, and the liquid collecting pipe 223 is connected to the liquid return port of the evaporator section 210 via the second connecting pipe 240. The function of the condensation section 220 is to condense the incoming gaseous working medium into a liquid working medium. In specific implementation, the condensation tube 222 can be a microchannel flat tube, and the condensation section 220 is in the form of a microchannel heat exchanger; or, the condensation tube 222 can be a copper tube, and the condensation section 220 is in the form of a tube-fin heat exchanger; or, the condensation tube 222 can be a blown plate, etc.

[0070] In specific implementations, the steam collecting pipe 221 includes a steam inlet and multiple steam outlets. The steam inlet is connected to the first end of the evaporator 210 via a first connecting pipe 230, and each steam outlet is connected to the liquid collecting pipe 223 via a condenser pipe 222. The liquid collecting pipe 223 includes a liquid outlet and multiple liquid inlets. The liquid outlet is connected to the second end of the evaporator 210 via a second connecting pipe 240, and each liquid inlet is connected to the steam collecting pipe 221 via a condenser pipe 222. Specifically, the steam inlet is connected to the steam exhaust port of the evaporator 210 through the first connecting pipe 230, the liquid outlet is connected to the liquid return port of the evaporator 210 through the second connecting pipe 240, and one steam outlet is connected to one liquid inlet through one condenser 222, or in other words, the two ends of each condenser 222 are respectively connected to one steam outlet and one liquid inlet, thereby realizing the connection between the steam collecting pipe 221, the condenser pipe 222 and the liquid collecting pipe 223, and realizing the connection between the condenser 220 and the evaporator 210.

[0071] In actual configuration, each condenser tube 222 can extend along the second direction, and multiple condenser tubes 222 can be arranged at intervals along the third direction. A second heat dissipation fin can be provided between two adjacent condenser tubes 222. In the third direction, one end of the second heat dissipation fin is connected to one of the two adjacent condenser tubes 222, and the other end of the second heat dissipation fin is connected to the other of the two adjacent condenser tubes 222. This not only improves the overall structural strength of the condenser section 220, but also increases the heat dissipation area of ​​the condenser section 220, improves the heat exchange efficiency between the condenser section 220 and the natural environment, and thus improves the heat dissipation capacity of the independent radiator 200. In addition to the second heat dissipation fin, a third heat dissipation fin can also be provided. One end of the third heat dissipation fin can be connected to the second heat dissipation fin, and the other end of the third heat dissipation fin can be away from the second heat dissipation fin along the first direction or in a direction at an angle to the first direction. The provision of the third heat dissipation fin can further increase the heat dissipation area of ​​the condenser section 220.

[0072] As a possible implementation, the condenser portion 220 of the independent radiator 200 can also be fixedly mounted to the base plate 110 of the main radiator 100 to further enhance the mounting strength of the independent radiator 200 and strengthen the structural integrity of the heat dissipation device. The steam collecting pipe 221 can be provided with a mounting plate 224, which is provided with a second positioning hole. The axis of the second positioning hole can be parallel to the first direction, and the second positioning hole penetrates the mounting plate 224 in the first direction. Specifically, the mounting plate 224 can be positioned on the side of the steam collecting pipe 221 away from the liquid collecting pipe 223 in the second direction, without affecting the layout of the condenser pipe 222. Figure 8 The schematic diagram of the structure of the main radiator of the heat dissipation device provided by the present application is shown in FIG. Figure 8As shown, a positioning column 113 may be provided on the side of the base plate 110 facing the condensation portion 220. The positioning column 113 is arranged along a first direction. The positioning column 113 is provided with a first positioning hole. The axis of the first positioning hole may be parallel to the first direction. Specifically, the first positioning hole may be a threaded hole. The steam collecting pipe 221 and the base plate 110 are fixedly connected by a first connecting member. The first connecting member is arranged in a second positioning hole and a first positioning hole to achieve fixed installation of the steam collecting pipe 221 and the base plate 110, that is, to achieve fixed installation of the condensation portion 220 and the base plate 110.

[0073] Figure 9 A partial connection diagram of the heat dissipation device provided by the present application is shown in FIG. Figure 9 As shown, a gasket 226 is provided between the mounting piece 224 and the positioning post 113 to prevent the mounting piece 224 from contacting the positioning post 113, and a gasket 226 is also provided between the first connecting member 225 and the side facing the mounting piece 224 in the first direction to prevent the mounting piece 224 from contacting the first connecting member 225, thereby preventing the steam collecting pipe 221 from contacting the base plate 110, that is, preventing the condensing portion 220 from contacting the base plate 110. Specifically, the gasket 226 can be made of a low thermal conductivity material to prevent heat from the base plate 110 from being transferred to the condensing portion 220, thereby achieving the goal of fixing the condensing portion 220 while not affecting the heat dissipation effect of the independent radiator 200.

[0074] Similar to the steam collecting pipe 221, Figure 7 As shown, the manifold 223 may also be provided with a mounting plate 224. Mounting plate 224 may be located on a side of the manifold 223, away from the steam collecting pipe 221, in the second direction. The manifold 223 and the base plate 110 are fixedly connected via a second connector. The second connector is disposed within one of the second and first positioning holes, thereby securing the manifold 223 to the base plate 110. A gasket 226 is also disposed between the side of the second connector facing the mounting plate 224 in the first direction and the mounting plate 224. Figure 10 The figure shows an assembly diagram of the independent radiator and the main radiator of the heat dissipation device provided by the present application. Figure 10 The example shows a case where mounting plates 224 are provided on both the liquid collecting pipe 223 and the steam collecting pipe 221. Both the liquid collecting pipe 223 and the steam collecting pipe 221 are connected to the base plate 110 via the mounting plates 224, which can further improve the stability of the fixed installation of the condensation part 220 and the base plate 110.

[0075] Figure 11 The schematic diagram of the heat dissipation device provided by the present application is shown in FIG. Figure 11As shown, the main radiator 100 can be provided with a first protective cover plate 130. The first protective cover plate 130 and the first heat dissipating fins 120 are located on the same side of the substrate 110, that is, the first protective cover plate 130 can be located on the first side of the substrate 110. The projection of the first protective cover plate 130 on the substrate 110 covers the first heat dissipating fins 120. Specifically, the projection of the first protective cover plate 130 in the first direction covers the first heat dissipating fins 120. The first protective cover plate 130 can cover the first heat dissipating fins 120 and the substrate 110 from the first side of the substrate 110. The first protective cover plate 130 can prevent foreign objects from impacting the main radiator 100, ensuring the anti-impact strength of the main radiator 100 and preventing damage to the main radiator 100 due to foreign objects. Specifically, the first protective cover plate 130 is provided with a first air inlet, which penetrates the first protective cover plate 130 in the first direction. The provision of the first air inlet can improve the air intake and outlet of natural heat dissipation without hindering the heat dissipation of the main radiator 100. The first air inlet may have a flat hole, a louver hole, a slit hole, or the like.

[0076] During specific implementation, the first protective cover 130 can be fixedly connected to the first heat dissipating fin 120 or the substrate 110. Specifically, a mounting hole can be provided on the first protective cover 130, and a corresponding positioning hole can be provided on the first heat dissipating fin 120 or the substrate 110, so that the first protective cover 130 can be fixedly connected to the first heat dissipating fin 120 or the substrate 110 by means of connecting parts such as screws provided in the mounting hole and the positioning hole, thereby achieving fixed connection between the first protective cover 130 and the main radiator 100, thereby achieving fixed installation of the first protective cover 130.

[0077] As a possible embodiment, the main radiator 100 may also be provided with a second protective cover plate 140. The second protective cover plate 140 and the first heat dissipating fins 120 may be located on the same side of the substrate 110, that is, the second protective cover plate 140 may also be located on the first side of the substrate 110. The projection of the second protective cover plate 140 on the substrate 110 covers the condenser portion 220. Specifically, the projection of the second protective cover plate 140 in the first direction covers the condenser portion 220 and the evaporator portion 210. The second protective cover plate 140 may cover the condenser portion 220 and the evaporator portion 210 from the first side of the substrate 110. The second protective cover plate 140 can prevent foreign objects from hitting the independent radiator 200, ensure the impact resistance of the independent radiator 200, and prevent the independent radiator 200 from being damaged by foreign objects. It is understandable that in the first direction, except for the area where the independent radiator 200 is installed, the first heat dissipating fins 120 in the remaining areas of the main radiator 100 can be covered by the first protective cover plate 130. Similar to the first protective cover 130 , the second protective cover 140 may be provided with a second air inlet, which passes through the second protective cover 140 in the first direction, so that the second protective cover 140 does not hinder the heat dissipation of the independent radiator 200 while playing a protective role.

[0078] During specific implementation, the second protective cover 140 can be fixedly connected to the main radiator 100. In one specific implementation, the second protective cover 140 can be fixedly connected to the positioning column 113 on the substrate 110 by means of connecting parts such as screws, thereby achieving a fixed connection between the second protective cover 140 and the main radiator 100, thereby achieving the installation and fixation of the second protective cover 140.

[0079] Figure 12 shows a partial structural schematic diagram of the heat dissipation device provided by this application, Figure 13 A partial structural cross-sectional view of the heat dissipation device provided by the present application is shown, combined with Figure 12 and Figure 13As shown, in another specific implementation, a portion of the first heat dissipation fins 120 may be provided with a positioning protrusion 121 on a side away from the base plate 110 in the first direction. The positioning protrusion 121 penetrates the condenser portion 220 in the first direction. Specifically, the positioning protrusion 121 may penetrate the condenser portion 220 through the gap between adjacent condenser tubes 222, and there is a gap between the positioning protrusion 121 and the condenser tube 222. The second protective cover plate 140 may be fixedly connected to the positioning protrusion 121 by a connecting member such as a screw, thereby achieving a fixed connection between the second protective cover plate 140 and the main radiator 100, thereby achieving the installation and fixation of the second protective cover plate 140. The provision of the positioning protrusion 121 can achieve the fixed installation of the second protective cover plate 140. At the same time, compared with the portion of the first heat dissipation fins 120 penetrating the condenser portion 220, only the positioning protrusion 121 penetrating the condenser portion 220 can reduce the baking of the condenser portion 220 by the first heat dissipation fins 120, thereby avoiding affecting the heat exchange effect of the condenser portion 220. Specifically, a low thermal conductivity material is provided at the position where the positioning protrusion 121 is fixedly connected to the second protective cover plate 140 to prevent the heat of the first heat dissipating fins 120 from being transferred to the second protective cover plate 140 , which can further avoid affecting the heat exchange effect of the condensation section 220 .

[0080] Figure 14 A schematic structural diagram of the bracket structure of the heat dissipation device provided in this application is shown. Figure 15 The assembly diagram of the second protective cover and the bracket structure of the heat dissipation device provided by the present application is shown. Figure 14 and Figure 15As shown, the second protective cover 140 can also be fixedly connected to the independent radiator 200. In a specific implementation, the condensing portion 220 can be provided with a bracket structure, which can include a bracket base 250 and a bracket tooth piece 260. The bracket base 250 is fixedly connected to the side of the condensing portion 220 facing the base plate 110. Specifically, the bracket base 250 can be fixedly connected to the steam collecting pipe 221 and / or the liquid collecting pipe 223; the bracket tooth piece 260 is fixedly connected to the bracket base 250 or integrally formed, and the bracket tooth piece 260 is fixedly connected to the bracket base 250. The bracket teeth 260 penetrate the condensing portion 220 in one direction. Specifically, the bracket teeth 260 can penetrate the condensing portion 220 through the gap between adjacent condensing tubes 222. There is a gap between the bracket teeth 260 and the condensing tubes 222. The second protective cover 140 can be fixedly connected to the bracket teeth 260 by screws or other connecting parts to achieve a fixed connection between the second protective cover 140 and the condensing portion 220, that is, to achieve a fixed connection between the second protective cover 140 and the independent radiator 200, thereby achieving the installation and fixation of the second protective cover 140. The bracket base 250 and the bracket teeth 260 can respectively adopt a metal material structure (such as aluminum alloy, copper, etc.). The bracket structure can not only achieve the fixed installation of the second protective cover 140, but also assist in heat dissipation of the condensing portion 220, thereby improving the heat dissipation capacity of the independent radiator 200. Alternatively, the bracket base 250 and the bracket teeth 260 can respectively adopt a structure of metal plus insulating ribs or rubber strips, or can be formed of other materials with better thermal insulation properties, so that the bracket structure has better thermal insulation performance. While being able to achieve fixed installation of the second protective cover 140, the bracket structure can also play a better insulation role between the independent radiator 200 and the main radiator 100, which can improve the heat dissipation performance of the independent radiator 200 and enhance the overall heat dissipation capacity of the heat dissipation device.

[0081] In this application, "at least one" means one or more, and "more" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. In the text description of this application, the character " / " generally indicates that the previous and next associated objects are in an "or" relationship; in the formula of this application, the character " / " indicates that the previous and next associated objects are in a "division" relationship. "Including at least one of A, B and C" can mean: including A; including B; including C; including A and B; including A and C; including B and C; including A, B and C.

[0082] It is understood that the various numbers used in the embodiments of this application are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The order of the sequence numbers of the above-mentioned processes does not necessarily imply a specific order of execution; the order of execution of the processes should be determined by their functions and inherent logic.

[0083] The above is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in this application should be covered by the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: Including main radiator and independent radiator; The main heat sink includes a base plate and first heat dissipation fins, the base plate having a first surface and a second surface opposite to each other, the first heat dissipation fins being arranged on the first surface of the base plate, and the second surface of the base plate being used to contact one or more first heat-generating devices; the base plate has a first notch extending from the first surface to the second surface; The independent radiator includes an evaporation part and a condensation part, the evaporation part is used to contact one or more second heating devices through the first notch; there is a gap between the evaporation part and the substrate; the condensation part is arranged on the side of the first heat dissipation fin away from the substrate, and there is a gap between the condensation part and the first heat dissipation fin, the first end of the condensation part is connected to the first end of the evaporation part, and the second end of the condensation part is connected to the second end of the evaporation part.

2. The heat dissipation device according to claim 1, wherein: A heat insulating member is provided between the evaporation portion and the substrate. The heat insulating member is provided with a second notch that passes through the heat insulating member. A projected area of ​​the second notch on the substrate is greater than or equal to a projected area of ​​the first notch on the substrate.

3. The heat dissipation device according to claim 2, wherein: The substrate is provided with a first mounting hole, and the first mounting hole passes through the substrate; The evaporation portion includes a bottom plate, a portion of the bottom plate projected onto the substrate coincides with a projection of the first notch onto the substrate; the bottom plate is provided with a second mounting hole, the second mounting hole passing through the bottom plate, and the second mounting hole is provided corresponding to the first mounting hole; the bottom plate and the substrate are fixedly connected by a fastener, the fastener being provided in one of the first mounting holes and one of the second mounting holes; The heat insulating member is arranged between the bottom plate and the base plate.

4. The heat dissipation device according to claim 3, wherein: A positioning groove is provided on a side of the bottom plate facing the substrate, and a projection area of ​​the positioning groove on the substrate is larger than a projection area of ​​the first notch on the substrate; The heat insulating member is arranged in the positioning groove, and along the thickness direction of the substrate, the size of the heat insulating member is larger than the size of the positioning groove.

5. The heat dissipation device according to claim 3 or 4, characterized in that: The evaporation part further includes a cover plate, the bottom plate is provided with a receiving groove, the cover plate and the bottom plate are buckled together to form a closed receiving space, and the receiving space is used to receive the working medium; The evaporation portion includes a steam exhaust port and a liquid return port, wherein the steam exhaust port is provided at a first end of the evaporation portion, and the liquid return port is provided at a second end of the evaporation portion; the steam exhaust port and the liquid return port are respectively communicated with the accommodating space; The first end of the condensation part is connected to the first end of the evaporation part through the steam exhaust port, and the second end of the condensation part is connected to the second end of the evaporation part through the liquid return port.

6. The heat dissipation device according to claim 5, wherein: The accommodating space includes a first part and a second part, and the first part and the second part are connected; The first notch includes a third portion and a fourth portion, and the third portion is connected to the fourth portion; A projection shape of the third portion on the substrate is the same as a projection shape of the first portion on the substrate, and a projection shape of the fourth portion on the substrate is the same as a projection shape of the second portion on the substrate.

7. The heat dissipation device according to any one of claims 1 to 6, wherein: The distance between the first end of the condensation portion and the bottom edge of the substrate is L1, and the distance between the first end of the evaporation portion and the bottom edge of the substrate is L2, wherein L1>L2.

8. The heat dissipation device according to any one of claims 1 to 7, wherein: The condensation part includes a steam collecting pipe, a condensation pipe and a liquid collecting pipe, wherein the distance between the steam collecting pipe and the bottom edge of the base plate is greater than the distance between the liquid collecting pipe and the bottom edge of the base plate; the condensation pipe is arranged between the steam collecting pipe and the liquid collecting pipe, and the two ends of the condensation pipe are respectively connected to the steam collecting pipe and the liquid collecting pipe; The steam collecting pipe is connected to the first end of the evaporation part through a first connecting pipe, and the liquid collecting pipe is connected to the second end of the evaporation part through a second connecting pipe.

9. The heat dissipation device according to claim 8, wherein: The steam collecting pipe includes a steam inlet and a plurality of steam outlets. The steam inlet is connected to the first end of the evaporation part through the first connecting pipe, and each steam outlet is connected to the liquid collecting pipe through one of the condensing pipes.

10. The heat dissipation device according to claim 8 or 9, characterized in that: The liquid collecting pipe includes a liquid outlet and multiple liquid inlets. The liquid outlet is connected to the second end of the evaporation part through the second connecting pipe, and each of the liquid inlets is connected to the steam collecting pipe through one of the condensing pipes.

11. The heat dissipation device according to any one of claims 8 to 10, characterized in that: There are multiple condensing tubes, and the multiple condensing tubes are arranged at intervals; A second heat dissipation fin is provided between two adjacent condensing tubes, one end of the second heat dissipation fin is connected to one of the two adjacent condensing tubes, and the other end of the second heat dissipation fin is connected to the other of the two adjacent condensing tubes.

12. The heat dissipation device according to any one of claims 8 to 11, characterized in that: A positioning post is provided on a side of the substrate facing the condensation portion, and the positioning post is provided with a first positioning hole; The steam collecting pipe is provided with a mounting plate, the mounting plate is provided with a second positioning hole, and the second positioning hole passes through the mounting plate; the steam collecting pipe and the base plate are fixedly connected by a first connecting member, and the first connecting member is provided in one of the second positioning holes and one of the first positioning holes; A gasket is provided between the mounting plate and the positioning column, and a gasket is provided between a surface of the first connecting member facing the mounting plate and the mounting plate.

13. The heat dissipation device according to claim 12, wherein: The collecting pipe is provided with the mounting plate, the collecting pipe and the base plate are fixedly connected via a second connecting member, and the second connecting member is provided in one of the second positioning holes and one of the first positioning holes; A gasket is provided between a surface of the second connecting member facing the mounting plate and the mounting plate.

14. The heat dissipation device according to any one of claims 1 to 13, wherein: The main radiator is provided with a first protective cover plate, the first protective cover plate and the first heat dissipation fins are located on the same side of the substrate, and the projection of the first protective cover plate on the substrate covers the first heat dissipation fins; The first protective cover is provided with a first air inlet, and the first air inlet passes through the first protective cover.

15. The heat dissipation device according to any one of claims 1 to 14, characterized in that: The main radiator is provided with a second protective cover plate, the second protective cover plate and the first heat dissipation fins are located on the same side of the base plate, and the projection of the second protective cover plate on the base plate covers the condensation portion; The second protective cover is provided with a second air inlet, and the second air inlet passes through the second protective cover.

16. The heat dissipation device according to claim 15, wherein: A positioning protrusion is provided on a side of a portion of the first heat dissipation fins away from the base plate, the positioning protrusion passes through the condensation portion, and the second protective cover is fixedly connected to the positioning protrusion.

17. The heat dissipation device according to claim 15, wherein: The condensation part is provided with a bracket structure, and the bracket structure includes a bracket base and a bracket tooth piece. The bracket base is fixedly connected to the side of the condensation part facing the substrate, and the bracket tooth piece is fixedly connected to the bracket base. The bracket tooth piece passes through the condensation part, and the second protective cover is fixedly connected to the bracket tooth piece.

18. A communication device, characterized in that: It comprises a signal processing module and the heat dissipation device according to any one of claims 1 to 17, wherein the independent heat sink contacts the core chip of the signal processing module, and the main heat sink contacts at least a part of other components of the signal processing module except the core chip.

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